JP2554458B2 - Relay device - Google Patents
Relay deviceInfo
- Publication number
- JP2554458B2 JP2554458B2 JP6308674A JP30867494A JP2554458B2 JP 2554458 B2 JP2554458 B2 JP 2554458B2 JP 6308674 A JP6308674 A JP 6308674A JP 30867494 A JP30867494 A JP 30867494A JP 2554458 B2 JP2554458 B2 JP 2554458B2
- Authority
- JP
- Japan
- Prior art keywords
- relay
- cover
- electronic circuit
- outer cover
- entire area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H9/00—Details of switching devices, not covered by groups H01H1/00 - H01H7/00
- H01H9/02—Bases, casings, or covers
- H01H2009/0278—Casings containing special noise reduction means, e.g. elastic foam between inner and outer casing
Landscapes
- Casings For Electric Apparatus (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、リレーベースにリレー
機構部を配設し、このリレー機構部をリレーカバーにて
覆うように構成したリレー装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a relay device in which a relay mechanism portion is arranged on a relay base and the relay mechanism portion is covered with a relay cover.
【０００２】[0002]
【従来の技術】従来、車両用の間欠ワイパーリレー、フ
ラッシャリレー、タイマリレー、ラッチングリレー等に
おいては、リレー機構部をリレーベースに設け、このリ
レーベースにリレーカバーを嵌合させることによって該
リレーカバーによりリレー機構部を覆うように構成して
いる。そして、リレーを制御する電子回路を構成する電
子部品を、リレー機構部とは別にプリント基板上に実装
している。2. Description of the Related Art Conventionally, in intermittent wiper relays, flasher relays, timer relays, latching relays, etc. for vehicles, a relay mechanism portion is provided in a relay base, and the relay cover is fitted into the relay base to fit the relay cover. Is configured to cover the relay mechanism section. Then, electronic components that form an electronic circuit that controls the relay are mounted on the printed circuit board separately from the relay mechanism section.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、上記従
来構成では、リレー機構部及び電子回路をそれぞれ別置
状態にプリント基板上に配設するから、据付面積が大き
くなり構成が大形化するという問題点があった。また、
リレーカバーの強度があまり十分でないために、リレー
機構部の作動に起因する振動や共振等が生じ易くなるこ
とから、リレーの駆動音が大きくなるという欠点があっ
た。However, in the above conventional configuration, the relay mechanism section and the electronic circuit are separately arranged on the printed circuit board, so that the installation area becomes large and the configuration becomes large. There was a point. Also,
Since the strength of the relay cover is not so strong, vibrations and resonances due to the operation of the relay mechanism portion are likely to occur, which causes a drawback that the driving sound of the relay becomes loud.
【０００４】そこで、本発明の目的は、装置全体の小形
化を図り得ると共に、リレーの駆動音を低減できて防音
性を向上することができるリレー装置を提供するにあ
る。SUMMARY OF THE INVENTION It is an object of the present invention to provide a relay device which can reduce the size of the entire device and can reduce the driving noise of the relay to improve the soundproofness.
【０００５】[0005]
【課題を解決するための手段】本発明のリレー装置は、
リレーベースに配設されたリレー機構部を備えると共
に、前記リレーベースに前記リレー機構部を覆って封入
するように嵌合されたリレーカバーを備え、このリレー
カバーの周囲の全域を所定間隙を存して覆う外カバーを
備え、この外カバーと前記リレーカバーとの間の一部分
に収納されたリレー制御用の電子回路を備え、そして、
前記外カバーと前記リレーカバーとの間の全域に絶縁材
を充填することにより前記電子回路をモールド状態に構
成したところに特徴を有する。The relay device of the present invention comprises:
The relay base is provided with a relay mechanism section and a relay cover fitted to the relay base so as to cover and enclose the relay mechanism section, and a predetermined gap is provided all around the relay cover. A relay control electronic circuit housed in a portion between the outer cover and the relay cover, and
It is characterized in that the electronic circuit is configured in a molded state by filling the entire area between the outer cover and the relay cover with an insulating material.
【０００６】[0006]
【作用】上記手段によれば、外カバーとリレーカバーと
の間の一部分にリレー制御用の電子回路を収納すると共
に、外カバーとリレーカバーとの間の全域に絶縁材を充
填することにより、前記電子回路をモールド状態に構成
したので、リレー機構部と電子回路が一体化されるた
め、装置の構成を小形化できる。また、外カバーとリレ
ーカバーとの間の全域に絶縁材を充填するから、外カバ
ーと絶縁材によってリレーカバーが補強されてその強度
が十分なものとなり、リレー機構部の作動に起因する振
動や共振等の発生を防止することができる。According to the above means, the electronic circuit for relay control is housed in a part between the outer cover and the relay cover, and the insulating material is filled in the entire area between the outer cover and the relay cover. Since the electronic circuit is formed in a molded state, the relay mechanism unit and the electronic circuit are integrated, so that the structure of the device can be downsized. Moreover, since the insulating material is filled in the entire area between the outer cover and the relay cover, the relay cover is reinforced by the outer cover and the insulating material so that the strength is sufficient, and vibration or vibration caused by the operation of the relay mechanism is prevented. It is possible to prevent the occurrence of resonance and the like.
【０００７】[0007]
【実施例】以下、本発明の一実施例について図１を参照
しながら説明する。この第１図において、１はリレーベ
ースで、これにコイル２及びコイル２により開閉される
リレースイッチ３からなるリレー機構部４が配設されて
いる。５は一面が開放した容器状をなすリレーカバー
で、これはリレー機構部４を覆うようにリレーベース１
の外側に嵌合されており、側面に形成された図示しない
係合孔がリレーベース１の側面に突設された図示しない
係合突部に係合されている。６は一面が開放した容器状
をなす外カバーで、これは上記リレーカバー５の周囲の
全域を所定間隙を存して覆うようになっている。この場
合、上記外カバー６とリレーカバー５との間は、その一
部分である図中右部がやや広く形成されており、この部
分を収納部７としている。８はリレー制御用の電子回路
で、これは集積回路により構成されている。この集積回
路は、例えばいわゆるＩＣ、ハイブリッドＩＣ又はＬＳ
Ｉ等と呼ばれるものである。上記電子回路８は、外カバ
ー６とリレーカバー５との間の収納部７内に収納されて
いる。そして、外カバー６とリレーカバー５との間の全
域に、絶縁材９を注入して充填しており、この絶縁材９
により上記電子回路８をモールドする構成となってい
る。尚、１０は電子回路８に接続された複数のターミナ
ルである。また、１１はリレーベース１に突設された複
数のターミナルで、これらはリレー機構部４に接続され
ている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIG. In FIG. 1, reference numeral 1 is a relay base, on which a relay mechanism section 4 including a coil 2 and a relay switch 3 opened and closed by the coil 2 is arranged. Reference numeral 5 denotes a container-shaped relay cover having an open surface, which covers the relay mechanism 4 and the relay base 1
The engaging holes (not shown) formed on the side surfaces are engaged with the engaging projections (not shown) provided on the side surfaces of the relay base 1. Reference numeral 6 denotes an outer cover which is in the form of a container with one surface open and which covers the entire area around the relay cover 5 with a predetermined gap. In this case, between the outer cover 6 and the relay cover 5, a right part in the drawing, which is a part thereof, is formed slightly wider, and this part is used as a storage part 7. Reference numeral 8 is an electronic circuit for relay control, which is composed of an integrated circuit. This integrated circuit is, for example, a so-called IC, hybrid IC or LS.
It is called I etc. The electronic circuit 8 is housed in a housing portion 7 between the outer cover 6 and the relay cover 5. Then, the insulating material 9 is injected and filled in the entire area between the outer cover 6 and the relay cover 5.
Thus, the electronic circuit 8 is molded. Incidentally, 10 is a plurality of terminals connected to the electronic circuit 8. Further, reference numeral 11 denotes a plurality of terminals projectingly provided on the relay base 1, which are connected to the relay mechanism section 4.
【０００８】このような構成の本実施例によれば、次の
効果を得ることができる。即ち、外カバー６とリレーカ
バー５との間の収容部７内にリレー制御用の電子回路８
を収納すると共に、外カバー６とリレーカバー５との間
の全域に絶縁材を充填することにより、電子回路８をモ
ールド状態にする構成であるので、リレー機構部４と電
子回路８とが一体化される。このため、リレー装置全体
の構成を小形化できる。また、外カバー６とリレーカバ
ー５との間の全域に絶縁材９を充填するから、外カバー
６と絶縁材９によってリレーカバー５が補強されてその
強度が十分なものとなり、リレー機構部４の作動に起因
する振動や共振等の発生を防止できる。このため、リレ
ーの駆動音を低減できて防音性を向上できる。According to this embodiment having such a configuration, the following effects can be obtained. That is, the relay control electronic circuit 8 is provided in the housing portion 7 between the outer cover 6 and the relay cover 5.
The relay mechanism section 4 and the electronic circuit 8 are integrated because the electronic circuit 8 is molded by filling the entire area between the outer cover 6 and the relay cover 5 with an insulating material. Be converted. Therefore, the configuration of the entire relay device can be downsized. Further, since the insulating material 9 is filled in the entire area between the outer cover 6 and the relay cover 5, the relay cover 5 is reinforced by the outer cover 6 and the insulating material 9 to have sufficient strength, and the relay mechanism portion 4 It is possible to prevent the occurrence of vibration and resonance due to the operation of. Therefore, the drive sound of the relay can be reduced and the soundproofing can be improved.
【０００９】尚、上記実施例では、外カバー６とリレー
カバー５との間の収納部７に集積回路により構成された
電子回路８を収納する構成としたから、従来とは異なり
多数の電子部品及びこれらを実装するためのプリント基
板等が不要になり、部品点数を少なくできる。従って、
組立工数を減少できて製造費を安くし得る。In the above embodiment, since the electronic circuit 8 constituted by the integrated circuit is housed in the housing portion 7 between the outer cover 6 and the relay cover 5, unlike the prior art, a large number of electronic parts are provided. Also, a printed circuit board or the like for mounting them is unnecessary, and the number of parts can be reduced. Therefore,
The number of assembly steps can be reduced and the manufacturing cost can be reduced.
【００１０】[0010]
【発明の効果】本発明は以上の説明から明らかなよう
に、リレーカバーの周囲の全域を所定間隙を存して覆う
外カバーを備え、この外カバーとリレーカバーとの間の
一部分に収納されたリレー制御用の電子回路を備え、そ
して、外カバーとリレーカバーとの間の全域に絶縁材を
充填する構成としたので、リレー装置全体の小形化を図
り得ると共に、リレーの駆動音を低減できて防音性を向
上させることができるという優れた効果を奏する。As is apparent from the above description, the present invention is provided with an outer cover that covers the entire area around the relay cover with a predetermined gap, and is housed in a part between the outer cover and the relay cover. Since it has an electronic circuit for relay control and is configured to fill the entire area between the outer cover and the relay cover with an insulating material, it is possible to reduce the size of the relay device as a whole and reduce the drive noise of the relay. It has an excellent effect of being able to improve the soundproofing.
【図１】本発明の一実施例を示すリレー装置の縦断側面
図FIG. 1 is a vertical sectional side view of a relay device showing an embodiment of the present invention.
１はリレーベース、４はリレー機構部、５はリレーカバ
ー、６は外カバー、７は収納部、８は電子回路、９は絶
縁材、１０、１１はターミナルを示す。Reference numeral 1 is a relay base, 4 is a relay mechanism portion, 5 is a relay cover, 6 is an outer cover, 7 is a housing portion, 8 is an electronic circuit, 9 is an insulating material, and 10 and 11 are terminals.
Claims (1)
と、前記リレーベースに前記リレー機構部を覆って封入
するように嵌合されたリレーカバーと、このリレーカバ
ーの周囲の全域を所定間隙を存して覆う外カバーと、こ
の外カバーと前記リレーカバーとの間の一部分に収納さ
れたリレー制御用の電子回路とを備え、前記外カバーと
前記リレーカバーとの間の全域に絶縁材を充填すること
により前記電子回路をモールド状態に構成したことを特
徴とするリレー装置。1. A relay mechanism section arranged on a relay base, a relay cover fitted to the relay base so as to cover and enclose the relay mechanism section, and a predetermined gap around the entire area of the relay cover. And an electronic circuit for relay control housed in a part between the outer cover and the relay cover, wherein an insulating material is provided over the entire area between the outer cover and the relay cover. A relay device, characterized in that the electronic circuit is configured in a molded state by filling the relay circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6308674A JP2554458B2 (en) | 1994-12-13 | 1994-12-13 | Relay device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6308674A JP2554458B2 (en) | 1994-12-13 | 1994-12-13 | Relay device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07169380A JPH07169380A (en) | 1995-07-04 |
| JP2554458B2 true JP2554458B2 (en) | 1996-11-13 |
Family
ID=17983927
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6308674A Expired - Lifetime JP2554458B2 (en) | 1994-12-13 | 1994-12-13 | Relay device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2554458B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR200476158Y1 (en) * | 2013-05-15 | 2015-02-03 | 송 추안 프레시션 컴퍼니 리미티드 | Relay structure for car socket |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS513036U (en) * | 1974-06-21 | 1976-01-10 | ||
| JPS57128742U (en) * | 1981-02-04 | 1982-08-11 | ||
| JPS58172838A (en) * | 1982-03-31 | 1983-10-11 | 松下電工株式会社 | Electronic circuit containing relay |
-
1994
- 1994-12-13 JP JP6308674A patent/JP2554458B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07169380A (en) | 1995-07-04 |
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