JP2550510B2 - Prepreg and laminated board - Google Patents
Prepreg and laminated boardInfo
- Publication number
- JP2550510B2 JP2550510B2 JP5206161A JP20616193A JP2550510B2 JP 2550510 B2 JP2550510 B2 JP 2550510B2 JP 5206161 A JP5206161 A JP 5206161A JP 20616193 A JP20616193 A JP 20616193A JP 2550510 B2 JP2550510 B2 JP 2550510B2
- Authority
- JP
- Japan
- Prior art keywords
- glass cloth
- prepreg
- resin
- thermal expansion
- laminated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、プリント配線板の材料
等に使用されるプリプレグ及び積層板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a prepreg and a laminated board used as materials for printed wiring boards.
【０００２】[0002]
【従来の技術】従来、平織のガラスクロスを基材として
使用したプリプレグ及びこのプリプレグを用いて積層一
体化された積層板がプリント配線板の材料として広く用
いられている。その際のプリプレグの樹脂含有率は通常
４０〜６０重量％程度である。2. Description of the Related Art Conventionally, a prepreg using a plain-woven glass cloth as a base material and a laminate laminated and integrated using the prepreg have been widely used as a material for a printed wiring board. The resin content of the prepreg at that time is usually about 40 to 60% by weight.
【０００３】近年、電子機器の軽薄短小化の要求に対応
するために、寸法安定性の良好なプリント配線板が求め
られている。特に、半導体チップを直接実装するプリン
ト配線板については、実装基板の信頼性を高めるために
プリント配線板の熱膨張率を半導体チップの熱膨張率に
整合させることが求められている。この場合、半導体チ
ップの熱膨張率は略７×１０-6ｍｍ／ｍｍ・℃と小さい
ので、熱膨張率を整合させることは、すなわちプリント
配線板の熱膨張率を小さくさせることを意味し、この低
熱膨張率化のための研究が種々なされているが、いまだ
十分には達成されていないのが現状である。In recent years, a printed wiring board having good dimensional stability has been demanded in order to meet the demand for lighter, thinner, shorter and smaller electronic devices. In particular, for a printed wiring board on which a semiconductor chip is directly mounted, it is required to match the thermal expansion coefficient of the printed wiring board with the thermal expansion coefficient of the semiconductor chip in order to improve the reliability of the mounting board. In this case, since the thermal expansion coefficient of the semiconductor chip is as small as approximately 7 × 10 −6 mm / mm · ° C., matching the thermal expansion coefficient means reducing the thermal expansion coefficient of the printed wiring board, Although various studies have been made for lowering the coefficient of thermal expansion, the current situation is that they have not been sufficiently achieved.
【０００４】[0004]
【発明が解決しようとする課題】上記の事情に鑑み、本
発明は低熱膨張率であるプリント配線板を得ることので
きる、プリプレグ及び積層板を提供することを目的とし
ている。In view of the above circumstances, it is an object of the present invention to provide a prepreg and a laminated board which can obtain a printed wiring board having a low coefficient of thermal expansion.
【０００５】[0005]
【課題を解決するための手段】本発明は、ななこ織りさ
れたガラスクロスを基材とし、樹脂含有率が２０〜４０
重量％であることを特徴とするプリプレグ及びこのプリ
プレグを用いて積層一体化された積層板である。According to the present invention, a glass cloth woven from satin is used as a base material, and the resin content is 20 to 40.
It is a prepreg characterized in that the content is% by weight, and a laminated plate integrally laminated using the prepreg.
【０００６】プリント配線板の低熱膨張率化のための有
力な手段として、ガラスクロスを基材とし、樹脂の含有
率を少なくしたプリプレグの使用が考えられる。しか
し、プリント配線板の用途で一般的に使用されている平
織のガラスクロスが基材の場合、樹脂含有率を少なくす
ると成型時の成形性が損なわれ、成形した積層板中に樹
脂による充填がされていない空隙部分が生じるという問
題があった。この空隙部分を生じさせないためにはプリ
プレグの樹脂含有率を約４０重量％以上にする必要があ
り、樹脂含有率を少なくしたプリプレグの使用という手
段による低熱膨張率化には限界があった。As a promising means for reducing the coefficient of thermal expansion of a printed wiring board, use of a prepreg containing glass cloth as a base material and having a low resin content can be considered. However, when a plain weave glass cloth, which is generally used for printed wiring board applications, is the base material, reducing the resin content impairs moldability during molding, and it is not possible to fill the molded laminate with resin. There is a problem in that there are voids that are not formed. In order to prevent the formation of voids, the resin content of the prepreg must be about 40% by weight or more, and there has been a limit to the reduction of the coefficient of thermal expansion by the use of a prepreg having a low resin content.
【０００７】そこで、ガラスクロスの織り方と成形性の
関係について研究し、ななこ織りされたガラスクロスを
使用すると樹脂含有率を少なくしても成形性が確保され
ることを見出し本発明に到ったものである。Therefore, the present invention has been found by studying the relationship between the weaving method of glass cloth and the formability, and that the use of the glass cloth woven from nanako ensures the formability even if the resin content is reduced. It is a thing.
【０００８】以下、本発明をより詳細に説明する。平織
のガラスクロスは、図３に示すように、たて糸（１）及
びよこ糸（２）の各ヤーンが交互に浮沈して織られてい
る。それに対し、本発明で使用するななこ織りのガラス
クロスは、図１に示しているたて糸（１）及びよこ糸
（２）が共に２本同時に浮沈して織られているものや、
図２に示しているたて糸（１）及びよこ糸（２）が共に
３本同時に浮沈して織られているもの等、たて糸（１）
及びよこ糸（２）の複数のヤーン〔たて糸とよこ糸の本
数は一致していない場合もある。〕が同時に浮沈して織
られているクロスである。なお、ここでいうヤーンはモ
ノフィラメントが一定本数束ねられたものを指し、束ね
られ方により単糸、双糸等の種類がある。そして、本発
明におけるななこ織りの織り組織は、可能な限り打ち込
み密度を上げ、成形性確保に必要な樹脂量を少なくする
ことが、本発明の目的である低熱膨張率化の達成にとっ
ては好ましい。The present invention will be described in more detail below. As shown in FIG. 3, the plain weave glass cloth is woven with warp yarns (1) and weft yarns (2) yarns alternately floating and sinking. On the other hand, the glass cloth of the nanako weave used in the present invention has two warp threads (1) and two weft threads (2) shown in FIG.
A warp thread (1) such as one in which three warp threads (1) and weft threads (2) shown in FIG.
In some cases, a plurality of yarns of the weft thread (2) [warp threads and weft threads do not have the same number. ] Is a cloth that is woven up and down at the same time. The yarn here refers to a bundle of a fixed number of monofilaments, and there are various types such as single yarn and twin yarn depending on how they are bundled. In the weave design of the satin weave of the present invention, it is preferable to increase the driving density as much as possible and reduce the amount of resin required for ensuring the moldability in order to achieve the object of the present invention to achieve a low coefficient of thermal expansion.
【０００９】本発明において、ななこ織りされたガラス
クロス基材と組み合わせる樹脂の種類については特に限
定はなく、例えばエポキシ樹脂、ポリイミド樹脂等の熱
硬化性樹脂や弗素樹脂等の熱可塑性樹脂を使用すること
ができる。そして、本発明においてはプリプレグ中の樹
脂含有率が２０〜４０重量％であることが重要である。
何故ならば、プリプレグ中の樹脂含有率が２０重量％未
満では成形した積層板中に樹脂による充填がされていな
い空隙部分が生じる問題が起こり、また、４０重量％を
越えると本発明の目的である低熱膨張率化が達成できな
くなるからである。In the present invention, the kind of resin to be combined with the satin-woven glass cloth base material is not particularly limited, and for example, thermosetting resin such as epoxy resin or polyimide resin or thermoplastic resin such as fluorine resin is used. be able to. In the present invention, it is important that the resin content of the prepreg is 20 to 40% by weight.
The reason for this is that if the resin content in the prepreg is less than 20% by weight, there will be a problem that voids that are not filled with the resin occur in the molded laminate, and if it exceeds 40% by weight, it is for the purpose of the present invention. This is because a certain low coefficient of thermal expansion cannot be achieved.
【００１０】本発明では、ななこ織りは、同時に浮沈さ
せるヤーンの本数を２〜５本とすることが好ましい。こ
の理由としては、浮沈させるヤーンの本数が多いほど糸
のうねり（屈曲）が小さくなるので成形性確保に必要な
樹脂量を少なくできるようになるが、しかし、６本以上
になるとガラスクロスの取り扱い性が損なわれたり、樹
脂を基材に含浸させる際にヤーンが重なるトラブルが生
じ易くなる等の問題が生じるからである。In the present invention, it is preferable that the number of the yarns of the satin weave that are simultaneously floated and set is 2 to 5. The reason for this is that as the number of yarns to be floated and sinked increases, the thread waviness (bending) decreases, so the amount of resin required to secure moldability can be reduced. However, when the number of yarns is 6 or more, handling of glass cloth This is because problems such as impairing the property and causing a problem of overlapping yarns when the resin is impregnated into the base material are likely to occur.
【００１１】本発明における、プリプレグ及び積層板の
製造条件については特に限定はなく、使用する樹脂の種
類により決定すればよい。なおプリプレグを積層一体化
して積層板とする際に、銅箔等の金属箔を同時に一体化
して金属箔張り積層板とすることも可能である。In the present invention, the manufacturing conditions for the prepreg and the laminated plate are not particularly limited and may be determined depending on the type of resin used. When the prepregs are laminated and integrated to form a laminated plate, it is possible to simultaneously integrate metal foils such as copper foil to form a metal foil-clad laminated plate.
【００１２】[0012]
【作用】プリプレグの基材がななこ織りされたガラスク
ロスであることは、プリプレグの樹脂含有率を少なくし
ても成形性が確保される作用をするので、低熱膨張率化
できた積層板及びプリント配線板が得られるようにな
る。[Function] Since the base material of the prepreg is a glass cloth woven from a satin, the moldability is ensured even if the resin content of the prepreg is reduced, so that the laminated plate and the print having a low coefficient of thermal expansion can be obtained. A wiring board can be obtained.
【００１３】[0013]
【実施例】以下、本発明を実施例及び比較例により説明
する。勿論、この発明は下記の実施例に限らない。EXAMPLES The present invention will be described below with reference to Examples and Comparative Examples. Of course, the present invention is not limited to the following embodiments.
【００１４】（実施例１〜５）ガラスヤーンとしてモノ
フィラメント径が７μｍであるＥＣＥ２２５−１／０の
ヤーンを使用し、図１に示すようなたて糸及びよこ糸共
に２本を同時に浮沈させたななこ織りのガラスクロスを
基材として使用した。このガラスクロスの打ち込み密度
はたて糸７５本／インチ、よこ糸６８本／インチの打ち
込み本数とした。このガラスクロスに硬化剤としてジシ
アンジアミドを含有するエポキシ樹脂ワニスを含浸させ
て、乾燥し、表１に示すように樹脂含有量の異なるプリ
プレグを作製した。(Examples 1 to 5) As a glass yarn, a yarn of ECE2255-1 / 0 having a monofilament diameter of 7 μm was used, and two warp yarns and weft yarns as shown in FIG. Glass cloth was used as the substrate. The driving density of this glass cloth was 75 warps / inch and 68 wefts / inch. The glass cloth was impregnated with an epoxy resin varnish containing dicyandiamide as a curing agent and dried to prepare prepregs having different resin contents as shown in Table 1.
【００１５】得られた各プリプレグを３０枚重ね、加圧
加熱（３０ｋｇ／ｃｍ2 −１７０℃で６０分間）して積
層一体化し、積層板を得た。得られた積層板について樹
脂による充填がされていない未充填部が生じていないか
どうかの成形性の評価及び各方向における熱膨張率を測
定を実施し、得られた結果を表１に示す。なお、成形性
評価については、未充填部が生じていない場合には良好
と表している。Thirty sheets of each of the obtained prepregs were stacked and heated under pressure (30 kg / cm 2 -170 ° C. for 60 minutes) to be laminated and integrated to obtain a laminated plate. The obtained laminated plate was evaluated for moldability as to whether or not an unfilled portion not filled with the resin was generated and the coefficient of thermal expansion in each direction was measured, and the obtained results are shown in Table 1. The moldability evaluation is indicated as good when there is no unfilled portion.
【００１６】[0016]
【表１】 [Table 1]
【００１７】（実施例６〜８）実施例１と同様のガラス
クロスを基材として使用した。このガラスクロスに熱硬
化型のポリイミド樹脂ワニスを含浸させて、乾燥し、表
２に示すように樹脂含有量の異なるプリプレグを作製し
た。(Examples 6 to 8) The same glass cloth as in Example 1 was used as a substrate. The glass cloth was impregnated with a thermosetting polyimide resin varnish and dried to prepare prepregs having different resin contents as shown in Table 2.
【００１８】得られた各プリプレグを３０枚重ね、加圧
加熱（３０ｋｇ／ｃｍ2 −２００℃で１２０分間）して
積層一体化し、積層板を得た。得られた積層板について
樹脂による充填がされていない未充填部が生じていない
かどうかの成形性の評価及び各方向における熱膨張率を
測定を実施し、得られた結果を表２に示す。得られた積
層板の各方向における熱膨張率を測定し、得られた結果
を表２に示す。Thirty sheets of each of the obtained prepregs were stacked and heated under pressure (30 kg / cm 2 -200 ° C. for 120 minutes) to be laminated and integrated to obtain a laminated plate. The obtained laminated plate was evaluated for moldability as to whether or not an unfilled portion not filled with the resin was generated and the coefficient of thermal expansion in each direction was measured, and the obtained results are shown in Table 2. The coefficient of thermal expansion in each direction of the obtained laminated plate was measured, and the obtained results are shown in Table 2.
【００１９】[0019]
【表２】 [Table 2]
【００２０】（実施例９〜１１）ガラスヤーンとしてモ
ノフィラメント径が９μｍであるＥＣＧ７５−１／０の
ヤーンを使用し、たて糸２本、よこ糸３本を同時に浮沈
させたななこ織りのガラスクロスを基材として使用し
た。このガラスクロスの打ち込み密度はたて糸８０本／
インチ、よこ糸６０本／インチの打ち込み本数とした。
このガラスクロスに実施例１と同様のエポキシ樹脂ワニ
スを含浸させて、乾燥し、表３に示すように樹脂含有量
の異なるプリプレグを作製した。(Examples 9 to 11) As a glass yarn, a yarn of ECG75-1 / 0 having a monofilament diameter of 9 μm was used, and a glass cloth of a satin weave in which two warp yarns and three weft yarns were simultaneously suspended was used as a base material. Used as. The driving density of this glass cloth is 80 warps /
The number of inches and 60 weft threads / inch were set.
This glass cloth was impregnated with the same epoxy resin varnish as in Example 1 and dried to prepare prepregs having different resin contents as shown in Table 3.
【００２１】得られた各プリプレグを３０枚重ね、加圧
加熱（３０ｋｇ／ｃｍ2 −１７０℃で６０分間）して積
層一体化し、積層板を得た。得られた積層板について樹
脂による充填がされていない未充填部が生じていないか
どうかの成形性の評価及び各方向における熱膨張率を測
定を実施し、得られた結果を表３に示す。Thirty sheets of each of the obtained prepregs were stacked and heated under pressure (30 kg / cm 2 -170 ° C. for 60 minutes) to be laminated and integrated to obtain a laminated plate. The obtained laminate was evaluated for moldability as to whether or not an unfilled portion not filled with resin was generated, and the coefficient of thermal expansion in each direction was measured. The obtained results are shown in Table 3.
【００２２】[0022]
【表３】 [Table 3]
【００２３】（比較例１，２）ガラスヤーンとしてモノ
フィラメント径が７μｍであるＥＣＥ２２５−１／０の
ヤーンを使用していて、打ち込み密度がたて糸６１本／
インチ、よこ糸５８本／インチの打ち込み本数である、
平織のガラスクロスを基材として使用した。このガラス
クロスは２１１６タイプと呼ばれ、プリントプリント配
線板用途において一般的に使用されているガラスクロス
である。このガラスクロスに実施例１と同様のエポキシ
樹脂ワニスを含浸させて、乾燥し、表４に示すように樹
脂含有量の異なるプリプレグを作製した。(Comparative Examples 1 and 2) As the glass yarn, a yarn of ECE2255-1 / 0 having a monofilament diameter of 7 μm is used, and the warp density is 61 warp yarns /
Inch, weft number of 58 threads / inch,
Plain weave glass cloth was used as the substrate. This glass cloth is called 2116 type, and is a glass cloth that is generally used in printed wiring board applications. This glass cloth was impregnated with the same epoxy resin varnish as in Example 1 and dried to prepare prepregs having different resin contents as shown in Table 4.
【００２４】得られた各プリプレグを３０枚重ね、加圧
加熱（３０ｋｇ／ｃｍ2 −１７０℃で６０分間）して積
層一体化し、積層板を得た。得られた積層板について樹
脂による充填がされていない未充填部が生じていないか
どうかの成形性の評価及び各方向における熱膨張率を測
定を実施し、得られた結果を表４に示す。Thirty sheets of each of the obtained prepregs were stacked and heated under pressure (30 kg / cm 2 -170 ° C. for 60 minutes) to be laminated and integrated to obtain a laminated plate. The obtained laminated plate was evaluated for moldability as to whether or not an unfilled portion not filled with the resin was generated and the coefficient of thermal expansion in each direction was measured, and the obtained results are shown in Table 4.
【００２５】（比較例３，４）ガラスヤーンとしてモノ
フィラメント径が７μｍであるＥＣＥ２２５−１／０の
ヤーンを使用していて、打ち込み密度がたて糸７５本／
インチ、よこ糸６８本／インチの打ち込み本数である、
平織のガラスクロスを基材として使用した。このガラス
クロスに実施例１と同様のエポキシ樹脂ワニスを含浸さ
せて、乾燥し、表４に示すように樹脂含有量の異なるプ
リプレグを作製した。(Comparative Examples 3 and 4) As a glass yarn, a yarn of ECE225-1 / 0 having a monofilament diameter of 7 μm is used, and the warp density is 75 warps /
Inch, 68 weft threads / inch
Plain weave glass cloth was used as the substrate. This glass cloth was impregnated with the same epoxy resin varnish as in Example 1 and dried to prepare prepregs having different resin contents as shown in Table 4.
【００２６】得られた各プリプレグを３０枚重ね、加圧
加熱（３０ｋｇ／ｃｍ2 −１７０℃で６０分間）して積
層一体化し、積層板を得た。得られた積層板について樹
脂による充填がされていない未充填部が生じていないか
どうかの成形性の評価及び各方向における熱膨張率を測
定を実施し、得られた結果を表４に示す。Thirty sheets of each of the obtained prepregs were stacked and heated under pressure (30 kg / cm 2 -170 ° C. for 60 minutes) to be laminated and integrated to obtain a laminated plate. The obtained laminated plate was evaluated for moldability as to whether or not an unfilled portion not filled with the resin was generated and the coefficient of thermal expansion in each direction was measured, and the obtained results are shown in Table 4.
【００２７】[0027]
【表４】 [Table 4]
【００２８】（比較例５，６）ガラスヤーンとしてモノ
フィラメント径が７μｍであるＥＣＥ２２５−１／０の
ヤーンを使用していて、打ち込み密度がたて糸６１本／
インチ、よこ糸５８本／インチの打ち込み本数である、
平織のガラスクロスを基材として使用した。このガラス
クロスは２１１６タイプと呼ばれ、プリントプリント配
線板用途において一般的に使用されているガラスクロス
である。このガラスクロスに実施例６と同様のポリイミ
ド樹脂ワニスを含浸させて、乾燥し、表５に示すように
樹脂含有量の異なるプリプレグを作製した。(Comparative Examples 5 and 6) As the glass yarn, a yarn of ECE2255-1 / 0 having a monofilament diameter of 7 μm is used, and the warp density is 61 warp threads /
Inch, weft number of 58 threads / inch,
Plain weave glass cloth was used as the substrate. This glass cloth is called 2116 type, and is a glass cloth that is generally used in printed wiring board applications. This glass cloth was impregnated with the same polyimide resin varnish as in Example 6 and dried to prepare prepregs having different resin contents as shown in Table 5.
【００２９】得られた各プリプレグを３０枚重ね、加圧
加熱（３０ｋｇ／ｃｍ2 −２００℃で１２０分間）して
積層一体化し、積層板を得た。得られた積層板について
樹脂による充填がされていない未充填部が生じていない
かどうかの成形性の評価及び各方向における熱膨張率を
測定を実施し、得られた結果を表５に示す。Thirty sheets of each of the obtained prepregs were stacked and heated under pressure (30 kg / cm 2 -200 ° C. for 120 minutes) to be laminated and integrated to obtain a laminated plate. The obtained laminate was evaluated for moldability as to whether or not an unfilled portion not filled with the resin was generated and the coefficient of thermal expansion in each direction was measured, and the obtained results are shown in Table 5.
【００３０】（実施例１２）実施例４で作製したプリプ
レグ１５枚と比較例３で作製したプリプレグ１５枚とを
交互に組み合わせて重ね、加圧加熱（３０ｋｇ／ｃｍ2
−１７０℃で６０分間）して積層一体化し、積層板を得
た。得られた積層板について樹脂による充填がされてい
ない未充填部が生じていないかどうかの成形性の評価及
び各方向における熱膨張率を測定を実施し、得られた結
果を表５に示す。Example 12 Fifteen prepregs produced in Example 4 and fifteen prepregs produced in Comparative Example 3 were alternately combined and stacked, and heated under pressure (30 kg / cm 2
(-170 ° C. for 60 minutes) to laminate and integrate to obtain a laminate. The obtained laminate was evaluated for moldability as to whether or not an unfilled portion not filled with the resin was generated and the coefficient of thermal expansion in each direction was measured, and the obtained results are shown in Table 5.
【００３１】[0031]
【表５】 [Table 5]
【００３２】本発明においては、本発明に係るプリプレ
グのみを用いて積層一体化することはもちろん、実施例
１２のように、本発明に係るプリプレグと従来のプリプ
レグとを組み合わせて重ね、積層一体化するようにして
も、本発明の目的である低熱膨張率化は達成することが
できる。In the present invention, not only the prepreg according to the present invention is used for lamination and integration, but also the prepreg according to the present invention and the conventional prepreg are combined and laminated and integrated as in Example 12. Even if it is done, the low coefficient of thermal expansion, which is the object of the present invention, can be achieved.
【００３３】[0033]
【発明の効果】本発明に係るプリプレグは、ななこ織り
されたガラスクロスを基材とし、樹脂含有率が低い構成
となっているので、本発明のプリプレグによれば成形性
を損なわずに、低熱膨張率である積層板が得られる。従
って、本発明のプリプレグ及び積層板を使用することで
低熱膨張率であるプリント配線板を得ることができる。EFFECTS OF THE INVENTION The prepreg according to the present invention uses a glass cloth woven from satin as a base material and has a low resin content. A laminate having a coefficient of expansion is obtained. Therefore, a printed wiring board having a low coefficient of thermal expansion can be obtained by using the prepreg and the laminated board of the present invention.
【図１】本発明の一実施例のプリプレグ作製に使用した
ななこ織りしたガラスクロスの平面図である。FIG. 1 is a plan view of a Nanako-woven glass cloth used for producing a prepreg according to one embodiment of the present invention.
【図２】図１以外のななこ織りしたガラスクロスの例を
示す平面図である。FIG. 2 is a plan view showing an example of a satin-woven glass cloth other than that shown in FIG.
【図３】比較例において使用した平織のガラスクロスの
平面図である。FIG. 3 is a plan view of a plain weave glass cloth used in a comparative example.
１ たて糸 ２ よこ糸 1 warp thread 2 weft thread
Claims (3)
し、樹脂含有率が２０〜４０重量％であることを特徴と
するプリプレグ。1. A prepreg characterized by using a glass cloth woven from a satin as a base material and having a resin content of 20 to 40% by weight.
の本数を２〜５本とするななこ織りである請求項１記載
のプリプレグ。2. The prepreg according to claim 1, wherein the nanko weave is a nanako weave in which the number of yarns to be simultaneously floated and set is 2 to 5.
グを用いて積層一体化された積層板。3. A laminated plate integrally laminated by using the prepreg according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5206161A JP2550510B2 (en) | 1993-08-20 | 1993-08-20 | Prepreg and laminated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5206161A JP2550510B2 (en) | 1993-08-20 | 1993-08-20 | Prepreg and laminated board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0752155A JPH0752155A (en) | 1995-02-28 |
| JP2550510B2 true JP2550510B2 (en) | 1996-11-06 |
Family
ID=16518818
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5206161A Expired - Lifetime JP2550510B2 (en) | 1993-08-20 | 1993-08-20 | Prepreg and laminated board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2550510B2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63318196A (en) * | 1987-06-22 | 1988-12-27 | Asahi Shiyueebell Kk | Glass fiber fabric reinforced printed wiring board |
| JPH05283828A (en) * | 1992-03-31 | 1993-10-29 | Asahi Shiyueebell Kk | Laminate for printed-circuit board |
-
1993
- 1993-08-20 JP JP5206161A patent/JP2550510B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63318196A (en) * | 1987-06-22 | 1988-12-27 | Asahi Shiyueebell Kk | Glass fiber fabric reinforced printed wiring board |
| JPH05283828A (en) * | 1992-03-31 | 1993-10-29 | Asahi Shiyueebell Kk | Laminate for printed-circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0752155A (en) | 1995-02-28 |
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