JP2548177Y2 - Heat transfer seal rubber for electronic equipment - Google Patents
Heat transfer seal rubber for electronic equipmentInfo
- Publication number
- JP2548177Y2 JP2548177Y2 JP1989129930U JP12993089U JP2548177Y2 JP 2548177 Y2 JP2548177 Y2 JP 2548177Y2 JP 1989129930 U JP1989129930 U JP 1989129930U JP 12993089 U JP12993089 U JP 12993089U JP 2548177 Y2 JP2548177 Y2 JP 2548177Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- heat transfer
- seal rubber
- transfer seal
- rubber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Gasket Seals (AREA)
- Vibration Dampers (AREA)
- Casings For Electric Apparatus (AREA)
Description
【考案の詳細な説明】 〔産業上の利用分野〕 この考案は電子機器用伝熱シールゴムに関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a heat transfer seal rubber for electronic devices.
従来、電気機器を構成する配線素子の中には、発熱の
著しい部品があり、回路の効率上このような発熱をスム
ーズに放散し、安定した温度条件に保つ必要のある場合
が少なくない。2. Description of the Related Art Conventionally, there is a case where it is necessary to dissipate such heat smoothly and maintain a stable temperature condition in terms of circuit efficiency in many cases, in a wiring element constituting an electric device, there is a component that generates a large amount of heat.
このため、特に放熱が必要な場合は回路シャーシ内に
冷却ファンを設け、これによって発熱の防止を図ること
が行なわれる場合がある。Therefore, when heat radiation is particularly required, a cooling fan may be provided in the circuit chassis to thereby prevent heat generation.
ところで、電子装置など回路及びシャーシをケーシン
グ内に収納する構造のものにあっては、上記冷却用ファ
ンはケーシング内に共に収納されるのが普通であるか
ら、ケーシング内では回路の他、冷却ファン用モータの
発熱の影響も無視できず、この発熱のため折角冷却ファ
ンを設置したにも係わらず、それほどの冷却効果が期待
できないといった問題があった。By the way, in an electronic device or the like having a structure in which a circuit and a chassis are housed in a casing, the cooling fan is usually housed in the casing. The effect of the heat generated by the motor cannot be neglected, and there is a problem that the cooling effect cannot be expected to be so high despite the installation of the angle cooling fan due to the generated heat.
さらに、例えばケーシングの蓋あるいは開口部を防水
用シールゴムでシールする防水構造等とされた電子機器
にあっては、外部との空気交換も容易でなくなるため上
記問題はさらに顕著となる。Further, in an electronic device having a waterproof structure in which a lid or an opening of a casing is sealed with a sealing rubber for waterproofing, for example, the above problem becomes more remarkable because air exchange with the outside is not easy.
また、上記機器の使用態様に応じ防水の他、防振を目
的として回路板をシャーシ等にクッションゴムを介して
取付けることが行なわれることもあるが、この場合は上
記クッションゴムが断熱材として機能し、熱の放散性も
さらに悪くなるといった問題があった。Further, in addition to waterproofing, a circuit board may be attached to a chassis or the like via a cushion rubber for the purpose of damping vibration in addition to waterproofing in this case. In this case, the cushion rubber functions as a heat insulating material. However, there is a problem that heat dissipation is further deteriorated.
この考案は上記問題点に鑑み、熱の放散性が良く、し
かも防振も有効に行える改良された電子機器用伝熱シー
ルゴムを提供することを目的としてなされたものであ
る。。The present invention has been made in view of the above problems, and has as its object to provide an improved heat transfer seal rubber for electronic devices which has good heat dissipation and can effectively prevent vibration. .
即ち、この考案の電子機器用伝熱シールゴムは、発熱
回路を有する回路板と電気機器のシャーシ又はケーシン
グ等の内面との間に圧縮介挿される電子機器用伝熱シー
ルゴムであって、金属粉混入により伝熱性が良くされた
ゴム製板状体の一面に、該板状体に対し起立するリブ状
体が空間を隔てて多数平行に立設され、該リブ状体先端
を必要に応じて一体に連接してなることを特徴とするも
のである。That is, the heat transfer seal rubber for electronic devices of the present invention is a heat transfer seal rubber for electronic devices which is inserted by compression between a circuit board having a heating circuit and an inner surface of a chassis or a casing of the electric device. A large number of ribs standing upright from the plate are placed in parallel with one another on one surface of the rubber plate whose heat conductivity is improved, and the tips of the ribs are integrated as necessary. It is characterized by being connected to.
上記において、伝熱性の良いゴムとしては金属粉混入
等により伝熱性を良くしたものが使用される。In the above, as the rubber having good heat conductivity, a rubber whose heat conductivity is improved by mixing metal powder or the like is used.
これらゴムは通常のゴムに比し弾性が低く、物性的に
緩衝性が低いが、空間部を有して起立したリブ状体の形
状によりその弾性が保持される。These rubbers are lower in elasticity and lower in physical properties than ordinary rubbers, but their elasticity is maintained by the shape of a rib-like body that has a space and stands upright.
即ち、電子機器用伝熱シールゴムは、板状体を発熱回
路を有する回路板またはシャーシ、起立するリブ状体の
先端をシャーシまたは回路板に圧縮して介挿される。That is, the heat transfer seal rubber for electronic equipment is inserted by compressing the plate-like body into a circuit board or a chassis having a heat generating circuit, and compressing the tip of the rising rib-like body into the chassis or the circuit board.
この時、電子機器用伝熱シールゴムは起立するリブ状
体が弾性的に湾曲変形するから、圧縮状態に応じた緩衝
作用があり、防振も合わせて行う。At this time, the heat-transfer seal rubber for electronic equipment has a buffering action according to the compression state and also performs vibration proof because the rising rib-like body elastically bends and deforms.
さらに、湾曲弾性変形によって回路板とシャーシまた
はケーシング間に隙間なく密接されるから、熱の伝導率
も良く回路板の熱は電子機器用伝熱シールゴムを介し
て、シャーシまたはケーシングへ伝熱され、さらにこの
熱はシャーシまたはケーシングから外部へと放熱され
る。Furthermore, since the circuit board and the chassis or the casing are closely contacted by the curved elastic deformation without any gap, the heat conductivity of the circuit board is good and the heat of the circuit board is transferred to the chassis or the casing via the heat transfer seal rubber for electronic devices. This heat is further radiated from the chassis or casing to the outside.
従って、放熱ファン等を特に設けなくても、効率の良
い放熱が可能となる。Therefore, efficient heat dissipation can be achieved without providing a heat dissipation fan or the like.
次に、この考案の実施例を説明する。 Next, an embodiment of the present invention will be described.
第１図はこの考案の実施例の断面図、第２図は他の実
施例の断面図、第３図及び第４図は実施例の使用状態を
示す要部断面図である。FIG. 1 is a cross-sectional view of an embodiment of the present invention, FIG. 2 is a cross-sectional view of another embodiment, and FIGS. 3 and 4 are main-portion cross-sectional views showing a use state of the embodiment.
この考案の電子機器用伝熱シールゴム１は、例えば、
金属粉混入ゴム等のように伝熱性の良いゴム製板状体２
の一面2Aに、板状体２に対し起立するリブ状体３…３が
空間Ｓを隔てて多数並行に立設されて構成されている。The heat transfer seal rubber 1 for electronic devices of the present invention is, for example,
Rubber plate 2 with good heat conductivity, such as rubber mixed with metal powder
On one surface 2A, a large number of ribs 3... 3 standing upright with respect to the plate 2 are arranged in parallel with a space S therebetween.
上記実施例において各リブ状体３…３の先端3A…3Aは
斜めに切断されていることが望ましい。In the above embodiment, it is desirable that the tips 3A... 3A of the ribs 3.
また、上記実施例として各リブ状体３…３の先端を開
放端とした場合を示したが、第２図に示すように各リブ
状体３…３の先端を板状体４で一体に連接した構成とし
ても良い。In the above embodiment, the case where the ends of the ribs 3... 3 are open ends is shown. However, the ends of the ribs 3. It may be configured to be connected.
さらに、この考案の電子機器用伝熱シールゴム１は第
３図又は第４図に示すように圧縮変形させて使用する
が、ゴム材質の硬度が高く、変形しにくい場合は、第３
図又は第４図に示すように、各リブが斜方向に起立する
断面形状に予め成形し弾性変形し易く構成される。Further, the heat transfer seal rubber 1 for electronic devices of the present invention is used after being compressed and deformed as shown in FIG. 3 or FIG.
As shown in FIG. 4 or FIG. 4, each rib is preliminarily formed into a cross-sectional shape that rises in an oblique direction and is configured to be easily elastically deformed.
上記実施例において、各電子機器用伝熱シールゴム１
は第３図または第４図に示すように、厚さ方向（矢印
Ｘ）へ圧縮された状態で発熱回路を有した回路板Ｐとシ
ャーシまたはケーシングＣ間に介挿される。In the above embodiment, the heat transfer seal rubber 1 for each electronic device is used.
3 is inserted between the circuit board P having the heating circuit and the chassis or casing C in a state of being compressed in the thickness direction (arrow X) as shown in FIG. 3 or FIG.
このとき、回路板Ｐの熱は電子機器用伝熱シールゴム
１を介して、シャーシまたはケーシングＣへ伝熱され、
さらにこの熱はシャーシまたはケーシングＣから外部へ
と放熱される。At this time, the heat of the circuit board P is transferred to the chassis or casing C via the heat transfer seal rubber 1 for electronic devices,
This heat is further radiated from the chassis or casing C to the outside.
従って、放熱ファン等を特に設けなくても、効率の良
い放熱が可能となる。Therefore, efficient heat dissipation can be achieved without providing a heat dissipation fan or the like.
この場合、第１図に示した実施例で、リブ状体３の先
端を斜めに切断した場合は、その傾斜部分がシャーシま
たはケーシングＣ表面に面3A′で接するので、接触面積
が大きくなり、良好な伝熱効果が得られる。In this case, in the embodiment shown in FIG. 1, when the tip of the rib-like body 3 is cut obliquely, the contact area increases because the inclined portion contacts the surface of the chassis or casing C at the surface 3A '. Good heat transfer effect is obtained.
また、第２図の実施例の場合は、伝熱を行う伝熱シー
ルゴム１の体積が増加するのでよりよい伝熱効率とな
る。In the case of the embodiment shown in FIG. 2, the volume of the heat transfer seal rubber 1 for transferring heat is increased, so that better heat transfer efficiency is achieved.
さらに、何れの実施例においても電子機器用伝熱シー
ルゴム１は空間Ｓによって弾性が低くされているため回
路板ＰとシャーシまたはケーシングＣ間に圧縮介挿され
やすく、圧縮状態に応じた緩衝作用があり、防振も合わ
せて行う。Further, in any of the embodiments, the heat transfer seal rubber 1 for electronic equipment is easily elastically inserted between the circuit board P and the chassis or the casing C because the elasticity of the rubber seal 1 is reduced by the space S. Yes, anti-vibration is also performed.
この場合において、金属粉混入等により伝熱性を良く
したゴムは金属粉無混入のゴムに比し弾性が低く、物性
的に緩衝性が低いが、空間部Ｓを有して立設したリブ状
体３の形状によりその弾性が保持される。In this case, the rubber whose heat conductivity is improved by mixing metal powder or the like has lower elasticity and lower physical properties than rubber without mixing metal powder. The shape of the body 3 maintains its elasticity.
また、予め第３図又は第４図に示す断面形状に成形し
たものの場合は、その形状により曲げ変形がし易く、こ
れによって弾性が発揮される。Further, in the case of a preliminarily formed one having the cross-sectional shape shown in FIG. 3 or FIG. 4, it is easy to bend and deform due to the shape, thereby exhibiting elasticity.
以上説明したように、この考案によれば、弾性の低い
金属粉混入等により伝熱性を良くしたゴムであっても空
間部を有して起立したリブ状体の形状によりその弾性が
確保される。As described above, according to the present invention, the elasticity is ensured by the shape of the rib-like body that has a space and stands up even if the rubber has improved heat conductivity by mixing metal powder with low elasticity. .
また、その弾性により対象物に対する密着が良く隙間
なく対象物間に密接するので、発熱のある回路に対する
熱伝導性が良く、このため特に冷却ファンを設けること
なく効率の良い放熱が図られ、回路を良好な状態に保つ
ことができる実用的効果を有するのである。In addition, because of its elasticity, it has good adhesion to the object and close contact between the objects without any gaps, so that it has good thermal conductivity to a circuit that generates heat, so that efficient heat radiation can be achieved without providing a cooling fan. Has a practical effect that can be maintained in a good state.
【図面の簡単な説明】 第１図はこの考案の実施例の断面図、第２図は他の実施
例の断面図、第３図及び第４図は実施例の使用状態を示
す要部断面図である。 １…電子機器用伝熱シールゴム、２…ゴム製板状体、2A
…一面、３…リブ状体、3A…先端、４…板状体、Ｓ…空
間、Ｐ…回路板、Ｃ…シャーシまたはケーシング。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view of an embodiment of the present invention, FIG. 2 is a cross-sectional view of another embodiment, and FIGS. FIG. 1. Heat transfer seal rubber for electronic equipment 2. Rubber plate, 2A
... one surface, 3 ... rib, 3A ... tip, 4 ... plate, S ... space, P ... circuit board, C ... chassis or casing.
Claims (1)
ーシ又はケーシング等の内面との間に圧縮介挿される電
子機器用伝熱シールゴムであって、金属粉混入により伝
熱性が良くされたゴム製板状体の一面に、該板状体に対
し起立するリブ状体が空間を隔てて多数平行に立設さ
れ、該リブ状体先端を必要に応じて一体に連接してなる
ことを特徴とする電子機器用伝熱シールゴム。1. A heat-transfer seal rubber for electronic equipment, which is inserted between a circuit board having a heat generating circuit and an inner surface of a chassis or a casing of an electric equipment, the rubber having improved heat conductivity due to mixing of metal powder. On one surface of the plate-like body, a number of rib-like bodies standing upright with respect to the plate-like body are erected in parallel with a space therebetween, and the rib-like body ends are connected integrally as required. Heat transfer seal rubber for electronic equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989129930U JP2548177Y2 (en) | 1989-11-07 | 1989-11-07 | Heat transfer seal rubber for electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989129930U JP2548177Y2 (en) | 1989-11-07 | 1989-11-07 | Heat transfer seal rubber for electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0368672U JPH0368672U (en) | 1991-07-05 |
| JP2548177Y2 true JP2548177Y2 (en) | 1997-09-17 |
Family
ID=31677528
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989129930U Expired - Lifetime JP2548177Y2 (en) | 1989-11-07 | 1989-11-07 | Heat transfer seal rubber for electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2548177Y2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002325350A (en) * | 2001-04-26 | 2002-11-08 | Mitsubishi Electric Corp | Submarine repeating equipment and manufacturing method therefor |
| JP6039887B2 (en) * | 2011-04-14 | 2016-12-07 | セイコーエプソン株式会社 | robot |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60107197U (en) * | 1983-12-24 | 1985-07-20 | 日立造船株式会社 | Seal abnormality detection device |
-
1989
- 1989-11-07 JP JP1989129930U patent/JP2548177Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0368672U (en) | 1991-07-05 |
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