JP2535086Y2 - Electronic component mounting structure and its holder - Google Patents
Electronic component mounting structure and its holderInfo
- Publication number
- JP2535086Y2 JP2535086Y2 JP3973191U JP3973191U JP2535086Y2 JP 2535086 Y2 JP2535086 Y2 JP 2535086Y2 JP 3973191 U JP3973191 U JP 3973191U JP 3973191 U JP3973191 U JP 3973191U JP 2535086 Y2 JP2535086 Y2 JP 2535086Y2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- lead terminal
- mounting structure
- holder
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本考案は、電子部品の実装構造及
びその実装構造に用いる保持体の構造に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting structure of an electronic component and a structure of a holder used for the mounting structure.
【０００２】[0002]
【従来の技術】従来、リ−ド線を有する近接センサ、半
導体素子、受動素子などの電子部品をプリント配線板等
の基板に実装する場合、特別にフォ−ミング加工したリ
−ド線に絶縁チュ−ブを挿入したり、絶縁スペ−サを設
けて、基板上の位置決めやランド間隔の保持を行ってい
た。2. Description of the Related Art Conventionally, when electronic components such as a proximity sensor, a semiconductor element, and a passive element having a lead wire are mounted on a substrate such as a printed wiring board, a specially formed lead wire is insulated. A tube is inserted or an insulating spacer is provided to perform positioning on the substrate and hold the land interval.
【０００３】このようなリ−ド線のフォ−ミング加工
は、治具の準備や加工工数を要するなどの欠点があり、
又、絶縁チュ−ブの挿入による実装では基板に装着後も
位置出しの調整が必要であり、位置精度が十分ではな
い。又、リ−ド線にフォ−ミング加工などをほどこさな
いで、リ−ド間隔のせまいままに実装すると基板でのラ
ンド間隔も十分でなく、安全規格上も問題を生じやす
い。[0003] Such forming of a lead wire has drawbacks such as the necessity of preparing a jig and the number of processing steps.
Further, in mounting by inserting an insulating tube, it is necessary to adjust the positioning even after mounting on the board, and the positioning accuracy is not sufficient. Also, if the lead wire is not subjected to forming processing or the like and is mounted with a narrow lead interval, the land interval on the board will not be sufficient, and problems will easily occur in safety standards.
【０００４】[0004]
【考案が解決しようとする課題】解決しようとする問題
点は、プリント配線板等の基板上にリ−ド端子をもつ電
子部品を実装するときの電子部品が安定して固定できな
い、特別にフォ−ミング加工手段を要する、基板上で電
子部品のリ−ド端子や本体部の位置決めの困難性などで
ある。なお、ここでリ−ド端子とは、手で押して屈曲す
る程度の線状、帯状の導電体である。（以下、同じ）The problem to be solved is that when an electronic component having lead terminals is mounted on a substrate such as a printed wiring board, the electronic component cannot be fixed stably. -It is difficult to position a lead terminal of an electronic component or a main body on a substrate, which requires a means for machining. Here, the lead terminal is a linear or belt-shaped conductor that can be pushed and bent by hand. (same as below)
【０００５】[0005]
【課題を解決するための手段】本考案は、電子部品の本
体部を収容する固定部、リ−ド端子を挿入できる穴部、
及び基板に位置決めをする突起部をもつ保持体を基板に
装着する実装構造であり、前記穴部の少なくとも一つに
はリ−ド端子の挿入時にフォ−ミング加工ができるよう
に湾曲部を設けることを特徴とし、実装精度の向上、生
産の容易性等を実現する。According to the present invention, there is provided a fixing portion for accommodating a main body of an electronic component, a hole portion for inserting a lead terminal,
And a mounting structure in which a holder having a projection for positioning the substrate is mounted on the substrate, and at least one of the holes is provided with a curved portion so that a forming process can be performed when a lead terminal is inserted. It is characterized by improving the mounting accuracy and facilitating production.
【０００６】[0006]
【実施例】図３は本考案の実装構造に用いる電子部品の
構造例を示す斜視構造図であり、２は電子部品の本体
部、３はリ−ド端子である。電子部品としては、前記せ
るごとく、近接センサ、半導体素子、受動素子など種々
のものに適用できる。又、リ−ド端子３についても形
状、本数等は図３に限定されず、前記せるごとく、手で
屈曲し得る程度のフレキシビリティを持つものである。FIG. 3 is a perspective structural view showing an example of the structure of an electronic component used for the mounting structure of the present invention. As described above, the electronic component can be applied to various components such as a proximity sensor, a semiconductor device, and a passive device. The shape, number, etc., of the lead terminals 3 are not limited to those shown in FIG. 3, and as described above, the lead terminals 3 have such flexibility that they can be bent by hand.
【０００７】図１は本考案の実施例を示す実装構造図で
あり、（ａ）は平面図、（ｂ）は正面図である。又、図
２は図１の側面断面図を示す。それぞれの符号について
は、１は保持体、２は電子部品の本体部、３はリ−ド端
子、４は１に設けた固定部、５は１に設けた突起部、６
は１に設けた穴部、７は穴部６に設けた湾曲部、８は基
板である。FIG. 1 is a mounting structure diagram showing an embodiment of the present invention, in which (a) is a plan view and (b) is a front view. FIG. 2 is a side sectional view of FIG. As for each reference numeral, 1 is a holder, 2 is a main body of an electronic component, 3 is a lead terminal, 4 is a fixing portion provided on 1, 5 is a projection provided on 1, 6
Is a hole provided in the hole 1, 7 is a curved portion provided in the hole 6, and 8 is a substrate.
【０００８】図３のごとき電子部品を保持体１の穴部６
の上部からリ−ド端子３を挿入し、固定部４に本体部２
を収容し、固定する。そのリ−ド端子３の挿入時、穴
（３）部６に形成された湾曲部７により、リ−ド端子３
が押されながら、フォ−ミング加工され、保持体１の底
部の所定の位置決めをなし得る。即ち、図１（ａ）のごと
く３本のリ−ド端子３の内、中央に位置するリ−ド端子
のみ、穴部６の湾曲部７に沿って、フォ−ミング加工さ
れ、１の底部におけるリ−ド端子の所定位置を決める。
図２においては、湾曲部７に沿って挿入されるリ−ド端
子３（実線で示す）はフォ−ミング加工され、湾曲部７
を設けない穴部６に挿入されたリ−ド端子３（点線で示
す）はフォ−ミング加工されないで、そのまま、１の底
部に達する。The electronic component as shown in FIG.
The lead terminal 3 is inserted from the upper part of the
House and secure. When the lead terminal 3 is inserted, the bent portion 7 formed in the hole (3) 6 allows the lead terminal 3 to be inserted.
Is pressed while forming, and the bottom of the holder 1 can be positioned at a predetermined position. That is, as shown in FIG. 1 (a), only the lead terminal located at the center among the three lead terminals 3 is formed along the curved portion 7 of the hole 6 and is formed at one bottom portion. The predetermined position of the lead terminal at is determined.
In FIG. 2, a lead terminal 3 (shown by a solid line) inserted along the curved portion 7 is formed by forming.
The lead terminal 3 (indicated by a dotted line) inserted into the hole 6 not provided with is not formed, but reaches the bottom of 1 as it is.
【０００９】次いで、電子部品を装着した保持体１をプ
リント配線板等の基板８の所定位置に設けた凹部、穴部
等の受け部に保持体１の位置決め用の突起部５を入れ、
同時に基板のランドにリ−ド端子３が挿入され、半田付
けより固着する。Next, the holder 1 on which the electronic components are mounted is inserted into a receiving portion such as a concave portion or a hole provided at a predetermined position of a substrate 8 such as a printed wiring board.
At the same time, the lead terminals 3 are inserted into the lands of the substrate and are fixed by soldering.
【００１０】このような、本考案の保持体を用いた電子
部品の実装構造により、電子部品の本体部及びリ−ド端
子の固定が確実であり、かつ基板上の位置決めが高精度
となる。又、基板上でのリ−ド端子の間隔を所定の寸法
になし得る。With the mounting structure of the electronic component using the holder of the present invention, the fixing of the main body and the lead terminal of the electronic component is ensured, and the positioning on the substrate is performed with high precision. Further, the distance between the lead terminals on the substrate can be set to a predetermined size.
【００１１】実施例ではリ−ド端子の中央に位置するも
ののみフォ−ミング加工をほどこしたが、いずれの一又
は複数本も挿入する穴部に湾曲部を設けることでフォ−
ミング加工ができる。In the embodiment, the forming process is applied only to the one located at the center of the lead terminal. However, by forming a curved portion in a hole portion into which one or more of the lead terminals are inserted, the forming portion is formed.
Can be machined.
【００１２】保持体１の固定部４の形状は、電子部品の
形状に対応して、任意に選択でき、又、保持体１の材質は
絶縁性樹脂や、リ−ド端子等の導電部に接触する部分の
み絶縁物とした金属などが選択できる。The shape of the fixing portion 4 of the holder 1 can be arbitrarily selected in accordance with the shape of the electronic component. The material of the holder 1 may be an insulating resin or a conductive portion such as a lead terminal. It is possible to select a metal or the like which has an insulating material only at a contacting portion.
【００１３】１の突起部５は、実施例では２個所、設け
たが、必要に応じ、１個所又はその他の個所に設けるこ
とができる。なお、その他、変形、付加、材料の変換等
のいずれの変更も本考案の要旨の範囲で本願に包含され
るものである。Although one protrusion 5 is provided at two places in the embodiment, it can be provided at one place or other places as needed. In addition, any changes such as modifications, additions, and conversions of materials are included in the present application within the scope of the present invention.
【００１４】[0014]
【考案の効果】以上、説明したごとく、本考案の電子部
品の実装構造及びその保持体により、基板上の電子部品
の実装を高精度に、かつ、生産性よくなし得るので、電
子機器等に広く利用でき、産業上きわめて有効である。[Effects of the Invention] As described above, the mounting structure of the electronic component of the present invention and the holder thereof enable the mounting of the electronic component on the substrate with high accuracy and high productivity. It can be widely used and is extremely effective in industry.
【図１】本考案の実装構造図であり、（ａ）は平面図、
（ｂ）は正面図である。FIG. 1 is a mounting structure diagram of the present invention, (a) is a plan view,
(B) is a front view.
【図２】図１の側面断面図である。FIG. 2 is a side sectional view of FIG.
【図３】電子部品の斜視構造図である。FIG. 3 is a perspective structural view of an electronic component.
１ 保持体 ２ 電子部品の本体部 ３ リ−ド端子 ４ １に設けた固定部 ５ １に設けた突起部 ６ １に設けた穴部 ７ ６に設けた湾曲部 ８ 基板 DESCRIPTION OF SYMBOLS 1 Holder 2 Main part of electronic components 3 Lead terminal 41 Fixed part 51 provided in 41 Projection part provided in 51 Hole part provided in 71 Curved part provided in 6 8 Substrate
Claims (2)
本体部をもつ電子部品、及び本体部を収容する固定部と
リ−ド端子を挿入できる穴部と基板に位置決めをする突
起部をもつ保持体から成り、リ−ド端子の挿入時に、穴
部の少なくとも一つに、リ−ド端子をフォ−ミング加工
するごとき湾曲部を形成するようにしたことを特徴とす
る電子部品の実装構造。1. A substrate such as a printed wiring board, an electronic component having a lead terminal and a main body, a fixing portion for accommodating the main body, a hole in which the lead terminal can be inserted, and a protrusion for positioning the substrate. And a curved portion formed in at least one of the holes when the lead terminal is inserted, such as by forming the lead terminal. Mounting structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3973191U JP2535086Y2 (en) | 1991-04-30 | 1991-04-30 | Electronic component mounting structure and its holder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3973191U JP2535086Y2 (en) | 1991-04-30 | 1991-04-30 | Electronic component mounting structure and its holder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04125474U JPH04125474U (en) | 1992-11-16 |
| JP2535086Y2 true JP2535086Y2 (en) | 1997-05-07 |
Family
ID=31920957
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3973191U Expired - Fee Related JP2535086Y2 (en) | 1991-04-30 | 1991-04-30 | Electronic component mounting structure and its holder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2535086Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6817142B2 (en) * | 2017-05-25 | 2021-01-20 | 田淵電機株式会社 | Pedestal for electronic components |
-
1991
- 1991-04-30 JP JP3973191U patent/JP2535086Y2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04125474U (en) | 1992-11-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |