JP2530938Y2 - Mounting structure of ceramic resonator - Google Patents
Mounting structure of ceramic resonatorInfo
- Publication number
- JP2530938Y2 JP2530938Y2 JP1990012272U JP1227290U JP2530938Y2 JP 2530938 Y2 JP2530938 Y2 JP 2530938Y2 JP 1990012272 U JP1990012272 U JP 1990012272U JP 1227290 U JP1227290 U JP 1227290U JP 2530938 Y2 JP2530938 Y2 JP 2530938Y2
- Authority
- JP
- Japan
- Prior art keywords
- ceramic resonator
- circuit board
- metal housing
- housing
- resonator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
【考案の詳細な説明】 〔産業上の利用分野〕 本考案は、回路基板への自動面実装に適したセラミッ
ク共振器の実装構造に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a mounting structure of a ceramic resonator suitable for automatic surface mounting on a circuit board.
発振回路や共振回路には共振器が用いられるが、最
近、装置の小型化と高感度化を図るために、共振器とし
てセラミック共振器が使用されるようになって来てい
る。第７図にはセラミック共振器１の回路基板２上への
実装構造が示されている。同図において、回路基板２上
にはグランド面３が形成されており、セラミック共振器
１はこのグランド面３上の定位置に配置固定される。A resonator is used for an oscillation circuit and a resonance circuit. In recent years, a ceramic resonator has been used as a resonator in order to reduce the size and increase the sensitivity of the device. FIG. 7 shows a mounting structure of the ceramic resonator 1 on the circuit board 2. In FIG. 1, a ground plane 3 is formed on a circuit board 2, and the ceramic resonator 1 is arranged and fixed at a fixed position on the ground plane 3.
しかしながら、セラミック共振器１を回路基板２上に
載せて配置する方式では、回路基板２の上側にセラミッ
ク共振器１の厚みがそのまま突き出る形となるため、回
路基板２とセラミック共振器１を合わせた厚みが厚くな
り、装置の小型化が図れないという問題がある。もちろ
んセラミック共振器１を薄型にすれば全体の厚みを薄く
できる。ところが、セラミック共振器１のＱは断面積の
大きさに関係し、共振器１を薄型にするとＱが低くな
り、共振特性が悪化するという問題があり、共振器１の
薄型にも限度があり、セラミック共振器１を回路基板２
上に配置する方式ではどうしても満足すべき装置の小型
化は図れないという問題が生じる。However, in the method in which the ceramic resonator 1 is placed on the circuit board 2 and arranged, the thickness of the ceramic resonator 1 protrudes as it is on the upper side of the circuit board 2, so that the circuit board 2 and the ceramic resonator 1 are combined. There is a problem that the thickness is increased and the size of the device cannot be reduced. Of course, if the ceramic resonator 1 is made thin, the overall thickness can be reduced. However, the Q of the ceramic resonator 1 is related to the size of the cross-sectional area, and when the resonator 1 is made thinner, the Q becomes lower, and there is a problem that the resonance characteristics deteriorate, and the thickness of the resonator 1 is also limited. , Ceramic resonator 1 to circuit board 2
There is a problem in that the size of the apparatus cannot be satisfactorily reduced by the above arrangement.
このような厚肉化の問題を解消するために、回路基板
２にセラミック共振器１の収容穴をあけ、この穴内にセ
ラミック共振器１をがたつきなく嵌め込む実装方式が考
えられる。しかし、周知のように、セラミック共振器１
の外形寸法はばらつきが非常に大きく、収容穴に対して
セラミック共振器１の形状が小さすぎてがたついたり、
収容穴に対してセラミック共振器１の大きさが大きす
ぎ、例えば、セラミック共振器１を自動機械（自動マウ
ンター）で実装する時に、セラミック共振器１の周端部
が前記収容穴に突き当たり、回路基板２が破損するとい
う問題が生じる。In order to solve such a problem of thickening, a mounting method in which a hole for accommodating the ceramic resonator 1 is formed in the circuit board 2 and the ceramic resonator 1 is fitted in the hole without play is considered. However, as is well known, the ceramic resonator 1
The external dimensions of the ceramic resonator 1 vary greatly, and the shape of the ceramic resonator 1 is too small for the accommodation hole,
The size of the ceramic resonator 1 is too large with respect to the accommodation hole. For example, when the ceramic resonator 1 is mounted by an automatic machine (automatic mounter), the peripheral end of the ceramic resonator 1 abuts on the accommodation hole, and the circuit is closed. There is a problem that the substrate 2 is damaged.
また、セラミック共振器を実装した回路基板全体の厚
みを小さくするために、第８図のように、回路基板２に
収容穴を設け、この収容穴に円弧状の突き出し部4aを設
けた金属板４を嵌め込み、この金属板４の円弧状の部分
に断面を丸形にしたセラミック共振器１を配置する実装
構造も提案されている。しかし、この提案構造において
も、前記のごとく、セラミック共振器１の外形寸法のば
らつきが大きいために、セラミック共振器１の丸形の半
径と金属板４の円弧状の半径との大きさがくいちがい、
セラミック共振器１が転動したりして、その実装位置が
ずれる等して、実装の安定性が損なわれるという問題が
ある。このように、セラミック共振器１の実装位置がず
れる等して不安定になると自動機械を用いて回路基板２
に回路素子を平面実装する上で大きな支障になり、自動
機械によるセラミック共振器１の面実装が円滑に行われ
ないという問題が生じるとともに、転動によって回路の
集中定数が変化し、共振条件、すなわち、共振周波数が
変動するという問題が生じる。In addition, in order to reduce the thickness of the entire circuit board on which the ceramic resonator is mounted, as shown in FIG. 8, a metal plate provided with an accommodation hole in the circuit board 2 and having an arc-shaped protrusion 4a in the accommodation hole. A mounting structure has also been proposed in which a ceramic resonator 1 having a round cross section is disposed in an arc-shaped portion of the metal plate 4. However, also in this proposed structure, as described above, since the external dimensions of the ceramic resonator 1 vary greatly, the round radius of the ceramic resonator 1 and the arc-shaped radius of the metal plate 4 are not the same. ,
There is a problem in that the mounting stability is impaired due to rolling of the ceramic resonator 1 or displacement of the mounting position. As described above, when the mounting position of the ceramic resonator 1 becomes unstable due to a shift or the like, the circuit board 2 is automatically machined.
In addition, this causes a great problem in mounting the circuit elements in a plane, causing a problem that the surface mounting of the ceramic resonator 1 by the automatic machine is not performed smoothly, and the lumped constant of the circuit changes due to the rolling, so that the resonance condition, That is, there is a problem that the resonance frequency fluctuates.
本考案は上記課題を解決するためになされたものであ
り、その目的は、セラミック共振器を回路基板の厚み方
向に大きく突き出すことなく実装することができ、しか
も、セラミック共振器を回路基板に位置ずれなく、安定
的に配置することができる自動面実装に適したセラミッ
ク共振器の実装構造を提供することにある。SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problem, and an object of the present invention is to enable a ceramic resonator to be mounted without protruding largely in the thickness direction of a circuit board, and to position a ceramic resonator on a circuit board. An object of the present invention is to provide a mounting structure of a ceramic resonator suitable for automatic surface mounting, which can be stably arranged without displacement.
本考案は上記目的を達成するために、次のように構成
されている。すなわち、本考案のセラミック共振器の実
装構造は、回路基板に設けられた嵌合穴に嵌め込まれる
膨出部と、その膨出部の縁部に形成された鍔部とを有す
る金属製ハウジングが前記膨出部を嵌合穴に嵌め込み鍔
部を回路基板面に係止した状態で回路基板に組み込まれ
ており、このハウジングの膨出部の内部はセラミック共
振器の収容凹部となっており、該収容凹部には側面から
内側に突出する弾性保持部が形成され、収容凹部に嵌め
込まれたセラミック共振器の外周面は前記弾性保持部に
弾性力をもって保持されるとともに、セラミック共振器
の外周面と金属製ハウジングはその保持接触部において
ハンダ付けによって直接接続固定されており、また、金
属製ハウジングには前記嵌合穴の近傍に形成されている
回路基板のグランド面に直接接触する接触面が設けら
れ、この接触面と回路基板のグランド面との接触部位置
で金属製ハウジングとグランド面とがハンダ付けによっ
て直接導通固定されていることを特徴として構成されて
いる。The present invention is configured as follows to achieve the above object. That is, the mounting structure of the ceramic resonator of the present invention includes a metal housing having a bulging portion fitted into a fitting hole provided in a circuit board and a flange formed at an edge of the bulging portion. The bulging portion is fitted into the fitting hole and incorporated into the circuit board in a state where the flange portion is locked to the circuit board surface, and the inside of the bulging portion of the housing is a housing concave portion of the ceramic resonator, An elastic holding portion projecting inward from the side surface is formed in the housing concave portion, and an outer peripheral surface of the ceramic resonator fitted into the housing concave portion is held by the elastic holding portion with elastic force, and an outer peripheral surface of the ceramic resonator is provided. The metal housing and the metal housing are directly connected and fixed by soldering at their holding contact portions, and the metal housing is directly connected to the ground surface of the circuit board formed near the fitting hole. The contact surface is provided to the metal housing and the ground plane is configured as characterized by being conductive fixed directly by soldering at the contact portion position between the contact surface and the circuit ground plane of the substrate.
本考案では、回路基板に設けた嵌合穴に金属製ハウジ
ングの膨出部を嵌め込むことで、膨出部縁部に形成され
た鍔部が回路基板面に係止し、金属製ハウジングは回路
基板に組み込まれる。この状態で、セラミック共振器を
膨出部の内側の収容凹部に挿入すると、セラミック共振
器は弾性保持部を押し拡げながら収容凹部に入り込み、
セラミック共振器の底部が収容凹部の底部に到達した位
置で、セラミック共振器の外周面が弾性保持部に弾性力
をもって保持され、セラミック共振器はがたつきなく定
位置に安定的に配置される。また、このとき、セラミッ
ク共振器の外周面と金属製ハウジングは、その保持接触
部においてハンダ付けによって直接接続固定され、前記
嵌合穴の近傍に形成されている回路基板のグランド面に
金属製ハウジングの接触面が直接接触し、この接触面と
グランド面との接触部位置で、金属製ハウジングとグラ
ンド面とがハンダ付けによって直接導通固定される。In the present invention, by fitting the bulge of the metal housing into the fitting hole provided in the circuit board, the flange formed at the bulge edge is locked to the circuit board surface, and the metal housing is Assembled on a circuit board. In this state, when the ceramic resonator is inserted into the housing recess inside the bulging portion, the ceramic resonator enters the housing recess while pushing and expanding the elastic holding portion,
At the position where the bottom of the ceramic resonator reaches the bottom of the housing recess, the outer peripheral surface of the ceramic resonator is held by the elastic holding portion with elastic force, and the ceramic resonator is stably arranged at a fixed position without rattling. . At this time, the outer peripheral surface of the ceramic resonator and the metal housing are directly connected and fixed by soldering at their holding contact portions, and the metal housing is connected to the ground surface of the circuit board formed near the fitting hole. And the metal housing and the ground surface are directly conductively fixed by soldering at the position of the contact between the contact surface and the ground surface.
以下、本考案の一実施例を図面に基づいて説明する。
第１図〜第４図には本考案に係るセラミック共振器の実
装構造の一実施例が示されている。これらの図におい
て、回路基板２には嵌合穴５が設けられており、この嵌
合穴５の周りにはグランド面３が形成されている。前記
嵌合穴５には銅やりん青銅等のばね弾性を有する金属製
ハウジング６が組み込まれている。第２図に示すよう
に、この金属製ハウジング６はプレス加工等により形成
される膨出部７を有しており、この膨出部７の内部は収
容凹部８となっている。本実施例では、膨出部７の両側
壁面の上端側に、内側に突出する弾性保持部10が形成さ
れており、また、膨出部７の底面側の両側壁面は外側に
突出する外向き突出部11となっている。そして、膨出部
７の上端縁からは外側に向けて鍔部としての鍔12が張り
出し形成されている。Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
1 to 4 show one embodiment of the mounting structure of the ceramic resonator according to the present invention. In these drawings, a fitting hole 5 is provided in the circuit board 2, and a ground plane 3 is formed around the fitting hole 5. A metal housing 6 having spring elasticity such as copper or phosphor bronze is incorporated in the fitting hole 5. As shown in FIG. 2, the metal housing 6 has a bulging portion 7 formed by press working or the like, and the inside of the bulging portion 7 is a housing recess 8. In the present embodiment, elastic holding portions 10 protruding inward are formed on the upper end sides of both side wall surfaces of the bulging portion 7, and both side wall surfaces on the bottom surface side of the bulging portion 7 are outwardly projecting outward. The projection 11 is provided. A flange 12 as a flange is formed to protrude outward from the upper end edge of the bulging portion 7.
金属製ハウジング６は膨出部７を前記回路基板２の嵌
合穴５に嵌め込み、鍔12を回路基板面（回路基板２の表
面）に係止することで、同基板２に組み込まれており、
この組み込み状態で、膨出部７の外向き突出部11が嵌合
穴５の下端内周面に対して弾性的に嵌合し、嵌合穴５に
対する金属製ハウジング６のがたつきが防止されてい
る。The metal housing 6 is incorporated into the circuit board 2 by fitting the bulging portion 7 into the fitting hole 5 of the circuit board 2 and locking the flange 12 to the circuit board surface (the surface of the circuit board 2). ,
In this assembled state, the outwardly protruding portion 11 of the bulging portion 7 is elastically fitted to the inner peripheral surface at the lower end of the fitting hole 5, and the rattling of the metal housing 6 to the fitting hole 5 is prevented. Have been.
本実施例では、セラミック共振器１の断面形状を四角
形に形成しており、このセラミック共振器１は前記収容
凹部８に嵌め込まれる。この嵌め込みに際しては、セラ
ミック共振器１は収容凹部８の上側から挿入されるが、
この挿入に際し、セラミック共振器１は弾性保持部10を
外側に押し開いた状態で収容凹部８に挿入されることと
なり、セラミック共振器１はその嵌め込み完了状態で底
面が収容凹部８の水平底面に当接し、セラミック共振器
１の外周面（本実施例では両側面）は金属製ハウジング
６の弾性保持部10により、弾性力をもって保持される。
この弾性保持部10の弾性保持力により、セラミック共振
器１は収容凹部８内に位置ずれすることなく定位置に安
定的に保持される。このセラミック共振器１の保持状態
でセラミック共振器１と金属製ハウジング６は、その保
持接触部において、ハンダ13によって直接、すなわち、
リード線等を用いずに接続固定されている。また、金属
製ハウジング６には、回路基板２のグランド面３に直接
接触する接触面20が設けられ、この接触面20と回路基板
２のグランド面３との接触部位置で、金属製ハウジング
６と回路基板２のグランド面３とがハンダ14によって、
あるいはスポット溶着によって直接導通固定、すなわ
ち、リード線等を用いずに導通固定されている。In the present embodiment, the cross-sectional shape of the ceramic resonator 1 is formed in a rectangular shape, and the ceramic resonator 1 is fitted into the accommodation recess 8. At the time of this fitting, the ceramic resonator 1 is inserted from the upper side of the accommodation recess 8,
During this insertion, the ceramic resonator 1 is inserted into the housing recess 8 with the elastic holding portion 10 pushed outward and opened, and the bottom surface of the ceramic resonator 1 is placed on the horizontal bottom surface of the housing recess 8 when the fitting is completed. The outer peripheral surfaces of the ceramic resonator 1 (both sides in this embodiment) are held by the elastic holding portion 10 of the metal housing 6 with elastic force.
Due to the elastic holding force of the elastic holding portion 10, the ceramic resonator 1 is stably held at a fixed position without being displaced in the accommodation recess 8. In the holding state of the ceramic resonator 1, the ceramic resonator 1 and the metal housing 6 are directly held by the solder 13 at the holding contact portion, that is,
The connection is fixed without using a lead wire or the like. Further, the metal housing 6 is provided with a contact surface 20 that directly contacts the ground surface 3 of the circuit board 2, and the contact portion between the contact surface 20 and the ground surface 3 of the circuit board 2 And the ground surface 3 of the circuit board 2 by the solder 14
Alternatively, it is directly conductively fixed by spot welding, that is, conductively fixed without using a lead wire or the like.
セラミック共振器１の電極部15は従来の第７図に示す
ようにその先端側を曲げて回路基板２上の導体部17に接
続するようにしてもよいが、本実施例では、電極部15を
直線状に突出し、第４図に示すように、セラミック共振
器１を収容凹部８に収容した状態で電極部15と回路基板
２上に設けた導体部17とが導通するようにして、セラミ
ック共振器１の自動機械による自動面実装の容易化を図
っている。The electrode portion 15 of the ceramic resonator 1 may be connected to the conductor portion 17 on the circuit board 2 by bending the distal end side as shown in FIG. The electrode portion 15 and the conductor portion 17 provided on the circuit board 2 are electrically connected in a state where the ceramic resonator 1 is housed in the housing recess 8 as shown in FIG. This facilitates automatic surface mounting of the resonator 1 by an automatic machine.
上記実施例によれば、回路基板２に金属製ハウジング
６を組み込み、その後に、セラミック共振器１を金属製
ハウジング６の収容凹部８に嵌め込むだけで、セラミッ
ク共振器１は金属製ハウジング６の弾性保持部10に押圧
されて定位置に安定的に位置決めされることとなり、セ
ラミック共振器１の自動機械を用いての自動面実装が非
常に容易となる。According to the above embodiment, the metal housing 6 is incorporated into the circuit board 2, and then the ceramic resonator 1 is simply fitted into the housing recess 8 of the metal housing 6. The ceramic resonator 1 is stably positioned at a fixed position by being pressed by the elastic holding portion 10, so that the automatic surface mounting of the ceramic resonator 1 using an automatic machine becomes very easy.
また、本実施例によれば、セラミック共振器１の両側
面と金属製ハウジング６は、その保持接触部においてリ
ード線を用いずにハンダ付けによって直接接続固定さ
れ、また、回路基板２のグランド面３に金属製ハウジン
グ６の接触面20が直接接触して、この接触部位置で、金
属製ハウジング６とグランド面３とがリード線を用いず
にハンダ付けによって直接導通固定されているために、
リード線を設ける手間および、リード線をセラミック共
振器１や回路基板２に溶接等によって接続する手間を省
略することが可能となる。Further, according to the present embodiment, both side surfaces of the ceramic resonator 1 and the metal housing 6 are directly connected and fixed by soldering without using a lead wire at the holding contact portion, and the ground surface of the circuit board 2 is formed. Since the contact surface 20 of the metal housing 6 is in direct contact with the metal housing 3 and the metal housing 6 and the ground surface 3 are directly conductively fixed by soldering without using a lead wire at this contact portion position,
It is possible to save the trouble of providing the lead wires and the trouble of connecting the lead wires to the ceramic resonator 1 and the circuit board 2 by welding or the like.
そのため、リード線を用いてセラミック共振器１と回
路基板２とを接続する場合に比べて、セラミック共振器
１の回路基板２への実装構造および実装方法の簡略化を
図ることが可能となり、自動機械によるセラミック共振
器１の実装を極めて容易とすることができる。Therefore, as compared with the case where the ceramic resonator 1 and the circuit board 2 are connected using a lead wire, the mounting structure and mounting method of the ceramic resonator 1 on the circuit board 2 can be simplified, and automatic The mounting of the ceramic resonator 1 by a machine can be made extremely easy.
さらに、本実施例によれば、金属製ハウジング６の膨
出部７の縁部には鍔12が張り出し形成されており、この
鍔12が回路基板２の表面に係止して金属製ハウジング６
が回路基板２に組み込まれているために、たとえ、回路
基板２に形成する嵌合穴５の形成寸法が多少大きく形成
されたとしても、その嵌合穴５に金属製ハウジング６を
嵌め込んだときに金属製ハウジング６が嵌合穴５から抜
けることはなく、金属製ハウジング２を鍔12によって係
止して回路基板２に確実に組み込むことができる。Further, according to the present embodiment, the flange 12 is formed so as to protrude from the edge of the bulging portion 7 of the metal housing 6, and the flange 12 is engaged with the surface of the circuit board 2 so as to engage with the metal housing 6.
Is incorporated in the circuit board 2, so that the metal housing 6 is fitted into the fitting hole 5 even if the size of the fitting hole 5 formed in the circuit board 2 is slightly larger. Sometimes, the metal housing 6 does not come out of the fitting hole 5, and the metal housing 2 is locked by the flange 12, so that the metal housing 2 can be reliably incorporated into the circuit board 2.
さらに、本実施例では、セラミック共振器１の断面形
状を四角形に形成しているから、セラミック共振器１を
収容凹部８に収容した時に、セラミック共振器１の回転
方向に対する安定性が非常に良く、セラミック共振器１
の転がりによる位置ずれはまったく生じることがなく、
断面を四角にすることで、より一層の位置決めの安定化
が図られている。Furthermore, in this embodiment, since the cross-sectional shape of the ceramic resonator 1 is formed in a square shape, when the ceramic resonator 1 is housed in the housing recess 8, the stability of the ceramic resonator 1 in the rotation direction is very good. , Ceramic resonator 1
There is no displacement caused by the rolling of
By making the cross section square, the positioning is further stabilized.
さらに、本実施例によれば、前記のごとく、セラミッ
ク共振器１は回路基板２の定位置に安定的に位置決めさ
れるから、セラミック共振器１の位置ずれによるＱのば
らつきや低下を生じることがなく、高性能の回路を構成
することができる。Further, according to the present embodiment, as described above, the ceramic resonator 1 is stably positioned at the fixed position on the circuit board 2, so that a variation or a decrease in Q due to the displacement of the ceramic resonator 1 may occur. And a high-performance circuit can be configured.
なお、本考案は上記実施例に限定されることはなく、
さまざまな実施の態様を採り得る。例えば、上記実施例
では、セラミック共振器１の外周面を保持するために、
収容凹部８の両側壁面から弾性保持部10を内側に突出さ
せたが、この弾性保持部10は収容凹部８の片側の側壁面
から内側に突設させたものでもよい。The present invention is not limited to the above embodiment,
Various embodiments may be employed. For example, in the above embodiment, in order to hold the outer peripheral surface of the ceramic resonator 1,
Although the elastic holding portions 10 protrude inward from both side walls of the housing recess 8, the elastic holding portions 10 may protrude inward from one side wall surface of the housing recess 8.
また、第５図に示すように、収容凹部８の一方の側壁
面あるいは両側壁面から爪状の弾性保持部10を突出さ
せ、この爪状の弾性保持部10により、セラミック共振器
１を弾性保持するようにしてもよい。この場合、第６図
に示すように、爪16を収容凹部８の外側にも突出させ、
金属製ハウジング６の膨出部７を回路基板２の嵌合穴５
内に爪16を内側に押しながら嵌め込み、膨出部７が完全
に嵌め込み完了した時に爪16が外側に開いて、爪16の接
触面20が回路基板２の下面に設けたグランド面３に直接
導通するようにしてもよい。このように、金属製ハウジ
ング６における収容凹部８の側壁面の形状や回路基板２
のグランド面３との接触面20の形成形態は仕様に応じさ
まざまな形態に設計できるものである。また、セラミッ
ク共振器１の外形も四角以外の任意の形状とすることが
できる。As shown in FIG. 5, a claw-shaped elastic holding portion 10 is protruded from one side wall surface or both side wall surfaces of the accommodating recess 8, and the claw-shaped elastic holding portion 10 holds the ceramic resonator 1 elastically. You may make it. In this case, as shown in FIG.
The bulging portion 7 of the metal housing 6 is fitted into the fitting hole 5 of the circuit board 2.
The claw 16 is inserted into the inside while pushing the claw 16 inward, and when the bulging portion 7 is completely fitted, the claw 16 opens outward, and the contact surface 20 of the claw 16 directly contacts the ground surface 3 provided on the lower surface of the circuit board 2. It may be made conductive. Thus, the shape of the side wall surface of the housing recess 8 in the metal housing 6 and the circuit board 2
The formation form of the contact surface 20 with the ground plane 3 can be designed in various forms according to specifications. In addition, the outer shape of the ceramic resonator 1 can be any shape other than a square.
本考案は、回路基板の嵌合穴に組み込まれる金属製ハ
ウジングの収容凹部には側面から内側に突出する弾性保
持部を設け、セラミック共振器がこの収容凹部に嵌め込
んだ時に、セラミック共振器は前記弾性保持部によって
弾性的に保持されるように構成したものであるから、セ
ラミック共振器を収容凹部に嵌め込むだけで、セラミッ
ク共振器は定位置にがっちりと安定的に位置決めされ
る。その上、金属製ハウジングにはグランド面との接触
面が設けられ、この接触面とグランド面および金属製ハ
ウジングとセラミック共振器とはハンダ付けにより直接
導通固定できるから、これらの導通固定作業も容易化さ
れることとなり、自動機械によるセラミック共振器の自
動面実装が極めて容易になるし、セラミック共振器の実
装構造の簡略化を図ることもできる。このことから従来
に較べ、セラミック共振器の実装の作業工数を大幅に削
減することができ、装置製造の効果的なコストダウンを
はかることができる。さらに、本考案によれば、金属製
ハウジングの膨出部の縁部には鍔部が張り出し形成され
ており、この鍔部が回路基板表面に係止して金属製ハウ
ジングが固定基板に組み込まれているために、たとえ、
回路基板に形成する嵌合穴の形成寸法が多少大きく形成
されたとしても、その嵌合穴に金属製ハウジングを嵌め
込んだときに金属製ハウジングが嵌合穴から抜け落ちる
ことはなく、金属製ハウジングをその鍔部によって係止
して回路基板に確実に組み込むことができる。The present invention provides an elastic holding portion projecting inward from a side surface in a housing recess of a metal housing incorporated in a fitting hole of a circuit board, and when the ceramic resonator is fitted into the housing recess, the ceramic resonator is Since the elastic resonator is configured to be elastically held by the elastic holding portion, the ceramic resonator is firmly and stably positioned at a fixed position only by fitting the ceramic resonator into the housing recess. In addition, the metal housing is provided with a contact surface with the ground surface, and the contact surface and the ground surface, and the metal housing and the ceramic resonator can be directly conductively fixed by soldering. Therefore, automatic surface mounting of the ceramic resonator by an automatic machine becomes extremely easy, and the mounting structure of the ceramic resonator can be simplified. Therefore, the number of steps for mounting the ceramic resonator can be significantly reduced as compared with the related art, and the cost of manufacturing the device can be effectively reduced. Further, according to the present invention, a flange portion is formed so as to protrude from an edge of the bulging portion of the metal housing, and the flange portion is engaged with the surface of the circuit board so that the metal housing is incorporated into the fixed substrate. Even if
Even if the size of the fitting hole formed in the circuit board is somewhat large, the metal housing does not fall out of the fitting hole when the metal housing is fitted into the fitting hole, and the metal housing Can be locked by the flange portion and can be reliably incorporated into the circuit board.
そして、このように、金属製ハウジングを回路基板に
確実に組み込み、かつ、前記の如く、この金属製ハウジ
ングにセラミック共振器をがっちりと安定的に保持して
固定できることから、セラミック共振器を定位置に安定
的に実装でき、しかも金属製ハウジングとグランド面お
よび金属製ハウジングとセラミック共振器との接続が接
着剤を用いることなく確実に行われることで、グランド
回路が完全となり、セラミック共振器のＱのばらつきや
Ｑの低下を生じることがなく、これにより、セラミック
共振器を内蔵した高性能の回路を構成することが可能と
なる。In this way, since the metal housing is securely incorporated in the circuit board and the ceramic resonator can be firmly and stably held and fixed to the metal housing as described above, the ceramic resonator is fixed in position. And the connection between the metal housing and the ground surface and the connection between the metal housing and the ceramic resonator are securely performed without using an adhesive. Therefore, a high-performance circuit having a built-in ceramic resonator can be configured.
さらに、セラミック共振器は回路基板に組み込まれて
いる金属製ハウジングの膨出部内の収容凹部に収容され
るから、セラミック共振器が回路基板から突き出す量も
小さくでき、セラミック共振器を直接回路基板上に実装
する方式に較べ、装置の小型化を一般にセラミック共振
器を高周波駆動すると、セラミック共振器の内部から外
周面の外に向けて電界（電磁波）が四方八方に放射さ
れ、この放射電界により周囲の回路素子とその間に浮遊
分布容量をもち、この浮遊分布容量によってセラミック
共振器の共振特性が悪影響をうけるが、本考案において
はセラミック共振器の外周は金属製ハウジングに導通接
続され、この金属製ハウジングは回路基板のグランド面
に導通するので、セラミック共振器の外周面はグランド
電位面となる結果、セラミック共振器の外周面（グラン
ド電位面）がセラミック共振器内部から放射する電界を
吸収して（グランド電位面に落として）外部への電界放
射を防止し、周囲の回路素子との浮遊分布容量の発生に
よる悪影響を無くすことができるという効果が得られ
る。Furthermore, since the ceramic resonator is housed in the housing recess in the bulge of the metal housing incorporated in the circuit board, the amount of protrusion of the ceramic resonator from the circuit board can be reduced, and the ceramic resonator can be directly mounted on the circuit board. In general, when a ceramic resonator is driven at a high frequency, the electric field (electromagnetic wave) is radiated from the inside of the ceramic resonator to the outside of the outer peripheral surface in all directions. The circuit element has a floating distribution capacitance between them, and the floating distribution capacitance adversely affects the resonance characteristics of the ceramic resonator.In the present invention, the outer periphery of the ceramic resonator is conductively connected to a metal housing, Since the housing is electrically connected to the ground plane of the circuit board, the outer peripheral surface of the ceramic resonator becomes a ground potential plane, and The outer peripheral surface (ground potential surface) of the Mick resonator absorbs the electric field radiated from inside the ceramic resonator (drops it to the ground potential surface) to prevent the emission of electric field to the outside, and the floating distribution capacitance with surrounding circuit elements The effect that the bad influence by generation of can be eliminated can be obtained.
第１図は本考案に係るセラミック共振器の実装構造の一
実施例を示す断面構成図、第２図は同実施例を構成する
金属製ハウジングの断面図、第３図は回路基板と金属製
ハウジングとの組み込み状態を示す斜視図、第４図は第
１図のＡ−Ａ断面図、第５図及び第６図は金属製ハウジ
ングの他の構成例を示す説明図、第７図は従来のセラミ
ック共振器の実装構造を示す側面図、第８図は金属板を
用いたセラミック共振器の実装構造の提案例を示す説明
図である。 １……セラミック共振器、２……回路基板、３……グラ
ンド面、４……金属板、4a……突き出し部、５……嵌合
穴、６……金属製ハウジング、７……膨出部、８……収
容凹部、10……弾性保持部、11……外向き突出部、12…
…鍔、13,14……ハンダ、15……電極部、16……爪、17
……導体部、20……接触面。FIG. 1 is a sectional view showing an embodiment of a mounting structure of a ceramic resonator according to the present invention, FIG. 2 is a sectional view of a metal housing constituting the embodiment, and FIG. 3 is a circuit board and a metal housing. FIG. 4 is a sectional view taken along line AA of FIG. 1, FIG. 5 and FIG. 6 are explanatory views showing other examples of the metal housing, and FIG. 8 is a side view showing a mounting structure of the ceramic resonator, and FIG. 8 is an explanatory view showing a proposed example of a mounting structure of the ceramic resonator using a metal plate. DESCRIPTION OF SYMBOLS 1 ... Ceramic resonator, 2 ... Circuit board, 3 ... Ground surface, 4 ... Metal plate, 4a ... Protrusion, 5 ... Mating hole, 6 ... Metal housing, 7 ... Swelling ..., Accommodation recess, 10... Elastic holding part, 11.
... Tsubasa, 13,14 ... Solder, 15 ... Electrode part, 16 ... Claw, 17
... conductor, 20 ... contact surface.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 実開 昭60−121324（ＪＰ，Ｕ) 実開 昭63−520（ＪＰ，Ｕ) 実開 昭55−7381（ＪＰ，Ｕ) 実開 昭56−172023（ＪＰ，Ｕ) 実公 昭61−33714（ＪＰ，Ｙ２) ──────────────────────────────────────────────────続 き Continuation of the front page (56) References Japanese Utility Model Showa 60-121324 (JP, U) Japanese Utility Model Showa 63-520 (JP, U) Japanese Utility Model Showa 55-7381 (JP, U) Japanese Utility Model Showa 56- 172023 (JP, U) Jiko 61-33714 (JP, Y2)
Claims (1)
る膨出部と、その膨出部の縁部に形成された鍔部とを有
する金属製ハウジングが前記膨出部を嵌合穴に嵌め込み
鍔部を回路基板面に係止した状態で回路基板に組み込ま
れており、このハウジングの膨出部の内部はセラミック
共振器の収容凹部となっており、該収容凹部には側面か
ら内側に突出する弾性保持部が形成され、収容凹部に嵌
め込まれたセラミック共振器の外周面は前記弾性保持部
に弾性力をもって保持されるとともに、セラミック共振
器の外周面と金属製ハウジングはその保持接触部におい
てハンダ付けによって直接接続固定されており、また、
金属製ハウジングには前記嵌合穴の近傍に形成されてい
る回路基板のグランド面に直接接触する接触面が設けら
れ、この接触面と回路基板のグランド面との接触部位置
で金属製ハウジングとグランド面とがハンダ付けによっ
て直接導通固定されているセラミック共振器の実装構
造。A metal housing having a bulging portion fitted into a fitting hole provided on the circuit board and a flange formed at an edge of the bulging portion. The housing is built into the circuit board in a state where the flange is locked to the surface of the circuit board, and the inside of the bulging portion of the housing is a recess for accommodating the ceramic resonator. The outer peripheral surface of the ceramic resonator fitted into the accommodation recess is held by the elastic holder with elastic force, and the outer peripheral surface of the ceramic resonator and the metal housing are in contact with each other. Part is directly connected and fixed by soldering, and
The metal housing is provided with a contact surface that is in direct contact with the ground surface of the circuit board formed in the vicinity of the fitting hole. A mounting structure of a ceramic resonator in which the ground plane is directly conductively fixed by soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990012272U JP2530938Y2 (en) | 1990-02-09 | 1990-02-09 | Mounting structure of ceramic resonator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990012272U JP2530938Y2 (en) | 1990-02-09 | 1990-02-09 | Mounting structure of ceramic resonator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03103620U JPH03103620U (en) | 1991-10-28 |
| JP2530938Y2 true JP2530938Y2 (en) | 1997-04-02 |
Family
ID=31515760
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990012272U Expired - Lifetime JP2530938Y2 (en) | 1990-02-09 | 1990-02-09 | Mounting structure of ceramic resonator |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2530938Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016076609A (en) * | 2014-10-07 | 2016-05-12 | アール・ビー・コントロールズ株式会社 | Spacer for printed wiring board |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS557381U (en) * | 1978-06-29 | 1980-01-18 | ||
| JPS5678284U (en) * | 1979-11-09 | 1981-06-25 | ||
| JPS56172023U (en) * | 1980-05-20 | 1981-12-18 | ||
| JPS58197909A (en) * | 1982-05-13 | 1983-11-17 | Murata Mfg Co Ltd | Mounting structure of chip-like piezo-electric oscillation part |
| JPS60121324U (en) * | 1984-01-25 | 1985-08-16 | オムロン株式会社 | Crystal resonator mounting bracket |
| JPS6133714U (en) * | 1984-07-31 | 1986-03-01 | トヨタ自動車株式会社 | Automobile window glass mounting structure |
| JPS63520U (en) * | 1986-06-19 | 1988-01-05 |
-
1990
- 1990-02-09 JP JP1990012272U patent/JP2530938Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03103620U (en) | 1991-10-28 |
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| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |