JP2530670B2 - Cooling ventilation structure for the housing that houses electronic devices - Google Patents
Cooling ventilation structure for the housing that houses electronic devicesInfo
- Publication number
- JP2530670B2 JP2530670B2 JP62295974A JP29597487A JP2530670B2 JP 2530670 B2 JP2530670 B2 JP 2530670B2 JP 62295974 A JP62295974 A JP 62295974A JP 29597487 A JP29597487 A JP 29597487A JP 2530670 B2 JP2530670 B2 JP 2530670B2
- Authority
- JP
- Japan
- Prior art keywords
- housing
- cooling air
- electronic device
- air flow
- air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は空冷電子機器の冷却風吸気技術に係り、特に
大形筐体（高さ1m以上）で、大吸気量を必要とする場合
に好適なように耐塵埃性を強化した電子機器筐体に関す
るものである。The present invention relates to a cooling air intake technology for air-cooled electronic devices, and particularly when a large housing (height 1 m or more) requires a large intake air amount. The present invention relates to an electronic device housing having enhanced dust resistance as appropriate.
従来の電子機器筐体には第３図に示す様に設置環境自
体の改善を図る方式がある。電子機器筐体１は専用室13
内に設置され、空調装置14により吸気温度を一定値以下
に抑えられる。更にこの空調装置14には空気浄化装置15
（一般にはエアフイルタ）が取付けられており、このエ
アフイルタにより電子機器筐体１への吸入埃図量を少な
くすることができる。As a conventional electronic device housing, there is a system for improving the installation environment itself as shown in FIG. The electronic device housing 1 is a dedicated room 13
Installed inside, the air conditioner 14 can keep the intake air temperature below a certain value. Further, this air conditioner 14 has an air purifier 15
(Generally, an air filter) is attached, and the amount of dust drawn into the electronic device housing 1 can be reduced by the air filter.
次に、第５図にもう１つの従来例を示す。本従来例
は、本来、排気風の側面排気によるオペレータへの不快
感をなくす為に考案された方式である。つまり冷却技術
の観点からみれば、筐体16を冷却する為には開口部17か
ら吸気し、開口部18から排気するのが望ましい。しかし
ながら開口部18から排気した場合、その排気風がオペレ
ータに吹き付けられるという問題があり吸気口を18の開
口部とし、排気口を17の開口部にするという構造になつ
たものである。本方式（第５図）は比較的低発熱量の電
子機器用の筐体に採用されている。本方式は耐塵埃性の
強化という観点からみれば、目的に符合した形となつて
いる。Next, FIG. 5 shows another conventional example. The conventional example is a system originally designed to eliminate discomfort to the operator due to side exhaust of exhaust air. In other words, from the viewpoint of the cooling technology, it is desirable to intake air through the opening 17 and exhaust air through the opening 18 in order to cool the housing 16. However, when exhausted from the opening 18, there is a problem that the exhaust air is blown to the operator, and the structure is such that the intake port is the opening part 18 and the exhaust port is the opening part 17. This method (Fig. 5) is used in a housing for electronic devices that generate a relatively low amount of heat. This method is suitable for the purpose from the viewpoint of strengthening dust resistance.
電子装置の高速化は、使用素子をTTLからECLにするこ
とで５〜６倍高速化することができる。ところがECLを
採用した場合発熱量も５〜６倍になる。一方、使用素子
は温度を一定値以下に押さえなければならず、そこで第
４図に示す様な関係が必要となる。本図は素子表面の空
気温度上昇を10℃以下に押さえる為に必要な風量と素子
を実装した基板の発熱量とを表わした図表である。従来
のTTL素子の場合は基板面積が0.1m2レベルの基板の場合
でも75W（ワツト）程度であつたが、これをECL素子に変
えた場合は約400Wとなり、それに伴い必要風量も0.38m3
/分から2.0m3/分へと増加する。The speed of electronic devices can be increased 5 to 6 times by changing the element used from TTL to ECL. However, when ECL is used, the amount of heat generated will be 5 to 6 times higher. On the other hand, the element to be used must keep the temperature below a certain value, which requires the relationship shown in FIG. This figure is a table showing the air flow required to keep the air temperature rise on the device surface below 10 ° C and the amount of heat generated by the substrate on which the device is mounted. In the case of the conventional TTL element, the board area was about 75W (Watt) even for the board of 0.1m 2 level, but when it was changed to the ECL element, it became about 400W, and the required air volume was 0.38m 3
/ Min to 2.0m 3 / min.
一方、素子の実装技術の進歩は目ざましく、100ピン
以上のLSTの場合、ピン間隙が、0.2〜0.3mmとなり、異
物によつてピン間絶縁が低下し易くなつた。異物とは一
般に塵埃であり、かつ、この塵埃に湿気が含まれた場合
が問題となる。従つて吸気流量が従来の４〜５倍、か
つ、ピン間隔が従来の４〜５分の１になる様な超高速コ
ンピユータの様な電気機器の場合、吸気塵埃量を出来る
だけ小さくすることが重要なポイントとなる。更に、こ
の吸気塵埃低減の為に、第３図に示す様な空調機に期待
することは、計算機自体のオフイス環境設置という要求
からは困難になつてきており、安価で、かつ電気機器自
体に耐塵埃性強化の機能をもたせる必要がある。On the other hand, the progress of the device mounting technology is remarkable, and in the case of LST of 100 pins or more, the pin gap is 0.2 to 0.3 mm, and the foreign matter easily deteriorates the insulation between the pins. The foreign matter is generally dust, and there is a problem when the dust contains moisture. Therefore, in the case of an electric device such as an ultra-high speed computer in which the intake flow rate is 4 to 5 times that of the conventional one, and the pin spacing is 4 to 1/5 of the conventional one, it is possible to reduce the intake dust amount as much as possible. This is an important point. Furthermore, in order to reduce the intake dust, it is becoming difficult to expect an air conditioner as shown in FIG. 3 due to the requirement that the computer itself be installed in an office environment. It is necessary to have a function of enhancing dust resistance.
空気中の浮遊塵埃のうち粒子径が１μ以上のものは沈
降性塵埃である。これらの塵埃は第２図に示す如く、床
面上30〜40cm以内の空間に浮遊している。またオフイス
等の環境では、この沈降性塵埃が全体の塵埃の大半を占
める。従つてこの沈降性塵埃の電子機器筐体への取込み
を押さえれば、耐塵埃性の大幅な改善につながることは
明らかである。Among suspended dust in the air, particles having a particle size of 1 μm or more are settling dust. As shown in FIG. 2, these dusts are floating in the space within 30 to 40 cm above the floor surface. In environments such as offices, the sedimentary dust occupies most of the whole dust. Therefore, it is obvious that if the sedimentation dust is prevented from being taken into the electronic device casing, the dust resistance is significantly improved.
その実現手段としては、本発明の実施例を模式的に描
いた第１図に示す構造が最も有効かつ安価である。第１
図は本発明の原理的説明図である。As a means for realizing this, the structure shown in FIG. 1 schematically illustrating the embodiment of the present invention is the most effective and inexpensive. First
The figure is a principle explanatory view of the present invention.
１は電子機器筐体で、図の左右方向について中央部に
上段吸気口５と下段吸気口４とが設けられている。この
ため、電子機器筐体１内に機器収納用の空間は図面参照
番号２で示した部分と図面参照番号３で示した部分とに
区分されている。Reference numeral 1 denotes an electronic device housing, which is provided with an upper intake port 5 and a lower intake port 4 in the center in the left-right direction of the drawing. For this reason, the space for housing the device in the electronic device housing 1 is divided into a portion indicated by reference numeral 2 and a portion indicated by reference numeral 3.
上記２の部分には高発熱素子を収納し、３の部分には
低発熱素子を収納する。下段吸気口４から吸入された冷
却風は低発熱素子実装部３内を上昇して排気10される。A high heat generating element is accommodated in the portion 2 and a low heat generating element is accommodated in the portion 3. The cooling air sucked from the lower intake port 4 rises inside the low heat-generating element mounting portion 3 and is exhausted 10.
一方、上段吸気口５から吸入された冷却風は高発熱素
子実装部２内を上昇して排気９される。On the other hand, the cooling air sucked from the upper intake port 5 rises in the high heat generating element mounting portion 2 and is exhausted 9.
この場合、下段吸気流の風量に比して上段吸気流８の
風量を数倍に大きく設定しておくことが望ましい。In this case, it is desirable to set the air volume of the upper stage intake flow 8 to be several times larger than the air volume of the lower stage intake flow.
前記の構成（第１図）によれば、下段吸気流７は床面
に近い空気を吸入するので塵埃を吸いこむ虞れが比較的
多いが、低発熱素子の冷却用に使われるので塵埃の影響
に対して敏感でないから、実用上の障害を招かない。こ
の冷却通風は、低い所から吸入し、冷却によつて暖めら
れた空気が上方に抜けるので、自然対流に抗わないとい
う意味で合理的である。According to the above-mentioned configuration (Fig. 1), since the lower intake air flow 7 draws in air close to the floor surface, there is a relatively high possibility of inhaling dust, but since it is used for cooling the low heat-generating element, Since it is not sensitive to the effects, it does not cause any practical problems. This cooling draft is rational in that it does not resist natural convection, because the air that is sucked in from a low place and warmed by cooling escapes upward.
塵埃の影響に敏感な高発熱高密度素子の冷却は、上段
吸気流が充当されるので、塵埃の含有が少ない空気が吸
入される。この通風径路は、矢印Ａの如く吸入された
後、矢印Ｂの如く下降し、矢印Ｃの如く方向を変えて矢
印Ｄの如く上昇流となる。このように、自然対流に抗ら
う形の流路をとるという意味では好ましくない面もある
ので、この上段吸気流８は、塵埃に敏感な高発熱素子の
冷却のみに充当するものである。Since the upper intake air flow is applied to the cooling of the high-heat-generation high-density element that is sensitive to the influence of dust, the air containing a small amount of dust is sucked. This ventilation path is sucked in as indicated by arrow A, then descends as indicated by arrow B, changes its direction as indicated by arrow C, and becomes an upward flow as indicated by arrow D. As described above, there is also a surface unfavorable in the sense of taking a flow path that resists natural convection, so the upper intake air flow 8 is used only for cooling the high heat-generating element that is sensitive to dust.
第６図は本発明に係る通風構造を適用した電子計算機
の１例を示す。電子計算機筐体19は、左右に大きく分類
される。図の右半分は中央処理装置（CPU）の部分であ
りECL素子を多用した基板24が複数枚実装される。これ
らの基板は約400W（ワツト）発熱する為に基板１枚当た
り約2m3/分の冷却風を要する。従つて最大静圧で400mmH
2Oクラスのブロワフアン23により送風する必要がある。
次に左半分に入出力系の基板25,28が実装される。これ
らの基板は速度の一段遅いTTL素子が基本となる為に発
熱量はCPU基板に比して1/5から1/10であり、従つて一般
のプロペラフアン26,27（最大静圧で６〜10mmH2O）で充
分冷却可能である。これら左右の基板への冷却風はそれ
ぞれ吸気口20,21から吸気される。これら下段吸気口20
と上段吸気口21とは仕切板22によつて区分されている。FIG. 6 shows an example of an electronic computer to which the ventilation structure according to the present invention is applied. The computer housing 19 is roughly classified into left and right. The right half of the figure is a central processing unit (CPU) part, and a plurality of boards 24 that heavily use ECL elements are mounted. Since these substrates generate heat of about 400 W (Watt), cooling air of about 2 m 3 / min is required for each substrate. Therefore, the maximum static pressure is 400 mmH.
It is necessary to blow air by Blois Juan 23 of 2 O class.
Next, the I / O boards 25 and 28 are mounted on the left half. Since these boards are based on TTL elements, which are one step slower in speed, the heat generation is 1/5 to 1/10 that of CPU boards. Therefore, general propeller fan 26, 27 (6 at maximum static pressure) ~ 10mmH 2 O) can be sufficiently cooled. The cooling air to the left and right substrates is sucked from the suction ports 20 and 21, respectively. These lower intake 20
The upper intake port 21 and the upper intake port 21 are separated by a partition plate 22.
上段吸気口21からの吸入空気流はCPUを構成している
高発熱高密度の基板24を冷却する。The intake airflow from the upper intake port 21 cools the substrate 24 having high heat generation and high density, which constitutes the CPU.
一方、下段吸気口20からの吸入空気流は低発熱量の基
板25,28を冷却する。On the other hand, the intake air flow from the lower intake port 20 cools the substrates 25 and 28 having a low heat generation amount.
本発明の冷却通風構造によれば、一つの筐体内に収納
されている高発熱量電子機器グループ、及び、低発熱量
電子機器グループのそれぞれに対して合理的に通風，冷
却することが出来、特に、塵埃の影響に敏感な高発熱量
高密度電子機器にたいして塵埃の含有の少ない清浄な空
気を流通せしめることが出来る。According to the cooling ventilation structure of the present invention, it is possible to rationally ventilate and cool each of the high heat value electronic device group and the low heat value electronic device group housed in one housing, In particular, it is possible to circulate clean air with a small amount of dust to a high-heat-density high-density electronic device that is sensitive to the influence of dust.
第１図は本発明の原理を説明するための模式図である。
第２図は室内に浮遊する塵埃の説明図である。第３図は
従来例の電子機器筐体の説明図である。第４図は電子機
器の冷却に必要な通風量を示す図表である。第５図は従
来技術の説明図である。第６図は本発明の１実施例の概
要的な斜視図である。 １……電子機器筐体、２……高発熱素子実装部、３……
低発熱素子実装部、４……下段吸気口、５……上段吸気
口、６……支切板。FIG. 1 is a schematic diagram for explaining the principle of the present invention.
FIG. 2 is an illustration of dust floating in the room. FIG. 3 is an explanatory diagram of a conventional electronic device housing. FIG. 4 is a table showing the ventilation amount necessary for cooling the electronic device. FIG. 5 is an explanatory diagram of a conventional technique. FIG. 6 is a schematic perspective view of an embodiment of the present invention. 1 ... Electronic device housing, 2 ... High heat element mounting part, 3 ...
Low heat-generating element mounting part, 4 ... Lower intake port, 5 ... Upper intake port, 6 ... Partition plate.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 坂田 昌行 茨城県日立市大みか町５丁目２番１号 日立プロセスコンピユータエンジニアリ ング株式会社内 (72)発明者 井手 寿之 茨城県日立市大みか町５丁目２番１号 株式会社日立製作所大みか工場内 (56)参考文献 実開 昭60−48288（ＪＰ，Ｕ) 実公 昭63−45764（ＪＰ，Ｙ２) ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Masayuki Sakata 52-1 Omika-cho, Hitachi-shi, Ibaraki Hitachi Process Computer Engineering Co., Ltd. (72) Toshiyuki Ide 5-chome Omika-cho, Hitachi-shi, Ibaraki 2-1 No. 1 in the Omika Plant of Hitachi, Ltd. (56) References: Actual Opening Sho 60-48288 (JP, U) Actual Opening Sho 63-45764 (JP, Y2)
Claims (1)
しめる為の構造において、 （ａ）該筐体の側面の中央部に互いに高さを異にする少
なくとも２個の吸気口を上下方向に配設し、 （ｂ）上記２個の吸気口に流通する２系統の冷却風流通
経路を構成し、 （ｃ）上記２系統の冷却風流通経路のうち、低い位置に
設けられた吸気口に連通する冷却風流通経路は、前記筐
体内に収納されている第１の電子機器グループを経由し
て排気口に連通し、 （ｄ）前記２系統の冷却風流通経路のうち、高い位置に
設けられた吸気口に連通する冷却風流通経路は、前記筐
体内に収納されかつ前記第１の電子機器グループより発
熱量の大きい第２の電子機器グループを経由して排気口
に連通し、 （ｅ）前記２系統の冷却風流通経路が筐体内で分離され
たことを特徴とする電子機器を収納した筐体の冷却通風
構造。1. A structure for circulating cooling air in a housing accommodating an electronic device, comprising: (a) at least two intake ports having different heights at the center of a side surface of the housing. Direction, and (b) forms two cooling air flow passages flowing through the two intake ports, and (c) intake air provided at a lower position in the two cooling air flow passages. The cooling air flow path communicating with the mouth communicates with the exhaust port via the first electronic device group housed in the housing, and (d) the higher position of the cooling air flow paths of the two systems. A cooling air flow path communicating with the intake port provided in the communication port is communicated with the exhaust port via a second electronic device group housed in the housing and having a larger heat generation amount than the first electronic device group, (E) The cooling air flow paths of the two systems are separated in the housing Cooling ventilation structure of a housing accommodating an electronic apparatus characterized.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62295974A JP2530670B2 (en) | 1987-11-26 | 1987-11-26 | Cooling ventilation structure for the housing that houses electronic devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62295974A JP2530670B2 (en) | 1987-11-26 | 1987-11-26 | Cooling ventilation structure for the housing that houses electronic devices |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01138796A JPH01138796A (en) | 1989-05-31 |
| JP2530670B2 true JP2530670B2 (en) | 1996-09-04 |
Family
ID=17827502
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62295974A Expired - Lifetime JP2530670B2 (en) | 1987-11-26 | 1987-11-26 | Cooling ventilation structure for the housing that houses electronic devices |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2530670B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2578950Y2 (en) * | 1992-10-20 | 1998-08-20 | 株式会社ピーエフユー | Electronic equipment cooling structure |
-
1987
- 1987-11-26 JP JP62295974A patent/JP2530670B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01138796A (en) | 1989-05-31 |
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