JP2520685B2 - Electrolytic treatment equipment - Google Patents
Electrolytic treatment equipmentInfo
- Publication number
- JP2520685B2 JP2520685B2 JP63054783A JP5478388A JP2520685B2 JP 2520685 B2 JP2520685 B2 JP 2520685B2 JP 63054783 A JP63054783 A JP 63054783A JP 5478388 A JP5478388 A JP 5478388A JP 2520685 B2 JP2520685 B2 JP 2520685B2
- Authority
- JP
- Japan
- Prior art keywords
- current density
- metal web
- electrolytic
- electrode
- electrolytic treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
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- Electroplating Methods And Accessories (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、交番波形電流を用いて連続的に金属ウエブ
に電解エッチング処理を行う電解槽に関するもので、特
に平版印刷版支持体の電解槽に関するものである。Description: TECHNICAL FIELD The present invention relates to an electrolytic cell in which a metal web is continuously subjected to an electrolytic etching treatment using an alternating waveform current, and particularly to an electrolytic cell for a lithographic printing plate support. It is about.
アルミニウム、鉄などの表面に電解エッチングする方
法は広く実用化されており、要求される品質や反応効率
の向上の目的から交番波形電流を用いることは一般的に
行われている。たとえば特公昭56-19280号公報ではアル
ミ板の電解粗面化処理に於いて陽極時電圧が陰極時電圧
より大なるよう印加した交番波形電圧を用いることによ
りオフセット印刷版支持体として優れた粗面化処理が可
能になるという記載がある。通常電解エッチング処理は
１〜５％の硝酸あるいは塩酸等酸性電解浴中で電流密度
10A/dm2〜100A/m2で行われる。交番波形電流を用いる時
たとえば金属ウエブとしてアルミニウム板を用いた時、
陽極周期時はAl→Al3+＋3eの溶解反応が生じ又陰極の周
期時は とAl3+＋3OH→Al(OH)3の水素ガス発生反応と同時に水酸
化アルミのスマット生成反応がアルミ板上で生じる。こ
れらの反応は電源の周波数に応じて交互に起る。これら
の基本反応を浴の種類、濃度、温度条件および電流密
度、投入電気量等の電気条件を制御することにより要求
される粗面化表面を得ることが一般的に可能である。The method of electrolytically etching the surface of aluminum, iron or the like has been widely put into practical use, and an alternating waveform current is generally used for the purpose of improving required quality and reaction efficiency. For example, in Japanese Patent Publication No. 56-19280, by using an alternating waveform voltage applied so that the voltage at the anode is larger than the voltage at the cathode in the electrolytic surface roughening treatment of an aluminum plate, an excellent rough surface as an offset printing plate support is obtained. There is a description that the chemical processing can be performed. Usually, the electrolytic etching treatment is carried out at a current density of 1-5% in an acidic electrolytic bath such as nitric acid or hydrochloric acid.
It is performed at 10 A / dm 2 to 100 A / m 2 . When using an alternating waveform current, for example when using an aluminum plate as a metal web,
During the anode cycle, the dissolution reaction of Al → Al 3+ ＋ 3e occurs, and during the cathode cycle, And Al 3+ + 3OH → Al (OH) 3 hydrogen gas generation reaction and aluminum hydroxide smut formation reaction occur on the aluminum plate. These reactions occur alternately depending on the frequency of the power supply. It is generally possible to obtain the required roughened surface by controlling these basic reactions by controlling the type of bath, concentration, temperature conditions and electric conditions such as current density and amount of electricity input.
しかし、交番波形電流を用いる時には、必ず金属ウエ
ブが電解槽に入った時、出た時の電流周期により、溶解
反応により処理が開始する部分と、終了する部分との相
違がある。これらの相違は当然のことながら電源の周波
数に応じて発生する。たとえば、処理スピード50m/min,
電源周波数が60Hzとした場合に、金属ウエブの長手方向
で、1.39cmピッチでその相違が発生する。また、より高
い量産化の観点からは、高い処理スピード，高電流密度
処理が望まれ、また、近年増加しているマンガンなどを
含有した高強度アルミニウム支持体では、周波数を低下
させることで高品質の平版印刷版支持体を製造するとい
う傾向もある。しかしながら、前述の電源周波数に応じ
た不均一性は、いずれも発生のメカニズムからして、電
流密度が高くなるほど又処理スピードが高いほど、周波
数が低くなるほど程度が強くなることは当然である。特
開昭60-67700号公報では、本出願人により金属ウエブの
入口部分すなわち電極の先端部に低電流密度処理を行う
ソフトスタートゾーンを設けたことを特徴とする電解処
理装置を開示している。However, when an alternating waveform current is used, there is a difference between the portion where the treatment starts due to the dissolution reaction and the portion where the treatment ends due to the current cycle when the metal web enters and leaves the electrolytic cell. These differences naturally occur according to the frequency of the power supply. For example, processing speed 50m / min,
When the power supply frequency is 60 Hz, the difference occurs at a pitch of 1.39 cm in the longitudinal direction of the metal web. In addition, from the viewpoint of higher mass production, high processing speed and high current density processing are desired, and in the case of high-strength aluminum supports containing manganese, etc., which have been increasing in recent years, high quality can be achieved by lowering the frequency. There is also a tendency to produce the lithographic printing plate support. However, it is natural that the nonuniformity depending on the power supply frequency becomes stronger as the current density becomes higher, the processing speed becomes higher, and the frequency becomes lower due to the mechanism of occurrence. Japanese Patent Application Laid-Open No. 60-67700 discloses, by the applicant of the present invention, an electrolytic treatment apparatus characterized in that a soft start zone for performing a low current density treatment is provided at an inlet portion of a metal web, that is, a tip portion of an electrode. .
しかしながらこの方法は、前述の周波数に応じた不均
一性について金属ウエブの出口部分すなわち電極の後端
部で電流集中をおこし、完全になくすことは出来なかっ
た。However, this method cannot completely eliminate the above-mentioned non-uniformity depending on the frequency because current concentration occurs at the exit portion of the metal web, that is, the rear end portion of the electrode.
本発明の目的は従来の問題点を解消し、周波数に応じ
たエッチング面の不均一性をなくし、高い処理スピー
ド，高電流密度処理が可能な電解処理装置を提供するこ
とにある。An object of the present invention is to solve the conventional problems, to eliminate the nonuniformity of the etching surface depending on the frequency, and to provide an electrolytic processing apparatus capable of high processing speed and high current density processing.
本発明者らは、前述の周波数に応じた不均一性をなく
す為、鋭意検討した結果、本発明を見出したのである。
すなわち、本発明の上記目的は交番波形電流を用いて、
金属ウエブに連続的に電解エッチング処理を行う電解槽
において、ドラムローラ３に巻回して走行する金属ウエ
ブ１に対向して設置された電極５、６の先端の切り欠き
部14a,14cと電極５、６の後端の切り欠き部14b,14dで低
電流密度ゾーンを設け、残余の部分は一定電流密度ゾー
ンとしたことを特徴とする電解処理装置によって達成さ
れる。The present inventors have found the present invention as a result of extensive studies in order to eliminate the above-mentioned nonuniformity according to frequency.
That is, the above object of the present invention is to use an alternating waveform current,
In an electrolytic bath in which a metal web is continuously electrolytically etched, the notches 14a and 14c at the tips of the electrodes 5 and 6 and the electrode 5 installed to face the metal web 1 wound around the drum roller 3 and running. , 6 at the rear end of the notches 14b and 14d to provide a low current density zone, and the remaining portion is a constant current density zone.
又本発明は電極の先端、後端での低電流密度ゾーンが
金属ウエブと電極面との距離を漸次離すようにしたこと
によって容易に確実に実施し得る。Further, the present invention can be easily and surely implemented by setting the low current density zones at the front and rear ends of the electrode to gradually separate the distance between the metal web and the electrode surface.
本発明はそれぞれの電極の先端，後端で低電流密度ゾ
ーンを設けることによって、金属ウエブの出口部すなわ
ち電極の後端部での電流集中も避けられ、結果として処
理面の不均一性を目立たなくすることが出来る。従って
電極槽における高い処理速度，高電流密度処理を可能と
することが出来る。According to the present invention, by providing a low current density zone at the front end and the rear end of each electrode, current concentration at the exit of the metal web, that is, the rear end of the electrode is avoided, and as a result, the non-uniformity of the treated surface is noticeable. It can be lost. Therefore, it is possible to achieve high processing speed and high current density processing in the electrode tank.
本発明において低電流密度ゾーンとしては、電流密度
をかえる別の電極をおくとか色々な方法が行なえるが、
先端と後端の電極面と金属ウエブとの距離を漸次離すよ
うにすることによって簡単容易に行うことが出来る。In the present invention, as the low current density zone, various methods such as placing another electrode for changing the current density can be performed,
This can be easily and easily performed by gradually separating the distance between the metal web and the electrode surfaces at the front and rear ends.
以下添付図面に従い、本発明の内容をさらに詳細に説
明する。Hereinafter, the content of the present invention will be described in more detail with reference to the accompanying drawings.
第１図は本発明の連続電解処理装置の１実施例を示す
模式的説明図である。第１図において１は金属ウエブで
あり、2,4は金属ウエブを通すパスローラであり、３は
金属ウエブと電極5,6の間隔を維持するドラムローラで
あり、通常その間隔は５〜50mmである。７はコンタクト
給電ローラであり、金属ウエブ１に接触し、金属ウエブ
１と同速で回転駆動される。また電極5,6は夫々の電極
の先端、後端で低電流密度ゾーンを設ける為、金属ウエ
ブ１と電極面との距離を漸次離す切り欠き部14a14bと14
c,14dをそれぞれ設けている。FIG. 1 is a schematic explanatory view showing one embodiment of the continuous electrolytic treatment apparatus of the present invention. In FIG. 1, 1 is a metal web, 2 and 4 are pass rollers that pass the metal web, 3 is a drum roller that maintains the distance between the metal web and the electrodes 5 and 6, and the distance is usually 5 to 50 mm. is there. Reference numeral 7 denotes a contact power supply roller, which comes into contact with the metal web 1 and is rotationally driven at the same speed as the metal web 1. Further, since the electrodes 5 and 6 are provided with low current density zones at the front and rear ends of the respective electrodes, the notches 14a14b and 14a and 14b which gradually separate the distance between the metal web 1 and the electrode surface.
c and 14d are provided respectively.
又電解液８はドラムローラ３の真下に配設した電解液
給液部９より供給されセル内を満たし、電解液排出部10
a,10bよりセル外に排出され循環タンク11を経てポンプ1
2等により強制循環される。又13は交番波形電源であり
電源出力端子の一方はコンタクト給電ローラ７に、他方
は電極5,6に接続され電圧印加される。このようにして
金属ウエブ１に連続的に電解エッチング処理を施すこと
が出来る。Further, the electrolytic solution 8 is supplied from an electrolytic solution supply section 9 arranged directly below the drum roller 3 to fill the inside of the cell, and an electrolytic solution discharge section 10
Pumps 1 and 10b are discharged to the outside of the cell and then passed through the circulation tank 11 to the pump 1
Forced circulation by 2nd grade. Reference numeral 13 is an alternating waveform power source, one of which is connected to the contact feeding roller 7 and the other of which is connected to the electrodes 5 and 6 to apply a voltage. In this way, the metal web 1 can be continuously subjected to electrolytic etching treatment.
又、13は、交番波形電源である。 Moreover, 13 is an alternating waveform power supply.
第１図に示す装置を用い、下記条件により処理ムラ発
生の比較を行なった。Using the apparatus shown in FIG. 1, the occurrence of processing unevenness was compared under the following conditions.
アルミ巾 :1000mm 処理スピード : 50m/min 電源周波数 : 20Hz 電流密度 : 50A/dm2 アルミ板アノード電気量:300C/dm2 以上結果より電極の先端・後端部に低電流密度ゾーン
を設け、その間に一定電流密度の処理を行なうことによ
り、均一なアルミ表面の電解エッチングが可能となるこ
とが判明した。Aluminum width: 1000 mm Processing speed: 50 m / min Power supply frequency: 20 Hz Current density: 50 A / dm 2 Aluminum plate anode Electricity: 300 C / dm 2 From the above results, it was found that by providing a low current density zone at the front and rear ends of the electrode and performing a constant current density treatment therebetween, it is possible to perform uniform electrolytic etching of the aluminum surface.
本発明の交番波形電流を用いて金属ウエブに連続的に
電解エッチング処理を行う電解槽において、それぞれの
電極の先端、後端で低電流密度ゾーンを設け残余の部分
は一定電流密度ゾーンとしたことを特徴とする電解処理
装置により、周波数に応じた不均一な処理ムラがなくな
り、高い処理スピード，高電流密度処理が可能となる品
質の向上及び生産性の向上に大いに貢献した。In the electrolytic cell for continuously electrolytically etching a metal web using the alternating waveform current of the present invention, a low current density zone is provided at the front and rear ends of each electrode, and the remaining portion is a constant current density zone. The non-uniform treatment unevenness depending on the frequency was eliminated by the electrolytic treatment device characterized by, and it greatly contributed to the improvement of the quality and the productivity that enable the high treatment speed and the high current density treatment.
又本発明の実施を電極の先端、後端での低電流密度ゾ
ーンが金属ウエブと電極面との距離を漸次離すようにす
ることによって容易に実施し上記の効果をあげることが
出来た。Further, the present invention was easily carried out by setting the low current density zones at the front and rear ends of the electrode so that the distance between the metal web and the electrode surface was gradually increased, and the above effects could be obtained.
第１図は本発明の電解処理装置の１実施例の模式的説明
図である。 １……金属ウエブ 2,4……パスローラ ３……ドラムローラ 5,6……電極 ７……コンタクト給電ローラ ８……電解液、９……電解液給液部 10a,10b……電解液排出部 11……循環タンク 12……ポンプ 13……交番波形電源 14a,14b……電極５の先端と後端の切り欠き部 14c,14d……電極６の先端と後端の切り欠き部FIG. 1 is a schematic explanatory view of one embodiment of the electrolytic treatment apparatus of the present invention. 1 …… Metal web 2,4 …… Pass roller 3 …… Drum roller 5,6 …… Electrode 7 …… Contact feeding roller 8 …… Electrolyte solution, 9 …… Electrolyte solution supply section 10a, 10b …… Electrolyte discharge Part 11 ...... Circulation tank 12 ...... Pump 13 ...... Alternating waveform power supply 14a, 14b ...... Notch part at the tip and rear end of electrode 5 14c, 14d ...... Notch part at the tip and rear end of electrode 6
Claims (2)
的に電界エッチング処理を行う電解処理装置において、
ドラムローラ３に巻回して走行する金属ウエブ１に対向
して設置された電極５、６の先端の切り欠き部14a,14c
と電極５、６の後端の切り欠き部14b,14dで低電流密度
ゾーンを設け、残余の部分は一定電流密度ゾーンとした
ことを特徴とする電解処理装置。1. An electrolytic treatment apparatus for continuously performing an electric field etching treatment on a metal web 1 using an alternating waveform current,
Notch parts 14a, 14c at the tips of the electrodes 5, 6 installed facing the metal web 1 wound around the drum roller 3 and running.
A low current density zone is provided in the notches 14b and 14d at the rear ends of the electrodes 5 and 6, and a constant current density zone is provided in the remaining portion.
を、金属ウエブと電解極面との距離を漸次離すように設
けたことを特徴とする請求項１に記載の電解処理装置。2. The electrolytic treatment apparatus according to claim 1, wherein the low current density zones at the front and rear ends of the electrode are provided so that the distance between the metal web and the electrolytic electrode surface is gradually increased.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63054783A JP2520685B2 (en) | 1988-03-10 | 1988-03-10 | Electrolytic treatment equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63054783A JP2520685B2 (en) | 1988-03-10 | 1988-03-10 | Electrolytic treatment equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01230800A JPH01230800A (en) | 1989-09-14 |
| JP2520685B2 true JP2520685B2 (en) | 1996-07-31 |
Family
ID=12980363
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63054783A Expired - Lifetime JP2520685B2 (en) | 1988-03-10 | 1988-03-10 | Electrolytic treatment equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2520685B2 (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5066370A (en) * | 1990-09-07 | 1991-11-19 | International Business Machines Corporation | Apparatus, electrochemical process, and electrolyte for microfinishing stainless steel print bands |
| JP2004035985A (en) * | 2002-07-08 | 2004-02-05 | Kawasaki Heavy Ind Ltd | Apparatus for plating surface of metallic foil |
| JP4410714B2 (en) | 2004-08-13 | 2010-02-03 | 富士フイルム株式会社 | Method for producing support for lithographic printing plate |
| DE602006001142D1 (en) | 2005-04-13 | 2008-06-26 | Fujifilm Corp | Method for producing a planographic printing plate support |
| JP2008246971A (en) * | 2007-03-30 | 2008-10-16 | Fujifilm Corp | Electrolytic processing apparatus, lithographic printing plate support, lithographic printing original plate, and electrolytic processing method |
| JP2009208140A (en) | 2008-03-06 | 2009-09-17 | Fujifilm Corp | Manufacturing method of aluminum alloy sheet for planographic printing plate, aluminum alloy sheet for planographic printing plate and support for planographic printing plate manufactured by the method |
| EP2343402B1 (en) | 2008-09-30 | 2017-08-02 | FUJIFILM Corporation | Electrolytic treatment method and electrolytic treatment device |
| KR20120101290A (en) | 2009-06-26 | 2012-09-13 | 후지필름 가부시키가이샤 | Light reflecting substrate and process for manufacture thereof |
| WO2011037005A1 (en) | 2009-09-24 | 2011-03-31 | 富士フイルム株式会社 | Lithographic printing original plate |
| JP2012033853A (en) | 2010-04-28 | 2012-02-16 | Fujifilm Corp | Insulation light reflection substrate |
| CN110678257A (en) | 2017-06-21 | 2020-01-10 | 富士胶片株式会社 | Aluminum composite material |
-
1988
- 1988-03-10 JP JP63054783A patent/JP2520685B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01230800A (en) | 1989-09-14 |
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