JP2520596Y2 - Electronic component mounting device - Google Patents
Electronic component mounting deviceInfo
- Publication number
- JP2520596Y2 JP2520596Y2 JP10455790U JP10455790U JP2520596Y2 JP 2520596 Y2 JP2520596 Y2 JP 2520596Y2 JP 10455790 U JP10455790 U JP 10455790U JP 10455790 U JP10455790 U JP 10455790U JP 2520596 Y2 JP2520596 Y2 JP 2520596Y2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- nozzle
- tapered
- component mounting
- camera
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Length Measuring Devices By Optical Means (AREA)
- Automatic Assembly (AREA)
- Image Input (AREA)
Description
【考案の詳細な説明】 〔産業上の利用分野〕 本考案はプリント基板を自動製造するためプリント基
板に搭載される薄膜コンデンサなどの電子部品（チップ
部品）を自動装着するための電子部品装着装置に関する
ものであり，特に，電子部品を吸着する電子部品装着装
置のノズルの形状に関する。[Detailed Description of the Invention] [Industrial field of application] The present invention is an electronic component mounting apparatus for automatically mounting electronic components (chip components) such as thin film capacitors mounted on a printed circuit board in order to automatically manufacture the printed circuit board. In particular, the present invention relates to the shape of a nozzle of an electronic component mounting device that adsorbs an electronic component.
電子部品装着装置は電子部品装着位置で薄膜コンデン
サ，トランジスタなどの微小電子部品をノズルで真空吸
着し，プリント基板の所定の位置まで運び，電子部品の
吸着状態を解いて半田づけなどが行われる位置に置く。
プリント基板の所定位置に装着される電子部品はその端
子部を半田づけするためには正しい方向で配設しなけれ
ばならない。そのため，電子部品装着装置のノズルに吸
着された電子部品はプリント基板に装着される前にカメ
ラで吸着姿勢状態を撮影され，所定の方向を向くように
姿勢制御される。The electronic component mounting device vacuum-adsorbs minute electronic components such as thin film capacitors and transistors at the electronic component mounting position with a nozzle, carries them to a predetermined position on the printed circuit board, and releases soldered state of the electronic components to perform soldering, etc. Put on.
Electronic components mounted at predetermined positions on the printed circuit board must be arranged in the correct direction in order to solder the terminals. Therefore, the electronic component sucked by the nozzle of the electronic component mounting device is photographed in a suction posture state by the camera before being mounted on the printed circuit board, and the posture is controlled so as to face a predetermined direction.
第５図に，電子部品の姿勢制御を行うため，電子部品
の装着状態を撮影するカメラとこのカメラの上部に位置
決めされた電子部品装着装置のノズル近傍の構成を示
す。下部にカメラ１が配設されており，その上部に電子
部品装着装置のノズル３が位置決めされている。ノズル
３はノズル先端31と反射板32からなる。ノズル３の上部
には内部に真空引用の管路が形成された回転装着機構５
が設けられている。種々の電子部品を安定に吸着させ，
所定の真空引きが達成されるようにノズル３の先端は所
定の大きさの口径に設計されなければならない。また，
電子部品の安定な吸着という観点からノズル先端31の最
先端部311は平坦な円形状になっている。ノズル先端31
にはノズル最先端部311を介して電子部品２が真空吸着
されている。FIG. 5 shows a configuration of a camera for photographing the mounting state of the electronic component and the vicinity of the nozzle of the electronic component mounting device positioned above the camera for controlling the attitude of the electronic component. A camera 1 is arranged in the lower part, and a nozzle 3 of an electronic component mounting device is positioned in the upper part thereof. The nozzle 3 includes a nozzle tip 31 and a reflecting plate 32. A rotary mounting mechanism 5 in which a vacuum reference pipe is formed inside the nozzle 3.
Is provided. Stable adsorption of various electronic parts,
The tip of the nozzle 3 must be designed to have a predetermined diameter so that a predetermined vacuum can be achieved. Also,
From the viewpoint of stable adsorption of electronic components, the tip 311 of the nozzle tip 31 has a flat circular shape. Nozzle tip 31
The electronic component 2 is vacuum-sucked through the nozzle tip 311.
電子部品２の下方に配設されたカメラ１側から上方の
電子部品２および反射板32に向けて照明光線Ｌが当てら
れている。反射板32はノズル先端31に吸着された電子部
品２の吸着状態がカメラ１によって良好に撮影できるよ
うに，光線を乱反射させる白い樹脂で製造されている。An illuminating light beam L is applied from the side of the camera 1 disposed below the electronic component 2 toward the electronic component 2 and the reflection plate 32 above. The reflecting plate 32 is made of white resin that diffusely reflects light rays so that the electronic component 2 attracted to the nozzle tip 31 can be photographed favorably by the camera 1.
第６図および第７図にカメラ１で撮影した電子部品２
の吸着状態の画像を示す。これらの図面において，中央
の斜線の長方形は電子部品２の画像を示し，その外側の
中央の白い部分は反射板32の画像を示し，外縁は反射板
32の外側を示す。第６図は，電子部品２の横幅がノズル
最先端部311の直径より大きいため，ノズル最先端部311
がカメラ１で撮影されていない状態を示す。また第７図
は，ノズル最先端部311の直径が電子部品２の横幅より
大きいため，電子部品２の他にノズル最先端部311の円
形の一部が撮影されている状態を示す。The electronic component 2 photographed by the camera 1 is shown in FIGS. 6 and 7.
The image of the adsorption state of is shown. In these drawings, the shaded rectangle in the center indicates the image of the electronic component 2, the central white portion outside thereof indicates the image of the reflector 32, and the outer edge indicates the reflector.
Shows 32 outside. FIG. 6 shows that the width of the electronic component 2 is larger than the diameter of the tip 311 of the nozzle.
Indicates that the camera 1 has not captured the image. Further, FIG. 7 shows a state in which, in addition to the electronic component 2, the circular part of the nozzle distal end portion 311 is photographed because the diameter of the nozzle distal end portion 311 is larger than the lateral width of the electronic component 2.
第６図に示した状態は電子部品２のみが中央に撮影さ
れているから，やや斜めに吸着されている電子部品２の
吸着姿勢状態が画像処理によって正確に認識できる。In the state shown in FIG. 6, since only the electronic component 2 is photographed in the center, the suction posture state of the electronic component 2 which is slightly obliquely sucked can be accurately recognized by image processing.
しかしながら，第７図の撮影状態は電子部品２の他に
ノズル最先端部311の一部も撮影されており，このノズ
ル最先端部311の映像を排除しないと電子部品２の吸着
姿勢状態を正確に認識することができない。ノズル先端
31には種々の電子部品，そして種々の形態で吸着され
る。たとえば，第７図破線で示したように非常に偏った
状態で吸着されることもある。またノズル３は種々の大
きさ，形状の電子部品を吸着するから，ノズル最先端部
311の映像を排除するには電子部品の形状，吸着状態に
応じて排除処理を行わなければならず，その排除処理は
容易ではない。However, in the shooting state of FIG. 7, not only the electronic component 2 but also a part of the nozzle tip portion 311 is shot, and the suction posture state of the electronic component 2 is accurate unless the image of the nozzle tip portion 311 is excluded. Can't recognize to. Nozzle tip
Various electronic components and various forms are adsorbed on 31. For example, it may be adsorbed in a very biased state as shown by the broken line in FIG. Moreover, since the nozzle 3 adsorbs electronic components of various sizes and shapes, the tip of the nozzle 3
In order to eliminate the 311 image, the elimination process must be performed according to the shape and suction state of the electronic component, and the elimination process is not easy.
電子部品の一層の微小化にともない，第７図に示した
ようなノズル最先端部311が撮影される場合が増加して
いる。Along with the further miniaturization of electronic components, the number of cases where the nozzle tip portion 311 as shown in FIG. 7 is photographed is increasing.
したがって，本考案は，種々の電子部品を安定に吸着
可能な構造であるとともに，ノズルが電子部品の吸着状
態の撮影に影響を及ぼさない構造の電子部品装着装置の
ノズルを提供することを目的とする。Therefore, an object of the present invention is to provide a nozzle of an electronic component mounting apparatus having a structure capable of stably adsorbing various electronic components and having a structure in which the nozzle does not affect the photographing of the adsorption state of the electronic components. To do.
上記問題を解決するため，本考案は，そのノズルに吸
着された電子部品を指向する照明光を該電子部品に投射
し，電子部品と対向する位置に配設された撮像手段でそ
の反射光を撮影し該電子部品の吸着状態の姿勢制御を行
う電子部品装着装置において，電子部品吸着用ノズルを
先細りテーパー形状にし，かつ，その該表面を鏡面仕上
げにする。In order to solve the above problems, the present invention projects illumination light directed to an electronic component, which is adsorbed by the nozzle, onto the electronic component, and the reflected light is reflected by an imaging means arranged at a position facing the electronic component. In an electronic component mounting apparatus that performs image capturing and controls the attitude of the electronic component in a suction state, the electronic component suction nozzle is tapered and has a mirror-finished surface.
好適には，ノズルの先端部の外径の大きさをそこに吸
着される電子部品の大きさより小さくする。Preferably, the size of the outer diameter of the tip portion of the nozzle is made smaller than the size of the electronic component sucked therein.
さらに好適には，該ノズル先端部に対向するテーパー
端部に乱反射手段を設ける。More preferably, irregular reflection means is provided at the taper end portion facing the nozzle tip end portion.
電子部品がノズル部に吸着された状態で照明が電子部
品に当てられたとき，ノズルのテーパー部分に投射され
た照明光は鏡面仕上げされたテーパ面からカメラなど撮
像手段とは異なる方向に反射される。すなわち，電子部
品からの反射光を除いて照明光の反射光が撮像手段に入
射されない。その結果として，吸着された電子部品のみ
撮影され，ノズルなどが映像としては撮影されない。When the electronic component is attracted to the nozzle and the illumination is applied to the electronic component, the illumination light projected on the tapered portion of the nozzle is reflected from the mirror-finished tapered surface in a direction different from that of the imaging means such as a camera. It That is, the reflected light of the illumination light is not incident on the image pickup means except the reflected light from the electronic component. As a result, only the sucked electronic components are photographed, and the nozzles are not photographed as an image.
ノズル先端の外径を電子部品の大きさより小さくする
ことにより，ノズル先端は常に撮影されない。By making the outer diameter of the nozzle tip smaller than the size of electronic parts, the nozzle tip is not always photographed.
乱反射手段を設けることにより，外部の光線の影響を
排除した電子部品の吸着状態が撮影できる。By providing the irregular reflection means, it is possible to photograph the adsorption state of the electronic component without the influence of external light rays.
第１図に本考案の電子部品装着装置のノズル部の１実
施例の部分断面図を示す。FIG. 1 shows a partial cross-sectional view of one embodiment of the nozzle portion of the electronic component mounting apparatus of the present invention.
電子部品装着装置の回転装着機構５の下部にノズル４
が設けられている。ノズル４の下部には第３図に示した
ようにカメラ（図示せず）が位置する。換言すれば，第
１図は電子部品２の吸着姿勢状態を撮影するカメラが位
置する上部にノズル４が位置決めされた状態を示してい
る。カメラで撮影した映像は図示しない画像信号処理装
置に送出されて姿勢制御に用いられる。The nozzle 4 is provided below the rotary mounting mechanism 5 of the electronic component mounting apparatus.
Is provided. A camera (not shown) is located below the nozzle 4 as shown in FIG. In other words, FIG. 1 shows a state in which the nozzle 4 is positioned above the camera where the camera for photographing the electronic component 2 in the suction posture is located. The image captured by the camera is sent to an image signal processing device (not shown) and used for attitude control.
ノズル４はテーパ部41および反射板42からなり，内部
に真空引内管43,44が穿孔されている。テーパ部41の太
さが細い部分は真空引内管も細い真空引内管43である
が，テーパー部の太さが太い部分は太い真空引内管44が
真空引内管43に続けられている。真空引内管44は回転装
着機構５内を貫通する真空引内管（図示せず）を介して
真空引き装置（図示せず）に接続されている。The nozzle 4 comprises a taper portion 41 and a reflection plate 42, and vacuum inner tubes 43, 44 are bored inside. The thin portion of the taper portion 41 is the thin vacuum suction inner tube 43 also in the thin vacuum suction inner tube, but the thick portion of the tapered portion is the thick vacuum suction inner tube 44 following the vacuum suction inner tube 43. There is. The vacuum evacuation inner tube 44 is connected to a vacuum evacuation device (not shown) via a vacuum evacuation inner tube (not shown) penetrating the rotary mounting mechanism 5.
テーパ部41は電子部品２が吸着されるテーパ細径部41
1と反射板42側のテーパ太径部412との間にテーパが形成
されている。このテーパ部41の材質は，たとえば，ステ
ンレススチールであり，テーパ部41の面は鏡面仕上げさ
れている。テーパ細径部411の外径の大きさは真空引内
管43の内径にステンレススチールの肉厚を加えた大きさ
である。真空引内管43の内径およびこの真空引内管43を
介して適用される真空引き装置からの真空圧は種々の電
子部品を真空吸着可能な吸着力を提供するようになって
いる。また，第５図に示したノズル最先端部311を用い
ずに電子部品２を正常に真空吸着可能なように，テーパ
細径部411の内径およびステンレススチールの肉厚が設
定されている。すなわち，テーパ細径部411の先端部は
電子部品２を正常に吸着可能な平坦面になっている。た
だし，このテーパ細径部411の外径は，第５図に示した
円形のノズル最先端部311の直径より小さく，かつ，吸
着する電子部品の大きさ，たとえば，横幅より小さくし
てある。The tapered portion 41 is a tapered small diameter portion 41 to which the electronic component 2 is adsorbed.
A taper is formed between 1 and the taper large-diameter portion 412 on the reflection plate 42 side. The material of the tapered portion 41 is, for example, stainless steel, and the surface of the tapered portion 41 is mirror-finished. The outer diameter of the tapered thin portion 411 is the inner diameter of the vacuum inner tube 43 plus the thickness of stainless steel. The inner diameter of the vacuum evacuation inner tube 43 and the vacuum pressure from the evacuation device applied through the vacuum evacuation inner tube 43 provide a suction force capable of vacuum suctioning various electronic components. Further, the inner diameter of the tapered small diameter portion 411 and the thickness of the stainless steel are set so that the electronic component 2 can be normally vacuum-adsorbed without using the nozzle tip portion 311 shown in FIG. That is, the tip portion of the tapered small diameter portion 411 is a flat surface that can normally adsorb the electronic component 2. However, the outer diameter of the tapered thin portion 411 is smaller than the diameter of the circular nozzle tip portion 311 shown in FIG. 5 and smaller than the size of the electronic component to be adsorbed, for example, the lateral width.
反射板42は白い樹脂などで形成され，下部からの照明
光線を乱反射する。The reflection plate 42 is formed of white resin or the like, and diffusely reflects the illumination light beam from the lower part.
第２図に下方（カメラ方向）から見た電子部品２の吸
着状態，テーパ細径部411,テーパ部41のテーパー面，反
射板42の平面図を示す。FIG. 2 shows a plan view of the suction state of the electronic component 2, the tapered small diameter portion 411, the tapered surface of the tapered portion 41, and the reflection plate 42 as viewed from below (camera direction).
第１図および第２図において，カメラ側からノズル４
に向けて撮影用照明光Ｌが投射される。この撮影用照明
光Ｌはテーパ細径部411に吸着されている電子部品２に
当たると下方に反射されてカメラに入射する。ここで，
テーパ細径部411の外径は電子部品２の横幅より小さい
から電子部品２が吸着されている状態ではテーパ細径部
411がカメラで撮影されることはない。テーパ部41の鏡
面仕上げされたテーパー面に投射された撮影用照明光Ｌ
は全て上方に反射する。したがって，カメラ方向にはテ
ーパー面からの反射光は入射されない。さらに，反射板
42に投射された撮影用照明光Ｌは乱反射される。その結
果，カメラで撮影された映像は常に第６図に示すものと
同様になる。本実施例においては，テーパ細径部411の
先端部の外径が電子部品の大きさより小さいこと，テー
パ部41が形成され，かつ，テーパー面が鏡面仕上げされ
ていることから，第７図に示したような映像になること
はない。すなわち，常に，テーパ部41,テーパ細径部411
などに無関係の電子部品２の吸着状態の映像が得られ
る。その結果，カメラに接続された画像処理，姿勢制御
装置における吸着状態認識および姿勢制御は容易かつ確
実になる。In FIGS. 1 and 2, the nozzle 4 is seen from the camera side.
Illumination light L for photographing is projected toward. When the photographing illumination light L hits the electronic component 2 attracted to the tapered small diameter portion 411, it is reflected downward and enters the camera. here,
Since the outer diameter of the taper thin portion 411 is smaller than the lateral width of the electronic component 2, the taper thin portion is in a state where the electronic component 2 is sucked.
The 411 is never photographed by the camera. Illumination light L for photographing projected on the mirror-finished taper surface of the taper portion 41.
All reflect upwards. Therefore, the reflected light from the tapered surface does not enter in the camera direction. Furthermore, a reflector
The photographing illumination light L projected on the 42 is diffusely reflected. As a result, the image taken by the camera is always the same as that shown in FIG. In this embodiment, since the outer diameter of the tip of the tapered small diameter portion 411 is smaller than the size of the electronic component, the tapered portion 41 is formed, and the tapered surface is mirror-finished, it is shown in FIG. The image will not be as shown. That is, the tapered portion 41 and the tapered thin portion 411 are always
An image of the suction state of the electronic component 2 irrelevant to the above can be obtained. As a result, the image processing connected to the camera, the suction state recognition and the posture control in the posture control device are easy and reliable.
本考案の実施に際しては以上に例示した実施例の他，
種々の変形形態をとることができる。In implementing the present invention, in addition to the above-exemplified embodiments,
Various modifications can be made.
たとえば，第３図に示したように，撮影においてテー
パ部の影響を排除可能な程度にテーパ部41′を充分大き
くとれば，第１図に示した反射板42を除去することがで
きる。この場合，カメラの映像には第４図に示すよう
に，カメラの視界との関係において吸着された電子部品
２のみを撮影することができる。第１図および第３図の
テーパ部41,テーパ部41′の材質は所定の強度があり，
鏡面仕上げされるものであれば上述したステンレススチ
ールに限らない。For example, as shown in FIG. 3, if the taper portion 41 'is made large enough to eliminate the influence of the taper portion in photographing, the reflector 42 shown in FIG. 1 can be removed. In this case, in the image of the camera, as shown in FIG. 4, only the electronic component 2 adsorbed in relation to the field of view of the camera can be photographed. The material of the taper portion 41 and the taper portion 41 'in FIGS. 1 and 3 has a predetermined strength,
It is not limited to the above-mentioned stainless steel as long as it is mirror-finished.
また，テーパ細径部411,411′の外径は真空吸着でき
る大きさであれば、電子部品の横幅の大きさよりも小さ
くてもよい。テーパ細径部411,411′の肉厚が充分小さ
いとそこの反射の影響も小さい。また，鏡面仕上げされ
ているテーパ部41,41′に投射された撮影用照明光Ｌは
全てカメラとは異なる方向に反射される。したがって，
テーパ部41,41′の撮影に対する影響は小さい。特に，
テーパ細径部411,411′の吸着面を乱反射面にしておけ
ば，撮影に対する影響のなさは一層向上する。Further, the outer diameter of the tapered thin portions 411, 411 'may be smaller than the lateral width of the electronic component as long as it can be vacuum-sucked. If the thickness of the tapered small diameter portions 411, 411 'is sufficiently small, the influence of reflection there is also small. Further, all the illumination light L for photographing projected on the mirror-finished tapered portions 41, 41 'is reflected in a direction different from that of the camera. Therefore,
The influence of the taper portions 41, 41 'on imaging is small. In particular,
If the suction surfaces of the tapered small diameter portions 411 and 411 'are diffuse reflection surfaces, the influence on the photographing is further improved.
以上の例は，電子部品装着装置における吸着を真空吸
着を用いた場合について例示したが，本考案は真空吸着
に限らず，磁気吸着などについても適用可能である。The above example illustrates the case where the vacuum suction is used in the electronic component mounting apparatus, but the present invention is not limited to the vacuum suction, and is also applicable to magnetic suction and the like.
さらに，以上の実施例は，電子部品２が吊り下げられ
る形態で吸着される場合について述べたが，本考案は撮
像手段および照明手段の配置が例示した場合と同様であ
れば，上下などの方向性には依存しない。Further, although the above embodiments have described the case where the electronic component 2 is adsorbed in a suspended form, the present invention is directed to the vertical and other directions as long as the arrangement of the image pickup means and the illumination means is the same as illustrated. It does not depend on sex.
以上述べたように，本考案に基づいて，好適には電子
部品のノズル吸着部の大きさを吸着される電子部品の大
きさより小さくし，ノズル吸着部の外面を鏡面仕上げの
テーパー面とすることにより，ノズル吸着部などの影響
を受けない電子部品の吸着状態を撮影することができ
る。その結果，電子部品の姿勢制御処理が迅速かつ正確
に行われる。As described above, according to the present invention, preferably, the size of the nozzle suction portion of the electronic component is made smaller than the size of the electronic component to be sucked, and the outer surface of the nozzle suction portion is a mirror-finished tapered surface. With this, it is possible to photograph the suction state of the electronic component that is not affected by the nozzle suction portion or the like. As a result, the attitude control process of the electronic component is performed quickly and accurately.
第１図は本考案の電子部品装着装置の１実施例としての
ノズル部の部分断面図， 第２図は第１図のノズル部の下部から見た部分平面図， 第３図は本考案の電子部品装着装置の他の実施例として
のノズル部の部分断面図， 第４図は第３図における電子部品の撮影図， 第５図は従来の電子部品装着装置のノズル部と部品装着
状態を撮影するカメラの配置図， 第６図および第７図は第５図における電子部品の撮影図
である。 （符号の説明） １……カメラ,2……電子部品,3……ノズル,31……ノズ
ル先端,32……反射板,311……ノズル最先端部,4……ノ
ズル,41……テーパ部,42……反射板,411……テーパ細径
部,412……テーパ太径部,43,44……真空引内管,5……回
転装着機構。FIG. 1 is a partial sectional view of a nozzle portion as an embodiment of the electronic component mounting apparatus of the present invention, FIG. 2 is a partial plan view of the nozzle portion of FIG. 1 seen from below, and FIG. FIG. 4 is a partial sectional view of a nozzle portion as another embodiment of the electronic component mounting apparatus, FIG. 4 is a photograph of the electronic component in FIG. 3, and FIG. The layout of the camera for shooting, FIGS. 6 and 7 are views of the electronic components in FIG. (Explanation of symbols) 1 …… Camera, 2 …… Electronic parts, 3 …… Nozzle, 31 …… Nozzle tip, 32 …… Reflector, 311 …… Nozzle tip part, 4 …… Nozzle, 41 …… Taper 42 ... Reflector, 411 ... Tapered small diameter part, 412 ... Tapered large diameter part, 43,44 ... Vacuum inner tube, 5 ... Rotary mounting mechanism.
Claims (3)
明光を該電子部品に投射し，電子部品と対向する位置に
配設された撮像手段でその反射光を撮影し該電子部品の
吸着状態の姿勢制御を行う電子部品装着装置において， 電子部品吸着用ノズルを先細りテーパー形状にし，か
つ，その該表面を鏡面仕上げにし，該電子部品からの反
射光を除いて該照明光の反射光が該撮像手段に入射され
ないようにしたことを特徴とする電子部品装着装置。1. An illumination light directed to an electronic component, which is adsorbed by a nozzle, is projected onto the electronic component, the reflected light is photographed by an image pickup means arranged at a position facing the electronic component, and the electronic component is adsorbed. In an electronic component mounting apparatus for controlling the attitude of a state, the electronic component suction nozzle is tapered and its surface is mirror-finished, and the reflected light of the illumination light is excluded except the reflected light from the electronic component. An electronic component mounting apparatus, characterized in that it is prevented from entering the imaging means.
る電子部品の大きさより小さいことを特徴とする請求項
１記載の電子部品装着装置。2. The electronic component mounting apparatus according to claim 1, wherein the outer diameter of the tip portion of the nozzle is smaller than the size of the electronic component sucked therein.
パー端部に乱反射手段を設けた請求項１または２記載の
電子部品装着装置。3. The electronic component mounting apparatus according to claim 1, wherein a diffused reflection means is provided at a tapered end portion of the nozzle facing the nozzle tip portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10455790U JP2520596Y2 (en) | 1990-10-05 | 1990-10-05 | Electronic component mounting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10455790U JP2520596Y2 (en) | 1990-10-05 | 1990-10-05 | Electronic component mounting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0463197U JPH0463197U (en) | 1992-05-29 |
| JP2520596Y2 true JP2520596Y2 (en) | 1996-12-18 |
Family
ID=31849884
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10455790U Expired - Lifetime JP2520596Y2 (en) | 1990-10-05 | 1990-10-05 | Electronic component mounting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2520596Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013031057A1 (en) * | 2011-08-29 | 2013-03-07 | パナソニック株式会社 | Component-mounting device, nozzle, and component-mounting-position correction method |
-
1990
- 1990-10-05 JP JP10455790U patent/JP2520596Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0463197U (en) | 1992-05-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4122187B2 (en) | Illumination device, recognition device including the same, and component mounting device | |
| JPH0824234B2 (en) | Electronic component suction device | |
| US20020176064A1 (en) | Board-stage for an aligner | |
| JPH02224951A (en) | Detecting device for holding position of electronic part | |
| JPH10145094A (en) | Parts mounting device | |
| JP2520596Y2 (en) | Electronic component mounting device | |
| JPH0918200A (en) | Leak detector for suction head | |
| JPH08139498A (en) | Electronic component mounting device | |
| JP3654206B2 (en) | Suction nozzle and electronic component mounting device for micro electronic components | |
| JP2752078B2 (en) | Visual recognition stage | |
| JP4117065B2 (en) | Electronic component recognition device | |
| JPH0718544Y2 (en) | Suction device for positioning system | |
| JPS6150002A (en) | Relative position detector | |
| JP3141482B2 (en) | Optical imaging device for component mounters | |
| JPH06246236A (en) | Parts feeder | |
| JP3242130B2 (en) | Electronic component holding method and electronic component mounting device | |
| JP2003124696A (en) | Component suction nozzle, component mounter, and method for recognizing component suction nozzle | |
| JPH04307314A (en) | Photographing apparatus of mounting pattern or electronic components in mounting machine | |
| JPH04179198A (en) | Suction head | |
| JP3328760B2 (en) | Chip image recognition device | |
| JP2001148600A (en) | Method for recognizing mark and aligner | |
| JP2003198195A (en) | Electronic component-packaging apparatus | |
| JP3674494B2 (en) | Electronic component suction nozzle and electronic component mounting apparatus | |
| JP3095083U (en) | Positioning device for square chip parts | |
| JP2006093248A (en) | Electronic part suction nozzle |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |