JP2507988B2 - Printed circuit board inspection equipment - Google Patents
Printed circuit board inspection equipmentInfo
- Publication number
- JP2507988B2 JP2507988B2 JP61023300A JP2330086A JP2507988B2 JP 2507988 B2 JP2507988 B2 JP 2507988B2 JP 61023300 A JP61023300 A JP 61023300A JP 2330086 A JP2330086 A JP 2330086A JP 2507988 B2 JP2507988 B2 JP 2507988B2
- Authority
- JP
- Japan
- Prior art keywords
- imaging
- magnification
- image pickup
- inspected
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Closed-Circuit Television Systems (AREA)
Description
【発明の詳細な説明】 ＜産業上の利用分野＞ 本発明は、プリント基板をTVカメラにより撮像して検
査を行う基板検査装置及び基板検査方法に関する。Description: TECHNICAL FIELD The present invention relates to a board inspection device and a board inspection method for inspecting a printed board by imaging it with a TV camera.
＜従来の技術＞ 従来この種の基板検査装置及び基板検査方法は、被検
査プリント基板全域を所定の一定倍率で撮像し、画像信
号をA/D変換して基板状の各部品の特徴パラメータなど
の被検査パターンを抽出し基準パターン（基準特徴パラ
メータ）と比較し、部品が基板状の正しい位置に実装さ
れているか否かを検査していた。<Prior Art> Conventionally, this type of board inspecting apparatus and board inspecting method captures the entire area of a printed circuit board to be inspected at a predetermined constant magnification, A / D-converts an image signal, and characterizes each board-like component. The pattern to be inspected was extracted and compared with a reference pattern (reference characteristic parameter) to inspect whether or not the component is mounted at a correct position on the board.
＜発明が解決しようとする問題点＞ しかしながら、従来の装置及び方法にあっては、一定
の倍率で撮像して判定するため、例えば基板上のチップ
部品が高密度実装されたエリアなどの細部の判定が困難
となる問題点がある。<Problems to be Solved by the Invention> However, in the conventional apparatus and method, since images are determined at a constant magnification for determination, for example, details of areas such as an area where chip components are densely mounted on a substrate are There is a problem that the determination is difficult.
他方、上記の細部判定のためには基板上を高倍率で撮
像する必要があるが、この場合には基板全域を判定する
ことは時間がかかり、現実の部品実装ラインでは実際的
ではないという問題点がある。On the other hand, it is necessary to image the substrate at a high magnification for the above-described detailed determination, but in this case, it takes time to determine the entire substrate, which is not practical in an actual component mounting line. There is a point.
本発明は上記問題点に鑑み、短時間で被検査プリント
基板の細部を検査することができる基板検査装置及び基
板検査方法を提供することを目的とする。In view of the above problems, it is an object of the present invention to provide a board inspection device and a board inspection method capable of inspecting details of a printed circuit board to be inspected in a short time.
＜問題点を解決するための手段＞ 上記問題点を解決するために、本発明の基板検査装置
は、部品が実装された被検査基板を撮像して得られる画
像データを処理して前記被検査基板上の部品の実装状態
を検査する基板検査装置において、異なる撮像倍率を選
択可能な撮像手段と、前記被検査基板上の所定の撮像エ
リアを、同一撮像倍率毎に抽出する抽出手段と、前記抽
出手段により同一撮像倍率について抽出された前記所定
の撮像エリアを順次撮像するように制御する制御手段
と、を有することを特徴とする。<Means for Solving Problems> In order to solve the above problems, the board inspection apparatus of the present invention processes the image data obtained by capturing an image of the board to be inspected on which the component is mounted to process the inspected object. In a board inspection device for inspecting a mounting state of components on a board, an imaging means capable of selecting different imaging magnifications, an extraction means for extracting a predetermined imaging area on the board to be inspected for each same imaging magnification, Control means for controlling to sequentially image the predetermined imaging areas extracted for the same imaging magnification by the extraction means.
また、本発明の基板検査方法は、異なる複数の撮像倍
率を選択可能な撮像手段を備え、予め前記被検査基板上
の所定のエリアの位置とそのエリアを撮像する撮像倍率
とを対応させて記憶させておき、前記撮像手段を用いて
同一撮像倍率に対応する所定のエリアを順次抽出し前記
被検査基板上を撮像し、この撮像によって得られた画像
データに基づいて実装部品の実装状態を検査することを
特徴とする。Further, the board inspection method of the present invention comprises an image pickup means capable of selecting a plurality of different image pickup magnifications, and stores in advance a position of a predetermined area on the board to be inspected and an image pickup magnification for picking up the area in association with each other. Then, a predetermined area corresponding to the same image pickup magnification is sequentially extracted by using the image pickup means, an image is picked up on the substrate to be inspected, and the mounting state of the mounted component is inspected based on the image data obtained by this image pickup. It is characterized by doing.
＜実施例＞ 以下、図面を参照して本発明の基板検査装置及び基板
検査方法を説明する。第１図は本発明に係る基板検査装
置の一実施例を示すブロック図である。<Examples> Hereinafter, a substrate inspection apparatus and a substrate inspection method of the present invention will be described with reference to the drawings. FIG. 1 is a block diagram showing one embodiment of a substrate inspection apparatus according to the present invention.
本装置は、チップ部品Ｃが搭載された被検査基板であ
るプリント基板Ｐを撮像する撮像手段であるTVカメラ１
を有し、TVカメラ１はズーミング機構及びオートフォー
カス機構を備え、異なる複数の撮像倍率が選択可能とな
っている。尚、このTVカメラ１は、カラーTVカメラでも
白黒TVカメラでもよい。This apparatus is a TV camera 1 which is an image pickup means for picking up an image of a printed circuit board P which is a substrate to be inspected on which a chip component C is mounted.
In addition, the TV camera 1 is provided with a zooming mechanism and an autofocus mechanism, and a plurality of different imaging magnifications can be selected. The TV camera 1 may be a color TV camera or a black and white TV camera.
本装置はまた、プリント基板Ｐを載置・固定してXY方
向に移動させるXYステージ２と、後述する処理部３と、
プリント基板Ｐを検査する際の基準となる各部品Ｃの識
別番号や座標、面積、形状、重心などの基準特徴パラメ
ータより構成される基準データを入力したり、また第２
図に示すようにTVカメラ１の撮像倍率（Ａ倍、3A倍、5A
倍）毎のプリント基板Ｐの撮像エリアの位置情報である
座標（x1,y2）〜（xn,yn）や各倍率のフォーカシングを
行う位置座標（後述）を入力したり、各処理手順を入力
する入力部４と、プリンタやCRTディスプレイなどの検
査結果や入力データを出力する出力部５を有する。The apparatus also includes an XY stage 2 for mounting and fixing the printed circuit board P and moving the printed board P in the XY directions, and a processing unit 3 to be described later.
Input reference data composed of reference characteristic parameters such as the identification number, coordinates, area, shape, and center of gravity of each component C that serves as a reference when inspecting the printed circuit board P.
As shown in the figure, the imaging magnification of TV camera 1 (A, 3A, 5A
Is position information coordinates of the image pickup area of the printed board P for each fold) (x 1, y 2) ~ (x n, y n) and to input the positional coordinates (described later) for performing focusing of the magnification, each processing It has an input unit 4 for inputting a procedure and an output unit 5 for outputting an inspection result and input data of a printer or a CRT display.
前述した処理部３は、制御手段である中央処理装置
（CPU）3aと、TVカメラ１により撮像されたプリント基
板Ｐ上の各部品Ｃの画像信号をA/D変換して各部品Ｃの
特徴腹メータを抽出する画像処理部3bを有する。The above-mentioned processing unit 3 performs the A / D conversion of the image signals of the central processing unit (CPU) 3a, which is the control means, and the respective parts C on the printed circuit board P imaged by the TV camera 1, and features of the respective parts C. It has an image processing unit 3b for extracting an abdominal meter.
尚、プリント基板Ｐを検査するための基準データは前
述したような入力部４を介して入力する代りに、XYステ
ージ２上に基準基板を予め載置し、画像処理部3bにより
各部品Ｃの基準特徴パラメータを抽出して入力するよう
にしてもよい。また、この基準特徴パラメータは、本検
査行程の前の部品搭載工程で用いられるマウント装置の
部品搭載データを用いてもよい。Instead of inputting the reference data for inspecting the printed circuit board P via the input unit 4 as described above, the reference substrate is placed in advance on the XY stage 2 and the image processing unit 3b is used to detect each component C. The reference feature parameter may be extracted and input. Further, as the reference feature parameter, component mounting data of a mounting device used in a component mounting process before the main inspection process may be used.
処理部３はまた、データメモリ3cとCPU3aの実行プロ
グラムを格納したプログラムメモリ3dと、その他不図示
のXYステージ２の駆動制御部などを有する。データメモ
リ3cには、前述した基準特徴パラメータや、第２図に示
すようにTVカメラ１の撮像倍率（Ａ倍、3A倍、5A倍）毎
の基板Ｐの所定の領域である撮像エリアの位置情報が予
め記憶される。すなわち、このデータメモリ3cは、TVカ
メラ１の撮像倍率及び撮像領域の位置情報（これらを一
括して撮像倍率情報という）を記憶する撮像倍率情報記
憶手段としての役割を担う。The processing unit 3 also includes a data memory 3c, a program memory 3d storing an execution program of the CPU 3a, and a drive control unit for the XY stage 2 (not shown). In the data memory 3c, the reference characteristic parameters described above and the position of the imaging area which is a predetermined area of the substrate P for each imaging magnification (A times, 3A times, 5A times) of the TV camera 1 as shown in FIG. Information is stored in advance. That is, the data memory 3c serves as an imaging magnification information storage unit that stores the imaging magnification of the TV camera 1 and the position information of the imaging area (these are collectively referred to as imaging magnification information).
第２図の撮像倍率毎の撮像エリアを第３図を参照して
説明して、本発明の基板検査方法を説明することとす
る。まず、第３図（イ）において、図示矢印はTVカメラ
１がプリント基板Ｐ上を順次撮像して行く所謂ラスタス
キャン方式による撮像方向を示し、実際にはTVカメラ１
は固定されてプリント基板Ｐを載置したXYステージ２が
移動する。The image pickup area for each image pickup magnification in FIG. 2 will be described with reference to FIG. 3 to explain the substrate inspection method of the present invention. First, in FIG. 3 (a), the arrow shown in the figure indicates the image capturing direction by the so-called raster scan method in which the TV camera 1 sequentially captures images on the printed circuit board P. Actually, the TV camera 1
Is fixed and the XY stage 2 on which the printed circuit board P is mounted moves.
第３図において、図示実線のエリアは部品が比較的粗
に搭載され、図示破線のエリアは比較的密に搭載され、
図示点線のエリアは最も密に実装されており、したがっ
て第３図（ロ）に示すようにまず最も近傍のフォーカシ
ングマークf1でTVカメラ１をＡ倍でズーミングするとと
もに合焦し、比較的粗のエリアを撮像する。次いで第３
図（ハ）に示すようにＡ倍撮像後最も近傍のフォーカシ
ングマークf2でTVカメラ１を3A倍にズーミングするとと
もに合焦し、比較的密なエリアを撮像する。同様に、3A
倍撮像後に最も近傍のフォーカシングマークf3でTVカメ
ラ１を5A倍にズーミングするとともに合焦し、最も密な
エリアを撮像する。In FIG. 3, parts are mounted relatively coarsely in the area shown by the solid line in the drawing, and relatively densely mounted in the area shown by the broken line in the drawing.
The area indicated by the dotted line in the figure is the most densely packed area. Therefore, as shown in FIG. 3B, first, the TV camera 1 is zoomed and zoomed in A times at the closest focusing mark f 1 to obtain a relatively rough image. Image the area. Then the third
As shown in FIG. 3C, after the A-time image is picked up, the TV camera 1 is zoomed 3A times and focused at the nearest focusing mark f 2 to image a relatively dense area. Similarly, 3A
The most near the focusing mark f 3 after multiple imaging focused while zooming the TV camera 1 to 5A times, imaging the densest area.
尚、TVカメラの合焦方法は、プリント基板Ｐ上に複数
のフォーカシングマーク（f1〜f2）を設けてもよいが、
プリント基板Ｐの配線パターンや部品を撮像して行って
もよい。また、変倍率はＡ倍、3A倍、5A倍率に限らず他
の倍率でもよいことは勿論である。The focusing method of the TV camera may be such that a plurality of focusing marks (f 1 to f 2 ) are provided on the printed board P.
The wiring pattern and the parts of the printed circuit board P may be imaged. Further, it goes without saying that the scaling factor is not limited to A, 3A, and 5A, and other scaling factors may be used.
したがって、上述の如くＡ倍ズーミング及び合焦後撮
像、3A倍ズーミング及び合焦後撮像、5A倍ズーミング及
び合焦後撮像を行う場合、第２図に示すようにＡ倍の撮
像エリア、3A倍の撮像エリア及び5A倍の撮像エリアを予
め入力部４を介してデータメモリ3cに記憶する。尚、第
２図における座標（x1,y2）〜（xn,yn）はプリント基板
Ｐ上におけるTVカメラ１の視野の中心を示し、この座標
によりTVカメラ１の撮像エリアが特定される。また、第
３図（ハ），（ニ）において拡大倍率で撮像する場合、
撮像エリアは第３図（イ）のＡ倍撮像エリアに比べて小
さくなるため、当然エリア全てを撮像するように行う。Therefore, as described above, when performing A-time zooming and after-focus imaging, 3A-time zooming and after-focus imaging, and 5A-time zooming and after-focus imaging, as shown in FIG. The image pickup area and the image pickup area of 5 A times are stored in the data memory 3c in advance via the input unit 4. Coordinates (x 1 , y 2 ) to (x n , y n ) in FIG. 2 indicate the center of the visual field of the TV camera 1 on the printed circuit board P, and the imaging area of the TV camera 1 is specified by these coordinates. It In addition, in the case of imaging at a magnifying power in FIGS. 3C and 3D,
Since the image pickup area is smaller than the A-times image pickup area in FIG. 3A, naturally, the entire area is picked up.
第４図は処理部３のCPU3aの概略動作を説明するため
のフローチャートであり、まず、それぞれステップ（以
下、STという。）1,2において、第２図に示すようなデ
ータメモリ3cの設定倍率の読み込み、各倍率のエリア
（座標）の抽出を行う。FIG. 4 is a flow chart for explaining the general operation of the CPU 3a of the processing unit 3. First, in steps (hereinafter referred to as ST) 1 and 2, respectively, the setting magnification of the data memory 3c as shown in FIG. 2 is set. Is read and the area (coordinates) of each magnification is extracted.
次いでST3において読出した倍率（Ａ倍）がTVカメラ
１の現在の設定倍率と一致しているか否かを判別し、一
致しない場合にはST4へ分岐する。ST4では第３図（イ）
に示すように、XYステージ２を移動してTVカメラ１をプ
リント基板Ｐのフォーカシングマークf1（又は当該倍率
の最初の撮像エリア内の配線パターンや部品）を撮像さ
せて当該倍率（Ａ倍）にズーミングし、また続くST5に
おいてフォーカシングを行う。Next, in ST3, it is determined whether or not the magnification (A times) read out matches the current set magnification of the TV camera 1, and if they do not match, the process branches to ST4. Figure 3 (b) in ST4
As shown in, the XY stage 2 is moved and the TV camera 1 is made to image the focusing mark f 1 (or the wiring pattern or component in the first imaging area of the magnification) of the printed circuit board P and the magnification (A times). Zoom in and focus at ST5.
ST5においてフォーカシングが完了するとST6へ進み、
当該倍率（Ａ倍）のエリアを順次TVカメラ１により撮像
して画像信号を取込み、画像処理部3bにより画像信号を
A/D変換後各部品の特徴パラメータを抽出し、データメ
モリ3cに記憶する。When focusing is completed in ST5, the process proceeds to ST6,
The area of the magnification (A times) is sequentially captured by the TV camera 1, the image signal is taken in, and the image signal is obtained by the image processing unit 3b.
After A / D conversion, characteristic parameters of each component are extracted and stored in the data memory 3c.
ST7では、プリント基板Ｐの全域の撮像が完了したか
どうかを判別し、NOの場合にはST3へ戻って新たな倍率
（3A倍）について処理を行う。以下、各倍率についてそ
れぞれズーミング（ST4）、フォーカシング（ST5）を行
った後、当該倍率の撮像（第３図（ハ）の破線、第３図
（ニ）の点線）を行い、基板Ｐの全域における部品Ｃの
データ（特徴パラメータ）を得る。In ST7, it is determined whether or not the imaging of the entire area of the printed circuit board P has been completed. If NO, the process returns to ST3 and a new magnification (3A) is processed. Hereinafter, after performing zooming (ST4) and focusing (ST5) for each magnification, imaging of that magnification (broken line in FIG. 3C, dotted line in FIG. 3D) is performed, and the whole area of the substrate P is measured. The data (characteristic parameter) of the part C in (1) is obtained.
上記の如く、プリント基板Ｐ上の全ての部品Ｃについ
て特徴パラメータを抽出するとST7からST8へ進み、デー
タメモリ3cに予め記憶されている各部品Ｃの基準パラメ
ータと比較し、続くST9において入力部４から指示があ
れば検査結果を出力部５を介して出力する。As described above, when the characteristic parameters of all the parts C on the printed circuit board P are extracted, the process proceeds from ST7 to ST8, and is compared with the reference parameters of the respective parts C stored in the data memory 3c in advance. If there is an instruction from, the inspection result is output via the output unit 5.
＜発明の効果＞ 以上説明したように本発明は、同一撮像倍率での撮像
エリアをまとめて順次撮像して検査するので、撮像エリ
アを変更する毎に毎回撮像倍率の設定をするという動作
が不要になり、短時間で効率良く被検査基板状の細部ま
で部品の実装状態を検査することができる。<Effects of the Invention> As described above, according to the present invention, since the image pickup areas having the same image pickup magnification are collectively imaged and inspected, the operation of setting the image pickup magnification every time the image pickup area is changed is unnecessary. Therefore, it is possible to efficiently inspect the mounting state of the components up to the details of the substrate to be inspected in a short time.
第１図は本発明に係る基板検査装置の一実施例を示すブ
ロック図、第２図は第１図におけるデータメモリの要部
記憶内容説明図、第３図（イ），（ロ），（ハ）は第１
図の装置の撮像手順を示す説明図、第４図は第２図にお
けるCPUの概略動作を説明するためのフローチャートで
ある。 １……TVカメラ（撮像手段）、3a……中央処理装置（CP
U）（制御手段）、3b……処理部（抽出手段）、3c……
データメモリ（撮像倍率情報記憶手段）、Ｐ……プリン
ト基板（被検査基板）。FIG. 1 is a block diagram showing an embodiment of a substrate inspection apparatus according to the present invention, FIG. 2 is an explanatory diagram of the main contents of the data memory in FIG. 1, FIG. 3 (a), (b), ( C) is the first
FIG. 4 is an explanatory diagram showing an image pickup procedure of the apparatus shown in FIG. 4, and FIG. 4 is a flowchart for explaining a schematic operation of the CPU in FIG. 1 ... TV camera (imaging means), 3a ... Central processing unit (CP
U) (control means), 3b ... Processing unit (extraction means), 3c.
Data memory (imaging magnification information storage means), P ... Printed circuit board (inspected board).
───────────────────────────────────────────────────── フロントページの続き (72)発明者 立石 義雄 京都市右京区花園土堂町10番地 立石電 機株式会社内 (56)参考文献 特開 昭61−241605（ＪＰ，Ａ) ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Yoshio Tateishi, Tateishi Electric Co., Ltd., No. 10, Hanazono Dodo-cho, Ukyo-ku, Kyoto City (56) Reference JP-A-61-241605 (JP, A)
Claims (5)
られる画像データを処理して前記被検査基板上の部品の
実装状態を検査する基板検査装置において、 異なる撮像倍率を選択可能な撮像手段と、 前記被検査基板上の所定の撮像エリアを、同一撮像倍率
毎に抽出する抽出手段と、 前記抽出手段により同一撮像倍率について抽出された前
記所定の撮像エリアを順次撮像するように制御する制御
手段と、 を有することを特徴とする基板検査装置。1. A board inspecting apparatus for inspecting a mounting state of a component on an inspected substrate by processing image data obtained by imaging an inspected substrate on which a component is mounted, and different imaging magnifications can be selected. Image pickup means, extraction means for extracting a predetermined image pickup area on the substrate to be inspected for each same image pickup magnification, and control for sequentially picking up the predetermined image pickup area extracted for the same image pickup magnification by the extracting means And a control unit for controlling the substrate.
像倍率毎にグループ分けして記憶している撮像倍率情報
記憶手段を備え、前記抽出手段は前記撮像倍率情報記憶
手段から同一撮像倍率について記憶された撮像位置を読
出して抽出する請求項（１）記載の基板検査装置。2. An imaging magnification information storage means for preliminarily grouping and storing imaging positions for imaging at the same imaging magnification for each imaging magnification, wherein the extraction means stores the same imaging magnification from the imaging magnification information storage means. The board inspection apparatus according to claim 1, wherein the stored imaging position is read and extracted.
られる画像データを処理して前記被検査基板上の部品の
実装状態を検査する基板検査装置において、 ズーミング機構を備えて基板上の所定の撮像エリアを異
なる複数の撮像倍率で撮像可能なTVカメラと、 前記撮像倍率毎に基板上を複数の撮像エリアに分割し、
各撮像エリアを撮像する際に当該撮像エリアを同一倍率
毎にグループ分けし、当該グループ毎にこれに対応する
撮像倍率に基づいてそれぞれ前記TVカメラのズーミング
を制御する制御手段と、 を有することを特徴とする基板検査装置。3. A board inspection device for processing image data obtained by picking up an image of a board on which a component is mounted to inspect a mounting state of a part on the board to be inspected, the board being provided with a zooming mechanism. A TV camera capable of capturing a predetermined image pickup area at a plurality of different image pickup magnifications, and dividing the substrate into a plurality of image pickup areas for each image pickup magnification,
A control unit that divides the imaging areas into groups according to the same magnification when imaging each imaging area, and controls the zooming of the TV camera based on the imaging magnification corresponding to each group. Characteristic board inspection device.
られる画像データを処理して前記検査基板上の部品の実
装状態を検査する基板検査方法において、 異なる複数の撮像倍率を選択可能な撮像手段を備え、予
め前記被検査基板上の所定のエリアの位置とそのエリア
を撮像する撮像倍率とを対応させて記憶させておき、前
記撮像手段を用いて同一撮像倍率に対応する所定のエリ
アを順次抽出し前記被検査基板上を撮像して、この撮像
によって得られた画像データに基づいて実装部品の実装
状態を検査することを特徴とする基板検査方法。4. A board inspection method for processing image data obtained by picking up an image of a board to be inspected on which a component is mounted to inspect a mounting state of the component on the inspection board, and a plurality of different imaging magnifications can be selected. A predetermined area on the substrate to be inspected and an imaging magnification for imaging the area are stored in advance, and a predetermined imaging magnification corresponding to the same imaging magnification is used by the imaging means. A board inspection method characterized in that areas are sequentially extracted, the board to be inspected is imaged, and the mounting state of the mounted component is inspected based on image data obtained by the imaging.
られる画像データを処理して前記被検査基板上の部品の
実装状態を検査する基板検査方法において、 異なる複数の撮像倍率で撮像可能な撮像手段を備え、予
め前記撮像倍率毎に被検査基板上を複数の撮像エリアに
分割し、当該撮像エリアを同一倍率毎にグループ分け
し、これら各グループに対応した撮像倍率を記憶してお
き、前記撮像手段により前記予め記憶された同一撮像倍
率のグループに属する撮像エリアをラスタスキャン方式
により前記被検査基板上の全体に亘って撮像して、この
撮像によって得られた画像データに基づいて実装部品の
実装状態を検査することを特徴とする基板検査方法。5. A board inspection method for inspecting a mounting state of a component on the inspected substrate by processing image data obtained by imaging the inspected substrate on which the component is mounted, wherein images are picked up at a plurality of different imaging magnifications. A possible imaging means is provided, the substrate to be inspected is divided into a plurality of imaging areas for each of the imaging magnifications in advance, the imaging areas are divided into groups of the same magnification, and the imaging magnifications corresponding to these groups are stored. Every time, the image pickup means images the image pickup areas belonging to the group of the same image pickup magnification stored in advance by the raster scan method over the entire substrate to be inspected, and based on the image data obtained by this image pickup. A board inspection method characterized by inspecting a mounting state of a mounted component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61023300A JP2507988B2 (en) | 1986-02-05 | 1986-02-05 | Printed circuit board inspection equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61023300A JP2507988B2 (en) | 1986-02-05 | 1986-02-05 | Printed circuit board inspection equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62180252A JPS62180252A (en) | 1987-08-07 |
| JP2507988B2 true JP2507988B2 (en) | 1996-06-19 |
Family
ID=12106748
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61023300A Expired - Lifetime JP2507988B2 (en) | 1986-02-05 | 1986-02-05 | Printed circuit board inspection equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2507988B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002277405A (en) * | 2001-03-14 | 2002-09-25 | Saki Corp:Kk | Visual inspection method and device therefor |
| JP2008224552A (en) * | 2007-03-14 | 2008-09-25 | Omron Corp | Image generation method for measurement processing, and substrate visual inspection device using the method |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH061288B2 (en) * | 1986-10-07 | 1994-01-05 | 富士通株式会社 | Automatic focusing device with height correction |
| FR2647574B1 (en) * | 1989-05-12 | 1991-09-06 | Automatisme Robotique Applique | METHODS AND DEVICES FOR PERFORMING VISUAL MANUFACTURING CHECKS OF A SERIES OF IDENTICAL PARTS |
| JPH0552765A (en) * | 1991-08-29 | 1993-03-02 | Hitachi Ltd | Through hole inspecting apparatus |
| WO2015019978A1 (en) | 2013-08-09 | 2015-02-12 | 武蔵エンジニアリング株式会社 | Focus adjustment method and device therefor |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61241605A (en) * | 1985-04-19 | 1986-10-27 | Yoshiaki Ihara | Image processing device |
-
1986
- 1986-02-05 JP JP61023300A patent/JP2507988B2/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002277405A (en) * | 2001-03-14 | 2002-09-25 | Saki Corp:Kk | Visual inspection method and device therefor |
| JP2008224552A (en) * | 2007-03-14 | 2008-09-25 | Omron Corp | Image generation method for measurement processing, and substrate visual inspection device using the method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62180252A (en) | 1987-08-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3522280B2 (en) | Method and apparatus for a ball bond inspection system | |
| KR100738693B1 (en) | Probe mark reader and probe mark reading method | |
| KR960001824B1 (en) | Wire bonding inspecting apparatus | |
| JP4105809B2 (en) | Appearance inspection method and appearance inspection apparatus | |
| JP2507988B2 (en) | Printed circuit board inspection equipment | |
| JP4477863B2 (en) | Cell measurement support system and cell observation apparatus | |
| JP2000329527A (en) | Apparatus and method for measuring height, and inspecting apparatus utilizing the same | |
| JP2570650B2 (en) | Substrate inspection device and substrate inspection method | |
| US20080008381A1 (en) | Coordinate acquisition apparatus for test of printed board, and coordinate acquisition method and program for test thereof | |
| KR20000014797A (en) | Automatic instruction device and a method thereof using printing circuit board image management | |
| KR100211004B1 (en) | Image processing method and processing system using the method | |
| JP2000283929A (en) | Wiring pattern inspection method, and its device | |
| JP2008224552A (en) | Image generation method for measurement processing, and substrate visual inspection device using the method | |
| JP2002042112A (en) | Part mounting inspecting method for circuit board and its system | |
| JP2009133696A (en) | Inspection method of substrate and inspection device of substrate | |
| JPH04194905A (en) | Microscopic image mapping device and method | |
| JP2005045194A (en) | Probe-mark reader and probe-mark reading method | |
| JP3652014B2 (en) | Distance measuring device | |
| JP2896153B2 (en) | Automatic inspection equipment | |
| JPH11295045A (en) | Inspecting apparatus | |
| JP2850807B2 (en) | Inspection data creation device | |
| JP2001091840A (en) | Microscope system | |
| KR100779126B1 (en) | image reading device and method, and image reading program storage media | |
| JP2003207320A (en) | Three-dimensional recognition method and device | |
| JP2000294612A (en) | Method and device for creating chip layout |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |