JP2505480B2 - Copper alloy foil for flexible circuit boards - Google Patents
Copper alloy foil for flexible circuit boardsInfo
- Publication number
- JP2505480B2 JP2505480B2 JP62211292A JP21129287A JP2505480B2 JP 2505480 B2 JP2505480 B2 JP 2505480B2 JP 62211292 A JP62211292 A JP 62211292A JP 21129287 A JP21129287 A JP 21129287A JP 2505480 B2 JP2505480 B2 JP 2505480B2
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- Japan
- Prior art keywords
- weight
- copper alloy
- alloy foil
- foil
- flexible circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
【発明の詳細な説明】 〔発明の目的〕 この出願の発明は、耐熱性、耐ヒートショック性、耐
剥離性、耐変形性に優れ、強度の改善が得られるととも
に、強度、伸び等に異方性がなく、かつ加工性に優れ、
可撓性をも改善したフレキシブル回路基板用銅合金箔に
関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] The invention of the present application is excellent in heat resistance, heat shock resistance, peeling resistance, and deformation resistance, and is improved in strength, and is different in strength, elongation, and the like. It is non-directional and has excellent workability,
The present invention relates to a copper alloy foil for flexible circuit boards, which has improved flexibility.
ICやLSI等の著しい進歩とともに、これらの素子を搭
載する回路基板の開発も広範囲にしかも急速に進められ
た。With the remarkable progress of ICs and LSIs, the development of circuit boards on which these devices are mounted has been extensively and rapidly advanced.
上記のように回路基板の主目的は、その上に搭載され
た素子の相互接続にあるが、その他低誘電率絶縁体、低
抵抗導体などの電気的特性、フレキシブルあるいは剛性
などの機械的特性、熱伝達特性、信頼性、経済性などが
要求されている。As described above, the main purpose of the circuit board is to interconnect the elements mounted on it, but other low dielectric constant insulators, electrical characteristics such as low resistance conductors, mechanical characteristics such as flexibility or rigidity, Heat transfer characteristics, reliability, economy, etc. are required.
このような回路基板には大別して、樹脂基板、セラミ
ック基板、金属基板がある。そしてセラミック基板はハ
イブリッドIC用として、樹脂基板はプリント回路用とし
てそれぞれ発展し、金属基板は両者の中間に位置するも
のである。Such circuit boards are roughly classified into resin boards, ceramic boards, and metal boards. The ceramic substrate has been developed for hybrid ICs, the resin substrate has been developed for printed circuits, and the metal substrate is located between them.
このような基板の中で樹脂基板は、エポキシ、フェノ
ール、ポリイミド等の樹脂又はこれらと紙、ガラス等の
他の材料の複合基板に銅箔をラミネートし、接着剤ある
いは加熱加圧により一体化して形成されたものである。Among such substrates, the resin substrate is formed by laminating a copper foil on a resin such as epoxy, phenol, or polyimide, or a composite substrate of these and other materials such as paper and glass, and integrating them with an adhesive or heat and pressure. It was formed.
上記の樹脂基板のうちフレキシブル回路（プリント）
基板は、ポリイミド等の可撓性のある樹脂に屈曲性に優
れた10〜60μｍ程度の圧延銅箔をラミネートした基板
で、電子機器の広範囲な用途に用いられている。Flexible circuit (print) of the above resin boards
The substrate is a substrate obtained by laminating a rolled copper foil having a flexibility of about 10 to 60 μm on a flexible resin such as polyimide, and is used in a wide range of electronic devices.
上記の銅箔をラミネートした回路基板は、エッチング
により線巾及び線間隔100μｍ程度にまでファイン化さ
れた配線パターンが形成される。On the circuit board laminated with the above copper foil, a fine wiring pattern having a line width and a line interval of about 100 μm is formed by etching.
そして高密度のためには上記の線巾及び線間隔が50μ
ｍのパターンも検討されている。And for high density, the above line width and line spacing are 50μ.
The m pattern is also being considered.
前記フレキシブル回路基板はポリイミド等の可撓性樹
脂基板にタフピッチ銅の圧延箔をラミネートしたものが
用いられているが、熱による変形、断線あるいは樹脂か
らの剥離という問題が発生し、信頼性が低下するという
欠点があった。The flexible circuit board is formed by laminating a rolled foil of tough pitch copper on a flexible resin board such as polyimide. However, the problem of deformation due to heat, disconnection or peeling from the resin occurs, and reliability is reduced. There was a drawback to do.
特にハイブリッドIC等の製造においてポリイミド等の
樹脂と圧延銅箔を接着するときの160〜200℃前後のキュ
アリング（焼成）時、外部リード線やヒートシンクのハ
ンダ付け時、パッケージング時の加熱などにより、かな
りの熱が基板にかかってくるので、上記の問題は看過す
ことができないものとなった。Especially when bonding resin such as polyimide to rolled copper foil in the manufacture of hybrid ICs, etc., when curing (baking) at around 160 to 200 ° C, when soldering external lead wires or heat sinks, and when heating during packaging. However, since a great deal of heat is applied to the substrate, the above problems cannot be overlooked.
また、上記のような製造時の熱履歴の他に、例えば自
動車のエンジンルームのようなところで使用される場合
には、100℃前後の熱環境下におかれるため、耐熱性や
耐ヒートショック性が必要とされるようになった。Also, in addition to the heat history during manufacturing as described above, when used in a place such as an automobile engine room, for example, it is exposed to a thermal environment of about 100 ° C., so heat resistance and heat shock resistance Came to be needed.
さらに、フレキシブル回路板のベースとなるポリイミ
ドのような樹脂と銅箔材料との熱膨張係数が、ポリイミ
ド23×10-6/℃、銅17×10-6/℃で大きな差異があり、熱
を受けると銅回路線に大きな引張り応力がかかり、回路
の変形や断線さらには剥離と悪化要因を助長する結果と
なっている。Furthermore, the coefficient of thermal expansion between a resin such as polyimide, which is the base of the flexible circuit board, and the copper foil material is greatly different in polyimide 23 × 10 -6 / ° C and copper 17 × 10 -6 / ° C, When it is received, a large tensile stress is applied to the copper circuit wire, which results in promoting the deformation and disconnection of the circuit and further exfoliation and deterioration factors.
さらにまた、前記した示したタフピッチの銅の圧延箔
に直接的に帰因する問題として、圧延銅箔の縦方向（圧
延方向）と横方向（圧延方向に直角な方向）とで引張り
強度や伸びに著しい差異があるため、すなわち機械的特
性に異方性があるために、回路基板や回路の変形、剥
離、さらには断線となるおそれがあり、しかも上記のよ
うな変形が生じた場合には素子との接続が不確実とな
り、信頼性がますます低下する結果となった。そしてこ
の異方性は、第１図に示すように影響を受ける熱が高く
なるにしたがって増加する傾向がある。Furthermore, as a problem directly attributed to the above-mentioned rolled foil of tough pitch copper, tensile strength and elongation in the longitudinal direction (rolling direction) and the transverse direction (direction perpendicular to the rolling direction) of the rolled copper foil are given. , There is a possibility that the circuit board or circuit may be deformed, peeled off, or even broken due to the significant difference in mechanical properties, that is, if such deformation occurs. The connection with the device became uncertain, and the reliability deteriorated. And, as shown in FIG. 1, this anisotropy tends to increase as the affected heat becomes higher.
また、近年では可動部への適用が多くなり、従来の銅
箔では破断する事も発生している。Further, in recent years, the number of applications to movable parts has increased, and the conventional copper foil may be broken.
従って可撓性のさらに改善された材料が求められてい
る現状である。Therefore, there is a demand for a material having further improved flexibility.
これらの諸要求に対し、ある種の添加元素を加えた銅
合金を用いる事は有効な手段の一つであるが、銅合金を
用いるという事だけでは必ずしも加工性、可撓性を満足
させる事はできなかった。In order to meet these requirements, using a copper alloy to which a certain kind of additive element is added is one of the effective means, but using a copper alloy alone does not necessarily satisfy workability and flexibility. I couldn't.
本発明はかかる点に鑑みなされたもので、銅に微量元
素を添加するとともに、有害な元素を規定する事によ
り、上記の種々の特性を改善したものである。The present invention has been made in view of the above points, and improves the above various characteristics by adding a trace element to copper and defining a harmful element.
すなわち、本発明は P0.005〜0.05重量％、B0.005〜0.05重量％、 Al0.01〜0.5重量％、As0.01〜0.5重量％、 Cd0.01〜0.5重量％、Co0.01〜0.5重量％、 Fe0.01〜0.5重量％、In0.01〜0.5重量％、 Mg0.01〜0.5重量％、Mn0.01〜0.5重量％、 Ni0.01〜0.5重量％、Si0.01〜0.5重量％、 Sn0.01〜0.5重量％、Te0.01〜0.5重量％、 Ag0.01〜１重量％、Cr0.01〜１重量％、 Hf0.01〜１重量％、Zn0.01〜１重量％、 Zr0.01〜１重量％ の群から選択された１種又は２種以上の成分を0.005〜
1.5重量％含有し、 Bi0.0015重量％以下、Se0.002重量％以下 Pb0.01重量％以下であり、残部Cu又は不可避的不純物か
らなることを特徴とするフレキシブル回路基板用銅合金
箔並びに前記銅合金箔の酸素含有量が50ppm以下である
前記フレキシブル回路基板用銅合金箔及び前記銅合金箔
が最終冷間圧延後歪取り焼鈍した圧延箔である前記のそ
れぞれに記載するフレキシブル回路基板用銅合金箔を提
供するものである。That is, the present invention is P0.005-0.05% by weight, B0.005-0.05% by weight, Al0.01-0.5% by weight, As0.01-0.5% by weight, Cd0.01-0.5% by weight, Co0.01-0.5% by weight. % By weight, Fe0.01-0.5% by weight, In0.01-0.5% by weight, Mg0.01-0.5% by weight, Mn0.01-0.5% by weight, Ni0.01-0.5% by weight, Si0.01-0.5% by weight , Sn0.01 ~ 0.5wt%, Te0.01 ~ 0.5wt%, Ag0.01 ~ 1wt%, Cr0.01 ~ 1wt%, Hf0.01 ~ 1wt%, Zn0.01 ~ 1wt%, Zr0 0.001 to 1% by weight of one or more components selected from the group of 0.005 to
1.5% by weight of Bi, 0.0015% by weight or less of Bi, 0.002% by weight or less of Se, 0.01% by weight or less of Pb, balance Cu or unavoidable impurities, and copper alloy foil for flexible circuit board and the above Oxygen content of the copper alloy foil is 50ppm or less the flexible circuit board copper alloy foil and the copper alloy foil is a rolled foil subjected to stress relief annealing after final cold rolling copper for flexible circuit board according to each of the An alloy foil is provided.
本発明を構成する合金成分のＰ、Ｂ、Al、As、Cd、C
o、Fe、In、Mg、Mn、Ni、Si、Sn、Te、Ag、Cr、Hf、Z
n、Zrは強度、耐熱性を向上させるとともに銅の再結晶
集合組織である（100）方位が発達することを防ぎ異方
性を改善する。P, B, Al, As, Cd, C of the alloy components constituting the present invention
o, Fe, In, Mg, Mn, Ni, Si, Sn, Te, Ag, Cr, Hf, Z
n and Zr improve strength and heat resistance and prevent the development of (100) orientation, which is a recrystallized texture of copper, and improve anisotropy.
しかし、銅に添加されるこれらの合金成分にはそれぞ
れ上限及び下限がある。それについて以下に説明する。However, each of these alloy components added to copper has an upper limit and a lower limit. This will be described below.
Ｐ、Ｂについては0.005重量％未満、Al、As、Cd、C
o、Fe、In、Mg、Mn、Ni、Si、Sn、Te、Ag、Cr、Hf、Z
n、Zrについては0.01重量％未満では期待する効果が得
られず、逆に、Ｐ、Ｂについては0.05重量％、Al、As、
Cd、Co、Fe、In、Mg、Mn、Ni、Si、Sn、Teについては0.
5重量％、Ag、Cr、Hf、Zn、Zrについては１重量％を超
えると導電性が著しく低下するため好ましくない。又、
これら群から選択された１種又は２種以上の成分の範囲
を0.005〜1.5重量％とした理由は、下限値については１
種添加の下限値として0.005重量％とし、上限値につい
ては２種以上の添加により１重量％を超えても金属間化
合物の生成等で必ずしも著しい導電性の低下がないが、
1.5重量％を超えると著しく低下するためである。Less than 0.005% by weight for P and B, Al, As, Cd, C
o, Fe, In, Mg, Mn, Ni, Si, Sn, Te, Ag, Cr, Hf, Z
If n and Zr are less than 0.01% by weight, the expected effect cannot be obtained. Conversely, if P and B are 0.05% by weight, Al, As,
0 for Cd, Co, Fe, In, Mg, Mn, Ni, Si, Sn, Te.
If the content of Ag, Cr, Hf, Zn, and Zr exceeds 5% by weight, the electrical conductivity remarkably decreases, which is not preferable. or,
The reason for setting the range of one or more components selected from these groups to 0.005 to 1.5% by weight is that the lower limit is 1
The lower limit of seed addition is 0.005% by weight, and the upper limit of addition of two or more species does not necessarily cause a marked decrease in conductivity due to the formation of intermetallic compounds, etc., even if it exceeds 1% by weight.
This is because if it exceeds 1.5% by weight, the amount will be remarkably reduced.
さらにBi、Se、Pbの含有量を規定した理由は、これら
元素が熱間加工、冷間加工等の加工性に有害であるとと
もに可撓性にも悪影響を及ぼすためである。Further, the reason for defining the contents of Bi, Se, and Pb is that these elements are harmful to workability such as hot working and cold working and adversely affect flexibility.
Biが0.0015重量％を超えると熱間加工性、冷間加工
性、可撓性が著しく劣化するため好ましくなく、Seが0.
002重量％を超えると冷間加工性、可撓性が著しく劣化
するため好ましくなく、Pbが0.01重量％を超えると熱間
加工性、冷間加工性、可撓性が著しく劣化するため好ま
しくない。When Bi exceeds 0.0015% by weight, hot workability, cold workability, and flexibility are significantly deteriorated, which is not preferable, and Se is 0.
If it exceeds 002% by weight, cold workability and flexibility are significantly deteriorated, which is not preferable, and if Pb exceeds 0.01% by weight, hot workability, cold workability, and flexibility are significantly deteriorated, which is not preferable. .
また、酸素含有量を50ppm以下とする理由は耐熱性を
さらに向上させるものであるが、上記添加元素を添加し
ても酸素含有量が50ppmを超えて多量に存在している
と、耐熱性がさほど向上せず、逆に酸素含有量が50ppm
以下では、微量の元素添加で著しい耐熱性の向上が得ら
れるためである。これは酸素含有量が高いと添加した合
金元素が酸化物となり耐熱性に寄与しなくなるためと考
えられる。好ましくは酸素含有量が20ppm以下が望まれ
る。Further, the reason for setting the oxygen content to 50 ppm or less is to further improve the heat resistance, but even if the oxygen content is present in a large amount exceeding 50 ppm even if the above-mentioned additional element is added, the heat resistance is high. Not much improved, conversely the oxygen content is 50ppm
The reason for this is that the addition of a trace amount of elements can significantly improve the heat resistance below. This is considered to be because when the oxygen content is high, the added alloy element becomes an oxide and does not contribute to heat resistance. The oxygen content is preferably 20 ppm or less.
また、最終冷間圧延後、歪取り焼鈍をする理由は、冷
間圧延上りの状態では材料内部に残留応力が多量に蓄積
されているため、回路基板製造工程中に受ける熱（樹脂
との接着時の熱あるいはエッチングパターン焼付け時の
熱等）により保留応力が開放され、銅合金箔の収縮が生
じ、効果的に変形してしまうおそれがあるからで、従っ
て、最終冷間圧延後に歪取り焼鈍をすることにより、こ
の銅合金箔の変形をさらに防止しようとするものであ
る。なお、歪取り焼鈍の方法については特に限定される
ものではなく、適宜の焼鈍法を用いることができる。The reason for strain relief annealing after the final cold rolling is that a large amount of residual stress is accumulated inside the material in the state after cold rolling, so that the heat received during the circuit board manufacturing process (bonding with the resin) It is possible that the holding stress is released by the heat of the time or the heat of baking the etching pattern, etc., causing shrinkage of the copper alloy foil and effectively deforming it. Therefore, after the final cold rolling, the strain relief annealing is performed. By doing so, the deformation of the copper alloy foil is further prevented. The strain relief annealing method is not particularly limited, and an appropriate annealing method can be used.
次に本発明に使用する銅合金箔及び従来のタフピッチ
銅箔の抗張力及び伸びの代表例を第１図に基づいて説明
する。本発明に使用する銅合金箔はSn入り（0.1％Sn）
銅合金箔で、比較例として示すものは従来のタフピッチ
銅からなるブライト箔である。第１図から明らかなよう
にSn入り銅合金箔は焼鈍温度（15分）が300℃を超えて
もなおかつ高い抗張力を維持しているのが分かる。Next, typical examples of the tensile strength and elongation of the copper alloy foil used in the present invention and the conventional tough pitch copper foil will be described with reference to FIG. The copper alloy foil used in the present invention contains Sn (0.1% Sn)
The copper alloy foil shown as a comparative example is a conventional bright foil made of tough pitch copper. As is clear from FIG. 1, the Sn-containing copper alloy foil maintains a high tensile strength even when the annealing temperature (15 minutes) exceeds 300 ° C.
これに対し、タフピッチ銅箔の抗張力は120℃程度か
ら急激に降下し、耐熱強度が著しく低いことが分かる。On the other hand, the tensile strength of the tough pitch copper foil drastically drops from around 120 ° C, and it can be seen that the heat resistance strength is extremely low.
これから明らかなように熱影響のある従来のタフピッ
チ圧延銅箔はフレキシブル回路基板として信頼性に著し
く欠けているのである。また、圧延の縦方向（圧延方
向）と横方向とでは、第１図の従来のタフピッチ圧延銅
箔で分かるように、抗張力及び伸びとも大きな差異があ
る。特に熱を受ける160〜200℃の範囲ではその差異が大
きく、このような異方性に伴う位置づれや変形のために
素子との接続の不確実性が増加する。As is apparent from the above, the conventional tough pitch rolled copper foil, which is affected by heat, is extremely lacking in reliability as a flexible circuit board. Further, in the longitudinal direction of the rolling (rolling direction) and the lateral direction, there is a large difference in tensile strength and elongation, as can be seen from the conventional tough pitch rolled copper foil of FIG. In particular, the difference is large in the range of 160 to 200 ° C. which receives heat, and the uncertainty of connection with the element increases due to the misalignment and deformation due to such anisotropy.
これに対して、代表的に示す本願発明に用いるSn入り
銅合金箔では前記のような高耐熱性にさらに前記のよう
な縦方向と横方向との抗張力と伸びの異方性は殆どな
い。これは、フレキシブル回路基板として信頼性の向上
に大きく寄与するものである。On the other hand, in the representatively shown Sn-containing copper alloy foil used in the present invention, in addition to the above-mentioned high heat resistance, there is almost no anisotropy of tensile strength and elongation in the machine direction and the transverse direction as described above. This greatly contributes to the improvement of reliability of the flexible circuit board.
この耐熱強度は他の本発明の合金組成についても同様
であった。This heat resistance strength was the same for the other alloy compositions of the present invention.
次に同材料についてピーリング強度を第１表に示す。 Next, Table 1 shows the peeling strength of the same material.
本発明例はSn入り（0.1％Sn）銅合金箔をポリイミド
樹脂へラミネート（接着）したもので、比較例は従来の
タフピッチ銅箔を表面処理（赤化又は黒化処理）した後
ポリイミドへ接着したものである。 The present invention example is a laminate (adhesion) of Sn-containing (0.1% Sn) copper alloy foil to a polyimide resin, and the comparative example is a conventional tough pitch copper foil surface-treated (red or blackened) and then adhered to the polyimide. It is a thing.
これから明らかなようにピーリング強度は比較例に比
べ本発明の例であるSn入り銅合金箔では大きく優れてい
る。これは他の合金組成についても同様であった。As is clear from this, the peeling strength of the Sn-containing copper alloy foil, which is an example of the present invention, is significantly superior to that of the comparative example. This was the same for other alloy compositions.
以下に本発明材料を実施例をもって説明する。 The material of the present invention will be described below with reference to examples.
第２表に示される本発明合金に係る各種成分組成のイ
ンゴットを高周波溶解炉で溶解鋳造した。酸素含有量を
50ppm以下とするには、銅原料として無酸素銅あるいは
低酸素銅という酸素含有量が50ppm以下のものを用い、
これが酸化しないよう還元性あるいは不活性雰囲気で溶
解鋳造するといった手段により行う。The ingots having various component compositions according to the alloy of the present invention shown in Table 2 were melt-cast in a high frequency melting furnace. Oxygen content
To make it 50 ppm or less, use an oxygen-free copper or low oxygen copper having an oxygen content of 50 ppm or less as a copper raw material,
This is carried out by means such as melting and casting in a reducing or inert atmosphere so that it will not be oxidized.
次にこれを900℃で熱間圧延して厚さ8mmの板とした
後、冷間圧延で厚さ1mmとした。これを500℃にて１時間
焼鈍したのち冷間圧延で厚さ0.2mmとし、さらに500℃に
て１時間焼鈍したのち冷間圧延で厚さ0.035mmとした。Next, this was hot rolled at 900 ° C. to form a plate having a thickness of 8 mm, and then cold rolled to have a thickness of 1 mm. This was annealed at 500 ° C for 1 hour and then cold rolled to a thickness of 0.2 mm, and further annealed at 500 ° C for 1 hour and then cold rolled to a thickness of 0.035 mm.
このようにして調整された試料の評価として、強度を
引針試験により測定し、耐熱性を加熱時間１時間におけ
る軟化温度により、導電性を導電率（％IACS）によって
示した。As the evaluation of the sample thus prepared, the strength was measured by a pulling needle test, the heat resistance was shown by the softening temperature in a heating time of 1 hour, and the conductivity was shown by the conductivity (% IACS).
可撓性はJIS P8115に準拠し、折り曲げ角度135゜、
曲げ半径0.8mm、荷重1.5kgの条件でMIT耐揉疲労試験機
を用いて破断までの回数を調査した。Flexibility complies with JIS P8115, bending angle 135 °,
The number of ruptures was investigated using a MIT rub-fatigue tester under the conditions of a bending radius of 0.8 mm and a load of 1.5 kg.
第２表からわかるように、本発明のフレキシブル回路
基板用導合金箔は優れた強度、耐熱性、導電性を有する
ばかりでなく、可撓性にも優れており、加工性も改善さ
れた合金となっている。As can be seen from Table 2, the conductive alloy foil for a flexible circuit board of the present invention not only has excellent strength, heat resistance and conductivity, but also has excellent flexibility and workability. Has become.
比較例のうち特性値の記述がないものは加工性が悪く
全くサンプルがとれなかったものである。Among the comparative examples, those in which the characteristic values are not described have poor workability and could not be sampled at all.
本発明は上記のように耐熱性、耐ヒートショック性、
耐剥離性、耐変形性、可撓性、加工性に優れ、かつ強
度、延性等に異方性がないので、素子の接着が確実に保
障され、信頼性が増し、フレキシブル回路基板として十
分な機能を備えるものである。The present invention, as described above, heat resistance, heat shock resistance,
It has excellent peeling resistance, deformation resistance, flexibility, workability, and has no anisotropy in strength, ductility, etc., so that the adhesion of the element is guaranteed reliably, the reliability is increased, and it is sufficient as a flexible circuit board. It has a function.
そしてこのような基板はICやLSI等の実装密度を高
め、これを用いた電子機器はさらに新たな用途や機能に
展開されていくことが十分に期待できるものである。It is highly promising that such a board will increase the packaging density of ICs, LSIs, etc., and that electronic equipment using this will be further developed into new applications and functions.
第１図は、比較例であるタフピッチ銅箔と本発明の例で
あるSn入り銅合金箔の焼鈍温度と抗張力及び伸びを示す
グラフである。 1a:タフピッチ銅箔縦方向の抗張力 1b:タフピッチ銅箔横方向の抗張力 2a:タフピッチ銅箔縦方向の伸び 2b:タフピッチ銅箔横方向の伸び 3a:Sn入り銅合金箔縦方向の抗張力 3b:Sn入り銅合金箔横方向の抗張力 4a:Sn入り銅合金箔縦方向の伸び 4b:Sn入り銅合金箔横方向の伸びFIG. 1 is a graph showing annealing temperature, tensile strength and elongation of a tough pitch copper foil which is a comparative example and a copper alloy foil containing Sn which is an example of the present invention. 1a: Tough pitch copper foil longitudinal tensile strength 1b: Tough pitch copper foil lateral tensile strength 2a: Tough pitch copper foil longitudinal elongation 2b: Tough pitch copper foil lateral elongation 3a: Sn-containing copper alloy foil longitudinal tensile strength 3b: Sn Copper alloy foil containing copper 4a: Sn-containing copper alloy foil Vertical elongation 4b: Sn-containing copper alloy foil Horizontal elongation
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭61−64837（ＪＰ，Ａ) 特開 昭63−310929（ＪＰ，Ａ) 特開 昭63−133402（ＪＰ，Ａ) 特開 昭62−189738（ＪＰ，Ａ) ─────────────────────────────────────────────────── ─── Continuation of the front page (56) Reference JP-A 61-64837 (JP, A) JP-A 63-310929 (JP, A) JP-A 63-133402 (JP, A) JP-A 62- 189738 (JP, A)
Claims (3)
％、 Al0.01〜0.5重量％、As0.01〜0.5重量％、 Cd0.01〜0.5重量％、Co0.01〜0.5重量％、 Fe0.01〜0.5重量％、In0.01〜0.5重量％、 Mg0.01〜0.5重量％、Mn0.01〜0.5重量％、 Ni0.01〜0.5重量％、Si0.01〜0.5重量％、 Sn0.01〜0.5重量％、Te0.01〜0.5重量％、 Ag0.01〜１重量％、Cr0.01〜１重量％、 Hf0.01〜１重量％、Zn0.01〜１重量％、 Zr0.01〜１重量％ の群から選択された１種又は２種以上の成分を0.005〜
1.5重量％含有し、 Bi0.0015重量％以下、Se0.002重量％以下 Pb0.01重量％以下であり、残部Cu又は不可避的不純物か
らなることを特徴とするフレキシブル回路基板用銅合金
箔。1. P0.005 to 0.05% by weight, B0.005 to 0.05% by weight, Al0.01 to 0.5% by weight, As0.01 to 0.5% by weight, Cd0.01 to 0.5% by weight, Co0.01 to 0.5% % By weight, Fe0.01-0.5% by weight, In0.01-0.5% by weight, Mg0.01-0.5% by weight, Mn0.01-0.5% by weight, Ni0.01-0.5% by weight, Si0.01-0.5% by weight , Sn0.01 ~ 0.5wt%, Te0.01 ~ 0.5wt%, Ag0.01 ~ 1wt%, Cr0.01 ~ 1wt%, Hf0.01 ~ 1wt%, Zn0.01 ~ 1wt%, Zr0 0.001 to 1% by weight of one or more components selected from the group of 0.005 to
A copper alloy foil for a flexible circuit board, characterized in that it contains 1.5% by weight of Bi, 0.0015% by weight or less of Bi, 0.002% by weight or less of Se, 0.01% by weight or less of Pb, and the balance Cu or unavoidable impurities.
下である特許請求の範囲第１項記載のフレキシブル回路
基板用銅合金箔。2. The copper alloy foil for a flexible circuit board according to claim 1, wherein the oxygen content of the rolled copper alloy foil is 50 ppm or less.
焼鈍した圧延箔である特許請求の範囲第１項又は第２項
のそれぞれに記載するフレキシブル回路基板用銅合金
箔。3. The copper alloy foil for a flexible circuit board according to claim 1 or 2, wherein the rolled copper alloy foil is a rolled foil subjected to stress relief annealing after final cold rolling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62211292A JP2505480B2 (en) | 1987-08-27 | 1987-08-27 | Copper alloy foil for flexible circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62211292A JP2505480B2 (en) | 1987-08-27 | 1987-08-27 | Copper alloy foil for flexible circuit boards |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6456841A JPS6456841A (en) | 1989-03-03 |
| JP2505480B2 true JP2505480B2 (en) | 1996-06-12 |
Family
ID=16603517
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62211292A Expired - Fee Related JP2505480B2 (en) | 1987-08-27 | 1987-08-27 | Copper alloy foil for flexible circuit boards |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2505480B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104593618A (en) * | 2015-01-06 | 2015-05-06 | 湖南金龙国际铜业有限公司 | High-conductivity ultrafine alloy regeneration copper rod and refining method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4738624B2 (en) * | 2001-04-17 | 2011-08-03 | 東芝機械株式会社 | Crushing machine |
| KR100491385B1 (en) * | 2001-07-04 | 2005-05-24 | 닛꼬 긴조꾸 가꼬 가부시키가이샤 | Copper alloy foil for laminated sheet |
| JP2003027162A (en) * | 2001-07-13 | 2003-01-29 | Nippon Mining & Metals Co Ltd | Copper alloy foil for laminated board |
| CN1681373A (en) * | 2001-08-10 | 2005-10-12 | 日矿金属加工株式会社 | Copper alloy foil for laminate sheet |
| JP2007125795A (en) * | 2005-11-04 | 2007-05-24 | Komatsu Zenoah Co | Foliage crushing machine |
| JP6643287B2 (en) * | 2017-08-03 | 2020-02-12 | Ｊｘ金属株式会社 | Copper foil for flexible printed circuit board, copper-clad laminate using the same, flexible printed circuit board, and electronic device |
| CN108012406A (en) * | 2017-12-06 | 2018-05-08 | 广州兴森快捷电路科技有限公司 | Stretchable FPC plates and preparation method thereof |
| CN110252972B (en) * | 2019-07-06 | 2021-11-30 | 湖北精益高精铜板带有限公司 | High-strength high-conductivity microalloy copper foil and processing method thereof |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52131925A (en) * | 1976-04-27 | 1977-11-05 | Sumitomo Electric Ind Ltd | Heat resisting tough pitch copper for electric wire |
| US4311522A (en) * | 1980-04-09 | 1982-01-19 | Amax Inc. | Copper alloys with small amounts of manganese and selenium |
| JPS58147142A (en) * | 1982-02-26 | 1983-09-01 | Furukawa Electric Co Ltd:The | Cu alloy for lead wire material of semiconductor device |
| JPS5978592A (en) * | 1982-10-27 | 1984-05-07 | 株式会社フジクラ | Flexible printed board |
| JPS6017040A (en) * | 1983-07-08 | 1985-01-28 | Sumitomo Metal Mining Co Ltd | Copper alloy for high electric conduction having low softening temperature |
| JPS6164837A (en) * | 1984-09-06 | 1986-04-03 | Kobe Steel Ltd | Copper alloy for flexible print |
| JPS61259555A (en) * | 1985-05-14 | 1986-11-17 | Mitsubishi Metal Corp | Cu alloy bonding wire for semiconductor device |
-
1987
- 1987-08-27 JP JP62211292A patent/JP2505480B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104593618A (en) * | 2015-01-06 | 2015-05-06 | 湖南金龙国际铜业有限公司 | High-conductivity ultrafine alloy regeneration copper rod and refining method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6456841A (en) | 1989-03-03 |
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