JP2504963B2 - Method for producing resin-impregnated base material - Google Patents
Method for producing resin-impregnated base materialInfo
- Publication number
- JP2504963B2 JP2504963B2 JP61164979A JP16497986A JP2504963B2 JP 2504963 B2 JP2504963 B2 JP 2504963B2 JP 61164979 A JP61164979 A JP 61164979A JP 16497986 A JP16497986 A JP 16497986A JP 2504963 B2 JP2504963 B2 JP 2504963B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- base material
- powder
- impregnated base
- impregnated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Details Of Cutting Devices (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Description
【発明の詳細な説明】 ［技術分野］ 本発明は切断部からの樹脂粉及び基材粉等の粉末の落
下を防止した樹脂含浸基材の製造方法に関する。Description: TECHNICAL FIELD The present invention relates to a method for producing a resin-impregnated base material in which powder such as resin powder and base material powder is prevented from dropping from a cut portion.
［背景技術］ 従来より樹脂含浸基材は、紙、ガラス布、織物等の基
材を樹脂ワニス槽に浸漬して樹脂を含浸させ、乾燥機で
乾燥させて製造されており、この樹脂含浸基材は、積層
成形に際して所定寸法に切断されるが、この際にあるい
は切断後に切断部から樹脂粉及び基材粉等の粉末が落下
して、作業環境が悪くなるだけでなく、積層成形の際の
加熱加圧により、これら粉末が打痕となってしまってい
た。BACKGROUND ART Conventionally, a resin-impregnated base material is manufactured by immersing a base material such as paper, glass cloth, and woven fabric in a resin varnish tank to impregnate the resin, and then drying it with a drier. The material is cut to a predetermined size during lamination molding, but at this time or after cutting, powder such as resin powder and base material powder falls from the cutting part, which not only deteriorates the working environment but also during lamination molding. These powders had become dents due to heating and pressing.
［発明の目的］ 本発明は上記事情に鑑みて為されたものであり、その
目的とするところは切断部からの粉末の落下がなく、作
業環境を悪化させることがないだけでなく、積層成形に
際して打痕を発生させることがない樹脂含浸基材の製造
方法を提供することにある。[Object of the Invention] The present invention has been made in view of the above circumstances, and an object of the present invention is not only that the powder does not fall from the cutting portion and the working environment is not deteriorated, but also the laminated molding is performed. It is another object of the present invention to provide a method for producing a resin-impregnated base material that does not generate dents.
［発明の開示］ 本発明の樹脂含浸基材の製造方法は、基材に樹脂を含
浸させ乾燥させて形成され、積層成形に際して所定寸法
に切断される樹脂含浸基材１であって、切断部２に樹脂
粉及び基材粉等の粉末の落下防止層３を設けて成るもの
であり、この構成により上記目的を達成できたものであ
る。DISCLOSURE OF THE INVENTION A method for producing a resin-impregnated base material according to the present invention is a resin-impregnated base material 1 which is formed by impregnating a base material with a resin and dried, and cut into a predetermined size during lamination molding. 2 is provided with a fall prevention layer 3 for powder such as resin powder and base powder, and the above object can be achieved by this configuration.
本発明における基材としては紙、有機繊維により形成
した布、不織布、又はガラス、アスベスト等の無機繊維
の単独もしくは混紡による不織布を採用できる。この基
材としては厚さ0.08〜0.30mmのものを好適に使用でき
る。この基材を樹脂ワニスに浸漬して樹脂を含浸し、乾
燥させて樹脂含浸基材を形成するが、樹脂ワニスの樹脂
としてはフェノール樹脂、エポキシ樹脂、不飽和ポリエ
ステル樹脂等の熱硬化性樹脂とかポリイミド樹脂、ポリ
フェニレンポリサルファイド樹脂、ポリアミド樹脂等の
熱可塑性樹脂のいずれをも採用できる。この場合基材へ
の樹脂の含浸はワニス槽を減圧して減圧下で、又はワニ
ス槽内に配置した上下２個のロール間に基材を通すこと
により加圧した後、除圧して行う。加圧下の場合、例え
ばロールが３段で、圧力10kg/cm2下で含浸を行う。樹脂
の含浸量は固形分で35〜65重量％である。加圧下又は減
圧下で行うことにより、ワニス槽中での基材への気泡の
巻き込みを少なくできるものである。もちろん、大気圧
下で行ってもよい。このようにして基材に樹脂を含浸さ
せた後、100〜160℃で乾燥して樹脂含浸基材１を得る。
この樹脂含浸基材１は積層成形に際して、例えば、1m×
1mの大きさに切断される。切断部２には樹脂粉及び基材
粉等の粉末の落下防止層３が形成されている。この落下
防止層３は切断前に切断する箇所に形成される。落下防
止層３は、熱風を当てることで形成される。このよう
に、切断前に熱風を当てて加熱し、切断部２に樹脂粉の
落下防止層３を形成した後に切断することで、切断箇所
が柔軟な状態となっているので、切断の衝撃で生じる樹
脂粉の発生量が低減し、このため樹脂粉の飛散を抑制で
きるものである。As the substrate in the present invention, it is possible to employ paper, a cloth formed of organic fibers, a non-woven fabric, or a non-woven fabric formed by single or mixed spinning of inorganic fibers such as glass and asbestos. The base material having a thickness of 0.08 to 0.30 mm can be preferably used. This base material is dipped in a resin varnish to impregnate the resin and dried to form a resin-impregnated base material. The resin varnish resin may be a thermosetting resin such as phenol resin, epoxy resin or unsaturated polyester resin. Any of thermoplastic resins such as polyimide resin, polyphenylene polysulfide resin, and polyamide resin can be adopted. In this case, the resin is impregnated into the base material under reduced pressure in the varnish tank, or by pressing the base material between two upper and lower rolls arranged in the varnish tank to pressurize and then depressurize. In the case of applying pressure, impregnation is carried out, for example, with three rolls and a pressure of 10 kg / cm 2 . The amount of resin impregnated is 35 to 65% by weight in terms of solid content. By carrying out under pressure or under reduced pressure, it is possible to reduce the inclusion of bubbles in the substrate in the varnish tank. Of course, it may be performed under atmospheric pressure. In this way, the base material is impregnated with the resin and then dried at 100 to 160 ° C. to obtain the resin-impregnated base material 1.
This resin-impregnated base material 1 is, for example, 1 m ×
It is cut to a size of 1m. On the cutting portion 2, a fall prevention layer 3 for powder such as resin powder and base material powder is formed. The fall prevention layer 3 is formed at a portion to be cut before cutting. The fall prevention layer 3 is formed by applying hot air. As described above, by heating with hot air before cutting to form the fall prevention layer 3 of the resin powder on the cutting portion 2 and then cutting, the cut portion is in a flexible state, so that the cutting impact may occur. The amount of generated resin powder is reduced, and thus the scattering of resin powder can be suppressed.
この切断部２に落下防止層３が形成された樹脂含浸基
材１は所要枚数が重ねられ、その両面又は片面に金属箔
が配置され、このものが一組みとして複数組み上下二枚
の進行するベルト間に挟まれ、例えば10〜30kg/cm2、15
0〜170℃で加熱加圧され、いわゆるダブルプレスにより
連続成形されたり、あるいは、熱盤間に挟まれ、例えば
10〜30kg/cm2、40〜90min、150〜170℃で加熱加圧され
て積層成形され積層板が製造される。この場合、樹脂含
浸基材１からは粉末が落下しないだけでなく、得られた
積層板には打痕が全く発生しない。A required number of the resin-impregnated base materials 1 on which the fall prevention layer 3 is formed on the cut portion 2 are stacked, and metal foils are arranged on both sides or one side thereof. Sandwiched between belts, for example 10-30kg / cm 2 , 15
It is heated and pressurized at 0 to 170 ° C., continuously molded by a so-called double press, or sandwiched between hot plates, for example,
10 to 30 kg / cm 2 , 40 to 90 min, heated and pressed at 150 to 170 ° C., laminated and molded to produce a laminated plate. In this case, not only the powder does not fall from the resin-impregnated base material 1, but also the obtained laminated plate has no dent.
［発明の効果］ 本発明の樹脂含浸基材の製造方法にあっては、切断前
に加熱し、切断部に樹脂粉の落下防止層を形成した後に
切断するから、切断前に切断する箇所を高温に加熱して
切断箇所が柔軟な状態となっているので、切断の衝撃で
生じる樹脂粉の発生量が低減し、このため樹脂粉の飛散
を抑制でき、切断部からの粉末の落下がなく、作業環境
を悪化させることがないだけでなく、積層成形に際して
打痕を発生させることがない。[Effects of the Invention] In the method for producing a resin-impregnated base material of the present invention, heating is performed before cutting, and cutting is performed after the resin powder drop prevention layer is formed in the cutting portion. Since the cutting location is softened by heating to a high temperature, the amount of resin powder generated by the impact of cutting is reduced, so that the scattering of resin powder can be suppressed and the powder does not fall from the cutting part. Not only does it not worsen the working environment, but it does not cause dents during lamination molding.
第１図は本発明の一実施例を示す平面図であって、１は
樹脂含浸基材、２は切断部、３は落下防止層である。FIG. 1 is a plan view showing an embodiment of the present invention, in which 1 is a resin-impregnated base material, 2 is a cut portion, and 3 is a fall prevention layer.
Claims (1)
れ、積層成形に際して所定寸法に切断される樹脂含浸基
材の製造方法であって、切断前に加熱し、切断部に樹脂
粉の落下防止層を形成した後に切断することを特徴とす
る樹脂含浸基材の製造方法。1. A method of manufacturing a resin-impregnated base material, which is formed by impregnating a base material with a resin and dried, and is cut into a predetermined size during lamination molding. A method for producing a resin-impregnated base material, which comprises cutting after forming a fall prevention layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61164979A JP2504963B2 (en) | 1986-07-14 | 1986-07-14 | Method for producing resin-impregnated base material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61164979A JP2504963B2 (en) | 1986-07-14 | 1986-07-14 | Method for producing resin-impregnated base material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6322299A JPS6322299A (en) | 1988-01-29 |
| JP2504963B2 true JP2504963B2 (en) | 1996-06-05 |
Family
ID=15803523
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61164979A Expired - Lifetime JP2504963B2 (en) | 1986-07-14 | 1986-07-14 | Method for producing resin-impregnated base material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2504963B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2518237B2 (en) * | 1986-12-22 | 1996-07-24 | 日立化成工業株式会社 | Laminated board manufacturing method |
| DE60140524D1 (en) | 2001-06-12 | 2009-12-31 | Borealis Tech Oy | Optical cable with improved tracking resistance |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55113527A (en) * | 1979-02-23 | 1980-09-02 | Matsushita Electric Works Ltd | Production of resin-impregnated blank material |
| JPH06334B2 (en) * | 1985-03-15 | 1994-01-05 | 日立化成工業株式会社 | Prepreg manufacturing method |
-
1986
- 1986-07-14 JP JP61164979A patent/JP2504963B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6322299A (en) | 1988-01-29 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |