JP2503838B2 - Electronic device structure - Google Patents
Electronic device structureInfo
- Publication number
- JP2503838B2 JP2503838B2 JP4193046A JP19304692A JP2503838B2 JP 2503838 B2 JP2503838 B2 JP 2503838B2 JP 4193046 A JP4193046 A JP 4193046A JP 19304692 A JP19304692 A JP 19304692A JP 2503838 B2 JP2503838 B2 JP 2503838B2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- air
- casing
- circuit board
- electronic device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Structure Of Telephone Exchanges (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、例えばコンピュータ本
体、構内交換機（ＰＢＸ）、ボタン電話装置の主装置等
のような電子機器の基本的な構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the basic structure of electronic equipment such as a computer main body, a private branch exchange (PBX), and a main unit of a button telephone system.
【０００２】[0002]
【従来の技術】周知のように、例えばコンピュータ本
体、ＰＢＸ、ボタン電話装置の主装置等においては、シ
ステム全体や外部局線を統括する主な機能素子類を搭載
したマザーボードと、各端末機器や個別ボタン電話機を
制御する個別機能素子類を搭載した多数のプリント基板
とを筐体内部に組込むが、従来の電子機器は、内部素子
類等の過熱を防止するため、図５に示すような構造とさ
れている。2. Description of the Related Art As is well known, in computer main bodies, PBXs, main units of button telephones, etc., for example, a mother board on which main functional elements for controlling the entire system and an external station line are mounted, terminal devices, A large number of printed circuit boards equipped with individual function elements for controlling individual button telephones are incorporated into the housing, but conventional electronic devices have a structure as shown in FIG. 5 in order to prevent overheating of internal elements and the like. It is said that.
【０００３】即ち、図５は従来のボタン電話装置の主装
置内部の斜視図であり、外部局線を統括する主な機能素
子類を搭載したマザーボードＡは、シャーシＢに固定す
る一対の支持フレームＣ1 ，Ｃ2 に略垂直状態で配置さ
れる。そして、前記シャーシＢの表面には、前記マザー
ボードＡに対して直角な方向に伸びる多数の樹脂製ガイ
ドレールＤが固定され、これらのガイドレールＤには、
温度上昇した空気を上方に逃すように、垂直向きとされ
た多数のプリント基板Ｅが併設され、これらのプリント
基板Ｅに搭載する個別機能素子により個別電話機が制御
される。なお、図５中、符号”Ｆ”は前記マザーボード
Ａと各プリント基板Ｅとの間の電気的結合を行うコネク
タである。That is, FIG. 5 is a perspective view of the inside of the main unit of a conventional button telephone device, in which a mother board A on which main functional elements for controlling an external station line are mounted is a pair of support frames fixed to a chassis B. It is arranged in a substantially vertical state with respect to C 1 and C 2 . A large number of resin guide rails D extending in a direction perpendicular to the mother board A are fixed to the surface of the chassis B.
A large number of vertically oriented printed circuit boards E are provided side by side so that the air whose temperature has risen is released upward, and the individual functional devices mounted on these printed circuit boards E control individual telephones. In FIG. 5, reference numeral “F” is a connector for electrically coupling the mother board A and each printed circuit board E.
【０００４】[0004]
【発明が解決しようとする課題】ところで、最近のかか
る電話設備（電話システム）等においては、使用される
局線数の増加やボタン電話機の台数あるいは、機能の増
加に応じて、主装置の内部に組込むプリント基板Ｅの数
が増加する傾向にあるけれども、前述したような構造の
主装置では、占有面積が増大し、主装置の設置場所の確
保が困難になりつつある。つまり、前述したような主装
置の構造によると、プリント基板Ｅの増加によりマザー
ボードＡの面積も大になり、主装置の水平方向の寸法が
大きくなるため、狭いオフィス面積に占める割合が増大
するから、主装置を設置できる場所の確保が難しくなっ
ている。By the way, in the recent telephone equipment (telephone system) or the like, the inside of the main device is changed according to the increase in the number of office lines used, the number of button telephones, or the increase in functions. Although there is a tendency that the number of printed circuit boards E incorporated in the main device increases, the occupied area of the main device having the above-described structure increases, and it is becoming difficult to secure the installation place of the main device. That is, according to the structure of the main device as described above, the area of the mother board A also increases due to the increase in the printed circuit board E, and the size of the main device in the horizontal direction increases, so that the ratio of the small office area increases. , It is difficult to secure a place where the main device can be installed.
【０００５】そして、プリント基板Ｅの増加により、主
装置内部での発熱量が非常に大きくなり、各プリント基
板Ｅと平行な下から上への自然通風だけでは、プリント
基板Ｅに搭載された素子類の冷却が困難になり、強制フ
ァンモータの設置等が考慮されたり、空気冷却のために
余分な内部空間を設けている。しかしながら、このよう
な強制ファンモータの設置は、消費電力や静粛さが要求
される主装置の特性上好ましくはなく、余分な内部空間
の確保により、主装置が大型化して、占有面積が増大
し、電話機システムの商品性が阻害されることになる。
本発明の目的は、以上に述べたような従来の電子機器設
置上の問題に鑑み、内部に組込むプリント基板の数が増
加しても、占有面積が増大することがなく、プリント基
板に搭載された素子類を効果的に冷却できる電子機器構
造を提案するものである。Due to the increase in the number of the printed circuit boards E, the amount of heat generated inside the main device becomes very large, and the elements mounted on the printed circuit boards E can be obtained only by natural ventilation from the bottom to the top parallel to the respective printed circuit boards E. It becomes difficult to cool things, and installation of a forced fan motor is considered, and an extra internal space is provided for air cooling. However, the installation of such a forced fan motor is not preferable in view of the characteristics of the main device that requires power consumption and quietness, and by securing an extra internal space, the main device becomes larger and the occupied area increases. , The commercialability of the telephone system will be hindered.
In view of the conventional electronic device installation problems as described above, an object of the present invention is to mount on a printed circuit board without increasing the occupied area even if the number of printed circuit boards incorporated therein increases. We propose an electronic device structure that can effectively cool the above-mentioned elements.
【０００６】[0006]
【課題を解決するための手段】この目的を達成するた
め、本発明は、電子機器筐体の背面内部に略垂直方向に
延長するマザーボードを配置し、同マザーボードに対し
て電気的に接続される略水平な多数のプリント基板を電
子機器筐体内部を上下に仕切った状態で併設し、一側上
部の連絡口から加熱空気を放出する電源部筐体を最下位
の前記プリント基板の下部に設けると共に、最上位の前
記プリント基板の上部に内部加熱空気を外部に排出する
配線筐体を設け、前記プリント基板の一側から外部空気
を電子機器筐体内部へ導入できる空気吸込孔を筐体側部
に形成し、前記電源部筐体から前記配線筐体とを連絡し
かつ同電源部筐体で加熱された空気が上昇しかつ同上昇
気流により生じる負圧により前記空気吸込孔から外部空
気を取りこめる配線ダクト兼用の垂直方向の放熱ダクト
を前記連絡口の上部に接続して電子機器筐体側部に設け
ることを提案するものである。In order to achieve this object, according to the present invention, a mother board extending in a substantially vertical direction is arranged inside a rear surface of an electronic equipment casing and electrically connected to the mother board. A large number of substantially horizontal printed circuit boards are installed side by side inside the electronic device housing, and a power supply housing that discharges heated air from the communication opening on one side is provided below the lowest printed circuit board. At the same time, a wiring casing for discharging the internally heated air to the outside is provided on the uppermost printed circuit board, and an air suction hole for introducing the external air into the electronic device housing from one side of the printed circuit board is provided on the housing side portion. The power supply housing communicates with the wiring housing, and the air heated in the power supply housing rises and the negative pressure generated by the rising airflow draws external air from the air suction hole. Wiring It proposes a provision to an electronic device case side portion of the vertical heat radiation duct transfected serves to connect the upper portion of the communication port.
【０００７】[0007]
【実施例】以下、図１から図４について本発明の実施例
の詳細を説明する。図示実施例は、本発明をボタン電話
装置の主装置に施した場合の実施例であり、前側板を取
除いて示す図１に示すように、この主装置は、発熱を伴
う電源トランスやパワートランジスタ等を収容する電源
部筐体１を備えている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The details of the embodiments of the present invention will be described below with reference to FIGS. The illustrated embodiment is an embodiment in which the present invention is applied to a main device of a button telephone device. As shown in FIG. 1 in which a front side plate is removed, the main device is a power transformer and a power generator that generate heat. A power supply unit housing 1 that accommodates transistors and the like is provided.
【０００８】そして、前記電源部筐体１の上部には、左
右方向に対向した垂直方向の一対の支持フレーム２Ｌ，
２Ｒが固定され、これらの支持フレーム２Ｌ，２Ｒの上
部に外部結線や内部配線を収容する配線筐体３が配置さ
れる。これらの支持フレーム２Ｌ，２Ｒの後側部間に
は、図３に示すマザーボード４が垂直状態を保って固定
ねじ（図示せず）等で固定される。前記支持フレーム２
Ｌ，２Ｒの表面には大面積の通風窓２ａが形成され、こ
れらの通風窓２ａを通って、主装置内部の空気の流通状
態が保たれる。勿論、同マザーボード４には、システム
全体や外部局線を統括する主な機能素子類が搭載され
る。A pair of vertical support frames 2L, which oppose each other in the left-right direction, are provided on the upper portion of the power supply unit casing 1.
2R is fixed, and a wiring housing 3 for accommodating external connections and internal wirings is arranged above these support frames 2L, 2R. The mother board 4 shown in FIG. 3 is fixed between the rear side portions of the support frames 2L and 2R with a fixing screw (not shown) or the like in a vertical state. The support frame 2
Large-area ventilation windows 2a are formed on the surfaces of L and 2R, and the air circulation state inside the main device is maintained through these ventilation windows 2a. Of course, the motherboard 4 is equipped with main functional elements that control the entire system and the external line.
【０００９】また、前記支持フレーム２Ｌ，２Ｒの各対
向面には、図２に示すように、左右方向に対向した複数
対の基板ホルダ５Ｌ，５Ｒが上下方向に整列した状態で
取付ねじ６で固定される。図４に示すように、樹脂成形
されるこれらの基板ホルダ５Ｌ，５Ｒは、前記マザーボ
ード４に電気的に接続されるプリント基板７の左右端部
を受入れる水平方向の複数のガイド溝５ａを対向面に備
えており、したがって、これらのガイド溝５ａにプリン
ト基板７の左右端部が受入れられた状態では、水平方向
に延長する各プリント基板７は上下方向に整列した状態
となる。これらの基板ホルダ５Ｌ，５Ｒの表面には内部
空気の流通性を改善する複数の開放窓５ｂが形成され、
これらの開放窓５ｂ及び前記通風窓２ａを通って主装置
内部の水平方向の通風状態が改善される。Further, as shown in FIG. 2, a plurality of pairs of substrate holders 5L, 5R facing each other in the left-right direction are vertically aligned on each of the facing surfaces of the supporting frames 2L, 2R with a mounting screw 6. Fixed. As shown in FIG. 4, the resin-molded substrate holders 5L and 5R have a plurality of horizontal guide grooves 5a for receiving the left and right end portions of the printed circuit board 7 electrically connected to the mother board 4 and facing each other. Therefore, when the left and right ends of the printed circuit board 7 are received in these guide grooves 5a, the printed circuit boards 7 extending in the horizontal direction are aligned in the vertical direction. A plurality of open windows 5b are formed on the surfaces of these substrate holders 5L and 5R to improve the flowability of internal air.
The ventilation state in the horizontal direction inside the main unit is improved through the open window 5b and the ventilation window 2a.
【００１０】図２に示すように、主装置の左右側面は、
前記電源部筐体１と前記配線筐体３との間のケーシング
の一部を構成する左右側板８Ｌ，８Ｒで覆われ、右側板
８Ｒと右支持フレーム２Ｒとの間には、加熱された内部
空気を上方へ導ける放熱ダクト９が形成される。前記プ
リント基板７及び前記マザーボード４との間の配線ダク
トを兼ねる同放熱ダクト９に臨む前記電源部筐体１の天
板１ａ及び前記配線筐体３の底板３ａには、前記電源部
筐体１中で加熱された空気を放熱ダクト９へ流出できる
連絡口１ｂ及び同放熱ダクト９内の空気を前記配線筐体
３中へ流出させる連結口３ｂがそれぞれ形成される。As shown in FIG. 2, the left and right side surfaces of the main unit are
The left and right side plates 8L and 8R forming a part of the casing between the power supply unit housing 1 and the wiring housing 3 are covered with a heated interior between the right side plate 8R and the right support frame 2R. A heat dissipation duct 9 that guides air upward is formed. The power supply unit housing 1 is mounted on the top plate 1a of the power supply unit housing 1 and the bottom plate 3a of the power supply unit housing 1 facing the heat dissipation duct 9 which also serves as a wiring duct between the printed circuit board 7 and the mother board 4. A communication port 1b through which the air heated in the heat radiation duct 9 can flow out and a connection port 3b through which the air in the heat radiation duct 9 flows into the wiring housing 3 are formed.
【００１１】そして、前記電源部筐体１の側面には、温
度の低い外部空気を電源部筐体１中に取入れる空気取入
口１ｃが、前記配線筐体３の上側部には空気取出口３ｃ
がそれぞれ形成され、電源部筐体１の内部での加熱によ
り軽くなった空気が前記放熱ダクト９へ導かれ、同放熱
ダクト９の上部の連結口３ｂから流出した加熱空気が空
気取出口３ｃから外部へ放出される。An air inlet 1c for taking in low-temperature external air into the power source housing 1 is provided on a side surface of the power source housing 1, and an air outlet is provided at an upper portion of the wiring housing 3. 3c
Are formed respectively, and the air lightened by the heating inside the power source housing 1 is guided to the heat dissipation duct 9, and the heated air flowing out from the connection port 3b at the upper part of the heat dissipation duct 9 is discharged from the air outlet 3c. It is released to the outside.
【００１２】一方、図１に示すように、左側板８Ｌには
主装置の内部に外部空気を取入れる多数の空気吸込孔１
０が、また、右側板８Ｒには圧力の低い前記放熱ダクト
９へ外部空気を上向きに流入させる側面流入口１１が形
成される。On the other hand, as shown in FIG. 1, the left side plate 8L has a large number of air suction holes 1 for taking in external air into the main unit.
No. 0, and the right side plate 8R is formed with a side surface inlet 11 through which external air flows upward into the heat dissipation duct 9 having a low pressure.
【００１３】図３に示すように、前記マザーボード４の
表面には、前述したガイド溝５ａの上下方向の配列ピッ
チに対応して上下方向に配列される多数のコネクタ・ソ
ケット１２が固定され、これらのコネクタ・ソケット１
２に対応する前記各プリント基板７の後端部に、対応コ
ネクタ・ソケット１２に係合できるコネクタ・プラグ１
３がそれぞれ固定される。図４に示すように、各基板ホ
ルダ５Ｌ，５Ｒのガイド溝５ａの前端部には、不用意な
プリント基板７の抜出しを防止するストッパ５ｃがそれ
ぞれ一体成形され、これらのストッパ５ｃに対応した各
プリント基板７の前端部左右には、弾性を与えられたロ
ック爪１４が固定される。即ち、各プリント基板７に片
持的に支持される各ロック爪１４は、図４に示すよう
に、対応ストッパ５ｃに係合できる突起14a 及び指先で
つまめるハンドル部14b を備えている。As shown in FIG. 3, on the surface of the motherboard 4, a large number of connector sockets 12 arranged in the vertical direction corresponding to the vertical arrangement pitch of the guide grooves 5a are fixed. Connector socket 1
The connector plug 1 which can be engaged with the corresponding connector socket 12 at the rear end portion of each printed circuit board 7 corresponding to 2.
3 are fixed respectively. As shown in FIG. 4, stoppers 5c for preventing careless removal of the printed circuit board 7 are integrally formed at the front end portions of the guide grooves 5a of the respective substrate holders 5L and 5R. Elasticized locking claws 14 are fixed to the left and right of the front end of the printed circuit board 7. That is, as shown in FIG. 4, each lock claw 14 cantileveredly supported by each printed circuit board 7 is provided with a protrusion 14a that can be engaged with the corresponding stopper 5c and a handle portion 14b that can be gripped by a fingertip.
【００１４】各プリント基板７の電圧の安定化を図るた
め、左側基板ホルダ５Ｌのガイド溝５ａには接触子１５
が配置され、これらの接触子１５とプリント基板７のグ
ランド金具１６との接触によりグランド導体への電気的
な導通が行われる。In order to stabilize the voltage of each printed circuit board 7, the contact 15 is provided in the guide groove 5a of the left substrate holder 5L.
Are arranged, and the contact between these contacts 15 and the ground metal fitting 16 of the printed circuit board 7 allows electrical conduction to the ground conductor.
【００１５】図示実施例は、以上のような構造であるか
ら、外部局線数が増加したり、端末ボタン電話機が増加
しても、設置面積（占有面積）が変化しない商品性の高
い構造を得ることができる。即ち、局線数や端末ボタン
電話機が増加しても、図示例では、上下方向に整列され
るプリント基板７の数及びマザーボード４の垂直方向の
面積が大きくなるだけであるから、占有面積が小さく、
狭いオフィスであっても、机の下等に設置できる主装置
を得ることができる。Since the illustrated embodiment has the above-mentioned structure, a structure having a high commercial property in which the installation area (occupied area) does not change even if the number of external office lines or the number of terminal button telephones increases Obtainable. That is, even if the number of station lines and the number of terminal buttons and telephones increase, in the illustrated example, the number of the printed circuit boards 7 aligned in the vertical direction and the vertical area of the mother board 4 only increase, so the occupied area is small. ,
Even in a small office, it is possible to obtain a main device that can be installed under a desk or the like.
【００１６】図示実施例の主装置は、故障やメンテナン
ス時の取扱の点でも、非常に有利である。つまり、マザ
ーボード４から希望するプリント基板７を取外すには、
ロック爪１４のハンドル部14b を押下げてプリント基板
７を手前に引くと、ロック爪１４の突起14a が基板ホル
ダ５Ｌ，５Ｒのストッパ５ｃから外れるため、同ハンド
ル部14b をつまんで手前に引くだけで、希望するプリン
ト基板７を外すことができる。また、マザーボード４に
プリント基板７を接続するには、プリント基板７の左右
端部を基板ホルダ５Ｌ，５Ｒのガイド溝５ａに挿入し、
マザーボード４の方向に同プリント基板７を押込むだけ
で、マザーボード４のコネクタ・ソケット１２にプリン
ト基板７のコネクタ・プラグ１３が係合し、ストッパ５
ｃにプリント基板７のロック爪１４が係合してプリント
基板７が不用意に抜出さなくなる。The main device of the illustrated embodiment is also very advantageous in terms of handling during failure or maintenance. In other words, to remove the desired printed circuit board 7 from the motherboard 4,
When the handle 14b of the lock claw 14 is pushed down and the printed circuit board 7 is pulled to the front, the protrusion 14a of the lock claw 14 is disengaged from the stopper 5c of the substrate holders 5L, 5R. Then, the desired printed circuit board 7 can be removed. To connect the printed board 7 to the mother board 4, the left and right ends of the printed board 7 are inserted into the guide grooves 5a of the board holders 5L and 5R,
By simply pushing the printed circuit board 7 in the direction of the mother board 4, the connector socket 12 of the mother board 4 is engaged with the connector plug 13 of the printed circuit board 7, and the stopper 5
The lock claw 14 of the printed circuit board 7 is engaged with c so that the printed circuit board 7 does not come out carelessly.
【００１７】図２から理解されるように、主装置の内部
は上下方向に隣合う多数のプリント基板７で仕切られた
風路状態となり、内部発熱で加熱された電源部筐体１中
の空気は、密度の低下により軽くなり、連絡口１ｂを通
って放熱ダクト９中へ流入し、同放熱ダクト９内を上昇
して連結口３ｂから配線筐体３内へ流入し、同配線筐体
３の空気取出口３ｃから外部へ流出する。As can be seen from FIG. 2, the inside of the main unit is in an air passage state partitioned by a large number of vertically adjacent printed circuit boards 7, and the air in the power supply unit casing 1 heated by internal heat generation. Becomes lighter due to the decrease in density, flows into the heat dissipation duct 9 through the communication port 1b, rises in the heat dissipation duct 9 and flows into the wiring casing 3 from the connection port 3b. Out of the air outlet 3c.
【００１８】この場合、放熱ダクト９内の圧力低下によ
り、左側板８Ｌ，８Ｒの取入口及び右側板８Ｌ，８Ｒの
側面流入口１１から低温の外部空気が放熱ダクト９中に
吸込まれる。したがって、各プリント基板７の間には取
入口から放熱ダクト９に向かった空気流が生じるため、
搭載された素子類の発熱により温度上昇したプリント基
板７付近の空気は、同空気流により常に外部へ排出され
ることになる。この結果、主装置の内部へ組入れるプリ
ント基板７は、温度上昇することがないため、特別にフ
ァンモータ等により強制排気しなくとも、内部を常に冷
却できる。In this case, due to the pressure drop in the heat radiation duct 9, low-temperature external air is sucked into the heat radiation duct 9 through the inlets of the left side plates 8L, 8R and the side surface inlets 11 of the right side plates 8L, 8R. Therefore, an air flow from the inlet toward the heat dissipation duct 9 is generated between the printed circuit boards 7,
The air around the printed circuit board 7 whose temperature has risen due to the heat generated by the mounted elements is always discharged to the outside by the same air flow. As a result, the temperature of the printed circuit board 7 incorporated in the main device does not rise, so that the internal space can be always cooled without special forced exhaust by a fan motor or the like.
【００１９】また、図示実施例の構造では、外部配線の
余長部やプリント基板７相互間の配線は、放熱ダクト９
中に処理すればよいので、配線処理作業が簡単でコンパ
クトな構造を得ることができる。In the structure of the illustrated embodiment, the extra length of the external wiring and the wiring between the printed circuit boards 7 are connected to each other through the heat radiation duct 9.
Since it is only necessary to process the wiring inside, it is possible to obtain a compact structure in which the wiring processing work is simple.
【００２０】なお、前記実施例においては、本発明をボ
タン電話機の主装置に施した例を説明したけれども、本
発明は、この例に限定されるものではなく、他の電子機
器にも適用可能であるのは、指摘するまでもない。Although the present invention is applied to the main unit of the button telephone in the above embodiment, the present invention is not limited to this example and can be applied to other electronic devices. It goes without saying.
【００２１】[0021]
【発明の効果】以上の説明から明らかなように、本発明
によれば、発熱量の大きな電源部筐体とプリント基板と
が熱的に隔絶されるばかりでなく、同電源部筐体内部で
温度上昇した空気が放熱ダクトを通って外部に放出され
る際、プリント基板の付近には、同放熱ダクトからの吸
引によって低温の外部空気が吸入されるため、プリント
基板付近は常に低温状態に保たれることになる。したが
って、本発明によれば、プリント基板の冷却のために、
特別のファンモータを設置する必要がなくなり、静粛な
稼動が可能で、製造原価の割安な電子機器を得ることが
できる。また、本発明の電子機器においては、略水平方
向に向けた多数のプリント基板を垂直方向に配列するた
め、プリント基板の数が増加しても、設置面積が増大す
ることがない効果を得ることができる。As is apparent from the above description, according to the present invention, not only is the power source unit casing, which generates a large amount of heat, and the printed circuit board thermally isolated, but also inside the power source unit casing. When the temperature-increased air is discharged to the outside through the heat dissipation duct, low temperature outside air is sucked into the vicinity of the printed circuit board by suction from the heat dissipation duct. You will be drunk. Therefore, according to the present invention, for cooling the printed circuit board,
There is no need to install a special fan motor, quiet operation is possible, and electronic equipment with low manufacturing cost can be obtained. Further, in the electronic device of the present invention, a large number of printed circuit boards oriented in the substantially horizontal direction are arranged in the vertical direction. Therefore, even if the number of printed circuit boards is increased, the installation area is not increased. You can
【図面の簡単な説明】[Brief description of drawings]
【図１】前側板を取除いて示す本考案によるボタン電話
装置の主装置の分解斜視図である。FIG. 1 is an exploded perspective view of a main unit of a key telephone device according to the present invention, showing a front plate removed.
【図２】同主装置の垂直断面図である。FIG. 2 is a vertical sectional view of the main device.
【図３】同主装置に用いるマザーボード廻りの要部拡大
分解斜視図である。FIG. 3 is an enlarged exploded perspective view of a main part around a motherboard used in the main device.
【図４】同主装置に用いる基板ホルダの斜視図である。FIG. 4 is a perspective view of a substrate holder used in the main device.
【図５】従来の電子機器の略図的斜視図である。FIG. 5 is a schematic perspective view of a conventional electronic device.
１ 電源部筐体 ３ 配線筐体 ４ マザーボード ７ プリント基板 ９ 放熱ダクト １０ 空気吸込孔 1 Power Supply Case 3 Wiring Case 4 Motherboard 7 Printed Circuit Board 9 Heat Dissipation Duct 10 Air Suction Hole
Claims (1)
延長するマザーボードを配置し、同マザーボードに対し
て電気的に接続される略水平な多数のプリント基板を電
子機器筐体内部を上下に仕切った状態で併設し、一側上
部の連絡口から加熱空気を放出する電源部筐体を最下位
の前記プリント基板の下部に設けると共に、最上位の前
記プリント基板の上部に内部加熱空気を外部に排出する
配線筐体を設け、前記プリント基板の一側から外部空気
を電子機器筐体内部へ導入できる空気吸込孔を筐体側部
に形成し、前記電源部筐体から前記配線筐体とを連絡し
かつ同電源部筐体で加熱された空気が上昇しかつ同上昇
気流により生じる負圧により前記空気吸込孔から外部空
気を取りこめる配線ダクト兼用の垂直方向の放熱ダクト
を前記連絡口の上部に接続して電子機器筐体側部に設け
たことを特徴とする電子機器構造。1. A mother board extending in a substantially vertical direction is arranged inside a rear surface of an electronic equipment casing, and a large number of substantially horizontal printed boards electrically connected to the mother board are vertically arranged inside the electronic equipment casing. It is installed side by side in a state of being divided into two parts, and a power supply unit housing that discharges heated air from the communication opening on one side is provided at the bottom of the lowest printed circuit board, and internal heated air is provided at the top of the highest printed circuit board. A wiring casing for discharging to the outside is provided, and an air suction hole for introducing external air into the electronic device casing from one side of the printed circuit board is formed in the casing side portion, and the power supply unit casing is connected to the wiring casing. A vertical heat radiation duct that also serves as a wiring duct for taking in external air from the air suction hole by negative pressure generated by the rising air and the heated air in the power supply unit Upper part An electronic device structure, characterized in that the electronic device structure is provided on a side part of an electronic device housing connected to the.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4193046A JP2503838B2 (en) | 1992-06-25 | 1992-06-25 | Electronic device structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4193046A JP2503838B2 (en) | 1992-06-25 | 1992-06-25 | Electronic device structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0677680A JPH0677680A (en) | 1994-03-18 |
| JP2503838B2 true JP2503838B2 (en) | 1996-06-05 |
Family
ID=16301280
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4193046A Expired - Fee Related JP2503838B2 (en) | 1992-06-25 | 1992-06-25 | Electronic device structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2503838B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7365976B2 (en) * | 2006-03-24 | 2008-04-29 | Fujitsu Limited | Electronic apparatus |
| JP2011082466A (en) * | 2009-10-09 | 2011-04-21 | Hitachi High-Tech Instruments Co Ltd | Control box, and electronic component mounting device |
| DE102010049605A1 (en) * | 2010-08-23 | 2012-02-23 | Rohde & Schwarz Gmbh & Co. Kg | Box housing and manufacturing process |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58180691U (en) * | 1982-05-26 | 1983-12-02 | 東芝エンジニアリング株式会社 | housing |
| JPH0276889U (en) * | 1988-11-30 | 1990-06-13 |
-
1992
- 1992-06-25 JP JP4193046A patent/JP2503838B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0677680A (en) | 1994-03-18 |
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