JP2024050236A - Circuit board packing body and method for manufacturing circuit board packing body - Google Patents
Circuit board packing body and method for manufacturing circuit board packing body Download PDFInfo
- Publication number
- JP2024050236A JP2024050236A JP2022156971A JP2022156971A JP2024050236A JP 2024050236 A JP2024050236 A JP 2024050236A JP 2022156971 A JP2022156971 A JP 2022156971A JP 2022156971 A JP2022156971 A JP 2022156971A JP 2024050236 A JP2024050236 A JP 2024050236A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- sealing member
- packaging container
- humidity
- less
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 25
- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 238000012856 packing Methods 0.000 title abstract description 14
- 238000007789 sealing Methods 0.000 claims abstract description 88
- 239000000463 material Substances 0.000 claims abstract description 68
- 229910052751 metal Inorganic materials 0.000 claims abstract description 40
- 239000002184 metal Substances 0.000 claims abstract description 40
- 229910000679 solder Inorganic materials 0.000 claims abstract description 33
- 239000011347 resin Substances 0.000 claims abstract description 19
- 229920005989 resin Polymers 0.000 claims abstract description 19
- 238000004806 packaging method and process Methods 0.000 claims description 94
- 238000001035 drying Methods 0.000 claims description 24
- 239000002274 desiccant Substances 0.000 claims description 9
- 230000035699 permeability Effects 0.000 claims description 9
- 239000000470 constituent Substances 0.000 claims description 7
- 229940123973 Oxygen scavenger Drugs 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 11
- 238000003860 storage Methods 0.000 description 9
- 238000012360 testing method Methods 0.000 description 9
- 239000000919 ceramic Substances 0.000 description 8
- -1 polyethylene terephthalate Polymers 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
- 230000007613 environmental effect Effects 0.000 description 5
- 239000001301 oxygen Substances 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000006096 absorbing agent Substances 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 238000005304 joining Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000011160 research Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000007872 degassing Methods 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 238000009461 vacuum packaging Methods 0.000 description 1
Landscapes
- Packages (AREA)
- Packaging Frangible Articles (AREA)
Abstract
Description
本発明は、回路基板梱包体及び回路基板梱包体の製造方法に関する。 The present invention relates to a circuit board package and a method for manufacturing a circuit board package.
回路基板は、搬送時やハンドリング時における基板の破損や表面の傷発生等を防ぐ必要があり、回路基板の周囲や表面を保護する各種の梱包体が知られている。例えば、特許文献１のように複数枚の回路基板を搬送する際に用いられる梱包容器や、特許文献２のように樹脂袋内に回路基板が挿入された梱包体等がある。そして、特許文献２の梱包体は、内部に乾燥剤を備えた樹脂袋を真空梱包することにより、傷発生防止等に加え、梱包体の内部の湿度上昇を抑制可能な構成となっている。 Circuit boards need to be protected from damage and surface scratches during transportation and handling, and various types of packaging are known to protect the surroundings and surface of circuit boards. For example, there is a packaging container used when transporting multiple circuit boards as in Patent Document 1, and a packaging in which a circuit board is inserted into a resin bag as in Patent Document 2. The packaging in Patent Document 2 is configured to prevent scratches and suppress an increase in humidity inside the packaging by vacuum packaging a resin bag with a desiccant inside.
上記梱包体により搬送される回路基板としては、例えば、樹脂やセラミックス等の基材に金属部材が接合された回路基板がある。これらの回路基板は、梱包後に搬送され、後工程では金属部材にハンダ等で別部材が接合されて回路形成が行われる。この後工程において、特許文献２のように真空梱包された回路基板であっても、金属部材表面への別部材の接合が十分に行われないことがあった。 The circuit boards transported in the above-mentioned package include, for example, circuit boards in which a metal member is bonded to a base material such as resin or ceramic. These circuit boards are transported after being packaged, and in a post-process, a separate member is bonded to the metal member with solder or the like to form a circuit. In this post-process, even in the case of a vacuum-packaged circuit board as in Patent Document 2, there are cases in which the separate member is not bonded sufficiently to the surface of the metal member.
上記した回路基板搬送後において別部材の接合等も良好に行なえる梱包体を提供すべく本発明者等は検討を行った。そして、搬送後の保管時に金属部材の表面特性に影響が出る場合があると考え、この表面特性としてはんだ濡れ性に着目することとした。 The inventors conducted research to provide a package that would allow for good joining of other components to the circuit board after it was transported. They also considered that the surface characteristics of the metal components might be affected during storage after transport, and decided to focus on solder wettability as one of the surface characteristics.
かかる本発明は、基材に金属部材が接合された回路基板の梱包体であって、回路基板における金属部材の表面のはんだ濡れ性が低下しにくい回路基板梱包体を提供する。 The present invention provides a package for a circuit board in which a metal member is bonded to a base material, in which the solder wettability of the surface of the metal member in the circuit board is not easily reduced.
本発明の第１の態様は、基板に金属部材が接合された回路基板と、
樹脂材料により構成され、前記回路基板が収容された梱包容器と、
前記梱包容器が内部に収容された封止部材と、を備え、
室温６０℃、湿度８５％の雰囲気下、前記封止部材の内部が封止された状態で２４時間保管したときに、前記内部の湿度が４０％以下である、
回路基板梱包体である。
A first aspect of the present invention is a circuit board having a metal member bonded to a substrate;
a packaging container made of a resin material and accommodating the circuit board;
A sealing member in which the packaging container is housed,
When the inside of the sealing member is stored for 24 hours in an atmosphere of room temperature 60° C. and humidity 85%, the humidity inside is 40% or less.
A circuit board package.
本発明の第２の態様は、前記梱包容器の構成材料の水分量が０．５ｗｔ％以下である、第１の態様に記載の回路基板梱包体である。 The second aspect of the present invention is the circuit board package described in the first aspect, in which the moisture content of the constituent material of the packaging container is 0.5 wt % or less.
本発明の第３の態様は、前記封止部材の形成材料の透湿度が６．０ｇ／ｍ２以下である、第１の態様又は第２の態様に記載の回路基板梱包体である。 A third aspect of the present invention is the circuit board package according to the first or second aspect, wherein the sealing member is made of a material having a moisture permeability of 6.0 g/ m2 or less.
本発明の第４の態様は、前記梱包容器の形成材料の引張り強さは、２５ＭＰａ以上８０ＭＰａ以下であるである、第１の態様から第４の態様のいずれかに記載の回路基板梱包体である。 The fourth aspect of the present invention is a circuit board package according to any one of the first to fourth aspects, in which the tensile strength of the material forming the packaging container is 25 MPa or more and 80 MPa or less.
本発明の第５の態様は、脱酸素剤又は乾燥剤のいずれか一種以上を前記封止部材内に備える、第１の態様から第５の態様のいずれかに記載の回路基板梱包体である。 The fifth aspect of the present invention is a circuit board package according to any one of the first to fifth aspects, in which at least one of an oxygen scavenger or a desiccant is provided in the sealing member.
本発明の第６の態様は、室温６０℃、湿度８５％の雰囲気下、前記封止部材の内部が封止された状態で３３６時間保管したときに、前記金属部材の表面のはんだ濡れ性が４７．５％以上である、第１の態様から第３の態様のいずれかに記載の回路基板梱包体である。 The sixth aspect of the present invention is a circuit board package according to any one of the first to third aspects, in which the solder wettability of the surface of the metal member is 47.5% or more when stored for 336 hours in an atmosphere of room temperature 60°C and humidity 85% with the inside of the sealing member sealed.
本発明の第７の態様は、基板に金属部材が接合された回路基板を梱包容器に収容する収容工程と、
前記梱包容器を封止部材内に配置し、前記封止部材の内部を封止する封止工程と、を有し、
室温６０℃、相対湿度８５％の雰囲気下、前記封止部材の内部が封止された状態で２４時間保管したときに、前記内部の湿度が４０％以下となる、
回路基板梱包体の製造方法である。
A seventh aspect of the present invention is a method for manufacturing a circuit board, the method comprising:
and a sealing step of placing the packaging container in a sealing member and sealing the inside of the sealing member,
When the inside of the sealing member is stored for 24 hours in an atmosphere of room temperature 60° C. and relative humidity 85%, the humidity inside the sealing member is 40% or less.
A method for manufacturing a packaged circuit board.
本発明の第８の態様は、前記収容工程の前に、前記梱包容器の構成材料を水分量０．４ｗｔ％以下にする乾燥工程を有する、第７の態様に記載の回路基板梱包体の製造方法である。 The eighth aspect of the present invention is a method for manufacturing a circuit board package according to the seventh aspect, which includes a drying step for reducing the moisture content of the constituent material of the packaging container to 0.4 wt % or less before the storage step.
本発明の回路基板梱包体によれば、回路基板の金属部材の表面のはんだ濡れ性が低下しにくいものとなる。 The circuit board package of the present invention makes it difficult for the solder wettability of the surface of the metal components of the circuit board to decrease.
＜発明者の知見＞
梱包体により搬送される回路基板では、基材としてセラミックス等の脆性破壊しやすい材料が使用されることがある。この場合、回路基板の損壊防止のため、梱包体には衝撃吸収性を有することが求められる。また、基材に接合される金属部材の重量によっては、梱包体に強度が求められることもある。このように、梱包対象となる回路基板の構成に応じて、梱包体には耐衝撃性や強度が求められることがある。
<Inventor's Findings>
In the circuit boards transported in the package, a material that is prone to brittle fracture, such as ceramics, may be used as the base material. In this case, the package is required to have shock absorbing properties in order to prevent damage to the circuit boards. Depending on the weight of the metal members bonded to the base material, the package may also be required to have strength. Thus, the package may be required to have shock resistance and strength depending on the configuration of the circuit boards to be packaged.
このため本発明者等は、梱包体を構成する梱包容器の構成材料や形状等について鋭意検討し、所定の樹脂材料を梱包容器として使用することで、回路基板が脆性破壊しにくく、重量のある金属部材を有する回路基板も搬送容易となる梱包体に想到した。 The inventors therefore conducted extensive research into the materials and shapes of the packaging containers that make up the package, and came up with the idea of using a specific resin material as the packaging container to make the package less susceptible to brittle fracture of circuit boards and to make it easier to transport even circuit boards that have heavy metal components.
しかしながら、梱包容器を用いた梱包体において、回路基板を搬送した後に金属部材表面に別部材等を接合する後工程を行った際、接合不良等を生じる場合があった。このため本発明者等は、この接合不良の原因について、さらに鋭意検討した。その結果、梱包容器として選定する樹脂材料の種類によっては、樹脂素材中に吸収されていた水分が想定外に梱包体内の湿度変化に影響する場合があることを見出した。具体的には、樹脂中の水分が梱包体の封止後に徐々に発散することがあり、例えば梱包体の封止時に湿度環境を調整した場合であっても、梱包体を所定期間保管した際、経時変化により内部の湿度が上昇することがあった。そして、湿度が上昇した梱包体内部では、雰囲気中の水分が金属部材の表面に物理的又は化学的に吸着し、表面特性に影響を及ぼす場合があった。 However, in a package using a packaging container, when a post-process is performed in which another member or the like is joined to the surface of the metal member after the circuit board is transported, poor joining and the like may occur. For this reason, the present inventors further investigated the cause of this poor joining. As a result, they found that, depending on the type of resin material selected for the packaging container, moisture absorbed in the resin material may unexpectedly affect humidity changes inside the package. Specifically, moisture in the resin may gradually dissipate after the package is sealed, and even if the humidity environment is adjusted when the package is sealed, the humidity inside the package may increase due to changes over time when the package is stored for a certain period of time. Then, inside the package where the humidity has increased, moisture in the atmosphere may physically or chemically adsorb onto the surface of the metal member, affecting the surface characteristics.
このような知見に基づき、本発明者等は、梱包容器を用いた梱包体であっても、所定期間保管した際に、内部の湿度が所定以下となる回路基板梱包体について鋭意検討し、上記課題を解決する本発明の梱包体を完成するに至った。 Based on this knowledge, the inventors have conducted extensive research into a package for circuit boards that uses a packaging container and that has an internal humidity level below a specified level after storage for a specified period of time, and have completed the package of the present invention that solves the above-mentioned problems.
＜本開示の一態様＞
本開示の一態様は、図面を参照しつつ、以下のように説明される。
<One aspect of the present disclosure>
One aspect of the present disclosure will be described as follows with reference to the drawings.
（１）回路基板梱包体の構成
図１Ａ及び図１Ｂは、本態様における回路基板梱包体１０の概略図およびＡ－Ｂ間の断面図である。回路基板梱包体１０は、回路基板１００と、梱包容器２００と、封止部材３００と、を備える。
1A and 1B are a schematic diagram and a cross-sectional view taken along line A-B of a circuit board package 10 according to this embodiment. The circuit board package 10 includes a circuit board 100, a packaging container 200, and a sealing member 300.
回路基板１００は、図２のように、基材１１０に金属部材１２０が接合されて構成される。基材１１０と金属部材１２０は、任意の接合方法で接合されていてよく、基材１１０と金属部材１２０との間に任意の層を有していても構わない。例えば、基材１１０と金属部材１２０は、ろう材を介して接合されたものとしてよい。また、金属部材１２０は、基材１１０の主面のいずれか一面に接合していればよく、基材１１０の両面に接合されていてもよい。基材１１０としては、任意の材料を用いてよい。例えば、基材１１０は、樹脂やセラミックス等から形成されるものとしてよく、特にセラミックスから形成されるものが好ましい。セラミックスとしては、窒化ケイ素、窒化アルミ等から形成された基材１１０が好ましい。金属部材１２０は、任意の金属又は合金から形成されるものを適用してよい。例えば、金属部材１２０は、銅、アルミ、又は、これらの一種以上からなる合金から形成されるものであってよい。 As shown in FIG. 2, the circuit board 100 is configured by bonding a metal member 120 to a base material 110. The base material 110 and the metal member 120 may be bonded by any bonding method, and any layer may be provided between the base material 110 and the metal member 120. For example, the base material 110 and the metal member 120 may be bonded via a brazing material. The metal member 120 may be bonded to either one of the main surfaces of the base material 110, or may be bonded to both sides of the base material 110. Any material may be used as the base material 110. For example, the base material 110 may be formed from a resin or ceramics, and is preferably formed from ceramics. As ceramics, the base material 110 formed from silicon nitride, aluminum nitride, or the like is preferable. The metal member 120 may be formed from any metal or alloy. For example, the metal member 120 may be formed from copper, aluminum, or an alloy of at least one of these.
梱包容器２００は、図２のように回路基板１００が収容されるように構成される。梱包容器２００における回路基板１００の収容方式は特に限定されない。また、回路基板１００の破損防止や搬送時のハンドリング等の利用目的に応じて、梱包容器２００は任意の形状としてよい。例えば、図２のように、梱包容器２００がトレイ状であり、複数の回路基板１００を収容できる収容部２１０を備える形状としてもよい。 The packing container 200 is configured to accommodate the circuit board 100 as shown in FIG. 2. The method of accommodating the circuit board 100 in the packing container 200 is not particularly limited. The packing container 200 may have any shape depending on the intended use, such as preventing damage to the circuit board 100 or handling during transport. For example, as shown in FIG. 2, the packing container 200 may be tray-shaped and have an accommodating section 210 capable of accommodating multiple circuit boards 100.
梱包容器２００の形成材料は、樹脂材料としてよい。梱包容器の形成材料の引張り強さは、回路基板の損壊防止の観点から、２５ＭＰａ以上８０ＭＰａ以下であると好ましい。また、引張り強さは、梱包体の搬送時におけるハンドリングの観点から、３５ＭＰａ以上８０ＭＰａ以下であると、より好ましい。梱包容器２００の形成材料は、例えば、ポリエチレンテレフタレート、ポリプロピレン、ポリスチレン、ポリエチレンのいずれかを適用できる。回路基板の損壊防止の観点では、ポリエチレンテレフタレートが好ましい。 The material forming the packaging container 200 may be a resin material. From the viewpoint of preventing damage to the circuit board, the tensile strength of the material forming the packaging container is preferably 25 MPa or more and 80 MPa or less. Furthermore, from the viewpoint of handling during transportation of the package, the tensile strength is more preferably 35 MPa or more and 80 MPa or less. The material forming the packaging container 200 may be, for example, polyethylene terephthalate, polypropylene, polystyrene, or polyethylene. From the viewpoint of preventing damage to the circuit board, polyethylene terephthalate is preferred.
梱包容器２００は、構成材料の水分量が０．５ｗｔ％以下であることが好ましい。梱包容器２００の構成材料の水分量が調整されていると、回路基板梱包体１０を、室温６０℃、湿度８５％の雰囲気下、前記封止部材の内部が封止された状態で２４時間保管したときに、前記内部の湿度が４０％以下になりやすいためである。上記湿度の範囲内である回路基板梱包体１０であると、所定期間保管した場合にも、金属部材１２０の表面のはんだ濡れ性が低下しにくい。本態様において、封止した状態で２４時間保管したときの湿度を規定するのは、封止直後の回路基板梱包体１０は湿度の変動幅が比較的大きいこと、及び、封止した状態で２４時間経過後は、比較的湿度が変動しにくいことによる。上記湿度は、所定期間保管後のはんだ濡れ性がバラつきにくい観点から３８％以下であると好ましい。また、上記湿度は、複数枚の回路基板を梱包する梱包体において、梱包箇所によらず回路基板のはんだ濡れ性の低下を抑制しやすいことから、３５％以下であると特に好ましい。なお、湿度の下限値は特に限定されないが、低すぎる場合、梱包容器の強度維持が困難になる傾向があるため５％以上であると好ましい。 The moisture content of the constituent materials of the packaging container 200 is preferably 0.5 wt% or less. If the moisture content of the constituent materials of the packaging container 200 is adjusted, when the circuit board package 10 is stored for 24 hours in an atmosphere of room temperature 60°C and humidity 85% with the inside of the sealing member sealed, the humidity inside is likely to be 40% or less. If the circuit board package 10 is within the above humidity range, the solder wettability of the surface of the metal member 120 is unlikely to decrease even when stored for a predetermined period of time. In this embodiment, the humidity when stored in a sealed state for 24 hours is specified because the humidity fluctuation range of the circuit board package 10 immediately after sealing is relatively large, and the humidity is relatively unlikely to fluctuate after 24 hours in a sealed state. The humidity is preferably 38% or less from the viewpoint of less variation in solder wettability after storage for a predetermined period of time. In addition, the humidity is particularly preferably 35% or less in a package that packs multiple circuit boards, because it is easy to suppress the decrease in solder wettability of the circuit board regardless of the packaging location. There is no particular limit to the lower limit of humidity, but if it is too low, it tends to be difficult to maintain the strength of the packaging container, so it is preferable that it is 5% or higher.
梱包容器２００の構成材料の水分量は、封止部材３００の内部の湿度に対する影響のバラつきが少なくなることから、０．４ｗｔ％以下であると好ましい。また、水分量は、梱包体の封止直後から比較的内部の湿度を低めに調整しやすくなることから、０．３ｗｔ％以下であるとさらに好ましい。なお、水分量の下限値は特に限定されず、０ｗｔ％であっても構わない。水分量は、梱包容器２００を６０℃、２４時間乾燥させた後の乾燥状態における質量を０ｇとしたときに対する質量増加分の質量分率として示される。 The moisture content of the constituent materials of the packaging container 200 is preferably 0.4 wt% or less, since this reduces variation in the effect on the humidity inside the sealing member 300. Furthermore, the moisture content is more preferably 0.3 wt% or less, since this makes it relatively easy to adjust the internal humidity to a low level immediately after sealing the package. The lower limit of the moisture content is not particularly limited, and may be 0 wt%. The moisture content is expressed as the mass fraction of the mass increase relative to the mass of the packaging container 200 in a dry state after drying at 60°C for 24 hours, which is set to 0 g.
上記水分量は、室温６０℃、湿度８５％の雰囲気下、前記封止部材の内部が封止された状態で２４時間保管したときにおける水分量として測定できる。なお、本態様における湿度は、いずれも相対湿度である。水分量の測定において、２４時間保管したときの水分量を測定するのは、封止部材３００の内部の湿度等に応じて、梱包容器２００の水分量が経時変化する場合を考慮したものである。 The moisture content can be measured as the moisture content after storing the sealing member with the inside sealed for 24 hours in an atmosphere of room temperature 60°C and humidity 85%. Note that the humidity in this embodiment is relative humidity. The moisture content is measured after storing for 24 hours in consideration of the case where the moisture content of the packaging container 200 changes over time depending on the humidity inside the sealing member 300, etc.
封止部材３００は、回路基板１００が収容された梱包容器２００を内部に収容可能に構成される。封止部材３００は、内部が封止された状態において、梱包容器２００を内部に有していればよく、封止前の形状等は限定されない。例えば、図１Ａ及び図１Ｂのように、袋状の封止部材３００の内部に梱包容器２００の全体が収容され、封止部３２０により封止部材３００の内部が封止された構成としてよい。一つの封止部材３００内に対して、複数の梱包容器２００を収容する構成としてもよく、複数の梱包容器２００を重ねて配置しても良い。封止部材３００の内部は、脱気されていることが好ましい。 The sealing member 300 is configured to be capable of housing the packaging container 200 housing the circuit board 100 therein. The sealing member 300 is not limited in shape before sealing as long as it has the packaging container 200 inside when the inside is sealed. For example, as shown in Figs. 1A and 1B, the entire packaging container 200 may be housed inside the bag-shaped sealing member 300, and the inside of the sealing member 300 may be sealed by the sealing part 320. A single sealing member 300 may house multiple packaging containers 200, or multiple packaging containers 200 may be stacked and arranged. It is preferable that the inside of the sealing member 300 is degassed.
封止部材３００の形成材料の透湿度は６．０ｇ／ｍ２・２４ｈ以下（測定条件：室温４０℃、湿度９０％）であるものを適用できる。かかる透湿度の範囲であると、封止部材３００の内部が下記湿度の範囲内になりやすい。透湿度は、封止部材３００の外部の湿度による影響を適切に排除する観点から、１．０ｇ／ｍ２・２４ｈ以下であると好ましい。また、封止部材３００の形成材料の酸素透過は、１．０×１０―３ｍｌ／ｍ２・２４ｈ・Ｐａ以下であると好ましく、引張強度は１０Ｎ／１５ｍｍ幅以上であると好ましい。封止部材３００の形成材料としては、例えば、アルミ、ナイロン、塩化ビニル、ポリエチレン、ポリエチレンテレフタレート、ポリプロピレンなどからなるフィルムまたはそれらのいずれか一種以上を積層したフィルムのいずれかを適用できる。 The material for forming the sealing member 300 may have a moisture permeability of 6.0 g/m 2 ·24 h or less (measurement conditions: room temperature 40° C., humidity 90%). In this moisture permeability range, the inside of the sealing member 300 is likely to be within the following humidity range. From the viewpoint of appropriately eliminating the influence of the humidity outside the sealing member 300, the moisture permeability is preferably 1.0 g/m 2 ·24 h or less. In addition, the material for forming the sealing member 300 may have an oxygen permeability of 1.0×10 −3 ml/m 2 ·24 h·Pa or less, and a tensile strength of 10 N/15 mm width or more. As the material for forming the sealing member 300, for example, a film made of aluminum, nylon, vinyl chloride, polyethylene, polyethylene terephthalate, polypropylene, or the like, or a film in which one or more of them are laminated, may be used.
本態様の回路基板梱包体１０は、上記湿度の範囲内であると、回路基板の金属部材の表面のはんだ濡れ性が４７．５％以上の状態を維持しやすくなる。特に、回路基板梱包体を室温６０℃、湿度８５％の雰囲気において、３３６時間（２週間に相当する）保管したときにも、回路基板の金属部材の表面のはんだ濡れ性が４７．５％以上の状態を維持しやすい。上記はんだ濡れ性は、後工程において別部材の接合性を向上させる観点から５０．０％以上であると好ましい。また、上記はんだ濡れ性は、５２．０％以上であると特に好ましい。なお、上記はんだ濡れ性は、高すぎるとはんだの実装時にはんだが濡れ広がりすぎてしまうおそれがあるため、８０．０％以下であることが好ましい。ここで、上記条件において３３６時間（２週間）後のはんだ濡れ性を規定したのは、梱包体を約６か月保管した際の条件を想定したものである。本態様におけるはんだ濡れ性は、はんだボールによるはんだ濡れ広がり率として測定することができ、面積率で示される。 When the humidity of the circuit board package 10 of this embodiment is within the above range, the solder wettability of the surface of the metal member of the circuit board is easily maintained at 47.5% or more. In particular, when the circuit board package is stored for 336 hours (corresponding to 2 weeks) in an atmosphere of room temperature 60°C and humidity 85%, the solder wettability of the surface of the metal member of the circuit board is easily maintained at 47.5% or more. The above solder wettability is preferably 50.0% or more from the viewpoint of improving the bonding of different members in a later process. In addition, the above solder wettability is particularly preferably 52.0% or more. Note that if the solder wettability is too high, the solder may spread too much when the solder is mounted, so it is preferably 80.0% or less. Here, the solder wettability after 336 hours (2 weeks) is specified under the above conditions assuming the conditions when the package is stored for about 6 months. The solder wettability in this embodiment can be measured as the solder wettability spread rate by the solder balls and is expressed as an area ratio.
回路基板梱包体１０は、封止部材内に乾燥剤又は脱酸素剤のいずれか一種以上を備えたものとしてよい。乾燥剤や脱酸素剤として利用可能な種類は特に制限されず、封止部材内に備える数も限定されない。 The circuit board package 10 may include one or more desiccants or oxygen absorbers in the sealing member. There are no particular limitations on the types of desiccants or oxygen absorbers that can be used, and there is no limit to the number of desiccants that can be included in the sealing member.
（２）回路基板梱包体の製造方法
本態様における回路基板梱包体１０の製造方法は、
梱包容器２００に回路基板１００を収容する収容工程（工程Ａ）と、
回路基板１００が収容された梱包容器２００を封止部材内に配置し、封止部材３００を減圧しながら密封する封止工程（工程Ｂ）と、を有する。
(2) Manufacturing Method of the Circuit Board Package The manufacturing method of the circuit board package 10 in this embodiment is as follows:
A housing step (step A) of housing the circuit board 100 in the packaging container 200;
The method also includes a sealing step (step B) of placing the packaging container 200 containing the circuit board 100 inside a sealing member 300 and sealing the same while reducing the pressure inside the sealing member 300 .
（前処理：乾燥工程）
本態様における回路基板１００の梱包方法は、梱包容器２００の構成材料の水分量を０．４ｗｔ％以下にする乾燥工程を前処理として行うものとしてもよい。乾燥工程は、湿度や梱包容器２００の乾燥工程前の水分量に応じて適宜の条件を設定してよく、例えば、温度３５℃以上８０℃以下において、３０分以上１６８時間以下の条件としてよい。複数の梱包容器２００を一度に所定の水分量以下に乾燥しやすい観点から、乾燥工程における温度は３８℃以上６０℃以下が好ましく、１０時間以上１００時間以下が好ましい。なお、梱包容器２００の形成材料や保存環境等により、予め梱包容器２００の水分量が所定範囲内である場合には、乾燥工程を行うことなく後述する工程Ａ及び工程Ｂのみ実施する方法としてよい。
(Pretreatment: drying process)
In the packaging method of the circuit board 100 in this embodiment, a drying process may be performed as a pretreatment to reduce the moisture content of the constituent material of the packaging container 200 to 0.4 wt % or less. The drying process may be performed under appropriate conditions depending on the humidity and the moisture content of the packaging container 200 before the drying process, for example, at a temperature of 35° C. to 80° C. and for 30 minutes to 168 hours. From the viewpoint of easily drying a plurality of packaging containers 200 to a predetermined moisture content or less at once, the temperature in the drying process is preferably 38° C. to 60° C. and preferably 10 hours to 100 hours. Note that, if the moisture content of the packaging container 200 is within a predetermined range in advance due to the forming material of the packaging container 200 or the storage environment, the method may be performed by performing only the steps A and B described below without performing the drying process.
（工程Ａ：収容工程）
工程Ａでは、回路基板１００を梱包容器２００に収容する。例えば、図２のように、梱包容器２００が備える収容部２１０に、回路基板１００を配置する工程としてよい。回路基板１００の収容方法は特に限定されず、梱包容器２００の形状等に併せて、適宜の方法を採用してよい。
(Step A: Storage Step)
In step A, the circuit board 100 is accommodated in a packaging container 200. For example, as shown in Fig. 2, this may be a step of placing the circuit board 100 in an accommodating portion 210 provided in the packaging container 200. The method of accommodating the circuit board 100 is not particularly limited, and an appropriate method may be adopted depending on the shape of the packaging container 200, etc.
（工程Ｂ：封止工程）
工程Ａの後、工程Ｂでは梱包容器２００を封止部材３００内に配置し、内部を封止する。封止部材３００の内部に脱酸素剤や乾燥剤を配置してもよい。工程Ｂは、例えば図３のように、開放端３１０を有する封止部材３００を用いて、開放端３１０より梱包容器２００を封止部材３００の内部に配置した後、開放端３１０を熱融着や超音波等の任意の方法で封止する工程としてよい。また、一つの封止部材３００に、複数の梱包容器２００を配置してもよい。工程Ｂでは、封止部材３００の内部を脱気しながら封止することが好ましい。
(Step B: Sealing step)
After step A, in step B, the packaging container 200 is placed in a sealing member 300 and the inside is sealed. An oxygen absorber or a desiccant may be placed inside the sealing member 300. Step B may be, for example, as shown in FIG. 3, a step of using a sealing member 300 having an open end 310, placing the packaging container 200 inside the sealing member 300 from the open end 310, and then sealing the open end 310 by any method such as heat fusion or ultrasonic waves. Also, a plurality of packaging containers 200 may be placed in one sealing member 300. In step B, it is preferable to seal the inside of the sealing member 300 while degassing it.
以上の工程Ａ及び工程Ｂを有する製造方法により得られた回路基板梱包体は、室温６０℃、相対湿度８５％の雰囲気下、前記封止部材の内部が封止された状態で２４時間保管したときに、前記内部の湿度が４０％以下となる。ここで、上述の通り回路基板梱包体としては、回路基板の基材の材質や、基材に接合される金属部材の厚み等に応じて、耐衝撃性や強度等の要求特性を満たす樹脂材料の梱包容器が用いられる。本製造方法において、上記した湿度範囲とするためには、梱包容器として適宜の種類の樹脂材料を選択する（例えば、吸湿性の低い樹脂材料を用いる）ものとしてもよく、後述する乾燥工程を行うものとしても良く、適宜の方法を採用してよい。なお、上記湿度の測定条件を、封止された状態で２４時間保管したときとしているのは、封止直後において湿度の変動が多い梱包体があることを想定し、梱包体内部の湿度変化が所定程度に落ち着いた状態の湿度を視標とするためである。 When the circuit board package obtained by the manufacturing method including the above-mentioned steps A and B is stored for 24 hours in an atmosphere of room temperature 60°C and relative humidity 85% with the inside of the sealing member sealed, the humidity inside the package is 40% or less. Here, as described above, a packaging container made of a resin material that meets the required characteristics such as impact resistance and strength depending on the material of the circuit board base material and the thickness of the metal member to be joined to the base material is used as the circuit board package. In this manufacturing method, in order to achieve the above-mentioned humidity range, an appropriate type of resin material may be selected for the packaging container (for example, a resin material with low hygroscopicity may be used), a drying process described later may be performed, or an appropriate method may be adopted. The humidity measurement condition is set to when the package is stored in a sealed state for 24 hours because it is assumed that there is a package with a large humidity fluctuation immediately after sealing, and the humidity in the package when the humidity change inside the package has settled to a predetermined level is used as an indicator.
（３）効果
本態様によれば、以下に示す１つ又は複数の効果が得られる。
(3) Effects According to this aspect, one or more of the following effects can be obtained.
（ａ）所定条件下において湿度が４０％以下である封止部材３００の内部に回路基板１００が配置された回路基板梱包体１０により、回路基板梱包体を所定期間保管した後にも、回路基板１００の金属部材表面のはんだ濡れ性が低下しにくいものとなる。 (a) By forming a circuit board package 10 in which a circuit board 100 is placed inside a sealing member 300 in which the humidity is 40% or less under specified conditions, the solder wettability of the metal member surface of the circuit board 100 is unlikely to decrease even after the circuit board package is stored for a specified period of time.
（ｂ）本態様では、封止部材内に水分量が０．５ｗｔ％以下である梱包容器を備えることにより、搬送時における回路基板の損傷等を防止しつつ、梱包容器に由来した封止部材内の湿度の想定外の上昇を抑制できる。この点、梱包容器を構成する樹脂材料としては、湿度の影響のみを考慮するならば、単純に吸湿しにくい材質を選定することも考えられるものの、回路基板梱包体への要求として、損壊しやすい回路基板の梱包等、回路基板の保護強度等が求められる場合もある。このような背景の下、本態様によれば、梱包容器として選定可能な材質を極度に制限することなく、封止部材内を所定の湿度に維持し、金属部材表面のはんだ濡れ性の低下を抑制できる梱包体が提供される。 (b) In this embodiment, by providing a packaging container with a moisture content of 0.5 wt% or less in the sealing member, damage to the circuit board during transportation can be prevented while suppressing an unexpected increase in humidity in the sealing member caused by the packaging container. In this regard, if only the effect of humidity is considered, it is possible to select a resin material that is simply less likely to absorb moisture as the resin material constituting the packaging container. However, there are also cases where the circuit board package is required to have protective strength for the circuit board, such as when packaging a circuit board that is easily damaged. In this context, according to this embodiment, a package is provided that can maintain a predetermined humidity level in the sealing member and suppress a decrease in the solder wettability of the metal member surface without excessively restricting the materials that can be selected for the packaging container.
（ｃ）回路基板の基材がセラミックスである場合、特性上、梱包体の搬送時等に損壊しやすく、梱包容器による保護が必要な場合がある。また、セラミックス基材では、用いる梱包容器の材質も、ある程度の強度を要することがあり、吸湿性の低い材質のみを選定することは難しい。これに対し、本態様では、吸湿性のある樹脂製の梱包容器を適用した場合にも、封止部材内を所定の湿度に維持可能になる。 (c) When the substrate of the circuit board is ceramic, due to its characteristics, it may be easily damaged during transportation of the package, and protection by a packaging container may be necessary. In addition, when the substrate is ceramic, the material of the packaging container used may need to have a certain degree of strength, and it is difficult to select only materials with low moisture absorption. In contrast, in this embodiment, it is possible to maintain a predetermined humidity level inside the sealing member even when a packaging container made of a hygroscopic resin is used.
＜他の態様＞
以上、本開示の態様を具体的に説明した。但し、本開示は上述の態様に限定されるものではなく、その要旨を逸脱しない範囲で種々変更可能である。
<Other Aspects>
Although the embodiments of the present disclosure have been specifically described above, the present disclosure is not limited to the above embodiments and can be modified in various ways without departing from the spirit and scope of the present disclosure.
例えば、梱包容器２００に収容可能な回路基板１００として、一つの梱包容器２００に複数の回路基板１００を収容する例について説明したが、一つの梱包容器２００について一枚の回路基板１００を収容する構成としてもよい。また、梱包容器２００として、トレイ状の形状とする例について説明したが、梱包容器２００は袋状や蓋つき等の任意の形状としてよい。 For example, an example has been described in which a single packaging container 200 contains multiple circuit boards 100 as circuit boards 100 that can be contained in the packaging container 200, but a single packaging container 200 may contain a single circuit board 100. Also, an example has been described in which the packaging container 200 is shaped like a tray, but the packaging container 200 may be shaped like a bag, with a lid, or in any other desired shape.
また、封止部材３００について、一辺に開放端３１０を有する袋状の形状とする例について説明したが、開放端３１０は複数有していてもよい。例えば、封止部材３００は、２枚のシート状の封止部材３００で梱包容器２００を挟み込んだ状態に配置し、シートの封止部材３００の四辺を封止して内部を封止した構成としても構わない。 In addition, although the sealing member 300 has been described as having a bag-like shape with an open end 310 on one side, the sealing member 300 may have multiple open ends 310. For example, the sealing member 300 may be configured such that the packaging container 200 is sandwiched between two sheet-like sealing members 300, and the four sides of the sheet-like sealing members 300 are sealed to seal the inside.
以下、実験例を参照しながら本態様についてより具体的に説明する。 Below, we will explain this aspect in more detail with reference to experimental examples.
＜実験例１＞
セラミックス（窒化ケイ素系、４７ｍｍ×２４ｍｍ）を基材とし、ろう材を介して金属部材として銅板（厚み１．２ｍｍ）が接合された回路基板を、ポリエチレンテレフタレート製（ＲＰ東プラ社製、品番ＮＯＡＣＲＹＳＴＬ－ＭＡ）でトレイ形状（大きさ３２３ｍｍ×１３６ｍｍ、深さ１１ｍｍ）の梱包容器（水分量０．４７ｗｔ％）の収容部に収容した。一つの梱包容器につき回路基板を１５枚、梱包容器の収容部に回路基板の側面と金属部材と反対側の裏面が近接するように収容した。回路基板を収容した梱包容器を、一辺に開封端を有するアルミパック（三菱ガス化学社製、ガスバリア袋、大きさ５００ｍｍ×３５０ｍｍ、透湿度＜１．０ｘ１０－２ｇ／ｍ２・２４ｈ、酸素透過性＜１．０ｘ１０―７ｍｌ／ｍ２・２４ｈ・Ｐａ）に配置した。一つのアルミパック内に、７個の梱包容器を重ねて配置し、梱包容器と同素材のトレイ形状の梱包容器を蓋部として重ねた。その後、アルミパック内の蓋部の上に、乾燥剤であるシリカゲル（東海化学工業所製、２個）及び脱酸素剤であるＲＰ剤（三菱ガス化学社製、２個）を配置し、アルミパック内を脱気しながらヒートシールで封止して梱包体とした。
<Experimental Example 1>
A circuit board having a ceramic (silicon nitride type, 47 mm x 24 mm) base material and a copper plate (thickness 1.2 mm) bonded as a metal member via a brazing material was placed in a tray-shaped packaging container (moisture content 0.47 wt%) made of polyethylene terephthalate (manufactured by RP Toho Plastics, product number NOACRYSTL-MA) in a storage section. 15 circuit boards were placed in each packaging container so that the side of the circuit board and the back surface opposite the metal member were close to each other in the storage section of the packaging container. The packaging container containing the circuit board was placed in an aluminum pack (manufactured by Mitsubishi Gas Chemical Company, gas barrier bag, size 500 mm x 350 mm, moisture permeability < 1.0 x 10 -2 g / m 2・ 24 h, oxygen permeability < 1.0 x 10 -7 ml / m 2・ 24 h ・ Pa) with an opening edge on one side. Seven packaging containers were stacked in one aluminum pack, and a tray-shaped packaging container made of the same material as the packaging containers was stacked as a lid. After that, silica gel (manufactured by Tokai Chemical Industry Co., Ltd., 2 pieces) as a desiccant and RP agent (manufactured by Mitsubishi Gas Chemical Co., Ltd., 2 pieces) as an oxygen scavenger were placed on the lid inside the aluminum pack, and the aluminum pack was heat-sealed while degassing to form a package.
［水分量の測定］
実験例１で用いた梱包容器について、下記条件で質量に基づき水分量を測定した。梱包容器を６０℃で２４時間乾燥させた際の質量を測定したところ、梱包容器一つあたり６９．６０ｇであり、これを乾燥した状態における質量（Ｇ１）とした。これに対し、実験例１で使用した梱包容器の質量は一つあたり６９．９３ｇであり（Ｇ２）、乾燥した状態における質量からの増加分の質量百分率を水分量とした（（Ｇ２－Ｇ１）／Ｇ１×１００）。
[Moisture content measurement]
The moisture content of the packaging containers used in Experimental Example 1 was measured based on the mass under the following conditions. The mass of each packaging container was measured after drying at 60°C for 24 hours, which was 69.60 g per packaging container, and this was taken as the mass in the dry state (G1). In contrast, the mass of each packaging container used in Experimental Example 1 was 69.93 g (G2), and the mass percentage of the increase from the mass in the dry state was taken as the moisture content ((G2-G1)/G1x100).
［環境試験］
実験例１の梱包体について、室温６０℃、湿度８５％の雰囲気下、３３６時間（２週間）の環境試験を行い、アルミパック内の湿度を測定した。その結果、２４時間後の湿度は３７．８％であり、２週間後の湿度は３１．３％であった。
[Environmental testing]
The package of Experimental Example 1 was subjected to an environmental test for 336 hours (2 weeks) in an atmosphere of room temperature 60° C. and humidity 85%, and the humidity inside the aluminum pack was measured. As a result, the humidity after 24 hours was 37.8%, and the humidity after 2 weeks was 31.3%.
［はんだ濡れ性試験］
上記２週間の環境試験後における梱包体内の回路基板について、下記のはんだ濡れ性試験を行った。はんだ濡れ性試験は、８８０ｍｍ２の金属表面に対し、Ｓｎ―３Ａｇ―０．５Ｃｕからなる１．３μｌのはんだボールを滴下して、２６０℃で５分間加熱し、冷却した後の金属表面の面積に対するはんだボールの広がり面積の比率として測定した。以上の結果、実験例１のはんだ濡れ性は、５４．４％であった。
[Solder wettability test]
The following solder wettability test was conducted on the circuit board inside the package after the above two-week environmental test. The solder wettability test was conducted by dropping 1.3 μl of solder balls made of Sn-3Ag-0.5Cu onto a metal surface of 880 mm2 , heating at 260°C for 5 minutes, and measuring the ratio of the spread area of the solder balls to the area of the metal surface after cooling. As a result, the solder wettability of Experimental Example 1 was 54.4%.
＜実験例２＞
実験例１で用いた梱包容器について、６０℃、１６時間の乾燥工程を行った後に回路基板の収容を行った以外は、実験例１と同様の条件で梱包体を得た。実験例２における梱包容器の水分量は０ｗｔ％であった。
＜実験例３～６＞
実験例３、４は、乾燥工程における乾燥時間をそれぞれ３時間、１時間とした以外は、実験例２と同様の条件とした。また、実験例５、６では、乾燥工程に代えて、３０℃、湿度６０％の条件において、梱包容器を２４時間放置、実験例６は、３０℃、８５％の条件において梱包容器を４８時間放置した後に、回路基板の収容を行った以外、実験例１と同様の条件とした。以上の結果、実験例３～６の水分量は、それぞれ０．２１ｗｔ％、０．３０ｗｔ％、０．５９ｗｔ％、０．８６ｗｔ％であった。
<Experimental Example 2>
A package was obtained under the same conditions as in Experimental Example 1, except that the packaging container used in Experimental Example 1 was subjected to a drying process at 60° C. for 16 hours before the circuit board was housed therein. The moisture content of the packaging container in Experimental Example 2 was 0 wt %.
<Experimental Examples 3 to 6>
In Experimental Examples 3 and 4, the conditions were the same as in Experimental Example 2, except that the drying time in the drying step was 3 hours and 1 hour, respectively. In Experimental Examples 5 and 6, instead of the drying step, the packing container was left for 24 hours under conditions of 30°C and 60% humidity, and in Experimental Example 6, the packing container was left for 48 hours under conditions of 30°C and 85% humidity before the circuit board was housed, and other conditions were the same as in Experimental Example 1. As a result of the above, the moisture contents of Experimental Examples 3 to 6 were 0.21 wt%, 0.30 wt%, 0.59 wt%, and 0.86 wt%, respectively.
以上の実験例１～６について、環境試験後におけるアルミパック内の湿度とはんだ濡れ性試験の結果を図４に示す。また、梱包容器の水分量と環境試験後のアルミパック内の湿度の結果を図５に示す。さらに、乾燥工程における乾燥時間と、梱包容器の水分量を図６に示す。 Figure 4 shows the humidity inside the aluminum pack after the environmental test and the results of the solder wettability test for the above experimental examples 1 to 6. Figure 5 shows the results of the moisture content in the packing container and the humidity inside the aluminum pack after the environmental test. Figure 6 shows the drying time in the drying process and the moisture content in the packing container.
以上の結果、図４より、アルミパック内の湿度が４０％以下であると、はんだ濡れ性が低下せず維持されることが示された。図５より、梱包容器の水分量が０．５ｗｔ％以下であった場合に、封止２４時間後におけるアルミパック内の湿度が４０％以下であった。また、図６より、乾燥工程における乾燥時間を１０時間以上とした場合、梱包容器の水分量が０．４ｗｔ％以下となった。 As a result of the above, Figure 4 shows that when the humidity inside the aluminum pack is 40% or less, the solder wettability is maintained without decreasing. Figure 5 shows that when the moisture content of the packaging container is 0.5 wt% or less, the humidity inside the aluminum pack 24 hours after sealing is 40% or less. Furthermore, Figure 6 shows that when the drying time in the drying process is 10 hours or more, the moisture content of the packaging container is 0.4 wt% or less.
＜付記＞
（１）基材に金属部材が接合された回路基板と、
樹脂材料により構成され、前記回路基板が収容された梱包容器と、
前記梱包容器が内部に収容された封止部材と、を備え、
前記梱包容器の構成材料の水分量が０．５ｗｔ％以下である、
回路基板梱包体。
<Additional Notes>
(1) A circuit board having a base material and a metal member bonded thereto;
a packaging container made of a resin material and accommodating the circuit board;
A sealing member in which the packaging container is housed,
The moisture content of the material constituting the packaging container is 0.5 wt % or less.
Circuit board packaging.
（２）室温６０℃、湿度８５％の雰囲気下、前記封止部材の内部が封止された状態で２４時間保管したときに、前記内部の湿度が４０％以下である、
（１）に記載の回路基板梱包体。
(2) When the inside of the sealing member is stored for 24 hours in an atmosphere of room temperature 60° C. and humidity 85%, the humidity inside is 40% or less.
The circuit board package according to (1).
（３）前記封止部材の形成材料の透湿度が６．０ｇ／ｍ２以下である、
（１）又は（２）に記載の回路基板梱包体。
(3) The moisture permeability of the material forming the sealing member is 6.0 g/ m2 or less.
A circuit board package according to (1) or (2).
（４）前記梱包容器の形成材料の引張り強さは、２５ＭＰａ以上８０ＭＰａ以下である、
（１）から（３）のいずれかに記載の回路基板梱包体。
(4) The tensile strength of the material forming the packaging container is 25 MPa or more and 80 MPa or less.
A circuit board package according to any one of (1) to (3).
（５）脱酸素剤又は乾燥剤のいずれか一種以上を前記封止部材内に備える、
（１）から（４）のいずれかに記載の回路基板梱包体。
(5) One or more of an oxygen scavenger or a desiccant is provided in the sealing member.
A circuit board package according to any one of (1) to (4).
（６）室温６０℃、湿度８５％の雰囲気下、前記封止部材の内部が封止された状態で３３６時間保管したときに、前記金属部材の表面のはんだ濡れ性が４７．５％以上である、
（１）から（５）のいずれかに記載の回路基板梱包体。
(6) When the sealing member is stored for 336 hours in an atmosphere of room temperature 60° C. and humidity 85%, with the inside of the sealing member sealed, the solder wettability of the surface of the metal member is 47.5% or more.
A circuit board package according to any one of (1) to (5).
（７）基材に金属部材が接合された回路基板を水分量が０．５ｗｔ％以下の梱包容器に収容する収容工程と、
前記梱包容器を封止部材内に配置し、前記封止部材の内部を封止する封止工程と、を有する、回路基板梱包体の製造方法。
(7) a step of housing the circuit board having the base material and the metal member bonded thereto in a packaging container having a moisture content of 0.5 wt % or less;
and a sealing step of placing the packaging container in a sealing member and sealing the inside of the sealing member.
（８）前記収容工程の前に、前記梱包容器を乾燥する乾燥工程を有する、
（７）に記載の回路基板梱包体の製造方法。
(8) A drying process for drying the packaging container is provided before the containing process.
A method for manufacturing the circuit board package described in (7).
（９）室温６０℃、湿度８５％の雰囲気下、前記封止部材の内部が封止された状態で２４時間保管したときに、前記内部の湿度が４０％以下となる、
（７）又は（８）に記載の回路基板梱包体の製造方法。
(9) When the inside of the sealing member is stored for 24 hours in an atmosphere of room temperature 60° C. and humidity 85%, the humidity inside the sealing member is 40% or less.
A method for manufacturing a circuit board package according to (7) or (8).
１０ 回路基板梱包体
１００ 回路基板
１１０ 基材
１２０ 金属部材
２００ 梱包容器
２１０ 収容部
３００ 封止部材
３１０ 開放端
３２０ 封止部
REFERENCE SIGNS LIST 10 Circuit board package 100 Circuit board 110 Base material 120 Metal member 200 Packaging container 210 Storage section 300 Sealing member 310 Open end 320 Sealing section
Claims (8)
樹脂材料により構成され、前記回路基板が収容された梱包容器と、
前記梱包容器が内部に収容された封止部材と、を備え、
室温６０℃、湿度８５％の雰囲気下、前記封止部材の内部が封止された状態で２４時間保管したときに、前記内部の湿度が４０％以下である、
回路基板梱包体。 A circuit board having a metal member bonded to a base material;
a packaging container made of a resin material and accommodating the circuit board;
A sealing member in which the packaging container is housed,
When the inside of the sealing member is stored for 24 hours in an atmosphere of room temperature 60° C. and humidity 85%, the humidity inside is 40% or less.
Circuit board packaging.
請求項１に記載の回路基板梱包体。 The moisture content of the material constituting the packaging container is 0.5 wt % or less.
The circuit board package according to claim 1 .
請求項１又は請求項２に記載の回路基板梱包体。 The moisture permeability of the material forming the sealing member is 6.0 g / m 2 · 24 h or less;
The circuit board package according to claim 1 or 2.
請求項１又は請求項２に記載の回路基板梱包体。 The tensile strength of the material forming the packaging container is 25 MPa or more and 80 MPa or less.
The circuit board package according to claim 1 or 2.
請求項１又は請求項２に記載の回路基板梱包体。 One or more of an oxygen scavenger or a desiccant is provided in the sealing member.
The circuit board package according to claim 1 or 2.
請求項１又は請求項２に記載の回路基板梱包体。 When the sealing member is stored for 336 hours in an atmosphere of room temperature 60° C. and humidity 85%, with the interior of the sealing member sealed, the solder wettability of the surface of the metal member is 47.5% or more.
The circuit board package according to claim 1 or 2.
前記梱包容器を封止部材内に配置し、前記封止部材の内部を封止する封止工程と、を有し、
室温６０℃、相対湿度８５％の雰囲気下、前記封止部材の内部が封止された状態で２４時間保管したときに、前記内部の湿度が４０％以下となる、
回路基板梱包体の製造方法。 a housing step of housing the circuit board having the base material and the metal member bonded thereto in a packaging container;
and a sealing step of placing the packaging container in a sealing member and sealing the inside of the sealing member,
When the inside of the sealing member is stored for 24 hours in an atmosphere of room temperature 60° C. and relative humidity 85%, the humidity inside the sealing member is 40% or less.
A method for manufacturing a circuit board package.
請求項７に記載の回路基板梱包体の製造方法。 A drying process is performed before the containing process to reduce the moisture content of the constituent material of the packaging container to 0.5 wt % or less.
A method for manufacturing the circuit board package according to claim 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022156971A JP2024050236A (en) | 2022-09-29 | 2022-09-29 | Circuit board packing body and method for manufacturing circuit board packing body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022156971A JP2024050236A (en) | 2022-09-29 | 2022-09-29 | Circuit board packing body and method for manufacturing circuit board packing body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2024050236A true JP2024050236A (en) | 2024-04-10 |
Family
ID=90622243
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022156971A Pending JP2024050236A (en) | 2022-09-29 | 2022-09-29 | Circuit board packing body and method for manufacturing circuit board packing body |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2024050236A (en) |
-
2022
- 2022-09-29 JP JP2022156971A patent/JP2024050236A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9434509B2 (en) | Package for metal-ceramic substrate and method for packing such substrates | |
| JP2007269391A (en) | Packaging unit and packaging method for glass substrate having electric conductive section formed therein | |
| WO2002053474A1 (en) | Cushioning body for glass substrate and packing body using the cushioning body | |
| JP5622179B2 (en) | Laminated resin film | |
| JP6044635B2 (en) | Packaging for substrates and packaging units comprising such packaging | |
| WO2017094208A1 (en) | Laminated resin film | |
| JP2024050236A (en) | Circuit board packing body and method for manufacturing circuit board packing body | |
| JP6703635B1 (en) | Package and packing box for housing the heat dissipation board | |
| JP6084044B2 (en) | Cold insulation packaging body and packaging body | |
| JP4617850B2 (en) | Glass substrate packing method using vacuum pack and package thereof | |
| US12035478B2 (en) | Apparatus and methods for packaging electronic components using a tape having desiccant entrained polymer on a reel | |
| JP7097770B2 (en) | Packaging bag | |
| RU130139U1 (en) | WATERPROOF PACKAGING FOR SEMICONDUCTOR PLATES | |
| EP3882177B1 (en) | Package accommodating heat-dissipating substrates, and packaging box | |
| JP3174559B1 (en) | Rust prevention packaging material | |
| JP6897020B2 (en) | Packaging bag | |
| JP2023073612A (en) | Cushioning sheet, transport method of glass articles and loading method of glass articles | |
| JP2023017333A (en) | Package of silicon nitride sintered substrate | |
| JP7300257B2 (en) | Hydrogen sulfide absorption film | |
| JP2004090971A (en) | Packaging method for epoxide resin molding material for sealing semiconductor | |
| JP2006069620A (en) | Packaging container for ball lens transport | |
| JP2023017329A (en) | Package of silicon nitride sintered substrate | |
| JP2015178251A (en) | Method of preserving metal-clad laminate sheet, laminate and packed article | |
| JPS62101435A (en) | Composite packaging material | |
| JP2021134819A (en) | Vacuum heat insulating material and heat insulating container |