JP2023510288A - 高耐食性ストリップ鋼およびその製造方法 - Google Patents
高耐食性ストリップ鋼およびその製造方法 Download PDFInfo
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- JP2023510288A JP2023510288A JP2022542049A JP2022542049A JP2023510288A JP 2023510288 A JP2023510288 A JP 2023510288A JP 2022542049 A JP2022542049 A JP 2022542049A JP 2022542049 A JP2022542049 A JP 2022542049A JP 2023510288 A JP2023510288 A JP 2023510288A
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Abstract
Description
(1)高耐食層とマトリックス金属である炭素鋼板の比が通常1:50以上と大きく異なるため、材料特性の差が大きく、そして加熱工程、圧延工程、又は熱処理工程の制御が困難である。これらの困難とは、具体的には、例えば、加熱過程での温度不均一による変形膨らみにより、高耐食層とマトリックス金属との結合ができなくなること、また、例えば、圧延過程で高耐食層がマトリックス金属から分離して割れやすく、最終鋼板の厚さの均一性を確保しにくくなることである。
C:0.01~0.20%;
Si:0.10~0.5%;
Mn:0.5~2.0%;
Al:0.02~0.04%;
Ti:0.005~0.018%;
Nb:0.005~0.020%;
残部は、Feと他の不可避不純物である。
C:0.01~0.18%;
Si:0.10~0.3%;
Mn:0.5~1.5%;
Al:0.02~0.03%;
Ti:0.005~0.015%;
Nb:0.005~0.015%。
C:本発明に記載された技術案において、Cはオーステナイトの安定化元素であり、鋼中では固溶強化元素として作用し、鋼の強度を大幅に向上させることができるが、Cの質量百分比が高すぎると、溶接性や靭性が損なわれ、また、パーライト組織やマルテンサイトなどの硬質相組織が増加しやすくなり、鋼の耐食性に悪影響を及ぼす。したがって、鋼板の強度・靭性のマッチングと炭素鋼材料の耐食性に対する要求とを考慮すると、本願のCの質量百分比を0.01~0.20%の範囲に制御すれば、圧延後の空冷時に本願の高耐食性ストリップ鋼が一定の硬さ・強度を確保することに寄与することができるが、Cの質量百分比は高すぎると、炭素鋼の基底層の溶接性を悪化させ、特に、本願の耐食層の厚さは、ストリップ鋼の総厚さの0.5~5%であるので、溶接性に悪影響を与えないためには、Cの質量百分比を上記範囲にすることがより一層重要である。一部の好ましい実施形態において、Cの質量百分比は、さらに0.01~0.18%に制御しても良い。一部の好ましい実施形態において、Cの質量百分比をさらに0.10~0.20%、より好ましくに0.10~0.18%に制御しても良い。
(1)基底層材料として炭素鋼の基底層を得、被覆層材料として耐食層を得る;
(2)ビレットの組み立て;
(3)予備加熱:ビレットを1150~1250℃の温度で予備加熱し、耐食層と炭素鋼の基底層の各元素が、界面での拡散を発生し、安定的な遷移層を形成した後、室温まで徐冷する;
(4)二次加熱と圧延:1100~1200℃の温度で二次加熱し、複数パスの圧延を行い、最終圧延温度を900℃以上に制御する;
(5)水冷の後に、巻取りを行う。
さらに、前記冷間圧延ステップにおいて、冷間圧延焼鈍温度を、600~750℃に制御する。
適当な厚さを有する耐食層および炭素鋼の基底層を設置することで、本発明に記載された高耐食性ストリップ鋼は、高耐食性と良好な力学性能を有する鋼板/鋼帯を得る。
実施例1-6の高耐食性ストリップ鋼は、以下のステップで製造された:
(1)基底層材料と被覆層材料を得、ただし、マトリックス層と被覆層材料の各化学成分割合は、表1を参照する。
いくつの実施形態において、ステップ(4)において、圧延の総圧下率を70%以上に制御する。
図5に示されたように、実施例2の高耐食性ストリップ鋼において、炭素鋼の基底層1の微細組織は、フェライトとパーライトであり、耐食層2は、オーステナイトステンレス鋼耐食層である、耐食層2の微細組織は、オーステナイトであり、炭素鋼の基底層1と耐食層2の間の遷移層は、フェライトとパーライトである。図5によって、実施例2の高耐食性ストリップ鋼の厚さは3.5mmであり、耐食層2の厚さは40μmであることはわかる。
図6に示されたように、実施例6の高耐食性ストリップ鋼において、炭素鋼の基底層1の微細組織は、フェライトとパーライトであり、耐食層2は、純チタン耐食層であり、その微細組織はα-Tiであり、炭素鋼の基底層1と耐食層2の間の遷移層は、フェライトとパーライトである。実施例6の高耐食性ストリップ鋼の厚さは、0.5mmであり、耐食層2の各層の厚さは、20μmである。
本発明の保護の範囲における従来技術部分は、本出願書類に記載の実施例に限定されるものではなく、本発明の方案と矛盾しない先行技術(先行の特許文献、先行の公開出版物、先行の公開使用などを含むが、それらに限定されない)は、全て本発明の保護の範囲に取り入れられることを説明すべきである。
Claims (15)
- 炭素鋼基底層および、炭素鋼基底層と圧延複合する耐食層を含み、ただし、耐食層は、オーステナイトステンレス鋼又は純チタンであり、耐食層の厚さは、ストリップ鋼総厚さの0.5~5%であることを特徴とする耐食性ストリップ鋼。
- 前記炭素鋼の基底層的化学元素質量百分比は以下の通りであることを特徴とする請求項1に記載された耐食ストリップ鋼:
C:0.01~0.20%;
Si:0.10~0.5%;
Mn:0.5~2.0%;
Al:0.02~0.04%;
Ti:0.005~0.018%;
Nb:0.005~0.020%;
残部は、Feと他の不可避不純物である。 - C、Si、Mn、Al、TiとNbの含有量は、以下の少なくとも一つを満たすことを特徴とする請求項2に記載された耐食ストリップ鋼:
C:0.01~0.18%;
Si:0.10~0.3%;
Mn:0.5~1.5%;
Al:0.02~0.03%;
Ti:0.005~0.015%;
Nb:0.005~0.015%。 - さらに以下の化学元素の少なくとも一つを含有することを特徴とする請求項1に記載された耐食ストリップ鋼:0<B≦0.0003%;0<N≦0.006%;0<Ni≦0.20%;0<Cr≦0.20%;0<Mo≦0.10%;0<Sb≦0.30%;0<V≦0.30%;0<W≦0.30%;0<Cu≦0.30%;0<Sn≦0.30%;0<Bi≦0.30%;0<Se≦0.30%;0<Te≦0.30%;0<Ge≦0.30%;0<As≦0.30%;0<Ca≦0.30%;0<Mg≦0.30%;0<Zr≦0.30%;0<Hf≦0.30%;0<希土類元素≦0.50%。
- 他の不可避不純物において:P≦0.015%;かつ/又はS≦0.010%であることを特徴とする請求項1に記載された耐食ストリップ鋼。
- 前記耐食ストリップ鋼炭素鋼の基底層の化学元素質量百分比は:C:0.01~0.20%;Si:0.10~0.5%;Mn:0.5~2.0%;Al:0.02~0.04%;Ti:0.005~0.018%;Nb:0.005~0.020%;N:0<N≦0.006%;Mo:≦0.10%;Cr:≦0.20%;Ni:≦0.20%、好ましくに≦0.10%;残部は、Feと他の不可避不純物であることを特徴とする請求項1に記載された耐食ストリップ鋼。
- 炭素鋼の基底層の微細組織は、フェライトとパーライトであり、オーステナイトステンレス鋼の耐食層の微細組織は、オーステナイトであり、炭素鋼の基底層と耐食層の間に遷移層は、パーライトとフェライトであることを特徴とする請求項1に記載された耐食ストリップ鋼。
- 引張強度≧500MPa、降伏強度は370~510MPaであり、伸び≧30%であることを特徴とする請求項1に記載された耐食ストリップ鋼。
- 以下のステップを含むことを特徴とする請求項1-8のいずれか一つに記載された耐食ストリップ鋼の製造方法:
(1)基底層材料として炭素鋼の基底層を得、被覆層材料として耐食層を得る;
(2)ビレットの組み立;
(3)予備加熱:ビレットを1150~1250℃の温度で予備加熱し、耐食層と炭素鋼の基底層の各元素が、界面での拡散を発生し、安定的な遷移層を形成した後、室温まで徐冷する;
(4)二次加熱と圧延:1100~1200℃の温度で二次加熱し、複数パスの圧延を行い、最終圧延温度を900℃以上に制御する;
(5)水冷の後に、巻取りを行う。 - ステップ(4)において、圧延の総圧下率は70%以上であることを特徴とする請求項8に記載された製造方法。
- ステップ(4)において、最終圧延温度を920~1000℃に制御することを特徴とする請求項8に記載された製造方法。
- ステップ(5)において、巻取り温度を500~650℃に制御することを特徴とする請求項8に記載された製造方法。
- ステップ(5)の後に、さらに表面処理ステップ又は冷間圧延ステップを含むことを特徴とする請求項8に記載された製造方法。
- 前記の表面処理ステップは、酸洗又は机械法スケール除去を含み、前記冷間圧延ステップにおいて、冷間圧延焼鈍温度を、600~750℃に制御することを特徴とする請求項13に記載された製造方法。
- ステップ(1)において、被覆層材料の各層の厚さは、5~20mmであり、基底層材料の厚さは、300~370mmであることを特徴とする請求項8に記載された製造方法。
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US20220396054A1 (en) | 2022-12-15 |
AU2021207953A1 (en) | 2022-07-14 |
EP4092151A1 (en) | 2022-11-23 |
KR20220127234A (ko) | 2022-09-19 |
CN113106327B (zh) | 2022-06-24 |
WO2021143661A1 (zh) | 2021-07-22 |
CN113106327A (zh) | 2021-07-13 |
EP4092151A4 (en) | 2022-11-23 |
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