JP2023176391A - Imaging apparatus - Google Patents
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- JP2023176391A JP2023176391A JP2022088647A JP2022088647A JP2023176391A JP 2023176391 A JP2023176391 A JP 2023176391A JP 2022088647 A JP2022088647 A JP 2022088647A JP 2022088647 A JP2022088647 A JP 2022088647A JP 2023176391 A JP2023176391 A JP 2023176391A
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- 238000003384 imaging method Methods 0.000 title claims abstract description 127
- 239000000463 material Substances 0.000 claims abstract description 27
- 230000003287 optical effect Effects 0.000 claims description 21
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 10
- 229920000515 polycarbonate Polymers 0.000 claims description 4
- 239000004417 polycarbonate Substances 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000000034 method Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
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Abstract
Description
本発明は、撮像装置に関し、特にフランジバックの変化を抑制する技術に関する。 The present invention relates to an imaging device, and particularly to a technique for suppressing changes in flange back.
ＣＭＯＳセンサ等の撮像素子による撮像を行う撮像装置では、撮像素子の高画素化に伴い、撮像素子の撮像光軸に対する傾き及び撮像素子のフランジバックに対して高い精度が求められている。そこで、例えば特許文献１は、撮像素子の周辺の温度情報と撮像装置のフランジバックとの関係を記憶する手段を備えた撮像装置を開示している。特許文献１に記載された技術によれば、ユーザが想定する任意の使用環境下（例えば、寒冷地や猛暑地等）での使用時にフランジバックのずれを軽減させることができる。 2. Description of the Related Art In an imaging device that captures an image using an image sensor such as a CMOS sensor, as the number of pixels in the image sensor increases, high precision is required for the tilt of the image sensor with respect to the imaging optical axis and the flange back of the image sensor. Therefore, for example, Patent Document 1 discloses an imaging device including means for storing the relationship between temperature information around an imaging element and flange back of the imaging device. According to the technology described in Patent Document 1, it is possible to reduce the displacement of the flange back when the device is used in any usage environment that the user envisions (for example, in a cold region or a very hot region).
撮像素子は動作時に発熱し、特に動画撮影時には発熱量が大きくなる。そのため、撮像素子で生じた熱によって撮像装置の筐体が膨張することで、撮像素子の傾きやフランジバックが変化してしまうことがある。 The image sensor generates heat during operation, and the amount of heat generated is particularly large when shooting a video. Therefore, the casing of the imaging device expands due to the heat generated by the imaging device, which may change the tilt or flange back of the imaging device.
この問題に対して、上記特許文献１に開示された技術は、使用者が想定した使用環境下におけるフランジバックのずれを事前に調整しておくものであって、撮影時に撮像素子に生じる熱によってフランジバックが変化していく状況に対処することはできない。 To solve this problem, the technology disclosed in Patent Document 1 adjusts the flange back shift in advance under the usage environment assumed by the user, and the technology is designed to adjust the flange back shift in advance under the usage environment assumed by the user. It is not possible to deal with the changing situation of flange back.
本発明は、このような事情に鑑みてなされたものであり、駆動によって発生する熱に起因するフランジバックの変化を低減させることが可能な撮像装置を提供することを目的とする。 The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an imaging device that can reduce changes in flange back due to heat generated by driving.
本発明に係る撮像装置は、レンズマウントと、撮像素子を有する撮像ユニットと、前記レンズマウントと前記撮像ユニットが取り付けられる筐体と、を備える撮像装置であって、前記筐体よりも熱伝導率の小さい材料で形成され、前記撮像ユニットと前記筐体に挟持されて前記撮像装置のフランジバックを調整する調整部材を有することを特徴とする。 An imaging device according to the present invention includes a lens mount, an imaging unit having an imaging element, and a housing to which the lens mount and the imaging unit are attached, the imaging device having a higher thermal conductivity than the housing. The image pickup apparatus is characterized by having an adjustment member that is made of a material with a small size and that is held between the image pickup unit and the housing to adjust the flange back of the image pickup apparatus.
本発明によれば、駆動によって発生する熱に起因するフランジバックの変化を低減させることが可能になる。 According to the present invention, it is possible to reduce changes in flange back caused by heat generated by driving.
以下、本発明の実施形態について、添付図面を参照して詳細に説明する。 Embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
図１は、本発明の実施形態に係る撮像装置１００の正面図である。なお、撮像装置１００に内包される後述の撮像ユニット２００（図２参照）の撮像装置１００との位置関係を明確にするために、図１に示す三次元直交座標系を規定する。Ｚ軸は撮像光軸と平行な軸であり、撮像装置１００から不図示の被写体に向かう方向を正方向とする。Ｘ軸は、Ｚ軸が水平面内にあるときに同水平面内においてＺ軸と直交する軸である。Ｙ軸は、Ｘ軸及びＺ軸が水平面内にあるときに同水平面と直交する軸である。 FIG. 1 is a front view of an imaging device 100 according to an embodiment of the present invention. Note that in order to clarify the positional relationship with the imaging device 100 of an imaging unit 200 (see FIG. 2) included in the imaging device 100, which will be described later, a three-dimensional orthogonal coordinate system shown in FIG. 1 is defined. The Z-axis is an axis parallel to the imaging optical axis, and the direction from the imaging device 100 toward a subject (not shown) is defined as the positive direction. The X-axis is an axis that is perpendicular to the Z-axis in the horizontal plane when the Z-axis is in the horizontal plane. The Y-axis is an axis that is orthogonal to the horizontal plane when the X-axis and the Z-axis are in the horizontal plane.
撮像装置１００の前面には、不図示のレンズ鏡筒（交換レンズ）の着脱を可能とするレンズマウント１０１と、レンズマウント１０１にレンズ鏡筒が装着されている場合にレンズ鏡筒を取り外すためのレンズロック解除ボタン１０３が設けられている。レンズマウント１０１には、レンズロックピン１０２が設けられている。レンズロックピン１０２は、レンズロック解除ボタン１０３が押し下げられて（－Ｚ側へ押下されて）いない状態では、レンズマウント１０１の当接面から＋Ｚ側に突出している。レンズロックピン１０２は、レンズロック解除ボタン１０３が押し下げられると、レンズマウント１０１の当接面から－Ｚ側に埋没する。 On the front of the imaging device 100, there is a lens mount 101 that allows a lens barrel (not shown) (interchangeable lens) to be attached and detached, and a lens barrel that is used to remove the lens barrel when the lens barrel is attached to the lens mount 101. A lens lock release button 103 is provided. A lens lock pin 102 is provided on the lens mount 101. The lens lock pin 102 protrudes from the contact surface of the lens mount 101 toward the +Z side when the lens lock release button 103 is not pressed down (not pushed down toward the −Z side). When the lens lock release button 103 is pressed down, the lens lock pin 102 is buried in the -Z side from the contact surface of the lens mount 101.
図２は、撮像装置１００におけるレンズマウント１０１と撮像ユニット２００の構造的関係を示す分解斜視図である。レンズマウント１０１は、撮像装置１００の筐体２０１に固定されている。ここで、筐体２０１とは、撮像装置１００の筐体全体ではなく、撮像装置１００の前面側の部分を指す。具体的には、筐体２０１は、レンズマウント１０１と撮像ユニット２００が取り付られ、撮像光軸方向において主にレンズマウント１０１と撮像ユニット２００のベースプレート２０４との間に存在する部分を指すものとする。 FIG. 2 is an exploded perspective view showing the structural relationship between the lens mount 101 and the imaging unit 200 in the imaging device 100. The lens mount 101 is fixed to the housing 201 of the imaging device 100. Here, the casing 201 refers to the front side portion of the imaging device 100, not the entire casing of the imaging device 100. Specifically, the housing 201 refers to a portion to which the lens mount 101 and the imaging unit 200 are attached, and which mainly exists between the lens mount 101 and the base plate 204 of the imaging unit 200 in the imaging optical axis direction. do.
撮像ユニット２００は、大略的に可動ユニットと固定ユニットから構成されており、像振れ補正機能を有する。可動ユニットは、撮像素子２０２と、撮像素子２０２を保持する撮像基板２０３（図３参照）と、撮像基板２０３を保持する保持部材等を有する。固定ユニットは、撮像素子２０２の撮像面と平行な平面内（撮像光軸と直交する平面内）で可動ユニットを揺動可能（並進及び回転可能）に保持している。撮像装置１００の振れを打ち消すように可動ユニットを揺動させることにより、像振れ補正を行うことができる。なお、固定ユニットが可動ユニットを揺動可能に保持する構成は、公知の構成でよいため、詳細な説明を省略する。 The imaging unit 200 is roughly composed of a movable unit and a fixed unit, and has an image blur correction function. The movable unit includes an imaging device 202, an imaging board 203 (see FIG. 3) that holds the imaging device 202, a holding member that holds the imaging board 203, and the like. The fixed unit holds the movable unit so as to be swingable (translatable and rotatable) within a plane parallel to the imaging surface of the image sensor 202 (in a plane perpendicular to the imaging optical axis). Image shake can be corrected by swinging the movable unit so as to cancel the shake of the imaging device 100. Note that the configuration in which the fixed unit swingably holds the movable unit may be a known configuration, so detailed description thereof will be omitted.
固定ユニットは、筐体２０１に固定されるベースプレート２０４を備える。ベースプレート２０４の３カ所に設けられた穴にビス２０６が挿入され、ビス２０６が筐体２０１に締結されることにより、撮像ユニット２００は筐体２０１に固定される。ここで、ビス２０６によりベースプレート２０４が筐体２０１に取り付けられる位置において、ベースプレート２０４と筐体２０１の間に調整部材２０５Ａ，２０５Ｂ，２０５Ｃが配置されている。筐体２０１には、調整部材２０５Ａを位置決めするための係合突部２１１，２１２と、調整部材２０５Ｂを位置決めするための係合突部２１５，２１６と、調整部材２０５Ｃを位置決めするための係合突部２１３，２１４が設けられている。 The fixed unit includes a base plate 204 fixed to the housing 201. The imaging unit 200 is fixed to the housing 201 by inserting screws 206 into holes provided at three locations in the base plate 204 and fastening the screws 206 to the housing 201. Here, adjustment members 205A, 205B, and 205C are arranged between the base plate 204 and the housing 201 at positions where the base plate 204 is attached to the housing 201 with the screws 206. The housing 201 includes engagement protrusions 211 and 212 for positioning the adjustment member 205A, engagement protrusions 215 and 216 for positioning the adjustment member 205B, and engagement protrusions for positioning the adjustment member 205C. Projections 213 and 214 are provided.
なお、ここでは、撮像ユニット２００として像振れ補正機能を有するものを取り上げているが、撮像ユニット２００は、像振れ補正機能を備えていなくともよい。その場合、撮像素子２０２が実装された撮像基板２０３か又は撮像基板２０３を保持する保持部材が、調整部材２０５Ａ，２０５Ｂ，２０５Ｃを挟んで筐体２０１に対して固定され、以下に説明する効果と同じ効果を得ることができる。 Note that although the imaging unit 200 has an image blur correction function here, the imaging unit 200 does not need to have an image blur correction function. In that case, the imaging board 203 on which the imaging element 202 is mounted or the holding member that holds the imaging board 203 is fixed to the housing 201 with the adjustment members 205A, 205B, and 205C in between, and the effects described below are achieved. You can get the same effect.
図３は、レンズマウント１０１と撮像ユニット２００を含む、撮像装置１００の部分的な断面図であり、撮像光軸を含むＹＺ平面での断面構造を表している。フランジバック３０１は、図３に示されるように、撮像光軸方向であるＺ方向におけるレンズマウント１０１から撮像素子２０２までの距離と定義される。フランジバック３０１はレンズの焦点距離に合わせて精密に調整される必要があり、フランジバック３０１が変化すると、合焦精度が低下し（被写体にピントが合わなくなり）、撮影画像の品質が低下してしまう。撮像装置１００のフランジバック３０１の調整は、撮像装置１００の組立工程（製造工程）において、調整部材２０５Ａ，２０５Ｂ，２０５Ｃそれぞれの厚みを適切に選択することにより行われる。 FIG. 3 is a partial cross-sectional view of the imaging device 100 including the lens mount 101 and the imaging unit 200, and represents the cross-sectional structure in the YZ plane including the imaging optical axis. As shown in FIG. 3, the flange back 301 is defined as the distance from the lens mount 101 to the image sensor 202 in the Z direction, which is the imaging optical axis direction. The flange back 301 needs to be precisely adjusted according to the focal length of the lens, and if the flange back 301 changes, the focusing accuracy will decrease (the subject will no longer be in focus) and the quality of the captured image will deteriorate. Put it away. Adjustment of the flange back 301 of the imaging device 100 is performed by appropriately selecting the thickness of each of the adjustment members 205A, 205B, and 205C in the assembly process (manufacturing process) of the imaging device 100.
図４は、調整部材２０５Ａの構成を説明する図である。調整部材２０５Ａは、平板部２０５１と、平板部２０５１に設けられた１カ所の穴２０５２及び２カ所の突起部２０５０を有する。平板部２０５１は、その表裏面が撮像光軸と略直交するように、撮像光軸方向において筐体２０１とベースプレート２０４に挟持される部分である。 FIG. 4 is a diagram illustrating the configuration of the adjustment member 205A. The adjustment member 205A has a flat plate portion 2051, one hole 2052 provided in the flat plate portion 2051, and two protrusions 2050. The flat plate portion 2051 is a portion that is held between the housing 201 and the base plate 204 in the direction of the imaging optical axis so that its front and back surfaces are substantially orthogonal to the imaging optical axis.
突起部２０５０は、円筒状の形状を有しており、平板部２０５１から撮像光軸方向に突出し、中心穴である係合穴２０５３は突起部２０５０の突出方向（平板部２０５１の平面と直交する方向）に貫通している。係合突部２１１，２１２がそれぞれ突起部２０５０の係合穴２０５３に挿入された状態で、ビス２０６が穴２０５２に挿入されて筐体２０１に螺合、固定される。これにより、調整部材２０５Ａは、筐体２０１とベースプレート２０４に挟持された状態で、筐体２０１に固定される。 The protrusion 2050 has a cylindrical shape and protrudes from the flat plate part 2051 in the direction of the imaging optical axis. direction). With the engagement protrusions 211 and 212 inserted into the engagement holes 2053 of the protrusion 2050, the screws 206 are inserted into the holes 2052 and screwed and fixed to the housing 201. Thereby, the adjustment member 205A is fixed to the housing 201 while being held between the housing 201 and the base plate 204.
調整部材２０５Ａの２カ所の突起部２０５０はそれぞれ、内周側円筒部２０５４及び外周側円筒部２０５５から成る２層構造を有している。平板部２０５１と内周側円筒部２０５４は、筐体２０１に用いられている材料（例えば、ポリカーボネイト等の樹脂材料、マグネシウム（ダイカスト）等の金属）よりも熱伝導率の小さい材料（例えば、ジルコニア等のセラミックス）で形成されている。なお、平板部２０５１は筐体２０１と比較して厚みが薄いため、熱膨張率が高くても平板部２０５１の熱膨張によるフランジバック変化の影響は無視できる程度に小さい。しかしながら、熱膨張率も筐体２０１に用いられている材料よりも小さい材料を選ぶことが望ましい。また、外周側円筒部２０５５は、内周側円筒部２０５４よりも線膨張率の小さい材料（例えば、ポリカーボネイト等の樹脂材料）で形成されている。 The two projections 2050 of the adjustment member 205A each have a two-layer structure consisting of an inner cylindrical portion 2054 and an outer cylindrical portion 2055. The flat plate part 2051 and the inner cylindrical part 2054 are made of a material (for example, zirconia) having a lower thermal conductivity than the material used for the housing 201 (for example, a resin material such as polycarbonate, a metal such as magnesium (die-cast)). It is made of ceramics such as Note that since the flat plate portion 2051 is thinner than the housing 201, even if the coefficient of thermal expansion is high, the influence of flange back change due to thermal expansion of the flat plate portion 2051 is negligibly small. However, it is desirable to select a material whose coefficient of thermal expansion is also smaller than that of the material used for the housing 201. Further, the outer cylindrical portion 2055 is made of a material having a smaller linear expansion coefficient than the inner cylindrical portion 2054 (for example, a resin material such as polycarbonate).
図５は、調整部材２０５Ａが筐体２０１とベースプレート２０４に挟持されている状態を示す断面図であり、調整部材２０５Ａの２カ所の突起部２０５０の係合穴２０５３の中心を通り、且つ、平板部２０５１と直交する平面で切断した断面図を表している。 FIG. 5 is a cross-sectional view showing a state in which the adjustment member 205A is held between the housing 201 and the base plate 204. A cross-sectional view taken along a plane perpendicular to portion 2051 is shown.
撮像素子２０２は光電変換による画像信号の生成時に発熱し、特に動画撮影時のように連続駆動を行うと、撮像素子２０２の発熱量が大きくなる。撮像素子２０２で発生した熱がベースプレート２０４を介して筐体２０１に伝わると、筐体２０１が熱膨張することでフランジバック３０１の変化が大きくなってしまうため、ベースプレート２０４から筐体２０１への熱伝達を抑制する必要がある。 The image sensor 202 generates heat when generating an image signal through photoelectric conversion, and the amount of heat generated by the image sensor 202 becomes large, especially when continuously driven as when shooting a moving image. When the heat generated in the image sensor 202 is transferred to the housing 201 via the base plate 204, the housing 201 thermally expands and the change in the flange back 301 becomes large. It is necessary to suppress transmission.
この課題に対して本実施形態では、調整部材２０５Ａにおいて突起部２０５０の内周側円筒部２０５４を熱伝導率の小さい材料で構成しているため、調整部材２０５Ａを介したベースプレート２０４から筐体２０１への熱伝達が抑制される。これにより、筐体２０１の熱膨張が抑制されることにより、フランジバック３０１の変化を低減させることができる。また、外周側円筒部２０５５を熱膨張率の小さい材料で構成することにより、突起部２０５０の全体的な熱膨張量を低減させて、突起部２０５０が挿入されるベースプレート２０４の穴と突起部２０５０との干渉を抑制されるよう構成されている。但し、内周側円筒部２０５４を構成する材料の線膨張率が小さい場合等、熱による変形量が無視可能な程度に小さい場合には、外周側円筒部２０５５を設ける必要はない。 To solve this problem, in the present embodiment, the inner cylindrical portion 2054 of the protrusion 2050 in the adjustment member 205A is made of a material with low thermal conductivity, so that the adjustment member 205A is connected to the housing 201 from the base plate 204. Heat transfer to is suppressed. This suppresses thermal expansion of the housing 201, thereby reducing changes in the flange back 301. Furthermore, by forming the outer circumferential cylindrical portion 2055 from a material with a small coefficient of thermal expansion, the overall amount of thermal expansion of the protrusion 2050 is reduced, and the protrusion 2055 is connected to the hole of the base plate 204 into which the protrusion 2050 is inserted. It is configured to suppress interference with the However, if the amount of deformation due to heat is negligibly small, such as when the coefficient of linear expansion of the material forming the inner cylindrical portion 2054 is small, it is not necessary to provide the outer cylindrical portion 2055.
このように、本実施形態に係る撮像装置１００によれば、撮像素子２０２の発熱に起因するフランジバックの変化を低減させることができ、これにより、例えば、長時間の動画撮影でも高画質の映像を取得することが可能となる。なお、調整部材２０５Ａ，２０５Ｂ，２０５Ｃはそれぞれ、形状は異なるが、平板部の形状及び平板部に設けられた穴部及び突起部の位置や数が異なるだけであり、同等の構成及び機能を有しているため、調整部材２０５Ｂ，２０５Ｃについての説明は省略する。 As described above, according to the imaging device 100 according to the present embodiment, it is possible to reduce changes in flange back due to heat generation of the imaging element 202, and thereby, for example, it is possible to produce high-quality images even during long-time video shooting. It becomes possible to obtain. Although the adjustment members 205A, 205B, and 205C have different shapes, they differ only in the shape of the flat plate part and the positions and numbers of holes and protrusions provided in the flat plate part, and have the same configuration and function. Therefore, a description of the adjustment members 205B and 205C will be omitted.
なお、上記実施形態では、撮像素子２０２から筐体２０１への係合突部２１１～２１６が介在する熱伝達経路での熱伝達を抑制する構成について説明したが、筐体２０１への他の熱伝達経路としてビス２０６を介した熱伝達経路が考えられる。この場合、ビス２０６を熱伝導率の小さい材料で形成することにより、ビス２０６を通じた熱伝達経路での熱伝達を抑制して、フランジバックの変化を抑制することができる。ビス２０６の緩みを防止するための接着剤をビス２０６とベースプレート２０４及び／又は筐体２０１との間に塗布する場合、接着剤にも熱伝導性の低いものを用いることが望ましい。 Note that in the above embodiment, a configuration has been described in which heat transfer from the image sensor 202 to the housing 201 is suppressed in a heat transfer path in which the engaging protrusions 211 to 216 are interposed; A heat transfer path via the screw 206 can be considered as the transfer path. In this case, by forming the screws 206 from a material with low thermal conductivity, heat transfer in the heat transfer path through the screws 206 can be suppressed, and changes in flange back can be suppressed. When applying an adhesive between the screws 206 and the base plate 204 and/or the housing 201 to prevent the screws 206 from loosening, it is desirable to use an adhesive with low thermal conductivity.
以上、本発明をその好適な実施形態に基づいて詳述してきたが、本発明はこれら特定の実施形態に限られるものではなく、この発明の要旨を逸脱しない範囲の様々な形態も本発明に含まれる。更に、上述した各実施形態は本発明の一実施形態を示すものにすぎず、各実施形態を適宜組み合わせることも可能である。 Although the present invention has been described above in detail based on its preferred embodiments, the present invention is not limited to these specific embodiments, and the present invention may take various forms without departing from the gist of the present invention. included. Further, each of the embodiments described above is merely one embodiment of the present invention, and each embodiment can be combined as appropriate.
例えば、上記実施形態では、撮像素子２０２を発熱源として、撮像素子２０２で発生した熱が筐体２０１に伝わり難い構成を説明したが、発熱源は撮像素子２０２に限られない。例えば、筐体２０１には、電子ファインダユニットが固定されるケースがある。この場合、電子ファインダユニットで発生した熱が筐体２０１に伝わり難くなるように、熱伝導率の小さい材料で形成された部材を筐体２０１と電子ファインダユニットの間に配置することにより、フランジバックの変化を抑制することができる。 For example, in the above embodiment, a configuration has been described in which the heat generated by the image sensor 202 is difficult to be transmitted to the housing 201 using the image sensor 202 as the heat source, but the heat source is not limited to the image sensor 202. For example, there is a case in which an electronic finder unit is fixed to the housing 201. In this case, by placing a member made of a material with low thermal conductivity between the housing 201 and the electronic finder unit so that the heat generated by the electronic finder unit is difficult to transfer to the housing 201, the flange back changes can be suppressed.
本実施形態の開示は、以下の構成および方法を含む。
（構成１）レンズマウントと、撮像素子を有する撮像ユニットと、前記レンズマウントと前記撮像ユニットが取り付けられる筐体と、を備える撮像装置であって、前記撮像ユニットと前記筐体に挟持されて前記撮像装置のフランジバックを調整する調整部材と、を備え、前記調整部材は前記筐体よりも熱伝導率の小さい材料で形成されていることを特徴とする撮像装置。
（構成２）前記調整部材は、その表裏面が撮像光軸と略直交するように、前記撮像装置の撮像光軸方向において前記筐体と前記撮像ユニットに挟持される平板部と、前記平板部から前記撮像光軸方向に突出し、前記筐体に設けられた係合突起と係合する係合穴を有する円筒状の突起部と、を有し、前記平板部と前記突起部は前記筐体よりも熱伝導率の小さい材料からなることを特徴とする構成１に記載の撮像装置。
（構成３）前記平板部および前記突起部はジルコニアからなることを特徴とする構成２に記載の撮像装置。
（構成４）前記調整部材は、その表裏面が撮像光軸と略直交するように、前記撮像装置の撮像光軸方向において前記筐体と前記撮像ユニットに挟持される平板部と、前記平板部から前記撮像光軸方向に突出し、前記筐体に設けられた係合突起と係合する係合穴を有する円筒状の突起部と、を有し、前記突起部は、前記筐体よりも熱伝導率の小さい材料からなる内周側円筒部と、前記内周側円筒部の外周側に設けられ、前記内周側円筒部よりも線膨張率の小さい材料からなる外周側円筒部と、を有することを特徴とする構成１に記載の撮像装置。
（構成５）前記平板部および前記内周側円筒部はジルコニアからなり、前記外周側円筒部はポリカーボネートからなることを特徴とする構成４に記載の撮像装置。
（構成６）前記撮像ユニットは、前記撮像ユニットに設けられた穴と前記調整部材に設けられた穴挿入されたビスが前記筐体に締結することにより前記筐体に固定され、前記ビスは前記筐体よりも熱伝導率の小さい材料からなることを特徴とする構成１乃至５のいずれか１つに記載の撮像装置。
（構成７）撮像素子を有する撮像ユニットおよびレンズマウントが取り付けられる筐体と、駆動により熱を発生する発熱源と前記筐体との間に介在する部材と、を備え、前記部材は前記筐体よりも熱伝導率の小さい材料からなることを特徴とする撮像装置。
（構成８）前記発熱源は電子ファインダユニットであることを特徴とする構成７に記載の撮像装置。
The disclosure of this embodiment includes the following configuration and method.
(Structure 1) An imaging device including a lens mount, an imaging unit having an image sensor, and a housing to which the lens mount and the imaging unit are attached, the imaging device being sandwiched between the imaging unit and the housing, An imaging device comprising: an adjustment member for adjusting flange back of the imaging device, the adjustment member being made of a material having a lower thermal conductivity than the casing.
(Structure 2) The adjustment member includes a flat plate portion that is held between the housing and the imaging unit in the direction of the imaging optical axis of the imaging device so that the front and back surfaces thereof are substantially orthogonal to the imaging optical axis; a cylindrical protrusion that protrudes in the direction of the imaging optical axis from the casing and has an engagement hole that engages with an engagement protrusion provided on the casing, and the flat plate part and the protrusion are connected to the casing. The imaging device according to configuration 1, wherein the imaging device is made of a material whose thermal conductivity is lower than that of the imaging device.
(Structure 3) The imaging device according to Structure 2, wherein the flat plate part and the projection part are made of zirconia.
(Structure 4) The adjustment member includes a flat plate part that is held between the housing and the imaging unit in the direction of the imaging optical axis of the imaging device so that the front and back surfaces thereof are substantially orthogonal to the imaging optical axis, and the flat plate part. a cylindrical protrusion that protrudes in the direction of the imaging optical axis from the casing and has an engagement hole that engages with an engagement protrusion provided on the casing, the protrusion having a lower temperature than the casing; an inner cylindrical part made of a material with low conductivity; and an outer cylindrical part provided on the outer periphery of the inner cylindrical part and made of a material with a coefficient of linear expansion smaller than that of the inner cylindrical part. The imaging device according to Configuration 1, comprising:
(Structure 5) The imaging device according to Structure 4, wherein the flat plate part and the inner cylindrical part are made of zirconia, and the outer cylindrical part is made of polycarbonate.
(Structure 6) The imaging unit is fixed to the casing by fastening screws inserted into holes provided in the imaging unit and holes provided in the adjustment member to the casing, and the screws are fastened to the casing. 6. The imaging device according to any one of configurations 1 to 5, characterized in that the imaging device is made of a material having a lower thermal conductivity than the casing.
(Structure 7) A casing to which an imaging unit having an image sensor and a lens mount are attached, and a member interposed between the casing and a heat generating source that generates heat when driven, the member being connected to the casing. An imaging device characterized in that it is made of a material with a lower thermal conductivity than that of the material.
(Structure 8) The imaging device according to Structure 7, wherein the heat source is an electronic finder unit.
１００ 撮像装置
１０１ レンズマウント
２００ 撮像ユニット
２０１ 筐体
２０２ 撮像素子
２０４ ベースプレート
２０５Ａ～２０５Ｃ 調整部材
２０６ ビス
２１１～２１６ 係合突部
２０５０ 突起部
２０５１ 平板部
２０５３ 係合穴
２０５４ 内周側円筒部
２０５５ 外周側円筒部
100 Imaging device 101 Lens mount 200 Imaging unit 201 Housing 202 Imaging element 204 Base plate 205A to 205C Adjustment member 206 Screw 211 to 216 Engagement protrusion 2050 Projection 2051 Flat plate part 2053 Engagement hole 2054 Inner circumferential cylindrical part 2055 outer circumference side Cylindrical part
Claims (8)
撮像素子を有する撮像ユニットと、
前記レンズマウントと前記撮像ユニットが取り付けられる筐体と、を備える撮像装置であって、
前記筐体よりも熱伝導率の小さい材料で形成され、前記撮像ユニットと前記筐体に挟持されて前記撮像装置のフランジバックを調整する調整部材を有することを特徴とする撮像装置。 lens mount and
an imaging unit having an imaging element;
An imaging device comprising the lens mount and a housing to which the imaging unit is attached,
An imaging device comprising: an adjustment member made of a material having a lower thermal conductivity than the casing, which is held between the imaging unit and the casing to adjust flange back of the imaging device.
その表裏面が撮像光軸と略直交するように、前記撮像装置の撮像光軸方向において前記筐体と前記撮像ユニットに挟持される平板部と、
前記平板部から前記撮像光軸方向に突出し、前記筐体に設けられた係合突起と係合する係合穴を有する円筒状の突起部と、を有し、
前記平板部と前記突起部は前記筐体よりも熱伝導率の小さい材料からなることを特徴とする請求項１に記載の撮像装置。 The adjustment member is
a flat plate portion sandwiched between the housing and the imaging unit in the direction of the imaging optical axis of the imaging device so that its front and back surfaces are substantially perpendicular to the imaging optical axis;
a cylindrical protrusion protruding from the flat plate part in the imaging optical axis direction and having an engagement hole that engages with an engagement protrusion provided on the housing;
The imaging device according to claim 1, wherein the flat plate portion and the projection portion are made of a material having a lower thermal conductivity than the casing.
その表裏面が撮像光軸と略直交するように、前記撮像装置の撮像光軸方向において前記筐体と前記撮像ユニットに挟持される平板部と、
前記平板部から前記撮像光軸方向に突出し、前記筐体に設けられた係合突起と係合する係合穴を有する円筒状の突起部と、を有し、
前記突起部は、
前記筐体よりも熱伝導率の小さい材料からなる内周側円筒部と、
前記内周側円筒部の外周側に設けられ、前記内周側円筒部よりも線膨張率の小さい材料からなる外周側円筒部と、を有することを特徴とする請求項１に記載の撮像装置。 The adjustment member is
a flat plate portion sandwiched between the housing and the imaging unit in the direction of the imaging optical axis of the imaging device so that its front and back surfaces are substantially perpendicular to the imaging optical axis;
a cylindrical protrusion protruding from the flat plate part in the imaging optical axis direction and having an engagement hole that engages with an engagement protrusion provided on the housing;
The protrusion is
an inner cylindrical portion made of a material having a lower thermal conductivity than the housing;
The imaging device according to claim 1, further comprising: an outer cylindrical part provided on the outer periphery of the inner cylindrical part and made of a material having a coefficient of linear expansion smaller than that of the inner cylindrical part. .
前記外周側円筒部はポリカーボネートからなることを特徴とする請求項４に記載の撮像装置。 The flat plate portion and the inner cylindrical portion are made of zirconia,
The imaging device according to claim 4, wherein the outer peripheral cylindrical portion is made of polycarbonate.
前記ビスは前記筐体よりも熱伝導率の小さい材料からなることを特徴とする請求項１に記載の撮像装置。 The imaging unit is fixed to the casing by fastening to the casing a screw inserted into a hole provided in the imaging unit and a hole provided in the adjustment member,
The imaging device according to claim 1, wherein the screw is made of a material having a lower thermal conductivity than the casing.
駆動により熱を発生する発熱源と前記筐体との間に介在する部材と、を備え、
前記部材は前記筐体よりも熱伝導率の小さい材料からなることを特徴とする撮像装置。 a housing to which an imaging unit having an imaging element and a lens mount are attached;
a member interposed between a heat generating source that generates heat when driven and the casing;
An imaging device characterized in that the member is made of a material having a lower thermal conductivity than the casing.
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