JP2023156384A - 表示装置 - Google Patents
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- JP2023156384A JP2023156384A JP2023125441A JP2023125441A JP2023156384A JP 2023156384 A JP2023156384 A JP 2023156384A JP 2023125441 A JP2023125441 A JP 2023125441A JP 2023125441 A JP2023125441 A JP 2023125441A JP 2023156384 A JP2023156384 A JP 2023156384A
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- 239000000758 substrate Substances 0.000 claims abstract description 66
- 239000010408 film Substances 0.000 description 142
- 239000010410 layer Substances 0.000 description 52
- 239000004065 semiconductor Substances 0.000 description 38
- 229910052751 metal Inorganic materials 0.000 description 30
- 239000002184 metal Substances 0.000 description 30
- 230000004048 modification Effects 0.000 description 24
- 238000012986 modification Methods 0.000 description 24
- 239000006059 cover glass Substances 0.000 description 17
- 239000010936 titanium Substances 0.000 description 16
- 239000011295 pitch Substances 0.000 description 15
- 239000003990 capacitor Substances 0.000 description 11
- 239000011229 interlayer Substances 0.000 description 11
- 229910052782 aluminium Inorganic materials 0.000 description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 7
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 239000011733 molybdenum Substances 0.000 description 7
- 229910052750 molybdenum Inorganic materials 0.000 description 7
- 229910052719 titanium Inorganic materials 0.000 description 7
- 238000002834 transmittance Methods 0.000 description 7
- 230000002093 peripheral effect Effects 0.000 description 6
- 239000004020 conductor Substances 0.000 description 4
- 239000011368 organic material Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- -1 aluminum indium phosphorus Chemical compound 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 238000005253 cladding Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910002601 GaN Inorganic materials 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1248—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or shape of the interlayer dielectric specially adapted to the circuit arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1255—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs integrated with passive devices, e.g. auxiliary capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Theoretical Computer Science (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
- Led Device Packages (AREA)
Abstract
Description
図1は、第1実施形態に係る表示装置を模式的に示す平面図である。図1に示すように、表示装置1は、アレイ基板2と、画素Pixと、駆動回路12と、駆動IC(Integrated Circuit)210と、カソード配線60と、を含む。アレイ基板2は、各画素Pixを駆動するための駆動回路基板であり、バックプレーン又はアクティブマトリクス基板とも呼ばれる。アレイ基板2は、基板21、複数のトランジスタ、複数の容量及び各種配線等を有する。特に図示しないが、アレイ基板2上には、駆動回路12及び駆動IC210を駆動するための制御信号及び電力を入力するためのフレキシブルプリント基板(FPC)等が接続されていてもよい。
図12は、第1変形例に係る信号線の積層構造を説明するための説明図である。なお、以下の説明において、上述した実施形態で説明した構成要素については、同じ符号を付して、説明を省略する。図12に示すように、変形例の信号線SLAは、黒色部材54に加え、黒色部材55を有する。黒色部材54、55は、それぞれ、金属膜51、52、53の表面及び裏面に設けられる。具体的には、信号線SLAは、層間絶縁膜93の上に黒色部材55、金属膜51、52、53、黒色部材54の順に積層される。言い換えると、黒色部材55は基板21と金属膜51との間に設けられる。
図13は、第2変形例に係る表示装置を模式的に示す断面図である。図13に示すように、第2変形例に係る表示装置1Aにおいて、透光領域CAでは、基板21の第1主面21Aの上に、第1有機絶縁膜94及び第2有機絶縁膜96が積層されている。第2有機絶縁膜96の上に、空隙SPを介してカバーガラス101が設けられている。
図14は、第3変形例に係る表示装置を模式的に示す断面図である。第3変形例の表示装置1Bでは、上述した第1実施形態及び第2変形例に比べて、素子絶縁膜97が、各発光素子3にそれぞれ設けられる構成が異なる。図14に示すように、素子絶縁膜97は、各発光素子3の側面及び実装電極24の外縁を覆って設けられる。隣り合う発光素子3の間で、素子絶縁膜97は凹状に設けられる。カソード電極22は、発光素子3の上面及び素子絶縁膜97で形成される凹凸形状に倣って形成される。
図15は、第2実施形態に係る表示装置の、複数の画素を模式的に示す平面図である。上述した第1実施形態では、第1方向Dxに隣接する2つの画素Pixで、複数の発光素子3と、複数の信号線SLとがひとまとまりに近接して配置される構成を説明したが、これに限定されない。
図17は、第2実施形態の第4変形例に係る表示装置の、複数の画素を模式的に示す平面図である。図18は、図17の1つの画素を拡大して示す平面図である。図18では、例えば画素Pix(1、1)を拡大して示している。
2 アレイ基板
3 発光素子
3R 第1発光素子
3G 第2発光素子
3B 第3発光素子
12 駆動回路
21 基板
22 カソード電極
23 アノード電極
24 実装電極
25 対向電極
31 半導体層
32 カソード端子
33 アノード端子
49 副画素
51、52、53、56、57、58 金属膜
54、55、59 黒色部材
60 カソード配線
101 カバーガラス
210 駆動IC
CA 透光領域
NCA 非透光領域
DRT 駆動トランジスタ
SST 書込トランジスタ
SL 信号線
SL-1 第1信号線
SL-2 第2信号線
SL-3 第3信号線
LVDD アノード電源線
LVSS カソード電源線
Pix 画素
Px-CA、Py-CA、Px-NCA、Py-NCA 長さ
PPx、PPy 配置ピッチ
Claims (5)
- 基板と、
前記基板に設けられた第1副画素と第2副画素とを含む画素と、
前記第1副画素に配置された第1発光素子と、前記第2副画素に配置された第2発光素子と、
第1方向に延在するゲート配線と、
前記第1方向と交差する第2方向に延在し、前記第1発光素子に電気的に接続する第1信号線と、
前記第2方向に延在し、前記第2発光素子に電気的に接続する第2信号線と、
アノード電位を供給するアノード配線と、
カソード電位を供給するカソード配線と、を備え、
前記第1副画素と前記第2副画素はそれぞれ書込みトランジスタと駆動トランジスタとを有し、
前記第1信号線は前記第1副画素の前記書込みトランジスタに電気的に接続し、
前記第2信号線は前記第2副画素の前記書込みトランジスタに電気的に接続し、
前記ゲート配線は前記第1副画素及び前記第2副画素の前記書込みトランジスタに電気的に接続し、
前記アノード配線は前記第1副画素及び前記第2副画素の前記駆動トランジスタと電気的に接続し、
前記カソード配線は前記第1発光素子及び前記第2発光素子に電気的に接続し、
前記アノード配線は平面視で、前記第1方向に延在し且つ前記ゲート配線に重畳して配置される表示装置。 - 前記カソード配線は前記第1方向に延在し、前記ゲート配線及び前記アノード配線に重畳する請求項1に記載の表示装置。
- 前記第1発光素子及び前記第2発光素子はそれぞれLED素子である請求項1又は請求項2に記載の表示装置。
- さらに、前記第1発光素子及び前記第2発光素子に共通に接続され且つ前記カソード配線に電気的に接続するカソード電極と、
前記基板と前記カソード電極の間において、前記第1発光素子及び前記第2発光素子を囲う素子絶縁膜と、を有し、
前記カソード配線は、前記基板と前記素子絶縁膜との間に位置し、
前記カソード電極は、前記素子絶縁膜に形成されたコンタクトホールを介して、前記カソード配線に接続され、
前記コンタクトホールは前記ゲート配線又は前記アノード配線に重畳する、請求項1から請求項3のいずれか1項に記載の表示装置。 - 前記アノード配線は、前記カソード配線と前記ゲート配線との間に位置する、請求項1から請求項4のいずれか1項に記載の表示装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2023125441A JP7515671B2 (ja) | 2023-08-01 | 表示装置 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019219148A JP7326137B2 (ja) | 2019-12-03 | 2019-12-03 | 表示装置 |
JP2023125441A JP7515671B2 (ja) | 2023-08-01 | 表示装置 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019219148A Division JP7326137B2 (ja) | 2019-12-03 | 2019-12-03 | 表示装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2023156384A true JP2023156384A (ja) | 2023-10-24 |
JP7515671B2 JP7515671B2 (ja) | 2024-07-12 |
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Also Published As
Publication number | Publication date |
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JP7326137B2 (ja) | 2023-08-15 |
WO2021111783A1 (ja) | 2021-06-10 |
JP2021089356A (ja) | 2021-06-10 |
CN114746928A (zh) | 2022-07-12 |
CN114746928B (zh) | 2023-12-15 |
US20220293579A1 (en) | 2022-09-15 |
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