JP2023098688A - 物品搬送システム及び物品搬送システムの運営方法 - Google Patents
物品搬送システム及び物品搬送システムの運営方法 Download PDFInfo
- Publication number
- JP2023098688A JP2023098688A JP2022207823A JP2022207823A JP2023098688A JP 2023098688 A JP2023098688 A JP 2023098688A JP 2022207823 A JP2022207823 A JP 2022207823A JP 2022207823 A JP2022207823 A JP 2022207823A JP 2023098688 A JP2023098688 A JP 2023098688A
- Authority
- JP
- Japan
- Prior art keywords
- transport
- time
- processing apparatus
- vehicle
- substrate processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 42
- 230000032258 transport Effects 0.000 claims description 387
- 239000000758 substrate Substances 0.000 claims description 159
- 238000012545 processing Methods 0.000 claims description 158
- 238000012546 transfer Methods 0.000 claims description 95
- 239000004065 semiconductor Substances 0.000 claims description 21
- 238000004519 manufacturing process Methods 0.000 claims description 20
- 238000011017 operating method Methods 0.000 claims description 19
- 238000013480 data collection Methods 0.000 claims description 15
- 238000004364 calculation method Methods 0.000 claims description 14
- WCHSQACWYIQTKL-XPWFQUROSA-N [[(2r,3s,4r,5r)-5-(6-aminopurin-9-yl)-3,4-dihydroxyoxolan-2-yl]methoxy-hydroxyphosphoryl] [(2r,3r,4r,5r)-2-(6-aminopurin-9-yl)-4-hydroxy-5-(hydroxymethyl)oxolan-3-yl] hydrogen phosphate Chemical compound C1=NC2=C(N)N=CN=C2N1[C@@H]1O[C@H](CO)[C@@H](O)[C@H]1OP(O)(=O)OP(O)(=O)OC[C@H]([C@@H](O)[C@H]1O)O[C@H]1N1C(N=CN=C2N)=C2N=C1 WCHSQACWYIQTKL-XPWFQUROSA-N 0.000 description 30
- 230000008569 process Effects 0.000 description 13
- 210000003739 neck Anatomy 0.000 description 9
- 235000012431 wafers Nutrition 0.000 description 7
- 238000009826 distribution Methods 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000001965 increasing effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000004904 shortening Methods 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 238000004380 ashing Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 238000000427 thin-film deposition Methods 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 238000012886 linear function Methods 0.000 description 1
- 238000007726 management method Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67727—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using a general scheme of a conveying path within a factory
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B66—HOISTING; LIFTING; HAULING
- B66C—CRANES; LOAD-ENGAGING ELEMENTS OR DEVICES FOR CRANES, CAPSTANS, WINCHES, OR TACKLES
- B66C13/00—Other constructional features or details
- B66C13/18—Control systems or devices
- B66C13/48—Automatic control of crane drives for producing a single or repeated working cycle; Programme control
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67724—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations by means of a cart or a vehicule
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67733—Overhead conveying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Automation & Control Theory (AREA)
- Mechanical Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Control Of Position, Course, Altitude, Or Attitude Of Moving Bodies (AREA)
- Warehouses Or Storage Devices (AREA)
Abstract
Description
前記運営データに基づいて前記基板処理装置の予測搬送要請時点を導出し、導出された前記予測搬送要請時点より以前時点である前記搬送車両に対する先呼出時点を導出する先呼出時点演算段階を含むことができる。
前記予測搬送要請時点から前記予測到着所要時間を引いた時点と同一であるか、或いはそれより早い時点を前記先呼出時点で指定することができる。
10 物品搬送システム
100 レール
200 搬送車両
300 制御装置
310 データ収集部
320 先呼出時点演算部
330 先呼出の可否判断部
340 搬送遂行部
S10 データ収集段階
S20 先呼出時点演算段階
S30 先呼出の可否判断段階
S40 搬送段階
PM 第1搬送モデル
BM 第2搬送モデル
Claims (20)
- 物品搬送システムの運営方法において、
予め収集された前記物品搬送システムの運営データからターゲット装置の予測搬送要請時点を導出し、導出された前記予測搬送要請時点より以前に前記物品搬送システムが有する搬送車両を呼び出して前記ターゲット装置に移動させる運営方法。 - 前記運営データに基づいて、前記搬送車両を呼び出す時、前記ターゲット装置に前記搬送車両が到着するのに所要される予測到着所要時間を導出し、導出された前記予測搬送要請時点と前記予測到着所要時間に基づいて搬送車両を呼び出す搬送車両先呼出時点を導出する請求項1に記載の運営方法。
- 前記搬送車両先呼出時点は、前記予測搬送要請時点から前記予測到着所要時間を引いた時点と同一であるか、或いはそれより早い時点で指定される請求項2に記載の運営方法。
- 前記物品搬送システムを設定期間の間に運営して、a)前記ターゲット装置の搬送要請時間間隔、b)搬送車両呼出の時、搬送車両が前記ターゲット装置に到着するのに所要される到着所要時間、及び/又はc)搬送車両呼出の時、搬送車両が前記ターゲット装置まで移動する移動距離に関するデータを収集する請求項2に記載の運営方法。
- 収集された前記データの代表値を前記運営データに追加する請求項4に記載の運営方法。
- 前記運営データに格納された前記代表値に各々加重値を掛けて、前記予測搬送要請時間間隔、前記予測到着所要時間、及び/又は搬送車両の予測移動距離を導出する請求項5に記載の運営方法。
- 最近に前記運営データに追加された前記代表値であるほど、前記加重値のサイズを大きくする請求項6に記載の運営方法。
- 前記加重値の和は、1である請求項7に記載の運営方法。
- 物品搬送システムの運営方法において、
前記物品搬送システムは、
基板処理装置の上側に設置されるレールと、
前記レールに沿って走行し、前記基板処理装置に物品を搬送する搬送車両と、を含み、
前記運営方法は、
前記物品搬送システムを運営して運営データを収集するデータ収集段階と、
前記運営データに基づいて前記基板処理装置の予測搬送要請時点を導出し、導出された前記予測搬送要請時点より以前時点である前記搬送車両に対する先呼出時点を導出する先呼出時点演算段階と、を含む運営方法。 - 前記先呼出時点演算段階には、
前記運営データに基づいて前記基板処理装置の予測搬送時間間隔を導出し、
実際の搬送要請時点に前記予測搬送時間間隔を加えて前記予測搬送要請時点を導出する請求項9に記載の運営方法。 - 前記先呼出時点演算段階には、
前記運営データに基づいて前記搬送車両が前記基板処理装置に到着するのに所要される予測到着所要時間及び/又は前記搬送車両が前記基板処理装置に到着する時まで移動した予測移動距離を導出し、
前記予測搬送要請時点から前記予測到着所要時間を引いた時点と同一であるか、或いはそれより早い時点を前記先呼出時点で指定する請求項10に記載の運営方法。 - 指定された前記先呼出時点が現在時点を過ぎたか、又は前記現在時点を過ぎていないかを判断して前記搬送車両の先呼出を進行するかどうかを判断する先呼出の可否判断段階をさらに含む請求項11に記載の運営方法。
- 前記先呼出の可否判断段階で判断された結果に基づいて、第1搬送モデルと前記第1搬送モデルと異なる第2搬送モデルの中で選択された搬送モデルを利用して物品を搬送する搬送段階を含む請求項12に記載の運営方法。
- 指定された前記先呼出時点が前記現在時点を過ぎていない場合、前記第1搬送モデルに基づいて前記搬送段階を遂行し、
前記第1搬送モデルは、
前記搬送車両の中でいずれか1つを選択して選択された前記搬送車両と前記基板処理装置の距離を確認し、
測定された前記距離に基づいて、選択された前記搬送車両の予約が可能であるかどうかを判断する請求項13に記載の運営方法。 - 前記第1搬送モデルは、
前記予測移動距離に対する測定された前記距離との比率を利用して前記搬送車両の予約可能可否を決定する請求項14に記載の運営方法。 - 前記第1搬送モデルは、
予約された前記搬送車両が前記基板処理装置に移動する途中前記基板処理装置の実際の搬送要請が発生する場合、前記搬送車両の予約を確定して搬送を遂行する請求項15に記載の運営方法。 - 前記第1搬送モデルは、
予約された前記搬送車両が前記基板処理装置に移動する途中、前記基板処理装置の実際の搬送要請が発生しない場合、前記基板処理装置の上側で待機する請求項15に記載の運営方法。 - 前記基板処理装置の上側で前記搬送車両が待機する間に、前記搬送車両の回避が必要である場合、前記第2搬送モデルを適用して他の搬送車両を呼び出す請求項17に記載の運営方法。
- 前記第2搬送モデルは、
前記基板処理装置が実際の搬送要請を発生させ、
その後、前記基板処理装置の前記実際の搬送要請を遂行することができる前記搬送車両を検索し、
検索された前記搬送車両に制御装置が課題を割当し、
前記制御装置から課題が割当された前記搬送車両が搬送を遂行する請求項13に記載の運営方法。 - 半導体製造ラインに物品を搬送する物品搬送システムにおいて、
基板処理装置の上側に設置されるレールと、
前記レールに沿って走行し、前記基板処理装置に物品を搬送する搬送車両と、
前記搬送車両の走行を制御する制御装置と、を含み、
前記制御装置は、
前記搬送車両が前記基板処理装置に物品を搬送しながら、獲得される運営データを収集するデータ収集部と、
前記運営データに基づいて前記基板処理装置の予測搬送要請時点を導出し、導出された予測搬送時点より以前時点である前記搬送車両の中で第1搬送車両に対する先呼出時点を導出する先呼出時点演算部と、
導出された前記先呼出時点が現在時点を過ぎたか、又は前記現在時点を過ぎていないかを判断して前記第1搬送車両の先呼出を進行するかどうかを判断する先呼出の可否判断部と、
前記先呼出の可否判断部で前記先呼出を進行することと判断した場合、第1搬送モデルに基づいて物品を搬送し、前記先呼出を進行しないことと判断した場合、前記第1搬送モデルと異なる第2搬送モデルに基づいて物品を搬送するように前記搬送車両に制御信号を伝送する搬送遂行部と、を含む物品搬送システム。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2021-0189974 | 2021-12-28 | ||
KR20210189974 | 2021-12-28 | ||
KR1020220158084A KR20230100607A (ko) | 2021-12-28 | 2022-11-23 | 물품 반송 시스템 및 물품 반송 시스템의 운영 방법 |
KR10-2022-0158084 | 2022-11-23 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2023098688A true JP2023098688A (ja) | 2023-07-10 |
JP7507843B2 JP7507843B2 (ja) | 2024-06-28 |
Family
ID=86897239
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022207823A Active JP7507843B2 (ja) | 2021-12-28 | 2022-12-26 | 物品搬送システム及び物品搬送システムの運営方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20230207364A1 (ja) |
JP (1) | JP7507843B2 (ja) |
CN (1) | CN116364617A (ja) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007141019A (ja) * | 2005-11-21 | 2007-06-07 | Asyst Shinko Inc | 搬送制御装置及び搬送制御プログラム、並びに搬送制御方法 |
WO2007132651A1 (ja) * | 2006-05-12 | 2007-11-22 | Murata Kikai Kabushiki Kaisha | 搬送システムと搬送方法 |
JP2017191361A (ja) * | 2016-04-11 | 2017-10-19 | 株式会社ダイフク | 物品搬送設備 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005026421A (ja) | 2003-07-01 | 2005-01-27 | Dainippon Screen Mfg Co Ltd | 基板処理装置および基板処理方法 |
-
2022
- 2022-12-26 JP JP2022207823A patent/JP7507843B2/ja active Active
- 2022-12-26 CN CN202211676562.9A patent/CN116364617A/zh active Pending
- 2022-12-28 US US18/147,258 patent/US20230207364A1/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007141019A (ja) * | 2005-11-21 | 2007-06-07 | Asyst Shinko Inc | 搬送制御装置及び搬送制御プログラム、並びに搬送制御方法 |
WO2007132651A1 (ja) * | 2006-05-12 | 2007-11-22 | Murata Kikai Kabushiki Kaisha | 搬送システムと搬送方法 |
JP2017191361A (ja) * | 2016-04-11 | 2017-10-19 | 株式会社ダイフク | 物品搬送設備 |
Also Published As
Publication number | Publication date |
---|---|
JP7507843B2 (ja) | 2024-06-28 |
CN116364617A (zh) | 2023-06-30 |
US20230207364A1 (en) | 2023-06-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI397491B (zh) | Handling systems and handling methods | |
US7356378B1 (en) | Method and system for smart vehicle route selection | |
JP4782194B2 (ja) | 搬送システム | |
US8160736B2 (en) | Methods and apparatus for white space reduction in a production facility | |
TWI817010B (zh) | 搬送控制裝置 | |
JP6017134B2 (ja) | 生産効率化システム、生産効率化装置および生産効率化方法 | |
JP2001189363A (ja) | 半導体装置製造設備およびその制御方法 | |
US7809466B2 (en) | Transportation system and transportation method | |
JP4143828B2 (ja) | 搬送台車システム | |
US20200372427A1 (en) | Travel order allocation method, controller, and transport system comprising controller | |
JP2023098688A (ja) | 物品搬送システム及び物品搬送システムの運営方法 | |
WO2020039700A1 (ja) | 走行車制御装置、走行車システム、及び走行車制御方法 | |
JP2001296922A (ja) | 無人搬送車システム | |
KR20230100607A (ko) | 물품 반송 시스템 및 물품 반송 시스템의 운영 방법 | |
KR102303109B1 (ko) | 반송체 제어 장치 및 이를 구비하는 반송체 제어 시스템 | |
JP4501734B2 (ja) | 搬送制御装置及び搬送制御方法 | |
JP5337543B2 (ja) | 搬送制御方法、制御装置及び搬送システム | |
JP2003347388A (ja) | 搬送システム | |
JP6294427B2 (ja) | 生産処理システムおよび生産効率化方法 | |
JP2008077496A (ja) | 搬送制御装置、搬送制御方法、搬送制御プログラム、および搬送制御装置を備えた生産システム | |
WO2008094129A1 (en) | Methods and apparatus for idle time reduction in a production facility | |
JP2018093131A (ja) | 搬送システム | |
JP2010247911A (ja) | 自動搬送の制御システム |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20221226 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20230905 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20231130 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20231212 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240311 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20240611 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20240618 |