JP2023082458A - Foamed adhesive tape for fixing electronic apparatus parts, and electronic apparatus including foamed adhesive tape for fixing electronic apparatus parts - Google Patents
Foamed adhesive tape for fixing electronic apparatus parts, and electronic apparatus including foamed adhesive tape for fixing electronic apparatus parts Download PDFInfo
- Publication number
- JP2023082458A JP2023082458A JP2021196253A JP2021196253A JP2023082458A JP 2023082458 A JP2023082458 A JP 2023082458A JP 2021196253 A JP2021196253 A JP 2021196253A JP 2021196253 A JP2021196253 A JP 2021196253A JP 2023082458 A JP2023082458 A JP 2023082458A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive tape
- parts
- electronic apparatus
- electronic device
- sensitive adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000002390 adhesive tape Substances 0.000 title claims abstract description 29
- 239000006260 foam Substances 0.000 claims abstract description 42
- 229920000098 polyolefin Polymers 0.000 claims abstract description 25
- 239000012790 adhesive layer Substances 0.000 claims abstract description 12
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 42
- 229920005989 resin Polymers 0.000 claims description 32
- 239000011347 resin Substances 0.000 claims description 32
- 239000000463 material Substances 0.000 claims description 31
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- 239000010410 layer Substances 0.000 claims description 20
- 239000000178 monomer Substances 0.000 claims description 20
- -1 polypropylene Polymers 0.000 claims description 17
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 8
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- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 7
- 229920001155 polypropylene Polymers 0.000 claims description 7
- 125000000217 alkyl group Chemical group 0.000 claims description 5
- 125000004432 carbon atom Chemical group C* 0.000 claims description 5
- 238000012360 testing method Methods 0.000 abstract description 21
- 230000035939 shock Effects 0.000 abstract description 20
- 239000000758 substrate Substances 0.000 abstract description 19
- 239000000853 adhesive Substances 0.000 description 31
- 230000001070 adhesive effect Effects 0.000 description 31
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- 238000000034 method Methods 0.000 description 13
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- 238000009472 formulation Methods 0.000 description 7
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- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
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- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical class CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
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- 239000011976 maleic acid Substances 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- JAYXSROKFZAHRQ-UHFFFAOYSA-N n,n-bis(oxiran-2-ylmethyl)aniline Chemical compound C1OC1CN(C=1C=CC=CC=1)CC1CO1 JAYXSROKFZAHRQ-UHFFFAOYSA-N 0.000 description 1
- QYZFTMMPKCOTAN-UHFFFAOYSA-N n-[2-(2-hydroxyethylamino)ethyl]-2-[[1-[2-(2-hydroxyethylamino)ethylamino]-2-methyl-1-oxopropan-2-yl]diazenyl]-2-methylpropanamide Chemical compound OCCNCCNC(=O)C(C)(C)N=NC(C)(C)C(=O)NCCNCCO QYZFTMMPKCOTAN-UHFFFAOYSA-N 0.000 description 1
- SJPFBRJHYRBAGV-UHFFFAOYSA-N n-[[3-[[bis(oxiran-2-ylmethyl)amino]methyl]phenyl]methyl]-1-(oxiran-2-yl)-n-(oxiran-2-ylmethyl)methanamine Chemical compound C1OC1CN(CC=1C=C(CN(CC2OC2)CC2OC2)C=CC=1)CC1CO1 SJPFBRJHYRBAGV-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
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- 239000000049 pigment Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
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- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005906 polyester polyol Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920005678 polyethylene based resin Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920001228 polyisocyanate Chemical class 0.000 description 1
- 239000005056 polyisocyanate Chemical class 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- GRWFGVWFFZKLTI-UHFFFAOYSA-N rac-alpha-Pinene Natural products CC1=CCC2C(C)(C)C1C2 GRWFGVWFFZKLTI-UHFFFAOYSA-N 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- 239000000243 solution Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- NMOALOSNPWTWRH-UHFFFAOYSA-N tert-butyl 7,7-dimethyloctaneperoxoate Chemical compound CC(C)(C)CCCCCC(=O)OOC(C)(C)C NMOALOSNPWTWRH-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Landscapes
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
本発明は、電子機器部品固定用発泡粘着テープに関し、特に冷熱衝撃試験耐性及び再剥離性に優れた電子機器部品固定用発泡粘着テープおよび電子機器に関する。 TECHNICAL FIELD The present invention relates to a foamed pressure-sensitive adhesive tape for fixing electronic device parts, and more particularly to a foamed pressure-sensitive adhesive tape for fixing electronic device parts and an electronic device which are excellent in thermal shock test resistance and removability.
従来、自動車に搭載される電子機器は、耐熱性や剥離防止の観点から接着剤が多く使用されていた。しかし近年モニター等の電子機器は画面の大型化が進み、歪みの影響から部品同士の隙間が大きくなり、接着剤で固定することが難しくなっている。そのため、大きな隙間を埋める目的などで電子機器部品固定用発泡粘着テープが使用される様になっている。 Conventionally, adhesives were often used for electronic devices mounted on automobiles from the viewpoint of heat resistance and peeling prevention. However, in recent years, the screens of electronic devices such as monitors have become larger, and the gaps between parts have become larger due to the effects of distortion, making it difficult to fix them with adhesive. For this reason, foamed adhesive tapes for fixing electronic equipment parts have come to be used for the purpose of filling large gaps.
このような目的で使用される電子機器部品固定用発泡粘着テープには、大きな振動や衝撃でも剥がれてしまう事がない様に、貼り合わせる被着体及び発泡体基材に対して強力な粘着力が要求される。 Foamed adhesive tapes for fixing electronic device parts used for such purposes have strong adhesion to adherends and foam substrates so that they do not come off even with large vibrations or shocks. is required.
さらに近年では、モニターの狭額縁化の要求に伴い、幅５ｍｍ程の粘着テープで大型の電子機器部品を固定する要求が高まっている一方、大型化により電子機器部品の歪みの影響が大きくなる傾向にあることから、狭幅の粘着テープで歪みの大きな電子機器部品同士を強固に固定する必要がある。さらに高温高湿度となる環境及び寒冷地でも剥がれる事がない、耐熱性と耐寒性が求められ、この様な耐久性を評価する試験である冷熱衝撃試験性に優れた製品が求められている。
また、上記固定する工程において粘着テープを一度剥がして位置合わせを行う場合もあり、この際に粘着テープが変形や破断することがない強靭性（以下、再剥離性と称する）も 求められている。
Furthermore, in recent years, along with the demand for narrower monitor frames, the demand for fixing large electronic equipment parts with adhesive tape of about 5 mm in width has increased. Therefore, it is necessary to firmly fix electronic device parts with large distortion to each other with a narrow adhesive tape. In addition, there is a demand for heat resistance and cold resistance that will not peel off even in environments with high temperatures and humidity and in cold regions, and products with excellent thermal shock test properties, which are tests for evaluating such durability, are required.
In addition, in the fixing process, the adhesive tape may be peeled off once to align, and toughness (hereinafter referred to as re-peelability) that does not cause deformation or breakage of the adhesive tape at this time is also required. .
特許文献１及び特許文献２には、ポリオレフィン系発泡体を用いた両面テープが開示されているが、上記の冷熱衝撃試験性及び再剥離性を兼ね備えた性能を満足する電子機器部品固定用発泡粘着テープは見出されていなかった。 Patent Documents 1 and 2 disclose double-sided tapes using polyolefin-based foams. Foamed adhesives for fixing electronic device parts that satisfy both the above-mentioned thermal shock testability and removability. No tape was found.
本発明は、冷熱衝撃試験耐性に優れ、再剥離性が良好な電子機器部品固定用発泡粘着テープを提供することを目的とする。 An object of the present invention is to provide a foamed pressure-sensitive adhesive tape for fixing electronic equipment parts, which has excellent thermal shock test resistance and good removability.
本発明者らは、前記課題を解決するために鋭意研究を重ねた結果、ポリオレフィン系発泡体基材の両面に一定範囲の厚みの粘着剤層を備え、各温度におけるＭＤ方向およびＴＤ方向の引張破断強度を一定以上にすることで、上記課題を解決し得ることを見出し、本発明に至った。 As a result of extensive research to solve the above problems, the present inventors have found that a pressure-sensitive adhesive layer having a certain range of thickness is provided on both sides of a polyolefin foam base material, and tensile strength in the MD and TD directions at each temperature The inventors have found that the above problems can be solved by increasing the breaking strength to a certain level or higher, and have completed the present invention.
すなわち、本発明は、ポリオレフィン系発泡体基材の両面に、厚み７０～２００μｍの粘着剤層を備える電子機器部品固定用発泡粘着テープであって、前記電子機器部品固定用発泡粘着テープの－１０℃、２３℃および８０℃におけるＭＤ方向の引張破断強度が９Ｎ／５ｍｍ以上、ＴＤ方向の引張破断強度が５Ｎ／５ｍｍ以上である電子機器部品固定用発泡粘着テープに関する 。 That is, the present invention provides a foamed pressure-sensitive adhesive tape for fixing electronic device parts, comprising a pressure-sensitive adhesive layer having a thickness of 70 to 200 μm on both sides of a polyolefin foam base material, wherein the foamed pressure-sensitive adhesive tape for fixing electronic device parts is -10 The present invention relates to a foamed pressure-sensitive adhesive tape for fixing electronic device components, having a tensile breaking strength of 9 N/5 mm or more in the MD direction and a tensile breaking strength of 5 N/5 mm or more in the TD direction at 23° C., 23° C. and 80° C.
本発明によれば、上記構成の電子機器部品固定用発泡粘着テープを用いることで、大きな振動や衝撃でも剥がれることのない保持力および冷熱衝撃試験耐性に優れ、良好な再剥離性を併せ持つ電子機器部品固定用発泡粘着テープおよびこれを用いた電子機器の供給が可能となる。 According to the present invention, by using the foamed adhesive tape for fixing electronic device parts having the above structure, an electronic device having excellent holding power and thermal shock test resistance that does not come off even with large vibrations and impacts, and good removability. It becomes possible to supply foamed adhesive tapes for fixing parts and electronic devices using the same.
本発明は、ポリオレフィン系発泡体基材の両面に、厚み７０～２００μｍの粘着剤層を備える電子機器部品固定用発泡粘着テープであって、前記電子機器部品固定用発泡粘着テープの－１０℃、２３℃および８０℃におけるＭＤ方向の引張破断強度が９Ｎ／５ｍｍ以上であり、－１０℃、２３℃および８０℃におけるＴＤ方向の引張破断強度が５Ｎ／５ｍｍ以上であることを特徴とする。電子機器部品固定用発泡粘着テープの引張破断強度を上記範囲とすることで冷熱衝撃試験耐性が向上する。加えて、例えば５ｍｍ幅ほどの狭幅テープ形状として場合においても、再剥離性が良好となる。
なお本発明で電子機器部品固定用発泡粘着テープ、粘着シート、粘着テープ、粘着フィルムは同義語である。
The present invention provides a foamed pressure-sensitive adhesive tape for fixing electronic device parts, comprising a pressure-sensitive adhesive layer having a thickness of 70 to 200 μm on both sides of a polyolefin foam base material, wherein the foamed pressure-sensitive adhesive tape for fixing electronic device parts is -10 ° C. The tensile breaking strength in the MD direction at 23°C and 80°C is 9 N/5 mm or more, and the tensile breaking strength in the TD direction at -10°C, 23°C and 80°C is 5 N/5 mm or more. By setting the tensile strength at break of the foamed pressure-sensitive adhesive tape for fixing electronic device parts within the above range, the thermal shock test resistance is improved. In addition, even in the case of a narrow tape shape with a width of, for example, about 5 mm, removability is improved.
In the present invention, the foamed adhesive tape for fixing electronic device parts, the adhesive sheet, the adhesive tape, and the adhesive film are synonymous.
＜粘着剤層の厚み＞
粘着テープの両面の粘着剤層の厚みは、夫々７０～２００μｍであって、８０～１８０μｍがより好ましく、１００μｍを超えて、１７０μｍ以下であることがさらに好ましい。粘着剤層の厚みを夫々上記範囲にする事で、保持力および冷熱衝撃試験特性に優れた電子機器部品固定用発泡粘着テープを得ることが出来る。粘着剤層の厚みを７０μｍ以上とすることでＴＤおよびＭＤ方向の引張破断強度を向上させ、再剥離性が良化する。また冷熱衝撃試験特性が向上する。２００μｍ以下とすることで保持力が良化する。
ポリオレフィン系発泡体基材の一方の粘着剤層の厚み（イ）は７０～２００μｍが好ましく、８０～１８０μｍがより好ましい。もう一方の粘着剤層の厚み（ロ）は、７０～２００μｍが好ましく、８０～１８０μｍがより好ましい。（イ）と（ロ）の差は１００μｍ以下が好ましく、３０μｍ以下がより好ましく、１０μｍ以下がさらに好ましい。このような厚みの構成とすることで、被着体と各電子機器部品との隙間が大きくても粘着剤層が追従し、良好な冷熱衝撃試験耐性を発現する。
<Thickness of adhesive layer>
The thickness of the adhesive layers on both sides of the adhesive tape is 70 to 200 μm, preferably 80 to 180 μm, and more preferably over 100 μm and 170 μm or less. By setting the thickness of the pressure-sensitive adhesive layer within the above range, it is possible to obtain a foamed pressure-sensitive adhesive tape for fixing electronic device parts which is excellent in holding power and thermal shock test properties. By setting the thickness of the pressure-sensitive adhesive layer to 70 μm or more, the tensile breaking strength in the TD and MD directions is improved, and the removability is improved. Also, thermal shock test properties are improved. Holding power is improved by setting the thickness to 200 μm or less.
The thickness (a) of one adhesive layer of the polyolefin foam substrate is preferably 70 to 200 μm, more preferably 80 to 180 μm. The thickness (b) of the other pressure-sensitive adhesive layer is preferably 70-200 μm, more preferably 80-180 μm. The difference between (a) and (b) is preferably 100 μm or less, more preferably 30 μm or less, even more preferably 10 μm or less. With such a thickness structure, the pressure-sensitive adhesive layer follows even if the gap between the adherend and each electronic device component is large, and good thermal shock test resistance is exhibited.
＜引張破断強度＞
本発明の粘着テープは－１０℃、２３℃および８０℃におけるＭＤ方向の引張破断強度が９Ｎ／５ｍｍ以上であって、１０Ｎ／５ｍｍ以上が好ましく、上限は５０Ｎ／５ｍｍ以下が好ましい。－１０℃、２３℃および８０℃におけるＴＤ方向の引張破断強度は５Ｎ／５ｍｍ以上であって、６Ｎ／５ｍｍ以上が好ましく、上限は１００Ｎ／５ｍｍ以下が好ましい。ここで、「ＭＤ」とは、Ｍａｃｈｉｎｅ Ｄｉｒｅｃｔｉｏｎを意味し、ポリオレフィン系発泡体基材の押出方向等と一致する方向を意味する。また、「ＴＤ」は、Ｔｒａｎｓｖｅｒｓｅ Ｄｉｒｅｃｔｉｏｎを意味し、ＭＤに直交しかつ発泡シートに平行な方向を意味する。ＭＤ方向及びＴＤ方向の引張破断強度を上記範囲にすることで、粘着テープを剥がす際の引張等の力で破断が抑制され再剥離性が向上する。
各種温度におけるＴＤおよびＭＤ方向の引張破断強度は粘着剤層の厚みを増すことに加え、後述するポリオレフィン系発泡体基材の厚みを増す、ポリオレフィン系発泡体基材の密度を特定の値にすることで向上する。
<Tensile breaking strength>
The adhesive tape of the present invention has a tensile breaking strength in the MD direction at -10°C, 23°C and 80°C of 9 N/5 mm or more, preferably 10 N/5 mm or more, and the upper limit is preferably 50 N/5 mm or less. The tensile breaking strength in the TD direction at −10° C., 23° C. and 80° C. is 5 N/5 mm or more, preferably 6 N/5 mm or more, and the upper limit is preferably 100 N/5 mm or less. Here, "MD" means Machine Direction, and means a direction that coincides with the extrusion direction of the polyolefin foam base material. Moreover, "TD" means Transverse Direction, and means a direction orthogonal to MD and parallel to the foam sheet. By setting the tensile breaking strength in the MD direction and the TD direction within the above range, breakage due to tensile force or the like when the adhesive tape is peeled off is suppressed, and removability is improved.
In addition to increasing the thickness of the pressure-sensitive adhesive layer, the tensile strength at break in the TD and MD directions at various temperatures increases the thickness of the polyolefin foam base material described later, and sets the density of the polyolefin foam base material to a specific value. improve by
粘着剤層はアクリル系共重合体（Ａ）、粘着付与樹脂（Ｂ）から形成されることが好ましい。
＜アクリル系共重合体（Ａ）＞
アクリル系共重合体（Ａ）としては、アクリルモノマーを用いて合成することが可能な（メタ）アクリル系重合体であり、アクリルモノマーとしては、例えば（メタ）アクリル酸メチル、（メタ）アクリル酸エチル、（メタ）アクリル酸ブチル、（メタ）アクリル酸イソブチル、（メタ）アクリル酸プロピル、（メタ）アクリル酸ペンチル、（メタ）アクリル酸ヘキシル、（メタ）アクリル酸２－エチルヘキシル、（メタ）アクリル酸オクチル、（メタ）アクリル酸ノニル、（メタ）アクリル酸デシル、（メタ）アクリル酸ドデシル、（メタ）アクリル酸ラウリル等の（メタ）アクリル酸アルキルや、（メタ）アクリルアミド、酢酸ビニル、（メタ）アクリロニトリル等が挙げられるが、これに限定するものではなく、単独で使用してもよいし、２種以上を組み合わせて使用してもよい。合成する際は、溶液重合、乳化重合、塊状重合または紫外線照射による重合等の重合方法をとることができるが、本発明では、反応制御や物性コントロールが容易な溶液重合を用いることが好ましい。
The pressure-sensitive adhesive layer is preferably formed from an acrylic copolymer (A) and a tackifying resin (B).
<Acrylic copolymer (A)>
The acrylic copolymer (A) is a (meth)acrylic polymer that can be synthesized using an acrylic monomer, and examples of the acrylic monomer include methyl (meth)acrylate and (meth)acrylic acid. Ethyl, butyl (meth)acrylate, isobutyl (meth)acrylate, propyl (meth)acrylate, pentyl (meth)acrylate, hexyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, (meth)acrylic Alkyl (meth)acrylates such as octyl acid, nonyl (meth)acrylate, decyl (meth)acrylate, dodecyl (meth)acrylate, and lauryl (meth)acrylate, (meth)acrylamide, vinyl acetate, (meth) ) acrylonitrile and the like, but not limited thereto, and may be used alone or in combination of two or more. When synthesizing, a polymerization method such as solution polymerization, emulsion polymerization, bulk polymerization, or polymerization by ultraviolet irradiation can be used. In the present invention, it is preferable to use solution polymerization, which facilitates reaction control and property control.
＜カルボキシ基含有モノマー＞
また、アクリル系共重合体（Ａ）の構成成分としてカルボキシ基含有モノマーを１～５質量％含むことが好ましい。カルボキシ基含有モノマーを含む事で、アクリル系共重合体と硬化剤との架橋密度をコントロールし各種温度における引張破断強度が向上する。上記の観点から、カルボキシ基含有モノマーは、１．５～４．５質量％を用いることがより好ましい。
<Carboxy group-containing monomer>
Further, it is preferable that the acrylic copolymer (A) contains 1 to 5% by mass of a carboxy group-containing monomer as a constituent component. By including a carboxy group-containing monomer, the cross-linking density between the acrylic copolymer and the curing agent is controlled, and the tensile breaking strength at various temperatures is improved. From the above viewpoint, it is more preferable to use 1.5 to 4.5 mass % of the carboxy group-containing monomer.
カルボキシ基含有モノマーとしては、カルボキシ基を有するものであればよく、例えば（メタ）アクリル酸、イタコン酸、マレイン酸等が挙げられるが、（メタ）アクリル酸が好ましい。これらのモノマーは、単独で使用してもよいし、２種以上を組み合わせて使用してもよい As the carboxy group-containing monomer, any monomer having a carboxy group can be used, and examples thereof include (meth)acrylic acid, itaconic acid, and maleic acid, with (meth)acrylic acid being preferred. These monomers may be used alone or in combination of two or more.
＜水酸基含有モノマー＞
また、アクリル系共重合体（Ａ）の構成成分としてアルキル基の炭素数が３以下の水酸基含有モノマーを０．０１～０．５質量％含むことが好ましい。アルキル基の炭素数が３以下の水酸基含有モノマーを含む事で、アクリル系共重合体（Ａ）と硬化剤との架橋密度をコントロールし、各種温度における引張破断強度が向上する。上記の観点から、アルキル基の炭素数が３以下のヒドロキシ含有モノマーは、０．０５～０．４質量％含むことがより好ましい。
<Hydroxyl Group-Containing Monomer>
Further, it is preferable that the acrylic copolymer (A) contains 0.01 to 0.5% by mass of a hydroxyl group-containing monomer having an alkyl group having 3 or less carbon atoms as a constituent component. By containing a hydroxyl group-containing monomer having an alkyl group with 3 or less carbon atoms, the cross-linking density between the acrylic copolymer (A) and the curing agent is controlled, and the tensile strength at break at various temperatures is improved. From the above viewpoint, it is more preferable that the hydroxy-containing monomer having an alkyl group having 3 or less carbon atoms is contained in an amount of 0.05 to 0.4% by mass.
アルキル基の炭素数が３以下の水酸基含有モノマーは、例えば、２－ヒドロキシエチル（メタ）アクリレート、３－ヒドロキシプロピル（メタ）アクリレート等が挙げられるが、これらの中でも硬化剤との適度な架橋性の観点から、２－ヒドロキシエチル（メタ）アクリレートがより好ましい。これらのモノマーは、単独で使用してもよいし、２種以上を組み合わせて使用してもよい。 Hydroxyl group-containing monomers having an alkyl group having 3 or less carbon atoms include, for example, 2-hydroxyethyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate and the like. From the viewpoint of 2-hydroxyethyl (meth) acrylate is more preferable. These monomers may be used alone or in combination of two or more.
本発明のアクリル系共重合体（Ａ）の共重合には、過酸化物系の重合開始剤やアゾビス系の重合開始剤等、従来公知の重合開始剤を使用することができる。有機過酸化物の重合開始剤としては、例えば、ベンゾイルパーオキサイド、ジ－ｔ－ブチルパーオキサイド、クメンハイドロパーオキサイド、ｔ－ブチルパーオキシベンゾエート、ｔ－ブチルパーオキシネオデカノエート、ｔ－ブチルパーオキシ２－エチルヘキサノエート等が挙げられ、アゾ系の重合開始剤としては、２，２’－アゾビスイソブチロニトリル、２，２’－アゾビス（２－アミジノプロパン）ジヒドロクロライド、２，２’－アゾビス［２－（５－メチル－２－イミダゾリン－２－イル）プロパン］ジヒドロクロライド、２，２’－アゾビス（２－メチルプロピオンアミジン）二硫酸塩、２，２’－アゾビス（Ｎ，Ｎ’－ジメチレンイソブチルアミジン）等が挙げられるが、これら重合開始剤は単独で使用しても、２種類以上の併用で使用してもよい。 Conventionally known polymerization initiators such as peroxide-based polymerization initiators and azobis-based polymerization initiators can be used for copolymerization of the acrylic copolymer (A) of the present invention. Polymerization initiators for organic peroxides include, for example, benzoyl peroxide, di-t-butyl peroxide, cumene hydroperoxide, t-butyl peroxybenzoate, t-butyl peroxyneodecanoate, t-butyl Peroxy 2-ethylhexanoate and the like, and examples of azo polymerization initiators include 2,2′-azobisisobutyronitrile, 2,2′-azobis(2-amidinopropane) dihydrochloride, 2 , 2'-azobis [2-(5-methyl-2-imidazolin-2-yl) propane] dihydrochloride, 2,2'-azobis (2-methylpropionamidine) disulfate, 2,2'-azobis ( N,N'-dimethyleneisobutylamidine) and the like, and these polymerization initiators may be used alone or in combination of two or more.
また、本発明のアクリル系共重合体（Ａ）としてより好ましくは、アクリル系共重合体（Ａ）の重量平均分子量は、６０万～１３０万が好ましい。重量平均分子量を６０万以上とする事で、電子機器部品固定用発泡粘着テープの各種温度における引張破断強度が向上する。なお本発明において重量平均分子量とはＧＰＣ測定で求めたポリスチレン換算の重量平均分子量であり、ＧＰＣ測定条件は以下のとおりである。
装置：ＳＨＩＭＡＤＺＵ Ｐｒｏｍｉｎｅｎｃｅ（（株）島津製作所製）カラム：ＴＯＳＯＨ ＴＳＫ－ＧＥＬ ＧＭＨＸＬ（東ソー（株）製）を使用。溶媒：テトラヒドロフラン、流速：０．５ｍｌ／ｍｉｎ、温度：４０℃、試料濃度：０．１ｗｔ％、試料注入量：１００μｌ
More preferably, the acrylic copolymer (A) of the present invention has a weight average molecular weight of 600,000 to 1,300,000. By setting the weight-average molecular weight to 600,000 or more, the tensile breaking strength at various temperatures of the foamed pressure-sensitive adhesive tape for fixing electronic device parts is improved. In the present invention, the weight-average molecular weight is the polystyrene-equivalent weight-average molecular weight obtained by GPC measurement, and the GPC measurement conditions are as follows.
Apparatus: SHIMADZU Prominence (manufactured by Shimadzu Corporation) Column: TOSOH TSK-GEL GMHXL (manufactured by Tosoh Corporation) was used. Solvent: tetrahydrofuran, flow rate: 0.5 ml/min, temperature: 40°C, sample concentration: 0.1 wt%, sample injection amount: 100 µl
＜粘着付与樹脂（Ｂ）＞
本発明の粘着剤層は粘着付与樹脂（Ｂ）を含むことが好ましい。粘着付与樹脂（Ｂ）を含むことで、適度な粘着性と耐熱性をバランスよく保持することができる。粘着付与樹脂（Ｂ）として、例えば、ロジンエステル、重合ロジン、水添ロジン、不均化ロジン、マレイン酸変性ロジン、フマル酸変性ロジン、ロジンフェノール樹脂などのロジン系樹脂；、α－ピネン樹脂、β－ピネン樹脂、ジペンテン樹脂、芳香族変性テルペン樹脂、水添テルペン樹脂、テルペンフェノール樹脂、酸変性テルペン樹脂、スチレン化テルペン樹脂などのテルペン系樹脂；、Ｃ５脂肪族炭化水素樹脂、Ｃ９系芳香族炭化水素樹脂、水添Ｃ９炭化水素樹脂、Ｃ５－Ｃ９系共重合樹脂、ジシクロペンタジエン炭化水素樹脂などの石油系炭化水素樹脂、クマロン－インデン樹脂、スチレン系樹脂、アルキルフェノール樹脂、キシレン樹脂等が挙げられる。粘着付与樹脂であれば、これらに限定するものではなく、単独で使用してもよいし、２種以上を組み合わせて使用してもよい。
<Tackifying resin (B)>
The pressure-sensitive adhesive layer of the present invention preferably contains a tackifying resin (B). By containing the tackifier resin (B), it is possible to maintain a good balance between appropriate adhesiveness and heat resistance. Examples of the tackifying resin (B) include rosin-based resins such as rosin esters, polymerized rosins, hydrogenated rosins, disproportionated rosins, maleic acid-modified rosins, fumaric acid-modified rosins, and rosin phenolic resins; α-pinene resins; Terpene resins such as β-pinene resin, dipentene resin, aromatic modified terpene resin, hydrogenated terpene resin, terpene phenol resin, acid modified terpene resin, styrenated terpene resin; C5 aliphatic hydrocarbon resin, C9 aromatic Hydrocarbon resins, hydrogenated C9 hydrocarbon resins, C5-C9 copolymer resins, petroleum hydrocarbon resins such as dicyclopentadiene hydrocarbon resins, coumarone-indene resins, styrene resins, alkylphenol resins, xylene resins, and the like. be done. As long as it is a tackifying resin, it is not limited to these, and may be used alone or in combination of two or more.
粘着付与樹脂（Ｂ）はアクリル共重合体（Ａ）１００質量部に対して、４５～７５質量部の範囲で含有することが好ましい。粘着付与樹脂（Ｂ）の含有量が４５質量部以上である事で、粘着力が向上し冷熱衝撃試験耐性が向上する。を付与する事が可能であり、７５質量部以下にする事で、粘着付与樹脂を起因とした凝集力の低下を抑制し保持力が向上する。上記観点から、より好ましくは、５０～７０質量部を用いることである。 It is preferable that the tackifying resin (B) is contained in the range of 45 to 75 parts by mass with respect to 100 parts by mass of the acrylic copolymer (A). When the content of the tackifier resin (B) is 45 parts by mass or more, the adhesive strength is improved and the thermal shock test resistance is improved. can be imparted, and by making it 75 parts by mass or less, the decrease in cohesive force caused by the tackifier resin is suppressed, and the holding power is improved. From the above viewpoint, it is more preferable to use 50 to 70 parts by mass.
また、本発明の粘着剤層は硬化剤を含むことが好ましい。硬化剤としては、イソシアネート化合物、アジリジン化合物、金属キレート化合物、およびエポキシ化合物等を使用する事ができる。 Moreover, the pressure-sensitive adhesive layer of the present invention preferably contains a curing agent. As curing agents, isocyanate compounds, aziridine compounds, metal chelate compounds, epoxy compounds, and the like can be used.
イソシアネート化合物としては、例えばトリレンジイソシアネート、ヘキサメチレンジイソシアネート、イソホロンジイソシアネート、キシリレンジイソシアネート、水添キシリレンジイソシアネート、ジフェニルメタンジイソシアネート、水添ジフェニルメタンジイソシアネート、テトラメチルキシリレンジイソシアネート、ナフタレンジイソシアネート、トリフェニルメタントリイソシアネート、ポリメチレンポリフェニルイソシアネートなどのポリイソシアネート化合物、及びこれらイソシアネート化合物とトリメチロールプロパン等のポリオール化合物とのアダクト体やビュレット体、またイソシアヌレート体、更にはこれらイソシアネート化合物と公知のポリエーテルポリオールやポリエステルポリオール、アクリルポリオール、ポリブタジエンポリオール、ポリイソプレンポリオール等とのアダクト体等が挙げられる 。 Examples of isocyanate compounds include tolylene diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, xylylene diisocyanate, hydrogenated xylylene diisocyanate, diphenylmethane diisocyanate, hydrogenated diphenylmethane diisocyanate, tetramethylxylylene diisocyanate, naphthalene diisocyanate, triphenylmethane triisocyanate, Polyisocyanate compounds such as polymethylene polyphenyl isocyanate, adducts and burettes of these isocyanate compounds and polyol compounds such as trimethylolpropane, and isocyanurate compounds, further these isocyanate compounds and known polyether polyols and polyester polyols , acrylic polyol, polybutadiene polyol, polyisoprene polyol, and the like.
金属キレート化合物としては、例えば、金属錯体化合物を使用できる。金属は、ニッケル、アルミニウム、クロム、鉄、チタン、亜鉛、コバルト、マンガン、銅、スズ、ジルコニウム等が挙げられる。金属キレート化合物は、例えば第二鉄トリスアセチルアセトネート、アルミニウムトリスアセチルアセトネート、アルミニウムモノアセチルアセトネートビス（エチルアセトアセテート）、アルミニウムトリス（エチルアセトアセテート）等が挙げられる。 As the metal chelate compound, for example, a metal complex compound can be used. Metals include nickel, aluminum, chromium, iron, titanium, zinc, cobalt, manganese, copper, tin, zirconium and the like. Examples of metal chelate compounds include ferric trisacetylacetonate, aluminum trisacetylacetonate, aluminum monoacetylacetonate bis(ethylacetoacetate), and aluminum tris(ethylacetoacetate).
アジリジン化合物としては、例えば、Ｎ，Ｎ’－ヘキサメチレン－１，６－ビス（１－アジリジンカルボキシアミド、トリメチロールプロパン－トリ－β－アジリジニルプロピオネート、Ｎ，Ｎ’－ジフェニルメタン４，４’－ビス（１－アジリジンカルボキシアミド）、トリメチロールプロパン－トリ－β－（２－メチルアジリジン）プロピオネート等が挙げられる。 Examples of aziridine compounds include N,N'-hexamethylene-1,6-bis(1-aziridinecarboxamide, trimethylolpropane-tri-β-aziridinylpropionate, N,N'-diphenylmethane, 4'-bis(1-aziridinecarboxamide), trimethylolpropane-tri-β-(2-methylaziridine) propionate and the like.
エポキシ化合物としては、例えば、ビスフェノールＡ、エピクロルヒドリン型のエポキシ系樹脂、エチレングリシジルエーテル、ポリエチレングリコールジグリシジルエーテル、グリセリンジグリシジルエーテル、グリセリントリグリシジルエーテル、１，６－ヘキサンジオールグリシジルエーテル、トリメチロールプロパントリグリシジルエーテル、ジグリシジルアニリン、ジアミングリシジルアミン、Ｎ，Ｎ，Ｎ’，Ｎ’－テトラグリシジル－ｍ－キシリレンジアミンおよび１，３－ビス（Ｎ，Ｎ’－ジアミングリシジルアミノメチル）シクロヘキサン等が挙げられる。 Examples of epoxy compounds include bisphenol A, epichlorohydrin type epoxy resins, ethylene glycidyl ether, polyethylene glycol diglycidyl ether, glycerin diglycidyl ether, glycerin triglycidyl ether, 1,6-hexanediol glycidyl ether, trimethylolpropane tri glycidyl ether, diglycidylaniline, diamineglycidylamine, N,N,N',N'-tetraglycidyl-m-xylylenediamine and 1,3-bis(N,N'-diamineglycidylaminomethyl)cyclohexane and the like. be done.
これら硬化剤は、併用してもよく、２種類以上を組み合わせ用いてもよい。 These curing agents may be used in combination, or two or more of them may be used in combination.
＜その他添加剤＞
さらに、必要に応じて公知の粘着剤に配合される充填剤、顔料、染料、希釈剤、重合禁止剤、紫外線吸収剤、紫外線安定剤、カップリング剤等、各種添加剤を含んでもよく、また、２種類以上を用いてもよい。また、添加剤の添加量は、必要な物性が得られる量とすればよく、特に限定されるものではない。
<Other additives>
Furthermore, it may contain various additives such as fillers, pigments, dyes, diluents, polymerization inhibitors, UV absorbers, UV stabilizers, coupling agents, etc., which are blended in known adhesives as necessary, and , two or more types may be used. Moreover, the amount of the additive to be added is not particularly limited as long as it is an amount that provides the required physical properties.
＜ポリオレフィン系発泡体基材＞
本発明においては基材として、ポリオレフィン系発泡体基材を使用することを特徴とする。ポリオレフィン系発泡体基材としては、ポリエチレン系発泡体基材やポリプロピレン系発泡体基材などが挙げられるが、耐熱性の観点から軟化点の高いポリプロピレン系発泡体基材である事がより好ましい。
ポリオレフィン系発泡体基材は密度が２００ｋｇ／ｍ３～８００ｋｇ／ｍ３ が好ましい。密度を２００ｋｇ／ｍ３以上とすることで基材自体の強度が増し電子機器部品固定用発泡粘着テープにおける－１０℃、２３℃および８０℃のＴＤ方向及びＭＤ方向の引張破断強度を向上させ、再剥離性が良化する。また８００ｋｇ／ｍ３以下とすることで埋め込み性が良好となり固定する電子機器部品同士の密着性が向上するため冷熱衝撃試験性が良化する。
<Polyolefin foam substrate>
The present invention is characterized by using a polyolefin foam base material as the base material. Examples of the polyolefin foam substrate include polyethylene foam substrates and polypropylene foam substrates. Polypropylene foam substrates having a high softening point are more preferable from the viewpoint of heat resistance.
The polyolefin foam substrate preferably has a density of 200 kg/m 3 to 800 kg/m 3 . By setting the density to 200 kg/m 3 or more, the strength of the base material itself increases, and the tensile breaking strength in the TD direction and MD direction at -10 ° C., 23 ° C. and 80 ° C. in the foamed adhesive tape for fixing electronic device parts is improved. Removability is improved. Further, when the density is 800 kg/m 3 or less, the embedding property is improved, and the adhesion between fixed electronic device parts is improved, so that the thermal shock test property is improved.
ポリオレフィン系発泡体基材の厚さは５０～４００μｍであることが好ましく、８０～３５０μｍがより好ましい。厚みを５０μｍとする事で、電子機器部品同士の隙間を埋め密着性が向上するため、冷熱衝撃試験性が良化する。また－１０℃、２３℃および８０℃のＴＤ方向及びＭＤ方向の引張破断強度が向上するため再剥離性も良化する。厚みを４００μｍ以下とする事でポリオレフィン系発泡体基材を起点とする層間割れ耐性が向上する。 The thickness of the polyolefin foam substrate is preferably 50-400 μm, more preferably 80-350 μm. By setting the thickness to 50 μm, gaps between electronic device parts are filled and adhesion is improved, so thermal shock testability is improved. In addition, since the tensile breaking strength in the TD direction and the MD direction at −10° C., 23° C. and 80° C. is improved, removability is also improved. By setting the thickness to 400 μm or less, the resistance to interlaminar cracks originating from the polyolefin foam substrate is improved.
ポリオレフィン系発泡体基材の２５％圧縮強度は特に限定されないが、再剥離性の点から５０ｋＰａ～３００ｋＰａが好ましく、７０ｋＰａ～２５０ｋＰａがより好ましい。 The 25% compressive strength of the polyolefin foam substrate is not particularly limited, but is preferably 50 kPa to 300 kPa, more preferably 70 kPa to 250 kPa, from the standpoint of removability.
粘着テープの製造方法としては、アクリル系共重合体（Ａ）、粘着付与樹脂（Ｂ）を含む粘着剤を作成する。次いで、粘着剤をそれぞれ剥離ライナーに塗工して粘着剤層を形成した後、ポリオレフィン系発泡体基材を貼り合わせる方法（１）。または、ポリオレフィン系発泡体基材に粘着剤を塗工し、粘着剤層を形成した後、剥離ライナーを貼り合わせる方法（２）等により製造できる。上記方法以外でも粘着テープが製造できる。なお、粘着剤層は、電子機器部品固定用発泡粘着テープを使用する直前まで剥離ライナーで保護されていることが通常である。 As a method for producing an adhesive tape, an adhesive containing an acrylic copolymer (A) and a tackifying resin (B) is prepared. Next, a method (1) in which a pressure-sensitive adhesive is applied to each release liner to form a pressure-sensitive adhesive layer, and then a polyolefin-based foam base material is laminated. Alternatively, it can be produced by the method (2) of coating a polyolefin foam base material with an adhesive to form an adhesive layer, and then laminating a release liner. Adhesive tapes can also be produced by methods other than the above. The pressure-sensitive adhesive layer is usually protected with a release liner until immediately before using the foamed pressure-sensitive adhesive tape for fixing electronic device parts.
粘着剤の塗工は、例えばロールコーター法、コンマコーター法、リップコーター法、ダイコーター法、リバースコーター法、シルクスクリーン法、グラビアコーター法等の公知の方法が使用できる。塗工後は、熱風オーブン、赤外線ヒーター等で乾燥することができる。 A known method such as a roll coater method, a comma coater method, a lip coater method, a die coater method, a reverse coater method, a silk screen method, or a gravure coater method can be used for coating the adhesive. After coating, it can be dried with a hot air oven, an infrared heater, or the like.
前記剥離ライナーは、紙、プラスチックフィルム、合成紙等の基材に、剥離剤を塗工して形成した剥離層を有する。剥離剤は、例えばシリコーン、アルキド樹脂、メラミン樹脂、フッ素樹脂、アクリル樹脂等が挙げられる。本発明の再剥離型粘着剤は、剥離力が剥離剤 の種類に依存し難い効果が得られる。なお、剥離ライナーの厚さは特に制限はないが１０～２００μｍ程度である。 The release liner has a release layer formed by applying a release agent to a substrate such as paper, plastic film, or synthetic paper. Release agents include, for example, silicones, alkyd resins, melamine resins, fluorine resins, acrylic resins, and the like. The re-peelable pressure-sensitive adhesive of the present invention has the effect that the peel strength is less dependent on the type of release agent. The thickness of the release liner is not particularly limited, but is about 10 to 200 μm.
粘着テープの厚みは１９０～８００μｍが電子機器部品同士の隙間を埋める目的および再剥離性の点から好ましく、２２０～７５０μｍがより好ましい。 The thickness of the adhesive tape is preferably from 190 to 800 μm, more preferably from 220 to 750 μm, from the viewpoint of filling gaps between electronic device parts and removability.
本発明の粘着テープの用途は電子機器部品を固定する用途として用いられる。
まず電子機器とは、トランジスタ、ダイオード等の半導体デバイス、液晶ディスプレイ、有機ＥＬディスプレイ、プラズマディスプレイ、タッチスクリーンパネル、カーナビゲーション等の表示デバイス、カメラ、ビデオ、ドライブレコーダー等の撮像デバイスがあげられる。
電子機器部品とは、上述の電子機器を構成する部品であって、例えばディスプレイ用のガラス、フィルム、筐体、配線材料、キャパシタ材料、電池材料、アクチュエータ材料、センサー用材料等である。
本発明の粘着テープを用いて形成した電子機器は自動車に搭載されることが好ましい。
本発明の粘着テープは、冷熱衝撃試験耐性に優れた粘着テープであることから、振動や衝撃が発生し、極寒、極暑いずれの環境下に置かれる社内においても電子部品を強固に固定することができる。加えて、大型化かつ狭額縁化するディスプレイの細幅のベゼル（１０ｍｍ以下）でも隙間なく強固に固定できるため車載ディスプレイ、カーナビやドライブレコーダーの電子部品固定に好適に用いられる。
上記用途における本発明の粘着テープの形状は特に限定されないが、長方形、額縁状、平行四辺形、円形、楕円形、ドーナツ型等が挙げられる。
The adhesive tape of the present invention is used for fixing electronic equipment parts.
Electronic devices include semiconductor devices such as transistors and diodes, liquid crystal displays, organic EL displays, plasma displays, touch screen panels, display devices such as car navigation systems, and imaging devices such as cameras, video recorders, and drive recorders.
Electronic equipment parts are parts that constitute the electronic equipment described above, and include glass for displays, films, housings, wiring materials, capacitor materials, battery materials, actuator materials, sensor materials, and the like.
An electronic device formed using the adhesive tape of the present invention is preferably mounted on an automobile.
Since the adhesive tape of the present invention is an adhesive tape with excellent thermal shock test resistance, it can firmly fix electronic parts even in a company where vibrations and shocks occur and it is placed in either extremely cold or extremely hot environments. can be done. In addition, it can be firmly fixed without gaps even with narrow bezels (10 mm or less) of displays, which are becoming larger and narrower, so it is suitable for fixing electronic parts of in-vehicle displays, car navigation systems, and drive recorders.
The shape of the pressure-sensitive adhesive tape of the present invention in the above application is not particularly limited, but examples thereof include rectangular, frame-like, parallelogram-like, circular, elliptical, donut-like, and the like.
以下に、本発明を実施例によってより具体的に説明するが、本発明は以下の実施例に限定されるものではない。尚、「部」は「質量部」を、「％」は「質量％」を意味するものとする。 EXAMPLES The present invention will be described in more detail below with reference to examples, but the present invention is not limited to the following examples. In addition, "part" shall mean "mass part" and "%" shall mean "mass %."
＜アクリル系共重合体（Ａ－１）の合成＞
攪拌機、温度計、還流冷却器、滴下装置、窒素導入管を備えた４口フラスコに、窒素雰囲気下で、ブチルアクリレート３２．５質量部、２－エチルヘキシルアクリレート１２．５質量部、エチルアクリレート３．２５質量部、アクリル酸１．７２５質量部、２－ヒドロキシエチルアクリレート０．０２５質量部、溶剤として酢酸エチル、開始剤としてアゾビスイソブチロニトリルを適量仕込んだ。
別途、滴下管に、ブチルアクリレート３２．５質量部、２－エチルヘキシルアクリレート１２．５質量部、エチルアクリレート３．２５質量部、アクリル酸１．７２５質量部、２－ヒドロキシエチルアクリレート０．０２５質量部、溶剤として酢酸エチル、開始剤としてアゾビスイソブチロニトリルを適量仕込んだ。次いでフラスコを徐々に加熱し、反応開始を確認後、滴下管から溶液を１時間かけて滴下した。さらに内温約８０℃で８時間反応を継続した。反応終了後、冷却し、酢酸エチルを適量仕込み、重量平均分子量＝１００万のアクリル系共重合体（Ａ－１）を得た。
<Synthesis of acrylic copolymer (A-1)>
32.5 parts by mass of butyl acrylate, 12.5 parts by mass of 2-ethylhexyl acrylate, 3.5 parts by mass of ethyl acrylate were placed in a four-necked flask equipped with a stirrer, thermometer, reflux condenser, dropping device and nitrogen inlet tube under a nitrogen atmosphere. 25 parts by mass, 1.725 parts by mass of acrylic acid, 0.025 parts by mass of 2-hydroxyethyl acrylate, ethyl acetate as a solvent, and appropriate amounts of azobisisobutyronitrile as an initiator were charged.
Separately, 32.5 parts by mass of butyl acrylate, 12.5 parts by mass of 2-ethylhexyl acrylate, 3.25 parts by mass of ethyl acrylate, 1.725 parts by mass of acrylic acid, and 0.025 parts by mass of 2-hydroxyethyl acrylate were added to a dropping tube. , ethyl acetate as a solvent, and an appropriate amount of azobisisobutyronitrile as an initiator. Then, the flask was gradually heated, and after confirming the start of the reaction, the solution was added dropwise from the dropping tube over 1 hour. Further, the reaction was continued at an internal temperature of about 80°C for 8 hours. After completion of the reaction, the mixture was cooled and an appropriate amount of ethyl acetate was added to obtain an acrylic copolymer (A-1) having a weight average molecular weight of 1,000,000.
＜アクリル系共重合体（Ａ－２）～（Ａ－１６）＞
アクリルモノマーの種類および配合量を表１～２に記載したように変更する以外は、アクリル系共重合体（Ａ－１）と同様にして、アクリル系共重合体（Ａ－２）～（Ａ－１６）を得た。
<Acrylic copolymers (A-2) to (A-16)>
Acrylic copolymers (A-2) to (A -16) was obtained.
＜配合例１＞
アクリル系共重合体（Ａ－１）１００質量部に対し、粘着付与樹脂（Ｂ）として、ＹＳポリスターＴ１３０（ヤスハラケミカル社製、テルペンフェノール系樹脂）を６０質量部、硬化剤として、トリレンジイソシアネートトリメチロールプロパンアダクト体を１．２質量部、溶剤として酢酸エチルを適量配合し、ディスパーで攪拌することで配合例１の粘着剤を得た。
<Formulation example 1>
Per 100 parts by mass of acrylic copolymer (A-1), 60 parts by mass of YS Polyster T130 (terpene phenolic resin manufactured by Yasuhara Chemical Co., Ltd.) as tackifier resin (B), and tolylene diisocyanate tri 1.2 parts by mass of the methylolpropane adduct and an appropriate amount of ethyl acetate as a solvent were blended, and the mixture was stirred with a disper to obtain an adhesive of formulation example 1.
＜配合例（２～１８）＞
アクリル系共重合体、粘着付与樹脂、イソシアネート化合物の種類および配合量を表３～４に記載したように変更する以外は、配合例１と同様にして、配合例（２～１８）の粘着剤を得た。尚、配合量は、ポリマーの固形分に対する不揮発分換算の添加量である。
<Formulation examples (2 to 18)>
Adhesives of Formulation Examples (2-18) in the same manner as Formulation Example 1, except that the types and amounts of the acrylic copolymer, tackifier resin, and isocyanate compound are changed as shown in Tables 3-4. got The compounding amount is the addition amount in terms of non-volatile content with respect to the solid content of the polymer.
［実施例１］
＜粘着シートの作成＞
得られた配合例１の粘着剤を、乾燥後の厚みが１００μｍになるよう５０μｍのポリエチレンテレフタレート（ＰＥＴ）セパレーターに塗工（第１面側粘着剤層）し、４０℃で１分間乾燥した後、直ぐに１００℃で３分間乾燥し、厚み１００μｍの発泡体基材１に貼り合わせた。次いで得られた配合例１の粘着剤を、乾燥後の厚みが１００μｍになるよう７５μｍのＰＥＴセパレーターに塗工（第２面側粘着剤層）し、４０℃で１分間乾燥した後、直ぐに１００℃で３分間乾燥し、発泡体基材１の粘着剤層が塗工されていない面に貼り合わせ、２３℃－５０％で１週間放置し、厚み３００μｍの実施例１の発泡体基材両面粘着シートを得た。
[Example 1]
<Creating an adhesive sheet>
The obtained adhesive of Formulation Example 1 was coated on a polyethylene terephthalate (PET) separator of 50 μm so that the thickness after drying was 100 μm (first surface side adhesive layer), and dried at 40 ° C. for 1 minute. , and immediately dried at 100°C for 3 minutes, and bonded to a foam substrate 1 having a thickness of 100 µm. Then, the obtained adhesive of Formulation Example 1 was coated on a 75 μm PET separator (second side adhesive layer) so that the thickness after drying was 100 μm, dried at 40 ° C. for 1 minute, and then ℃ for 3 minutes, laminated to the surface of the foam substrate 1 not coated with the adhesive layer, left at 23 ℃ -50% for 1 week, and both sides of the foam substrate of Example 1 having a thickness of 300 μm. A sticky sheet was obtained.
［実施例２～２４、比較例１～３］
表５～７に示す通り粘着剤層の種類、厚み、発泡体基材の種類を変えた以外は、実施例１と同様に粘着シートの作成を行うことでそれぞれ実施例２～２４、比較例１～３の粘着テープを得た。
[Examples 2 to 24, Comparative Examples 1 to 3]
As shown in Tables 5 to 7, the adhesive sheets were prepared in the same manner as in Example 1, except that the type and thickness of the adhesive layer and the type of foam base material were changed. Adhesive tapes of 1 to 3 were obtained.
表１～７中の略号は下記の通りである。
・アクリルモノマー
ＢＡ：ブチルアクリレート
２ＥＨＡ：２エチルへキシルアクリレート
ＥＡ：エチルアクリレート
・カルボキシ基含有モノマー
ＡＡ：アクリル酸
・水酸基含有モノマー
ＨＥＡ：２－ヒドロキシエチルアクリレート
２ＨＥＭＡ：２－ヒドロキシエチルメタクリレート
・粘着付与樹脂
ＹＳポリスターＴ１３０：（ヤスハラケミカル社製テルペンフェノール樹脂、軟化点１３０±５℃）
・イソシアネート化合物
ＴＤＩ－ＴＭＰアダクト体：トリレンジイソシアネートのトリメチロールプロパンアダクト体
［発泡体基材］
・発泡体基材１；ポリオレフィン系発泡体基材「ポリプロピレン系樹脂、密度：７００ｋｇ／ｍ3、厚み：１００μ、易接着処理済」
・発泡体基材２；ポリオレフィン系発泡体基材「ポリプロピレン系樹脂、密度：６００ｋｇ／ｍ3、厚み：２００μ、易接着処理済」
・発泡体基材３；ポリオレフィン系発泡体基材「ポリプロピレン系樹脂、密度：１８０ｋｇ／ｍ3、厚み：２００μ、易接着処理済」
・発泡体基材４；ポリオレフィン系発泡体基材「ポリプロピレン系樹脂、密度：９００ｋｇ／ｍ3、厚み：２００μ、易接着処理済」
・発泡体基材５；ポリオレフィン系発泡体基材「ポリエチレン系樹脂、密度：６００ｋｇ／ｍ3、厚み：２００μ、易接着処理済」
Abbreviations in Tables 1 to 7 are as follows.
・Acrylic monomer BA: butyl acrylate 2EHA: 2-ethylhexyl acrylate EA: ethyl acrylate ・Carboxy group-containing monomer AA: acrylic acid ・Hydroxy group-containing monomer HEA: 2-hydroxyethyl acrylate 2HEMA: 2-hydroxyethyl methacrylate ・Tackifier resin YS Polystar T130: (Terpene phenolic resin manufactured by Yasuhara Chemical Co., softening point 130±5° C.)
・ Isocyanate compound TDI-TMP adduct: trimethylolpropane adduct of tolylene diisocyanate [foam base material]
・Foam base material 1: Polyolefin-based foam base material "polypropylene resin, density: 700 kg/m 3 , thickness: 100 µm, easy-adhesion treatment completed"
・Foam base material 2: Polyolefin-based foam base material "polypropylene resin, density: 600 kg/m 3 , thickness: 200 µm, easy-adhesion treatment completed"
・Foam base material 3: Polyolefin-based foam base material "polypropylene resin, density: 180 kg/m 3 , thickness: 200 µm, easy-adhesion treatment completed"
・Foam base material 4: Polyolefin-based foam base material "polypropylene resin, density: 900 kg/m 3 , thickness: 200 µm, easy-adhesion treatment completed"
・Foam base material 5: Polyolefin-based foam base material "Polyethylene-based resin, density: 600 kg/m 3 , thickness: 200 µm, easy-adhesion treatment completed"
得られた粘着シートを用いて、以下の物性評価を行った。 The following physical property evaluation was performed using the obtained adhesive sheet.
＜２３℃引張破断強度＞
得られた粘着シートを幅 ５ｍｍ・長さ１００ｍｍの大きさにカットし夫々試料とした。この際、ＭＤ方向が長さ１００ｍｍとなるようにカットした試料と、ＴＤ方向が１００ｍｍとなるようにカットした試料を夫々用意した。
次いで２３℃－５０％ＲＨ雰囲気下にて、上記の試料を２４時間放置後、得られた試料の両面の剥離ライナーを剥がし、試料の上部２．５ｍｍ、下部２．５ｍｍに紙基材を貼り合わせ、引張試験機に固定、引張速度０．３ｍ／ｍｉｎの条件で測定し、発泡体粘着シートが破断した値をＭＤ方向とＴＤ方向で測定した。
<Tensile breaking strength at 23°C>
The pressure-sensitive adhesive sheet thus obtained was cut into a size of 5 mm in width and 100 mm in length to obtain a sample. At this time, a sample cut to have a length of 100 mm in the MD direction and a sample cut to have a length of 100 mm in the TD direction were prepared.
Then, after leaving the above sample in an atmosphere of 23° C.-50% RH for 24 hours, the release liners on both sides of the obtained sample were peeled off, and paper substrates were attached to the top 2.5 mm and bottom 2.5 mm of the sample. It was put together, fixed to a tensile tester, measured under conditions of a tensile speed of 0.3 m/min, and the value at which the foam adhesive sheet broke was measured in the MD direction and the TD direction.
＜８０℃引張破断強度＞
得られた粘着シートを幅５ｍｍ・長さ１００ｍｍの大きさに準備し試料とした。次いで８０℃の雰囲気下にて、試料を２４時間放置後、得られた試料の両面の剥離ライナーを剥がし、試料の上部２．５ｍｍ、下部２．５ｍｍに紙基材を貼り合わせ、引張試験機に固定、引張速度０．３ｍ／ｍｉｎの条件で測定し、発泡体粘着シートが破断した値をＭＤ方向とＴＤ方向で測定した。
<80°C tensile breaking strength>
The pressure-sensitive adhesive sheet thus obtained was prepared in a size of 5 mm in width and 100 mm in length and used as a sample. Then, after leaving the sample in an atmosphere of 80°C for 24 hours, the release liners on both sides of the obtained sample were peeled off, and paper substrates were attached to the top 2.5 mm and bottom 2.5 mm of the sample, and a tensile tester was used. , and a tensile speed of 0.3 m/min.
＜－１０℃引張破断強度＞
得られた粘着シートを幅５ｍｍ・長さ１００ｍｍの大きさに準備し試料とした。次いで－１０℃の雰囲気下にて、試料を２４時間放置後、得られた試料の両面の剥離ライナーを剥がし、試料の上部２．５ｍｍ、下部２．５ｍｍに紙基材を貼り合わせ、引張試験機に固定、引張速度０．３ｍ／ｍｉｎの条件で測定し、発泡体粘着シートが破断した値をＭＤ方向とＴＤ方向で測定した。
<-10°C tensile breaking strength>
The pressure-sensitive adhesive sheet thus obtained was prepared in a size of 5 mm in width and 100 mm in length and used as a sample. Then, after leaving the sample for 24 hours in an atmosphere of −10° C., the release liners on both sides of the obtained sample were peeled off, and a paper substrate was attached to the top 2.5 mm and the bottom 2.5 mm of the sample, and a tensile test was performed. It was fixed to the machine and measured at a tensile speed of 0.3 m/min.
＜冷熱衝撃試験後の９０℃剥離粘着力＞
得られた粘着シートの測定しない面（第２面側粘着剤層）の剥離ライナーを剥がし、ＰＥＴフィルム（厚さ２５μｍ）を貼り合せた後、幅５ｍｍ長さ１００ｍｍの大きさにカットし試料とした。次いで２３℃－５０％ＲＨ雰囲気下にて、得られた試料から、第１面側粘着剤層の剥離ライナーを剥がし、露出した粘着剤層をポリカーボネート板に２ｋｇのローラーで１往復圧着し、２４時間放置後、冷熱衝撃試験機を用いて、８０℃環境で３０分間と－１０℃環境で３０分間の条件を１往復で１サイクルとした試験を、１００サイクル実施した。試験終了後、試験片を取り出し、２３℃－５０％ＲＨ雰囲気下にて１時間放置後、引張試験機を使用して剥離角度９０度、剥離速度０．３ｍ／分の条件でＭＤ方向とＴＤ方向で粘着力を測定することで冷熱衝撃試験性を評価した。評価基準は下記の通りである。
＋＋：９０℃剥離の粘着力が６．０Ｎ／５ｍｍ以上（良好）
＋：９０℃剥離の粘着力が４．０Ｎ／５ｍｍ以上、６．０Ｎ／５ｍｍ未満（実用上問題なし）
ＮＧ：９０℃剥離の粘着力が４．０Ｎ／５ｍｍ未満（実用不可）
<90°C peel adhesive strength after thermal shock test>
After peeling off the release liner on the surface (second surface side adhesive layer) of the obtained adhesive sheet that is not to be measured and pasting a PET film (thickness 25 μm), it was cut into a size of 5 mm in width and 100 mm in length and used as a sample. bottom. Then, in an atmosphere of 23° C.-50% RH, the release liner of the pressure-sensitive adhesive layer on the first side was peeled off from the obtained sample, and the exposed pressure-sensitive adhesive layer was pressed back and forth against a polycarbonate plate with a roller of 2 kg. After leaving for a period of time, a thermal shock tester was used to conduct 100 cycles of a test in which one cycle was 30 minutes in an 80° C. environment and 30 minutes in a −10° C. environment. After the test, the test piece was taken out and left in an atmosphere of 23° C.-50% RH for 1 hour. The thermal shock testability was evaluated by measuring the adhesive force in the direction. Evaluation criteria are as follows.
++: Adhesive strength at 90° C. peeling is 6.0 N/5 mm or more (good)
+: Adhesive strength at 90° C. peeling is 4.0 N/5 mm or more and less than 6.0 N/5 mm (practically no problem)
NG: 90 ° C. peeling adhesive force is less than 4.0 N / 5 mm (practical impractical)
＜保持力＞
得られた粘着シートの測定しない面（第２面側粘着剤層）の剥離ライナーを剥がし、ＰＥＴフィルム（２５μｍ）を貼り合せた後、幅２５ｍｍ・長さ１００ｍｍの大きさに準備し試料とした。次いで２３℃－５０％ＲＨ雰囲気下にて、得られた試料から第１面側粘着剤層の剥離ライナーを長さ２５ｍｍ×幅２５ｍｍ剥がしポリカーボネート板に２ｋｇロールで１往復圧着し、２３℃－５０％の雰囲気下で２０分間放置した。その後、８０℃の雰囲気下で１ｋｇの重りを付け１８０度の方向に力が加わるようセットし、２４時間後に粘着シートが被着体から何ｍｍずれているか、もしくは完全にずれ落ちた落下時間を測定した。
＋＋：保持力試験のずれが０．５ｍｍ未満（良好）
＋：保持力試験のずれが０．５ｍｍ以上１．０ｍｍ未満（実用上問題なし）
ＮＧ：保持力試験のずれが１．０ｍｍ以上または落下（実用不可）
<Holding power>
After peeling off the release liner on the surface (second surface side adhesive layer) of the obtained adhesive sheet that is not to be measured and pasting a PET film (25 μm), a sample having a width of 25 mm and a length of 100 mm was prepared. . Next, in an atmosphere of 23° C.-50% RH, the release liner of the pressure-sensitive adhesive layer on the first side was peeled off from the obtained sample, and the sample was pressed back and forth with a 2-kg roll to a polycarbonate plate, and then 23° C.-50. % atmosphere for 20 minutes. After that, a weight of 1 kg was attached in an atmosphere of 80 ° C. and set so that a force was applied in the direction of 180 degrees. It was measured.
++: Deviation in holding force test is less than 0.5 mm (good)
+: Deviation in holding force test is 0.5 mm or more and less than 1.0 mm (practically no problem)
NG: Deviation of holding force test is 1.0 mm or more or drop (not practical)
《再剥離性の評価》
作成した各粘着シートを、幅５ｍｍ×長さ１００ｍｍに裁断し、第１面側粘着剤層の剥離ライナーを剥がし、露出した粘着剤層を厚さ３ｍｍの表面をポリカーボネート板に２３℃、相対湿度５０％の環境下で貼着し、質量２ｋｇのロールを１往復して測定試料を得た。
次いで、この測定試料を２３℃雰囲気下で２４時間放置した後に、引張試験機を用いて、剥離速度３００ｍｍ／分、剥離角度１８０度の条件で剥離し、粘着シートの破断および剥離後のポリカーボネート板表面の状態を目視で３段階評価した。
＋＋：粘着シートの破断が無く、ポリカーボネート板に粘着シートの残渣がない。良好。
＋：粘着シートの破断は無いが、一部層間剥離が起こりポリカーボネート板にわずかに粘着シートが残った。実用可。
ＮＧ：粘着シートが破断。実用不可。
<<Evaluation of Removability>>
Each pressure-sensitive adhesive sheet was cut into a width of 5 mm and a length of 100 mm, the release liner of the pressure-sensitive adhesive layer on the first side was peeled off, and the exposed pressure-sensitive adhesive layer was placed on a polycarbonate plate with a thickness of 3 mm at 23 ° C. and relative humidity. A measurement sample was obtained by pasting under an environment of 50% and reciprocating a roll having a mass of 2 kg once.
Next, after leaving this measurement sample in an atmosphere of 23 ° C. for 24 hours, using a tensile tester, it was peeled at a peel speed of 300 mm / min and a peel angle of 180 degrees, and the polycarbonate plate after breaking and peeling the adhesive sheet. The state of the surface was visually evaluated on a 3-grade scale.
++: No breakage of the adhesive sheet and no residue of the adhesive sheet on the polycarbonate plate. Good.
+: The adhesive sheet was not broken, but some delamination occurred and a small amount of the adhesive sheet remained on the polycarbonate plate. Practical.
NG: The adhesive sheet broke. Not practical.
表５～表７の結果から実施例１～２４は、冷熱衝撃試験後の９０℃剥離粘着力が良好であった。さらに本願発明の両面粘着シートは、再剥離性も良好であった。 From the results in Tables 5 to 7, Examples 1 to 24 had good 90° C. peel adhesive strength after the thermal shock test. Furthermore, the double-sided pressure-sensitive adhesive sheet of the present invention had good removability.
Claims (5)
－１０℃、２３℃および８０℃におけるＭＤ方向の引張破断強度が９Ｎ／５ｍｍ以上であり、
－１０℃、２３℃および８０℃におけるＴＤ方向の引張破断強度が５Ｎ／５ｍｍ以上である電子機器部品固定用発泡粘着テープ。 A foamed adhesive tape for fixing electronic device parts, comprising an adhesive layer having a thickness of 70 to 200 μm on both sides of a polyolefin foam base material,
The tensile breaking strength in the MD direction at -10 ° C., 23 ° C. and 80 ° C. is 9 N / 5 mm or more,
A foamed pressure-sensitive adhesive tape for fixing electronic device parts having a tensile breaking strength in the TD direction at -10°C, 23°C and 80°C of 5 N/5 mm or more.
5. The electronic device according to claim 4, wherein the electronic device is mounted in an automobile.
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|---|---|---|---|---|
| JP2009108314A (en) * | 2007-10-12 | 2009-05-21 | Dic Corp | Water-proofing double-sided adhesive tape |
| JP2011105829A (en) * | 2009-11-16 | 2011-06-02 | Nitto Denko Corp | Self-adhesive tape |
| JP2015120876A (en) * | 2013-11-22 | 2015-07-02 | 日東電工株式会社 | Double-sided adhesive sheet |
| JP2016124936A (en) * | 2014-12-26 | 2016-07-11 | 積水化学工業株式会社 | Adhesive sheet |
| WO2017126135A1 (en) * | 2016-01-21 | 2017-07-27 | 積水化学工業株式会社 | Double-sided adhesive tape |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009108314A (en) * | 2007-10-12 | 2009-05-21 | Dic Corp | Water-proofing double-sided adhesive tape |
| JP2011105829A (en) * | 2009-11-16 | 2011-06-02 | Nitto Denko Corp | Self-adhesive tape |
| JP2015120876A (en) * | 2013-11-22 | 2015-07-02 | 日東電工株式会社 | Double-sided adhesive sheet |
| JP2015120877A (en) * | 2013-11-22 | 2015-07-02 | 日東電工株式会社 | Double-sided adhesive sheet |
| JP2016124936A (en) * | 2014-12-26 | 2016-07-11 | 積水化学工業株式会社 | Adhesive sheet |
| WO2017126135A1 (en) * | 2016-01-21 | 2017-07-27 | 積水化学工業株式会社 | Double-sided adhesive tape |
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