JP2023018335A - Light source device - Google Patents

Abstract

To provide a light source device capable of accurately detecting intensity of light from a plurality of light-emitting elements due to an inexpensive configuration.SOLUTION: A light source device comprises: a plate-like substrate extending in a prescribed direction; a plurality of light-emitting elements arranged on the substrate and emitting light in the prescribed direction; a plurality of optical members transmitting light from each of the plurality light-emitting elements; a plurality of support members supporting each of the plurality of optical members; and a plurality of light-receiving elements arranged on the substrate, receiving light from the plurality of light-emitting elements, and outputting current according to intensity of the received light. A groove extending in the prescribed direction is formed on lower surfaces of the plurality of support members, and the plurality of light-receiving elements are arranged so that at least a part is housed in a groove of each support member.SELECTED DRAWING: Figure 5

Description

本発明は、光源装置に関する。 The present invention relates to a light source device.

ディスプレイ又はスクリーン等に画像を表示するための光源装置として、空気中に出射された赤色光、緑色光及び青色光を合波して出力する三色光光源が知られている（例えば、特許文献１参照）。このような光源装置は、相互に異なる波長帯の光を出力する複数の発光素子、各発光素子を駆動するための駆動回路及び各発光素子からの光を結合する結合素子を有する。 As a light source device for displaying an image on a display, screen, or the like, a three-color light source that multiplexes and outputs red light, green light, and blue light emitted into the air is known (for example, Patent Document 1 reference). Such a light source device has a plurality of light emitting elements that output light in mutually different wavelength bands, a driving circuit for driving each light emitting element, and a coupling element that couples the light from each light emitting element.

特開２０１６－１５４１５号公報JP 2016-15415 A

このような光源装置においては、複数の発光素子から出射される光の強度を制御するために、各発光素子に対応する受光素子を設け、各発光素子からの光の強度を検出することが一般的になされている。しかしながら、各受光素子が他の発光素子からの光を受光することにより、各発光素子の発光強度を正確に検出できなくなるという問題があった。他方で、各受光素子が他の発光素子からの光を受光しないように遮光壁を設けた場合、装置の製造コストが増加するという問題があった。 In such a light source device, in order to control the intensity of light emitted from a plurality of light emitting elements, it is common to provide a light receiving element corresponding to each light emitting element and detect the intensity of light from each light emitting element. It is done purposefully. However, since each light receiving element receives light from another light emitting element, there is a problem that the light emission intensity of each light emitting element cannot be accurately detected. On the other hand, if a light-shielding wall is provided so that each light-receiving element does not receive light from other light-emitting elements, there is a problem that the manufacturing cost of the device increases.

本発明は、上述の課題を解決するためになされたものであり、安価な構成により、複数の発光素子からの光の強度を正確に検出することを可能とする光源装置を提供することを目的とする。 SUMMARY OF THE INVENTION It is an object of the present invention to provide a light source device capable of accurately detecting the intensity of light emitted from a plurality of light emitting elements with an inexpensive structure. and

本発明に係る光源装置は、所定方向に延伸する平板状の基板と、基板に配置され、所定方向に光を出射する複数の発光素子と、複数の発光素子からの光をそれぞれ透過させる複数の光学部材と、複数の光学部材をそれぞれ支持する複数の支持部材と、基板に配置され、複数の発光素子からの光を受光して、受光した光の強度に応じた電流を出力する複数の受光素子と、を有し、複数の支持部材の下面には、所定方向に延伸する溝部が形成され、複数の受光素子は、少なくとも一部が各支持部材の溝部に収容されるように配置される、ことを特徴とする。 A light source device according to the present invention comprises a flat substrate extending in a predetermined direction, a plurality of light emitting elements arranged on the substrate and emitting light in a predetermined direction, and a plurality of light emitting elements transmitting light from the plurality of light emitting elements. An optical member, a plurality of support members that respectively support the plurality of optical members, and a plurality of light receivers arranged on a substrate for receiving light from the plurality of light emitting elements and outputting a current corresponding to the intensity of the received light. grooves extending in a predetermined direction are formed on the lower surfaces of the plurality of support members, and the plurality of light receiving elements are arranged so that at least a portion of the plurality of light receiving elements is accommodated in the grooves of the support members. , characterized in that

また、本発明に係る光源装置において、複数の受光素子は、各受光素子を収容する支持部材が支持する光学部材に対向するように配置される、ことが好ましい。 Moreover, in the light source device according to the present invention, it is preferable that the plurality of light receiving elements are arranged so as to face the optical member supported by the supporting member that accommodates each light receiving element.

また、本発明に係る光源装置において、複数の光学部材の発光素子に対向する面は、発光素子からの光を受光素子に向けて反射させるように、下方に傾斜して形成される、ことが好ましい。 Further, in the light source device according to the present invention, the surfaces of the plurality of optical members facing the light-emitting elements may be inclined downward so as to reflect the light from the light-emitting elements toward the light-receiving elements. preferable.

また、本発明に係る光源装置において、複数の光学部材は、各支持部材に所定方向に形成された貫通孔の内部に収容されることにより支持され、複数の受光素子は、貫通孔の壁面と対向するように配置される、ことが好ましい。 Further, in the light source device according to the present invention, the plurality of optical members are supported by being housed inside through holes formed in each supporting member in a predetermined direction, and the plurality of light receiving elements are arranged between the wall surfaces of the through holes. Preferably, they are arranged to face each other.

また、本発明に係る光源装置において、複数の支持部材のそれぞれは、複数の発光素子のうち、支持部材に対向する発光素子とは異なる発光素子のうちの少なくとも一つの発光素子から支持部材に収容される受光素子に向かう光を遮光する、ことが好ましい。 Further, in the light source device according to the present invention, each of the plurality of supporting members is accommodated in the supporting member from at least one light emitting element among the plurality of light emitting elements that is different from the light emitting element facing the supporting member. It is preferable to block the light directed to the light receiving element.

また、本発明に係る光源装置は、各光学部材を透過した各発光素子からの光を結合して出射する結合素子をさらに有する、ことが好ましい。 Moreover, it is preferable that the light source device according to the present invention further includes a coupling element that couples and emits light from each light emitting element that has passed through each optical member.

また、本発明に係る光源装置は、基板の上面に配置される導電性の配線パターンをさらに有し、複数の受光素子は、一部のみが各支持部材の溝部に収容されるように配置されるとともに、それぞれ複数のボンディングワイヤを介して配線パターンと電気的に接続され、複数のボンディングワイヤの一端は、各受光素子の上面の、溝部に収容されない部分に接合される、ことが好ましい。 In addition, the light source device according to the present invention further has a conductive wiring pattern arranged on the upper surface of the substrate, and the plurality of light receiving elements are arranged so that only some of them are accommodated in the grooves of the support members. In addition, it is preferable that each light receiving element is electrically connected to the wiring pattern via a plurality of bonding wires, and one end of the plurality of bonding wires is bonded to a portion of the upper surface of each light receiving element that is not accommodated in the groove.

本発明に係る光源装置は、安価な構成により、複数の発光素子からの光の強度を正確に検出することを可能とする。 INDUSTRIAL APPLICABILITY The light source device according to the present invention enables accurate detection of the intensity of light emitted from a plurality of light emitting elements with an inexpensive configuration.

光源装置１の斜視図である。1 is a perspective view of a light source device 1; FIG. 光源装置１の斜視図である。1 is a perspective view of a light source device 1; FIG. 光源装置１の平面図である。2 is a plan view of the light source device 1; FIG. 光源装置１の平面図である。2 is a plan view of the light source device 1; FIG. 光源装置１の正面図である。2 is a front view of the light source device 1; FIG. （Ａ）は第１支持部材１４６の斜視図であり、（Ｂ）は光源装置１の一部拡大断面図である。(A) is a perspective view of the first support member 146, and (B) is a partially enlarged sectional view of the light source device 1. FIG. 光源装置２の平面図である。2 is a plan view of the light source device 2; FIG. 光源装置３の一部拡大断面図である。3 is a partially enlarged cross-sectional view of the light source device 3. FIG. 光源装置４の一部拡大断面図である。4 is a partially enlarged cross-sectional view of the light source device 4; FIG. 光源装置５の一部拡大断面図である。3 is a partially enlarged cross-sectional view of the light source device 5; FIG.

以下、図面を参照しつつ、本発明の様々な実施形態について説明する。本発明の技術的範囲はそれらの実施形態に限定されず、特許請求の範囲に記載された発明及びその均等物に及ぶ点に留意されたい。 Various embodiments of the present invention will now be described with reference to the drawings. It should be noted that the scope of the present invention is not limited to those embodiments, but rather extends to the invention recited in the claims and equivalents thereof.

図１は本発明の実施形態に係る光源装置１の斜視図であり、図２は筐体を取り除いた状態の光源装置１の斜視図である。図３は筐体を取り除いた状態の光源装置１の平面図であり、図４は、光源装置１の配線について説明するための、筐体、結合素子、各光学部材及び各支持部材を取り除いた状態の光源装置１の平面図である。なお、以降では、図１の矢印Ｄ１で示される方向を第１方向と称し、第１方向と直交する、矢印Ｄ２で示される方向を第２方向と称することがある。また、第１方向は所定方向の一例である。光源装置１は、第１基板１１、第２基板１２、配線パターン１３、第１光学系１４、第２光学系１５、第３光学系１６、結合素子１７、温度センサ１８及び筐体１９を有する。 FIG. 1 is a perspective view of a light source device 1 according to an embodiment of the present invention, and FIG. 2 is a perspective view of the light source device 1 with the housing removed. FIG. 3 is a plan view of the light source device 1 with the housing removed, and FIG. 4 shows the wiring of the light source device 1 with the housing, coupling elements, optical members, and support members removed. 1 is a plan view of a light source device 1 in a state; FIG. Hereinafter, the direction indicated by arrow D1 in FIG. 1 may be referred to as a first direction, and the direction indicated by arrow D2 orthogonal to the first direction may be referred to as a second direction. Also, the first direction is an example of a predetermined direction. The light source device 1 has a first substrate 11, a second substrate 12, a wiring pattern 13, a first optical system 14, a second optical system 15, a third optical system 16, a coupling element 17, a temperature sensor 18, and a housing 19. .

第１基板１１及び第２基板１２は、窒化アルミ又は酸化アルミ等の、剛性及び放熱性の高いセラミック材料により、第１方向に延伸する矩形の平板状に形成される。第２基板１２は、第１基板１１よりも小さい平面形状を有し、第１基板１１の上面に接合される。第１基板１１の上面には、第２基板１２を囲むように、筐体１９を接合するための接着部材１１１が配置される。接着部材１１１は、例えば金錫である。なお、第１基板１１と第２基板１２は一体であってもよい。また、第２基板１２の外周が第１基板１１の外周と重なる位置まで延伸されてもよい。 The first substrate 11 and the second substrate 12 are made of a ceramic material such as aluminum nitride or aluminum oxide, which has high rigidity and heat dissipation, and is formed into a rectangular flat plate shape extending in the first direction. The second substrate 12 has a planar shape smaller than that of the first substrate 11 and is bonded to the upper surface of the first substrate 11 . An adhesive member 111 for bonding the housing 19 is arranged on the upper surface of the first substrate 11 so as to surround the second substrate 12 . The adhesive member 111 is gold tin, for example. Note that the first substrate 11 and the second substrate 12 may be integrated. Also, the outer circumference of the second substrate 12 may be extended to a position where it overlaps with the outer circumference of the first substrate 11 .

配線パターン１３は、金、銅又はアルミニウム等の導電性の金属により形成され、第２基板１２の上面に配置される。配線パターン１３は、相互に離間して且つ絶縁される第１配線１３１ａ、第２配線１３１ｂ、第３配線１３１ｃ、第４配線１３１ｄ、第５配線１３２ａ、第６配線１３２ｂ、第７配線１３２ｃ、第８配線１３２ｄ、第９配線１３３ａ、第１０配線１３３ｂ、第１１配線１３３ｃ、第１２配線１３３ｄ、第１３配線１３４ａ及び第１４配線１３４ｂを有する。各配線は、第１基板１１及び第２基板１２の上下を貫通する貫通孔（図４において、破線により図示）を介して、外部の駆動回路に電気的に接続される。 The wiring pattern 13 is made of a conductive metal such as gold, copper, or aluminum and arranged on the upper surface of the second substrate 12 . The wiring pattern 13 includes a first wiring 131a, a second wiring 131b, a third wiring 131c, a fourth wiring 131d, a fifth wiring 132a, a sixth wiring 132b, a seventh wiring 132c, and a third wiring 132c, which are spaced apart and insulated from each other. It has eight wirings 132d, a ninth wiring 133a, a tenth wiring 133b, an eleventh wiring 133c, a twelfth wiring 133d, a thirteenth wiring 134a, and a fourteenth wiring 134b. Each wiring is electrically connected to an external drive circuit via a through-hole (indicated by a broken line in FIG. 4) penetrating vertically through the first substrate 11 and the second substrate 12 .

第１光学系１４、第２光学系１５、第３光学系１６は、それぞれ赤色光、緑色光及び青色光を結合素子１７に向けて出射するための構成である。第１光学系１４は、第１サブ基板１４１、第１発光素子１４２、第１保護素子１４３、第１受光素子１４４、第１光学部材１４５及び第１支持部材１４６を有する。第２光学系１５は、第２サブ基板１５１、第２発光素子１５２、第２保護素子１５３、第２受光素子１５４、第２光学部材１５５及び第２支持部材１５６を有する。第３光学系１６は、第３サブ基板１６１、第３発光素子１６２、第３保護素子１６３、第３受光素子１６４、第３光学部材１６５及び第３支持部材１６６を有する。 The first optical system 14, the second optical system 15, and the third optical system 16 are configured to emit red light, green light, and blue light toward the coupling element 17, respectively. The first optical system 14 has a first sub-board 141 , a first light emitting element 142 , a first protection element 143 , a first light receiving element 144 , a first optical member 145 and a first support member 146 . The second optical system 15 has a second sub-board 151 , a second light emitting element 152 , a second protection element 153 , a second light receiving element 154 , a second optical member 155 and a second support member 156 . The third optical system 16 has a third sub-board 161 , a third light emitting element 162 , a third protection element 163 , a third light receiving element 164 , a third optical member 165 and a third support member 166 .

第１サブ基板１４１、第２サブ基板１５１及び第３サブ基板１６１は、窒化アルミ又は酸化アルミ等の、剛性及び放熱性の高いセラミック材料により直方体状に形成され、第２基板１２の上面に配置される。第１サブ基板１４１、第２サブ基板１５１及び第３サブ基板１６１は、絶縁性の樹脂により形成されてもよい。 The first sub-substrate 141 , second sub-substrate 151 and third sub-substrate 161 are formed in a rectangular parallelepiped shape from a ceramic material with high rigidity and heat dissipation such as aluminum nitride or aluminum oxide, and are arranged on the top surface of the second substrate 12 . be done. The first sub-board 141, the second sub-board 151 and the third sub-board 161 may be made of insulating resin.

第１サブ基板１４１の上面には、第１導電体１４１ａ、第２導電体１４１ｂ及び第３導電体１４１ｃが配置される。第１導電体１４１ａは第２導電体１４１ｂの上面に配置され、第１導電体１４１ａと第２導電体１４１ｂとは、電気的に接続される。第２導電体１４１ｂ及び第３導電体１４１ｃは相互に離間して且つ絶縁される。第１導電体１４１ａは、第２導電体１４１ｂと第１発光素子１４２とを接合する導電性の接合剤であり、例えば、金錫である。 A first conductor 141 a , a second conductor 141 b , and a third conductor 141 c are arranged on the top surface of the first sub-board 141 . The first conductor 141a is arranged on the upper surface of the second conductor 141b, and the first conductor 141a and the second conductor 141b are electrically connected. The second conductor 141b and the third conductor 141c are spaced apart and insulated from each other. The first conductor 141a is a conductive bonding agent that bonds the second conductor 141b and the first light emitting element 142, and is gold tin, for example.

第２サブ基板１５１の上面には、第１導電体１５１ａ、第２導電体１５１ｂ及び第３導電体１５１ｃが配置される。第１導電体１５１ａは第２導電体１５１ｂの上面に配置され、第１導電体１５１ａと第２導電体１５１ｂとは、電気的に接続される。第２導電体１５１ｂ及び第３導電体１５１ｃは相互に離間して且つ絶縁される。第１導電体１５１ａは、第２導電体１５１ｂと第２発光素子１５２とを接合する導電性の接合剤であり、例えば、金錫である。 A first conductor 151 a , a second conductor 151 b and a third conductor 151 c are arranged on the top surface of the second sub-board 151 . The first conductor 151a is arranged on the upper surface of the second conductor 151b, and the first conductor 151a and the second conductor 151b are electrically connected. The second conductor 151b and the third conductor 151c are spaced apart and insulated from each other. The first conductor 151a is a conductive bonding agent that bonds the second conductor 151b and the second light emitting element 152, and is gold tin, for example.

第３サブ基板１６１の上面には、第１導電体１６１ａ、第２導電体１６１ｂ及び第３導電体１６１ｃが配置される。第１導電体１６１ａは第２導電体１６１ｂの上面に配置され、第１導電体１６１ａと第２導電体１６１ｂとは、電気的に接続される。第２導電体１６１ｂ及び第３導電体１６１ｃは相互に離間して且つ絶縁される。第１導電体１６１ａは、第２導電体１６１ｂと第３発光素子１６２とを接合する導電性の接合剤であり、例えば、金錫である。 A first conductor 161a, a second conductor 161b, and a third conductor 161c are arranged on the upper surface of the third sub-board 161. As shown in FIG. The first conductor 161a is arranged on the upper surface of the second conductor 161b, and the first conductor 161a and the second conductor 161b are electrically connected. The second conductor 161b and the third conductor 161c are spaced apart and insulated from each other. The first conductor 161a is a conductive bonding agent that bonds the second conductor 161b and the third light emitting element 162, and is gold tin, for example.

第１発光素子１４２は、ガリウムヒ素基板に形成され、赤色光を出射するレーザダイオードである。第１発光素子１４２は、下面にアノードを、上面にカソードを有する。第１発光素子１４２は第１サブ基板１４１の第１導電体１４１ａの上面に配置される。第１発光素子１４２のアノードは、第１導電体１４１ａ、第２導電体１４１ｂ及びボンディングワイヤを介して第１配線１３１ａと電気的に接続される。第１発光素子１４２のカソードは、第３導電体１４１ｃ及びボンディングワイヤを介して第２配線１３１ｂと電気的に接続される。第１発光素子１４２は、アノードとカソードとの間に外部の駆動回路から電流を供給されることに応じて、６２０ｎｍ－７５０ｎｍの波長帯の赤色光を出射する。 The first light emitting element 142 is a laser diode formed on a gallium arsenide substrate and emitting red light. The first light emitting element 142 has an anode on the bottom surface and a cathode on the top surface. The first light emitting device 142 is arranged on the top surface of the first conductor 141 a of the first sub-substrate 141 . The anode of the first light emitting element 142 is electrically connected to the first wiring 131a through the first conductor 141a, the second conductor 141b and bonding wires. The cathode of the first light emitting element 142 is electrically connected to the second wiring 131b via the third conductor 141c and bonding wire. The first light emitting element 142 emits red light with a wavelength band of 620 nm to 750 nm in response to current being supplied from an external driving circuit between the anode and the cathode.

第２発光素子１５２は、窒化ガリウム基板に形成され、緑色光を出射するレーザダイオードである。第２発光素子１５２は、下面にアノードを、上面にカソードを有する。第２発光素子１５２は第２サブ基板１５１の第１導電体１５１ａの上面に配置される。第２発光素子１５２のアノードは、第１導電体１５１ａ、第２導電体１５１ｂ及びボンディングワイヤを介して第５配線１３２ａと電気的に接続される。第２発光素子１５２のカソードは、第３導電体１５１ｃ及びボンディングワイヤを介して第６配線１３２ｂと電気的に接続される。第２発光素子１５２は、アノードとカソードとの間に外部の駆動回路から電流を供給されることに応じて、４９０ｎｍ－５７０ｎｍの波長帯の緑色光を出射する。 The second light emitting element 152 is a laser diode formed on a gallium nitride substrate and emitting green light. The second light emitting element 152 has an anode on the bottom surface and a cathode on the top surface. The second light emitting device 152 is arranged on the upper surface of the first conductor 151a of the second sub-substrate 151 . The anode of the second light emitting element 152 is electrically connected to the fifth wiring 132a through the first conductor 151a, the second conductor 151b and bonding wires. The cathode of the second light emitting element 152 is electrically connected to the sixth wiring 132b via the third conductor 151c and bonding wire. The second light emitting element 152 emits green light with a wavelength band of 490 nm to 570 nm in response to current being supplied from an external driving circuit between the anode and the cathode.

第３発光素子１６２は、窒化ガリウム基板に形成され、青色光を出射するレーザダイオードである。第３発光素子１６２は、下面にアノードを、上面にカソードを有する。第３発光素子１６２は第３サブ基板１６１の第１導電体１６１ａの上面に配置される。第３発光素子１６２のアノードは、第１導電体１６１ａ、第２導電体１６１ｂ及びボンディングワイヤを介して第９配線１３３ａと電気的に接続される。第３発光素子１６２のカソードは、第３導電体１６１ｃ及びボンディングワイヤを介して第１０配線１３３ｂと電気的に接続される。第３発光素子１６２は、アノードとカソードとの間に外部の駆動回路から電流を供給されることに応じて、４４０ｎｍ－４９５ｎｍの波長帯の青色光を出射する。 The third light emitting element 162 is a laser diode formed on a gallium nitride substrate and emitting blue light. The third light emitting element 162 has an anode on the bottom surface and a cathode on the top surface. The third light emitting device 162 is arranged on the upper surface of the first conductor 161a of the third sub-substrate 161. As shown in FIG. The anode of the third light emitting element 162 is electrically connected to the ninth wiring 133a via the first conductor 161a, the second conductor 161b and bonding wires. A cathode of the third light emitting element 162 is electrically connected to the tenth wiring 133b via a third conductor 161c and a bonding wire. The third light emitting element 162 emits blue light with a wavelength band of 440 nm to 495 nm in response to current being supplied between the anode and the cathode from an external driving circuit.

第１保護素子１４３、第２保護素子１５３及び第３保護素子１６３は、ツェナーダイオードである。第１保護素子１４３、第２保護素子１５３及び第３保護素子１６３は、上面にアノードを、下面にカソードをそれぞれ有する。第１保護素子１４３のアノードはボンディングワイヤを介して第２配線１３１ｂと電気的に接続され、第１保護素子１４３のカソードは第１配線１３１ａと電気的に接続される。第２保護素子１５３のアノードはボンディングワイヤを介して第６配線１３２ｂと電気的に接続され、第２保護素子１５３のカソードは第５配線１３２ａと電気的に接続される。第３保護素子１６３のアノードはボンディングワイヤを介して第１０配線１３３ｂと電気的に接続され、第３保護素子１６３のカソードは第９配線１３３ａと電気的に接続される。これにより、各保護素子は、各発光素子の保護回路を形成する。各保護素子は、バリスタでもよい。 The first protection element 143, the second protection element 153 and the third protection element 163 are Zener diodes. The first protection element 143, the second protection element 153, and the third protection element 163 each have an anode on the upper surface and a cathode on the lower surface. An anode of the first protection element 143 is electrically connected to the second wiring 131b through a bonding wire, and a cathode of the first protection element 143 is electrically connected to the first wiring 131a. An anode of the second protection element 153 is electrically connected to the sixth wiring 132b through a bonding wire, and a cathode of the second protection element 153 is electrically connected to the fifth wiring 132a. The anode of the third protection element 163 is electrically connected to the tenth wiring 133b through a bonding wire, and the cathode of the third protection element 163 is electrically connected to the ninth wiring 133a. Thereby, each protection element forms a protection circuit for each light emitting element. Each protective element may be a varistor.

第１受光素子１４４、第２受光素子１５４及び第３受光素子１６４は、フォトダイオードであり、上面にアノードを、下面にカソードをそれぞれ有する。第１受光素子１４４は、第１発光素子１４２と第１光学部材１４５との間に位置するように、第２基板１２の上面に配置される。第１受光素子１４４のアノードはボンディングワイヤを介して第３配線１３１ｃと電気的に接続され、第１受光素子１４４のカソードは第４配線１３１ｄと電気的に接続される。第１受光素子１４４は、第１発光素子１４２から出射された赤色光を受光して、赤色光の強度に応じた電流を出力する。第２受光素子１５４は、第２発光素子１５２と第２光学部材１５５との間に位置するように、第２基板１２の上面に配置される。第２受光素子１５４のアノードはボンディングワイヤを介して第７配線１３２ｃと電気的に接続され、第２受光素子１５４のカソードは第８配線１３２ｄと電気的に接続される。第２受光素子１５４は、第２発光素子１５２から出射された緑色光を受光して、緑色光の強度に応じた電流を出力する。第３受光素子１６４は、第３発光素子１６２と第３光学部材１６５との間に位置するように、第２基板１２の上面に配置される。第３受光素子１６４のアノードはボンディングワイヤを介して第１１配線１３３ｃと電気的に接続され、第３受光素子１６４のカソードは第１２配線１３３ｄと電気的に接続される。第３受光素子１６４は、第３発光素子１６２から出射された青色光を受光して、青色光の強度に応じた電流を出力する。 The first light-receiving element 144, the second light-receiving element 154, and the third light-receiving element 164 are photodiodes, each having an anode on the upper surface and a cathode on the lower surface. The first light receiving element 144 is arranged on the upper surface of the second substrate 12 so as to be positioned between the first light emitting element 142 and the first optical member 145 . The anode of the first light receiving element 144 is electrically connected to the third wiring 131c through a bonding wire, and the cathode of the first light receiving element 144 is electrically connected to the fourth wiring 131d. The first light receiving element 144 receives the red light emitted from the first light emitting element 142 and outputs a current corresponding to the intensity of the red light. The second light receiving element 154 is arranged on the upper surface of the second substrate 12 so as to be positioned between the second light emitting element 152 and the second optical member 155 . The anode of the second light receiving element 154 is electrically connected to the seventh wiring 132c via a bonding wire, and the cathode of the second light receiving element 154 is electrically connected to the eighth wiring 132d. The second light receiving element 154 receives the green light emitted from the second light emitting element 152 and outputs a current corresponding to the intensity of the green light. The third light receiving element 164 is arranged on the upper surface of the second substrate 12 so as to be positioned between the third light emitting element 162 and the third optical member 165 . The anode of the third light receiving element 164 is electrically connected to the eleventh wiring 133c through a bonding wire, and the cathode of the third light receiving element 164 is electrically connected to the twelfth wiring 133d. The third light receiving element 164 receives the blue light emitted from the third light emitting element 162 and outputs a current corresponding to the intensity of the blue light.

各受光素子から出力された電流は、配線パターン１３を介して外部の駆動回路に供給される。駆動回路は、第１発光素子１４２、第２発光素子１５２及び第３発光素子１６２が出射する光の強度が一定になるように、各受光素子から供給された電流の大きさに基づいて各発光素子に供給する電流の大きさを制御する。 A current output from each light-receiving element is supplied to an external drive circuit via the wiring pattern 13 . The driving circuit controls each light emission based on the magnitude of the current supplied from each light receiving element so that the intensity of the light emitted from the first light emitting element 142, the second light emitting element 152, and the third light emitting element 162 is constant. It controls the magnitude of the current supplied to the device.

第１光学部材１４５、第２光学部材１５５及び第３光学部材１６５は、第１発光素子１４２、第２発光素子１５２及び第３発光素子１６２からの光を集束させて透過させる平凸形のコリメータレンズである。各光学部材は、平凸形以外のコリメータレンズでもよく、複数のレンズから構成されていてもよい。 The first optical member 145, the second optical member 155, and the third optical member 165 are plano-convex collimators that focus and transmit the light from the first light emitting element 142, the second light emitting element 152, and the third light emitting element 162. is the lens. Each optical member may be a collimator lens other than a plano-convex collimator lens, and may be composed of a plurality of lenses.

第１支持部材１４６、第２支持部材１５６及び第３支持部材１６６は、絶縁性の樹脂等により形成され、第１光学部材１４５、第２光学部材１５５及び第３光学部材１６５をそれぞれ支持する。各光学部材は、各支持部材に第１方向に形成された円形の貫通孔の内部に収容されることにより、光軸が第１方向と平行となるように支持される。第１光学部材１４５は、その光軸の高さが第１発光素子１４２の下面の高さと一致し、かつ、その光軸が第１発光素子１４２の第２方向における中央部を通過するような位置に支持される。同様に、第２光学部材１５５は、その光軸の高さが第２発光素子１５２の下面の高さと一致し、かつ、その光軸が第２発光素子１５２の第２方向における中央部を通過するように支持される。第３光学部材１６５は、その光軸の高さが第３発光素子１６２の下面の高さと一致し、かつ、その光軸が第３発光素子１６２の第２方向における中央部を通過するように支持される。なお、各光学部材は透光性の樹脂により形成されてもよく、この場合は、各支持部材が各光学部材と一体になっていてもよい。 The first support member 146, the second support member 156, and the third support member 166 are made of insulating resin or the like, and support the first optical member 145, the second optical member 155, and the third optical member 165, respectively. Each optical member is accommodated in a circular through-hole formed in each support member in the first direction, and supported so that the optical axis is parallel to the first direction. The first optical member 145 has an optical axis whose height matches the height of the lower surface of the first light emitting element 142 and whose optical axis passes through the center of the first light emitting element 142 in the second direction. supported in position. Similarly, the second optical member 155 has an optical axis whose height matches the height of the lower surface of the second light emitting element 152 and whose optical axis passes through the center of the second light emitting element 152 in the second direction. supported to do so. The optical axis of the third optical member 165 is aligned with the height of the lower surface of the third light emitting element 162, and the optical axis passes through the center of the third light emitting element 162 in the second direction. Supported. Each optical member may be made of translucent resin, and in this case, each support member may be integrated with each optical member.

図１－図４に示す例では、各発光素子は、アノードが下面に位置するように配置されているため、発光層が下面の近傍に位置し、各発光素子から出射される光の多くは各発光素子の下面の近傍から出射される。したがって、各光学部材の光軸の高さが各発光素子の下面の高さと一致することにより、多くの光が結合素子１７に到達するようになり、光源装置１から出射される光の強度が大きくなる。また、このとき、各発光素子が各サブ基板の上面に配置されているため、各発光素子と各光学部材との間の高さの調整が容易になる。なお、各発光素子は、発光層が上面の近傍に位置し、上面の近傍から多くの光を出射するように配置されてもよい。この場合、各光学部材は、その光軸の高さが各発光素子の上面の高さと一致するように支持されてもよい。すなわち、各光学部材は、光軸の高さが各発光素子の発光層の高さと一致するように支持される。 In the examples shown in FIGS. 1 to 4, each light-emitting element is arranged so that the anode is located on the bottom surface, so the light-emitting layer is located near the bottom surface, and most of the light emitted from each light-emitting element is The light is emitted from the vicinity of the lower surface of each light emitting element. Therefore, by matching the height of the optical axis of each optical member with the height of the lower surface of each light emitting element, a large amount of light reaches the coupling element 17, and the intensity of the light emitted from the light source device 1 increases. growing. Further, at this time, since each light emitting element is arranged on the upper surface of each sub-substrate, it becomes easy to adjust the height between each light emitting element and each optical member. Each light-emitting element may be arranged such that the light-emitting layer is positioned near the upper surface and emits a large amount of light from the vicinity of the upper surface. In this case, each optical member may be supported so that the height of its optical axis matches the height of the upper surface of each light emitting element. That is, each optical member is supported so that the height of the optical axis matches the height of the light emitting layer of each light emitting element.

結合素子１７は、ダイクロイックプリズムであり、図３に示すように、第１発光素子１４２からの赤色光Ｌ１、第２発光素子１５２からの緑色光Ｌ２及び第３発光素子１６２からの青色光Ｌ３を結合して、白色光を出射する。結合素子１７は、入射する赤色光、緑色光及び青色光の進行方向と出射する白色光の進行方向とが平行になるように形成される。 The coupling element 17 is a dichroic prism, and as shown in FIG. Combine to emit white light. The coupling element 17 is formed so that the traveling directions of the incident red, green, and blue light are parallel to the traveling direction of the emitted white light.

温度センサ１８は、サーミスタである。温度センサ１８は、第２基板１２の上面に配置され、第１基板１１及び筐体１９により形成される収容空間の温度変化に応じて抵抗値を変化させる。温度センサ１８は、第１３配線１３４ａ及び第１４配線１３４ｂを介して外部の駆動回路に電気的に接続される。駆動回路は、第１発光素子１４２、第２発光素子１５２及び第３発光素子１６２が出射する光の強度が温度にかかわらず一定になるように、温度センサ１８の抵抗値の大きさに基づいて各発光素子に供給する電流の大きさを制御する。 Temperature sensor 18 is a thermistor. The temperature sensor 18 is arranged on the upper surface of the second substrate 12 and changes the resistance value according to the temperature change of the accommodation space formed by the first substrate 11 and the housing 19 . The temperature sensor 18 is electrically connected to an external drive circuit via the thirteenth wiring 134a and the fourteenth wiring 134b. The driving circuit controls the resistance value of the temperature sensor 18 so that the intensity of the light emitted by the first light emitting element 142, the second light emitting element 152, and the third light emitting element 162 is constant regardless of the temperature. It controls the magnitude of the current supplied to each light emitting element.

筐体１９は、窒化アルミ又は酸化アルミ等の、剛性及び放熱性の高いセラミック材料により形成され、第１基板１１の接着部材１１１と接合されて第２基板１２及び第２基板１２に配置された各部材をその内部の収容空間に収容する。筐体１９の、結合素子１７に対向する側面には開口部が設けられるとともに、開口部を被覆するように透光性の被覆部材１９１が配置される。これにより、結合素子１７から出射された白色光が被覆部材１９１を透過して光源装置１の外部に出射される。第１基板１１と第２基板１２との間に段差を設けることにより、筐体１９が配置しやすくなると共に、筐体１９が第２基板１２の上面に実装された部品に接触する可能性を低くすることができる。また、接着部材１１１が第２基板１２の表面に到達する可能性を低くすることができる。 The housing 19 is formed of a ceramic material with high rigidity and heat dissipation such as aluminum nitride or aluminum oxide, and is bonded to the adhesive member 111 of the first substrate 11 and arranged on the second substrate 12 and the second substrate 12. Each member is housed in its internal housing space. An opening is provided on the side surface of the housing 19 facing the coupling element 17, and a translucent covering member 191 is arranged so as to cover the opening. Thereby, the white light emitted from the coupling element 17 is transmitted through the covering member 191 and emitted to the outside of the light source device 1 . By providing a step between the first substrate 11 and the second substrate 12, the housing 19 can be easily arranged and the possibility of the housing 19 coming into contact with components mounted on the upper surface of the second substrate 12 can be reduced. can be lowered. Moreover, the possibility that the adhesive member 111 reaches the surface of the second substrate 12 can be reduced.

図２及び図３に示すように、第１光学系１４、第２光学系１５及び第３光学系１６は、この順に結合素子１７に近くなるように配置される。また、第１発光素子１４２、第２発光素子１５２及び第３発光素子１６２は、第１方向に対して傾斜した直線上に並ぶように、かつ、波長の長い光を発するものほど結合素子１７に近くなるように配置される。各発光素子が第１方向に対して傾斜した直線上に並ぶように配置されることにより、各発光素子と結合素子との間の距離が相互に異なるようになる。また、各発光素子から照射された光は結合素子１７に到達するまでに広がるが、一般に、その広がりの程度は波長が長い光ほど大きくなる。光源装置１において、各発光素子が波長の長い光を発するものほど結合素子１７に近くなるように配置されることにより、各発光素子からの光が結合素子に到達するまでの広がりの程度が均一化され、結合素子１７から一様な白色光が出射されるようになる。 As shown in FIGS. 2 and 3, the first optical system 14, the second optical system 15 and the third optical system 16 are arranged in this order so as to be close to the coupling element 17. FIG. Also, the first light emitting element 142, the second light emitting element 152, and the third light emitting element 162 are arranged on a straight line inclined with respect to the first direction, and the longer the wavelength of the light, the closer to the coupling element 17. placed close together. By arranging the light emitting elements on a straight line that is inclined with respect to the first direction, the distances between the light emitting elements and the coupling elements are different from each other. In addition, the light emitted from each light emitting element spreads until it reaches the coupling element 17. In general, the longer the wavelength of the light, the greater the extent of the spread. In the light source device 1, each light emitting element that emits light with a longer wavelength is arranged closer to the coupling element 17, so that the degree of spread of the light from each light emitting element until it reaches the coupling element is uniform. uniform white light is emitted from the coupling element 17 .

図５は、第１光学系１４、第２光学系１５及び第３光学系１６の、第１方向から見たときの位置関係を説明するための、光源装置１の正面図である。図５においては、筐体１９及び結合素子１７の図示は省略されている。また、図５においては、各構成が透過しているものとして、各構成の奥に見える構成が破線により図示されている。図５に示すように、第１支持部材１４６は、第１方向から見たときに第２支持部材１５６と位置Ｗ１において、第２光学部材１５５と位置Ｗ２において、それぞれ重なるように配置される。また、第２支持部材１５６は、第１方向から見たときに第３支持部材１６６と位置Ｗ３において、第３光学部材１６５と位置Ｗ４において、それぞれ重なるように配置される。すなわち、複数の支持部材は、第１方向から見たときに他の支持部材及び他の支持部材が支持する光学部材と重なるように配置される。これにより、支持部材を第２方向に沿って一列に並べる場合よりも、光源装置１の第２方向の幅を小さくすることができる。 FIG. 5 is a front view of the light source device 1 for explaining the positional relationship of the first optical system 14, the second optical system 15, and the third optical system 16 when viewed from the first direction. In FIG. 5, illustration of the housing 19 and the coupling element 17 is omitted. In addition, in FIG. 5, it is assumed that each configuration is transparent, and the configuration that can be seen behind each configuration is illustrated by a broken line. As shown in FIG. 5, the first support member 146 is arranged to overlap the second support member 156 at position W1 and the second optical member 155 at position W2 when viewed from the first direction. The second support member 156 is arranged to overlap the third support member 166 at position W3 and the third optical member 165 at position W4 when viewed from the first direction. That is, the plurality of support members are arranged so as to overlap other support members and the optical members supported by the other support members when viewed from the first direction. Thereby, the width of the light source device 1 in the second direction can be made smaller than when the supporting members are arranged in a line along the second direction.

レーザダイオードである第１発光素子１４２、第２発光素子１５２及び第３発光素子１６２から出射された光の照射範囲は、通常、図５の点線Ｅが示すように、水平方向よりも鉛直方向において広くなる。他方で、第１光学部材１４５、第２光学部材１５５及び第３光学部材１６５として用いられるレンズとしては、円形のものが一般に流通している。したがって、発光素子からの光の鉛直方向の照射範囲よりも直径が大きい光学部材を選択すると、各光学部材の水平方向における両端部からは光が出射されないこととなる。この場合、各支持部材が他の支持部材が支持する光学部材の水平方向における端部と重なるように配置されたとしても、支持部材が発光素子からの光を遮光することはなく、光源装置１の発光効率が低下することはない。すなわち、支持部材が他の支持部材及び他の支持部材が支持する光学部材と重なるように配置されることにより、光源装置１は、装置の発光効率を低下させることなく装置を細くすることを可能とする。 The irradiation range of the light emitted from the first light emitting element 142, the second light emitting element 152, and the third light emitting element 162, which are laser diodes, is normally larger in the vertical direction than in the horizontal direction, as indicated by the dotted line E in FIG. get wider. On the other hand, as the lenses used as the first optical member 145, the second optical member 155, and the third optical member 165, circular lenses are generally distributed. Therefore, if an optical member having a diameter larger than the vertical irradiation range of the light from the light emitting element is selected, light will not be emitted from both ends of each optical member in the horizontal direction. In this case, even if each support member is arranged so as to overlap the horizontal end of the optical member supported by another support member, the support member does not block the light from the light emitting element, and the light source device 1 luminous efficiency does not decrease. That is, by arranging the supporting member so as to overlap other supporting members and optical members supported by the other supporting members, the light source device 1 can be made thinner without lowering the luminous efficiency of the device. and

また、図５に示す例では、第１方向から見たときに、第１光学部材１４５と第２光学部材１５５と、及び、第２光学部材１５５と第３光学部材１６５とは、それぞれ接円となり重ならないように配置されている。 In the example shown in FIG. 5, when viewed from the first direction, the first optical member 145 and the second optical member 155, and the second optical member 155 and the third optical member 165 are tangent to each other. are arranged so that they do not overlap.

第１サブ基板１４１、第２サブ基板１５１及び第３サブ基板１６１の第２方向における幅は、それぞれ第１支持部材１４６、第２支持部材１５６及び第３支持部材１６６の第２方向における幅と等しい。また、第１サブ基板１４１、第２サブ基板１５１及び第３サブ基板１６１は、第１方向から見たときに、第１支持部材１４６、第２支持部材１５６及び第３支持部材１６６とそれぞれ重なるように配置される。したがって、第１方向から見たときに、第１サブ基板１４１は位置Ｗ１において第２サブ基板１５１と重なるように配置され、第２サブ基板１５１は位置Ｗ３において第３サブ基板１６１と重なるように配置される。すなわち、各サブ基板は、第１方向から見たときに、他のサブ基板と重なるように配置される。これにより、光源装置１は、サブ基板の第２方向における幅を確保し、サブ基板の放熱性を低下させることなく装置を細くすることを可能とする。なお、各サブ基板の第２方向における幅は、各支持部材の第２方向における幅よりも大きくてもよい。 The widths in the second direction of the first sub-board 141, the second sub-board 151 and the third sub-board 161 are the same as the widths in the second direction of the first support member 146, the second support member 156 and the third support member 166, respectively. equal. Also, the first sub-substrate 141, the second sub-substrate 151 and the third sub-substrate 161 respectively overlap the first supporting member 146, the second supporting member 156 and the third supporting member 166 when viewed from the first direction. are arranged as follows. Therefore, when viewed from the first direction, the first sub-board 141 is arranged to overlap the second sub-board 151 at the position W1, and the second sub-board 151 is arranged to overlap the third sub-board 161 at the position W3. placed. That is, each sub-board is arranged so as to overlap other sub-boards when viewed from the first direction. As a result, the light source device 1 secures the width of the sub-board in the second direction, and makes it possible to make the device thinner without lowering the heat radiation performance of the sub-board. The width of each sub-board in the second direction may be larger than the width of each supporting member in the second direction.

なお、各サブ基板の第１方向における幅を大きくすることによっても、サブ基板の放熱性を向上させることが可能である。しかしながら、各発光素子は、各サブ基板の光学部材側に配置されるから、各発光素子からの熱は各サブ基板の光学部材側に遍在する。したがって、各サブ基板の第１方向における幅を大きくするよりも、第２方向における幅を大きくする方が、各発光素子からの熱に対する放熱性がより大きく向上する。 It should be noted that the heat dissipation of the sub-boards can also be improved by increasing the width of each sub-board in the first direction. However, since each light emitting element is arranged on the optical member side of each sub substrate, the heat from each light emitting element is omnipresent on the optical member side of each sub substrate. Therefore, rather than increasing the width in the first direction of each sub-substrate, increasing the width in the second direction improves the heat radiation from each light-emitting element to a greater extent.

図５に示す例では、各支持部材は他の支持部材及び他の支持部材が支持する光学部材と重なるように配置されるものとしたが、このような例に限られない。例えば、各支持部材は、他の支持部材とは重なるが、他の支持部材が支持する光学部材とは重ならないように配置されてもよい。このようにしても、装置の発光効率を低下させることなく装置を細くすることが可能となる。また、複数の支持部材のすべてではなく、そのうちの少なくとも一つの支持部材が他の支持部材と重なるように配置されればよい。また、同様に、複数のサブ基板のすべてではなく、そのうちの少なくとも一つのサブ基板型のサブ基板と重なるように配置されればよい。 In the example shown in FIG. 5, each supporting member is arranged so as to overlap other supporting members and optical members supported by other supporting members, but the present invention is not limited to such an example. For example, each support member may be arranged so as to overlap with other support members but not with optical members supported by other support members. Even in this way, the device can be made thinner without lowering the luminous efficiency of the device. Moreover, not all of the plurality of support members, but at least one of them may be arranged so as to overlap other support members. Similarly, it may be arranged so as to overlap at least one sub-substrate type sub-substrate, not all of the plurality of sub-substrates.

図６（Ａ）は、第１支持部材１４６の斜視図であり、図６（Ｂ）は、光源装置１の第１支持部材１４６の近傍を拡大した一部拡大断面図である。図６（Ａ）に示すように、第１支持部材１４６の、第１発光素子１４２に対向する側面には、第１方向に延伸する貫通孔１４６ａが形成され、第１光学部材１４５は、貫通孔１４６ａの内部に収容されることにより支持される。また、第１支持部材１４６の下面には、第１発光素子１４２に対向する辺の中央部から結合素子１７に対向する辺の中央部まで、第１方向に延伸する溝部１４６ｂが形成される。溝部１４６ｂが貫通孔１４６ａと接続することにより、第１光学部材１４５は、第２基板１２と対向する。 6A is a perspective view of the first support member 146, and FIG. 6B is a partially enlarged cross-sectional view of the vicinity of the first support member 146 of the light source device 1. FIG. As shown in FIG. 6A, a through hole 146a extending in the first direction is formed in the side surface of the first support member 146 facing the first light emitting element 142, and the first optical member 145 is inserted through the through hole 146a. It is supported by being accommodated inside the hole 146a. A groove 146 b extending in the first direction from the center of the side facing the first light emitting element 142 to the center of the side facing the coupling element 17 is formed on the lower surface of the first support member 146 . The first optical member 145 faces the second substrate 12 by connecting the groove portion 146b to the through hole 146a.

図６（Ｂ）に示すように、溝部１４６ｂが貫通孔１４６ａと接続されることにより、第１受光素子１４４は、第１発光素子１４２の下方であって、第１光学部材１４５と直接に対向するように配置される。これにより、第１受光素子１４４は、第１発光素子１４２から出射されて第１光学部材１４５の第１発光素子１４２に対向する対向面で反射された光Ｍ１を受光して、第１発光素子１４２からの光の強度を反映した電流を出力することができる。また、溝部１４６ｂが貫通孔１４６ａと接続されることにより、第１受光素子１４４は、貫通孔１４６ａの壁面と直接に対向するように配置される。これにより、第１受光素子１４４は、第１発光素子１４２から出射されて貫通孔１４６ａの壁面で反射された光Ｍ２を受光して、第１発光素子１４２からの光の強度を反映した電流を出力することができる。 As shown in FIG. 6B, by connecting the groove portion 146b to the through hole 146a, the first light receiving element 144 is located below the first light emitting element 142 and directly faces the first optical member 145. are arranged to As a result, the first light receiving element 144 receives the light M1 emitted from the first light emitting element 142 and reflected by the surface of the first optical member 145 facing the first light emitting element 142, and receives the light M1. A current reflecting the intensity of the light from 142 can be output. Further, by connecting the groove portion 146b to the through hole 146a, the first light receiving element 144 is arranged so as to directly face the wall surface of the through hole 146a. Accordingly, the first light receiving element 144 receives the light M2 emitted from the first light emitting element 142 and reflected by the wall surface of the through hole 146a, and generates a current reflecting the intensity of the light from the first light emitting element 142. can be output.

また、図６（Ｂ）に示すように、第１受光素子１４４は、第２方向における両側面の一部が第１支持部材１４６によってそれぞれ被覆されるように配置される。すなわち、第１受光素子１４４は、一部が第１支持部材１４６の溝部１４６ｂに収容されるように配置される。これにより、第２発光素子１５２及び第３発光素子１６２から出射された光が第１支持部材１４６の側面によって遮光され、第１受光素子１４４によって受光されにくくなる。したがって、第１受光素子１４４は、第１発光素子１４２からの光の強度を正確に反映した電流を出力することができる。 Also, as shown in FIG. 6B, the first light receiving element 144 is arranged such that both side surfaces thereof in the second direction are partially covered by the first support members 146 . That is, the first light receiving element 144 is arranged so that a part thereof is accommodated in the groove portion 146 b of the first support member 146 . As a result, light emitted from the second light emitting element 152 and the third light emitting element 162 is blocked by the side surface of the first support member 146 and is less likely to be received by the first light receiving element 144 . Therefore, the first light receiving element 144 can output current that accurately reflects the intensity of the light from the first light emitting element 142 .

また、第１受光素子１４４の一部が溝部１４６ｂに収容されることにより、第１受光素子１４４と第３配線１３１ｃとを接続するボンディングワイヤの一端を、第１受光素子１４４の上面の、溝部１４６ｂに収容されない部分に接合することができる。すなわち、図３に示すように、平面視したときに、第１受光素子１４４とボンディングワイヤとの接合部が第１支持部材１４６と重ならないようにすることができる。これにより、光源装置１の製造過程において、ボンディングワイヤを第１光学部材１４５又は第１支持部材１４６に接触させることなく各構成要素を第２基板１２の上面に配置することが容易となり、光源装置１の製造効率が向上する。 Further, since a part of the first light receiving element 144 is accommodated in the groove portion 146b, one end of the bonding wire connecting the first light receiving element 144 and the third wiring 131c is connected to the groove portion of the upper surface of the first light receiving element 144. It can be joined to portions not accommodated in 146b. That is, as shown in FIG. 3, when viewed from the top, the bonding portion between the first light receiving element 144 and the bonding wire can be prevented from overlapping the first support member 146 . As a result, in the manufacturing process of the light source device 1, each component can be easily arranged on the upper surface of the second substrate 12 without contacting the bonding wires with the first optical member 145 or the first support member 146, and the light source device can be manufactured. 1 production efficiency is improved.

また、各支持部材は各光学部材を支持するために不可欠な構成であるため、各支持部材に溝部を形成することにより、追加の構成を要することなく、安価な構成により各受光素子が発光素子からの光を正確に検出できるようになる。 In addition, since each support member is an essential component for supporting each optical member, by forming a groove in each support member, each light receiving element can be replaced by a light emitting element with an inexpensive configuration without requiring an additional configuration. can accurately detect light from

図６では、第１光学系１４について説明したが、第２光学系１５及び第３光学系１６についても同様である。すなわち、第２支持部材１５６及び第３支持部材１６６の側面にはそれぞれ貫通孔が形成される。第２支持部材１５６及び第３支持部材１６６の下面にはそれぞれ溝部が形成される。第２受光素子１５４及び第３受光素子１６４は、それぞれ一部のみが溝部に収容されるように配置される。これにより、各支持部材は、各支持部材に対向する発光素子とは異なる発光素子から、各支持部材に収容される受光素子に向かう光を遮光する。また、第２受光素子１５４及び第３受光素子１６４は、第２光学部材１５５及び第３光学部材１６５と直接に対向する位置に配置される。第２受光素子１５４及び第３受光素子１６４と第７配線１３２ｃ及び第１１配線１３３ｃとをそれぞれ接続するボンディングワイヤの一端は、各受光素子の上面の、溝部の外側に位置する部分に接合される。 Although the first optical system 14 has been described in FIG. 6, the second optical system 15 and the third optical system 16 are the same. That is, through holes are formed in the side surfaces of the second support member 156 and the third support member 166, respectively. Grooves are formed in the lower surfaces of the second support member 156 and the third support member 166, respectively. The second light-receiving element 154 and the third light-receiving element 164 are arranged so that only a part thereof is accommodated in the groove. Thereby, each supporting member blocks light directed toward the light receiving element housed in each supporting member from a light emitting element different from the light emitting element facing each supporting member. Also, the second light receiving element 154 and the third light receiving element 164 are arranged at positions directly facing the second optical member 155 and the third optical member 165 . One ends of bonding wires connecting the second light receiving element 154 and the third light receiving element 164 to the seventh wiring 132c and the eleventh wiring 133c, respectively, are bonded to the upper surface of each light receiving element located outside the groove. .

なお、各発光素子からは、結合素子１７に向かう方向（正方向）とは反対側の方向（逆方向）にも光が出射される。各受光素子が各支持部材の溝部に収容されることにより、逆方向に出射された光も各支持部材の側面によって遮光されるため、各受光素子は、各発光素子からの光の強度を正確に反映した電流を出力することができる。例えば、第１発光素子１４２から逆方向に出射された赤色光は、第２支持部材１５６の側面によって遮光されるため、第２受光素子１５４に受光されにくくなる。また、第２発光素子１５２から逆方向に出射された緑色光は、第３支持部材１６６の側面によって遮光されるため、第３受光素子１６４に受光されにくくなる。 In addition, light is emitted from each light emitting element also in a direction opposite to the direction toward the coupling element 17 (forward direction) (reverse direction). Since each light-receiving element is accommodated in the groove of each supporting member, even the light emitted in the opposite direction is blocked by the side surface of each supporting member. can output the current reflected in For example, the red light emitted in the opposite direction from the first light emitting element 142 is blocked by the side surface of the second support member 156 , so that it is less likely to be received by the second light receiving element 154 . In addition, the green light emitted in the opposite direction from the second light emitting element 152 is blocked by the side surface of the third support member 166 , so that it is less likely to be received by the third light receiving element 164 .

一般に、受光素子であるフォトダイオードは、波長の短い光に対する受光感度よりも波長の長い光に対する受光感度の方が優れている。そして、光源装置１において、各発光素子は波長の長いものほど結合素子１７に近くなるように配置されている。すなわち、各受光素子において、各発光素子から正方向に出射された光に対する受光感度よりも逆方向に出射された光に対する受光感度の方が優れていることとなる。したがって、逆方向に出射された光は、各受光素子が対向する発光素子から正方向に出射された光の強度を正確に検出するための大きな妨げとなる。光源装置１において、各受光素子が支持部材の溝部に収容されることにより、このような逆方向に出射された光が支持部材によって遮光されるため、各受光素子は、各発光素子からの光の強度を正確に反映した電流を出力することができる。 In general, a photodiode, which is a light-receiving element, is more sensitive to long-wavelength light than to short-wavelength light. In the light source device 1 , the light emitting elements having longer wavelengths are arranged closer to the coupling element 17 . That is, in each light receiving element, the light receiving sensitivity to the light emitted in the reverse direction is superior to the light receiving sensitivity to the light emitted in the forward direction from each light emitting element. Therefore, the light emitted in the opposite direction greatly hinders each light-receiving element from accurately detecting the intensity of the light emitted in the forward direction from the facing light-emitting element. In the light source device 1, each light-receiving element is accommodated in the groove of the supporting member, and thus such light emitted in the opposite direction is blocked by the supporting member. can output a current that accurately reflects the intensity of

以上説明したように、光源装置１において、複数の支持部材のうちの少なくとも一つは、第１方向から見たときに他の支持部材と重なるように第２基板１２に配置される。これにより、光源装置１は、複数の発光素子を有しながら装置を小型化することを可能とする。 As described above, in the light source device 1 , at least one of the plurality of support members is arranged on the second substrate 12 so as to overlap other support members when viewed from the first direction. Accordingly, the light source device 1 can be miniaturized while having a plurality of light emitting elements.

また、光源装置１において、複数の支持部材のうちの少なくとも一つは、第１方向から見たときに他の支持部材が支持する光学部材と重なるように第２基板１２に配置されてもよい。これにより、光源装置１は、複数の発光素子を有しながら装置をより小型化することを可能とする。 Further, in the light source device 1, at least one of the plurality of supporting members may be arranged on the second substrate 12 so as to overlap the optical members supported by the other supporting members when viewed from the first direction. . As a result, the light source device 1 can be made more compact while having a plurality of light emitting elements.

また、光源装置１において、複数の発光素子は、第１方向に対して傾斜した直線上に並ぶように、かつ、相互に異なる波長の光を発し、波長の長い光を発するものから順に結合素子１７に近くなるように配置されてもよい。これにより、各発光素子からの光が結合素子に到達するまでに生じる散乱の程度が均一化され、結合素子１７から一様な白色光が出射されるようになる。また、結合素子１７を小型化することを可能とする。 Further, in the light source device 1, the plurality of light emitting elements are arranged in a straight line inclined with respect to the first direction and emit light of mutually different wavelengths. 17 may be arranged. As a result, the degree of scattering that occurs before the light from each light emitting element reaches the coupling element is made uniform, and uniform white light is emitted from the coupling element 17 . In addition, the size of the coupling element 17 can be reduced.

また、光源装置１において、複数の支持部材の下面には第１方向に延伸する溝部が形成され、複数の受光素子は、少なくとも一部が溝部に収容されるように配置される。溝部は、光学部材を支持する支持部材に設けられる。これにより、各受光素子は、安価な構成により発光素子からの光の強度を正確に検出することができる。 Further, in the light source device 1, grooves extending in the first direction are formed in the lower surfaces of the plurality of support members, and the plurality of light receiving elements are arranged so that at least a portion thereof is accommodated in the grooves. The groove is provided in a supporting member that supports the optical member. Thereby, each light-receiving element can accurately detect the intensity of light from the light-emitting element with an inexpensive configuration.

また、光源装置１において、複数の受光素子は、各受光素子を収容する支持部材が支持する光学部材と直接に対向するように配置される。これにより、各受光素子は、対向する発光素子からの光をより多く受光するため、対向する発光素子からの光の強度をより正確に反映した電流を出力することができる。 Further, in the light source device 1, the plurality of light receiving elements are arranged so as to directly face the optical member supported by the supporting member that accommodates each light receiving element. As a result, each light receiving element receives more light from the facing light emitting element, so that it is possible to output a current that more accurately reflects the intensity of the light from the facing light emitting element.

また、光源装置１において、複数の受光素子は、各支持部材の貫通孔の壁面と対向するように配置される。これにより、各受光素子は、対向する発光素子から出射されて貫通孔の壁面で反射された光を受光するため、対向する発光素子からの光の強度をより正確に反映した電流を出力することができる。 Moreover, in the light source device 1, the plurality of light receiving elements are arranged so as to face the wall surfaces of the through holes of the respective support members. As a result, each light-receiving element receives the light emitted from the facing light-emitting element and reflected by the wall surface of the through hole, so that it is possible to output a current that more accurately reflects the intensity of the light from the facing light-emitting element. can be done.

また、光源装置１において、各受光素子の上面と配線パターンとを接続するボンディングワイヤの一端は、各受光素子の上面の、溝部に収容されない部分に接合される。これにより、ボンディングワイヤを各光学部材又は各支持部材に接触させることなく各構成要素を第２基板１２の上面に配置することが容易となり、光源装置１の製造効率が向上する。 In the light source device 1, one end of the bonding wire connecting the upper surface of each light receiving element and the wiring pattern is bonded to a portion of the upper surface of each light receiving element that is not accommodated in the groove. This makes it easy to dispose each component on the upper surface of the second substrate 12 without bringing bonding wires into contact with each optical member or each support member, thereby improving the manufacturing efficiency of the light source device 1 .

上述した説明では、第１支持部材１４６の下面に溝部１４６ｂが形成されるものとしたが、第１方向に延伸する一対の側面のうち第２支持部材１５６側の側面にも、下面と同様に、第１方向に延伸し且つ貫通孔と接続される溝部が形成されてもよい。すなわち、第１支持部材１４６は、第１光学部材１４５の下部と側部とが開放された状態で第１光学部材１４５を支持してもよい。この場合、溝部は、第１方向から見たときに第１支持部材１４６が第２光学部材１５５と重ならないように、第２光学部材１５５と略同一の高さに形成される。これにより、第１支持部材１４６が第２発光素子１５２から出射されて第２光学部材１５５を透過した光を遮光する可能性が低くなる。 In the above description, the groove portion 146b is formed on the lower surface of the first support member 146, but the side surface on the side of the second support member 156 among the pair of side surfaces extending in the first direction is also formed in the same manner as the lower surface. , a groove extending in the first direction and connected to the through hole may be formed. That is, the first support member 146 may support the first optical member 145 with the lower portion and side portions of the first optical member 145 opened. In this case, the groove is formed at substantially the same height as the second optical member 155 so that the first support member 146 does not overlap the second optical member 155 when viewed from the first direction. This reduces the possibility that the first support member 146 blocks the light emitted from the second light emitting element 152 and transmitted through the second optical member 155 .

同様に、第２支持部材１５６の、第１方向に延伸する一対の側面のうち第３支持部材１６６側の側面には、第１方向に延伸する溝部が形成されてもよい。この場合、溝部は、第１方向から見たときに第２支持部材１５６が第３光学部材１６５と重ならないように、第３光学部材１６５と略同一の高さに形成される。これにより、第２支持部材１５６が第３発光素子１６２から出射されて第３光学部材１６５を透過した光を遮光する可能性が低くなる。 Similarly, a groove portion extending in the first direction may be formed on the side surface of the second support member 156 on the side of the third support member 166 among the pair of side surfaces extending in the first direction. In this case, the groove is formed at substantially the same height as the third optical member 165 so that the second support member 156 does not overlap the third optical member 165 when viewed from the first direction. This reduces the possibility that the second support member 156 blocks the light emitted from the third light emitting element 162 and transmitted through the third optical member 165 .

このように、支持部材の第１方向に延伸する側面には、第１方向に延伸し且つ貫通孔と接続される溝部が設けられてもよい。これにより、支持部材が他の発光素子からの光を遮光する可能性が低くなり、光源装置１の発光効率の低下が抑えられる。 Thus, the side surface of the support member extending in the first direction may be provided with a groove extending in the first direction and connected to the through hole. As a result, the support member is less likely to block light from other light emitting elements, and a decrease in luminous efficiency of the light source device 1 can be suppressed.

図７は、他の実施形態に係る光源装置２の平面図である。光源装置２は、第１光学系１４、第２光学系１５及び第３光学系１６に代えて第１光学系２４、第２光学系２５及び第３光学系２６を有する点で光源装置１と相違する。第１光学系２４、第２光学系２５及び第３光学系２６以外の光源装置２の構成要素は、対応する光源装置１の構成要素と同様であるため、説明を省略する。 FIG. 7 is a plan view of a light source device 2 according to another embodiment. The light source device 2 differs from the light source device 1 in that it has a first optical system 24, a second optical system 25 and a third optical system 26 instead of the first optical system 14, the second optical system 15 and the third optical system 16. differ. The components of the light source device 2 other than the first optical system 24, the second optical system 25, and the third optical system 26 are the same as the corresponding components of the light source device 1, so description thereof will be omitted.

第１光学系２４、第２光学系２５及び第３光学系２６は、第２基板１２における配置においてのみ、第１光学系１４、第２光学系１５及び第３光学系１６と相違する。第１光学系２４、第２光学系２５及び第３光学系２６の構成要素は、対応する第１光学系１４、第２光学系１５及び第３光学系１６の構成要素と同様であるため、同一の符号を付して説明を省略する。 The first optical system 24 , the second optical system 25 and the third optical system 26 differ from the first optical system 14 , the second optical system 15 and the third optical system 16 only in their arrangement on the second substrate 12 . Since the components of the first optical system 24, the second optical system 25 and the third optical system 26 are the same as the corresponding components of the first optical system 14, the second optical system 15 and the third optical system 16, The same reference numerals are given and the description is omitted.

図７に示すように、第１光学系２４及び第２光学系２５は、結合素子１７からの距離が同一となるように、かつ、第２方向に相互に離間して配置される。第３光学系２６は、結合素子１７からの距離が第１光学系２４及び第２光学系２５よりも大きくなるように、かつ、第２方向において第１光学系２４と第２光学系２５との間に位置するように配置される。 As shown in FIG. 7, the first optical system 24 and the second optical system 25 are arranged at the same distance from the coupling element 17 and spaced apart from each other in the second direction. The third optical system 26 is arranged such that the distance from the coupling element 17 is greater than that of the first optical system 24 and the second optical system 25, and that the first optical system 24 and the second optical system 25 are separated from each other in the second direction. is positioned between

すなわち、光源装置２において、複数の支持部材のうちの少なくとも一つは、結合素子１７からの距離が他の支持部材と同一となるように配置される。これにより、光源装置２は、第１方向のみならず第２方向においても装置を小型化することが可能となる。なお、複数の支持部材と結合素子１７との距離は、厳密に同一である必要はなく、第２方向から見たときに複数の支持部材が重なるように配置されていればよい。 That is, in the light source device 2, at least one of the plurality of support members is arranged so that the distance from the coupling element 17 is the same as that of the other support members. Thereby, the light source device 2 can be miniaturized not only in the first direction but also in the second direction. Note that the distances between the plurality of support members and the coupling element 17 do not have to be exactly the same, and it is sufficient that the plurality of support members are arranged so as to overlap each other when viewed from the second direction.

第１光学系２４の第１支持部材１４６は、第１方向から見たときに、第３光学系２６の第３支持部材１６６及び第３光学部材１６５と重なるように配置される。また、第２光学系２５の第２支持部材１５６は、第１方向から見たときに、第３光学系２６の第３支持部材１６６及び第３光学部材１６５と重なるように配置される。すなわち、光源装置２においても、複数の支持部材は、第１方向から見たときに他の支持部材と重なるように配置される。 The first support member 146 of the first optical system 24 is arranged so as to overlap the third support member 166 and the third optical member 165 of the third optical system 26 when viewed from the first direction. Also, the second supporting member 156 of the second optical system 25 is arranged so as to overlap the third supporting member 166 and the third optical member 165 of the third optical system 26 when viewed from the first direction. That is, in the light source device 2 as well, the plurality of support members are arranged so as to overlap other support members when viewed from the first direction.

このように、光源装置２において、複数の支持部材のうちの少なくとも一つは、第１方向から見たときに他の支持部材と重なるように第２基板１２に配置される。また、複数の支持部材のうちの少なくとも一つは、第２方向から見たときに他の支持部材と重なるように配置される。これにより、光源装置２は、複数の発光素子を有しながら装置を第１方向及び第２方向の何れにおいても小型化することを可能とする。 Thus, in the light source device 2 , at least one of the plurality of support members is arranged on the second substrate 12 so as to overlap other support members when viewed from the first direction. Also, at least one of the plurality of support members is arranged so as to overlap other support members when viewed from the second direction. Thereby, the light source device 2 can be miniaturized in both the first direction and the second direction while having a plurality of light emitting elements.

図８は、他の実施形態に係る光源装置３が有する第１支持部材１４６の近傍を拡大した一部拡大断面図である。光源装置３は、第１光学部材１４５、第２光学部材１５５及び第３光学部材１６５に代えて第１光学部材３４５、第２光学部材３５５及び第３光学部材３６５を有する点で光源装置１と相違する。第１光学部材３４５、第２光学部材３５５及び第３光学部材３６５以外の光源装置３の構成要素は、対応する光源装置１の構成要素と同様であるため、同一の符号を付して説明を省略する。また、第２光学部材３５５及び第３光学部材３６５の構成は、第１光学部材３４５と同様であるため、以下では、第１光学部材３４５についてのみ説明する。 FIG. 8 is a partially enlarged sectional view enlarging the vicinity of the first support member 146 of the light source device 3 according to another embodiment. The light source device 3 is different from the light source device 1 in that it has a first optical member 345 , a second optical member 355 and a third optical member 365 instead of the first optical member 145 , the second optical member 155 and the third optical member 165 . differ. The components of the light source device 3 other than the first optical member 345, the second optical member 355, and the third optical member 365 are the same as the corresponding components of the light source device 1, so the same reference numerals are assigned to them. omitted. Also, since the configurations of the second optical member 355 and the third optical member 365 are the same as those of the first optical member 345, only the first optical member 345 will be described below.

図８に示すように、第１光学部材３４５の第１発光素子１４２に対向する対向面３４５ａは、下方に傾斜した平面に形成される。これにより、対向面３４５ａは、第１発光素子１４２からの光を第１受光素子１４４に向けて反射させる。したがって、第１受光素子１４４は、対向面３４５ａが鉛直面である場合よりも第１発光素子１４２からの光をより多く受光するため、第１発光素子１４２からの光の強度をより正確に反映した電流を出力することができる。なお、対向面３４５ａは、下方に傾斜した曲面（例えば、凸面）でもよい。 As shown in FIG. 8, the facing surface 345a of the first optical member 345, which faces the first light emitting element 142, is formed as a plane inclined downward. Thereby, the facing surface 345 a reflects the light from the first light emitting element 142 toward the first light receiving element 144 . Therefore, since the first light receiving element 144 receives more light from the first light emitting element 142 than when the facing surface 345a is a vertical surface, the intensity of the light from the first light emitting element 142 is reflected more accurately. current can be output. Note that the facing surface 345a may be a downwardly inclined curved surface (for example, a convex surface).

このように、光源装置３において、複数の受光素子は、各受光素子を収容する支持部材が支持する光学部材と直接に対向するように配置される。また、各光学部材の発光素子に対向する面は、発光素子からの光を受光素子に向けて反射させるように、下方に傾斜して形成される。これにより、各受光素子は、各発光素子からの光の強度をより正確に反映した電流を出力することができる。 Thus, in the light source device 3, the plurality of light receiving elements are arranged so as to directly face the optical member supported by the supporting member that accommodates each light receiving element. Further, the surface of each optical member facing the light emitting element is inclined downward so as to reflect the light from the light emitting element toward the light receiving element. As a result, each light receiving element can output a current that more accurately reflects the intensity of light from each light emitting element.

図９は、他の実施形態に係る光源装置４が有する第１支持部材１４６の近傍を拡大した一部拡大断面図である。光源装置４は、第１受光素子１４４、第２受光素子１５４及び第３受光素子１６４に代えて第１受光素子４４４、第２受光素子４５４及び第３受光素子４６４を有する点で相違する。第１受光素子４４４、第２受光素子４５４及び第３受光素子４６４以外の光源装置４の構成要素は、対応する光源装置１の構成要素と同様であるため、同一の符号を付して説明を省略する。また、第２受光素子４５４及び第３受光素子４６４の構成は、第１受光素子４４４と同様であるため、以下では、第１受光素子４４４についてのみ説明する。 FIG. 9 is a partially enlarged sectional view enlarging the vicinity of the first support member 146 of the light source device 4 according to another embodiment. The light source device 4 is different in that it has a first light receiving element 444 , a second light receiving element 454 and a third light receiving element 464 instead of the first light receiving element 144 , the second light receiving element 154 and the third light receiving element 164 . Components of the light source device 4 other than the first light receiving element 444, the second light receiving element 454, and the third light receiving element 464 are the same as the corresponding components of the light source device 1, so the same reference numerals will be used for description. omitted. Also, since the configurations of the second light receiving element 454 and the third light receiving element 464 are the same as those of the first light receiving element 444, only the first light receiving element 444 will be described below.

図９に示すように、第１受光素子４４４は、全部が第１支持部材１４６の溝部１４６ｂに収容されるように配置される点で第１受光素子１４４と相違する。すなわち、第１受光素子４４４は、第１受光素子４４４の第２方向における両側面の全部が第１支持部材１４６によってそれぞれ被覆されるように配置される。これにより、第１受光素子４４４は、第１発光素子１４２から下方に出射された光Ｍ３を受光する。また、第１受光素子４４４は、第１発光素子１４２から出射されて第１支持部材１４６の貫通孔１４６ａの壁面で反射された光Ｍ４をより受光しやすくなる。これにより、第１受光素子４４４は、第１発光素子１４２からの光をより多く受光するため、第１発光素子１４２からの光の強度をより正確に反映した電流を出力することができる。 As shown in FIG. 9, the first light receiving element 444 is different from the first light receiving element 144 in that the entirety of the first light receiving element 444 is arranged to be accommodated in the groove portion 146b of the first support member 146. As shown in FIG. That is, the first light receiving element 444 is arranged such that both side surfaces of the first light receiving element 444 in the second direction are entirely covered with the first supporting member 146 . Thereby, the first light receiving element 444 receives the light M3 emitted downward from the first light emitting element 142 . Further, the first light receiving element 444 can more easily receive the light M4 emitted from the first light emitting element 142 and reflected by the wall surface of the through hole 146a of the first supporting member 146. FIG. Accordingly, since the first light receiving element 444 receives more light from the first light emitting element 142 , it is possible to output a current that more accurately reflects the intensity of the light from the first light emitting element 142 .

また、図９に示すように、第１受光素子４４４は、第１光学部材１４５の下方に位置するように配置される。これにより、第１受光素子４４４は、第１発光素子１４２から出射されて第１光学部材１４５に入射した光のうち、下方に漏れた光Ｍ５を受光しやすくなる。これにより、第１受光素子４４４は、第１発光素子１４２からの光をより多く受光するため、第１発光素子１４２からの光の強度をより正確に反映した電流を出力することができる。 Moreover, as shown in FIG. 9, the first light receiving element 444 is arranged so as to be positioned below the first optical member 145 . This makes it easier for the first light receiving element 444 to receive light M<b>5 that has leaked downward out of the light emitted from the first light emitting element 142 and incident on the first optical member 145 . Accordingly, since the first light receiving element 444 receives more light from the first light emitting element 142 , it is possible to output a current that more accurately reflects the intensity of the light from the first light emitting element 142 .

このように、光源装置４において、複数の受光素子は、全部が各支持部材の溝部に収容されるように配置される。これにより、各受光素子は、対向する発光素子からの光をより多く受光し、各発光素子からの光の強度をより正確に反映した電流を出力することができる。また、複数の受光素子は、各光学素子の下方に位置するように配置される。これにより、各受光素子は、対向する発光素子からの光をより多く受光し、各発光素子からの光の強度をより正確に反映した電流を出力することができる。 Thus, in the light source device 4, the plurality of light receiving elements are arranged so that they are all accommodated in the grooves of the respective support members. Thereby, each light-receiving element can receive more light from the facing light-emitting element and output a current that more accurately reflects the intensity of the light from each light-emitting element. Also, the plurality of light receiving elements are arranged so as to be positioned below each optical element. Thereby, each light-receiving element can receive more light from the facing light-emitting element and output a current that more accurately reflects the intensity of the light from each light-emitting element.

光源装置１及び光源装置４を用いて説明したように、複数の受光素子は、一部又は全部が溝部に収容されるように配置される。すなわち、複数の受光素子は、少なくとも一部が溝部に収容されるように配置される。これにより、各受光素子は、対向する発光素子から下方に出射された光及び対向する発光素子から出射されて支持部材の内側で反射された光をより多く受光し、各発光素子からの光の強度をより正確に反映した電流を出力することができる。 As described using the light source device 1 and the light source device 4, the plurality of light receiving elements are arranged so that part or all of them are accommodated in the grooves. That is, the plurality of light-receiving elements are arranged so that at least some of them are accommodated in the grooves. As a result, each light receiving element receives more of the light emitted downward from the facing light emitting element and the light emitted from the facing light emitting element and reflected inside the supporting member in a larger amount. A current that more accurately reflects the intensity can be output.

図１０は、他の実施形態に係る光源装置５が有する第１支持部材５４６の近傍を拡大した一部拡大断面図である。光源装置５は、第１支持部材１４６、第２支持部材１５６及び第３支持部材１６６に代えて第１支持部材５４６、第２支持部材５５６及び第３支持部材５６６を有する点で光源装置１と相違する。第１支持部材５４６、第２支持部材５５６及び第３支持部材５６６以外の光源装置５の構成要素は、対応する光源装置１の構成要素と同様であるため、同一の符号を付して説明を省略する。また、第２支持部材５５６及び第３支持部材５６６の構成は、第１支持部材５４６と同様であるため、以下では、第１支持部材５４６についてのみ説明する。 FIG. 10 is a partially enlarged sectional view enlarging the vicinity of the first support member 546 of the light source device 5 according to another embodiment. The light source device 5 differs from the light source device 1 in that it has a first support member 546 , a second support member 556 and a third support member 566 instead of the first support member 146 , the second support member 156 and the third support member 166 . differ. Components of the light source device 5 other than the first support member 546, the second support member 556, and the third support member 566 are the same as the corresponding components of the light source device 1, so the same reference numerals are used for description. omitted. Also, since the configurations of the second support member 556 and the third support member 566 are the same as those of the first support member 546, only the first support member 546 will be described below.

第１支持部材１４６と同様に、第１支持部材５４６の下面には、第１発光素子１４２に対向する辺の中央部から第１方向に延伸する溝部５４６ｂが形成される。第１支持部材５４６は、溝部５４６ｂが結合素子１７に対向する辺まで到達していない点で第１支持部材１４６と相違する。すなわち、第１支持部材５４６の下部には、第１受光素子１４４と結合素子１７との間に脚部５４６ｃが形成される。 Similarly to the first support member 146, the bottom surface of the first support member 546 is formed with a groove portion 546b extending in the first direction from the central portion of the side facing the first light emitting element 142. As shown in FIG. The first support member 546 differs from the first support member 146 in that the groove portion 546b does not reach the side facing the coupling element 17 . That is, a leg portion 546 c is formed between the first light receiving element 144 and the coupling element 17 under the first support member 546 .

このように、光源装置５において、複数の支持部材の下面には、各発光素子に対向する辺から第１方向に延伸し、結合素子に対向する辺まで到達しない溝部が形成される。これにより、他の発光素子から逆方向に出射された光が脚部で遮光されて受光素子に到達しにくくなるため、各受光素子は、対向する発光素子からの光をより多く受光し、各発光素子からの光の強度をより正確に反映した電流を出力することができる。 As described above, in the light source device 5 , grooves extending in the first direction from the sides facing the light emitting elements and not reaching the sides facing the coupling elements are formed on the lower surfaces of the plurality of support members. As a result, light emitted in the opposite direction from other light-emitting elements is blocked by the legs and is less likely to reach the light-receiving element. A current that more accurately reflects the intensity of light emitted from the light emitting element can be output.

当業者は、本発明の精神および範囲から外れることなく、様々な変更、置換及び修正をこれに加えることが可能であることを理解されたい。例えば、上述した実施形態及び変形例は、本発明の範囲において、適宜に組み合わせて実施されてもよい。 It should be understood by those skilled in the art that various changes, substitutions and modifications can be made thereto without departing from the spirit and scope of the present invention. For example, the above-described embodiments and modifications may be combined as appropriate within the scope of the present invention.

１ 光源装置
１１ 第１基板
１２ 第２基板
１３ 配線パターン
１４１ 第１サブ基板
１４２ 第１発光素子
１４４ 第１受光素子
１４５ 第１光学部材
１４６ 第１支持部材
１５１ 第２サブ基板
１５２ 第２発光素子
１５４ 第２受光素子
１５５ 第２光学部材
１５６ 第２支持部材
１６１ 第３サブ基板
１６２ 第３発光素子
１６４ 第３受光素子
１６５ 第３光学部材
１６６ 第３支持部材
１７ 結合素子 Reference Signs List 1 light source device 11 first substrate 12 second substrate 13 wiring pattern 141 first sub substrate 142 first light emitting element 144 first light receiving element 145 first optical member 146 first support member 151 second sub substrate 152 second light emitting element 154 Second light receiving element 155 Second optical member 156 Second supporting member 161 Third sub-substrate 162 Third light emitting element 164 Third light receiving element 165 Third optical member 166 Third supporting member 17 Coupling element

Claims (7)

所定方向に延伸する平板状の基板と、
前記基板に配置され、前記所定方向に光を出射する複数の発光素子と、
前記複数の発光素子からの光をそれぞれ透過させる複数の光学部材と、
前記複数の光学部材をそれぞれ支持する複数の支持部材と、
前記基板に配置され、前記複数の発光素子からの光を受光して、前記受光した光の強度に応じた電流を出力する複数の受光素子と、を有し、
前記複数の支持部材の下面には、前記所定方向に延伸する溝部が形成され、
前記複数の受光素子は、少なくとも一部が各支持部材の溝部に収容されるように配置される、
ことを特徴とする光源装置。 a flat substrate extending in a predetermined direction;
a plurality of light emitting elements arranged on the substrate and emitting light in the predetermined direction;
a plurality of optical members that respectively transmit light from the plurality of light emitting elements;
a plurality of support members respectively supporting the plurality of optical members;
a plurality of light receiving elements arranged on the substrate for receiving light from the plurality of light emitting elements and outputting a current corresponding to the intensity of the received light;
Grooves extending in the predetermined direction are formed on the lower surfaces of the plurality of support members,
The plurality of light receiving elements are arranged such that at least a portion thereof is accommodated in the groove of each support member;
A light source device characterized by: 前記複数の受光素子は、各受光素子を収容する支持部材が支持する光学部材に対向するように配置される、
請求項１に記載の光源装置。 The plurality of light receiving elements are arranged so as to face an optical member supported by a support member that accommodates each light receiving element.
The light source device according to claim 1. 前記複数の光学部材の前記発光素子に対向する面は、当該発光素子からの光を前記受光素子に向けて反射させるように、下方に傾斜して形成される、
請求項２に記載の光源装置。 a surface of each of the plurality of optical members facing the light-emitting element is inclined downward so as to reflect light from the light-emitting element toward the light-receiving element;
The light source device according to claim 2. 前記複数の光学部材は、各支持部材に前記所定方向に形成された貫通孔の内部に収容されることにより支持され、
前記複数の受光素子は、前記貫通孔の壁面と対向するように配置される、
請求項１－３の何れか一項に記載の光源装置。 The plurality of optical members are supported by being housed inside through holes formed in each support member in the predetermined direction,
The plurality of light receiving elements are arranged so as to face the wall surface of the through hole,
The light source device according to any one of claims 1-3. 前記複数の支持部材のそれぞれは、前記複数の発光素子のうち、当該支持部材に対向する発光素子とは異なる発光素子のうちの少なくとも一つの発光素子から当該支持部材に収容される受光素子に向かう光を遮光する、
請求項１－４の何れか一項に記載の光源装置。 Each of the plurality of supporting members directs from at least one light emitting element among the plurality of light emitting elements different from the light emitting element facing the supporting member to the light receiving element accommodated in the supporting member. block out light,
A light source device according to any one of claims 1-4. 各光学部材を透過した各発光素子からの光を結合して出射する結合素子をさらに有する、
請求項１－５の何れか一項に記載の光源装置。 further comprising a coupling element that couples and emits light from each light emitting element that has passed through each optical member;
A light source device according to any one of claims 1-5. 前記基板の上面に配置される導電性の配線パターンをさらに有し、
前記複数の受光素子は、一部のみが各支持部材の溝部に収容されるように配置されるとともに、それぞれ複数のボンディングワイヤを介して前記配線パターンと電気的に接続され、
前記複数のボンディングワイヤの一端は、各受光素子の上面の、前記溝部に収容されない部分に接合される、
請求項１－６の何れか一項に記載の光源装置。 further comprising a conductive wiring pattern disposed on the upper surface of the substrate;
the plurality of light receiving elements are arranged such that only a portion thereof is accommodated in the groove of each support member, and are electrically connected to the wiring pattern via a plurality of bonding wires, respectively;
one end of the plurality of bonding wires is bonded to a portion of the upper surface of each light receiving element that is not accommodated in the groove;
A light source device according to any one of claims 1-6.

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