JP2022519993A - フリップチップレーザーボンディングシステム - Google Patents
フリップチップレーザーボンディングシステム Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 claims abstract description 98
- 239000000758 substrate Substances 0.000 claims abstract description 93
- 230000005540 biological transmission Effects 0.000 claims abstract description 45
- 238000007689 inspection Methods 0.000 claims description 33
- 238000007599 discharging Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 abstract description 21
- 230000001678 irradiating effect Effects 0.000 abstract description 3
- 238000005452 bending Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 16
- 230000004907 flux Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 238000011109 contamination Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
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Abstract
Description
Claims (9)
- 基板の上面にボンディングするための複数の半導体チップが配置された状態の前記基板を供給する供給ユニットと、
前記供給ユニットから前記基板の供給を受けて前記基板の下面を固定する固定ユニットと、
前記固定ユニットに固定された基板にレーザービームを照射して前記半導体チップと基板とをボンディングするレーザーヘッド、及び前記レーザーヘッドを移送するレーザー移送部を備えるレーザーユニットと、
前記レーザーユニットのレーザーヘッドから照射されるレーザービームを透過させる透過部を備えるマスクと、
前記マスクを前記固定ユニットの上側に据え置くマスク据置ユニットと、
前記固定ユニットから前記基板の送達を受けて排出する排出ユニットと、
前記供給ユニット、前記固定ユニット、前記レーザーユニット及び前記排出ユニットの作動を制御する制御部と、を含んでなる、フリップチップレーザーボンディングシステム。 - 前記固定ユニットに固定された前記基板の複数の半導体チップを前記マスクの透過部が加圧することができるように、前記マスク据置ユニットと前記固定ユニットのいずれか一方を他の一方に対して昇降させる加圧ユニットをさらに含む、請求項1に記載のフリップチップレーザーボンディングシステム。
- 前記マスクを前記マスク据置ユニットに供給又は排出するマスク交換ユニットをさらに含む、請求項1又は2に記載のフリップチップレーザーボンディングシステム。
- 前記マスクの下側から前記マスクに対して光を照射する検査ランプと、
前記マスク又は基板を上側から撮影する検査カメラと、をさらに含み、
前記制御部は、前記検査カメラが前記マスクを撮影した画像を用いて前記マスクの汚染有無を判断する、請求項3に記載のフリップチップレーザーボンディングシステム。 - 前記検査ランプは、マスク交換ユニットに設置され、
前記検査カメラは、前記レーザーユニットに設置され、前記レーザー移送部によって移送される、請求項4に記載のフリップチップレーザーボンディングシステム。 - 前記レーザーユニットのレーザーヘッドによってレーザービームが照射される前記半導体チップを撮影する赤外線カメラをさらに含み、
前記制御部は、前記赤外線カメラで測定された値を用いて前記レーザーヘッドの作動を制御する、請求項5に記載のフリップチップレーザーボンディングシステム。 - 前記マスクは、平板形状のマスク本体、及び前記マスク本体に形成された複数の透過孔をさらに含み、
前記マスクの透過部は、複数設けられ、前記マスクの複数の透過孔にそれぞれ挿入される、請求項2に記載のフリップチップレーザーボンディングシステム。 - 前記マスクは、前記複数の透過孔にそれぞれ内方に突出する係止段部をさらに含み、
前記複数の透過部は、前記マスクの複数の透過孔にそれぞれ挿入されて前記係止段部に掛けられる方式で据え置かれる、請求項7に記載のフリップチップレーザーボンディングシステム。 - 前記マスクの複数の透過部の上面には、それぞれウエイト溝が凹設され、
前記マスクは、前記基板に配置された複数の半導体チップをそれぞれ加圧する重さを増やすことができるように、前記透過部のウエイト溝に据え置かれるウエイトをさらに含む、請求項8に記載のフリップチップレーザーボンディングシステム。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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KR10-2019-0001170 | 2019-01-04 | ||
KR1020190001170A KR102208065B1 (ko) | 2019-01-04 | 2019-01-04 | 플립칩 레이저 본딩 시스템 |
PCT/KR2019/006786 WO2020141666A1 (ko) | 2019-01-04 | 2019-06-05 | 플립칩 레이저 본딩 시스템 |
Publications (2)
Publication Number | Publication Date |
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JP2022519993A true JP2022519993A (ja) | 2022-03-28 |
JP7185052B2 JP7185052B2 (ja) | 2022-12-06 |
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JP2021538799A Active JP7185052B2 (ja) | 2019-01-04 | 2019-06-05 | フリップチップレーザーボンディングシステム |
Country Status (6)
Country | Link |
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US (1) | US20210335749A1 (ja) |
JP (1) | JP7185052B2 (ja) |
KR (1) | KR102208065B1 (ja) |
CN (1) | CN113261088A (ja) |
TW (1) | TWI717750B (ja) |
WO (1) | WO2020141666A1 (ja) |
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US11817357B2 (en) | 2021-06-09 | 2023-11-14 | STATS ChipPAC Pte. Ltd. | Region-of-interest positioning for laser-assisted bonding |
Citations (6)
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JP2001148403A (ja) * | 1999-11-18 | 2001-05-29 | Seiko Epson Corp | 半導体チップの実装方法および装置 |
JP2006253385A (ja) * | 2005-03-10 | 2006-09-21 | Seiko Epson Corp | ボンディング装置および半導体装置の製造方法 |
JP2007180457A (ja) * | 2005-12-28 | 2007-07-12 | Toyota Industries Corp | 半田付け方法及び半導体モジュールの製造方法並びに半田付け装置 |
JP2011159847A (ja) * | 2010-02-02 | 2011-08-18 | Apic Yamada Corp | 半導体装置の接合装置及び接合方法 |
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JP2007180457A (ja) * | 2005-12-28 | 2007-07-12 | Toyota Industries Corp | 半田付け方法及び半導体モジュールの製造方法並びに半田付け装置 |
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TWI717750B (zh) | 2021-02-01 |
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KR102208065B1 (ko) | 2021-01-27 |
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