JP2022515621A - 照明モジュール、照明装置およびその製造方法 - Google Patents
照明モジュール、照明装置およびその製造方法 Download PDFInfo
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- JP2022515621A JP2022515621A JP2021537743A JP2021537743A JP2022515621A JP 2022515621 A JP2022515621 A JP 2022515621A JP 2021537743 A JP2021537743 A JP 2021537743A JP 2021537743 A JP2021537743 A JP 2021537743A JP 2022515621 A JP2022515621 A JP 2022515621A
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- Prior art keywords
- resin
- light emitting
- resin portion
- light
- emitting element
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Images
Classifications
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- F21V7/0016—Reflectors for light sources providing for indirect lighting on lighting devices that also provide for direct lighting, e.g. by means of independent light sources, by splitting of the light beam, by switching between both lighting modes
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- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V15/00—Protecting lighting devices from damage
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
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- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
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- G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
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-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
- F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
- F21S43/13—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source characterised by the type of light source
- F21S43/16—Light sources where the light is generated by photoluminescent material spaced from a primary light generating element
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2102/00—Exterior vehicle lighting devices for illuminating purposes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2103/00—Exterior vehicle lighting devices for signalling purposes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2106/00—Interior vehicle lighting devices
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2107/00—Use or application of lighting devices on or in particular types of vehicles
- F21W2107/10—Use or application of lighting devices on or in particular types of vehicles for land vehicles
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0091—Scattering means in or on the semiconductor body or semiconductor body package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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- Condensed Matter Physics & Semiconductors (AREA)
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Abstract
Description
Claims (14)
- 基板と、
前記基板の上に配置される複数の発光素子を含む光源と、
前記基板の上に配置される樹脂層と、
前記樹脂層の上に配置される第1拡散層と、
を含み、
前記樹脂層は、前記光源の上に配置される第1樹脂部と、前記第1樹脂部と隣接して前記基板の上に配置される第2樹脂部とを含み、
前記第1樹脂部の上面は、傾きを有し、且つ前記第1拡散層と離隔し、
前記第2樹脂部は、前記第1樹脂部と異なる材質を含み、
前記基板の上面を基準として、前記第2樹脂部の上面の高さは、前記第1樹脂部の上面の最下端の高さより大きい、照明装置。 - 前記光源は、少なくとも一つの第1発光素子と、前記第1発光素子から離隔した少なくとも一つの第2発光素子と、を含み、
前記第2樹脂部は、前記第1発光素子と前記第2発光素子との間に配置され、
前記第1樹脂部は、複数配置され、前記第2樹脂部は、前記複数の第1樹脂部の間に配置される、請求項1に記載の照明装置。 - 前記複数の第1樹脂部のそれぞれは、少なくとも一つの第1発光素子を覆う、請求項2に記載の照明装置。
- 前記発光素子は、N行およびM列で前記基板の上に配置され、前記MおよびNは1以上の整数であり、N≧Mの関係を有し、
前記第1樹脂部と前記第2樹脂部は、行方向に交互に配置される、請求項1から3のいずれか一項に記載の照明装置。 - 前記第1樹脂部は、列方向に相互離隔または一体形成される、請求項4に記載の照明装置。
- 前記樹脂層は、相互反対側に配置される第1側面および第2側面を含み、
前記第1発光素子は、前記第1側面に隣接し、
前記第2発光素子は、前記第2側面に隣接し、
前記第2樹脂部は、前記樹脂層の第1側面に隣接する前記第1発光素子と、前記第2側面に隣接する前記第2発光素子との間に配置される、請求項5に記載の照明装置。 - 基板と、
前記基板の上に配置される光源と、
前記基板の上に配置される樹脂層と、
前記樹脂層の上に配置される第1拡散層と、
を含み、
前記光源は、第1発光素子と、前記第1発光素子と離隔した第2発光素子とを含み、
前記樹脂層は、前記第1発光素子および前記第2発光素子の上に配置される複数の第1樹脂部と、前記第1発光素子と前記第2発光素子との間に配置される第2樹脂部とを含み、
前記複数の第1樹脂部の上面は、前記第1拡散層と離隔し、
前記基板の上面を基準として、前記第2樹脂部の上面の高さは、前記基板の上面で垂直方向に前記第1発光素子とオーバーラップする前記第1樹脂部の上面の高さより大きい、照明装置。 - 前記第2樹脂部の最上端の高さは、前記第1樹脂部の上面の最上端の高さより大きいか同一である、請求項1または7に記載の照明装置。
- 前記第2樹脂部および前記第1拡散層は、第1接着層によって接着される、請求項1または7に記載の照明装置。
- 前記第1樹脂部の上に遮光部を含み、前記第2樹脂部の上面は、前記遮光部と垂直方向にオーバーラップしない、請求項9に記載の照明装置。
- 前記第1拡散層の上に配置される第2拡散層と、前記第1拡散層と前記第2拡散層との間に配置される第2接着層とを含み、
前記遮光部は、前記第1拡散層と前記第2拡散層との間に配置され、前記第1樹脂部と垂直方向にオーバーラップし、前記第2接着層および前記第1接着層は、垂直方向にオーバーラップする、請求項10に記載の照明装置。 - 前記第1接着層は、前記第1樹脂部と垂直方向にオーバーラップしない、請求項9に記載の照明装置。
- 前記複数の第1樹脂部は、相互離隔して配置され、前記複数の第1樹脂部の間に配置される第2樹脂部は、相互連結され、
前記第1樹脂部は、シリコーン樹脂または熱硬化性樹脂を含み、
前記第2樹脂部は、UV樹脂を含む、請求項3または7に記載の照明装置。 - 前記第1樹脂部と前記第1拡散層との間に離隔した領域は、エアー領域であり、前記第1発光素子と前記第2発光素子との間に配置される前記第1樹脂部および第2樹脂部の水平方向の長さは、4:6~6:4の比率である、請求項1または7に記載の照明装置。
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US11656399B2 (en) | 2023-05-23 |
KR20200080063A (ko) | 2020-07-06 |
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US11874491B2 (en) | 2024-01-16 |
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US20220342142A1 (en) | 2022-10-27 |
US11415740B2 (en) | 2022-08-16 |
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