JP2022164770A - プラズマ処理装置およびリングアセンブリ - Google Patents
プラズマ処理装置およびリングアセンブリ Download PDFInfo
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- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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Abstract
Description
図1は、実施形態に係るプラズマ処理装置1の概略構成を示す断面図である。図1のプラズマ処理装置1は、金属製、例えば、アルミニウム又はステンレス鋼製の保安接地された円筒型の処理容器10を有し、該処理容器10内に、被処理体(基板)としてのウエハWを載置する円板状のサセプタ(下部電極)11が配設されている。このサセプタ11は、例えば、アルミニウムからなり、絶縁性の筒状保持部材12を介して処理容器10の底から垂直上方に延びる筒状支持部13に支持されている。
図2は、実施形態に係る搬送機構50の概略構成を示す断面図である。実施形態に係るプラズマ処理装置は、載置台上に載置されるエッジリングERおよびカバーリングCRを搬送するための搬送機構50を備える。搬送機構50は、リフタピン51、封止部52、駆動機構53を有する。
次に、図4A~図4Eを参照し、実施形態に係る搬送機構50によるエッジリングERの搬送について説明する。図4Aは、実施形態に係る搬送機構50によるエッジリングERの搬送開始時の状態例を示す図である。
次に、図5A~図5Eを参照し、実施形態に係る搬送機構50によるカバーリングCRの搬送について説明する。図5Aは、実施形態に係る搬送機構50によるカバーリングCRの搬送開始時の状態例を示す図である。
なお、上記実施形態では、実施形態に係る搬送機構50はカバーリングCRとエッジリングERとを搬送するものとして説明した。これに限らず、実施形態に係る搬送機構50は、任意の消耗部品の複数の部分または複数の任意の消耗部品を搬送するために適用できる。
また、上記実施形態においては、カバーリングCRをエッジリングERの下方に配置するものとした。しかしこれに限らず、外側に配置される消耗部品の方が消耗が激しい場合には、外側に配置される消耗部品の内周部が、内側に配置される消耗部品の外周部の上に重なるような形状としてもよい。
なお、上記実施形態では、リフタピン51の数は特に限定されない。2以上、好ましくは3以上のリフタピン51を設けることで、エッジリングERおよびカバーリングCRを昇降できる。また、リフタピン51各々に一つの駆動機構53を設けてもよく、複数のリフタピン51に共通の一つの駆動機構53を設けてもよい。
上記のように、実施形態に係る載置台およびプラズマ処理装置は、ウエハを載置するウエハ載置面と、を備える。また、実施形態に係る載置台は、第1係合部を有する第1リングと、第1係合部の下面に至る貫通孔を有し第1係合部に係合する第2係合部を有する第2リングと、を載置するリング載置面を備える。リング載置面は、貫通孔に対応する位置に孔を有し、ウエハ載置面の外周側に設けられる。実施形態に係る載置台はさらに、貫通孔に嵌合する第1保持部と、第1保持部の軸方向に連接され第1保持部の外周から突出する突出部を有する第2保持部と、を有し、第1保持部をリング載置面側にしてリング載置面の孔内に収容されるリフタピンを備える。実施形態に係る載置台はさらに、リフタピンを昇降可能に駆動する駆動機構を備える。このように、実施形態に係る載置台は、駆動機構によりリフタピンをリング載置面の孔から上昇させることにより、第2リングの貫通孔を通ってリフタピンを第1リングに当接させることができる。このため、実施形態に係る載置台は、第2リングをリング載置面上に載置したままで、第1リングをリング載置面から持ち上げて搬送することができる。また、実施形態に係る載置台は、駆動機構によりリフタピンを上昇させて第2保持部の突出部を第2リングの下面に当接させることができる。このため、実施形態に係る載置台は、一つのリフタピンを用いて第1リングおよび第2リングの双方を搬送することができる。また、実施形態に係る載置台は、一つのリフタピンにより複数消耗部品の搬送を実現するため、搬送機構により占有される空間を抑制できる。
10 処理容器
11 サセプタ(下部電極)
12 筒状保持部材
13 筒状支持部
14 排気路
15 バッフル板
16 排気口
17 排気管
18 排気装置
19 搬入出口
20 ゲートバルブ
21a 第1の高周波電源
21b 第2の高周波電源
22 整合器
23 給電棒
24 シャワーヘッド
25 静電チャック
25a 中心部
25b 内周部
25c 外周部
25d,25e 電極板
26,28 直流電源
27,29 スイッチ
35a、35b 伝熱ガス供給部
36a ウエハ用ガス供給ライン
36b リング用ガス供給ライン
43 制御部
50 搬送機構
51 リフタピン
51a 第1保持部
51b 第2保持部
51c 突出部
52 封止部
53 駆動機構
61 貫通孔
63,64 孔
CR カバーリング
ER エッジリング
W ウエハ
Claims (9)
- ウエハを載置するウエハ載置面と、
第1係合部を有する第1リングと、前記第1係合部の下面に至る貫通孔を有し前記第1係合部に係合する第2係合部を有する第2リングと、を載置し、前記貫通孔に対応する位置に孔を有し、前記ウエハ載置面の外周側に設けられるリング載置面と、
前記貫通孔に嵌合する第1保持部と、当該第1保持部の軸方向に連接され前記第1保持部の外周から突出する突出部を有する第2保持部と、を有し、前記第1保持部を前記リング載置面側にしてリング載置面の孔内に収容されるリフタピンと、
前記リフタピンを昇降可能に駆動する駆動機構と、
を備えるプラズマ処理装置の載置台。 - 前記第1保持部および前記第2保持部は、同軸かつ断面同心円形状の棒状部材であり、前記第1保持部の径は、前記第2保持部の径よりも小さい、請求項1に記載の載置台。
- 前記第1リングは前記第2リングよりも前記ウエハ載置面の中心側に配置され、前記第2係合部は前記第1係合部よりもリング載置面側に配置される、請求項1または2に記載の載置台。
- 前記第1リングは導電材料で形成され、
前記第2リングは絶縁材料で形成される、
請求項3に記載の載置台。 - 前記第2リングは前記第1リングよりも前記ウエハ載置面の中心側に配置され、前記第2係合部は前記第1係合部よりもリング載置面側に配置される、請求項1または2に記載の載置台。
- 前記第1リングおよび前記第2リングの少なくとも一方を前記リング載置面に吸着するリング用静電チャックと、
前記第1リングおよび前記第2リングの前記少なくとも一方の下面と前記リング載置面との間に伝熱ガスを供給するガス供給機構と、
をさらに備える請求項1から5のいずれか1項に記載の載置台。 - 前記駆動機構は、
前記第1リングの搬送時、前記第1保持部の頂部が所定の高さに到達するまで前記リフタピンを上昇させ、
前記第2リングの搬送時、前記第2保持部の頂部が前記所定の高さに到達するまで前記リフタピンを上昇させる、請求項1から6のいずれか1項に記載の載置台。 - 前記第1保持部の軸方向長さは、前記第2リングの軸方向の厚みよりも長い、請求項1から7のいずれか1項に記載の載置台。
- ウエハを載置するウエハ載置面と、
第1係合部を有する第1リングと、
前記第1係合部の下面に至る貫通孔を有し前記第1係合部に係合する第2係合部を有する第2リングと、
前記ウエハ載置面の外周側に設けられ、前記貫通孔に対応する位置に孔を有し、前記第1リングおよび前記第2リングを載置するリング載置面と、
前記貫通孔に嵌合する第1保持部と、当該第1保持部の軸方向に連接され前記第1保持部の外周から突出する突出部を有する第2保持部と、を有し、前記第1保持部を前記リング載置面側にしてリング載置面の孔内に収容されるリフタピンと、
前記リフタピンを昇降可能に駆動する駆動機構と、
を備えるプラズマ処理装置。
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