JP2022104964A - 堆積の均一性を改善するための、様々なプロファイルを有する側部を有するシャドーフレーム - Google Patents
堆積の均一性を改善するための、様々なプロファイルを有する側部を有するシャドーフレーム Download PDFInfo
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- JP2022104964A JP2022104964A JP2022058409A JP2022058409A JP2022104964A JP 2022104964 A JP2022104964 A JP 2022104964A JP 2022058409 A JP2022058409 A JP 2022058409A JP 2022058409 A JP2022058409 A JP 2022058409A JP 2022104964 A JP2022104964 A JP 2022104964A
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- 238000004062 sedimentation Methods 0.000 title 1
- 230000008878 coupling Effects 0.000 claims description 7
- 238000010168 coupling process Methods 0.000 claims description 7
- 238000005859 coupling reaction Methods 0.000 claims description 7
- 239000000758 substrate Substances 0.000 description 52
- 239000007789 gas Substances 0.000 description 17
- 238000000151 deposition Methods 0.000 description 7
- 230000008021 deposition Effects 0.000 description 7
- 238000009826 distribution Methods 0.000 description 7
- 230000002093 peripheral effect Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910010293 ceramic material Inorganic materials 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 229910021417 amorphous silicon Inorganic materials 0.000 description 2
- 230000001174 ascending effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 244000309464 bull Species 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000012772 electrical insulation material Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
Images
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J29/00—Details of cathode-ray tubes or of electron-beam tubes of the types covered by group H01J31/00
- H01J29/02—Electrodes; Screens; Mounting, supporting, spacing or insulating thereof
- H01J29/06—Screens for shielding; Masks interposed in the electron stream
- H01J29/07—Shadow masks for colour television tubes
- H01J29/073—Mounting arrangements associated with shadow masks
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45587—Mechanical means for changing the gas flow
- C23C16/45591—Fixed means, e.g. wings, baffles
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/04—Coating on selected surface areas, e.g. using masks
- C23C16/042—Coating on selected surface areas, e.g. using masks using masks
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
- C23C16/4585—Devices at or outside the perimeter of the substrate support, e.g. clamping rings, shrouds
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
- H01J37/32477—Vessel characterised by the means for protecting vessels or internal parts, e.g. coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
- H01J37/32633—Baffles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/24—Deposition of silicon only
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2229/00—Details of cathode ray tubes or electron beam tubes
- H01J2229/07—Shadow masks
- H01J2229/0716—Mounting arrangements of aperture plate to frame or vessel
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2229/00—Details of cathode ray tubes or electron beam tubes
- H01J2229/07—Shadow masks
- H01J2229/0722—Frame
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Plasma & Fusion (AREA)
- Physics & Mathematics (AREA)
- Analytical Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Drying Of Semiconductors (AREA)
Abstract
Description
Claims (15)
- 2つの対向する副側部フレーム部材に隣接する2つの対向する主側部フレーム部材であって、それらの間の交差部におけるコーナーブラケットによって結合された、前記2つの対向する副側部フレーム部材に隣接する前記2つの対向する主側部フレーム部材、を備えるシャドーフレームであって、各コーナーブラケットが、互いにほぼ直交する方向に延びる脚部を有するコーナーインレーを含む、シャドーフレーム。
- 前記コーナーブラケットの各々が、それぞれのコーナーインレーと、前記2つの対向する主側部フレーム部材のうちの1つの主側部フレーム部材との間、および前記2つの対向する副側部フレーム部材のうちの1つの副側部フレーム部材との間のインターフェース部に配置された継ぎ目カバーを含む、請求項1に記載のシャドーフレーム。
- 前記コーナーインレーが、平面上面の平面から角度を付けられている傾斜した平面表面を含む、請求項2に記載のシャドーフレーム。
- 前記傾斜した平面表面が、前記平面上面から約7度の角度で形成されている、請求項3に記載のシャドーフレーム。
- 前記継ぎ目カバーが、第1の表面および第2の表面を有する、請求項2に記載のシャドーフレーム。
- 前記第2の表面が、前記第1の表面の平面よりも下に凹んでいる、請求項5に記載のシャドーフレーム。
- 前記コーナーインレーが、平面上面の平面から角度を付けられている傾斜した平面表面を含む、請求項6に記載のシャドーフレーム。
- 第2の表面が、前記傾斜した平面表面の角度と実質的に整合するように角度を付けられている、請求項7に記載のシャドーフレーム。
- 前記コーナーブラケットが、丸みを帯びたコーナーを含む、請求項1に記載のシャドーフレーム。
- 結合インターフェース部におけるコーナーブラケットによって結合された、2つの対向する副側部フレーム部材に隣接する2つの対向する主側部フレーム部材を備えるシャドーフレームであって、各コーナーブラケットが、互いにほぼ直交する方向に延びる脚部を有するコーナーインレーを含み、各コーナーブラケットが、丸みを帯びたコーナーを含む、シャドーフレーム。
- 前記結合インターフェース部が、複数のピンを含む、請求項10に記載のシャドーフレーム。
- 前記結合インターフェースが、継ぎ目カバーを含む、請求項10に記載のシャドーフレーム。
- 前記継ぎ目カバーが、第1の表面および第2の表面を有する、請求項12に記載のシャドーフレーム。
- 前記第2の表面が、前記第1の表面の平面よりも下に凹んでいる、請求項13に記載のシャドーフレーム。
- 前記コーナーインレーが、平面上面の平面から角度を付けられている傾斜した平面表面を含む、請求項14に記載のシャドーフレーム。
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201762564015P | 2017-09-27 | 2017-09-27 | |
US62/564,015 | 2017-09-27 | ||
US16/122,003 US10468221B2 (en) | 2017-09-27 | 2018-09-05 | Shadow frame with sides having a varied profile for improved deposition uniformity |
US16/122,003 | 2018-09-05 | ||
PCT/US2018/051178 WO2019067240A1 (en) | 2017-09-27 | 2018-09-14 | PERFORATED MASK WITH VARIED PROFILE SIDES FOR IMPROVED DEPOSIT UNIFORMITY |
JP2020516797A JP7053809B2 (ja) | 2017-09-27 | 2018-09-14 | 堆積の均一性を改善するための、様々なプロファイルを有する側部を有するシャドーフレーム |
Related Parent Applications (1)
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JP2020516797A Division JP7053809B2 (ja) | 2017-09-27 | 2018-09-14 | 堆積の均一性を改善するための、様々なプロファイルを有する側部を有するシャドーフレーム |
Publications (2)
Publication Number | Publication Date |
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JP2022104964A true JP2022104964A (ja) | 2022-07-12 |
JP7224511B2 JP7224511B2 (ja) | 2023-02-17 |
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JP2020516797A Active JP7053809B2 (ja) | 2017-09-27 | 2018-09-14 | 堆積の均一性を改善するための、様々なプロファイルを有する側部を有するシャドーフレーム |
JP2022058409A Active JP7224511B2 (ja) | 2017-09-27 | 2022-03-31 | 堆積の均一性を改善するための、様々なプロファイルを有する側部を有するシャドーフレーム |
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JP2020516797A Active JP7053809B2 (ja) | 2017-09-27 | 2018-09-14 | 堆積の均一性を改善するための、様々なプロファイルを有する側部を有するシャドーフレーム |
Country Status (6)
Country | Link |
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US (1) | US10468221B2 (ja) |
JP (2) | JP7053809B2 (ja) |
KR (2) | KR102517891B1 (ja) |
CN (2) | CN114959648A (ja) |
TW (1) | TWI829652B (ja) |
WO (1) | WO2019067240A1 (ja) |
Families Citing this family (1)
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KR102581673B1 (ko) * | 2021-09-13 | 2023-09-21 | 에스케이엔펄스 주식회사 | 쉐도우 프레임 및 이를 포함하는 증착장치 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017512894A (ja) * | 2014-01-30 | 2017-05-25 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | プロファイル均一性を改善するためのコーナースポイラー |
JP2017519109A (ja) * | 2014-06-13 | 2017-07-13 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 均一性の改善及びエッジの長寿命化のための平坦なエッジの設計 |
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US7771538B2 (en) * | 2004-01-20 | 2010-08-10 | Jusung Engineering Co., Ltd. | Substrate supporting means having wire and apparatus using the same |
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KR101119780B1 (ko) * | 2005-06-30 | 2012-03-23 | 엘지디스플레이 주식회사 | 플라즈마 화학증착장치 |
US8435379B2 (en) * | 2007-05-08 | 2013-05-07 | Applied Materials, Inc. | Substrate cleaning chamber and cleaning and conditioning methods |
US20080289686A1 (en) * | 2007-05-23 | 2008-11-27 | Tae Kyung Won | Method and apparatus for depositing a silicon layer on a transmitting conductive oxide layer suitable for use in solar cell applications |
FI20070991L (fi) | 2007-12-19 | 2009-06-20 | Beneq Oy | Lasituote, tuotteen käyttö ja valmistusmenetelmä |
USD631858S1 (en) * | 2008-11-17 | 2011-02-01 | Applied Materials, Inc. | Shadow frame |
WO2011024853A1 (ja) * | 2009-08-26 | 2011-03-03 | キヤノンアネルバ株式会社 | 成膜装置 |
KR101840322B1 (ko) * | 2009-12-31 | 2018-03-20 | 어플라이드 머티어리얼스, 인코포레이티드 | 웨이퍼 엣지 및 경사면 증착을 수정하기 위한 쉐도우 링 |
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2018
- 2018-09-05 US US16/122,003 patent/US10468221B2/en active Active
- 2018-09-14 KR KR1020227017110A patent/KR102517891B1/ko active IP Right Grant
- 2018-09-14 KR KR1020207011540A patent/KR102402497B1/ko active IP Right Grant
- 2018-09-14 CN CN202210513328.8A patent/CN114959648A/zh active Pending
- 2018-09-14 WO PCT/US2018/051178 patent/WO2019067240A1/en active Application Filing
- 2018-09-14 CN CN201880056414.2A patent/CN111051569B/zh active Active
- 2018-09-14 JP JP2020516797A patent/JP7053809B2/ja active Active
- 2018-09-26 TW TW107133766A patent/TWI829652B/zh active
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- 2022-03-31 JP JP2022058409A patent/JP7224511B2/ja active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017512894A (ja) * | 2014-01-30 | 2017-05-25 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | プロファイル均一性を改善するためのコーナースポイラー |
JP2017519109A (ja) * | 2014-06-13 | 2017-07-13 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 均一性の改善及びエッジの長寿命化のための平坦なエッジの設計 |
Also Published As
Publication number | Publication date |
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TW201930642A (zh) | 2019-08-01 |
WO2019067240A1 (en) | 2019-04-04 |
KR102402497B1 (ko) | 2022-05-25 |
KR20200045003A (ko) | 2020-04-29 |
JP7053809B2 (ja) | 2022-04-12 |
US10468221B2 (en) | 2019-11-05 |
JP2020535640A (ja) | 2020-12-03 |
CN114959648A (zh) | 2022-08-30 |
CN111051569A (zh) | 2020-04-21 |
JP7224511B2 (ja) | 2023-02-17 |
CN111051569B (zh) | 2022-05-24 |
KR102517891B1 (ko) | 2023-04-03 |
KR20220070573A (ko) | 2022-05-31 |
TWI829652B (zh) | 2024-01-21 |
US20190096624A1 (en) | 2019-03-28 |
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