JP2021516767A - アレイ基板、その製造方法及び表示装置 - Google Patents
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- 229910052581 Si3N4 Inorganic materials 0.000 description 2
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- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
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Abstract
Description
本開示の実施例は、アレイ基板、その製造方法及び表示装置に関する。
ベース基板上に第1金属層を形成するステップS301と、
第1金属層のベース基板から離れた一側に第1絶縁層を形成するステップS302と、
第1絶縁層のベース基板から離れた一側に第2金属層を形成するステップS303と、
第2金属層の第1絶縁層から離れた一側に第2絶縁層を形成するステップS304と、
第2絶縁層をエッチングして少なくとも1つの溝を形成するステップS305とを含み、アレイ基板は、表示領域と表示領域を取り囲んでいる周辺領域とを含み、第1金属層は、周辺領域において複数本の信号線を含み、溝は、複数本の信号線のうち少なくとも2本の信号線と重なり、第2金属層は、周辺領域において金属バーを含み、溝と信号線との重なる領域では、信号線のベース基板での正投影が金属バーのベース基板での正投影内にある。
(1)本開示の実施例の図面では、本開示の実施例に係る構造のみを示しており、その他の構造は、通常の設計を参照すればよい。
(2)矛盾しない限り、本開示の同一実施例及び異なる実施例における特徴を互いに組み合わせ得る。
Claims (17)
- アレイ基板であって、
ベース基板と、
前記ベース基板上に位置する第1金属層と、
前記第1金属層の前記ベース基板から離れた一側に位置する第1絶縁層と、
前記第1絶縁層の前記ベース基板から離れた一側に位置する第2金属層と、
前記第2金属層の前記ベース基板から離れた一側に位置する第2絶縁層とを備え、
前記アレイ基板は、表示領域と前記表示領域を取り囲んでいる周辺領域とを含み、前記第1金属層は、前記周辺領域において複数本の信号線を含み、前記第2絶縁層は、前記周辺領域において前記複数本の信号線のうち少なくとも2本の信号線と重なる少なくとも1つの溝を含み、前記第2金属層は、前記周辺領域において金属バーを含み、
前記溝と前記信号線との重なる領域では、前記信号線の前記ベース基板での正投影が前記金属バーの前記ベース基板での正投影内にある
アレイ基板。 - 前記金属バーは、前記複数本の信号線に1対1で対応して設置された複数の金属バーを含み、前記溝と前記信号線との重なる領域では、前記信号線のそれぞれの前記ベース基板での正投影が対応して設置された前記金属バーの前記ベース基板での正投影内にある
請求項1に記載のアレイ基板。 - 前記溝と前記信号線との重なる領域では、各前記金属バーの幅が各前記信号線の幅より大きい
請求項1又は2に記載のアレイ基板。 - 前記複数本の信号線は、前記表示領域まで延びている
請求項1−3のいずれか1項に記載のアレイ基板。 - 前記第2金属層は、前記表示領域において導電性パターンを含み、各前記金属バーは、前記導電性パターンと絶縁している
請求項1−4のいずれか1項に記載のアレイ基板。 - 前記第1絶縁層の材料は、無機絶縁材料を含み、前記第2絶縁層の材料は、無機絶縁材料を含む
請求項1−5のいずれか1項に記載のアレイ基板。 - 前記溝は、前記周辺領域の前記金属バーが設置されていない領域において、前記ベース基板に垂直な方向に沿って前記第1絶縁層を貫通している
請求項1−6のいずれか1項に記載のアレイ基板。 - 前記第1金属層は、第1ゲート金属層であり、前記第2金属層は、第2ゲート金属層である
請求項1−7のいずれか1項に記載のアレイ基板。 - 前記第2絶縁層は、層間誘電体層を含む
請求項1−8のいずれか1項に記載のアレイ基板。 - 前記第2絶縁層の前記第2金属層から離れた一側に位置する第3金属層をさらに備え、
前記第3金属層は、前記周辺領域において前記溝の底角に位置する金属残留を含む
請求項1−9のいずれか1項に記載のアレイ基板。 - 前記第3金属層は、前記表示領域においてソース、ドレイン及びソース・ドレイン信号線のうち少なくとも1つを含む
請求項10に記載のアレイ基板。 - 前記第3金属層の前記第2絶縁層から離れた一側に設置されたパッシベーション層と、
前記表示領域であって前記パッシベーション層の前記第3金属層から離れた一側に位置する画素電極とをさらに備える
請求項11に記載のアレイ基板。 - 表示装置であって、請求項1−12のいずれか1項に記載のアレイ基板を備える
表示装置。 - アレイ基板の製造方法であって、
ベース基板上に第1金属層を形成するステップと、
前記第1金属層の前記ベース基板から離れた一側に第1絶縁層を形成するステップと、
前記第1絶縁層の前記ベース基板から離れた一側に第2金属層を形成するステップと、
前記第2金属層の前記ベース基板から離れた一側に第2絶縁層を形成するステップと、
前記第2絶縁層をエッチングして少なくとも1つの溝を形成するステップとを含み、
前記アレイ基板は、表示領域と前記表示領域を取り囲んでいる周辺領域とを含み、前記第1金属層は、前記周辺領域において複数本の信号線を含み、前記溝は、前記複数本の信号線のうち少なくとも2本の信号線と重なり、前記第2金属層は、前記周辺領域において金属バーを含み、前記溝と前記信号線との重なる領域では、前記信号線の前記ベース基板での正投影が前記金属バーの前記ベース基板での正投影内にある
アレイ基板の製造方法。 - 前記金属バーは、前記複数本の信号線に1対1で対応して設置された複数の金属バーを含み、前記溝と前記信号線との重なる領域では、前記信号線のそれぞれの前記ベース基板での正投影が対応して設置された前記金属バーの前記ベース基板での正投影内にある
請求項14に記載のアレイ基板の製造方法。 - 前記溝と前記信号線との重なる領域では、各前記金属バーの幅が各前記信号線の幅より大きい
請求項14に記載のアレイ基板の製造方法。 - 前記第2金属層は、前記表示領域において導電性パターンを含み、各前記金属バーは、前記導電性パターンと絶縁しており、前記金属バー及び前記導電性パターンは、同一のマスクプロセスにより作製される
請求項14に記載のアレイ基板の製造方法。
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CN109637994B (zh) * | 2018-11-26 | 2021-02-02 | 武汉华星光电半导体显示技术有限公司 | 一种柔性显示面板及柔性显示装置 |
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CN111192910B (zh) * | 2020-01-22 | 2022-10-14 | 京东方科技集团股份有限公司 | 阵列基板及制作方法、显示面板 |
CN113597578B (zh) * | 2020-03-02 | 2023-11-17 | 京东方科技集团股份有限公司 | 偏光片、电子装置及制备偏光片的方法 |
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WO2019174297A1 (zh) | 2019-09-19 |
EP3767673A1 (en) | 2021-01-20 |
US11316000B2 (en) | 2022-04-26 |
CN108447872B (zh) | 2021-01-22 |
CN108447872A (zh) | 2018-08-24 |
EP3767673A4 (en) | 2021-12-15 |
US20210358956A1 (en) | 2021-11-18 |
JP7239481B2 (ja) | 2023-03-14 |
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