JP2021501699A - 基板処理システムのための平坦化膜および方法 - Google Patents
基板処理システムのための平坦化膜および方法 Download PDFInfo
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- 239000012528 membrane Substances 0.000 title claims abstract description 158
- 238000000034 method Methods 0.000 title claims abstract description 76
- 239000000758 substrate Substances 0.000 title claims abstract description 27
- 238000012545 processing Methods 0.000 title description 9
- 239000000126 substance Substances 0.000 claims abstract description 31
- 239000002002 slurry Substances 0.000 claims description 29
- 239000000463 material Substances 0.000 claims description 20
- 230000003746 surface roughness Effects 0.000 claims description 10
- 239000000969 carrier Substances 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 2
- 239000004576 sand Substances 0.000 claims description 2
- 238000005299 abrasion Methods 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 abstract description 80
- 238000010586 diagram Methods 0.000 abstract description 2
- 238000005498 polishing Methods 0.000 description 68
- 239000010408 film Substances 0.000 description 57
- 230000008569 process Effects 0.000 description 34
- 239000002245 particle Substances 0.000 description 13
- 238000004519 manufacturing process Methods 0.000 description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 6
- 230000033001 locomotion Effects 0.000 description 6
- 230000007246 mechanism Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 238000003825 pressing Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 229920002943 EPDM rubber Polymers 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical group CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000012736 aqueous medium Substances 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
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- 230000008901 benefit Effects 0.000 description 2
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 description 2
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 description 2
- 239000008119 colloidal silica Substances 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000000725 suspension Substances 0.000 description 2
- 229920003051 synthetic elastomer Polymers 0.000 description 2
- 239000005061 synthetic rubber Substances 0.000 description 2
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000002925 chemical effect Effects 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000005459 micromachining Methods 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 230000027756 respiratory electron transport chain Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000000284 resting effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 208000024891 symptom Diseases 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F3/00—Brightening metals by chemical means
- C23F3/04—Heavy metals
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- General Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
本出願は、2017年11月6日に出願された米国仮出願第62/582,187号の先の出願日の利益を主張する実用新案出願であり、その全体が参照により本明細書に組み込まれる。
平坦化ウェーハキャリア膜の使用によってもたらされ得るウェーハの改善された不均一性を実証する証拠が得られた。1つの実証では、改善された不均一性は、特にウェーハのエッジ付近で明らかであった。その実証では、修正された150mmのTitan研磨ヘッドが使用された。その実証の結果を図7〜図8に示す。
Claims (20)
- 弾性膜を提供するステップと、
前記弾性膜の表面を平坦化して平坦化弾性膜を形成するステップと、
を含む、基板キャリア用の弾性膜を処理するための方法。 - 前記平坦化するステップが、
膜調整工具を提供するステップと、
前記膜調整工具を前記弾性膜に適用するステップと、
を含む、請求項1に記載の方法。 - 前記膜表面が摩耗性材料を用いて平坦化される、請求項1または2に記載の方法。
- 前記摩耗性材料が砂である、請求項3に記載の方法。
- 前記平坦化するステップが、前記弾性膜の前記表面に1つまたは複数の化学物質を導入するステップをさらに含む、請求項1〜4のいずれか一項に記載の方法。
- 前記1つまたは複数の化学物質が化学スラリー混合物を含む、請求項5に記載の方法。
- 前記平坦化するステップは、プレートと前記膜との間で互いに対する相対的な回転速度を制御するステップを含む、請求項1〜6のいずれか一項に記載の方法。
- 前記回転速度は、約10〜500回転/分である、請求項7に記載の方法。
- 前記平坦化するステップは、支持プレートおよび保持要素を備える膜アセンブリに取り付けられた前記膜を用いて実施される、請求項1〜6のいずれか一項に記載の方法。
- 基板を提供するステップと、
請求項1〜9のいずれか一項に記載の方法で形成された平坦化膜を含むCMPシステムを提供するステップと、
前記基板の表面を平坦化するステップと、
を含む、基板を平坦化する方法。 - 平坦化表面を備える膜と、
前記膜を支持するように構成された支持プレートと、
前記膜を前記支持プレートに保持するように構成された保持要素と、
を備える、基板を支持するための装置。 - 前記支持プレートと前記膜との間にキャビティをさらに備える、請求項11に記載の装置。
- 前記支持プレートと前記膜との間に配置され、前記キャビティに対する外周を形成するリングをさらに備える、請求項12に記載の装置。
- 前記リングが前記平坦化表面を備える、請求項13に記載の装置。
- 請求項11〜14のいずれか一項に記載の装置を備える、基板キャリア。
- 弾性膜本体が基板対向面とキャリア対向面とを備え、前記基板対向面が平坦化される、化学機械平坦化のための膜。
- 前記平坦化基板対向面と、前記キャリア対向面との間の厚さが、約0.005〜0.100インチの範囲内である、請求項16に記載の膜。
- 請求項16または17に記載の膜を平坦化するために、膜調整工具を備える、システム。
- 約0.1〜10psiの範囲内の圧力で前記膜を平坦化するように構成されたコントローラを備える、請求項18に記載のシステム。
- 前記平坦化基板対向面の表面粗さが、前記弾性膜本体の前記表面にわたって実質的に均一である、請求項18または20に記載のシステム。
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JP2023176926A JP2023176009A (ja) | 2017-11-06 | 2023-10-12 | 基板処理システムのための平坦化膜および方法 |
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US201762582187P | 2017-11-06 | 2017-11-06 | |
US62/582,187 | 2017-11-06 | ||
PCT/US2018/058024 WO2019089467A1 (en) | 2017-11-06 | 2018-10-29 | Planarized membrane and methods for substrate processing systems |
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JP2020524244A Pending JP2021501699A (ja) | 2017-11-06 | 2018-10-29 | 基板処理システムのための平坦化膜および方法 |
JP2023176926A Pending JP2023176009A (ja) | 2017-11-06 | 2023-10-12 | 基板処理システムのための平坦化膜および方法 |
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Country Status (5)
Country | Link |
---|---|
US (2) | US11685012B2 (ja) |
EP (1) | EP3706954A4 (ja) |
JP (2) | JP2021501699A (ja) |
CN (1) | CN111432983A (ja) |
WO (1) | WO2019089467A1 (ja) |
Families Citing this family (1)
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US11705354B2 (en) | 2020-07-10 | 2023-07-18 | Applied Materials, Inc. | Substrate handling systems |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH0957587A (ja) * | 1995-08-16 | 1997-03-04 | Sony Corp | 軟質材の平坦化方法及び装置 |
JP2001054855A (ja) * | 1999-07-09 | 2001-02-27 | Applied Materials Inc | 変更された可撓膜を有するキャリアヘッド |
JP2001219368A (ja) * | 2000-02-07 | 2001-08-14 | Applied Materials Inc | ウェハー研磨装置 |
JP2007012918A (ja) * | 2005-06-30 | 2007-01-18 | Toshiba Ceramics Co Ltd | 研磨ヘッド |
US20100173566A1 (en) * | 2008-12-12 | 2010-07-08 | Applied Materials, Inc. | Carrier Head Membrane Roughness to Control Polishing Rate |
JP2015223681A (ja) * | 2014-05-29 | 2015-12-14 | ミクロ技研株式会社 | 研磨ヘッド及び研磨処理装置 |
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US5885137A (en) | 1997-06-27 | 1999-03-23 | Siemens Aktiengesellschaft | Chemical mechanical polishing pad conditioner |
US6200199B1 (en) * | 1998-03-31 | 2001-03-13 | Applied Materials, Inc. | Chemical mechanical polishing conditioner |
US6722963B1 (en) | 1999-08-03 | 2004-04-20 | Micron Technology, Inc. | Apparatus for chemical-mechanical planarization of microelectronic substrates with a carrier and membrane |
TW579319B (en) * | 2000-05-12 | 2004-03-11 | Multi Planar Technologies Inc | System and method for CMP head having multi-pressure annular zone subcarrier material removal control |
JP4718107B2 (ja) * | 2003-05-20 | 2011-07-06 | 株式会社荏原製作所 | 基板保持装置及び研磨装置 |
US7273408B2 (en) * | 2005-12-16 | 2007-09-25 | Applied Materials, Inc. | Paired pivot arm |
JP4374370B2 (ja) * | 2006-10-27 | 2009-12-02 | 信越半導体株式会社 | 研磨ヘッド及び研磨装置 |
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US20090242125A1 (en) | 2008-03-25 | 2009-10-01 | Applied Materials, Inc. | Carrier Head Membrane |
KR101196652B1 (ko) * | 2011-05-31 | 2012-11-02 | 주식회사 케이씨텍 | 캐리어 헤드의 멤브레인 결합체 및 이를 구비한 캐리어 헤드 |
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-
2018
- 2018-10-29 WO PCT/US2018/058024 patent/WO2019089467A1/en unknown
- 2018-10-29 CN CN201880078406.8A patent/CN111432983A/zh active Pending
- 2018-10-29 US US16/758,794 patent/US11685012B2/en active Active
- 2018-10-29 EP EP18873683.9A patent/EP3706954A4/en active Pending
- 2018-10-29 JP JP2020524244A patent/JP2021501699A/ja active Pending
-
2023
- 2023-05-23 US US18/322,374 patent/US20240227116A9/en active Pending
- 2023-10-12 JP JP2023176926A patent/JP2023176009A/ja active Pending
Patent Citations (6)
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JPH0957587A (ja) * | 1995-08-16 | 1997-03-04 | Sony Corp | 軟質材の平坦化方法及び装置 |
JP2001054855A (ja) * | 1999-07-09 | 2001-02-27 | Applied Materials Inc | 変更された可撓膜を有するキャリアヘッド |
JP2001219368A (ja) * | 2000-02-07 | 2001-08-14 | Applied Materials Inc | ウェハー研磨装置 |
JP2007012918A (ja) * | 2005-06-30 | 2007-01-18 | Toshiba Ceramics Co Ltd | 研磨ヘッド |
US20100173566A1 (en) * | 2008-12-12 | 2010-07-08 | Applied Materials, Inc. | Carrier Head Membrane Roughness to Control Polishing Rate |
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Also Published As
Publication number | Publication date |
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US11685012B2 (en) | 2023-06-27 |
EP3706954A1 (en) | 2020-09-16 |
CN111432983A (zh) | 2020-07-17 |
EP3706954A4 (en) | 2021-08-18 |
US20240227116A9 (en) | 2024-07-11 |
WO2019089467A1 (en) | 2019-05-09 |
US20240131652A1 (en) | 2024-04-25 |
JP2023176009A (ja) | 2023-12-12 |
KR20200079533A (ko) | 2020-07-03 |
US20210178548A1 (en) | 2021-06-17 |
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