JP2021190479A - 冷却装置 - Google Patents
冷却装置 Download PDFInfo
- Publication number
- JP2021190479A JP2021190479A JP2020091716A JP2020091716A JP2021190479A JP 2021190479 A JP2021190479 A JP 2021190479A JP 2020091716 A JP2020091716 A JP 2020091716A JP 2020091716 A JP2020091716 A JP 2020091716A JP 2021190479 A JP2021190479 A JP 2021190479A
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- Prior art keywords
- refrigerant
- container
- cooling device
- transport
- evaporation
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- 238000001816 cooling Methods 0.000 title claims abstract description 91
- 230000032258 transport Effects 0.000 claims abstract description 166
- 239000003507 refrigerant Substances 0.000 claims abstract description 141
- 238000001704 evaporation Methods 0.000 claims abstract description 86
- 230000008020 evaporation Effects 0.000 claims abstract description 82
- 239000007791 liquid phase Substances 0.000 claims abstract description 52
- 239000012071 phase Substances 0.000 claims abstract description 36
- 230000017525 heat dissipation Effects 0.000 claims abstract description 12
- 238000013459 approach Methods 0.000 claims description 4
- 230000008859 change Effects 0.000 abstract description 5
- 238000002347 injection Methods 0.000 description 28
- 239000007924 injection Substances 0.000 description 28
- 238000000034 method Methods 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 239000007788 liquid Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 238000009833 condensation Methods 0.000 description 5
- 230000005494 condensation Effects 0.000 description 5
- 238000009792 diffusion process Methods 0.000 description 5
- 238000009835 boiling Methods 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 230000000630 rising effect Effects 0.000 description 4
- 230000007704 transition Effects 0.000 description 4
- 238000009834 vaporization Methods 0.000 description 4
- 230000008016 vaporization Effects 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000638 solvent extraction Methods 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0068—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for refrigerant cycles
- F28D2021/0071—Evaporators
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- Sustainable Development (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
(付記1)
冷媒が密封された容器と、
前記容器の内部で液相の前記冷媒を受熱により蒸発させる蒸発部と、
前記容器の内部で気相の前記冷媒を放熱により凝縮させる凝縮部と、
前記容器の内部で液相の前記冷媒を毛細管現象により前記蒸発部に輸送する管状の輸送部と、
前記輸送部と前記蒸発部の間に液相の前記冷媒が前記輸送部から前記蒸発部に移動する隙間を生じさせる隙間部と、
を有する冷却装置。
(付記2)
前記蒸発部が、前記輸送部の内径よりも狭い溝幅の溝部を成す複数の柱部材を備え、
前記輸送部の一端部分が前記隙間を生じた状態で前記柱部材に対向している付記1に記載の冷却装置。
(付記3)
前記隙間部が前記輸送部に設けられる付記2に記載の冷却装置。
(付記4)
前記隙間部が前記輸送部の前記一端部分を前記輸送部の長手方向に対し傾斜させた傾斜部である付記3に記載の冷却装置。
(付記5)
前記傾斜部が、前記蒸発部から離間するにしたがって互いに接近するように対で設けられる傾斜面を有する付記4に記載の冷却装置。
(付記6)
前記傾斜部が、前記輸送部の周方向で複数個所に設けられている付記5に記載の冷却装置。
(付記7)
前記隙間部が、前記輸送部及び前記蒸発部と別体である付記2に記載の冷却装置。
(付記8)
前記隙間部が、前記輸送部と前記蒸発部との間に配設される網部材である付記7に記載の冷却装置。
(付記9)
前記網部材が前記輸送部と前記蒸発部の両方に接触している付記8に記載の冷却装置。
(付記10)
前記隙間部が、前記容器に設けられている付記2に記載の冷却装置。
(付記11)
前記容器に、前記輸送部を収容する凹部が設けられ、
前記隙間部が、前記凹部において前記一端部分と対向する壁部として設けられている付記10に記載の冷却装置。
(付記12)
前記輸送部における前記一端部分と反対側の他端部分と前記容器の側壁との間に、液相の前記冷媒が前記蒸発部に移動する第二隙間を生じさせる第二隙間部を有する付記2から付記11のいずれか一項に記載の冷却装置。
(付記13)
前記輸送部を複数備える付記1から付記12のいずれか一項に記載の冷却装置。
(付記14)
複数の前記輸送部と前記容器の底板との間に液相の前記冷媒が流れる流路を成すように前記輸送部が配置されている付記13に記載の冷却装置。
(付記15)
前記容器の天板と底板との間に配置されて前記天板と前記底板の間隔を維持する支柱を有する付記1から付記14のいずれか一項に記載の冷却装置。
(付記16)
前記輸送部を前記容器に固定する固定具を有する付記1から付記15のいずれか一項に記載の冷却装置。
(付記17)
前記凝縮部が、前記容器の天板から前記容器の内側に突出する突起を有する付記1から付記16のいずれか一項に記載の冷却装置。
(付記18)
前記容器に設けられ、前記容器を冷却対象に固定するための締結具が挿通される締結孔を有する付記1から付記17のいずれか一項に記載の冷却装置。
(付記19)
前記容器に接触され前記容器の熱を外部に放出するフィンを有する付記1から付記18のいずれか一項に記載の冷却装置。
(付記20)
前記容器に設けられ前記冷媒を前記容器に注入するための注入孔と、
前記注入孔を封止する栓と、
を有する付記1から付記19のいずれか一項に記載の冷却装置。
34 基板
36、38 素子
42 冷却装置
44 容器
44S 側壁
46 受熱部
48 放熱部
50 接続部
52 底板
54 天板
56 支柱
58 開口
60 受熱板
62 蒸発部
64 柱部材
66 溝部
68 拡散領域
72 凝縮部
74 移動領域
76 突起
78 輸送パイプ
78A 一端部分
78B 他端部分
80 空間
82A 傾斜部
82B 第二傾斜部
82T 傾斜面
84A 隙間
84B 第二隙間
86 固定具
86A 嵌込部
86B 押付部
86C 側面部
88 締結孔
90 フィン
92 注入孔
94 栓
96 注入パイプ
202 冷却装置
204 網部材
302 冷却装置
304 凹部
306A 壁部
306B 第二壁部
Claims (9)
- 冷媒が密封された容器と、
前記容器の内部で液相の前記冷媒を受熱により蒸発させる蒸発部と、
前記容器の内部で気相の前記冷媒を放熱により凝縮させる凝縮部と、
前記容器の内部で液相の前記冷媒を毛細管現象により前記蒸発部に輸送する管状の輸送部と、
前記輸送部と前記蒸発部の間に液相の前記冷媒が前記輸送部から前記蒸発部に移動する隙間を生じさせる隙間部と、
を有する冷却装置。 - 前記蒸発部が、前記輸送部の内径よりも狭い溝幅の溝部を成す複数の柱部材を備え、
前記輸送部の一端部分が前記隙間を生じた状態で前記柱部材に対向している請求項1に記載の冷却装置。 - 前記隙間部が前記輸送部に設けられる請求項2に記載の冷却装置。
- 前記隙間部が前記輸送部の前記一端部分を前記輸送部の長手方向に対し傾斜させた傾斜部である請求項3に記載の冷却装置。
- 前記傾斜部が、前記蒸発部から離間するにしたがって互いに接近するように対で設けられる傾斜面を有する請求項4に記載の冷却装置。
- 前記隙間部が、前記輸送部及び前記蒸発部と別体である請求項2に記載の冷却装置。
- 前記隙間部が、前記輸送部と前記蒸発部との間に配設される網部材である請求項6に記載の冷却装置。
- 前記隙間部が、前記容器に設けられている請求項2に記載の冷却装置。
- 前記容器に、前記輸送部を収容する凹部が設けられ、
前記隙間部が、前記凹部において前記一端部分と対向する壁部として設けられている請求項8に記載の冷却装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020091716A JP7452253B2 (ja) | 2020-05-26 | 2020-05-26 | 冷却装置 |
US17/181,737 US20210372707A1 (en) | 2020-05-26 | 2021-02-22 | Cooling device |
Applications Claiming Priority (1)
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---|---|---|---|
JP2020091716A JP7452253B2 (ja) | 2020-05-26 | 2020-05-26 | 冷却装置 |
Publications (2)
Publication Number | Publication Date |
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JP2021190479A true JP2021190479A (ja) | 2021-12-13 |
JP7452253B2 JP7452253B2 (ja) | 2024-03-19 |
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JP2020091716A Active JP7452253B2 (ja) | 2020-05-26 | 2020-05-26 | 冷却装置 |
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US (1) | US20210372707A1 (ja) |
JP (1) | JP7452253B2 (ja) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006503436A (ja) * | 2002-10-16 | 2006-01-26 | エルジー ケーブル リミテッド | 板型熱伝達装置及びその製造方法 |
JP2010151353A (ja) * | 2008-12-24 | 2010-07-08 | Sony Corp | 熱輸送デバイス、電子機器及び熱輸送デバイスの製造方法 |
JP2016219575A (ja) * | 2015-05-19 | 2016-12-22 | Apsジャパン株式会社 | ヒートシンク |
JP6647439B1 (ja) * | 2019-04-18 | 2020-02-14 | 古河電気工業株式会社 | ヒートシンク |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4640347A (en) * | 1984-04-16 | 1987-02-03 | Q-Dot Corporation | Heat pipe |
TW551612U (en) * | 2002-07-26 | 2003-09-01 | Tai Sol Electronics Co Ltd | Piercing type IC heat dissipating device |
CN101093151B (zh) * | 2006-06-21 | 2010-04-14 | 富准精密工业(深圳)有限公司 | 热管 |
US20090040726A1 (en) * | 2007-08-09 | 2009-02-12 | Paul Hoffman | Vapor chamber structure and method for manufacturing the same |
US20110297355A1 (en) * | 2010-06-07 | 2011-12-08 | Celsia Technologies Taiwan, Inc. | Heat-conducting module and heat-dissipating device having the same |
US9315280B2 (en) * | 2012-11-20 | 2016-04-19 | Lockheed Martin Corporation | Heat pipe with axial wick |
-
2020
- 2020-05-26 JP JP2020091716A patent/JP7452253B2/ja active Active
-
2021
- 2021-02-22 US US17/181,737 patent/US20210372707A1/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006503436A (ja) * | 2002-10-16 | 2006-01-26 | エルジー ケーブル リミテッド | 板型熱伝達装置及びその製造方法 |
JP2010151353A (ja) * | 2008-12-24 | 2010-07-08 | Sony Corp | 熱輸送デバイス、電子機器及び熱輸送デバイスの製造方法 |
JP2016219575A (ja) * | 2015-05-19 | 2016-12-22 | Apsジャパン株式会社 | ヒートシンク |
JP6647439B1 (ja) * | 2019-04-18 | 2020-02-14 | 古河電気工業株式会社 | ヒートシンク |
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US20210372707A1 (en) | 2021-12-02 |
JP7452253B2 (ja) | 2024-03-19 |
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