JP2021174906A - Electronic apparatus - Google Patents

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JP2021174906A
JP2021174906A JP2020078597A JP2020078597A JP2021174906A JP 2021174906 A JP2021174906 A JP 2021174906A JP 2020078597 A JP2020078597 A JP 2020078597A JP 2020078597 A JP2020078597 A JP 2020078597A JP 2021174906 A JP2021174906 A JP 2021174906A
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circuit board
insulator
heat
contact
heat radiating
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正実 水越
Masami Mizukoshi
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NEC Platforms Ltd
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NEC Platforms Ltd
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Abstract

To promote heat dissipation of a circuit board on which an electronic component having heat generation is mounted.SOLUTION: A circuit pattern 2 is formed by a conductor on the surface of a base material 1. A through insulator 4 is provided that penetrates from one surface to the other surface of a first circuit board 3 having the base material 1 and the circuit pattern 2, conducts heat from the one surface to the other surface, and comes into contact with the circuit pattern 2 at a portion that penetrates the first circuit board 3. The through insulator 4 is formed of an electrically insulating material having higher thermal conductivity than the base material 1.SELECTED DRAWING: Figure 1

Description

本発明は、放熱装置および電子機器に関する。 The present invention relates to a heat radiating device and an electronic device.

電子機器の高密度化に伴い、あるいは、電子機器の高負荷での動作を考慮して、より高い放熱性能が求められている。また、発熱するＩＣチップから放熱する手段としてヒートシンクがあるが、ヒートシンクという表面積の大きな部品を設置するためのスペースを回路基板上に確保することが必要であった。従って省スペース化が必要なシステムでは、ヒートシンクの配置に必要なスペースの確保が困難であった。 Higher heat dissipation performance is required as the density of electronic devices increases, or in consideration of the operation of electronic devices under high load. Further, although there is a heat sink as a means for dissipating heat from the heat-generating IC chip, it is necessary to secure a space on the circuit board for installing a component having a large surface area called a heat sink. Therefore, in a system that requires space saving, it is difficult to secure the space required for arranging the heat sink.

回路基板に搭載された発熱部品の冷却に関連する技術として、特許文献１〜３が知られている。
特許文献１には、回路基板を貫通するスルーホールーホールを経由して放熱する技術が開示されている。
特許文献２には、熱伝導性の高い金属材料により構成された冷却部材を回路基板に貫通させて放熱する技術が開示されている。
特許文献３には、回路基板よりも熱伝導率の高い冷却フレーム（冷却部材）を回路基板に貫通させて放熱する技術が開示されている。 Patent Documents 1 to 3 are known as techniques related to cooling of heat-generating components mounted on a circuit board.
Patent Document 1 discloses a technique for dissipating heat via a through hole-hole penetrating a circuit board.
Patent Document 2 discloses a technique of penetrating a cooling member made of a metal material having high thermal conductivity through a circuit board to dissipate heat.
Patent Document 3 discloses a technique in which a cooling frame (cooling member) having a higher thermal conductivity than that of a circuit board is penetrated through the circuit board to dissipate heat.

特開２００２−１１８３８４号公報JP-A-2002-118384 特開２０１３−１２３０１１号公報Japanese Unexamined Patent Publication No. 2013-12301 特開２０１３−２１１３６９号公報Japanese Unexamined Patent Publication No. 2013-21139

しかしながら、特許文献１の技術は、単にスルーホールを経由した熱伝導の構造を開示するに過ぎず、より高い熱伝導を実現するための具体的な構成を開示するものではない。
また特許文献２の技術は、冷却部材を構成する金属材料が電気伝導体であるため、回路基板上の電子部品や回路パターンとの電気的な絶縁を考慮することが必要となり、例えば、冷却部材を回避して回路パターンを設計する等、回路設計上の制約となることがある。また、熱伝導性を考慮して発熱体としての電子部品に密着して配置しようとすると、電子部品との間を電気的に絶縁するための絶縁体を設けることが必要となる。
また特許文献３の技術は、単に熱伝導性の高い冷却部材を設ける構成を開示するにすぎず、いかなる材料をいかなる構造を採用して効果的な放熱を実現するかを開示するものではない。 However, the technique of Patent Document 1 merely discloses the structure of heat conduction via the through hole, and does not disclose a specific configuration for realizing higher heat conduction.
Further, in the technique of Patent Document 2, since the metal material constituting the cooling member is an electric conductor, it is necessary to consider electrical insulation from electronic parts and circuit patterns on the circuit board. For example, the cooling member It may be a restriction on the circuit design, such as designing the circuit pattern while avoiding the above. Further, in order to arrange the heating element in close contact with the electronic component in consideration of thermal conductivity, it is necessary to provide an insulator for electrically insulating the electronic component.
Further, the technique of Patent Document 3 merely discloses a configuration in which a cooling member having high thermal conductivity is provided, and does not disclose what kind of material is adopted and what kind of structure is used to realize effective heat dissipation.

この発明は、回路基板に搭載された発熱部品を効果的に放熱することができる装置を提供することを目的とする。 An object of the present invention is to provide an apparatus capable of effectively dissipating heat from heat-generating components mounted on a circuit board.

上記課題を解決するために、この発明は以下の手段を提案している。
本発明の放熱装置は、電気絶縁性を有する基材と、この基材の表面に導体により形成された回路パターンとを有する第１の回路基板と、この第１の回路基板の一方の面から他方の面へ貫通して設けられ、一方の面から他方の面へ熱伝導するとともに、前記第１の回路基板を貫通する部分で前記回路パターンに接触する貫通絶縁体とを有し、前記貫通絶縁体は、前記基材より熱伝導性が高い電気絶縁性材料により形成されたことを特徴とする。 In order to solve the above problems, the present invention proposes the following means.
The heat radiating device of the present invention comprises a first circuit board having an electrically insulating base material and a circuit pattern formed by a conductor on the surface of the base material, and one surface of the first circuit board. It is provided so as to penetrate the other surface, conducts heat from one surface to the other surface, and has a through insulator that contacts the circuit pattern at a portion that penetrates the first circuit board, and has the penetration. The insulator is characterized in that it is formed of an electrically insulating material having a higher thermal conductivity than the base material.

本発明によれば、回路基板に搭載された発熱部品を効果的に放熱することができる。 According to the present invention, heat-generating components mounted on a circuit board can be effectively dissipated.

本発明の最小構成例の放熱装置の回路基板と直交する方向の矢視図である。It is an arrow view of the direction orthogonal to the circuit board of the heat dissipation device of the minimum configuration example of this invention. 本発明の第１実施形態の放熱装置の回路基板と直交する方向の矢視図である。It is an arrow view of the direction orthogonal to the circuit board of the heat dissipation device of the 1st Embodiment of this invention. 本発明の第２実施形態の放熱装置の回路基板と直交する方向の矢視図である。It is an arrow view of the direction orthogonal to the circuit board of the heat dissipation device of the 2nd Embodiment of this invention.

本発明に係る放熱装置の最小構成について図１を参照して説明する。
符号１は絶縁体により構成された基材である。この基材１の表面には、導体により回路パターン２が形成されている。これら基材１と回路パターン２とを有する第１の回路基板３の一方の面から他方の面へ貫通して、前記一方の面から他方の面へ熱伝導するとともに、前記第１の回路基板３を貫通する部分で前記回路パターン２に接触する貫通絶縁体４が設けられている。前記貫通絶縁体４は、前記基材１より熱伝導性が高い電気絶縁性材料により形成されている。 The minimum configuration of the heat radiating device according to the present invention will be described with reference to FIG.
Reference numeral 1 is a base material composed of an insulator. A circuit pattern 2 is formed by a conductor on the surface of the base material 1. The first circuit board 3 having the base material 1 and the circuit pattern 2 penetrates from one surface to the other surface, conducts heat from the one surface to the other surface, and conducts heat from the first surface to the other surface. A penetrating insulator 4 that comes into contact with the circuit pattern 2 is provided at a portion penetrating the circuit pattern 2. The through insulator 4 is formed of an electrically insulating material having a higher thermal conductivity than the base material 1.

上記構成の放熱装置は、例えば前記貫通絶縁体４の一端（例えば、第１の回路基板３の一方の面から突出する端部）を図示しない電子部品等の発熱体に接触させることで、前記発熱体から熱伝導された熱を前記第１の回路基板３の他方の面へ熱伝導するとともに、第１の回路基板３を貫通する箇所で前記回路パターン２を構成する金属等の導体に接触し、回路パターン２へも熱伝導する。この結果、前記発熱体から前記貫通絶縁体４へ伝導された熱が回路パターン２、および、第１の回路基板３の他方の面へ伝導され、これらの経路を介して放熱される。 In the heat radiating device having the above configuration, for example, one end of the through insulator 4 (for example, the end protruding from one surface of the first circuit board 3) is brought into contact with a heating element such as an electronic component (not shown). The heat conducted from the heating element is thermally conducted to the other surface of the first circuit board 3, and at a point penetrating the first circuit board 3, it comes into contact with a conductor such as metal constituting the circuit pattern 2. It also conducts heat to the circuit pattern 2. As a result, the heat conducted from the heating element to the through insulator 4 is conducted to the other surfaces of the circuit pattern 2 and the first circuit board 3, and is dissipated through these paths.

図１の放熱装置を具体化した本発明の第１実施形態に係る構成について図２を参照して説明する。なお、図２中、図１と共通の構成要素には同一符号を付し、説明を簡略化する。
図２は、第１実施形態の放熱装置を有する電子機器を示すものである。
この第１実施形態の第１の回路基板３Ａは、電気絶縁性樹脂等により構成された基材１と、銅等の導体層にエッチング、トリミング等の処理を施して形成された回路パターン２とを交互に複数層にわたって積層した構造を有する。
最上部の回路パターン２の上には、例えば半導体チップである電子部品５が実装されている。この電子部品５の底面には、電子部品５の内部の回路と接続された端子導体６が複数設けられていて、はんだリフロー処理等により、前記回路パターン２の所定の接続点と電気的に接続されている。 The configuration according to the first embodiment of the present invention embodying the heat dissipation device of FIG. 1 will be described with reference to FIG. In FIG. 2, the same components as those in FIG. 1 are designated by the same reference numerals to simplify the description.
FIG. 2 shows an electronic device having the heat radiating device of the first embodiment.
The first circuit board 3A of the first embodiment has a base material 1 made of an electrically insulating resin or the like, and a circuit pattern 2 formed by subjecting a conductor layer such as copper to a process such as etching or trimming. Has a structure in which is alternately laminated over a plurality of layers.
For example, an electronic component 5 which is a semiconductor chip is mounted on the uppermost circuit pattern 2. A plurality of terminal conductors 6 connected to the circuit inside the electronic component 5 are provided on the bottom surface of the electronic component 5, and are electrically connected to a predetermined connection point of the circuit pattern 2 by solder reflow processing or the like. Has been done.

貫通絶縁体４は、少なくとも、前記基材１より熱伝導性が高い電気絶縁性材料で形成されるもので、例えば、窒化アルミニウム、窒化珪素、アルミナ等のいわゆるファインセラミックスが好適である。また貫通絶縁体４は、電気絶縁性が高く、熱伝導性が高いのみならず、できるだけ誘電率が低いことが望ましい。 The through insulator 4 is formed of at least an electrically insulating material having a higher thermal conductivity than the base material 1, and for example, so-called fine ceramics such as aluminum nitride, silicon nitride, and alumina are suitable. Further, it is desirable that the through insulator 4 not only has high electrical insulation and high thermal conductivity, but also has a low dielectric constant as much as possible.

前記第１の回路基板３Ａの一方の面（電子部品５が実装された面）から他方の面へ貫通して設けられ、他方の面から突出した先端部には、筐体７が接触している。前記貫通絶縁体４の第１の回路基板３Ａを貫通する個所にあっては、第１の回路基板３Ａと密着させて熱伝導性をできるだけ高くする目的から、貫通個所の内面にできるだけ緊密に接触させること、あるいは、貫通個所に熱伝導性が良好な油脂、樹脂等の充填材を充填して熱伝導性の低下を最小限とすることが望ましい。 The housing 7 is provided so as to penetrate from one surface (the surface on which the electronic component 5 is mounted) of the first circuit board 3A to the other surface, and the housing 7 comes into contact with the tip portion protruding from the other surface. There is. At the portion of the penetrating insulator 4 that penetrates the first circuit board 3A, it contacts the inner surface of the penetrating portion as closely as possible for the purpose of bringing it into close contact with the first circuit board 3A and increasing the thermal conductivity as much as possible. It is desirable that the penetrating portion is filled with a filler such as oil or resin having good thermal conductivity to minimize the decrease in thermal conductivity.

前記筐体７は、実施形態の場合、熱伝導性の良好な鋼、アルミニウム等の金属で形成されていて、かつ、所定の表面積を有することから、電子機器が存在する領域の大気中へ熱を拡散させる放熱部としての機能を有する。なお、筐体７に放熱フィン等の表面積の大きな部材をさらに設けるようにしても良い。 In the case of the embodiment, the housing 7 is made of a metal such as steel or aluminum having good thermal conductivity and has a predetermined surface area. Therefore, the housing 7 heats into the atmosphere in a region where an electronic device exists. It has a function as a heat radiating part that diffuses. The housing 7 may be further provided with a member having a large surface area such as heat radiation fins.

上記構成の放熱装置を有する電子機器にあっては、電子部品５の下面に貫通絶縁体４が接触しているから、貫通絶縁体４が存在する範囲では、当該接触部分を第１の回路基板３Ａの最上部の回路パターン２に対して絶縁することができるとともに、該接触個所から、図２に矢印Ａで示すように、電子部品５で発生した熱を熱伝導することができる。また貫通絶縁体４は、第１の回路基板３Ａを貫通する個所で各層の前記回路パターン２と接触しているので、前記電子部品５からの熱が各層の回路パターン２へ熱伝導し、さらに、回路パターン２を構成する金属を熱伝導して、回路パターン２の面方向に沿って全体に熱伝導する。 In the electronic device having the heat radiating device having the above configuration, since the penetrating insulator 4 is in contact with the lower surface of the electronic component 5, the contact portion is referred to as the first circuit board within the range where the penetrating insulator 4 exists. It can be insulated from the uppermost circuit pattern 2 of 3A, and heat generated by the electronic component 5 can be thermally conducted from the contact point as shown by an arrow A in FIG. Further, since the penetrating insulator 4 is in contact with the circuit pattern 2 of each layer at a portion penetrating the first circuit board 3A, heat from the electronic component 5 is thermally conducted to the circuit pattern 2 of each layer, and further. , The metal constituting the circuit pattern 2 is thermally conducted, and the metal constituting the circuit pattern 2 is thermally conducted as a whole along the plane direction of the circuit pattern 2.

すなわち、回路パターン２の大気と接触する面が放熱面となるため、大きな放熱面積を得ることができる。また前記貫通絶縁体４は、電気絶縁性材料により形成されているため、各層の回路パターン２が貫通絶縁体４との接触によって電気的に導通されることがない。 That is, since the surface of the circuit pattern 2 that comes into contact with the atmosphere becomes the heat dissipation surface, a large heat dissipation area can be obtained. Further, since the through insulator 4 is formed of an electrically insulating material, the circuit pattern 2 of each layer is not electrically conducted by contact with the through insulator 4.

さらに、前記貫通絶縁体４の下端は、回路基板３Ａの下面から下方へ突出して筐体７に接触していることから、前記電子部品５の熱が前記筐体７へ熱伝導し、さらに筐体７の面方向へ熱伝導して大気中に放熱される。 Further, since the lower end of the through insulator 4 projects downward from the lower surface of the circuit board 3A and is in contact with the housing 7, the heat of the electronic component 5 is thermally conducted to the housing 7, and the housing is further provided. Heat is conducted in the direction of the surface of the body 7 and radiated into the atmosphere.

本発明の第２実施形態に係る構成について図３を参照して説明する。なお、図３中、図１、２と共通の構成要素には同一符号を付し、説明を簡略化する。
図３は、例えば、Ｍ２規格のコネクタを搭載した電子機器に適用した場合の第２実施形態の放熱装置を有する電子機器を示すものである。
この第２実施形態の第１の回路基板３Ｂは、前記第１実施形態の第１の回路基板３Ａと同様に、電気絶縁性樹脂等により構成された基材１と、銅等の導体層にエッチング、トリミング等の処理を施して形成された回路パターン２とを交互に複数層にわたって積層した構造を有する。また第１の回路基板３Ｂの上面には、第１の回路基板３Ｂ上の回路を外部の機器に接続するための、Ｍ２規格等の所定規格のコネクタ８が搭載されている。 The configuration according to the second embodiment of the present invention will be described with reference to FIG. In FIG. 3, the same components as those in FIGS. 1 and 2 are designated by the same reference numerals to simplify the description.
FIG. 3 shows, for example, an electronic device having a heat radiating device of the second embodiment when applied to an electronic device equipped with an M2 standard connector.
Similar to the first circuit board 3A of the first embodiment, the first circuit board 3B of the second embodiment is formed on a base material 1 made of an electrically insulating resin or the like and a conductor layer of copper or the like. It has a structure in which circuit patterns 2 formed by undergoing processing such as etching and trimming are alternately laminated over a plurality of layers. Further, on the upper surface of the first circuit board 3B, a connector 8 having a predetermined standard such as the M2 standard for connecting the circuit on the first circuit board 3B to an external device is mounted.

この第１の回路基板３Ｂには、貫通絶縁体４Ａが貫通している。この貫通絶縁体４Ａは、前記第１実施形態の貫通絶縁体４より長さが大きく、第１の回路基板３Ｂの下面からの突出量がより大きい。前記貫通絶縁体４Ａの突出部は、さらに、第２の回路基板３Ｃを貫通して、第２の回路基板３Ｃの下面から突出している。 A through insulator 4A penetrates the first circuit board 3B. The through insulator 4A has a larger length than the through insulator 4 of the first embodiment, and the amount of protrusion from the lower surface of the first circuit board 3B is larger. The protruding portion of the penetrating insulator 4A further penetrates the second circuit board 3C and protrudes from the lower surface of the second circuit board 3C.

前記貫通絶縁体４Ａは、前記第１の回路基板３Ｂの一方の面（電子部品５が実装された面）から他方の面へ貫通して設けられ、さらに、第２の回路基板３Ｃを貫通して、他方の面から突出して、筐体７に接触している。前記貫通絶縁体４の第１の回路基板３Ｂを貫通する個所、および第２の回路基板３Ｃを貫通する個所は、前記回路パターン２と密着させて熱伝導性をできるだけ高くする目的から、貫通個所の内面にできるだけ緊密に接触させること、あるいは、貫通個所に熱伝導性が良好な油脂、樹脂等の充填材を介在させることによって、熱伝導性の低下を最小限とすることが望ましい。 The penetrating insulator 4A is provided so as to penetrate from one surface (the surface on which the electronic component 5 is mounted) of the first circuit board 3B to the other surface, and further penetrates the second circuit board 3C. It protrudes from the other surface and is in contact with the housing 7. The portion of the penetrating insulator 4 that penetrates the first circuit board 3B and the portion that penetrates the second circuit board 3C are the portions that penetrate the circuit board 3C for the purpose of bringing them into close contact with the circuit pattern 2 to increase the thermal conductivity as much as possible. It is desirable to minimize the decrease in thermal conductivity by bringing the inner surface into contact with the inner surface as closely as possible, or by interposing a filler such as oil or resin having good thermal conductivity in the penetrating portion.

上記構成の放熱装置を有する電子機器にあっては、電子部品５の下面に接点導体等としての金属が存在している場合であっても、貫通絶縁体４Ａが接触しているから、当該接触部分を第１の回路基板３Ｂの最上部の回路パターン２に対して絶縁することができるとともに、該接触個所から、図３に矢印Ａで示すように、電子部品５で発生した熱を熱伝導させることができる。
また貫通絶縁体４Ａは、第１の回路基板３Ｂを貫通する個所で各層の前記回路パターン２と接触しているので、前記電子部品５からの熱を各層の回路パターン２へ熱伝導する。さらに、貫通絶縁体４Ａは、第２の回路基板３Ｃを貫通する個所で各層の前記回路パターン２と接触しているので、前記電子部品５からの熱を各層の回路パターン２を構成する金属へ熱伝導して、回路パターン２の面方向に沿って全体に拡散することができる。 In an electronic device having the heat radiating device having the above configuration, even if a metal such as a contact conductor is present on the lower surface of the electronic component 5, the penetrating insulator 4A is in contact with the electronic device. The portion can be insulated from the uppermost circuit pattern 2 of the first circuit board 3B, and the heat generated by the electronic component 5 is thermally conducted from the contact portion as shown by an arrow A in FIG. Can be made to.
Further, since the penetrating insulator 4A is in contact with the circuit pattern 2 of each layer at a portion penetrating the first circuit board 3B, heat from the electronic component 5 is thermally conducted to the circuit pattern 2 of each layer. Further, since the penetrating insulator 4A is in contact with the circuit pattern 2 of each layer at a portion penetrating the second circuit board 3C, the heat from the electronic component 5 is transferred to the metal constituting the circuit pattern 2 of each layer. It can conduct heat and diffuse throughout along the plane direction of the circuit pattern 2.

さらに、前記貫通絶縁体４Ａの下端は、回路基板３Ｃの下面から下方へ突出して筐体７に接触していることから、前記電子部品５の熱が前記筐体７へ熱伝導し、さらに筐体７の面方向へ熱伝導して大気中に放熱される。 Further, since the lower end of the penetrating insulator 4A projects downward from the lower surface of the circuit board 3C and is in contact with the housing 7, the heat of the electronic component 5 is thermally conducted to the housing 7, and the housing is further provided. Heat is conducted in the direction of the surface of the body 7 and radiated into the atmosphere.

上記実施形態の貫通絶縁体は、熱伝導性を考慮して、横断面の面積が大きい中実構造とすることが望ましいが、軽量化、変形性を考慮して中空状としても良い。また、全体をセラミックにより構成するに限らず、金属によりしてその表面の一部（回路パターン等、電気的に絶縁することが必要な接触個所）に絶縁性材料による被覆を設ける構成であっても良い。
貫通絶縁体と電子部品との接触は、電子部品内部の発熱個所に最も近い部位としても良い。すなわち、第１の回路基板が回路基板を貫通する個所を電子部品の発熱領域に対応して異なる位置にずらして発熱個所からの熱伝導を促進する配置としても良い。また、電子部品、筐体との接触個所の形状を変更して接触面積を大きくしても良い。 The through insulator of the above embodiment preferably has a solid structure having a large cross-sectional area in consideration of thermal conductivity, but may be hollow in consideration of weight reduction and deformability. Further, the entire surface is not limited to ceramic, but a part of the surface (contact points such as circuit patterns that need to be electrically insulated) is covered with an insulating material by metal. Is also good.
The contact between the penetrating insulator and the electronic component may be the portion closest to the heat generating portion inside the electronic component. That is, the location where the first circuit board penetrates the circuit board may be shifted to a different position corresponding to the heat generation region of the electronic component to promote heat conduction from the heat generation portion. Further, the contact area may be increased by changing the shape of the contact portion with the electronic component or the housing.

貫通絶縁体が貫通する回路基板の数、あるいは、回路基板を構成する基材、導体パターンの積層数は、上記実施形態に限定されるものではなく、これより多数、あるいは少数であっても良い。
なお、貫通絶縁体の配置は、回路基板の配線パターンに応じて、例えば、より多くの配線パターンと接触して接触面積を多くすることが望ましい。 The number of circuit boards through which the penetrating insulator penetrates, or the number of layers of the base materials and conductor patterns constituting the circuit board is not limited to the above embodiment, and may be larger or smaller than this. ..
It is desirable that the through insulator is arranged in contact with, for example, more wiring patterns to increase the contact area according to the wiring pattern of the circuit board.

以上、本発明の実施形態について図面を参照して詳述したが、具体的な構成はこの実施形態に限られるものではなく、本発明の要旨を逸脱しない範囲の設計変更等も含まれる。 Although the embodiments of the present invention have been described in detail with reference to the drawings, the specific configuration is not limited to this embodiment, and design changes and the like within a range not deviating from the gist of the present invention are also included.

本発明は、放熱装置および放熱装置を備えた電子機器に利用することができる。 The present invention can be applied to a heat radiating device and an electronic device provided with the heat radiating device.

１ 基材
２ 回路パターン
３、３Ａ、３Ｂ （第１の）回路基板
３Ｃ （第２の）回路基板
４ 貫通絶縁体
５ 電子部品
６ 端子導体
７ 筐体（放熱部）
８ コネクタ 1 Base material 2 Circuit pattern 3, 3A, 3B (1st) circuit board 3C (2nd) circuit board 4 Penetrating insulator 5 Electronic component 6 Terminal conductor 7 Housing (heat dissipation part)
8 connector

Claims (9)

電気絶縁性を有する基材と、この基材の表面に導体により形成された回路パターンとを有する第１の回路基板と、
この第１の回路基板の一方の面から他方の面へ貫通して設けられ、一方の面から他方の面へ熱伝導するとともに、この第１の回路基板を貫通する部分で前記回路パターンに接触する貫通絶縁体と、
を有し、
前記貫通絶縁体は、前記基材より熱伝導性が高い電気絶縁性材料により形成された、
放熱装置。 A first circuit board having an electrically insulating base material and a circuit pattern formed by a conductor on the surface of the base material,
It is provided so as to penetrate from one surface of the first circuit board to the other surface, conduct heat from one surface to the other surface, and come into contact with the circuit pattern at a portion penetrating the first circuit board. Through insulation and
Have,
The through insulator is formed of an electrically insulating material having a higher thermal conductivity than the base material.
Heat dissipation device. 前記貫通絶縁体は、中実状に構成された、
請求項１に記載の放熱装置。 The penetrating insulator was constructed in a solid state.
The heat radiating device according to claim 1. 前記貫通絶縁体は、アルミナ、窒化ケイ素、窒化アルミニウムのいずれかの材料により構成された、
請求項１または２のいずれか１項に記載の放熱装置。 The through insulator is made of any material of alumina, silicon nitride, and aluminum nitride.
The heat radiating device according to any one of claims 1 or 2. 前記貫通絶縁体は、前記第１の回路基板の一方の面で発熱体に接触する、
請求項１〜３のいずれか１項に記載の放熱装置。 The through insulator contacts the heating element on one surface of the first circuit board.
The heat radiating device according to any one of claims 1 to 3. 前記貫通絶縁体は、前記第１の回路基板の他方の面で放熱体に接触する、
請求項１〜４のいずれか１項に記載の放熱装置。 The through insulator contacts the radiator on the other surface of the first circuit board.
The heat radiating device according to any one of claims 1 to 4. 前記第１の回路基板の他方に面の側に設けられ、電気絶縁性を有する基材と、この基材の表面に導体により形成された回路パターンとを有する第２の回路基板をさらに有し、
前記貫通絶縁体は、さらに前記第２の回路基板を貫通して、かつ、該第２の回路基板の回路パターンと接触して設けられた、
請求項１〜５のいずれか１項に記載の放熱装置。 Further having a second circuit board provided on the other side of the first circuit board on the surface side and having an electrically insulating base material and a circuit pattern formed by a conductor on the surface of the base material. ,
The penetrating insulator is further provided so as to penetrate the second circuit board and in contact with the circuit pattern of the second circuit board.
The heat radiating device according to any one of claims 1 to 5. 請求項１〜５のいずれか１項に記載の放熱装置と、
前記第１の回路基板の他方の面に前記貫通絶縁体に接触させて設けられて、前記第１の回路基板を収容する筐体と、
を有する電子機器。 The heat radiating device according to any one of claims 1 to 5,
A housing provided on the other surface of the first circuit board in contact with the through insulator and accommodating the first circuit board.
Electronic equipment with. 請求項６に記載の放熱装置と、
前記第２の回路基板の他方の面に前記貫通絶縁体に接触させて設けられて、前記第１の回路基板を収容する筐体と、
を有する電子機器。 The heat radiating device according to claim 6 and
A housing provided on the other surface of the second circuit board in contact with the through insulator and accommodating the first circuit board.
Electronic equipment with. 請求項１〜６のいずれか１項に記載の放熱装置と、
前記第１の回路基板の一方の面に前記貫通絶縁体に接触させて設けられた電子部品と、
を有する電子機器。

The heat radiating device according to any one of claims 1 to 6,
An electronic component provided on one surface of the first circuit board in contact with the through insulator, and
Electronic equipment with.
JP2020078597A 2020-04-27 2020-04-27 Electronic apparatus Pending JP2021174906A (en)

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* Cited by examiner, † Cited by third party
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JPH0733514A (en) * 1993-07-19 1995-02-03 Nippondenso Co Ltd Alumina substrate and multi-layered substrate using the same
JPH08148839A (en) * 1994-11-21 1996-06-07 Nippondenso Co Ltd Hybrid integrated circuit device
JP2015018857A (en) * 2013-07-09 2015-01-29 三菱電機株式会社 High heat dissipation substrate, heat dissipation structure of component
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JP2018133382A (en) * 2017-02-14 2018-08-23 三菱電機株式会社 Semiconductor package
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JP2018201324A (en) * 2017-05-17 2018-12-20 ジョンソン エレクトリック ソシエテ アノニム Motor, circuit board, and engine cooling module including motor
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