JP2021173853A - Package, optical device, and optical module - Google Patents

Package, optical device, and optical module Download PDF

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JP2021173853A
JP2021173853A JP2020077018A JP2020077018A JP2021173853A JP 2021173853 A JP2021173853 A JP 2021173853A JP 2020077018 A JP2020077018 A JP 2020077018A JP 2020077018 A JP2020077018 A JP 2020077018A JP 2021173853 A JP2021173853 A JP 2021173853A
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Prior art keywords
translucent substrate
optical
package
wiring board
substrate
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宏和 保坂
Hirokazu Hosaka
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Kyocera Corp
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Kyocera Corp
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Abstract

To provide a package for an optical device that can reduce variations in relative position between a light guide component connected from the outside and an optical component mounted on the package, an optical device, and an optical module.SOLUTION: A package (1) and an optical device (50) comprise: a wiring board (10) that has a through hole (13); and a translucent substrate (20) that is joined to the wiring board (10) and covers the through hole (13). The package and the optical device have a mounting part (R) for an optical component (60) on the translucent substrate (20). An optical module (100) comprises: the above-described optical device (50); and a substrate for a module (110).SELECTED DRAWING: Figure 1

Description

本開示は、パッケージ、光学装置及び光学モジュールに関する。 The present disclosure relates to packages, optics and optical modules.

特許文献１には、貫通孔を有する基板に光学素子が搭載された光通信モジュールが記載されている。上記の貫通孔には光ファイバーなどの導光部品が固定され、導光部品を介して光学素子へ信号光が送られる。あるいは、光学素子から出射された信号光が導光部品を介して外部へ出力される。 Patent Document 1 describes an optical communication module in which an optical element is mounted on a substrate having a through hole. A light guide component such as an optical fiber is fixed to the through hole, and signal light is sent to the optical element via the light guide component. Alternatively, the signal light emitted from the optical element is output to the outside via the light guide component.

特開２００４−３２５９３９号公報Japanese Unexamined Patent Publication No. 2004-325939

光を通過させる貫通孔を有する基板を含んだ光学装置用のパッケージにおいては、貫通孔に対応して配置が調整される導光部材と、パッケージに収容される光学部品との相対位置のバラツキを低減することが要求される。 In a package for an optical device including a substrate having a through hole for passing light, the relative position of the light guide member whose arrangement is adjusted according to the through hole and the optical component housed in the package varies. It is required to reduce.

本開示は、外部から接続される導光部品と、パッケージに搭載される光学部品との相対位置のバラツキを低減できる光学装置用のパッケージ、光学装置、並びに、光学モジュールを提供することを目的とする。 An object of the present disclosure is to provide a package, an optical device, and an optical module for an optical device capable of reducing a variation in the relative position between a light guide component connected from the outside and an optical component mounted on the package. do.

本開示に係るパッケージは、
貫通孔を有する配線基板と、
前記配線基板に接合され、前記貫通孔を覆う透光性基板と、
を備え、
前記透光性基板上に光学部品の搭載部を有する。 The package pertaining to this disclosure is
A wiring board with through holes and
A translucent substrate that is joined to the wiring board and covers the through hole,
With
An optical component mounting portion is provided on the translucent substrate.

本開示に係る光学装置は、
上記のパッケージと、
前記搭載部に搭載された光学部品と、
を備える。 The optical device according to the present disclosure is
With the above package
The optical components mounted on the mounting part and
To be equipped.

本開示に係る光学モジュールは、
上記の光学装置と、
前記光学装置が搭載されたモジュール用基板と、
を備える。 The optical module according to the present disclosure is
With the above optics
A module substrate on which the optical device is mounted and
To be equipped.

本開示によれば、外部から接続される導光部品と、パッケージに搭載される光学部品との相対位置のバラツキを低減できる光学装置用のパッケージ、光学装置、並びに、光学モジュールを提供できるという効果が得られる。 According to the present disclosure, it is possible to provide a package, an optical device, and an optical module for an optical device that can reduce the variation in the relative positions of the light guide component connected from the outside and the optical component mounted on the package. Is obtained.

本開示に係る実施形態１のパッケージ、光学装置及び光学モジュールを示す縦断面図である。It is a vertical sectional view which shows the package, an optical apparatus and an optical module of Embodiment 1 which concerns on this disclosure. 配線基板と透光性基板との接合構造の第１例（Ａ）及び第２例（Ｂ）を示す図である。It is a figure which shows the 1st example (A) and 2nd example (B) of the joint structure of a wiring board and a translucent substrate. 透光性基板と光学部品との第１接合例（Ａ）、第２接合例（Ｂ）及び第３接合例（Ｃ）を示す図である。It is a figure which shows the 1st bonding example (A), 2nd bonding example (B) and 3rd bonding example (C) of a translucent substrate and an optical component. 比較例のパッケージ及び光学装置を示す縦断面図である。It is a vertical cross-sectional view which shows the package and an optical apparatus of a comparative example. 本開示に係る実施形態２（Ａ）、実施形態３（Ｂ）及び実施形態４（Ｃ）のパッケージを示す縦断面図である。It is a vertical sectional view which shows the package of Embodiment 2 (A), Embodiment 3 (B) and Embodiment 4 (C) which concerns on this disclosure. 本開示に係る実施形態５（Ａ）及び実施形態６（Ｂ）のパッケージを示す縦断面図である。It is a vertical sectional view which shows the package of Embodiment 5 (A) and Embodiment 6 (B) which concerns on this disclosure. 本開示に係る実施形態７（Ａ）及び実施形態８（Ｂ）のパッケージを示す縦断面図である。It is a vertical sectional view which shows the package of Embodiment 7 (A) and Embodiment 8 (B) which concerns on this disclosure.

以下、本開示の各実施形態について図面を参照して詳細に説明する。実施形態では、図１から図７に示したＺ方向を上方、Ｘ−Ｙ平面に沿った方向を水平方向として説明する。これらの方向は説明の便宜上のもので、光学部品が使用されるときの方向と一致していなくてもよい。Ｘ、Ｙ、Ｚ方向は互いに直交する３方向である。Ｘ方向及びＹ方向は配線基板１０の第１主面１１に沿った方向に相当し、Ｚ方向は第１主面１１に垂直な方向に相当する。Ｚ方向は高さ方向又は厚み方向に相当する。 Hereinafter, each embodiment of the present disclosure will be described in detail with reference to the drawings. In the embodiment, the Z direction shown in FIGS. 1 to 7 will be described as an upward direction, and the direction along the XY plane will be described as a horizontal direction. These orientations are for convenience of explanation and may not match the orientations when the optics are used. The X, Y, and Z directions are three directions orthogonal to each other. The X and Y directions correspond to the directions along the first main surface 11 of the wiring board 10, and the Z direction corresponds to the direction perpendicular to the first main surface 11. The Z direction corresponds to the height direction or the thickness direction.

（実施形態１）
図１は、本開示に係る実施形態１のパッケージ、光学装置及び光学モジュールを示す縦断面図である。図中、透光性基板２０、光学部品６０及び導光部材１２０は他の部材と同一面で破断せずに示している。図４から図７において同様である。実施形態１のパッケージ１は、光学部品６０が搭載されて光学装置５０を構成するためのパッケージであり、第１主面１１及び第１主面１１とは逆側の第２主面１２を有する配線基板１０と、配線基板１０に接合される透光性基板２０と、蓋体３０とを備える。配線基板１０は、第１主面１１から第２主面１２に通じる貫通孔１３を有する。実施形態に係る光学装置５０は、電気信号又は電力の入力又は出力と、受光又は発光とを行う装置であり、パッケージ１とパッケージ１に搭載された光学部品６０とを備える。 (Embodiment 1)
FIG. 1 is a vertical sectional view showing a package, an optical device, and an optical module of the first embodiment according to the present disclosure. In the figure, the translucent substrate 20, the optical component 60, and the light guide member 120 are shown on the same surface as the other members without breaking. The same is true in FIGS. 4 to 7. The package 1 of the first embodiment is a package on which the optical component 60 is mounted to form the optical device 50, and has a first main surface 11 and a second main surface 12 opposite to the first main surface 11. A wiring board 10, a translucent board 20 joined to the wiring board 10, and a lid 30 are provided. The wiring board 10 has a through hole 13 leading from the first main surface 11 to the second main surface 12. The optical device 50 according to the embodiment is a device that inputs or outputs an electric signal or electric power and receives or emits light, and includes a package 1 and an optical component 60 mounted on the package 1.

配線基板１０は、絶縁性を有する基板１０Ｉと、基板１０Ｉに位置する配線導体１５とを含む。基板１０Ｉは、平板状であってよく、セラミックであってもよい。基板１０Ｉは複数のセラミック層が積層された積層体であってもよい。配線導体１５は、第１主面１１に位置する導体膜である接続電極１５ａと、第１主面１１から第２主面１２にかけて基板１０Ｉ内に位置するビア導体１５ｂと、第２主面１２に位置する外部接続用の導体膜である外部電極１５ｃとを含む。配線導体１５の途中、第１主面１１と第２主面１２との間の層において水平方向に延在する層間導体１５ｄ（図６、図７を参照）が含まれてもよい。 The wiring board 10 includes an insulating substrate 10I and a wiring conductor 15 located on the substrate 10I. The substrate 10I may be flat or ceramic. The substrate 10I may be a laminated body in which a plurality of ceramic layers are laminated. The wiring conductor 15 includes a connection electrode 15a which is a conductor film located on the first main surface 11, a via conductor 15b located in the substrate 10I from the first main surface 11 to the second main surface 12, and a second main surface 12. Includes an external electrode 15c, which is a conductor film for external connection located in. In the middle of the wiring conductor 15, an interlayer conductor 15d (see FIGS. 6 and 7) extending in the horizontal direction in the layer between the first main surface 11 and the second main surface 12 may be included.

上記のような配線基板１０は、シート状に成形したセラミックグリーンシート（以下、グリーンシートともいう）を積層し、貫通孔１３を設け、その後、この積層体を約１３００℃〜１６００℃程度の温度で焼成することによって製作することができる。接続電極１５ａ、外部電極１５ｃ及び層間導体１５ｄは、金属粉末を有機溶剤及び有機バインダと混合して作製した金属ペーストを上記グリーンシートの所定位置にスクリーン印刷法等の方法で印刷し、グリーンシートとともに焼成する方法で形成することができる。ビア導体１５ｂは、上記の金属ペーストの印刷に先駆けてグリーンシートの所定の位置に貫通孔を設け、上記と同様の金属ペーストをこの貫通孔に充填しておき、グリーンシートとともに焼成する方法で形成することができる。接続電極１５ａ及び外部電極１５ｃのように露出する導体層の表面には、１〜１０μｍ程度のニッケル膜及び０．１〜３μｍ程度の金膜を順に形成してもよく、その表面を保護するとともに、ボンディングワイヤーなどの導線ｗあるいはろう材やはんだ等の接合導体Ｇ１の接合性を高めることができる。ニッケル膜及び金膜は、電解めっきによるめっき膜あるいは薄膜で形成することができる。 In the wiring board 10 as described above, a ceramic green sheet (hereinafter, also referred to as a green sheet) formed into a sheet is laminated to provide a through hole 13, and then the laminated body is heated at a temperature of about 1300 ° C to 1600 ° C. It can be manufactured by firing in. The connection electrode 15a, the external electrode 15c, and the interlayer conductor 15d are formed by printing a metal paste prepared by mixing a metal powder with an organic solvent and an organic binder at a predetermined position on the green sheet by a method such as a screen printing method, and together with the green sheet. It can be formed by a method of firing. The via conductor 15b is formed by providing a through hole at a predetermined position on the green sheet prior to printing the metal paste, filling the through hole with the same metal paste as above, and firing the via conductor together with the green sheet. can do. On the surface of the exposed conductor layer such as the connection electrode 15a and the external electrode 15c, a nickel film of about 1 to 10 μm and a gold film of about 0.1 to 3 μm may be formed in this order to protect the surfaces. , The bondability of the conducting wire w such as a bonding wire or the bonding conductor G1 such as a brazing material or solder can be improved. The nickel film and the gold film can be formed of a plating film or a thin film obtained by electrolytic plating.

透光性基板２０は、透明であるなど透光性を有し、貫通孔１３を覆う。透光性基板２０は、ガラス、サファイア単結晶などの結晶体、又は樹脂などから構成できる。透光性基板２０は、上面に光学部品６０が搭載される搭載部Ｒを有する。透光性基板２０は、ＡＲ（Anti Reflection）コート、フィルタ特性を有するコートなど、種々のコートが付加されてもよい。透光性基板２０は、光学部品６０を後付け（透光性基板２０が配線基板１０に接合された後で、蓋体３０が接合される前）で搭載するための基板である。透光性基板２０は、光学部品６０へ電気信号又は電力を送る電極、並びに、光学部品６０から電気信号又は電力を受ける電極を、ともに有さず、専ら光学部品６０が接合されて光学部品６０を固定する役割を担う。透光性基板２０は、さらに、光学部品６０とは逆側で光ファイバーなどの導光部材１２０の端面を接合又は位置決めする役割を担ってもよい。透光性基板２０は、研磨加工等の高い寸法精度を実現する加工方法を適用して作製可能であり、基板１０Ｉと比較してバラツキの少ない高い厚み精度が得られる。電極を有する透光性基板を高い厚み精度で作製するには、研磨加工等の後に電極形成が必要となり、手間とコストがかかるのに対して、電極を有さない透光性基板２０であれば、少ない手間に低いコストで厚みバラツキの少ない透光性基板２０を作製できる。 The translucent substrate 20 has translucency such as being transparent, and covers the through hole 13. The translucent substrate 20 can be made of a crystal such as glass or a sapphire single crystal, a resin, or the like. The translucent substrate 20 has a mounting portion R on which the optical component 60 is mounted on the upper surface. Various coats such as an AR (Anti Reflection) coat and a coat having filter characteristics may be added to the translucent substrate 20. The translucent substrate 20 is a substrate for mounting the optical component 60 afterwards (after the translucent substrate 20 is joined to the wiring board 10 and before the lid 30 is joined). The translucent substrate 20 does not have an electrode for sending an electric signal or power to the optical component 60 and an electrode for receiving an electric signal or power from the optical component 60, and the optical component 60 is exclusively joined to the optical component 60. Plays the role of fixing. The translucent substrate 20 may further serve to join or position the end faces of the light guide member 120 such as an optical fiber on the opposite side of the optical component 60. The translucent substrate 20 can be manufactured by applying a processing method that realizes high dimensional accuracy such as polishing, and can obtain high thickness accuracy with less variation as compared with the substrate 10I. In order to produce a translucent substrate having electrodes with high thickness accuracy, it is necessary to form electrodes after polishing and the like, which requires labor and cost. On the other hand, even if the translucent substrate 20 does not have electrodes. For example, the translucent substrate 20 with little thickness variation can be manufactured at low cost with little effort.

蓋体３０は、下方に開口する凹部３１を有する。凹部３１の内部に光学部品６０及び透光性基板２０が配置される。蓋体３０は、金属又はセラミックスなどから構成されてもよい。蓋体３０は、透光性基板２０に光学部品６０が搭載された後、配線基板１０に接合される。蓋体３０は、凹部３１の開口の全周にわたって配線基板１０に接合され、凹部３１内を封止する。蓋体３０と配線基板１０とは、溶接、あるいは、ろう材、ガラス接合材、様々な硬化型の樹脂などの接合材を介して接合できる。溶接としては、シーム溶接、電子ビーム溶接、レーザー溶接など、様々な溶接が適用できる。溶接又はろう材により接合する場合、配線基板１０の枠状の接合面（基板１０Ｉ上又はメタライズ導体膜上）に予め金属膜を形成しておいてもよい。 The lid 30 has a recess 31 that opens downward. The optical component 60 and the translucent substrate 20 are arranged inside the recess 31. The lid 30 may be made of metal, ceramics, or the like. The lid 30 is joined to the wiring board 10 after the optical component 60 is mounted on the translucent substrate 20. The lid 30 is joined to the wiring board 10 over the entire circumference of the opening of the recess 31 to seal the inside of the recess 31. The lid 30 and the wiring substrate 10 can be joined by welding or through a joining material such as a brazing material, a glass joining material, or various curable resins. As welding, various welding such as seam welding, electron beam welding, and laser welding can be applied. When joining by welding or brazing material, a metal film may be formed in advance on the frame-shaped joining surface (on the substrate 10I or the metallized conductor film) of the wiring board 10.

図２は、透光性基板と配線基板との接合構造の第１例（Ａ）及び第２例（Ｂ）を示す図である。図２において、配線基板１０と接合材Ｅ１、Ｅ２は縦断面を示し、透光性基板２０は破断せずに示している。 FIG. 2 is a diagram showing a first example (A) and a second example (B) of a bonding structure of a translucent substrate and a wiring substrate. In FIG. 2, the wiring board 10 and the joining materials E1 and E2 show vertical cross sections, and the translucent board 20 is shown without breaking.

透光性基板２０は、貫通孔１３の周囲全周にわたる部位が配線基板１０に接合され、貫通孔１３の第１主面１１側の開口を気密に塞いでもよい。透光性基板２０は、下面の一部（例えば周縁部）が配線基板１０の第１主面１１に対向することで高さ方向に位置決めされる。具体的には、透光性基板２０が第１主面１１に接触して位置決めされていてもよいし、接合材Ｅ１、Ｅ２を挟んで透光性基板２０と第１主面１１とが対向及び近接することで位置決めされていてもよい。透光性基板２０の下面は、配線基板１０の第２主面１２よりも第１主面１１に近い高さに位置する。透光性基板２０の搭載部Ｒ側の面（上面）は、第２主面１２の逆側を向く面であるが、第１主面１１、第２主面１２、透光性基板２０の下面又はこれらいずれかと平行でなくてもよい。 In the translucent substrate 20, a portion extending around the entire circumference of the through hole 13 may be joined to the wiring board 10 to airtightly close the opening of the through hole 13 on the first main surface 11 side. The translucent substrate 20 is positioned in the height direction by a part of the lower surface (for example, a peripheral edge portion) facing the first main surface 11 of the wiring board 10. Specifically, the translucent substrate 20 may be positioned in contact with the first main surface 11, or the translucent substrate 20 and the first main surface 11 face each other with the joining materials E1 and E2 interposed therebetween. And may be positioned by being close to each other. The lower surface of the translucent substrate 20 is located at a height closer to the first main surface 11 than the second main surface 12 of the wiring board 10. The surface (upper surface) of the mounting portion R side of the translucent substrate 20 faces the opposite side of the second main surface 12, but the first main surface 11, the second main surface 12, and the translucent substrate 20 It does not have to be parallel to the bottom surface or any of these.

透光性基板２０と配線基板１０との接合は、低融点ガラスなどのガラス接合材、硬化型樹脂、又は、半田を含むろう材などの接合材Ｅ１、Ｅ２を介して行われる。ろう材を用いる場合、配線基板１０の接合面には金属膜を設け、透光性基板２０の接合面には金属薄膜を設けてもよい。接合面の金属膜及び金属薄膜により、接合作業性及び接合強度が向上する。配線基板１０の金属膜は、メタライズ導体又はメタライズ導体とその上のめっき皮膜であってもよい。薄膜は蒸着法又はスパッタリング法により形成された膜を意味する。接合材Ｅ１、Ｅ２として金属の材料を適用することで気密性、耐熱性及び耐湿性が向上される。 The bonding between the translucent substrate 20 and the wiring substrate 10 is performed via a glass bonding material such as low melting point glass, a curable resin, or bonding materials E1 and E2 such as a brazing material containing solder. When a brazing material is used, a metal film may be provided on the joint surface of the wiring board 10, and a metal thin film may be provided on the joint surface of the translucent substrate 20. The metal film and the metal thin film on the joint surface improve the joint workability and the joint strength. The metal film of the wiring board 10 may be a metallized conductor or a metallized conductor and a plating film on the metallized conductor. The thin film means a film formed by a vapor deposition method or a sputtering method. Airtightness, heat resistance and moisture resistance are improved by applying a metal material as the joining materials E1 and E2.

透光性基板２０と配線基板１０とは、図２（Ａ）に示すように、透光性基板２０の下面及び配線基板１０の第１主面１１のうち、互いに対向する部位を接合面として、互いの接合面の間に接合材Ｅ１が介在することで接合されてもよい。あるいは、図２（Ｂ）に示すように、透光性基板２０と配線基板１０とは、透光性基板２０の側面と配線基板１０の第１主面１１とが成す隅部にフィレット状の接合材Ｅ２が位置することで接合されてもよい。フィレット状の接合材Ｅ２により接合される場合、透光性基板２０と配線基板１０との対向する面には接合材が介在していてもよいし、介在していなくてもよい。また、図示を省略するが、図２（Ａ）又は図２（Ｂ）の接合構造に加えて、あるいは、図２（Ａ）又は図２（Ｂ）の接合構造は無しで、透光性基板２０の下面の周縁部と貫通孔１３の内周面とにかけて接合材Ｅ２が位置して、透光性基板２０と配線基板１０とが接合されてもよい。この場合、透光性基板２０の下面に位置する接合材Ｅ２は、光の透過を妨げない範囲に位置すればよい。 As shown in FIG. 2A, the translucent substrate 20 and the wiring substrate 10 have a joint surface of the lower surface of the translucent substrate 20 and the first main surface 11 of the wiring board 10 facing each other. , The bonding material E1 may be interposed between the bonding surfaces of each other. Alternatively, as shown in FIG. 2B, the translucent substrate 20 and the wiring board 10 have a fillet-like shape at a corner formed by the side surface of the translucent substrate 20 and the first main surface 11 of the wiring board 10. It may be joined by locating the joining material E2. When joined by the fillet-shaped bonding material E2, the bonding material may or may not be interposed on the facing surfaces of the translucent substrate 20 and the wiring substrate 10. Further, although not shown, a translucent substrate is provided in addition to the bonding structure of FIG. 2 (A) or FIG. 2 (B) or without the bonding structure of FIG. 2 (A) or FIG. 2 (B). The bonding material E2 may be located between the peripheral edge of the lower surface of the 20 and the inner peripheral surface of the through hole 13, and the translucent substrate 20 and the wiring substrate 10 may be bonded. In this case, the bonding material E2 located on the lower surface of the translucent substrate 20 may be located within a range that does not interfere with the transmission of light.

図３は、透光性基板と光学部品との接合構造の第１例（Ａ）、第２例（Ｂ）及び第３例（Ｃ）を示す図である。図３において、透光性基板２０と接合材Ｆ１、Ｆ２とは縦断面を示し、光学部品６０は破断せずに示している。光学部品６０は、発光部を有する発光素子、受光部を有する受光素子、又はこれら両方を含む部品であり、下側、透光性基板２０側に受光部、発光部、又はこれら両方が位置する。 FIG. 3 is a diagram showing a first example (A), a second example (B), and a third example (C) of a bonding structure of a translucent substrate and an optical component. In FIG. 3, the translucent substrate 20 and the joining materials F1 and F2 show vertical cross sections, and the optical component 60 is shown without breaking. The optical component 60 is a light emitting element having a light emitting portion, a light receiving element having a light receiving portion, or a component including both of them, and the light receiving portion, the light emitting portion, or both are located on the lower side and the translucent substrate 20 side. ..

透光性基板２０と光学部品６０とは、透明又は非透明な接合材Ｆ１が互いの接合面の間で硬化して接合される。接合材Ｆ１が透明の場合、図３（Ａ）に示すように、光学部品６０の受光部又は発光部を含む下面の一部又は全部と、透光性基板２０の上面とを、それぞれ接合面としてもよい。接合材Ｆ１が透明又は非透明の場合、図３（Ｂ）に示すように、光学部品６０の受光部又は発光部を含まない下面の一部と透光性基板２０の上面とをそれぞれ接合面としてもよい。透明の接合材Ｆ１としては、熱硬化型、紫外線硬化型など様々な硬化型の樹脂、又は、低融点ガラスなどのガラス接合材が適用できる。非透明な接合材Ｆ１としては、半田等が適用できる。半田等の金属の接合材を用いる場合、光学部品６０と透光性基板２０との接合面には金属薄膜が予め形成されていてもよい。 The translucent substrate 20 and the optical component 60 are joined by curing a transparent or non-transparent joining material F1 between the joining surfaces of each other. When the bonding material F1 is transparent, as shown in FIG. 3A, a part or all of the lower surface including the light receiving portion or the light emitting portion of the optical component 60 and the upper surface of the translucent substrate 20 are respectively bonded surfaces. May be. When the bonding material F1 is transparent or non-transparent, as shown in FIG. 3B, a part of the lower surface of the optical component 60 that does not include the light receiving portion or the light emitting portion and the upper surface of the translucent substrate 20 are respectively joined surfaces. May be. As the transparent bonding material F1, various curable resins such as thermosetting type and ultraviolet curable type, or glass bonding materials such as low melting point glass can be applied. As the non-transparent bonding material F1, solder or the like can be applied. When a metal bonding material such as solder is used, a metal thin film may be formed in advance on the bonding surface between the optical component 60 and the translucent substrate 20.

あるいは、透光性基板２０と光学部品６０とは、図３（Ｃ）に示すように、透明又は非透明の接合材Ｆ２が、光学部品６０の側面と透光性基板２０の上面とが成す隅部にフィレット（接合材の隅肉）状に位置することで接合されてもよい。フィレット状の接合材Ｆ２により接合される場合、光学部品６０と透光性基板２０との対向する面には接合材が介在していてもよいし、介在していないなくてもよい。 Alternatively, as shown in FIG. 3C, the translucent substrate 20 and the optical component 60 are formed by a transparent or non-transparent bonding material F2 formed by a side surface of the optical component 60 and an upper surface of the translucent substrate 20. It may be joined by being positioned in the shape of a fillet (fillet of the joining material) at the corner. When joined by the fillet-shaped joining material F2, the joining material may or may not be interposed on the facing surfaces of the optical component 60 and the translucent substrate 20.

透光性基板２０の上面と光学部品６０の下面に位置する接合材Ｆ１（又は接合材Ｆ２の一部）は、厚みが小さく、その厚みバラツキは基板１０Ｉの厚みバラツキと比較して非常に小さくすることができる。さらに、図３（ｃ）の例で透光性基板２０と光学部品６０との間に接合材が介在しない接合構造では、透光性基板２０と光学部品６０との相対位置のバラツキに接合材の厚みバラツキが加算されないため、導光部材１２０と光学部品６０との相対位置のバラツキをより小さくし、導光部材１２０と光学部品６０との相対位置の精度を高めることができる。 The joint material F1 (or a part of the joint material F2) located on the upper surface of the translucent substrate 20 and the lower surface of the optical component 60 has a small thickness, and the thickness variation thereof is very small as compared with the thickness variation of the substrate 10I. can do. Further, in the example of FIG. 3C, in the bonding structure in which the bonding material does not intervene between the translucent substrate 20 and the optical component 60, the bonding material varies in the relative positions between the translucent substrate 20 and the optical component 60. Since the thickness variation of the light guide member 120 and the optical component 60 is not added, the variation in the relative position between the light guide member 120 and the optical component 60 can be further reduced, and the accuracy of the relative position between the light guide member 120 and the optical component 60 can be improved.

上記のような光学部品６０と透光性基板２０との接合構造によれば、例えば接合部に所定の導電性を確保する必要があるなど、電気的な接続の要求が課されないため、光学部品６０と透光性基板２０との相対的な位置のバラツキが少ない接合が可能となる。 According to the joint structure of the optical component 60 and the translucent substrate 20 as described above, the optical component is not required to be electrically connected, for example, it is necessary to secure a predetermined conductivity at the joint portion. It is possible to join the 60 and the translucent substrate 20 with little variation in the relative positions.

光学部品６０は、電気信号又は電力を入力又は出力する端子６２を有していてもよい。端子６２は、光学部品６０の上面（側面でもよい）に位置し、ボンディングワイヤーなどの導線ｗを介して配線基板１０の接続電極１５ａと電気的に接続される。 The optical component 60 may have a terminal 62 for inputting or outputting an electric signal or electric power. The terminal 62 is located on the upper surface (or the side surface) of the optical component 60, and is electrically connected to the connection electrode 15a of the wiring board 10 via a conducting wire w such as a bonding wire.

＜光学モジュール＞
図１に示すように、本実施形態に係る光学モジュール１００は、モジュール用基板１１０と、モジュール用基板１１０に実装された光学装置５０と、光を伝送する光ファイバー等の導光部材１２０とを備える。モジュール用基板１１０には、光学装置５０に加えて、他の光学装置、電気装置、電子素子、電気素子などが実装されていてもよい。 <Optical module>
As shown in FIG. 1, the optical module 100 according to the present embodiment includes a module substrate 110, an optical device 50 mounted on the module substrate 110, and a light guide member 120 such as an optical fiber that transmits light. .. In addition to the optical device 50, other optical devices, electric devices, electronic elements, electric elements, and the like may be mounted on the module substrate 110.

光学装置５０の外部電極１５ｃは、半田等の接合導体Ｇ１を介してモジュール用基板１１０の接続パッド１１１に接続される。配線基板１０の第２主面１２と透光性基板２０の下面とが離間していることで、光学装置５０をモジュール用基板１１０へ実装する際に接合導体Ｇ１が透光性基板２０に付着してしまうことを抑制できる。 The external electrode 15c of the optical device 50 is connected to the connection pad 111 of the module substrate 110 via a bonding conductor G1 such as solder. Since the second main surface 12 of the wiring board 10 and the lower surface of the translucent substrate 20 are separated from each other, the bonding conductor G1 adheres to the translucent substrate 20 when the optical device 50 is mounted on the module substrate 110. It is possible to prevent this from happening.

モジュール用基板１１０は、配線基板１０の貫通孔１３に連通する貫通孔１１３を有する。導光部材１２０は貫通孔１１３、１３に通され、導光部材１２０の端面が透光性基板２０の下面に対向することで光学部品６０に位置が調整される。導光部材１２０の端面は透明な接合材（樹脂等）を介して透光性基板２０の下面に接合されてもよい。 The module board 110 has a through hole 113 communicating with the through hole 13 of the wiring board 10. The light guide member 120 is passed through the through holes 113 and 13, and the position of the light guide member 120 is adjusted to the optical component 60 by facing the end surface of the light guide member 120 to the lower surface of the translucent substrate 20. The end face of the light guide member 120 may be joined to the lower surface of the translucent substrate 20 via a transparent bonding material (resin or the like).

モジュール用基板１１０及び光学装置５０は次のように動作する。光学部品６０が光を受けて電気信号又は電力を出力する素子である場合、導光部材１２０から透光性基板２０を介して光学部品６０の受光部へ光が送られる。光学部品６０が受光すると、光学部品６０の端子６２に電気信号又は電力が出力され、導線ｗ及び配線基板１０の配線導体１５を介して電気信号又は電力がモジュール用基板１１０に送られる。光学部品６０が電気信号又は電力を受けて光を出射する素子である場合、モジュール用基板１１０から配線基板１０の配線導体１５及び導線ｗを介して光学部品６０に電気信号又は電力が送られる。光学部品６０は電気信号又は電力に基づき発光部から光を照射し、光が透光性基板２０を介して導光部材１２０に送られる。 The module substrate 110 and the optical device 50 operate as follows. When the optical component 60 is an element that receives light and outputs an electric signal or electric power, light is sent from the light guide member 120 to the light receiving portion of the optical component 60 via the translucent substrate 20. When the optical component 60 receives light, an electric signal or electric power is output to the terminal 62 of the optical component 60, and the electric signal or electric power is sent to the module substrate 110 via the conducting wire w and the wiring conductor 15 of the wiring substrate 10. When the optical component 60 is an element that receives an electric signal or electric power and emits light, the electric signal or electric power is transmitted from the module substrate 110 to the optical component 60 via the wiring conductor 15 and the conducting wire w of the wiring substrate 10. The optical component 60 irradiates light from the light emitting unit based on an electric signal or electric power, and the light is sent to the light guide member 120 via the translucent substrate 20.

以上のように、実施形態１のパッケージ１、光学装置５０及び光学モジュール１００によれば、貫通孔１３を覆う透光性基板２０が配線基板１０に接合され、透光性基板２０上に光学部品６０の搭載部Ｒを有する。したがって、導光部材１２０が貫通孔１３を介して透光性基板２０の下面に位置決めされることで、導光部材１２０と光学部品６０との相対位置のバラツキを小さくできる。ここで、比較例として、図４に示すように、透光性基板２０が配線基板１０の貫通孔１３を塞ぐ一方、透光性基板２０と離間した位置に光学部品６０の搭載部ＲＸを有するパッケージ１Ｘを想定する。比較例のパッケージ１Ｘでは、透光性基板２０と配線基板１０との接合面と、光学部品６０の搭載部ＲＸとが、配線基板１０の別の層に位置する。このような構造では、配線基板１０の第１層部１０Ｉ１の厚みにバラツキが生じると、導光部材１２０と光学部品６０との相対位置にもバラツキが生じる。セラミックは焼成により体積が変化するため、厚みなどにバラツキが生じる場合があり、比較例の配線基板１０の材料にセラミックを適用した場合、厚みのバラツキにより導光部材１２０と光学部品６０との相対位置にバラツキが生じる。一方、実施形態１のパッケージ１、光学装置５０及び光学モジュール１００によれば、透光性基板２０の上面に光学部品６０が搭載され、下面に導光部材１２０の端面が位置するので、配線基板１０の寸法バラツキが、導光部材１２０と光学部品６０との相対位置に作用することがない。 As described above, according to the package 1, the optical device 50, and the optical module 100 of the first embodiment, the translucent substrate 20 covering the through hole 13 is joined to the wiring substrate 10, and the optical component is placed on the translucent substrate 20. It has 60 mounting portions R. Therefore, by positioning the light guide member 120 on the lower surface of the translucent substrate 20 via the through hole 13, the variation in the relative positions of the light guide member 120 and the optical component 60 can be reduced. Here, as a comparative example, as shown in FIG. 4, the translucent substrate 20 closes the through hole 13 of the wiring substrate 10, while the mounting portion RX of the optical component 60 is provided at a position separated from the translucent substrate 20. Assume package 1X. In the package 1X of the comparative example, the joint surface between the translucent substrate 20 and the wiring board 10 and the mounting portion RX of the optical component 60 are located in another layer of the wiring board 10. In such a structure, if the thickness of the first layer portion 10I1 of the wiring board 10 varies, the relative positions of the light guide member 120 and the optical component 60 also vary. Since the volume of ceramic changes due to firing, the thickness and the like may vary. When ceramic is applied to the material of the wiring board 10 of the comparative example, the light guide member 120 and the optical component 60 are relative to each other due to the thickness variation. There will be variations in position. On the other hand, according to the package 1, the optical device 50, and the optical module 100 of the first embodiment, the optical component 60 is mounted on the upper surface of the translucent substrate 20, and the end face of the light guide member 120 is located on the lower surface. The dimensional variation of 10 does not affect the relative positions of the light guide member 120 and the optical component 60.

さらに、実施形態１のパッケージ１、光学装置５０及び光学モジュール１００によれば、透光性基板２０の下面が配線基板１０に接合又は対向している。したがって、透光性基板２０に下向きの荷重が加わる場合に、パッケージ１の耐荷重性が向上する。よって、パッケージ１に光学部品６０を搭載する工程において、光学部品６０に下向きの荷重を加えながら光学部品６０を接合することができ、その場合に、荷重の大きさに課せられる制限を低減できる。荷重を加えながら光学部品６０を接合することで、光学部品６０の下面と透光性基板２０の上面との間の接合材の厚みバラツキをより小さくすることができ、透光性基板２０と光学部品６０との相対位置のバラツキをより小さくすることができる。 Further, according to the package 1, the optical device 50, and the optical module 100 of the first embodiment, the lower surface of the translucent substrate 20 is joined or opposed to the wiring substrate 10. Therefore, when a downward load is applied to the translucent substrate 20, the load bearing capacity of the package 1 is improved. Therefore, in the process of mounting the optical component 60 on the package 1, the optical component 60 can be joined while applying a downward load to the optical component 60, and in that case, the limitation imposed on the magnitude of the load can be reduced. By joining the optical component 60 while applying a load, the thickness variation of the bonding material between the lower surface of the optical component 60 and the upper surface of the translucent substrate 20 can be further reduced, and the translucent substrate 20 and the optical component 20 can be optically joined. The variation in the position relative to the component 60 can be further reduced.

さらに、実施形態１のパッケージ１、光学装置５０及び光学モジュール１００によれば、第２主面１２に外部電極１５ｃが位置する一方、搭載部Ｒは透光性基板２０の第２主面１２とは逆側を向く面に位置する。さらに、透光性基板２０の下面が、第２主面１２の高さよりも第１主面１１側に離間した高さに位置する。したがって、光学装置５０をモジュール用基板１１０へ実装する際に半田等の接合導体Ｇ１が透光性基板２０に付着してしまうことを抑制できる。 Further, according to the package 1, the optical device 50, and the optical module 100 of the first embodiment, the external electrode 15c is located on the second main surface 12, while the mounting portion R is the second main surface 12 of the translucent substrate 20. Is located on the opposite side. Further, the lower surface of the translucent substrate 20 is located at a height separated from the height of the second main surface 12 toward the first main surface 11. Therefore, it is possible to prevent the bonding conductor G1 such as solder from adhering to the translucent substrate 20 when the optical device 50 is mounted on the module substrate 110.

さらに、実施形態１のパッケージ１、光学装置５０及び光学モジュール１００によれば、蓋体３０が凹部３１を有し、搭載部Ｒが凹部３１に収容される。したがって、蓋体３０が外された状態で、搭載部Ｒ及び配線基板１０の上面がフラットに近くなり、ワイヤーボンディングなど導線ｗを接続する作業性を向上できる。また、配線基板１０が平板であることで、配線基板１０の作製工程を単純化でき部品コストの低減を図れる。 Further, according to the package 1, the optical device 50, and the optical module 100 of the first embodiment, the lid 30 has the recess 31, and the mounting portion R is housed in the recess 31. Therefore, with the lid 30 removed, the upper surfaces of the mounting portion R and the wiring board 10 become nearly flat, and workability for connecting the conductor w such as wire bonding can be improved. Further, since the wiring board 10 is a flat plate, the manufacturing process of the wiring board 10 can be simplified and the component cost can be reduced.

さらに、実施形態１の光学装置５０及び光学モジュール１００によれば、パッケージ１の上述した構造により、導光部材１２０と光学部品６０との位置が高い精度で合わせられることから、光の利得が上がり性能を向上できる。 Further, according to the optical device 50 and the optical module 100 of the first embodiment, the light gain is increased because the positions of the light guide member 120 and the optical component 60 are aligned with high accuracy by the above-described structure of the package 1. Performance can be improved.

（実施形態２〜９）
図５は、本開示に係る実施形態２（Ａ）、実施形態３（Ｂ）及び実施形態４（Ｃ）のパッケージを示す縦断面図である。図中、光学部品６０と導線ｗを仮想線で示す。 (Embodiments 2-9)
FIG. 5 is a vertical cross-sectional view showing the packages of the second embodiment (A), the third embodiment (B), and the fourth embodiment (C) according to the present disclosure. In the figure, the optical component 60 and the conducting wire w are shown by virtual lines.

図５（Ａ）に示すように、実施形態２のパッケージ１Ａ及び光学装置５０Ａは、主に透光性基板２０の配置が異なる他は、実施形態１と同様である。実施形態２の透光性基板２０は、側面が配線基板１０の貫通孔１３の内周面（内側面）に対向するように配置される。透光性基板２０の側面と貫通孔１３の内周面とが接合材Ｅ３を介して接合されてもよい。上方から見たとき、透光性基板２０が占める領域が、貫通孔１３の領域に包含されてもよい。 As shown in FIG. 5A, the package 1A and the optical device 50A of the second embodiment are the same as those of the first embodiment except that the arrangement of the translucent substrate 20 is mainly different. The translucent substrate 20 of the second embodiment is arranged so that the side surface faces the inner peripheral surface (inner side surface) of the through hole 13 of the wiring board 10. The side surface of the translucent substrate 20 and the inner peripheral surface of the through hole 13 may be joined via the joining material E3. When viewed from above, the region occupied by the translucent substrate 20 may be included in the region of the through hole 13.

なお、図５（Ａ）の透光性基板２０の配置が採用される場合、透光性基板２０の上面の周縁部から配線基板１０の第１主面１１にかけて接合材が位置することで透光性基板２０と配線基板１０とが接合されてもよい。透光性基板２０の下面の周縁部から配線基板１０の第２主面１２にかけて接合材が位置することで透光性基板２０と配線基板１０とが接合されてもよい。図５（Ａ）の接合構造と、上記２つの接合構造とのいずれか２つ又は全部が適用されてもよい。 When the arrangement of the translucent substrate 20 shown in FIG. 5A is adopted, the bonding material is positioned from the peripheral edge of the upper surface of the translucent substrate 20 to the first main surface 11 of the wiring substrate 10 to be transparent. The optical substrate 20 and the wiring board 10 may be joined. The translucent substrate 20 and the wiring board 10 may be bonded by locating the bonding material from the peripheral edge of the lower surface of the translucent substrate 20 to the second main surface 12 of the wiring board 10. Any two or all of the joint structure of FIG. 5A and the above two joint structures may be applied.

搭載部Ｒ、並びに、透光性基板２０の上面は、配線基板１０の第１主面１１と同じ高さに位置していてもよいし、それより低く又はそれより高くてもよい。蓋体３０Ａは、光学部品６０の配置が実施形態１と比べて低くなる分、実施形態１の蓋体３０と比べて浅い凹部３１を有する。 The mounting portion R and the upper surface of the translucent substrate 20 may be located at the same height as the first main surface 11 of the wiring board 10, and may be lower or higher than that. The lid 30A has a recess 31 that is shallower than the lid 30 of the first embodiment because the arrangement of the optical components 60 is lower than that of the first embodiment.

実施形態２のパッケージ１Ａによれば、蓋体３０の凹部３１を浅くでき、光学装置５０Ａを低背化できる。低背化とは高さの寸法が小さくなることを意味する。さらに、実施形態２のパッケージ１Ａによれば、透光性基板２０の水平方向の位置決めが容易になる。 According to the package 1A of the second embodiment, the recess 31 of the lid 30 can be made shallow, and the optical device 50A can be made low in height. Shortening means that the height dimension becomes smaller. Further, according to the package 1A of the second embodiment, the horizontal positioning of the translucent substrate 20 becomes easy.

図５（Ｂ）、（Ｃ）に示すように、実施形態３のパッケージ１Ｂ及び光学装置５０Ｂ、並びに、実施形態４のパッケージ１Ｃ及び光学装置５０Ｃは、主に、透光性基板２０の下面の高さが異なり、他は実施形態２と同様である。パッケージ１Ｂ（図５（Ｂ））では、透光性基板２０の厚さと配線基板１０の厚ささがほぼ同一であり、透光性基板２０の下面が第２主面１２よりも高くなる配置で、透光性基板２０が配線基板１０に接合されている。搭載部Ｒは第１主面１１よりも高く配置される。パッケージ１Ｃ（図５（Ｃ））では、透光性基板２０が配線基板１０よりも薄いことで、透光性基板２０の下面が第２主面１２よりも高くなる配置で透光性基板２０が接合されている。搭載部Ｒは第１主面１１と同程度の高さであってもよい。 As shown in FIGS. 5B and 5C, the package 1B and the optical device 50B of the third embodiment and the package 1C and the optical device 50C of the fourth embodiment are mainly formed on the lower surface of the translucent substrate 20. The height is different, and the other aspects are the same as those in the second embodiment. In package 1B (FIG. 5B), the thickness of the translucent substrate 20 and the thickness of the wiring substrate 10 are almost the same, and the lower surface of the translucent substrate 20 is higher than the second main surface 12. , The translucent substrate 20 is joined to the wiring board 10. The mounting portion R is arranged higher than the first main surface 11. In package 1C (FIG. 5 (C)), the translucent substrate 20 is thinner than the wiring substrate 10, so that the lower surface of the translucent substrate 20 is higher than the second main surface 12 of the translucent substrate 20. Are joined. The mounting portion R may be as high as the first main surface 11.

なお、図５（Ｂ）の透光性基板２０の配置が採用される場合、透光性基板２０の側面と貫通孔１３の内周面との間、配線基板１０の第１主面１１から透光性基板２０の側面（貫通孔１３の外に出た側面）にかけた範囲、透光性基板２０の下面の周縁部から貫通孔１３の内周面にかけた範囲、あるいは、上記の間及び２つの範囲のうちの２つ又は全てに接合材Ｅ３が位置することで、透光性基板２０と配線基板１０とが接合されてもよい。 When the arrangement of the translucent substrate 20 shown in FIG. 5B is adopted, the space between the side surface of the translucent substrate 20 and the inner peripheral surface of the through hole 13 is from the first main surface 11 of the wiring board 10. The range over the side surface of the translucent substrate 20 (the side surface outside the through hole 13), the range from the peripheral edge of the lower surface of the translucent substrate 20 to the inner peripheral surface of the through hole 13, or between the above and the above. The translucent substrate 20 and the wiring board 10 may be bonded by locating the bonding material E3 in two or all of the two ranges.

また、図５（Ｃ）の透光性基板２０の構造及び配置が採用される場合、透光性基板２０の側面と貫通孔１３の内周面との間、配線基板１０の第１主面１１から透光性基板２０の上面の周縁部にかけた範囲、透光性基板２０の下面の周縁部から貫通孔１３の内周面にかけた範囲、あるいは、上記の間及び２つの範囲のうちの２つ又は全てに接合材Ｅ３が位置することで、透光性基板２０と配線基板１０とが接合されてもよい。 When the structure and arrangement of the translucent substrate 20 shown in FIG. 5C are adopted, the first main surface of the wiring board 10 is between the side surface of the translucent substrate 20 and the inner peripheral surface of the through hole 13. The range from 11 to the peripheral edge of the upper surface of the translucent substrate 20, the range from the peripheral edge of the lower surface of the translucent substrate 20 to the inner peripheral surface of the through hole 13, or between the above and two ranges. The translucent substrate 20 and the wiring substrate 10 may be bonded by locating the bonding material E3 on two or all of them.

実施形態３のパッケージ１Ｂ及び実施形態４のパッケージ１Ｃによれば、実施形態２の効果に加え、光学装置５０Ｂ、５０Ｃをモジュール用基板１１０へ実装する際に、半田等の接合導体Ｇ１（図１を参照）が透光性基板２０の下面に付着してしまうことを抑制できる。 According to the package 1B of the third embodiment and the package 1C of the fourth embodiment, in addition to the effect of the second embodiment, when the optical devices 50B and 50C are mounted on the module substrate 110, the joint conductor G1 such as solder (FIG. 1). Can be prevented from adhering to the lower surface of the translucent substrate 20.

図６は、本開示に係る実施形態５（Ａ）及び実施形態６（Ｂ）のパッケージを示す縦断面図である。図中、光学部品６０と導線ｗを仮想線で示す。 FIG. 6 is a vertical cross-sectional view showing the packages of Embodiment 5 (A) and Embodiment 6 (B) according to the present disclosure. In the figure, the optical component 60 and the conducting wire w are shown by virtual lines.

図６（Ａ）に示すように、実施形態５のパッケージ１Ｄ及び光学装置５０Ｄは、配線基板１０Ｄの貫通孔１３の内周面に、上方を向いた段差面１３ｆ１を有する段部Ｄ１が含まれる。段部Ｄ１は、内周面の全周にわたって存在してもよいし、内周面の周方向の一部の範囲、又は複数の範囲に存在していてもよい。段部Ｄ１は、配線基板１０Ｄの焼成前、配線基板１０Ｄを構成する各層のグリーンシートに段部Ｄ１を含んだ貫通孔１３に対応した寸法及び形状の孔をそれぞれ設け、上記の複数のグリーンシートを積層し、焼成することで形成できる。 As shown in FIG. 6A, the package 1D and the optical device 50D of the fifth embodiment include a step portion D1 having an upward stepped surface 13f1 on the inner peripheral surface of the through hole 13 of the wiring board 10D. .. The step portion D1 may exist over the entire circumference of the inner peripheral surface, may exist in a part of the circumferential direction of the inner peripheral surface, or may exist in a plurality of ranges. Before firing the wiring board 10D, the step portion D1 is provided with holes having dimensions and shapes corresponding to the through holes 13 including the step portion D1 in the green sheet of each layer constituting the wiring board 10D, and the above-mentioned plurality of green sheets are provided. Can be formed by laminating and firing.

実施形態５の透光性基板２０は、側面が貫通孔１３の内周面に対向する。さらに、透光性基板２０の下面の一部（例えば周縁部）が段差面１３ｆ１に対向することで高さ方向に位置決めされている。透光性基板２０は、下面の一部が段差面１３ｆ１に接合材Ｅ４を介して接合されてもよいし、側面が貫通孔１３の内周面に接合材Ｅ４を介して接合されてもよい。搭載部Ｒを含んだ透光性基板２０の上面は、配線基板１０Ｄの第１主面１１と同じ高さに位置してもよいし、第１主面１１より低くてもよいし高くてもよい。 The side surface of the translucent substrate 20 of the fifth embodiment faces the inner peripheral surface of the through hole 13. Further, a part of the lower surface (for example, the peripheral edge) of the translucent substrate 20 faces the stepped surface 13f1 and is positioned in the height direction. A part of the lower surface of the translucent substrate 20 may be bonded to the stepped surface 13f1 via the bonding material E4, or the side surface may be bonded to the inner peripheral surface of the through hole 13 via the bonding material E4. .. The upper surface of the translucent substrate 20 including the mounting portion R may be located at the same height as the first main surface 11 of the wiring board 10D, or may be lower or higher than the first main surface 11. good.

実施形態５のパッケージ１Ｄによれば、実施形態１の効果に加えて、透光性基板２０の水平方向の位置決めが容易となり、さらに、透光性基板２０の側面と下面の一部とが貫通孔１３の内周面と段差面１３ｆ１とに接合されることで接合強度を向上できる。 According to the package 1D of the fifth embodiment, in addition to the effect of the first embodiment, the horizontal positioning of the translucent substrate 20 is facilitated, and further, a part of the side surface and the lower surface of the translucent substrate 20 penetrates. The joining strength can be improved by joining the inner peripheral surface of the hole 13 and the stepped surface 13f1.

図６（Ｂ）に示すように、実施形態６のパッケージ１Ｅ及び光学装置５０Ｅは、配線基
板１０Ｅの貫通孔１３の内周面に、下方を向いた段差面１３ｆ２を有する段部Ｄ２が含まれる。段部Ｄ２は、内周面の全周にわたって存在してもよいし、内周面の周方向の一部の範囲、又は複数の範囲に存在していてもよい。段部Ｄ２は、実施形態５の段部Ｄ１と同様に形成できる。 As shown in FIG. 6B, the package 1E and the optical device 50E of the sixth embodiment include a step portion D2 having a stepped surface 13f2 facing downward on the inner peripheral surface of the through hole 13 of the wiring board 10E. .. The step portion D2 may exist over the entire circumference of the inner peripheral surface, may exist in a part of the circumferential direction of the inner peripheral surface, or may exist in a plurality of ranges. The step portion D2 can be formed in the same manner as the step portion D1 of the fifth embodiment.

実施形態６の透光性基板２０は、側面が貫通孔１３の内周面に対向する。さらに、透光性基板２０の上面の一部（例えば周縁部）が段差面１３ｆ２に対向することで高さ方向に位置決めされている。透光性基板２０は、上面の一部が段差面１３ｆ２に接合材Ｅ４を介して接合されてもよいし、側面が貫通孔１３の内周面に接合材Ｅ４を介して接合されてもよい。透光性基板２０の下面は、配線基板１０Ｅの第２主面１２より高くてもよいし、同じ高さであってもよいし、第２主面１２より低くてもよい。光学部品６０は、一部又は全部が貫通孔１３に位置する。蓋体３０Ｅは、光学部品６０の配置が実施形態５と比べて低くなる分、実施形態５の蓋体３０と比べて浅い凹部３１を有する。 The side surface of the translucent substrate 20 of the sixth embodiment faces the inner peripheral surface of the through hole 13. Further, a part of the upper surface (for example, the peripheral edge) of the translucent substrate 20 faces the stepped surface 13f2 and is positioned in the height direction. A part of the upper surface of the translucent substrate 20 may be bonded to the stepped surface 13f2 via the bonding material E4, or the side surface may be bonded to the inner peripheral surface of the through hole 13 via the bonding material E4. .. The lower surface of the translucent substrate 20 may be higher than the second main surface 12 of the wiring board 10E, may be the same height, or may be lower than the second main surface 12. Part or all of the optical component 60 is located in the through hole 13. The lid 30E has a recess 31 that is shallower than the lid 30 of the fifth embodiment because the arrangement of the optical components 60 is lower than that of the fifth embodiment.

実施形態６のパッケージ１Ｅによれば、実施形態５と同様に、透光性基板２０の水平方向の位置決めが容易となり、さらに、透光性基板２０の側面と上面の一部とが貫通孔１３の内周面と段差面１３ｆ２と接合されることで接合強度を向上できる。さらに、光学部品６０の配置が低くなり、光学装置５０Ｅを低背化できる。さらに、透光性基板２０の下面が第２主面１２より高い構成では、光学装置５０Ｅをモジュール用基板へ実装する際に半田等の接合導体が透光性基板２０に付着してしまうことを抑制できる。 According to the package 1E of the sixth embodiment, as in the fifth embodiment, the translucent substrate 20 can be easily positioned in the horizontal direction, and the side surface and a part of the upper surface of the translucent substrate 20 are formed through holes 13. The joint strength can be improved by joining the inner peripheral surface of the above and the stepped surface 13f2. Further, the arrangement of the optical component 60 is lowered, and the height of the optical device 50E can be lowered. Further, in a configuration in which the lower surface of the translucent substrate 20 is higher than the second main surface 12, a bonded conductor such as solder adheres to the translucent substrate 20 when the optical device 50E is mounted on the module substrate. Can be suppressed.

図７は、本開示に係る実施形態７（Ａ）及び実施形態８（Ｂ）のパッケージを示す縦断面図である。図中、光学部品６０と導線ｗを仮想線で示す。 FIG. 7 is a vertical cross-sectional view showing the packages of the seventh embodiment (A) and the eighth embodiment (B) according to the present disclosure. In the figure, the optical component 60 and the conducting wire w are shown by virtual lines.

図７（Ａ）、図７（Ｂ）に示すように、実施形態７、８のパッケージ１Ｆ、１Ｇ及び光学装置５０Ｆ、５０Ｇは、配線基板１０Ｆ、１０Ｇが凹部１６（キャビティ構造）を有し、凹部１６内に透光性基板２０、光学部品６０及び導線ｗの少なくとも一部が収容される。パッケージ１Ｆは貫通孔１３の構造と透光性基板２０の配置が実施形態５と同様であり、パッケージ１Ｇは貫通孔１３の構造と透光性基板２０の配置が実施形態６と同様である。貫通孔１３の構造と透光性基板２０の配置とは、実施形態１〜４と同様にしてもよい。 As shown in FIGS. 7 (A) and 7 (B), in the packages 1F and 1G of the embodiments 7 and 8 and the optical devices 50F and 50G, the wiring boards 10F and 10G have recesses 16 (cavity structure). At least a part of the translucent substrate 20, the optical component 60, and the conducting wire w is housed in the recess 16. The structure of the through hole 13 and the arrangement of the translucent substrate 20 of the package 1F are the same as those of the fifth embodiment, and the structure of the through hole 13 and the arrangement of the translucent substrate 20 of the package 1G are the same as those of the sixth embodiment. The structure of the through hole 13 and the arrangement of the translucent substrate 20 may be the same as those in the first to fourth embodiments.

凹部１６は、配線基板１０Ｆ、１０Ｇの焼成前、配線基板１０Ｆ、１０Ｇを構成する各層のグリーンシートに凹部１６及び貫通孔１３に対応した寸法及び形状の孔をそれぞれ設け、上記の複数のグリーンシートを積層し、焼成することで形成できる。 The recess 16 is provided with holes having dimensions and shapes corresponding to the recess 16 and the through hole 13 in the green sheet of each layer constituting the wiring board 10F and 10G before firing the wiring board 10F and 10G, respectively, and the plurality of green sheets described above. Can be formed by laminating and firing.

蓋体３０Ｆ、３０Ｇは平板状であるか、あるいは、実施形態１の蓋体３０よりも平板に近い形状であってもよい。蓋体３０Ｆ、３０Ｇは、凹部１６の開口を囲う側壁１７の上面全周にわたって接合され、凹部１６内を封止する。 The lids 30F and 30G may have a flat plate shape, or may have a shape closer to a flat plate than the lid body 30 of the first embodiment. The lids 30F and 30G are joined over the entire upper surface of the side wall 17 surrounding the opening of the recess 16 to seal the inside of the recess 16.

実施形態７及び実施形態８のパッケージ１Ｆ、１Ｇによれば、蓋体３０Ｆ、３０Ｇが平板状又は平板に近い形状にできるので、蓋体３０Ｆ、３０Ｇの作製が容易となる。さらに、凹部１６により蓋体３０Ｆ、３０Ｇの接合部から透光性基板２０及び光学部品６０までの熱伝導経路が長くなるため、接合部に熱を加えて蓋体３０Ｆ、３０Ｇを配線基板１０Ｆ、１０Ｇに接合する場合でも、熱が透光性基板２０及び光学部品６０まで伝導することを抑制できる。よって、透光性基板２０と配線基板１０Ｆ、１０Ｇとの接合部への熱による影響、光学部品６０への熱による影響を低減できる。蓋体３０Ｆ、３０Ｇを、シーム溶接、電子ビーム溶接、レーザー溶接などにより接合する場合に、接合部が局所的に高熱になる。さらに、実施形態８の光学装置５０Ｇによれば、実施形態６と同様に光学部品６０の配置が低くなり、光学装置５０Ｇを低背化できる。 According to the packages 1F and 1G of the seventh and eighth embodiments, the lids 30F and 30G can be formed into a flat plate or a shape close to a flat plate, so that the lids 30F and 30G can be easily manufactured. Further, since the recess 16 lengthens the heat conduction path from the joint portion of the lids 30F and 30G to the translucent substrate 20 and the optical component 60, heat is applied to the joint portion to connect the lids 30F and 30G to the wiring substrate 10F. Even when joining to 10G, it is possible to prevent heat from being conducted to the translucent substrate 20 and the optical component 60. Therefore, the influence of heat on the joint portion between the translucent substrate 20 and the wiring boards 10F and 10G and the influence of heat on the optical component 60 can be reduced. When the lids 30F and 30G are joined by seam welding, electron beam welding, laser welding, or the like, the joint portion becomes locally hot. Further, according to the optical device 50G of the eighth embodiment, the arrangement of the optical components 60 is lowered as in the sixth embodiment, and the height of the optical device 50G can be reduced.

以上、本開示の各実施形態について説明した。しかし、本発明は上記実施形態に限られるものでなく、実施形態で示した細部は、発明の趣旨を逸脱しない範囲で適宜変更可能である。 Each embodiment of the present disclosure has been described above. However, the present invention is not limited to the above embodiment, and the details shown in the embodiment can be appropriately changed without departing from the spirit of the invention.

１、１Ａ〜１Ｇ パッケージ
１０、１０Ｄ〜１０Ｇ 配線基板
１０Ｉ 基板
１１ 第１主面
１２ 第２主面
１３ 貫通孔
Ｄ１、Ｄ２ 段部
１３ｆ１、１３ｆ２ 段差面
１５ 配線導体
１５ａ 接続電極
１５ｂ ビア導体
１５ｃ 外部電極
１５ｄ 層間導体
１６ 凹部
１７ 側壁
２０ 透光性基板
３０、３０Ａ、３０Ｅ〜３０Ｇ 蓋体
３１ 凹部
５０、５０Ａ〜５０Ｇ 光学装置
６０ 光学部品
１００ 光学モジュール
１１０ モジュール用基板
１１３ 貫通孔
１２０ 導光部材
Ｅ１、Ｅ２、Ｅ３、Ｅ４、Ｆ１、Ｆ２ 接合材
Ｇ１ 接合導体
Ｒ 搭載部
ｗ 導線 1, 1A ~ 1G Package 10, 10D-10G Wiring board 10I Board 11 1st main surface 12 2nd main surface 13 Through hole D1, D2 Step surface 13f1, 13f2 Step surface 15 Wiring conductor 15a Connection electrode 15b Via conductor 15c External electrode 15d Interlayer conductor 16 Recessed 17 Side wall 20 Translucent substrate 30, 30A, 30E to 30G Lid 31 Recessed 50, 50A to 50G Optical device 60 Optical component 100 Optical module 110 Module substrate 113 Through hole 120 Light guide member E1, E2 , E3, E4, F1, F2 Joint material G1 Joint conductor R Mounting part w Conductor

Claims (11)

貫通孔を有する配線基板と、
前記配線基板に接合され、前記貫通孔を覆う透光性基板と、
を備え、
前記透光性基板上に光学部品の搭載部を有する、
パッケージ。 A wiring board with through holes and
A translucent substrate that is joined to the wiring board and covers the through hole,
With
A mounting portion for optical components is provided on the translucent substrate.
package. 前記透光性基板における前記搭載部とは逆側の面が前記配線基板に対向している、
請求項１記載のパッケージ。 The surface of the translucent substrate opposite to the mounting portion faces the wiring board.
The package according to claim 1. 前記透光性基板における側面が前記貫通孔の内周面に対向している、
請求項１記載のパッケージ。 The side surface of the translucent substrate faces the inner peripheral surface of the through hole.
The package according to claim 1. 前記貫通孔の内周に位置する段部を有し、
前記透光性基板は前記段部の段差面に対向している、
請求項１又は請求項３に記載のパッケージ。 It has a step portion located on the inner circumference of the through hole and has a step portion.
The translucent substrate faces the stepped surface of the stepped portion.
The package according to claim 1 or 3. 前記透光性基板における前記搭載部の逆側の面が前記段差面に対向している、
請求項４記載のパッケージ。 The surface of the translucent substrate on the opposite side of the mounting portion faces the stepped surface.
The package according to claim 4. 前記透光性基板における前記搭載部側の面が前記段差面に対向している、
請求項４記載のパッケージ。 The surface of the translucent substrate on the mounting portion side faces the stepped surface.
The package according to claim 4. 前記配線基板は、第１主面と、前記第１主面とは逆側の第２主面と、前記第２主面に位置する外部接続用の外部電極と、を有し、
前記搭載部は、前記透光性基板における前記第２主面とは逆側を向く面に位置し、
前記透光性基板の前記搭載部とは逆側の面が、前記第２主面の高さよりも前記第１主面側に位置する、
請求項１から請求項６のいずれか一項に記載のパッケージ。 The wiring board has a first main surface, a second main surface opposite to the first main surface, and an external electrode for external connection located on the second main surface.
The mounting portion is located on a surface of the translucent substrate facing the side opposite to the second main surface.
The surface of the translucent substrate opposite to the mounting portion is located on the first main surface side with respect to the height of the second main surface.
The package according to any one of claims 1 to 6. 前記搭載部を覆う蓋体を有し、
前記蓋体は、前記搭載部を収容する凹部を有する、
請求項１から請求項７のいずれか一項に記載のパッケージ。 It has a lid that covers the mounting portion, and has a lid.
The lid has a recess for accommodating the mounting portion.
The package according to any one of claims 1 to 7. 前記配線基板は前記搭載部を収容する凹部を有し、
前記凹部の開口を覆う蓋体を、更に備える、
請求項１から請求項７のいずれか一項に記載のパッケージ。 The wiring board has a recess for accommodating the mounting portion.
A lid covering the opening of the recess is further provided.
The package according to any one of claims 1 to 7. 請求項１から請求項９のいずれか一項に記載のパッケージと、
前記搭載部に搭載された光学部品と、
を備える光学装置。 The package according to any one of claims 1 to 9, and the package.
The optical components mounted on the mounting part and
An optical device equipped with. 請求項１０に記載の光学装置と、
前記光学装置が搭載されたモジュール用基板と、
を備える光学モジュール。 The optical device according to claim 10 and
A module substrate on which the optical device is mounted and
Optical module with.
JP2020077018A 2020-04-24 2020-04-24 Package, optical device, and optical module Pending JP2021173853A (en)

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Country Link
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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002359426A (en) * 2001-06-01 2002-12-13 Hitachi Ltd Optical module and optical communication system
JP2004163655A (en) * 2002-11-13 2004-06-10 Matsushita Electric Ind Co Ltd Light transmission and reception module optical communication
US20050001221A1 (en) * 2003-05-06 2005-01-06 Thomas Killer Metal carrier (leadframe) for receiving and contact-connecting electrical and/or optoelectronic components
US20050249450A1 (en) * 2004-05-07 2005-11-10 Karl Schrodinger Optoelectronic module and method for producing an optoelectronic module
JP2007304311A (en) * 2006-05-11 2007-11-22 Seiko Epson Corp Optical module and its manufacturing method
JP2013222095A (en) * 2012-04-17 2013-10-28 Panasonic Corp Mounting body of optical module

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002359426A (en) * 2001-06-01 2002-12-13 Hitachi Ltd Optical module and optical communication system
JP2004163655A (en) * 2002-11-13 2004-06-10 Matsushita Electric Ind Co Ltd Light transmission and reception module optical communication
US20050001221A1 (en) * 2003-05-06 2005-01-06 Thomas Killer Metal carrier (leadframe) for receiving and contact-connecting electrical and/or optoelectronic components
US20050249450A1 (en) * 2004-05-07 2005-11-10 Karl Schrodinger Optoelectronic module and method for producing an optoelectronic module
JP2007304311A (en) * 2006-05-11 2007-11-22 Seiko Epson Corp Optical module and its manufacturing method
JP2013222095A (en) * 2012-04-17 2013-10-28 Panasonic Corp Mounting body of optical module

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