JP2021079490A - 切削装置 - Google Patents
切削装置 Download PDFInfo
- Publication number
- JP2021079490A JP2021079490A JP2019208983A JP2019208983A JP2021079490A JP 2021079490 A JP2021079490 A JP 2021079490A JP 2019208983 A JP2019208983 A JP 2019208983A JP 2019208983 A JP2019208983 A JP 2019208983A JP 2021079490 A JP2021079490 A JP 2021079490A
- Authority
- JP
- Japan
- Prior art keywords
- cutting
- cutting blade
- mount
- rotating shaft
- pressure gauge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 130
- 238000004891 communication Methods 0.000 claims abstract description 17
- 238000000034 method Methods 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 description 6
- 238000004140 cleaning Methods 0.000 description 3
- 238000003384 imaging method Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
- B26D1/12—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis
- B26D1/14—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter
- B26D1/143—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter rotating about a stationary axis
- B26D1/15—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter rotating about a stationary axis with vertical cutting member
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D5/02—Means for moving the cutting member into its operative position for cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D5/20—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting with interrelated action between the cutting member and work feed
- B26D5/26—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting with interrelated action between the cutting member and work feed wherein control means on the work feed means renders the cutting member operative
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Mechanical Engineering (AREA)
- Forests & Forestry (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Dicing (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
4:保持手段
6:切削手段
16:回転軸
18:ハウジング
20:切削ブレード
22:マウント
32:切り刃
34:ボス部
36:支持部
40:吸引孔
42:吸引源
44:連通路
46:圧力計
50:制御手段
Claims (1)
- 被加工物を保持する保持手段と、該保持手段に保持された被加工物を切削する切り刃を外周に備えた切削ブレードを回転可能に支持した切削手段と、該保持手段と該切削手段とを相対的に加工送りする送り手段と、を含む切削装置であって、
該切削手段は、回転軸と、該回転軸を回転可能に支持するハウジングと、該回転軸の先端に形成され切削ブレードを保持するマウントと、から少なくとも構成され、
該マウントは、該切削ブレードの中央に形成された開口に挿入されるボス部と、該ボス部の外周に形成され該切削ブレードの切り刃を露出させて支持するリング状の支持部と、該ボス部と該支持部との間に開口し該切削ブレードを吸引保持する吸引孔と、該吸引孔を吸引源に連通する連通路とを含み、
該連通路には圧力計が配設され、該圧力計が計測した値が許容値に達しない場合は該回転軸の回転開始を阻止し、該圧力計が計測した値が許容値に達した場合は該回転軸の回転開始を許容する制御手段を備える切削装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019208983A JP2021079490A (ja) | 2019-11-19 | 2019-11-19 | 切削装置 |
KR1020200147613A KR20210061266A (ko) | 2019-11-19 | 2020-11-06 | 절삭 장치 |
CN202011251567.8A CN112908888A (zh) | 2019-11-19 | 2020-11-11 | 切削装置 |
TW109140222A TW202120255A (zh) | 2019-11-19 | 2020-11-18 | 切削裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019208983A JP2021079490A (ja) | 2019-11-19 | 2019-11-19 | 切削装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2021079490A true JP2021079490A (ja) | 2021-05-27 |
Family
ID=75963253
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019208983A Pending JP2021079490A (ja) | 2019-11-19 | 2019-11-19 | 切削装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2021079490A (ja) |
KR (1) | KR20210061266A (ja) |
CN (1) | CN112908888A (ja) |
TW (1) | TW202120255A (ja) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03100044U (ja) * | 1990-01-30 | 1991-10-18 | ||
JP2015023222A (ja) * | 2013-07-22 | 2015-02-02 | 株式会社ディスコ | 切削装置 |
JP2015023139A (ja) * | 2013-07-18 | 2015-02-02 | 株式会社ディスコ | 切削装置 |
JP2020142342A (ja) * | 2019-03-08 | 2020-09-10 | 株式会社ディスコ | 切削装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002154054A (ja) | 2000-11-17 | 2002-05-28 | Disco Abrasive Syst Ltd | 切削ブレードの装着機構 |
-
2019
- 2019-11-19 JP JP2019208983A patent/JP2021079490A/ja active Pending
-
2020
- 2020-11-06 KR KR1020200147613A patent/KR20210061266A/ko active Search and Examination
- 2020-11-11 CN CN202011251567.8A patent/CN112908888A/zh active Pending
- 2020-11-18 TW TW109140222A patent/TW202120255A/zh unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03100044U (ja) * | 1990-01-30 | 1991-10-18 | ||
JP2015023139A (ja) * | 2013-07-18 | 2015-02-02 | 株式会社ディスコ | 切削装置 |
JP2015023222A (ja) * | 2013-07-22 | 2015-02-02 | 株式会社ディスコ | 切削装置 |
JP2020142342A (ja) * | 2019-03-08 | 2020-09-10 | 株式会社ディスコ | 切削装置 |
Also Published As
Publication number | Publication date |
---|---|
KR20210061266A (ko) | 2021-05-27 |
TW202120255A (zh) | 2021-06-01 |
CN112908888A (zh) | 2021-06-04 |
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