JP2021063293A5 - - Google Patents
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- JP2021063293A5 JP2021063293A5 JP2020168565A JP2020168565A JP2021063293A5 JP 2021063293 A5 JP2021063293 A5 JP 2021063293A5 JP 2020168565 A JP2020168565 A JP 2020168565A JP 2020168565 A JP2020168565 A JP 2020168565A JP 2021063293 A5 JP2021063293 A5 JP 2021063293A5
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- substrate
- mask
- alignment
- film forming
- control
- Prior art date
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- 239000000758 substrate Substances 0.000 claims description 46
- 238000001514 detection method Methods 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 20
- 239000000463 material Substances 0.000 claims 5
- 238000006073 displacement reaction Methods 0.000 claims 4
- 238000005339 levitation Methods 0.000 claims 2
- 238000001179 sorption measurement Methods 0.000 claims 2
- 238000007599 discharging Methods 0.000 claims 1
Description
本発明の一実施形態によるアライメント装置は、基板とマスクの位置ずれ量を検知する位置ずれ量検知手段と、前記基板または前記マスクを相対移動させるための駆動手段と、前記位置ずれ量検知手段によって検知された位置ずれ量に基づいて、前記駆動手段を制御し、前記基板と前記マスクの位置合わせを行う制御手段と、前記基板と前記マスクの接触を検知する接触検知手段と、を含み、前記制御手段は、前記接触検知手段による接触の検知結果に基づいて、前記駆動手段の出力を調整するように構成されることを特徴とする。
An alignment apparatus according to an embodiment of the present invention includes positional deviation amount detection means for detecting a positional deviation amount between a substrate and a mask , driving means for relatively moving the substrate or the mask, and the positional deviation amount detection means. a control means for controlling the driving means and aligning the substrate and the mask based on the amount of positional deviation detected by a contact detection means for detecting contact between the substrate and the mask; The control means is configured to adjust the output of the drive means based on the result of contact detection by the contact detection means.
本発明の一実施形態によるアライメント方法は、基板とマスクの位置ずれ量を検知する位置ずれ量検知手段と、前記基板または前記マスクを相対移動させるための駆動手段と、前記駆動手段を制御する制御手段を含む成膜装置を用いて、前記基板および前記マスクを位置調整するためのアライメント方法であって、前記位置ずれ量検知手段により、前記基板と前記マスクの位置ずれ量を検知する位置ずれ量検知工程と、検知された前記位置ずれ量に基づいて、前記制御手段により前記駆動手段を制御することで、前記基板と前記マスクの位置合わせを行う工程と、を含み、前記制御手段は、前記位置合わせ工程中に、前記基板と前記マスクの接触を検知し、前記駆動手段の出力を調整するように制御することを
特徴とする。
An alignment method according to an embodiment of the present invention includes positional deviation amount detection means for detecting a positional deviation amount between a substrate and a mask , driving means for relatively moving the substrate or the mask, and controlling the driving means. An alignment method for adjusting the positions of the substrate and the mask using a film forming apparatus including a control means, wherein the positional deviation amount of the substrate and the mask is detected by the positional deviation amount detection means. and a step of aligning the substrate and the mask by controlling the drive means by the control means based on the detected positional deviation amount , wherein the control means is characterized by detecting contact between the substrate and the mask during the alignment process and controlling the output of the drive means to adjust.
Claims (19)
前記基板または前記マスクを相対移動させるための駆動手段と、
前記位置ずれ量検知手段によって検知された位置ずれ量に基づいて、前記駆動手段を制御し、前記基板と前記マスクの位置合わせを行う制御手段と、
前記基板と前記マスクの接触を検知する接触検知手段と、を含み、
前記制御手段は、前記接触検知手段による接触の検知結果に基づいて、前記駆動手段の出力を調整するように構成されることを特徴とするアライメント装置。 misalignment amount detection means for detecting a misalignment amount between the substrate and the mask ;
driving means for relatively moving the substrate or the mask;
a control means for controlling the driving means based on the positional deviation amount detected by the positional deviation amount detecting means to align the substrate and the mask ;
contact detection means for detecting contact between the substrate and the mask;
The alignment apparatus according to claim 1, wherein the control means is configured to adjust the output of the drive means based on the result of contact detection by the contact detection means.
前記駆動手段は、基板を吸着した前記基板吸着手段を前記マスクに対し相対移動させるリニアモーターであることを特徴とする請求項４に記載のアライメント装置。 further comprising substrate adsorption means for adsorbing the substrate;
5. The alignment apparatus according to claim 4 , wherein said driving means is a linear motor for relatively moving said substrate attracting means that has attracted the substrate with respect to said mask.
前記基板吸着手段は、前記可動プレート部に設置され、
前記駆動手段は、前記可動プレート部を磁気浮上した状態で移動させるリニアモーターであることを特徴とする請求項７に記載のアライメント装置。 further comprising a magnetic levitation stage mechanism having a fixed plate portion and a movable plate portion capable of moving relative to the fixed plate portion while being magnetically levitated;
The substrate adsorption means is installed on the movable plate portion,
8. An alignment apparatus according to claim 7 , wherein said driving means is a linear motor for moving said movable plate portion in a magnetically levitated state.
前記真空容器内に設けられ、前記基板及び前記マスクを位置調整するための請求項１～９の何れか一項に記載のアライメント装置と、
前記真空容器内に設けられ、成膜材料を収納し、前記成膜材料を粒子化して放出するための成膜源と、を含むことを特徴とする成膜装置。 A film forming apparatus for forming a film of a film forming material on a substrate through a mask, comprising: a vacuum vessel;
an alignment apparatus according to any one of claims 1 to 9 , which is provided in the vacuum vessel and for adjusting the positions of the substrate and the mask;
A film forming apparatus, comprising: a film forming source provided in the vacuum vessel, containing a film forming material, and for granulating and discharging the film forming material.
前記位置ずれ量検知手段により、前記基板と前記マスクの位置ずれ量を検知する位置ずれ量検知工程と、
検知された前記位置ずれ量に基づいて、前記制御手段により前記駆動手段を制御することで、前記基板と前記マスクの位置合わせを行う工程と、を含み、
前記制御手段は、前記位置合わせ工程中に、前記基板と前記マスクの接触を検知し、前記駆動手段の出力を調整するように制御することを特徴とするアライメント方法。 Using a film forming apparatus including a positional deviation amount detecting means for detecting a positional deviation amount between a substrate and a mask , a driving means for relatively moving the substrate or the mask, and a control means for controlling the driving means, An alignment method for aligning the substrate and the mask, comprising:
a positional deviation amount detection step of detecting a positional deviation amount between the substrate and the mask by the positional deviation amount detection means;
a step of aligning the substrate and the mask by controlling the driving means by the control means based on the detected positional deviation amount ;
The alignment method, wherein the control means detects contact between the substrate and the mask during the alignment process, and controls to adjust the output of the drive means.
板を吸着した前記基板吸着手段を前記マスクに対し相対移動させるリニアモーターであることを特徴とする請求項１３に記載のアライメント方法。 3. The film forming apparatus further includes substrate chucking means for chucking the substrate, and the drive means is a linear motor for relatively moving the substrate chucking means chucking the substrate with respect to the mask . 13. The alignment method according to 13 .
請求項１１～１８の何れか一項に記載のアライメント方法により、前記基板及び前記マスクを位置調整する工程と、
成膜源によって粒子化された成膜材料を、前記マスクを介して前記基板に成膜する工程と、
を含むことを特徴とする成膜方法。
A film forming method for forming a film of a film forming material on a substrate through a mask,
A step of adjusting the positions of the substrate and the mask by the alignment method according to any one of claims 11 to 18 ;
forming a film of a film forming material granulated by a film forming source on the substrate through the mask;
A film forming method comprising:
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2019-0126092 | 2019-10-11 | ||
| KR20190126092 | 2019-10-11 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2021063293A JP2021063293A (en) | 2021-04-22 |
| JP2021063293A5 true JP2021063293A5 (en) | 2022-11-30 |
| JP7449215B2 JP7449215B2 (en) | 2024-03-13 |
Family
ID=75346639
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020168565A Active JP7449215B2 (en) | 2019-10-11 | 2020-10-05 | Alignment equipment, alignment method, film forming equipment and film forming method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7449215B2 (en) |
| KR (1) | KR20210043464A (en) |
| CN (1) | CN112652565A (en) |
| TW (1) | TW202115822A (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4534011B2 (en) | 2004-06-25 | 2010-09-01 | 京セラ株式会社 | Display manufacturing method using mask alignment method |
| JP2012079480A (en) * | 2010-09-30 | 2012-04-19 | Hitachi High-Technologies Corp | Organic el device manufacturing apparatus and organic el device manufacturing method |
| JP2012092397A (en) | 2010-10-27 | 2012-05-17 | Canon Inc | Alignment method, alignment apparatus, and method and apparatus for manufacturing organic el display device |
| US10361099B2 (en) | 2017-06-23 | 2019-07-23 | Applied Materials, Inc. | Systems and methods of gap calibration via direct component contact in electronic device manufacturing systems |
-
2020
- 2020-10-05 JP JP2020168565A patent/JP7449215B2/en active Active
- 2020-10-07 KR KR1020200129580A patent/KR20210043464A/en not_active Application Discontinuation
- 2020-10-07 TW TW109134757A patent/TW202115822A/en unknown
- 2020-10-10 CN CN202011078353.5A patent/CN112652565A/en active Pending
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