JP2021061300A - Light emitting module, lighting device, and manufacturing method of light emitting module - Google Patents

Light emitting module, lighting device, and manufacturing method of light emitting module Download PDF

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JP2021061300A
JP2021061300A JP2019183950A JP2019183950A JP2021061300A JP 2021061300 A JP2021061300 A JP 2021061300A JP 2019183950 A JP2019183950 A JP 2019183950A JP 2019183950 A JP2019183950 A JP 2019183950A JP 2021061300 A JP2021061300 A JP 2021061300A
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light emitting
emitting module
emitting element
elastomer
light
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JP7447421B2 (en
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晃三 丸田
Kozo Maruta
晃三 丸田
幸久 武田
Yukihisa Takeda
幸久 武田
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Iwasaki Denki KK
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Abstract

To easily replace a part and easily obtain an airtight structure.SOLUTION: A light emitting module 101 includes a printed circuit board 110 and a light emitting element 121 provided on the mounting surface 110A of the printed circuit board 110, and the mounting surface 110A includes an airtight layer 131 made of a transparent elastomer that airtightly seals the light emitting element 121.SELECTED DRAWING: Figure 5

Description

本発明は、発光モジュール、照明器具及び発光モジュールの製造方法に関する。 The present invention relates to a light emitting module, a luminaire, and a method for manufacturing a light emitting module.

照明器具には、ＬＥＤ等の光源を備え、かつ防爆構造を有した防爆照明器具が知られている。この種の照明器具には、反射型発光ダイオードと基板とを黒色の樹脂で封止した後に容器内に配置し、容器内に光透過性材料を充填した防爆構造（例えば特許文献１参照）や、半導体発光素子を密封的に囲む光透過性のゲル層を備え、ゲル層内に複屈折性微粒子を分散させて光散乱特性を得た防爆構造（例えば特許文献２参照）や、リフレクタの内側で、ＬＥＤチップ及びボンディングワイヤをシリコーン樹脂で封止した防爆構造（例えば特許文献３参照）が開示されている。 Explosion-proof luminaires provided with a light source such as an LED and having an explosion-proof structure are known as luminaires. In this type of lighting equipment, a reflective light emitting diode and a substrate are sealed with a black resin and then placed in a container, and the container is filled with a light-transmitting material to provide an explosion-proof structure (see, for example, Patent Document 1). , An explosion-proof structure (see, for example, Patent Document 2) having a light-transmitting gel layer that seals the semiconductor light-emitting element and obtaining light scattering characteristics by dispersing birefringent fine particles in the gel layer, and the inside of a reflector. Therefore, an explosion-proof structure in which an LED chip and a bonding wire are sealed with a silicone resin (see, for example, Patent Document 3) is disclosed.

特開平７−１５０４７号公報Japanese Unexamined Patent Publication No. 7-1504 特開２０１４−２３２６４１号公報Japanese Unexamined Patent Publication No. 2014-232641 特開２００７−０８８０９１号公報Japanese Unexamined Patent Publication No. 2007-088091

しかし、特許文献１記載の構成は、容器内の全体に樹脂を充填するので、基板等の内部部品へのアクセスが困難であり、内部部品に不良があると、容器ごと交換する必要がある。特許文献２及び３記載の構成も基板等の内部部品へのアクセスが困難であり、内部部品の交換ができない。しかも、特許文献２及び３記載の構成は、封止材に複屈折性微粒子を分散させたり、リフレクタの内側に樹脂を封止させたりするので、構造や製造作業の複雑化を招く。 However, in the configuration described in Patent Document 1, since the entire container is filled with resin, it is difficult to access internal parts such as a substrate, and if the internal parts are defective, it is necessary to replace the entire container. Also in the configurations described in Patent Documents 2 and 3, it is difficult to access the internal parts such as the substrate, and the internal parts cannot be replaced. Moreover, in the configurations described in Patent Documents 2 and 3, the birefringent fine particles are dispersed in the sealing material and the resin is sealed inside the reflector, which causes the structure and the manufacturing work to be complicated.

本発明は、部品交換が容易で、かつ、簡易に気密構造を得ることを目的とする。 An object of the present invention is to easily obtain an airtight structure in which parts can be easily replaced.

上記目的を達成するために、プリント基板と、前記プリント基板の実装面に設けられる発光素子とを備える発光モジュールにおいて、前記実装面に、前記発光素子を気密封止する透明なエラストマーを有することを特徴とする。 In order to achieve the above object, in a light emitting module including a printed circuit board and a light emitting element provided on a mounting surface of the printed circuit board, the mounting surface is provided with a transparent elastomer that airtightly seals the light emitting element. It is a feature.

上記発光モジュールにおいて、前記エラストマーは、前記発光素子からの光が通る領域に前記光の出射方向を制御する光制御部を有していることを特徴とする。 In the light emitting module, the elastomer is characterized by having an optical control unit that controls an emission direction of the light in a region through which light from the light emitting element passes.

また、上記発光モジュールにおいて、前記光制御部は、前記エラストマーの外表面のうち、前記発光素子からの光が入射する領域に設けられた凸面であることを特徴とする。 Further, in the light emitting module, the light control unit is characterized by being a convex surface provided on a region of the outer surface of the elastomer in which light from the light emitting element is incident.

また、上記発光モジュールにおいて、前記エラストマーは、前記実装面における配線パターン及び前記発光素子を覆うベース部と、前記ベース部から突出して前記凸面を形成する第１突出部と、前記第１突出部よりも更に突出する第２突出部とを有し、前記第２突出部は、当該発光モジュールに対向して配置される透光性カバーに接触することを特徴とする。 Further, in the light emitting module, the elastomer is formed from a wiring pattern on the mounting surface, a base portion covering the light emitting element, a first protruding portion protruding from the base portion to form the convex surface, and the first protruding portion. Also has a second protruding portion that further protrudes, the second protruding portion is characterized in that it comes into contact with a translucent cover arranged so as to face the light emitting module.

また、上記発光モジュールにおいて、前記実装面には、前記発光素子よりも前記透光性カバー側に張り出す他の部品が設けられ、前記第２突出部は、前記他の部品に対応する領域に設けられても良い。 Further, in the light emitting module, the mounting surface is provided with another component that projects toward the translucent cover side of the light emitting element, and the second protruding portion is located in a region corresponding to the other component. It may be provided.

また、上記発光モジュールにおいて、前記第２突出部は、前記実装面の中央領域に設けられても良い。また、照明器具は、上記発光モジュールを有することを特徴とする。また、照明器具は、上記発光モジュールを１つ又は複数組み合わせて筐体に取り付けていることを特徴とする。 Further, in the light emitting module, the second protruding portion may be provided in the central region of the mounting surface. Further, the luminaire is characterized by having the above-mentioned light emitting module. Further, the luminaire is characterized in that one or a plurality of the above light emitting modules are attached to the housing.

プリント基板と、前記プリント基板の実装面に設けられる発光素子とを備える発光モジュールの製造方法において、前記実装面に対し、前記発光素子を含む所定の領域に透明なエラストマーを密着させ、前記発光素子を気密封止する気密層を形成することを特徴とする。 In a method for manufacturing a light emitting module including a printed circuit board and a light emitting element provided on a mounting surface of the printed circuit board, a transparent elastomer is brought into close contact with the mounting surface in a predetermined region including the light emitting element, and the light emitting element is formed. It is characterized by forming an airtight layer that airtightly seals the material.

上記製造方法において、前記所定の領域を含む空間を減圧する減圧工程を行い、前記減圧した状態で、前記所定の領域に前記エラストマーを密着させることを特徴とする。 The manufacturing method is characterized in that a depressurizing step of depressurizing a space including the predetermined region is performed, and the elastomer is brought into close contact with the predetermined region in the depressurized state.

また、上記製造方法において、前記実装面上に前記エラストマーを充填した後、減圧環境にすることで前記エラストマーから気泡を抜く脱泡工程を行うことを特徴とする。 Further, in the above manufacturing method, after filling the mounting surface with the elastomer, a defoaming step of removing air bubbles from the elastomer is performed by creating a reduced pressure environment.

本発明によれば、部品交換が容易で、かつ、簡易な構成で樹脂充填防爆形照明器具に使用できる気密構造を得ることができる。 According to the present invention, it is possible to obtain an airtight structure that can be easily used for a resin-filled explosion-proof luminaire with easy parts replacement and a simple configuration.

本発明の第１実施形態に係る発光ユニットを利用した照明器具の一例を示す図である。It is a figure which shows an example of the luminaire using the light emitting unit which concerns on 1st Embodiment of this invention. 発光ユニットを利用した照明器具の他の例を示す図である。It is a figure which shows another example of the luminaire using a light emitting unit. 発光ユニットの側断面図である。It is a side sectional view of a light emitting unit. 発光モジュールの斜視図である。It is a perspective view of a light emitting module. 発光モジュールの側断面図である。It is a side sectional view of a light emitting module. 発光素子を周辺構成と共に示す断面図である。It is sectional drawing which shows the light emitting element together with the peripheral structure. 気密層の製造工程を示す図である。It is a figure which shows the manufacturing process of the airtight layer. 気密層の他の製造工程を模式的に示す図である。It is a figure which shows typically the other manufacturing process of the airtight layer. 本発明の第２実施形態に係る発光ユニットの側断面図である。It is a side sectional view of the light emitting unit which concerns on 2nd Embodiment of this invention.

以下、図面を参照して本発明の実施形態について説明する。
（第１実施形態）
図１は、本発明の発光モジュールを採用した第１実施形態に係る発光ユニットを利用した照明器具の一例を示す図である。図１に示す照明器具１０Ａは、建物の天井面に固定される固定具１１Ａと、固定具１１Ａに吊りパイプ１２を介して支持される筐体（以下、器具筐体という）１３Ａとを備え、器具筐体１３Ａに複数の発光ユニット２１を下向きに取り付けることによって、高天井用照明器具に形成されている。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.
(First Embodiment)
FIG. 1 is a diagram showing an example of a lighting fixture using a light emitting unit according to a first embodiment using the light emitting module of the present invention. The lighting fixture 10A shown in FIG. 1 includes a fixture 11A fixed to the ceiling surface of the building and a housing (hereinafter, referred to as a fixture housing) 13A supported by the fixture 11A via a suspension pipe 12. By attaching a plurality of light emitting units 21 downward to the fixture housing 13A, the lighting fixture for a high ceiling is formed.

固定具１１Ａは、防爆形の配管付属品として使用される結線ボックス１６を用いて天井面に固定され、結線ボックス１６内で商用電源の電源線と結線される。器具筐体１３Ａは、下方が開口する金属製の箱形状に形成され、下方の開口を覆うように複数（９個）の発光ユニット２１が取り付けられる。
本実施形態の発光ユニット２１は、樹脂充填防爆形に相当する構造を有している。これにより、発光ユニット２１を配置する容器に相当する器具筐体１３Ａに気密封止のための構造を設けることなく、可燃ガス、腐食性ガス又は水蒸気等が発生しうる施設での使用に好適な高天井用照明器具が得られる。 The fixture 11A is fixed to the ceiling surface using a connection box 16 used as an explosion-proof piping accessory, and is connected to a power supply line of a commercial power source in the connection box 16. The fixture housing 13A is formed in the shape of a metal box with an opening at the bottom, and a plurality (9) of light emitting units 21 are attached so as to cover the opening at the bottom.
The light emitting unit 21 of the present embodiment has a structure corresponding to a resin-filled explosion-proof type. This makes it suitable for use in facilities where flammable gas, corrosive gas, water vapor, etc. can be generated without providing a structure for airtight sealing in the fixture housing 13A corresponding to the container in which the light emitting unit 21 is arranged. High ceiling lighting fixtures can be obtained.

図２は、発光ユニット２１を利用した照明器具の他の例を示す図である。図２に示す照明器具１０Ｂは、地面等から立設するポールに固定されるパイプ状の固定具１１Ｂと、固定具１１Ｂに支持される器具筐体１３Ｂとを備え、器具筐体１３Ｂに周囲を照明可能に複数（８個）の発光ユニット２１を取り付けることによって、街路灯用途の照明器具に形成されている。発光ユニット２１は、樹脂充填防爆形に相当する構造を有しているので、屋外使用の場合に要求される気密性や防水性等を満たしている。これにより、器具筐体１３Ｂに気密封止のための構造を設けることなく、屋外使用可能な照明器具が得られる。 FIG. 2 is a diagram showing another example of a lighting fixture using the light emitting unit 21. The lighting fixture 10B shown in FIG. 2 includes a pipe-shaped fixture 11B fixed to a pole erected from the ground or the like, and a fixture housing 13B supported by the fixture 11B. By attaching a plurality (8) light emitting units 21 so that they can be illuminated, the lighting fixture is formed for street lighting. Since the light emitting unit 21 has a structure corresponding to a resin-filled explosion-proof type, it satisfies the airtightness, waterproofness, and the like required for outdoor use. As a result, a lighting fixture that can be used outdoors can be obtained without providing a structure for airtight sealing in the fixture housing 13B.

また、各照明器具１０Ａ，１０Ｂにおいて、発光ユニット２１の台数及び配置等を適宜に変更することで、様々な仕様へ対応し易くなる。このように、本実施形態の発光ユニット２１を利用することで、防爆性能、又は防水性能等が要求される様々な照明器具を実現し易くなり、例えば、水中照明用の照明器具も容易に実現可能である。 Further, in each of the lighting fixtures 10A and 10B, by appropriately changing the number and arrangement of the light emitting units 21, it becomes easy to correspond to various specifications. As described above, by using the light emitting unit 21 of the present embodiment, it becomes easy to realize various lighting fixtures that are required to have explosion-proof performance or waterproof performance, and for example, a lighting fixture for underwater lighting can be easily realized. It is possible.

図３は、発光ユニット２１の側断面図を示している。
発光ユニット２１は、光を放射する発光モジュール１０１が配置される筐体２２と、筐体２２に配置された発光モジュール１０１を覆う保護カバー２３と、保護カバー２３を筐体２２側に押さえる押さえ部材２４とを有している。
筐体２２は、発光モジュール１０１が載置される板状の載置部２２Ａと、載置部２２Ａに載置された発光モジュール１０１の周囲を連続して囲う周壁部２２Ｂと、載置部２２Ａにおける発光モジュール１０１の反対側の面から突出する放熱フィン２２Ｃとを一体に備えている。この筐体２２は、アルミニウム合金等の剛性を有し、かつ、熱伝導性を有する材料で形成され、上記防爆性能、及び防水性能等のいずれかで要求される各種の条件を満たしている。 FIG. 3 shows a side sectional view of the light emitting unit 21.
The light emitting unit 21 includes a housing 22 in which a light emitting module 101 that emits light is arranged, a protective cover 23 that covers the light emitting module 101 arranged in the housing 22, and a pressing member that presses the protective cover 23 toward the housing 22 side. It has 24 and.
The housing 22 includes a plate-shaped mounting portion 22A on which the light emitting module 101 is mounted, a peripheral wall portion 22B that continuously surrounds the light emitting module 101 mounted on the mounting portion 22A, and a mounting portion 22A. The heat radiation fin 22C projecting from the surface opposite to the light emitting module 101 in the above is integrally provided. The housing 22 is made of a material having rigidity such as an aluminum alloy and having thermal conductivity, and satisfies various conditions required for any of the above-mentioned explosion-proof performance, waterproof performance, and the like.

載置部２２Ａと周壁部２２Ｂとによって囲まれた領域は、発光モジュール１０１が配置されるモジュール配置空間２２Ｋを形成している。このモジュール配置空間２２Ｋの幅ＷＡは、発光モジュール１０１の幅Ｗ１よりも大きく、かつ、モジュール配置空間２２Ｋの深さＤＡは、発光モジュール１０１の厚さＤ１よりも大きく形成されている。
本構成では、発光モジュール１０１が載置される載置部２２Ａに放熱フィン２２Ｃが一体に設けられるので、発光モジュール１０１の熱を効率良く放熱できると共に、放熱構造を含む筐体２２を小型薄型化でき、発光モジュール１０１全体の小型薄型化ができる。 The area surrounded by the mounting portion 22A and the peripheral wall portion 22B forms a module arrangement space 22K in which the light emitting module 101 is arranged. The width WA of the module arrangement space 22K is larger than the width W1 of the light emitting module 101, and the depth DA of the module arrangement space 22K is formed larger than the thickness D1 of the light emitting module 101.
In this configuration, since the heat radiating fins 22C are integrally provided on the mounting portion 22A on which the light emitting module 101 is mounted, the heat of the light emitting module 101 can be efficiently radiated, and the housing 22 including the heat radiating structure is made smaller and thinner. This makes it possible to reduce the size and thickness of the entire light emitting module 101.

載置部２２Ａには、発光モジュール１０１のプリント基板１１０に設けられた孔部ＨＬにそれぞれ係合する突起２２Ｔが設けられ、これら突起２２Ｔにより発光モジュール１０１が載置部２２Ａに位置決めされる。また、載置部２２Ａには、放熱フィン２２Ｃ側から発光モジュール１０１に電気的接続するための配線部品（配線、又はコネクタ等）が通る孔部２２Ｈが形成されている。この孔部２２Ｈは、配線部品を通した後に所定の封止材３１によって封止される。この封止材３１には、気密性及び絶縁性等を確保可能なポリマー材料等が適用され、例えば、シリコーン系又はオレフィン系等のエラストマーが適用される。 The mounting portion 22A is provided with protrusions 22T that engage with the holes HL provided in the printed circuit board 110 of the light emitting module 101, and the light emitting module 101 is positioned on the mounting portion 22A by these protrusions 22T. Further, the mounting portion 22A is formed with a hole portion 22H through which wiring components (wiring, a connector, etc.) for electrically connecting to the light emitting module 101 from the heat radiation fin 22C side pass. The hole 22H is sealed with a predetermined sealing material 31 after passing through the wiring component. A polymer material or the like capable of ensuring airtightness and insulating properties is applied to the sealing material 31, and for example, an elastomer such as a silicone-based or olefin-based elastomer is applied.

保護カバー２３は、発光モジュール１０１の光照射側に配置され、発光モジュール１０１の光を透過する透光性を有する透光性カバー、及び発光モジュール１０１の光照射側を保護する保護部材として機能する。この保護カバー２３は、防爆照明器具の仕様を満たす材質、肉厚及び機械的強度を有している。この種の保護カバーには、通常、強化ガラスが採用されるが、発光ユニット２１が防爆仕様の照明器具に使用されない場合は、肉薄の透光性樹脂等を保護カバー２３として採用することも可能である。
押さえ部材２４は、筐体２２の周壁部２２Ｂに沿って延在する枠状に形成され、保護カバー２３の外周部を筐体２２側に押さえた状態で、図３に示す締結部材（例えば締結ボルト）４１によって周壁部２２Ｂに固定される。この押さえ部材２４についても、上記防爆性能の条件を満たす材質、肉厚及び機械的強度を有している。この締結部材４１を取り外すことによって、押さえ部材２４、保護カバー２３及び発光モジュール１０１のそれぞれを容易に取り外すことができ、これらの交換等が容易である。 The protective cover 23 is arranged on the light irradiation side of the light emitting module 101, and functions as a translucent cover that transmits light of the light emitting module 101 and a protective member that protects the light irradiation side of the light emitting module 101. .. The protective cover 23 has a material, wall thickness, and mechanical strength that meet the specifications of an explosion-proof luminaire. Tempered glass is usually used for this type of protective cover, but if the light emitting unit 21 is not used for explosion-proof lighting equipment, a thin translucent resin or the like can be used as the protective cover 23. Is.
The pressing member 24 is formed in a frame shape extending along the peripheral wall portion 22B of the housing 22, and the fastening member (for example, fastening) shown in FIG. 3 is held in a state where the outer peripheral portion of the protective cover 23 is pressed toward the housing 22. It is fixed to the peripheral wall portion 22B by the bolt) 41. The pressing member 24 also has a material, a wall thickness, and a mechanical strength that satisfy the above-mentioned explosion-proof performance. By removing the fastening member 41, each of the holding member 24, the protective cover 23, and the light emitting module 101 can be easily removed, and their replacement or the like can be easily performed.

図４は、発光モジュール１０１の斜視図を示している。本実施形態の発光モジュール１０１は、一辺が上記幅Ｗ１の長さに形成された正方形板状のプリント基板１１０を備え、このプリント基板１１０の片面である実装面１１０Ａに複数の発光素子１２１が実装されている。なお、プリント基板１１０は、正方形板状以外の矩形板状等に適宜に変更してもよい。この実装面１１０Ａには、全ての発光素子１２１を覆う透明なエラストマーからなる気密層（気密カバーと称することもできる）１３１が設けられ、この気密層１３１により、発光モジュール１０１単体で、発光素子１２１等にガスや水分が入り込まない気密性を得ている。
より具体的には、プリント基板１１０の実装面１１０Ａには、配線パターン１２２が形成されており、この配線パターン１２２に合わせて複数の発光素子１２１、及び発光素子１２１以外の電気部品１２３が実装されることによって、発光素子１２１を含む所定の電気回路が形成される。気密層１３１は、配線パターン１２２、発光素子１２１及び電気部品１２３を覆うことで、これらを気密状態に封止している。 FIG. 4 shows a perspective view of the light emitting module 101. The light emitting module 101 of the present embodiment includes a square plate-shaped printed circuit board 110 whose side is formed to have the width W1 on one side, and a plurality of light emitting elements 121 are mounted on the mounting surface 110A which is one side of the printed circuit board 110. Has been done. The printed circuit board 110 may be appropriately changed to a rectangular plate shape other than the square plate shape. An airtight layer (also referred to as an airtight cover) 131 made of a transparent elastomer covering all the light emitting elements 121 is provided on the mounting surface 110A, and the light emitting module 101 alone is provided with the airtight layer 131. It is airtight so that gas and water do not enter.
More specifically, a wiring pattern 122 is formed on the mounting surface 110A of the printed circuit board 110, and a plurality of light emitting elements 121 and electrical components 123 other than the light emitting element 121 are mounted according to the wiring pattern 122. As a result, a predetermined electric circuit including the light emitting element 121 is formed. The airtight layer 131 covers the wiring pattern 122, the light emitting element 121, and the electric component 123 to seal them in an airtight state.

本実施形態では、プリント基板１１０の中央領域を避けて多数の発光素子１２１が格子状に配列され、中央領域に、発光素子１２１よりも厚みを有する電気部品１２３がまとめて配置されている。この発光素子１２１には、ＳＭＤ型のＬＥＤチップが用いられる。なお、各発光素子１２１及び電気部品１２３の配置は適宜に変更してもよいし、発光素子１２１に公知の他の発光素子を用いてもよい。 In the present embodiment, a large number of light emitting elements 121 are arranged in a grid pattern avoiding the central region of the printed circuit board 110, and electric components 123 having a thickness thicker than that of the light emitting element 121 are collectively arranged in the central region. An SMD type LED chip is used for the light emitting element 121. The arrangement of each light emitting element 121 and the electric component 123 may be appropriately changed, or another known light emitting element may be used for the light emitting element 121.

気密層１３１を構成するエラストマーには、発光素子１２１の光が十分に透過可能な透光性、及び十分な電気絶縁性（以下単に「絶縁性」とも称する）を有する弾性材からなるポリマー材料等を広く適用できる。本実施形態のエラストマーには、透明性及び耐熱性等に優れたシリコーンゴムを適用している。なお、シリコーンゴムに限定されず、例えば透明のエポキシ樹脂でもよい。 The elastomer constituting the airtight layer 131 includes a polymer material made of an elastic material having sufficient translucency through which the light of the light emitting element 121 can be sufficiently transmitted and sufficient electrical insulation (hereinafter, also simply referred to as “insulation”). Can be widely applied. Silicone rubber having excellent transparency, heat resistance, etc. is applied to the elastomer of the present embodiment. The type is not limited to silicone rubber, and may be, for example, a transparent epoxy resin.

（発光モジュール１０１について）
図５は、発光モジュール１０１の側断面図を示している。
図４及び図５に示すように、気密層１３１は、発光素子１２１及び配線パターン１２２を覆うベース部１３１Ａと、各発光素子１２１に対向する位置でベース部１３１Ａから突出する凸面をそれぞれ形成する第１突出部１３１Ｂと、中央領域にてベース部１３１Ａから突出する第２突出部１３１Ｃとを一体に有している。ベース部１３１Ａの厚さＤＭ１（図５参照）は、外部から配線パターン１２２及び発光素子１２１への電気的離隔距離を十分に確保できる厚さに形成されている。 (About the light emitting module 101)
FIG. 5 shows a side sectional view of the light emitting module 101.
As shown in FIGS. 4 and 5, the airtight layer 131 forms a base portion 131A that covers the light emitting element 121 and the wiring pattern 122, and a convex surface that protrudes from the base portion 131A at a position facing each light emitting element 121. It integrally has one protruding portion 131B and a second protruding portion 131C protruding from the base portion 131A in the central region. The thickness DM1 (see FIG. 5) of the base portion 131A is formed to a thickness that can sufficiently secure an electrical separation distance from the outside to the wiring pattern 122 and the light emitting element 121.

第１突出部１３１Ｂは、気密層１３１の外表面のうち、各発光素子１２１の出射光軸Ｌ１を中心とした所定角度範囲（図５中、符号θ１で示す角度の範囲）に渡って設けられた凸面を形成する。なお、発光素子１２１（の中心）から発する光が、隣の第１突出部１３１Ｂに当たらない角度範囲をθ１とする。
凸面にすることで、平坦面にする場合と比べ、気密層１３１の表面で全反射される光を低減でき、光の利用効率が向上する。この凸面は、楕円球面等の球面形状に形成され、各発光素子１２１からの光を、保護カバー２３を通過して照射エリアに向かう方向に高精度に制御する。なお、照明光として利用可能な方向に制御できる範囲で、第１突出部１３１Ｂを球面形状以外の形状にしてもよい。このようにして、第１突出部１３１Ｂは、発光素子１２１からの光の全反射を抑制すると共に、その光の出射方向を制御する光制御部として機能する。 The first protrusion 131B is provided on the outer surface of the airtight layer 131 over a predetermined angle range (the range of angles indicated by reference numerals θ1 in FIG. 5) centered on the emission light axis L1 of each light emitting element 121. Form a convex surface. The angle range in which the light emitted from (the center of) the light emitting element 121 does not hit the adjacent first protruding portion 131B is defined as θ1.
By making the surface convex, the light totally reflected by the surface of the airtight layer 131 can be reduced as compared with the case where the surface is flat, and the light utilization efficiency is improved. This convex surface is formed in a spherical shape such as an elliptical spherical surface, and the light from each light emitting element 121 is controlled with high accuracy in the direction of passing through the protective cover 23 and toward the irradiation area. The first protrusion 131B may have a shape other than the spherical shape as long as it can be controlled in a direction that can be used as illumination light. In this way, the first protruding portion 131B functions as an optical control unit that suppresses total reflection of light from the light emitting element 121 and controls the emission direction of the light.

例えば、角度θ１は、各発光素子１２１の出射光軸Ｌ１を中心とした所定角度（例えば１００度）に設定され、各発光素子１２１からの光を効率良く照明エリアに向けて出射させる。なお、角度θ１は、発光素子１２１の出射特性等に合わせて適宜な値に設定すればよい。 For example, the angle θ1 is set to a predetermined angle (for example, 100 degrees) centered on the emission light axis L1 of each light emitting element 121, and the light from each light emitting element 121 is efficiently emitted toward the illumination area. The angle θ1 may be set to an appropriate value according to the emission characteristics of the light emitting element 121 and the like.

第２突出部１３１Ｃの厚さＤＭ２は、図４に示す電気部品１２３への電気的離隔距離を十分に確保する厚みであって、かつ、図３に示す保護カバー２３の裏面に当接する長さに形成される。これにより、第２突出部１３１Ｃが、保護カバー２３を弾性支持する支持部材を兼用し、保護カバー２３に外力が作用した場合に、保護カバー２３の撓みを抑えることができる。しかも、第２突出部１３１Ｃは、プリント基板１１０の中央（発光モジュール１０１及び保護カバー２３の中央に相当）に設けられるので、保護カバー２３の最大撓みを効率良く抑えることができる。保護カバー２３の撓みを抑えることができるので、保護カバー２３を薄型化し易くなり、保護カバー２３を軽量化し易くなる。
例えば防爆仕様の照明器具においては、保護カバー２３は「鋼球落下試験」に合格できる厚さを有する必要があるが、第２突出部１３１Ｃが、保護カバー２３を弾性支持する支持部材となっている構造を採用することで、第２突出部１３１Ｃが無い場合より保護カバー２３を薄くしても「鋼球落下試験」に合格できることが確認されている。 The thickness DM2 of the second protrusion 131C is a thickness that sufficiently secures an electrical separation distance from the electrical component 123 shown in FIG. 4, and is a length that abuts on the back surface of the protective cover 23 shown in FIG. Is formed in. As a result, the second protruding portion 131C also serves as a support member that elastically supports the protective cover 23, and when an external force acts on the protective cover 23, the bending of the protective cover 23 can be suppressed. Moreover, since the second protruding portion 131C is provided at the center of the printed circuit board 110 (corresponding to the center of the light emitting module 101 and the protective cover 23), the maximum bending of the protective cover 23 can be efficiently suppressed. Since the bending of the protective cover 23 can be suppressed, the protective cover 23 can be easily made thinner and the protective cover 23 can be made lighter.
For example, in an explosion-proof lighting fixture, the protective cover 23 needs to have a thickness that can pass the "steel ball drop test", but the second protrusion 131C serves as a support member that elastically supports the protective cover 23. It has been confirmed that by adopting the above structure, the "steel ball drop test" can be passed even if the protective cover 23 is made thinner than when the second protruding portion 131C is not provided.

図６は、発光素子１２１を周辺構成と共に示す断面図である。この図６には、発光素子１２１からの光を二点鎖線で示している。
第２突出部１３１Ｃは、図４及び図６に示すように、保護カバー２３に近づくほど幅狭の角錐台形状（本実施形態では四角錐台形状）に形成されている。これにより、図６に示すように、第２突出部１３１Ｃの周囲に位置する発光素子１２１からの光が、第２突出部１３１Ｃによって遮られる事態を回避し易くなる。
本実施形態では、第２突出部１３１Ｃの壁面１３１Ｍが、各発光素子１２１の出射光軸に対して角度θ２（例えば２０度）だけ傾斜した傾斜面に形成され、第１突出部１３１Ｂで出射方向が制御された光等が壁面１３１Ｍで遮られ難い。
なお、光量を十分に確保できる範囲で、角度θ２等の第２突出部１３１Ｃの各部の形状を適宜に変更してもよい。例えば、第２突出部１３１Ｃを四角錐台形状以外の角錐台形状、又は円錐台形状にしてもよいし、壁面１３１Ｍが傾斜しない角柱形状、又は円柱形状にしてもよい。 FIG. 6 is a cross-sectional view showing the light emitting element 121 together with the peripheral configuration. In FIG. 6, the light from the light emitting element 121 is shown by a chain double-dashed line.
As shown in FIGS. 4 and 6, the second protruding portion 131C is formed in a quadrangular pyramid shape (in the present embodiment, a quadrangular pyramid shape) that becomes narrower as it approaches the protective cover 23. As a result, as shown in FIG. 6, it becomes easy to avoid a situation in which the light from the light emitting element 121 located around the second protrusion 131C is blocked by the second protrusion 131C.
In the present embodiment, the wall surface 131M of the second protrusion 131C is formed on an inclined surface inclined by an angle θ2 (for example, 20 degrees) with respect to the emission optical axis of each light emitting element 121, and the emission direction is formed by the first protrusion 131B. It is difficult for the controlled light or the like to be blocked by the wall surface 131M.
The shape of each portion of the second protruding portion 131C such as an angle θ2 may be appropriately changed within a range in which a sufficient amount of light can be secured. For example, the second protruding portion 131C may have a truncated cone shape or a truncated cone shape other than the truncated quadrangular pyramid shape, or may have a prismatic shape or a cylindrical shape in which the wall surface 131M does not tilt.

ところで、発光素子１２１からは、出射光軸Ｌ１を中心とした角度θ１（図５参照）を超えた範囲からも光が出射される。この光は、気密層１３１の側面等から直接出射され、或いは、気密層１３１の表面で全反射された後に側面等から出射される。
本実施形態では、図６に示すように、発光モジュール１０１の周囲に配置される反射面５１Ｍを有する反射体５１を配置し、この反射面５１Ｍにより、発光モジュール１０１からの光を、透光性カバーとして機能する保護カバー２３に向けて反射するように構成している。 By the way, light is also emitted from the light emitting element 121 from a range beyond the angle θ1 (see FIG. 5) about the emission optical axis L1. This light is directly emitted from the side surface or the like of the airtight layer 131, or is totally reflected by the surface of the airtight layer 131 and then emitted from the side surface or the like.
In the present embodiment, as shown in FIG. 6, a reflector 51 having a reflecting surface 51M arranged around the light emitting module 101 is arranged, and the light from the light emitting module 101 is translucent by the reflecting surface 51M. It is configured to reflect toward the protective cover 23 that functions as a cover.

（反射体５１について）
図３及び図６に示すように、この反射体５１は、発光モジュール１０１の周囲に渡って連続する反射面５１Ｍを有する反射部５１Ａと、発光モジュール１０１の周囲に渡って筐体２２と保護カバー２３との間の隙間を閉塞するシール部５１Ｂとを一体に有している。この反射体５１は、発光モジュール１０１からの光を反射可能で、かつ、十分なシール性（気密性、水密性）を確保可能な可撓性等を有する弾性材で形成され、本実施形態では、白色のシリコーンゴムで形成されている。
なお、発光モジュール１０１は、矩形（本実施形態では正方形）の板形状に形成されているので、反射体５１は、この矩形の発光モジュール１０１の外周に沿って延びる矩形の枠形状に形成されている。仮に発光モジュール１０１が円板形状に形成された場合、反射体５１を、発光モジュール１０１の外周に沿って延びる環状の枠形状、或いは多角形の枠形状にしてもよい。 (About reflector 51)
As shown in FIGS. 3 and 6, the reflector 51 includes a reflecting portion 51A having a reflecting surface 51M continuous around the light emitting module 101, and a housing 22 and a protective cover around the light emitting module 101. It integrally has a seal portion 51B that closes the gap between the 23 and the 23. The reflector 51 is made of an elastic material that can reflect the light from the light emitting module 101 and has flexibility and the like that can secure sufficient sealing properties (airtightness and watertightness). , Formed of white silicone rubber.
Since the light emitting module 101 is formed in a rectangular (square in this embodiment) plate shape, the reflector 51 is formed in a rectangular frame shape extending along the outer circumference of the rectangular light emitting module 101. There is. If the light emitting module 101 is formed in a disk shape, the reflector 51 may have an annular frame shape extending along the outer circumference of the light emitting module 101 or a polygonal frame shape.

反射面５１Ｍは、発光モジュール１０１の気密層１３１の外周端ＰＸに近接し、気密層１３１の全周囲を囲うので、気密層１３１の外周端ＰＸ等から出射される光、換言すると、保護カバー２３に向けて出射されない光を反射する。この反射面５１Ｍは、この反射面５１Ｍに入射する光を保護カバー２３に向けて反射するように、発光素子１２１の出射光軸Ｌ１に対して一定の角度θ３（例えば２０度）で傾斜する傾斜面に形成されている。
本実施形態では、反射体５１の材料に白色のシリコーンゴムを用いるため、反射面５１Ｍを鏡面等にすることなく、反射面５１Ｍで十分に光を反射できる。なお、反射面５１Ｍに金属蒸着等を施すことによって、より反射率の高い鏡面にしてもよい。 Since the reflective surface 51M is close to the outer peripheral end PX of the airtight layer 131 of the light emitting module 101 and surrounds the entire circumference of the airtight layer 131, the light emitted from the outer peripheral end PX of the airtight layer 131, in other words, the protective cover 23. Reflects light that is not emitted toward. The reflecting surface 51M is inclined at a constant angle θ3 (for example, 20 degrees) with respect to the emitted light axis L1 of the light emitting element 121 so as to reflect the light incident on the reflecting surface 51M toward the protective cover 23. It is formed on the surface.
In the present embodiment, since white silicone rubber is used as the material of the reflector 51, the reflecting surface 51M can sufficiently reflect light without making the reflecting surface 51M a mirror surface or the like. The reflective surface 51M may be made into a mirror surface having higher reflectance by subjecting the reflective surface 51M to a metal vapor deposition or the like.

また、反射面５１Ｍは、同図６に示すように、プリント基板１１０と保護カバー２３との間に渡って設けられるので、プリント基板１１０と保護カバー２３との間の光を効率良く反射面５１Ｍで反射できる。これにより、光の利用効率を効果的に高め、照明光の光量を増大できる。
なお、反射面５１Ｍの角度θ３を含む形状については、適宜に変更してもよく、例えば反射面５１Ｍを楕円曲面に形成してもよいし、角度θ３を０度にしてもよい。 Further, as shown in FIG. 6, since the reflective surface 51M is provided between the printed circuit board 110 and the protective cover 23, the light between the printed circuit board 110 and the protective cover 23 is efficiently reflected on the reflective surface 51M. Can be reflected by. As a result, the light utilization efficiency can be effectively increased and the amount of illumination light can be increased.
The shape of the reflecting surface 51M including the angle θ3 may be appropriately changed. For example, the reflecting surface 51M may be formed on an elliptic curved surface, or the angle θ3 may be set to 0 degrees.

反射部５１Ａの箇所は、気密層１３１の外周端ＰＸ近傍から筐体２２の内周面ＭＸの間に渡って延在する厚肉箇所に形成されている。したがって、反射体５１の他の部分（シール部５１Ｂに相当する部分）よりも相対的に変形し難くなり、反射体５１を、筐体２２と保護カバー２３との間に挟持しても、その挟持力の影響による反射面５１Ｍの変形を抑制できる。また、この厚肉箇所である反射部５１Ａが、プリント基板１１０と保護カバー２３との間に挟持されているので、プリント基板１１０と保護カバー２３との離間距離を適切距離に保持しつつ、反射部５１Ａによっても保護カバー２３を弾性支持できる。 The portion of the reflection portion 51A is formed in a thick portion extending from the vicinity of the outer peripheral end PX of the airtight layer 131 to the inner peripheral surface MX of the housing 22. Therefore, it is relatively less likely to be deformed than the other parts of the reflector 51 (the part corresponding to the seal portion 51B), and even if the reflector 51 is sandwiched between the housing 22 and the protective cover 23, the reflector 51 is not easily deformed. Deformation of the reflective surface 51M due to the influence of the holding force can be suppressed. Further, since the reflective portion 51A, which is a thick portion, is sandwiched between the printed circuit board 110 and the protective cover 23, the reflection is performed while maintaining the separation distance between the printed circuit board 110 and the protective cover 23 at an appropriate distance. The protective cover 23 can also be elastically supported by the portion 51A.

なお、発光モジュール１０１の全周囲に渡って反射面５１Ｍを形成する場合を説明したが、これに限定されず、反射面５１Ｍの一部を省略してもよい。例えば、発光素子１２１の配列等によっては発光モジュール１０１の周囲から漏れる光に偏りができる場合、漏れ光が相対的に多い領域に対向する反射面５１Ｍを形成し、漏れ光が相対的に少ないか、殆ど存在しない領域に対向する反射面５１Ｍは省略してもよい。 Although the case where the reflecting surface 51M is formed over the entire circumference of the light emitting module 101 has been described, the present invention is not limited to this, and a part of the reflecting surface 51M may be omitted. For example, if the light leaking from the periphery of the light emitting module 101 is biased depending on the arrangement of the light emitting elements 121 or the like, the reflecting surface 51M facing the region where the leaked light is relatively large is formed, and whether the leaked light is relatively small. The reflecting surface 51M facing the region that hardly exists may be omitted.

シール部５１Ｂは、反射部５１Ａから筐体２２の載置部２２Ａに向けて突出する第１突出部５１Ｃと、反射部５１Ａから押さえ部材２４に向けて突出する第２突出部５１Ｄとを有している。第１突出部５１Ｃは、プリント基板１１０の周囲に渡って連続する枠形状であって、プリント基板１１０の厚さＤＫ（図３参照）よりもやや長い長さで突出する。また、第２突出部５１Ｄは、プリント基板１１０の周囲に渡って連続する枠形状であって、保護カバー２３の厚さＤＣ（図３参照）よりもやや長い長さで突出する。これら突出部５１Ｃ，５１Ｄは、図３に示すように、反射部５１Ａよりも大幅に薄く形成され、容易に撓むことができる。 The seal portion 51B has a first protruding portion 51C protruding from the reflecting portion 51A toward the mounting portion 22A of the housing 22, and a second protruding portion 51D protruding from the reflecting portion 51A toward the pressing member 24. ing. The first protruding portion 51C has a frame shape that is continuous over the periphery of the printed circuit board 110, and projects at a length slightly longer than the thickness DK (see FIG. 3) of the printed circuit board 110. Further, the second protruding portion 51D has a frame shape that is continuous over the periphery of the printed circuit board 110, and protrudes with a length slightly longer than the thickness DC (see FIG. 3) of the protective cover 23. As shown in FIG. 3, these projecting portions 51C and 51D are formed to be significantly thinner than the reflecting portion 51A and can be easily bent.

これにより、図３に示すように反射体５１を取り付けた場合に、第１突出部５１Ｃによって、筐体２２とプリント基板１１０との間の隙間を全周に渡って閉塞でき、第２突出部５１Ｄによって、押さえ部材２４と保護カバー２３との間の隙間を全周に渡って閉塞できる。したがって、モジュール配置空間２２Ｋを、ガスや水分が入り込まない気密状態に閉塞でき、発光モジュール１０１がガスや水分に触れないようにすることができる。 As a result, when the reflector 51 is attached as shown in FIG. 3, the gap between the housing 22 and the printed circuit board 110 can be closed by the first protruding portion 51C over the entire circumference, and the second protruding portion can be closed. The 51D can close the gap between the pressing member 24 and the protective cover 23 over the entire circumference. Therefore, the module arrangement space 22K can be closed in an airtight state in which gas or moisture does not enter, and the light emitting module 101 can be prevented from coming into contact with gas or moisture.

なお、第１突出部５１Ｃ及び第２突出部５１Ｄの長さ調整等により、モジュール配置空間２２Ｋの気密度合いや水密度合いを調整可能である。しかも、発光モジュール１０１と、反射体５１と、保護カバー２３との間には、樹脂等が無い隙間が形成されるので、この隙間に樹脂等を充填する構成と比べ、軽量化が可能である。また、発光モジュール１０１又は反射体５１に不具合が生じた場合に、これら部品を独立して取り出すことができるので、これらの部品を容易に交換することも可能である。 The airtightness and water density of the module arrangement space 22K can be adjusted by adjusting the lengths of the first protruding portion 51C and the second protruding portion 51D. Moreover, since a gap without resin or the like is formed between the light emitting module 101, the reflector 51, and the protective cover 23, the weight can be reduced as compared with the configuration in which the gap is filled with resin or the like. .. Further, when a defect occurs in the light emitting module 101 or the reflector 51, these parts can be taken out independently, so that these parts can be easily replaced.

次いで、発光モジュール１０１の製造方法について説明する。
この発光モジュール１０１は、プリント基板１１０の実装面１１０Ａに発光素子１２１、及び電気部品１２３を実装した後、配線パターン１２２、発光素子１２１及び電気部品１２３を含む所定の領域に透明なエラストマーを充填し、エラストマーが実装面１１０Ａに密着させることによって、配線パターン１２２、発光素子１２１及び電気部品１２３を気密封止する気密層１３１が形成される。 Next, a method of manufacturing the light emitting module 101 will be described.
In this light emitting module 101, after mounting the light emitting element 121 and the electric component 123 on the mounting surface 110A of the printed circuit board 110, a predetermined region including the wiring pattern 122, the light emitting element 121 and the electric component 123 is filled with a transparent elastomer. The elastomer is brought into close contact with the mounting surface 110A to form an airtight layer 131 that airtightly seals the wiring pattern 122, the light emitting element 121, and the electric component 123.

図７は、気密層１３１の製造工程を示す図である。
第１工程では、気密層１３１を形成する前の発光モジュール１０１を取り付ける取付型（台部とも称する）７１を用意し、第２工程では、取付型７１に発光モジュール１０１をセットする。第３工程では、取付型７１の上に成形型７２をセットする。ここで、成形型７２は、取付型７１及び発光モジュール１０１との間に気密層１３１を形成する空間を形成する型であり、型枠とも称する。なお、取付型７１には、発光モジュール１０１に電気的接続された配線を通すための孔７１Ｈが形成されている。 FIG. 7 is a diagram showing a manufacturing process of the airtight layer 131.
In the first step, a mounting type (also referred to as a base) 71 to which the light emitting module 101 before forming the airtight layer 131 is attached is prepared, and in the second step, the light emitting module 101 is set in the mounting type 71. In the third step, the molding die 72 is set on the mounting die 71. Here, the molding mold 72 is a mold that forms a space for forming an airtight layer 131 between the mounting mold 71 and the light emitting module 101, and is also referred to as a mold. The mounting type 71 is formed with a hole 71H for passing the wiring electrically connected to the light emitting module 101.

第４工程では、上記取付型７１、発光モジュール１０１及び成形型７２からなるセット体を真空チャンバー内に入れ、真空ポンプによって真空チャンバー内の空気を排気して減圧環境（例えば真空雰囲気）にする。その後、成形型７２に予め設けた注入口に、気密層１３１の材料となる液体状態のエラストマーを充填する。減圧した状態でエラストマーを充填することにより、エラストマー中の気泡の発生を抑制できる。 In the fourth step, a set body including the mounting mold 71, the light emitting module 101, and the molding mold 72 is put into a vacuum chamber, and the air in the vacuum chamber is exhausted by a vacuum pump to create a reduced pressure environment (for example, a vacuum atmosphere). After that, the injection port provided in advance in the molding die 72 is filled with a liquid elastomer used as a material for the airtight layer 131. By filling the elastomer in a reduced pressure state, the generation of bubbles in the elastomer can be suppressed.

第５工程では、大気開放によってエラストマーを大気圧で加圧した状態にし、炉体を利用した加熱硬化によりエラストマーを硬化させる。エラストマーを加圧した状態にするので、エラストマーを成形型７２と発光モジュール１０１との間に空く空間の隅々まで行き渡らせることができ、加熱硬化することで速やかに硬化させることができる。これらにより短時間で高精度に気密層１３１を設けることができる。なお、気密層１３１は、エラストマー自体が有する接着性によってプリント基板１１０等に密着する。第６工程では、エラストマーが十分に硬化した後に、成形型７２及び取付型７１を取り外す（離型工程に相当）。以上が気密層１３１の製造工程である。 In the fifth step, the elastomer is pressurized at atmospheric pressure by opening to the atmosphere, and the elastomer is cured by heat curing using a furnace body. Since the elastomer is in a pressurized state, the elastomer can be spread to every corner of the space between the molding die 72 and the light emitting module 101, and can be quickly cured by heat curing. As a result, the airtight layer 131 can be provided with high accuracy in a short time. The airtight layer 131 adheres to the printed circuit board 110 or the like due to the adhesiveness of the elastomer itself. In the sixth step, after the elastomer is sufficiently cured, the molding die 72 and the mounting die 71 are removed (corresponding to the mold release step). The above is the manufacturing process of the airtight layer 131.

気密層１３１の製造工程は上記工程に限定されない。
図８は、気密層１３１の他の製造工程を模式的に示す図である。
図８に示すように、第１工程では、取付型７１として、液体状態のエラストマーを貯留可能な槽を使用し、この取付型７１内に、気密層１３１を形成する前の発光モジュール１０１をセットする。第２工程では、取付型７１内に液体状態のエラストマーを充填し、第３工程では、その取付型７１を減圧環境（例えば真空雰囲気）に置くことで、エラストマー中の気泡を抜く（脱泡工程に相当）。なお、第３工程ではエラストマーは硬化していない。 The manufacturing process of the airtight layer 131 is not limited to the above process.
FIG. 8 is a diagram schematically showing another manufacturing process of the airtight layer 131.
As shown in FIG. 8, in the first step, a tank capable of storing a liquid elastomer is used as the mounting mold 71, and the light emitting module 101 before forming the airtight layer 131 is set in the mounting mold 71. To do. In the second step, the mounting die 71 is filled with a liquid elastomer, and in the third step, the mounting die 71 is placed in a reduced pressure environment (for example, a vacuum atmosphere) to remove air bubbles in the elastomer (defoaming step). Equivalent to). The elastomer was not cured in the third step.

第４工程では、成形型７２をセットすることにより余分なエラストマーを外部に抜く。第５工程では、炉体を利用した加熱硬化によりエラストマーを硬化させる。第６工程では、成形型７２及び取付型７１を取り外す（離型工程に相当）。この場合も、気泡を含まない気密層１３１を設けることができる。 In the fourth step, the excess elastomer is pulled out by setting the molding die 72. In the fifth step, the elastomer is cured by heat curing using a furnace body. In the sixth step, the molding die 72 and the mounting die 71 are removed (corresponding to the mold release step). Also in this case, the airtight layer 131 containing no air bubbles can be provided.

以上説明したように、発光モジュール１０１は、図５等に示すように、プリント基板１１０と、プリント基板１１０の実装面１１０Ａに設けられる発光素子１２１とを備え、実装面１１０Ａに、発光素子１２１を気密封止する透明なエラストマーからなる気密層１３１を有している。これにより、発光モジュール１０１が配置される筐体２２内に樹脂を充填することなく、発光素子１２１等を気密封止することができる。したがって、筐体２２内に配置される発光モジュール１０１等の部品交換を容易に行うことが可能な構成で、簡易な構成で樹脂充填防爆形照明器具に使用できる気密構造を得ることができる。 As described above, as shown in FIG. 5, the light emitting module 101 includes a printed circuit board 110 and a light emitting element 121 provided on the mounting surface 110A of the printed circuit board 110, and the light emitting element 121 is provided on the mounting surface 110A. It has an airtight layer 131 made of a transparent elastomer that is airtightly sealed. As a result, the light emitting element 121 and the like can be hermetically sealed without filling the housing 22 in which the light emitting module 101 is arranged with resin. Therefore, it is possible to easily replace parts such as the light emitting module 101 arranged in the housing 22, and it is possible to obtain an airtight structure that can be used for a resin-filled explosion-proof lighting fixture with a simple configuration.

しかも、エラストマーからなる気密層１３１は、発光素子１２１からの光が通る領域に光の出射方向を制御する光制御部として機能する第１突出部１３１Ｂを有するので、光の出射方向を制御する別体のレンズ等を配置せずに所望の方向に光を出射させることができる。これにより、光の利用率を高めることができる。
さらに、第１突出部１３１Ｂは、エラストマーの外表面のうち、発光素子１２１からの光が入射する領域に設けられた凸面に形成されるので、第１突出部１３１Ｂを簡易に設けることができると共に、エラストマーの外表面で全反射される光を低減し、光の利用率をより高めることができる。 Moreover, since the airtight layer 131 made of an elastomer has a first protruding portion 131B that functions as an optical control unit that controls the light emission direction in a region through which the light from the light emitting element 121 passes, another method that controls the light emission direction is different. Light can be emitted in a desired direction without arranging a body lens or the like. As a result, the light utilization rate can be increased.
Further, since the first protruding portion 131B is formed on a convex surface provided on the outer surface of the elastomer in the region where the light from the light emitting element 121 is incident, the first protruding portion 131B can be easily provided. , The light totally reflected by the outer surface of the elastomer can be reduced, and the light utilization rate can be further increased.

また、気密層１３１は、実装面１１０Ａにおける配線パターン１２２及び発光素子１２１を覆うベース部１３１Ａと、ベース部１３１Ａから突出する第１突出部１３１Ｂと、第１突出部１３１Ｂよりも更に突出する第２突出部１３１Ｃとを有するので、ベース部１３１Ａ、第１突出部１３１Ｂ及び第２突出部１３１Ｃにより、発光素子１２１等への電気的離隔距離を確保し易くなる。しかも、図３に示すように、第２突出部１３１Ｃは、当該発光モジュール１０１に対向して配置される保護カバー２３に接触するので、第２突出部１３１Ｃが保護カバー２３を弾性支持する支持部材を兼用し、保護カバー２３の撓みを抑制し、保護カバー２３を薄型化し易くなる。 Further, the airtight layer 131 has a base portion 131A that covers the wiring pattern 122 and the light emitting element 121 on the mounting surface 110A, a first protruding portion 131B that protrudes from the base portion 131A, and a second protruding portion 131B that protrudes further than the first protruding portion 131B. Since it has a protruding portion 131C, the base portion 131A, the first protruding portion 131B, and the second protruding portion 131C make it easy to secure an electrical separation distance from the light emitting element 121 or the like. Moreover, as shown in FIG. 3, since the second protruding portion 131C comes into contact with the protective cover 23 arranged to face the light emitting module 101, the second protruding portion 131C elastically supports the protective cover 23. The protective cover 23 is suppressed from bending, and the protective cover 23 can be easily made thinner.

また、図４に示すように、実装面１１０Ａには、発光素子１２１よりも保護カバー２３側（突出側）に張り出す他の部品である電気部品１２３が設けられ、第２突出部１３１Ｃは、電気部品１２３に対応する領域に設けられているので、電気部品１２３への電気的離隔距離を十分に確保し易くなる。つまり、第２突出部１３１Ｃは、保護カバー２３を弾性支持する支持部材、及び電気部品１２３への電気的離隔距離を確保する部材を兼用し、これらを別々に設ける場合と比べ、構成を簡易化でき、小型化や薄型化に有利である。 Further, as shown in FIG. 4, the mounting surface 110A is provided with an electric component 123 which is another component projecting from the light emitting element 121 to the protective cover 23 side (protruding side), and the second projecting portion 131C is provided with an electric component 123. Since it is provided in the area corresponding to the electric component 123, it becomes easy to sufficiently secure the electrical separation distance from the electric component 123. That is, the second projecting portion 131C also serves as a support member that elastically supports the protective cover 23 and a member that secures an electrical separation distance from the electrical component 123, and the configuration is simplified as compared with the case where these are separately provided. It can be made, which is advantageous for miniaturization and thinning.

さらに、第２突出部１３１Ｃは、実装面１１０Ａの中央領域に設けられるので、保護カバー２３が最も撓み易くなる箇所を弾性支持し易くなる。これにより、保護カバー２３の最大撓みを効率良く抑え、保護カバー２３を薄型化し易くなる。 Further, since the second protruding portion 131C is provided in the central region of the mounting surface 110A, it becomes easy to elastically support the portion where the protective cover 23 is most likely to bend. As a result, the maximum bending of the protective cover 23 is efficiently suppressed, and the protective cover 23 can be easily made thinner.

また、本実施形態の発光モジュール１０１の製造方法では、実装面１１０Ａに対し、発光素子１２１を含む所定の領域に透明なエラストマーを密着させ、発光素子１２１を気密封止する気密層１３１を形成するので、発光モジュール１０１が配置される筐体２２内に樹脂を充填することなく、簡易な構成で樹脂充填防爆形照明器具に使用できる気密構造を得ることができる。 Further, in the method for manufacturing the light emitting module 101 of the present embodiment, a transparent elastomer is brought into close contact with a predetermined region including the light emitting element 121 on the mounting surface 110A to form an airtight layer 131 that airtightly seals the light emitting element 121. Therefore, it is possible to obtain an airtight structure that can be used for a resin-filled explosion-proof lighting fixture with a simple configuration without filling the housing 22 in which the light emitting module 101 is arranged with resin.

しかも、図７の第４工程に示すように、気密層１３１の形成に際し、前記所定の領域を含む空間を減圧する減圧工程を行い、減圧した状態で、前記所定の領域にエラストマーを密着させるので、気泡の発生を抑制できる。
また、図８の第３工程に示すように、実装面上にエラストマーを充填した後、減圧環境にすることでエラストマーから気泡を抜く脱泡工程を行うことによっても、気泡の発生を抑制できる。 Moreover, as shown in the fourth step of FIG. 7, when the airtight layer 131 is formed, a decompression step of depressurizing the space including the predetermined region is performed, and the elastomer is brought into close contact with the predetermined region in the decompressed state. , The generation of air bubbles can be suppressed.
Further, as shown in the third step of FIG. 8, the generation of bubbles can also be suppressed by performing a defoaming step of removing bubbles from the elastomer by filling the mounting surface with the elastomer and then setting the environment under reduced pressure.

また、本実施形態の発光ユニット２１は、図３に示すように、発光モジュール１０１の周囲に配置される弾性材からなる反射体５１を備え、反射体５１は、発光モジュール１０１の周囲に渡って筐体２２と保護カバー２３との間の隙間を塞ぐシール部５１Ｂと、発光モジュール１０１からの光を保護カバー２３に向けて反射する反射部５１Ａとを一体に有している。この構成によれば、パッキン及び反射部材を別々に設ける構成と比べ、簡易化かつコンパクト化に有利な構成で、筐体２２内の密閉と光の利用率向上とを図ることができる。 Further, as shown in FIG. 3, the light emitting unit 21 of the present embodiment includes a reflector 51 made of an elastic material arranged around the light emitting module 101, and the reflector 51 extends around the light emitting module 101. It integrally has a sealing portion 51B that closes the gap between the housing 22 and the protective cover 23, and a reflecting portion 51A that reflects the light from the light emitting module 101 toward the protective cover 23. According to this configuration, as compared with the configuration in which the packing and the reflective member are separately provided, the configuration is advantageous for simplification and compactification, and the inside of the housing 22 can be sealed and the light utilization rate can be improved.

また、シール部５１Ｂは、筐体２２と保護カバー２３とが重なる方向に対して垂直方向で反射部５１Ａよりも薄く形成されているので、筐体２２と保護カバー２３との間でシール部５１Ｂを変形させて十分なシール効果を得ながら、反射部５１Ａの変形を抑制して意図した反射を実現し易くなる。
また、反射部５１Ａは、図６に示すように、気密層１３１の少なくとも外周端ＰＸから出射される光を保護カバー２３に向けて反射するので、光の利用効率を効果的に高め、照明光の光量を向上できる。 Further, since the seal portion 51B is formed thinner than the reflection portion 51A in the direction perpendicular to the direction in which the housing 22 and the protective cover 23 overlap, the seal portion 51B is formed between the housing 22 and the protective cover 23. Is deformed to obtain a sufficient sealing effect, while the deformation of the reflecting portion 51A is suppressed and the intended reflection can be easily realized.
Further, as shown in FIG. 6, the reflecting portion 51A reflects the light emitted from at least the outer peripheral end PX of the airtight layer 131 toward the protective cover 23, so that the light utilization efficiency is effectively improved and the illumination light is illuminated. The amount of light can be improved.

また、保護カバー２３を筐体２２側に押さえる押さえ部材２４を有し、シール部５１Ｂは、押さえ部材２４と筐体２２との間に挟持されるので、押さえ部材２４によって、保護カバー２３の取付と、シール部５１Ｂによる筐体２２内の密閉とを行うことができる。
また、反射部５１Ａは、発光モジュール１０１の一部（プリント基板１１０）と保護カバー２３との間に挟持されるので、反射部５１Ａによって、発光モジュール１０１の一部と保護カバー２３との離間距離を保持すると共に、保護カバー２３を弾性支持することができる。 Further, since the holding member 24 for pressing the protective cover 23 on the housing 22 side is provided and the seal portion 51B is sandwiched between the pressing member 24 and the housing 22, the protective cover 23 is attached by the pressing member 24. And, the inside of the housing 22 can be sealed by the seal portion 51B.
Further, since the reflection unit 51A is sandwiched between a part of the light emitting module 101 (printed circuit board 110) and the protective cover 23, the distance between the part of the light emitting module 101 and the protective cover 23 by the reflection unit 51A Can be elastically supported and the protective cover 23 can be elastically supported.

（第２実施形態）
図９は、本発明の第２実施形態に係る発光ユニット２１の側断面図を示している。この発光ユニット２１は、押さえ部材２４を用いずに保護カバー２３を筐体２２に取り付ける構造である点、及び、反射体５１の形状が異なる点を除いて、第１実施形態の発光ユニット２１と同様である。なお、同様の箇所は同一の符号を付して示し、異なる部分を説明する。 (Second Embodiment)
FIG. 9 shows a side sectional view of the light emitting unit 21 according to the second embodiment of the present invention. The light emitting unit 21 is different from the light emitting unit 21 of the first embodiment except that the protective cover 23 is attached to the housing 22 without using the pressing member 24 and the shape of the reflector 51 is different. The same is true. The same parts are designated by the same reference numerals, and different parts will be described.

保護カバー２３には、複数の締結部材（例えば締結ボルト）４１が貫通する貫通孔２３Ｈが設けられており、図９に示すように、保護カバー２３と筐体２２の載置部２２Ａとの間に反射体５１を配置した状態で、各締結部材４１を筐体２２の載置部２２Ａにそれぞれ締結することによって、保護カバー２３が筐体２２に固定される。 The protective cover 23 is provided with a through hole 23H through which a plurality of fastening members (for example, fastening bolts) 41 penetrate, and as shown in FIG. 9, between the protective cover 23 and the mounting portion 22A of the housing 22. The protective cover 23 is fixed to the housing 22 by fastening each fastening member 41 to the mounting portion 22A of the housing 22 with the reflector 51 arranged in the housing 22.

反射体５１の反射部５１Ａには、各締結部材４１が貫通する貫通孔５１Ｘが設けられ、これら貫通孔５１Ｘよりも内周側（発光モジュール１０１側）に、発光モジュール１０１の周囲に渡って連続する反射面５１Ｍが設けられる。
貫通孔５１Ｘのそれぞれには、筒状のブッシング８１が挿入され、このブッシング８１内に締結部材４１が挿入される。このブッシング８は、反射体５１よりも剛性を有する素材（例えば金属材）で形成され、かつ、図９に示す距離ＤＬ（突起２２Ｔと保護カバー２３表面との間の距離に相当）の長さを規定する部材である。このブッシング８１によって、保護カバー２３と筐体２２との離間距離を予め定めた長さに規定でき、締結部材４１を過度に締結して反射面５１Ｍが変形する事態を抑制できる。 The reflecting portion 51A of the reflector 51 is provided with a through hole 51X through which each fastening member 41 penetrates, and is continuous on the inner peripheral side (light emitting module 101 side) of the through hole 51X over the periphery of the light emitting module 101. A reflective surface 51M is provided.
A tubular bushing 81 is inserted into each of the through holes 51X, and the fastening member 41 is inserted into the bushing 81. The bushing 8 is made of a material (for example, a metal material) that is more rigid than the reflector 51, and has a length of the distance DL (corresponding to the distance between the protrusion 22T and the surface of the protective cover 23) shown in FIG. It is a member that defines. With this bushing 81, the separation distance between the protective cover 23 and the housing 22 can be defined to a predetermined length, and the situation where the fastening member 41 is excessively fastened and the reflecting surface 51M is deformed can be suppressed.

なお、反射部５１Ａには、筐体２２の載置部２２Ａに設けられた突起２２Ｔに係合する孔部５１Ｙが設けられ、これらの係合によって、載置部２２Ａに対する反射体５１の位置が位置決めされる。本構成では、これらの孔部５１Ｙと貫通孔５１Ｘとを同軸上に設け、かつ、突起２２Ｔにブッシング８１の一端を当接させるので、孔部５１Ｙ、貫通孔５１Ｘ及びブッシング８１からなる締結構造及び位置決め構造をコンパクトにできる。また、孔部５１Ｙと貫通孔５１Ｘとを同軸上に設ける構成にしなくてもよい。 The reflecting portion 51A is provided with a hole portion 51Y that engages with the protrusion 22T provided on the mounting portion 22A of the housing 22, and by these engagements, the position of the reflector 51 with respect to the mounting portion 22A is adjusted. Positioned. In this configuration, these holes 51Y and the through holes 51X are provided coaxially, and one end of the bushing 81 is brought into contact with the protrusion 22T. Therefore, a fastening structure including the holes 51Y, the through holes 51X, and the bushing 81 and a fastening structure. The positioning structure can be made compact. Further, it is not necessary to provide the hole portion 51Y and the through hole 51X coaxially.

反射体５１のシール部５１Ｂは、反射部５１Ａから筐体２２の載置部２２Ａに向けて突出する第１突出部５１Ｃと、反射部５１Ａから反射体５１の径方向外側に突出する環状の第２突出部５１Ｄとを有している。第２突出部５１Ｄは、矩形の環状、又は円環状に設けられ、保護カバー２３と筐体２２との間に挟持されることによって、保護カバー２３と筐体２２との間の隙間を閉塞する。本構成では、第２突出部５１Ｄに、間隔を空けて、保護カバー２３側に突出する複数の枠状の突起５１Ｔを設けている。これら突起５１Ｔにより、保護カバー２３と筐体２２との間の隙間を効果的に閉塞でき、十分な気密状態を得やすくなる。 The seal portion 51B of the reflector 51 has a first protruding portion 51C protruding from the reflecting portion 51A toward the mounting portion 22A of the housing 22, and an annular first projecting portion 51A from the reflecting portion 51A to the outside in the radial direction. It has two protrusions 51D. The second protruding portion 51D is provided in a rectangular ring shape or an annular shape, and is sandwiched between the protective cover 23 and the housing 22 to close the gap between the protective cover 23 and the housing 22. .. In this configuration, the second protrusion 51D is provided with a plurality of frame-shaped protrusions 51T protruding toward the protective cover 23 at intervals. With these protrusions 51T, the gap between the protective cover 23 and the housing 22 can be effectively closed, and it becomes easy to obtain a sufficient airtight state.

さらに、この反射体５１には、保護カバー２３の外周面を囲う囲い部５１Ｋが一体に設けられている。この囲い部５１Ｋは、反射体５１の第２突出部５１Ｄから延出し、保護カバー２３の外周面を全体に渡って囲う枠形状に形成されている。同図９に示すように、この囲い部５１Ｋは、保護カバー２３と筐体２２との間に空いた隙間Ｓ内に納まる。仮に保護カバー２３をガラスで形成した場合に、保護カバー２３の外周面が相対的に損傷し易い面となり、この面を、弾性材からなる囲い部５１Ｋで囲うので、保護カバー２３の損傷を防止できる。つまり、囲い部５１Ｋは保護カバー２３の外周面を保護する保護部材として機能する。
なお、囲い部５１Ｋが保護カバー２３の外周面全体を囲う場合を例示したが、これに限定されず、要は、保護カバー２３の外周面を十分に保護できる範囲で、保護カバー２３の外周面の少なくとも一部を囲えばよい。 Further, the reflector 51 is integrally provided with an enclosure 51K that surrounds the outer peripheral surface of the protective cover 23. The enclosure 51K extends from the second protrusion 51D of the reflector 51 and is formed in a frame shape that surrounds the outer peripheral surface of the protective cover 23 over the entire surface. As shown in FIG. 9, the enclosure 51K fits in the gap S between the protective cover 23 and the housing 22. If the protective cover 23 is made of glass, the outer peripheral surface of the protective cover 23 becomes a surface that is relatively easily damaged, and since this surface is surrounded by the enclosing portion 51K made of an elastic material, damage to the protective cover 23 is prevented. it can. That is, the enclosure 51K functions as a protective member that protects the outer peripheral surface of the protective cover 23.
The case where the enclosure 51K surrounds the entire outer peripheral surface of the protective cover 23 has been illustrated, but the present invention is not limited to this, and the point is that the outer peripheral surface of the protective cover 23 can be sufficiently protected. It suffices to enclose at least a part of.

以上説明したように、第２実施形態では、保護カバー２３を筐体２２に締結する締結部材４１を有し、締結部材４１の周囲には、保護カバー２３と筐体２２との離間距離を予め定めた長さに規制するブッシング８１が配置されるので、締結部材４１を過度に締結して反射面５１Ｍが変形する事態を抑制できる。
また、反射体５１は、保護カバー２３の外周面の少なくとも一部を囲う囲い部５１Ｋを有するので、保護カバー２３の外周面を保護することができる。さらに、第２実施形態の発光ユニット２１は、保護カバー２３を筐体２２側に押さえる押さえ部材２４を必要としないので、その分、部品点数の低減や、組立・分解作業を簡易化し易くなる。 As described above, in the second embodiment, the fastening member 41 for fastening the protective cover 23 to the housing 22 is provided, and the distance between the protective cover 23 and the housing 22 is previously set around the fastening member 41. Since the bushing 81 that regulates the length is arranged, it is possible to suppress a situation in which the fastening member 41 is excessively fastened and the reflecting surface 51M is deformed.
Further, since the reflector 51 has an enclosure portion 51K that surrounds at least a part of the outer peripheral surface of the protective cover 23, the outer peripheral surface of the protective cover 23 can be protected. Further, since the light emitting unit 21 of the second embodiment does not require a pressing member 24 that presses the protective cover 23 toward the housing 22, the number of parts can be reduced and the assembly / disassembly work can be simplified accordingly.

上述した各実施形態は、あくまでも本発明の一態様の例示であり、本発明の趣旨を逸脱しない範囲において任意に変形、及び応用が可能である。例えば、型成形の技術を利用してエラストマーからなる気密層１３１を単体で成形し、成形した気密層１３１をプリント基板１１０に接着等で接合してもよい。また、発光モジュール１０１を複数組み合わせて器具筐体１３Ａに取り付ける構成に限定されず、１つの発光モジュール１０１を器具筐体１３Ａに取り付けてもよい。 Each of the above-described embodiments is merely an example of one aspect of the present invention, and can be arbitrarily modified and applied without departing from the spirit of the present invention. For example, the airtight layer 131 made of an elastomer may be molded by itself using a mold molding technique, and the molded airtight layer 131 may be bonded to the printed circuit board 110 by adhesion or the like. Further, the configuration is not limited to a configuration in which a plurality of light emitting modules 101 are combined and attached to the fixture housing 13A, and one light emitting module 101 may be attached to the fixture housing 13A.

１０Ａ，１０Ｂ 照明器具
１１Ａ，１１Ｂ 固定具
１３Ａ，１３Ｂ 器具筐体
２１ 発光ユニット
２２ 筐体
２３ 保護カバー（透光性カバー）
２４ 押さえ部材
４１ 締結部材
５１ 反射体
５１Ａ 反射部
５１Ｂ シール部
５１Ｋ 囲い部
５１Ｍ 反射面
８１ ブッシング
１０１ 発光モジュール
１１０ プリント基板
１１０Ａ 実装面
１２１ 発光素子
１２３ 電気部品（他の部品）
１３１ 気密層
１３１Ａ ベース部
１３１Ｂ 第１突出部（光制御部）
１３１Ｃ 第２突出部
１３１Ｍ 壁面 10A, 10B Lighting equipment 11A, 11B Fixture 13A, 13B Equipment housing 21 Light emitting unit 22 Housing 23 Protective cover (translucent cover)
24 Pressing member 41 Fastening member 51 Reflector 51A Reflector 51B Seal 51K Enclosure 51M Reflector 81 Bushing 101 Light emitting module 110 Printed circuit board 110A Mounting surface 121 Light emitting element 123 Electrical parts (other parts)
131 Airtight layer 131A Base part 131B First protruding part (optical control part)
131C Second protrusion 131M Wall surface

Claims (11)

プリント基板と、前記プリント基板の実装面に設けられる発光素子とを備える発光モジュールにおいて、
前記実装面に、前記発光素子を気密封止する透明なエラストマーを有することを特徴とする発光モジュール。 In a light emitting module including a printed circuit board and a light emitting element provided on a mounting surface of the printed circuit board.
A light emitting module characterized by having a transparent elastomer that airtightly seals the light emitting element on the mounting surface. 前記エラストマーは、前記発光素子からの光が通る領域に前記光の出射方向を制御する光制御部を有していることを特徴とする請求項１に記載の発光モジュール。 The light emitting module according to claim 1, wherein the elastomer has an optical control unit that controls an emission direction of the light in a region through which light from the light emitting element passes. 前記光制御部は、前記エラストマーの外表面のうち、前記発光素子からの光が入射する領域に設けられた凸面であることを特徴とする請求項２に記載の発光モジュール。 The light emitting module according to claim 2, wherein the light control unit is a convex surface provided on a region of the outer surface of the elastomer in which light from the light emitting element is incident. 前記エラストマーは、
前記実装面における配線パターン及び前記発光素子を覆うベース部と、
前記ベース部から突出して前記凸面を形成する第１突出部と、
前記第１突出部よりも更に突出する第２突出部とを有し、
前記第２突出部は、当該発光モジュールに対向して配置される透光性カバーに接触することを特徴とする請求項３に記載の発光モジュール。 The elastomer is
A wiring pattern on the mounting surface, a base portion covering the light emitting element, and
A first protruding portion that protrudes from the base portion and forms the convex surface,
It has a second protruding portion that protrudes further than the first protruding portion, and has a second protruding portion.
The light emitting module according to claim 3, wherein the second protruding portion comes into contact with a translucent cover arranged so as to face the light emitting module. 前記実装面には、前記発光素子よりも前記透光性カバー側に張り出す他の部品が設けられ、
前記第２突出部は、前記他の部品に対応する領域に設けられていることを特徴とする請求項４に記載の発光モジュール。 The mounting surface is provided with other components that project toward the translucent cover side of the light emitting element.
The light emitting module according to claim 4, wherein the second protruding portion is provided in a region corresponding to the other component. 前記第２突出部は、前記実装面の中央領域に設けられていることを特徴とする請求項４又は５に記載の発光モジュール。 The light emitting module according to claim 4 or 5, wherein the second protruding portion is provided in a central region of the mounting surface. 請求項１から請求項６のいずれかに記載された発光モジュールを有することを特徴とする照明器具。 A lighting fixture comprising the light emitting module according to any one of claims 1 to 6. 請求項１から請求項６のいずれかに記載された発光モジュールを１つ又は複数組み合わせて筐体に取り付けたことを特徴とする照明器具。 A lighting fixture characterized in that one or a plurality of light emitting modules according to any one of claims 1 to 6 are attached to a housing. プリント基板と、前記プリント基板の実装面に設けられる発光素子とを備える発光モジュールの製造方法において、
前記実装面に対し、前記発光素子を含む所定の領域に透明なエラストマーを密着させ、前記発光素子を気密封止する気密層を形成することを特徴とする発光モジュールの製造方法。 In a method for manufacturing a light emitting module including a printed circuit board and a light emitting element provided on a mounting surface of the printed circuit board.
A method for manufacturing a light emitting module, characterized in that a transparent elastomer is brought into close contact with a predetermined region containing the light emitting element with respect to the mounting surface to form an airtight layer for airtightly sealing the light emitting element. 前記所定の領域を含む空間を減圧する減圧工程を行い、前記減圧した状態で、前記所定の領域に前記エラストマーを密着させることを特徴とする請求項９に記載の発光モジュールの製造方法。 The method for manufacturing a light emitting module according to claim 9, wherein a depressurizing step of depressurizing a space including the predetermined region is performed, and the elastomer is brought into close contact with the predetermined region in the depressurized state. 前記実装面上に前記エラストマーを充填した後、減圧環境にすることで前記エラストマーから気泡を抜く脱泡工程を行うことを特徴とする請求項９に記載の発光モジュールの製造方法。 The method for manufacturing a light emitting module according to claim 9, wherein after filling the mounting surface with the elastomer, a defoaming step of removing air bubbles from the elastomer is performed by creating a reduced pressure environment.
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JPH04127667U (en) * 1991-05-15 1992-11-20 タキロン株式会社 LED light emitter
JP2006005029A (en) * 2004-06-15 2006-01-05 Fujitsu Ltd Imaging device and its manufacturing method
JP2006229096A (en) * 2005-02-21 2006-08-31 Rohm Co Ltd Optical communication module
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