JP2020201134A - Elastic surface wave sensor and measurement system using the same - Google Patents

Elastic surface wave sensor and measurement system using the same Download PDF

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JP2020201134A
JP2020201134A JP2019108379A JP2019108379A JP2020201134A JP 2020201134 A JP2020201134 A JP 2020201134A JP 2019108379 A JP2019108379 A JP 2019108379A JP 2019108379 A JP2019108379 A JP 2019108379A JP 2020201134 A JP2020201134 A JP 2020201134A
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main body
wave sensor
acoustic wave
surface acoustic
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JP7235378B2 (en
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典雅 中村
Norimasa Nakamura
典雅 中村
芳雄 藤井
Yoshio Fujii
芳雄 藤井
栄輔 森
Eisuke Mori
栄輔 森
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New Japan Radio Co Ltd
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Abstract

To provide an elastic surface wave sensor and a measurement system using the elastic surface wave sensor that can withstand use at places such as a site where a great vibration is produced and a high temperature site.SOLUTION: An SAW element 10A serving as a detection element is implemented on a body 5 of a package made of an inorganic material composed of the body part 5 and a lid part 6 with a cantilever beam structure in which only a one-side end is joined. The package is joined to a mounting member, and joints between the SAW element 10A and the body part 5, between the body part 5 and the lid part 6, and between the body part 5 and the mounting member are via a joint material 7.SELECTED DRAWING: Figure 3

Description

本発明は、弾性表面波（Surface Acoustic Wave：ＳＡＷ）素子を用いた弾性表面波センサおよびそれを用いた計測システムに関する。 The present invention relates to a surface acoustic wave sensor using a surface acoustic wave (SAW) element and a measurement system using the same.

弾性表面波を発生させることができるＳＡＷ素子は、温度、圧力、応力等の物理量の変化を検出するセンサとして利用することができる。この種のＳＡＷ素子は、圧電基板上に弾性表面波を励振するための櫛形電極（ＩＤＴ：Interdigital Transducer）が形成されており、ＳＡＷ素子が設置されている周囲環境の物理量に応じて弾性表面波の共振周波数や反射信号、遅延時間が変化することを利用し、周囲環境の物理量の変化を応答信号の変化としてセンシングしている。 A SAW element capable of generating surface acoustic waves can be used as a sensor for detecting changes in physical quantities such as temperature, pressure, and stress. In this type of SAW element, a surface acoustic wave (IDT) for exciting an elastic surface wave is formed on a piezoelectric substrate, and the surface acoustic wave depends on the physical quantity of the surrounding environment in which the SAW element is installed. The change in the physical quantity of the surrounding environment is sensed as the change in the response signal by utilizing the change in the resonance frequency, the reflected signal, and the delay time.

例えば特許文献１には、−５５℃〜１５０℃の温度範囲で精度良くセンシングできるＳＡＷ温度センサが開示されている。この種の温度センサを測定対象に接触させる形態は、測定対象に載置したり、センサと測定対象の接合面に凹凸を形成して嵌合する構成とする例が特許文献２に開示されている。 For example, Patent Document 1 discloses a SAW temperature sensor capable of accurately sensing in a temperature range of −55 ° C. to 150 ° C. Patent Document 2 discloses an example in which a form in which this type of temperature sensor is brought into contact with a measurement target is placed on the measurement target or the joint surface between the sensor and the measurement target is fitted with irregularities. There is.

またＳＡＷ素子は、専用の電源を必要とせず、アンテナから受信した電力のみで動作可能で、パッシブ型のワイヤレスセンサとして利用されている。無給電ワイヤレスセンサとそれを用いた計測システムは、特許文献３に開示されている。 Further, the SAW element does not require a dedicated power supply and can operate only with the electric power received from the antenna, and is used as a passive wireless sensor. A non-powered wireless sensor and a measurement system using the sensor are disclosed in Patent Document 3.

特表２０１８−５０２３０１号公報Special Table 2018-50230 特開２０１８−１９４４７０号公報JP-A-2018-194470 特開２０１７−９６８４１号公報JP-A-2017-96841

弾性表面波センサは無給電ワイヤレスセンサであり、電源配線等を必要としないことから設置場所を選ばないセンサとして利用の拡大が期待されている。しかしながら現状は、利用拡大が進んでいるとは言い難い。利用が拡大しない理由の一つは、ワイヤレスセンサとしての利点を生かせる設置場所が大きく振動する場所や高温の場所などで、従来の弾性表面波センサの構造では長期間の使用に耐えられなかったためである。そこで本発明は、大きな振動が発生する場所や高温の場所等での使用に耐えることができる弾性表面波センサおよびそれを用いた計測システムを提供することを目的とする。 The surface acoustic wave sensor is a non-feeding wireless sensor, and since it does not require power supply wiring or the like, it is expected to be widely used as a sensor that can be installed anywhere. However, at present, it cannot be said that the usage is expanding. One of the reasons why the use does not expand is that the installation place where the advantage as a wireless sensor can be utilized is a place where the installation place vibrates greatly or a place with high temperature, and the structure of the conventional surface acoustic wave sensor cannot withstand long-term use. is there. Therefore, an object of the present invention is to provide a surface acoustic wave sensor capable of withstanding use in a place where a large vibration is generated, a place where a high temperature is generated, and the like, and a measurement system using the same.

上記目的を達成するため、本願請求項１に係る発明は、検知素子としてＳＡＷ素子を備えた弾性表面波センサにおいて、前記ＳＡＷ素子は、本体部と蓋部とで構成された無機材料からなるパッケージの前記本体部に一方の端部側のみ接合して実装されていることと、前記パッケージは、取付部材に接合していることと、前記ＳＡＷ素子と前記本体部との接合、前記本体部と前記蓋部との接合、および前記本体部と前記取付部材との接合が、焼結層を介した接合であることを特徴とする。 In order to achieve the above object, the invention according to claim 1 of the present application is a surface acoustic wave sensor provided with a SAW element as a detection element, wherein the SAW element is a package made of an inorganic material composed of a main body portion and a lid portion. The package is mounted on the main body by joining only one end side, the package is joined to the mounting member, the SAW element and the main body are joined, and the main body and the main body are joined. The joining with the lid portion and the joining between the main body portion and the mounting member are characterized by joining through a sintered layer.

本願請求項２に係る発明は、請求項１記載の弾性表面波センサにおいて、前記取付部材は、変形して設置位置に密着接合する取付部を有することを特徴とする。 The invention according to claim 2 of the present application is characterized in that, in the surface acoustic wave sensor according to claim 1, the mounting member has a mounting portion that is deformed and tightly joined to the mounting position.

本願請求項３に係る発明は、電気信号を出力する送信機と、該送信機から送信された電気信号を受信し、応答信号を出力する弾性表面波センサと、該弾性表面波センサから出力される応答信号を受信する受信機とを備えた計測システムにおいて、前記弾性表面波センサは、検知素子としてＳＡＷ素子を備え、該ＳＡＷ素子は、本体部と蓋部とで構成された無機材料からなるパッケージの前記本体部に一方の端部側のみ接合して実装されていることと、前記パッケージは、取付部材に接合していることと、前記ＳＡＷ素子と前記本体部との接合、前記本体部と蓋部との接合、および前記本体部と前記取付部材との接合が、焼結層を介した接合であることを特徴とする。 The invention according to claim 3 of the present application is a transmitter that outputs an electric signal, a surface acoustic wave sensor that receives an electric signal transmitted from the transmitter and outputs a response signal, and a surface acoustic wave sensor that is output from the surface acoustic wave sensor. In a measurement system including a receiver that receives a response signal, the surface acoustic wave sensor includes a SAW element as a detection element, and the SAW element is made of an inorganic material composed of a main body and a lid. It is mounted by joining only one end side to the main body of the package, the package is joined to the mounting member, the SAW element and the main body are joined, and the main body is joined. The joint between the lid and the lid and the main body and the mounting member are joined via a sintered layer.

本発明の弾性表面波センサは、ＳＡＷ素子とパッケージの本体部との接合、パッケージの本体部と蓋部との接合、パッケージの本体部と取付部材との接合を、いずれも焼結層を介した接合とすることで、相互に強固な接合を形成することを可能とした。その結果、大きな振動が発生している場所に設置することが可能となる。さらに、従来より高温領域でもセンシングが可能となり、利用の拡大が期待できる。 In the surface acoustic wave sensor of the present invention, the SAW element and the main body of the package are joined, the main body of the package and the lid are joined, and the main body of the package and the mounting member are joined via a sintered layer. It was possible to form a strong bond with each other by making the bond. As a result, it can be installed in a place where a large vibration is generated. Furthermore, sensing is possible even in a higher temperature region than before, and it is expected that the use will expand.

また本発明の弾性表面波センサは、パッケージに取付部材を接合し、この取付部材に変形可能な取付部を備える構成とすることで、設置場所に密着させ、あるいは確実に接合することを可能とした。このような取付部材を備える構成によっても設置位置の制約を緩和することが可能となり、利用の拡大が期待できる。 Further, the surface acoustic wave sensor of the present invention has a structure in which a mounting member is joined to a package and the mounting member is provided with a deformable mounting portion, so that the mounting member can be brought into close contact with the installation location or can be securely joined. did. It is possible to relax the restrictions on the installation position even with the configuration provided with such a mounting member, and it is expected that the use will be expanded.

特に取付部を変形可能とし、設置位置に密着させることができるので、設置場所から取付部を介して熱が効果的に伝導し、温度センサとしての利用が期待できる。 In particular, since the mounting portion can be deformed and can be brought into close contact with the installation position, heat is effectively conducted from the mounting location through the mounting portion, and it can be expected to be used as a temperature sensor.

本発明の弾性表面波センサを用いた計測システムは、無給電の計測システムを構成することができるので、給電のための配線が不要となり、常に動いている場所や振動の大きな場所、温度の高い場所への設置が可能となり、センサの設置場所を選ばない計測システムとして利用の拡大が期待できる。 Since the measurement system using the surface acoustic wave sensor of the present invention can be configured as a non-power supply measurement system, wiring for power supply is not required, and the place is constantly moving, has a large vibration, and has a high temperature. It can be installed in any place, and it can be expected to be widely used as a measurement system that can be installed anywhere.

本発明の弾性表面波センサのＳＡＷ素子の説明図である。It is explanatory drawing of the SAW element of the surface acoustic wave sensor of this invention. 本発明の弾性表面波センサの説明図である。It is explanatory drawing of the surface acoustic wave sensor of this invention. 本発明の弾性表面波センサの説明図である。It is explanatory drawing of the surface acoustic wave sensor of this invention. 本発明の弾性表面波センサの説明図である。It is explanatory drawing of the surface acoustic wave sensor of this invention. 本発明の弾性表面波センサの説明図である。It is explanatory drawing of the surface acoustic wave sensor of this invention. 本発明の計測システムの説明図である。It is explanatory drawing of the measurement system of this invention. 本発明の計測システムの説明図である。It is explanatory drawing of the measurement system of this invention.

本発明の弾性表面波センサおよびそれを用いた計測システムは、検知素子であるＳＡＷ素子を無機材料のパッケージに実装し、ＳＡＷ素子とパッケージの本体部とを、パッケージの本体部と蓋部とを、さらにパッケージの本体部と取付部材とを焼結層を介した接合としている。このように構成することで、振動の大きい場所や、高温となる場所でのセンシングが可能となる。以下、本発明の実施例について詳細に説明する。 In the surface acoustic wave sensor of the present invention and the measurement system using the same, the SAW element, which is a detection element, is mounted on a package made of an inorganic material, and the SAW element and the main body of the package are separated from each other. Furthermore, the main body of the package and the mounting member are joined via a sintered layer. With this configuration, sensing can be performed in a place with large vibration or a place with high temperature. Hereinafter, examples of the present invention will be described in detail.

本発明の第１の実施例について、弾性表面波センサとして温度センサを構成した場合を例にとり詳細に説明する。まず、ＳＡＷ素子を用意する。図１は、本発明の温度センサに利用可能なＳＡＷ素子１０Ａを模式的に示している。図1に示すように、ＳＡＷ素子１０Ａは、水晶、ニオブ酸リチウム（ＬｉＮｂＯ3）、タンタル酸リチウム（ＬｉＴａＯ3）などからなる圧電基板１上に、第１の櫛形電極２ａと第２の櫛形電極２ｂが形成されている。第１の櫛形電極２ａに接続する第１の引出電極３ａと、第２の櫛形電極２ｂに接続する第２の引出電極３ｂは、圧電基板１の一方の端部側に配置する。圧電基板１の他方の端部側には、反射器４が配置されている。なお、第１および第２の引出電極３ａ、３ｂを圧電基板１の一方の端部側に配置することを除けば、櫛形電極や反射器の形状、配置等は適宜変更することが可能である。 A first embodiment of the present invention will be described in detail by taking a case where a temperature sensor is configured as a surface acoustic wave sensor as an example. First, a SAW element is prepared. FIG. 1 schematically shows a SAW element 10A that can be used in the temperature sensor of the present invention. As shown in FIG. 1, the SAW element 10A has a first comb-shaped electrode 2a and a second comb-shaped electrode on a piezoelectric substrate 1 made of quartz, lithium niobate (LiNbO 3 ), lithium tantalate (LiTaO 3 ), or the like. 2b is formed. The first extraction electrode 3a connected to the first comb-shaped electrode 2a and the second extraction electrode 3b connected to the second comb-shaped electrode 2b are arranged on one end side of the piezoelectric substrate 1. A reflector 4 is arranged on the other end side of the piezoelectric substrate 1. The shapes and arrangements of the comb-shaped electrodes and reflectors can be changed as appropriate, except that the first and second extraction electrodes 3a and 3b are arranged on one end side of the piezoelectric substrate 1. ..

ＳＡＷ素子１０Ａは、パッケージ内に実装される。このパッケージは、金属、ガラス、セラミック等焼結層による接合が可能な無機材料で形成することができる。特に耐熱性、耐久性、加工性の観点から、汎用的にはセラミックパッケージが選択できる。例えばセラミックパッケージは、ＳＡＷ素子を搭載する本体部と蓋部とで構成することができる。 The SAW element 10A is mounted in a package. This package can be formed of an inorganic material such as metal, glass, or ceramic that can be bonded by a sintered layer. In particular, from the viewpoint of heat resistance, durability, and workability, a ceramic package can be selected for general purposes. For example, a ceramic package can be composed of a main body and a lid on which a SAW element is mounted.

図２および図３に、セラミックパッケージ内に図１で説明したＳＡＷ素子１０Ａを実装した弾性表面波センサ２０Ａを示す。図２はセラミックパッケージの蓋部６を接合しない状態の平面図を、図３は蓋部６を接合した状態の断面図をそれぞれ示す。図２に示すようにパッケージの本体部５上にＳＡＷ素子１０Ａが実装される。ここで図３に示すようにＳＡＷ素子１０Ａは、その一端部側だけが接合材７に接触して本体部５と接合する片持ち梁構造で実装されている。図３に示す例では、パッケージの本体部５の底部の一部を高くするように段差を付け、この段差により接合材７を堰き止め、比較的高さの高い接合材７を形成している。接合材７とパッケージの本体部５との接着性を向上させるため本体部５の表面（底面）に選択的に金属膜を形成しておいても良い。なお、段差の形成は必ずしも必須ではなく、接合材７が所望の場所に形成できれば、種々変更可能である。 2 and 3 show a surface acoustic wave sensor 20A in which the SAW element 10A described with reference to FIG. 1 is mounted in a ceramic package. FIG. 2 shows a plan view of the ceramic package with the lid 6 not joined, and FIG. 3 shows a cross-sectional view of the ceramic package with the lid 6 joined. As shown in FIG. 2, the SAW element 10A is mounted on the main body 5 of the package. Here, as shown in FIG. 3, the SAW element 10A is mounted in a cantilever structure in which only one end portion thereof contacts the bonding material 7 and is bonded to the main body portion 5. In the example shown in FIG. 3, a step is provided so as to raise a part of the bottom portion of the main body portion 5 of the package, and the joint material 7 is blocked by this step to form a relatively high joint material 7. .. A metal film may be selectively formed on the surface (bottom surface) of the main body 5 in order to improve the adhesiveness between the bonding material 7 and the main body 5 of the package. It should be noted that the formation of the step is not always essential, and various changes can be made as long as the bonding material 7 can be formed at a desired location.

図３に示すようにＳＡＷ素子１０Ａの一方の端部側の接合材７とＳＡＷ素子１０Ａとの接合部上に、ＳＡＷ素子１０Ａの第１の引出電極３ａおよび第２の引出電極３ｂを配置することで、第１の引出電極３ａおよび第２の引出電極３ｂは、ワイヤ８によりパッケージ側電極９と接続することが可能となる。 As shown in FIG. 3, the first extraction electrode 3a and the second extraction electrode 3b of the SAW element 10A are arranged on the joint portion between the bonding material 7 on one end side of the SAW element 10A and the SAW element 10A. As a result, the first extraction electrode 3a and the second extraction electrode 3b can be connected to the package side electrode 9 by the wire 8.

このようなワイヤ８による接続を形成するためには、接合材７としてかたい接合層を形成する材料を選択するのが好ましい。例えば、金、銅、銀のような金属微粒子を含有する金属粉焼結ペーストを用いて、接合層として焼結層を形成するのが好ましい。３００℃程度の高温領域の温度センサとして使用する場合には、金属微粒子の含有量が７０ｗｔ％以上、好ましくは８５ｗｔ％含み、その他の成分である有機物の量が少ない金属粉焼結ペーストを選択し、焼結層とするのが好ましい。これは、金属微粒子の含有量が７０ｗｔ％未満となると有機物の含有量が多くなり、３００℃程度の高温での長期信頼性が低下するおそれがあるからである。 In order to form such a connection by the wire 8, it is preferable to select a material for forming a hard bonding layer as the bonding material 7. For example, it is preferable to form a sintered layer as a bonding layer by using a metal powder sintered paste containing metal fine particles such as gold, copper, and silver. When used as a temperature sensor in a high temperature region of about 300 ° C., select a metal powder sintered paste containing 70 wt% or more, preferably 85 wt% of metal fine particles and a small amount of organic substances as other components. , It is preferable to use a sintered layer. This is because if the content of the metal fine particles is less than 70 wt%, the content of organic substances increases, and the long-term reliability at a high temperature of about 300 ° C. may decrease.

なお金属粉焼結ペーストは、窒素または大気雰囲気下で加熱処理されることにより金属粒子が融着し焼結が進行し、生成した焼結層により接合を形成するものである。 In the metal powder sintered paste, metal particles are fused by heat treatment in nitrogen or an air atmosphere, and sintering proceeds, and a bond is formed by the generated sintered layer.

パッケージ側電極９は、図示しない貫通孔等によりパーケージの外部に形成される外部電極と接続する構造としている。このパッケージの外部電極は、後述する計測システムを構成する際、所望の電位を接続したり、電気信号を送受信するためのアンテナを接続することになる。 The package side electrode 9 has a structure in which it is connected to an external electrode formed outside the package by a through hole or the like (not shown). The external electrodes of this package are connected to an antenna for connecting a desired potential or transmitting and receiving an electric signal when configuring a measurement system described later.

パッケージの本体部５は、蓋部６と接合して密閉される。ここで、本体部５と蓋部６との接合も本体部５とＳＡＷ素子１０Ａとの接合に使用した接合材７を用いることができる。先に説明したように、高温での長期信頼性を確保するためである。接着性を向上させるため、それぞれの接合部の表面には、選択的に金属膜を形成しておいても良い。 The main body 5 of the package is joined to the lid 6 and sealed. Here, the joining material 7 used for joining the main body 5 and the SAW element 10A can also be used for joining the main body 5 and the lid 6. As described above, this is to ensure long-term reliability at high temperatures. In order to improve the adhesiveness, a metal film may be selectively formed on the surface of each joint.

このように形成した弾性表面波センサ２０Ａを所望の設置位置に固定するため、パッケージに取付部材３０Ａを接合する。図４は、図２に示した蓋部を外した状態の弾性表面波センサ２０Ａを取付部材３０Ａに接合した平面図を示す。取付部材３０Ａは、弾性表面波センサ２０Ａを接合する搭載部３１と、設置位置に固定するための取付部３２を備えている。図４に示す例では、取付部３２には固定のためのねじ等を取り付ける貫通孔３３が形成されている。 In order to fix the surface acoustic wave sensor 20A formed in this way at a desired installation position, the mounting member 30A is joined to the package. FIG. 4 shows a plan view in which the surface acoustic wave sensor 20A with the lid portion shown in FIG. 2 removed is joined to the mounting member 30A. The mounting member 30A includes a mounting portion 31 for joining the surface acoustic wave sensor 20A and a mounting portion 32 for fixing to the installation position. In the example shown in FIG. 4, the mounting portion 32 is formed with a through hole 33 for mounting a screw or the like for fixing.

図５は、図３に示す蓋部をつけた状態の弾性表面波センサ２０Ａを取付部材３０Ａに接合した断面図を示す。弾性表面波センサ２０Ａの底面が接合材７を介して取付部材３０Ａに接合している。この接合材７も、パッケージの本体部と蓋部との接合、本体部とＳＡＷ素子との接合に使用した接合材７を用いることができる。先に説明したように、高温での長期信頼性を確保するためである。それぞれの接合部の表面には、選択的に金属膜を形成しておいても良い。パッケージの本体部５と蓋部６との接合と、本体部５と取付部材３０Ａとの接合のため、焼結層を形成する工程は同時に行うことも可能である。 FIG. 5 shows a cross-sectional view in which the surface acoustic wave sensor 20A with the lid shown in FIG. 3 is joined to the mounting member 30A. The bottom surface of the surface acoustic wave sensor 20A is joined to the mounting member 30A via the joining material 7. As the joining material 7, the joining material 7 used for joining the main body and the lid of the package and joining the main body and the SAW element can be used. As described above, this is to ensure long-term reliability at high temperatures. A metal film may be selectively formed on the surface of each joint. Since the main body 5 and the lid 6 of the package are joined and the main body 5 and the mounting member 30A are joined, the steps of forming the sintered layer can be performed at the same time.

取付部材３０Ａを金属板で形成すると、熱伝導性が良く好ましい。また、弾性表面波センサ２０Ａを接合した状態では、セラミックパッケージに接合した搭載部３１は変形しないものの、取付部３２は変形可能となる。取付部３２を変形可能とすることは、後述する計測システムを構成する際、測定位置に密着させて取り付けることができ好適である。 It is preferable that the mounting member 30A is formed of a metal plate because of its good thermal conductivity. Further, in the state where the surface acoustic wave sensor 20A is joined, the mounting portion 31 joined to the ceramic package is not deformed, but the mounting portion 32 is deformable. Making the mounting portion 32 deformable is preferable because it can be mounted in close contact with the measurement position when configuring the measurement system described later.

取付部材３０Ａを構成する金属板は、例えば通常の半導体装置の製造工程で使用されるリードフレームを用いることができる。リードフレームを用いると、複数の取付部材３０Ａの集合体上に、弾性表面波センサ２０Ａを実装し、その後リードフレームを切断して個片化することで、取付部材３０Ａが接合した弾性表面波センサ２０Ａを簡便に形成することができる。 As the metal plate constituting the mounting member 30A, for example, a lead frame used in a normal manufacturing process of a semiconductor device can be used. When a lead frame is used, a surface acoustic wave sensor 20A is mounted on an aggregate of a plurality of mounting members 30A, and then the lead frame is cut and separated into individual pieces, whereby the surface acoustic wave sensor to which the mounting members 30A are joined is joined. 20A can be easily formed.

このような構造の本実施例の弾性表面波センサ２０Ａは、ＳＡＷ素子１０Ａがパッケージ内に確実に接着、実装され、動きのある設置位置、あるいは振動の大きな設置場所での使用が可能となる。また、３００℃程度の比較的高温領域でも使用が可能となり、従来の温度センサより高温領域のセンシングが可能となる。具体的な計測システムについては、第２の実施例として以下に詳述する。 In the surface acoustic wave sensor 20A of the present embodiment having such a structure, the SAW element 10A is surely adhered and mounted in the package, and it can be used in a moving installation position or an installation place with a large vibration. In addition, it can be used even in a relatively high temperature region of about 300 ° C., and can sense in a high temperature region as compared with a conventional temperature sensor. A specific measurement system will be described in detail below as a second embodiment.

次に、本発明の第２の実施例について、ワイヤレスの温度センサとして使用可能な計測システムを構成した場合を例にとり詳細に説明する。図６は、本実施例の計測システムの概略説明図である。上記第１の実施例で説明した取付部材３０Ａを接合した弾性表面波センサ２０Ａを被測定物の所定の設置位置に取り付ける。この取付けは、図４で説明した貫通孔３３内にネジ等を貫入させ、被測定物表面に固定すれば良い。被測定物が、例えば配管やエンジン等の場合、その表面は平坦でない場合が多い。その際には、取付部３２を変形させることで、少なくとも取付部３２は、被測定物の表面に沿うように取り付けるようにする。 Next, a second embodiment of the present invention will be described in detail by taking as an example a case where a measurement system that can be used as a wireless temperature sensor is configured. FIG. 6 is a schematic explanatory view of the measurement system of this embodiment. The surface acoustic wave sensor 20A to which the mounting member 30A described in the first embodiment is joined is mounted at a predetermined installation position of the object to be measured. For this mounting, a screw or the like may be inserted into the through hole 33 described with reference to FIG. 4 and fixed to the surface of the object to be measured. When the object to be measured is, for example, a pipe or an engine, its surface is often not flat. At that time, by deforming the mounting portion 32, at least the mounting portion 32 is mounted along the surface of the object to be measured.

弾性表面波センサ２０Ａの一対の櫛形電極のうち第１の櫛形電極２ａにアンテナ６１ａを接続する。その場合、第２の櫛形電極２ｂには接地電位が接続する。逆の接続でも良い。被測定物から離れた位置には、送受信機４０Ａを配置する。送受信機４０Ａにもアンテナ６１ｂが接続されている。送受信機４０Ａと弾性表面波センサ２０Ａとの間のワイヤレス通信は通常のＳＡＷ素子を用いた通信と同様となる。 The antenna 61a is connected to the first comb-shaped electrode 2a of the pair of comb-shaped electrodes of the surface acoustic wave sensor 20A. In that case, a ground potential is connected to the second comb-shaped electrode 2b. The reverse connection is also possible. The transmitter / receiver 40A is arranged at a position away from the object to be measured. The antenna 61b is also connected to the transmitter / receiver 40A. The wireless communication between the transmitter / receiver 40A and the surface acoustic wave sensor 20A is the same as the communication using a normal SAW element.

即ち、送受信機４０Ａのアンテナ６１ｂから電気信号を送信する。この電気信号はアンテナ６１ａが受信し、一対の櫛形電極によって表面弾性波に変換される。この表面弾性波は、圧電基板１上を伝搬し、反射器４で櫛形電極に向かって反射する。櫛形電極に伝搬した表面弾性波は、応答信号に変換される。この応答信号はアンテナ６１ａから送信され、アンテナ６１ｂで受信された応答信号は送受信機４０Ａで信号処理され、被測定物の温度が検知される。 That is, an electric signal is transmitted from the antenna 61b of the transmitter / receiver 40A. This electric signal is received by the antenna 61a and converted into a surface acoustic wave by a pair of comb-shaped electrodes. This surface acoustic wave propagates on the piezoelectric substrate 1 and is reflected by the reflector 4 toward the comb-shaped electrode. The surface acoustic wave propagating to the comb-shaped electrode is converted into a response signal. This response signal is transmitted from the antenna 61a, the response signal received by the antenna 61b is signal processed by the transmitter / receiver 40A, and the temperature of the object to be measured is detected.

図７は、送信信号と応答信号の位相差から被測定物の温度を検知する例を示している。図７に示すように、２５℃から２８０℃程度の広い温度範囲で、温度検知が可能となる結果が得られている。 FIG. 7 shows an example of detecting the temperature of the object to be measured from the phase difference between the transmission signal and the response signal. As shown in FIG. 7, the result that the temperature can be detected in a wide temperature range of about 25 ° C. to 280 ° C. has been obtained.

このような構成の本実施例の計測システムは、ＳＡＷ素子１０Ａがパッケージ内に確実に接合し、このパッケージが接合部材３０Ａに確実に接続し、さらに接合部材３０Ａが被測定物に確実に接合するため、動きのある設置場所、あるいは振動の大きな設置場所での使用が可能となる。また、３００℃程度の比較的高温領域でも使用が可能となり、従来の温度センサより高温領域のセンシングが可能となる。 In the measurement system of this embodiment having such a configuration, the SAW element 10A is securely joined in the package, the package is surely connected to the joining member 30A, and the joining member 30A is surely joined to the object to be measured. Therefore, it can be used in a moving installation place or an installation place with a large vibration. In addition, it can be used even in a relatively high temperature region of about 300 ° C., and can sense in a high temperature region as compared with a conventional temperature sensor.

以上本発明の実施例について説明したが、本発明の弾性表面波センサは温度センサに限定されるものではなく、圧力等の物理量センサに適用可能である。また上記実施例では、接合材７を同一の金属粉焼結ペーストを用いて焼結層を形成する旨説明したが、確実な接合が形成可能な範囲で、異なる種類の焼結層により接合を形成してもよい。 Although the embodiment of the present invention has been described above, the surface acoustic wave sensor of the present invention is not limited to the temperature sensor, and can be applied to a physical quantity sensor such as pressure. Further, in the above embodiment, it has been described that the bonding material 7 is formed of the sintered layer using the same metal powder sintered paste, but the bonding is performed by different types of sintering layers within the range in which a reliable bonding can be formed. It may be formed.

本発明の弾性表面波センサを製造する際、取付部材３０Ａとパッケージの本体部５との接合は、ＳＡＷ素子１を接合する前のパッケージの本体部５を取付部材３０Ａ（リードフレーム）に接合しても良い。 When manufacturing the surface acoustic wave sensor of the present invention, the mounting member 30A and the main body 5 of the package are joined by joining the main body 5 of the package before joining the SAW element 1 to the mounting member 30A (lead frame). You may.

１： 圧電基板、２ａ：第１の櫛形電極、２ｂ：第２の櫛形電極、３ａ：第１の引出電極、３ｂ：第２の引出電極、４：反射器、５:本体部、６：蓋部、７：接合材、８：ワイヤ、９：パッケージ側電極、３１：搭載部、３２：取付部、３３：貫通孔、６１：アンテナ、１０Ａ：ＳＡＷ素子、２０Ａ：弾性表面波センサ、３０Ａ：取付部材、４０Ａ：送受信機 1: Piezoelectric substrate, 2a: First comb-shaped electrode, 2b: Second comb-shaped electrode, 3a: First lead-out electrode, 3b: Second pull-out electrode, 4: Reflector, 5: Main body, 6: Lid Part, 7: Bonding material, 8: Wire, 9: Package side electrode, 31: Mounting part, 32: Mounting part, 33: Through hole, 61: Antenna, 10A: SAW element, 20A: Surface acoustic wave sensor, 30A: Mounting member, 40A: Transmitter / receiver

Claims (3)

検知素子としてＳＡＷ素子を備えた弾性表面波センサにおいて、
前記ＳＡＷ素子は、本体部と蓋部とで構成された無機材料からなるパッケージの前記本体部に一方の端部側のみ接合して実装されていることと、
前記パッケージは、取付部材に接合していることと、
前記ＳＡＷ素子と前記本体部との接合、前記本体部と前記蓋部との接合、および前記本体部と前記取付部材との接合が、焼結層を介した接合であることを特徴とする弾性表面波センサ。 In a surface acoustic wave sensor equipped with a SAW element as a detection element,
The SAW element is mounted on the main body of a package made of an inorganic material composed of a main body and a lid by joining only one end side.
The package must be joined to the mounting member and
Elasticity characterized in that the joining between the SAW element and the main body, the joining between the main body and the lid, and the joining between the main body and the mounting member are through a sintered layer. Surface wave sensor. 請求項１記載の弾性表面波センサにおいて、
前記取付部材は、変形して設置位置に密着接合する取付部を有することを特徴とする弾性表面波センサ。 In the surface acoustic wave sensor according to claim 1,
The surface acoustic wave sensor is characterized in that the mounting member has a mounting portion that is deformed and closely joined to the installation position. 電気信号を出力する送信機と、該送信機から送信された電気信号を受信し、応答信号を出力する弾性表面波センサと、該弾性表面波センサから出力される応答信号を受信する受信機とを備えた計測システムにおいて、
前記弾性表面波センサは、検知素子としてＳＡＷ素子を備え、該ＳＡＷ素子は、本体部と蓋部とで構成された無機材料からなるパッケージの前記本体部に一方の端部側のみ接合して実装されていることと、
前記パッケージは、取付部材に接合していることと、
前記ＳＡＷ素子と前記本体部との接合、前記本体部と蓋部との接合、および前記本体部と前記取付部材との接合が、焼結層を介した接合であることを特徴とする計測システム。 A transmitter that outputs an electric signal, an elastic surface wave sensor that receives an electric signal transmitted from the transmitter and outputs a response signal, and a receiver that receives a response signal output from the elastic surface wave sensor. In the measurement system equipped with
The surface acoustic wave sensor includes a SAW element as a detection element, and the SAW element is mounted by joining only one end side to the main body of a package made of an inorganic material composed of a main body and a lid. What has been done and
The package must be joined to the mounting member and
A measurement system characterized in that the joining between the SAW element and the main body, the joining between the main body and the lid, and the joining between the main body and the mounting member are through a sintered layer. ..
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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0888537A (en) * 1994-09-16 1996-04-02 Kyocera Corp Surface acoustic wave device
JP2002124848A (en) * 2000-10-17 2002-04-26 Tdk Corp Surface acoustic wave element, electronic component and its mounting method
JP2008175678A (en) * 2007-01-18 2008-07-31 Nec Tokin Corp Dynamic quantity sensor system
JP2008185573A (en) * 2007-01-31 2008-08-14 Noritz Corp Sensor attachment structure and hot water storage tank unit with this structure
JP2012235511A (en) * 2007-03-22 2012-11-29 Seiko Epson Corp Device
WO2018131164A1 (en) * 2017-01-16 2018-07-19 株式会社芝浦電子 Temperature sensor

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0888537A (en) * 1994-09-16 1996-04-02 Kyocera Corp Surface acoustic wave device
JP2002124848A (en) * 2000-10-17 2002-04-26 Tdk Corp Surface acoustic wave element, electronic component and its mounting method
JP2008175678A (en) * 2007-01-18 2008-07-31 Nec Tokin Corp Dynamic quantity sensor system
JP2008185573A (en) * 2007-01-31 2008-08-14 Noritz Corp Sensor attachment structure and hot water storage tank unit with this structure
JP2012235511A (en) * 2007-03-22 2012-11-29 Seiko Epson Corp Device
WO2018131164A1 (en) * 2017-01-16 2018-07-19 株式会社芝浦電子 Temperature sensor

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