JP2020190439A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP2020190439A JP2020190439A JP2019094771A JP2019094771A JP2020190439A JP 2020190439 A JP2020190439 A JP 2020190439A JP 2019094771 A JP2019094771 A JP 2019094771A JP 2019094771 A JP2019094771 A JP 2019094771A JP 2020190439 A JP2020190439 A JP 2020190439A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/26—Auxiliary measures taken, or devices used, in connection with the measurement of force, e.g. for preventing influence of transverse components of force, for preventing overload
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L3/00—Measuring torque, work, mechanical power, or mechanical efficiency, in general
- G01L3/02—Rotary-transmission dynamometers
- G01L3/14—Rotary-transmission dynamometers wherein the torque-transmitting element is other than a torsionally-flexible shaft
- G01L3/1464—Rotary-transmission dynamometers wherein the torque-transmitting element is other than a torsionally-flexible shaft involving screws and nuts, screw-gears or cams
- G01L3/1471—Rotary-transmission dynamometers wherein the torque-transmitting element is other than a torsionally-flexible shaft involving screws and nuts, screw-gears or cams using planet wheels or conical gears
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
- G01L5/16—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force
- G01L5/161—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force using variations in ohmic resistance
- G01L5/1627—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force using variations in ohmic resistance of strain gauges
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0311—Metallic part with specific elastic properties, e.g. bent piece of metal as electrical contact
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09027—Non-rectangular flat PCB, e.g. circular
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1031—Surface mounted metallic connector elements
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
Description
[測定対象物]
図1は、第1実施形態に係る半導体装置の測定対象物を例示する図であり、図1(a)は平面図、図1(b)は側面図である。
図2は、第1実施形態に係る半導体装置を例示する平面図である。図3は、第1実施形態に係る半導体装置を例示する背面図であり、半導体装置を図2とは反対側から視た図である。
測定用ばね端子40及びダミーばね端子50は、配線基板10の他方の面10bに設けられたランドに、例えば、はんだにより実装されるが、図3では、ランドやはんだの図示を省略している。
図5は、第1実施形態に係る半導体装置を測定対象物に装着した状態を例示する側面図である。
第1実施形態の変形例1では、第1実施形態とは形状が異なる突起部を備えた半導体装置の例を示す。なお、第1実施形態の変形例1において、既に説明した実施形態と同一構成部についての説明は省略する場合がある。
第1実施形態の変形例2では、第1実施形態とは形状が異なる突起部を備えた半導体装置の他の例を示す。なお、第1実施形態の変形例2において、既に説明した実施形態と同一構成部についての説明は省略する場合がある。
第1実施形態の変形例3では、第1実施形態よりもダミーばね端子50の数を増やす例を示す。なお、第1実施形態の変形例3において、既に説明した実施形態と同一構成部についての説明は省略する場合がある。
10 配線基板
10x、10y、500x、500y 貫通孔
21、22、23、24 半導体集積回路
21a、21b 演算増幅器
30 受動部品
40 測定用ばね端子
50 ダミーばね端子
60、70 柱状部材
500 測定対象物
510 円筒部
520 円盤部
520a 所定面
530 歯車
551、552、553、554、555、556、557、558 ひずみゲージ
570 ダミー端子
Claims (10)
- 所定面に複数のセンサが設けられた測定対象物に、着脱可能な状態で装着される半導体装置であって、
配線基板と、
前記配線基板の一方の面に実装された半導体集積回路と、
前記配線基板の他方の面に実装された複数の測定用ばね端子と、
前記配線基板の他方の面に設けられた複数の突起部と、を有し、
前記測定対象物の所定面と前記配線基板の他方の面とが対向するように前記半導体装置が前記測定対象物に装着されると、各々の前記測定用ばね端子は前記センサと接続する端子に接触して前記センサと接続する端子と電気的に導通し、各々の前記突起部が前記測定対象物に接触する半導体装置。 - 複数の前記突起部は、複数のダミーばね端子であり、
前記半導体装置が前記測定対象物に装着されると、各々の前記ダミーばね端子が前記測定対象物と接触する請求項1に記載の半導体装置。 - 前記半導体装置が前記測定対象物に装着されると、各々の前記ダミーばね端子は、前記測定対象物に設けられたダミー端子と接触し、
前記ダミーばね端子は、前記測定用ばね端子と同一形状に形成され、
前記ダミー端子の厚さは、前記センサと接続する端子の厚さと同一である請求項2に記載の半導体装置。 - 複数の前記突起部は、複数の柱状部材である請求項1に記載の半導体装置。
- 複数の前記突起部は、前記測定用ばね端子よりも前記配線基板の中心側に配置された突起部と、前記測定用ばね端子よりも前記配線基板の外周側に配置された突起部と、を含む請求項1乃至4の何れか一項に記載の半導体装置。
- 複数の前記突起部は、前記配線基板の中心に対して点対称に配置されている請求項1乃至5の何れか一項に記載の半導体装置。
- 前記突起部は、前記測定用ばね端子よりも硬い請求項1乃至6の何れか一項に記載の半導体装置。
- 前記半導体装置は、複数のスペーサーを介して前記測定対象物に装着され、
前記突起部は、前記スペーサーよりも柔らかい請求項7に記載の半導体装置。 - 前記センサは、ひずみゲージである請求項1乃至8の何れか一項に記載の半導体装置。
- 複数の前記センサは、少なくとも4つのひずみゲージを含み、
前記半導体装置が前記測定対象物に装着されると、4つの前記ひずみゲージはホイートストンブリッジ回路を構成する請求項9に記載の半導体装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019094771A JP7228465B2 (ja) | 2019-05-20 | 2019-05-20 | 半導体装置 |
US16/875,101 US11630010B2 (en) | 2019-05-20 | 2020-05-15 | Semiconductor device |
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JP2019094771A JP7228465B2 (ja) | 2019-05-20 | 2019-05-20 | 半導体装置 |
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JP2020190439A true JP2020190439A (ja) | 2020-11-26 |
JP7228465B2 JP7228465B2 (ja) | 2023-02-24 |
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US11650110B2 (en) * | 2020-11-04 | 2023-05-16 | Honeywell International Inc. | Rosette piezo-resistive gauge circuit for thermally compensated measurement of full stress tensor |
Citations (7)
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JPH0271278U (ja) * | 1988-11-17 | 1990-05-30 | ||
JP2004028767A (ja) * | 2002-06-25 | 2004-01-29 | Nec Corp | 回路基板調整用測定装置および回路基板調整方法 |
JP2004045378A (ja) * | 2002-05-13 | 2004-02-12 | Harmonic Drive Syst Ind Co Ltd | 波動歯車装置のトルク検出方法 |
JP2007188972A (ja) * | 2006-01-11 | 2007-07-26 | Okutekku:Kk | 微小構造体の検査装置、及び微小構造体の検査方法 |
WO2009114948A1 (en) * | 2008-03-18 | 2009-09-24 | Vachon Leandre | Security cap with latch |
JP2011049022A (ja) * | 2009-08-27 | 2011-03-10 | Shinko Electric Ind Co Ltd | 接続端子付基板 |
US20190064219A1 (en) * | 2017-08-22 | 2019-02-28 | Samsung Electronics Co., Ltd. | Probe card, test apparatus including the probe card, and related methods of manufacturing |
Family Cites Families (8)
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NL94441C (ja) * | 1951-09-15 | |||
BE572207A (ja) * | 1957-10-29 | |||
US3665113A (en) * | 1969-08-25 | 1972-05-23 | North Electric Co | Telephone repertory dialer |
US4203642A (en) * | 1979-05-25 | 1980-05-20 | The United States Of America As Represented By The Secretary Of The Air Force | Adjustable connector |
WO2002011904A1 (fr) * | 2000-08-08 | 2002-02-14 | Namiki Seimitsu Houseki Kabushiki Kaisha | Dispositif actionneur de type a induction electromagnetique et structure de montage adaptee et assistant numerique |
JP2005069402A (ja) * | 2003-08-26 | 2005-03-17 | Harmonic Drive Syst Ind Co Ltd | トルク検出機構付き波動歯車装置 |
US7332808B2 (en) * | 2005-03-30 | 2008-02-19 | Sanyo Electric Co., Ltd. | Semiconductor module and method of manufacturing the same |
US9535099B2 (en) * | 2014-05-19 | 2017-01-03 | Honeywell International Inc. | Systems and methods that allow for simultaneous sensor and signal conditioning circuit performance testing |
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2019
- 2019-05-20 JP JP2019094771A patent/JP7228465B2/ja active Active
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2020
- 2020-05-15 US US16/875,101 patent/US11630010B2/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0271278U (ja) * | 1988-11-17 | 1990-05-30 | ||
JP2004045378A (ja) * | 2002-05-13 | 2004-02-12 | Harmonic Drive Syst Ind Co Ltd | 波動歯車装置のトルク検出方法 |
JP2004028767A (ja) * | 2002-06-25 | 2004-01-29 | Nec Corp | 回路基板調整用測定装置および回路基板調整方法 |
JP2007188972A (ja) * | 2006-01-11 | 2007-07-26 | Okutekku:Kk | 微小構造体の検査装置、及び微小構造体の検査方法 |
WO2009114948A1 (en) * | 2008-03-18 | 2009-09-24 | Vachon Leandre | Security cap with latch |
JP2011049022A (ja) * | 2009-08-27 | 2011-03-10 | Shinko Electric Ind Co Ltd | 接続端子付基板 |
US20190064219A1 (en) * | 2017-08-22 | 2019-02-28 | Samsung Electronics Co., Ltd. | Probe card, test apparatus including the probe card, and related methods of manufacturing |
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US11630010B2 (en) | 2023-04-18 |
JP7228465B2 (ja) | 2023-02-24 |
US20200370976A1 (en) | 2020-11-26 |
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