JP2020187042A - Optical distance measurement device - Google Patents

Optical distance measurement device Download PDF

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JP2020187042A
JP2020187042A JP2019092514A JP2019092514A JP2020187042A JP 2020187042 A JP2020187042 A JP 2020187042A JP 2019092514 A JP2019092514 A JP 2019092514A JP 2019092514 A JP2019092514 A JP 2019092514A JP 2020187042 A JP2020187042 A JP 2020187042A
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light
light receiving
receiving region
region
incident
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林内　政人
Masato Rinnai
政人 林内
尾崎　憲幸
Noriyuki Ozaki
憲幸 尾崎
武廣 秦
Takehiro Hata
武廣 秦
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Denso Corp
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Denso Corp
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Abstract

To provide a technique that allows an optical distance measurement device to efficiently receive incident light and disturbance light without increasing the number of components.SOLUTION: An optical distance measurement device 20 comprises a light reception unit 60 having a plurality of light reception regions La2, Lb2, Lc2, and Ld2 for receiving incident light and implementing light reception of the incident light in units of light reception region, and a light emission unit 40 for implementing light emission of the irradiation light so as to correspond exclusively to each light reception region. When the light reception unit receives the incident light in response to the emission of the irradiation light by the light emission unit, another different light reception region from one light reception region is turned on to enter into a light reception state during a period when the one light reception region corresponding to the emission of the irradiation light of the plurality of light reception regions is turned on to enter into the light reception state.SELECTED DRAWING: Figure 7

Description

本開示は、光測距装置に関する。 The present disclosure relates to an optical ranging device.

光を照射し、対象物で反射された反射光を受光素子で受光することで対象物までの距離を測定する光測距装置が知られている。このような光測距装置は、反射光とともにノイズとしての外乱光を同時に受光することがある。入射光を受光するための受光領域と、外乱光を受光するための受光領域とを個別に備え、入射光から外乱光の影響を取り除く光測距装置が知られている（例えば、特許文献１）。 There is known an optical ranging device that measures the distance to an object by irradiating light and receiving the reflected light reflected by the object with a light receiving element. Such an optical ranging device may simultaneously receive ambient light as noise together with reflected light. There is known an optical ranging device that separately provides a light receiving region for receiving incident light and a light receiving region for receiving ambient light to remove the influence of ambient light from the incident light (for example, Patent Document 1). ).

特開２０１６−１７６７５０号公報Japanese Unexamined Patent Publication No. 2016-176750

こうした光測距装置では、外乱光のみを検出する受光領域を備えるために部品点数が増加する。そこで、部品点数の増加を抑制しつつ、外乱光と入射光とを効率良く受光できる光測距装置が望まれていた。 In such an optical ranging device, the number of parts increases because it includes a light receiving region that detects only ambient light. Therefore, there has been a demand for an optical ranging device that can efficiently receive ambient light and incident light while suppressing an increase in the number of parts.

本開示は、以下の形態として実現することが可能である。 The present disclosure can be realized in the following forms.

本開示の一形態によれば、光測距装置（２０）が提供される。この光測距装置は、入射光を受光するための複数の受光領域（Ｌａ２，Ｌｂ２，Ｌｃ２，Ｌｄ２）を有し、前記受光領域のそれぞれを単位として前記入射光の受光を実行する受光部（６０）と、前記受光領域のそれぞれに対応して排他的に照射光の照射を実行する発光部（４０）と、を備える。前記発光部による前記照射光の照射に応じて前記受光部により前記入射光を受光する際に、前記複数の受光領域のうち前記照射光の照射に対応する一の受光領域をオンにして受光状態とする期間内に、前記一の受光領域とは異なる他の受光領域をオンにして受光状態とする。 According to one embodiment of the present disclosure, an optical ranging device (20) is provided. This optical ranging device has a plurality of light receiving regions (La2, Lb2, Lc2, Ld2) for receiving incident light, and a light receiving unit (La2, Lb2, Lc2, Ld2) that executes light reception of the incident light in each of the light receiving regions as a unit. 60) and a light emitting unit (40) that exclusively irradiates the irradiation light corresponding to each of the light receiving regions. When the incident light is received by the light receiving unit in response to the irradiation of the irradiation light by the light emitting unit, one of the plurality of light receiving regions corresponding to the irradiation of the irradiation light is turned on to receive the light receiving state. Within the period of the above, another light receiving area different from the one light receiving area is turned on to put the light receiving state.

この形態の光測距装置によれば、複数の受光領域のうち一の受光領域に入射光を受光させる期間内に、他の受光領域に外乱光を受光させる。一の受光領域に入射光を受光させる期間内に、他の受光領域に外乱光を受光させる制御をひとつの受光部が実行するので、部品点数を増加させることなく入射光と外乱光とを受光させることができるとともに、外乱光のみを受光させるための期間を設けることなく効率良く入射光と外乱光とを受光させることができる。 According to the optical ranging device of this form, the ambient light is received by the other light receiving regions within the period in which the incident light is received by one of the light receiving regions. Since one light receiving unit executes control to receive the ambient light in the other light receiving area within the period in which the incident light is received in one light receiving area, the incident light and the ambient light are received without increasing the number of parts. In addition, it is possible to efficiently receive the incident light and the disturbance light without providing a period for receiving only the disturbance light.

本開示は、光測距装置以外の種々の形態で実現することも可能である。例えば、光測距方法、光測距装置を搭載する車両、光測距装置を制御する制御方法等の形態で実現できる。 The present disclosure can also be realized in various forms other than the optical ranging device. For example, it can be realized in the form of an optical ranging method, a vehicle equipped with an optical ranging device, a control method for controlling the optical ranging device, and the like.

第１実施形態の光測距装置の概略構成図。The schematic block diagram of the optical ranging device of 1st Embodiment. 光学系を表す概略構成図。Schematic block diagram showing an optical system. 受光アレイの構成を模式的に示す説明図。The explanatory view which shows typically the structure of the light receiving array. 画素に含まれる受光素子の構成を模式的に示す説明図。Explanatory drawing which shows typically the structure of the light receiving element included in a pixel. ＳＰＡＤ演算部の概略構成図。Schematic configuration diagram of the SPAD calculation unit. 反射光に対応するピーク信号の検出方法を示す説明図。Explanatory drawing which shows the detection method of the peak signal corresponding to the reflected light. 外乱光と入射光の受光方法を示すタイミングチャート。A timing chart showing a method of receiving ambient light and incident light. 第２実施形態でのピーク信号の算出に用いられる外乱光と入射光との関係を示す説明図。The explanatory view which shows the relationship between the disturbance light and the incident light used for the calculation of the peak signal in 2nd Embodiment.

Ａ．第１実施形態：
光測距装置２０は、距離を光学的に測距する装置である。光測距装置２０は、図１に示すように、測距のための照射光を射出して対象物からの反射光を受ける光学系３０と、光学系３０から得られた信号を処理するＳＰＡＤ演算部１００とを備える。光学系３０は、照射光としてのレーザ光を射出する発光部４０と、照射光を反射させて予め定められた領域に投射する投射部５０と、対象物からの反射光や外乱光を含む入射光を受光するための受光部６０とを備える。 A. First Embodiment:
The optical distance measuring device 20 is a device that optically measures a distance. As shown in FIG. 1, the optical ranging device 20 emits irradiation light for ranging and receives reflected light from an object, and a SPAD that processes a signal obtained from the optical system 30. It includes a calculation unit 100. The optical system 30 includes a light emitting unit 40 that emits laser light as irradiation light, a projection unit 50 that reflects the irradiation light and projects it onto a predetermined region, and incident light including reflected light and ambient light from an object. A light receiving unit 60 for receiving light is provided.

光学系３０の詳細を図２に示す。本実施形態において、発光部４０は、測距用のレーザ光を射出する半導体レーザ素子（以下、単にレーザ素子とも呼ぶ）４１と、レーザ素子４１の駆動回路を組み込んだ回路基板４３と、レーザ素子４１から射出されたレーザ光を平行光にするコリメートレンズ４５とを備える。レーザ素子４１は、いわゆる短パルスレーザを発振可能なレーザダイオードである。本実施形態において、レーザ素子４１は、複数のレーザダイオードを鉛直方向に沿って配列させることにより矩形状のレーザ発光領域を構成する。レーザ素子４１のレーザ光のパルス幅は、５ｎｓｅｃ程度である。５ｎｓｅｃの短パルスを用いることで、測距の分解能を高めている。 Details of the optical system 30 are shown in FIG. In the present embodiment, the light emitting unit 40 includes a semiconductor laser element (hereinafter, also simply referred to as a laser element) 41 that emits a laser beam for distance measurement, a circuit board 43 incorporating a drive circuit of the laser element 41, and a laser element. It includes a collimating lens 45 that makes the laser beam emitted from 41 into parallel light. The laser element 41 is a laser diode capable of oscillating a so-called short pulse laser. In the present embodiment, the laser element 41 constitutes a rectangular laser emitting region by arranging a plurality of laser diodes along the vertical direction. The pulse width of the laser beam of the laser element 41 is about 5 nsec. By using a short pulse of 5 nsec, the resolution of distance measurement is improved.

投射部５０は、いわゆる一次元スキャナによって構成される。投射部５０は、ミラー５４と、ロータリソレノイド５８と、回転部５６とによって構成される。ミラー５４は、コリメートレンズ４５により平行光とされたレーザ光を反射する。ロータリソレノイド５８は、後述する制御部１１０からの制御信号Ｓｍを受けて、予め定められた角度範囲内で正転および逆転を繰り返す。回転部５６は、ロータリソレノイド５８によって駆動し、鉛直方向を軸方向とする回転軸で正転および逆転を繰り返し、ミラー５４を水平方向に沿った一方向に走査させる。コリメートレンズ４５を介してレーザ素子４１から入射したレーザ光は、ミラー５４によって反射され、ミラー５４の回転により水平方向に沿って走査される。図１に、この照射光の走査範囲を測定範囲８０として概念的に示した。 The projection unit 50 is composed of a so-called one-dimensional scanner. The projection unit 50 includes a mirror 54, a rotary solenoid 58, and a rotating unit 56. The mirror 54 reflects the laser beam that is collimated by the collimated lens 45. The rotary solenoid 58 receives a control signal Sm from the control unit 110, which will be described later, and repeats forward rotation and reverse rotation within a predetermined angle range. The rotating portion 56 is driven by the rotary solenoid 58, repeats forward rotation and reverse rotation on a rotating axis with the vertical direction as the axial direction, and scans the mirror 54 in one direction along the horizontal direction. The laser beam incident from the laser element 41 via the collimating lens 45 is reflected by the mirror 54 and scanned along the horizontal direction by the rotation of the mirror 54. FIG. 1 conceptually shows the scanning range of the irradiation light as the measurement range 80.

光測距装置２０から出力されるレーザ光は、人や車などの対象物があると、その表面で乱反射し、その一部は反射光として投射部５０のミラー５４に戻ってくる。この反射光は、ミラー５４で反射されて、外乱光とともに入射光として受光部６０の受光レンズ６１に入射し、受光レンズ６１で集光されて受光アレイ６５に入射する。 When there is an object such as a person or a car, the laser beam output from the optical ranging device 20 is diffusely reflected on the surface of the object, and a part of the laser beam returns to the mirror 54 of the projection unit 50 as reflected light. This reflected light is reflected by the mirror 54, is incident on the light receiving lens 61 of the light receiving unit 60 as incident light together with the ambient light, is collected by the light receiving lens 61, and is incident on the light receiving array 65.

次に、図３および図４を用いて受光アレイ６５の構成について説明する。受光アレイ６５は、複数の画素６６を二次元配列することによって構成される。図３に示すように、受光アレイ６５は、直線状に配列された受光領域Ｌａ２，Ｌｂ２，Ｌｃ２，Ｌｄ２からなる複数の受光領域に区分される。発光部４０は、投射部５０を介して、各受光領域Ｌａ２，Ｌｂ２，Ｌｃ２，Ｌｄ２に対応して排他的に照射光の照射を実行し、各受光領域Ｌａ２，Ｌｂ２，Ｌｃ２，Ｌｄ２は、それぞれをひとつの単位として入射光の受光を実行する。 Next, the configuration of the light receiving array 65 will be described with reference to FIGS. 3 and 4. The light receiving array 65 is configured by arranging a plurality of pixels 66 in two dimensions. As shown in FIG. 3, the light receiving array 65 is divided into a plurality of light receiving regions including light receiving regions La2, Lb2, Lc2, and Ld2 arranged in a straight line. The light emitting unit 40 exclusively executes irradiation of the irradiation light corresponding to each light receiving region La2, Lb2, Lc2, Ld2 via the projection unit 50, and each light receiving region La2, Lb2, Lc2, Ld2 respectively. Is executed as one unit to receive the incident light.

図１には、各受光領域Ｌａ２，Ｌｂ２，Ｌｃ２，Ｌｄ２に対応する照射光の照射方向に対応する照射領域Ｌａ１，Ｌｂ１，Ｌｃ１，Ｌｄ１が測定範囲８０内に概念的に示されている。例えば、測定範囲８０の照射領域Ｌａ１に照射光が照射された場合、受光領域Ｌａ２の受光アレイ６５がオンにされ、反射光を受光可能な受光状態とされる。同様に、照射領域Ｌｂ１には受光領域Ｌｂ２が対応し、照射領域Ｌｃ１には受光領域Ｌｃ２が対応し、照射領域Ｌｄ１には受光領域Ｌｄ２が対応する。このように、本実施形態の光測距装置２０では、投射部５０による照射光の各照射領域Ｌａ１，Ｌｂ１，Ｌｃ１，Ｌｄ１への照射方向の制御と、各照射領域Ｌａ１，Ｌｂ１，Ｌｃ１，Ｌｄ１に対応する受光領域Ｌａ２，Ｌｂ２，Ｌｃ２，Ｌｄ２のＯＮ／ＯＦＦの制御とを対応付けて実行し、測定範囲８０を順次に測距する。 In FIG. 1, the irradiation regions La1, Lb1, Lc1, Ld1 corresponding to the irradiation direction of the irradiation light corresponding to each light receiving region La2, Lb2, Lc2, Ld2 are conceptually shown in the measurement range 80. For example, when the irradiation region La1 in the measurement range 80 is irradiated with the irradiation light, the light receiving array 65 in the light receiving region La2 is turned on so that the reflected light can be received. Similarly, the irradiation region Lb1 corresponds to the light receiving region Lb2, the irradiation region Lc1 corresponds to the light receiving region Lc2, and the irradiation region Ld1 corresponds to the light receiving region Ld2. As described above, in the optical ranging device 20 of the present embodiment, the projection unit 50 controls the irradiation direction of the irradiation light to each irradiation region La1, Lb1, Lc1, Ld1 and each irradiation region La1, Lb1, Lc1, Ld1. The ON / OFF control of the light receiving regions La2, Lb2, Lc2, and Ld2 corresponding to the above is executed in association with each other, and the measurement range 80 is sequentially measured.

図４に、画素６６の構成を示す。図４に示すように、画素６６は、水平方向にＨ個、鉛直方向にＶ個となるように配列された複数の受光素子６８で構成されている。本実施形態において、水平方向および鉛直方向においてそれぞれ５個の受光素子６８で構成されるが一つの受光素子６８であってもよく、任意の数で構成してもよい。受光素子６８には、アバランシェフォトダイオード（ＡＰＤ）が用いられるが、ＰＩＮフォトダイオードを用いてもよい。 FIG. 4 shows the configuration of the pixel 66. As shown in FIG. 4, the pixel 66 is composed of a plurality of light receiving elements 68 arranged so as to have H elements in the horizontal direction and V elements in the vertical direction. In the present embodiment, five light receiving elements 68 are formed in each of the horizontal direction and the vertical direction, but one light receiving element 68 may be used, or any number of light receiving elements 68 may be used. An avalanche photodiode (APD) is used as the light receiving element 68, but a PIN photodiode may also be used.

各受光素子６８は、図４の等価回路に示すように、電源Ｖｃｃと接地ラインとの間に直列にクエンチ抵抗器ＲｑとアバランシェダイオードＤａを接続し、その接続点の電圧を反転素子ＩＮＶに入力し、電圧レベルの反転したデジタル信号に変換している。アンド回路ＳＷの他方の入力の状態は、選択信号ＳＣにより切り換えることができる。選択信号ＳＣは、受光アレイ６５のどの受光素子６８からの信号を読み出すかを指定するのに用いられることから、アドレス信号とも呼ぶ。各受光素子６８が光を受光するタイミングに合わせて、アドレス信号ＳＣをハイレベルＨにすれば、アンド回路ＳＷの出力信号、つまり各受光素子６８からの出力信号Ｓｏｕｔは、アバランシェダイオードＤａの状態を反映したデジタル信号となる。 As shown in the equivalent circuit of FIG. 4, each light receiving element 68 connects a quenching resistor Rq and an avalanche diode Da in series between the power supply Vcc and the ground line, and inputs the voltage at the connection point to the inverting element INV. Then, it is converted into a digital signal with the voltage level inverted. The state of the other input of the AND circuit SW can be switched by the selection signal SC. Since the selection signal SC is used to specify which light receiving element 68 of the light receiving array 65 to read, it is also called an address signal. If the address signal SC is set to high level H in accordance with the timing at which each light receiving element 68 receives light, the output signal of the AND circuit SW, that is, the output signal Sout from each light receiving element 68 changes the state of the avalanche diode Da. It becomes a reflected digital signal.

出力信号Ｓｏｕｔは、照射光が走査範囲に存在する対象物ＯＢＪに反射して戻ってくる反射光や外乱光を含む入射光の受光により生じるパルス信号である。受光素子６８が出力するパルス信号は、ＳＰＡＤ演算部１００に入力される。 The output signal Sout is a pulse signal generated by receiving incident light including reflected light and ambient light in which the irradiation light is reflected by the object OBJ existing in the scanning range and returned. The pulse signal output by the light receiving element 68 is input to the SPAD calculation unit 100.

図５に、ＳＰＡＤ演算部１００の詳細を示す。ＳＰＡＤ演算部１００は、レーザ素子４１が照射光パルスを出力した時点から受光素子６８が反射光パルスを受け取るまでの時間Ｔｆから、対象物ＯＢＪまでの距離を演算する。ＳＰＡＤ演算部１００は、周知のマイクロプロセッサやメモリを備え、ＣＰＵが予め用意されたプログラムを実行することで、測距に必要な処理を行なう。ＳＰＡＤ演算部１００は、ＡＳＩＣ（Application Specific Integrated Circuit）や、内部回路のプログラムが可能なＦＰＧＡ（Field Programmable Gate Array）やＣＰＬＤ（Complex Programmable Logic Device）といったプログラマブル論理回路などの集積回路にＣＰＵやメモリを備える態様であってもよい。ＳＰＡＤ演算部１００は、全体の制御を行なう制御部１１０の他、加算部１２０、ヒストグラム生成部１３０、ピーク検出部１４０、距離演算部１５０を備える。 FIG. 5 shows the details of the SPAD calculation unit 100. The SPAD calculation unit 100 calculates the distance from the time Tf from the time when the laser element 41 outputs the irradiation light pulse until the light receiving element 68 receives the reflected light pulse to the object OBJ. The SPAD calculation unit 100 is provided with a well-known microprocessor and memory, and the CPU executes a program prepared in advance to perform processing necessary for distance measurement. The SPAD calculation unit 100 adds a CPU and memory to an integrated circuit such as an ASIC (Application Specific Integrated Circuit) or a programmable logic circuit such as an FPGA (Field Programmable Gate Array) or a CPLD (Complex Programmable Logic Device) capable of programming an internal circuit. It may be a mode to provide. The SPAD calculation unit 100 includes a control unit 110 that controls the entire system, an addition unit 120, a histogram generation unit 130, a peak detection unit 140, and a distance calculation unit 150.

加算部１２０は、受光アレイ６５を構成する画素６６に含まれる受光素子６８の出力を加算する回路である。入射光パルスが一つの画素６６に入射すると、画素６６に含まれる各受光素子６８が動作する。画素６６を複数個のＳＰＡＤから構成しているのは、ＳＰＡＤの特性による。ＳＰＡＤは、一つのフォトンが入射しただけでこれを検出することが可能であるが、対象物ＯＢＪからの限られた光によるＳＰＡＤの検出は確率的なものにならざるを得ない。ＳＰＡＤ演算部１００の加算部１２０は、確率的にしか入射光を検出し得ないＳＰＡＤからの出力信号Ｓｏｕｔを加算する。 The adder 120 is a circuit that adds the outputs of the light receiving elements 68 included in the pixels 66 constituting the light receiving array 65. When the incident light pulse is incident on one pixel 66, each light receiving element 68 included in the pixel 66 operates. The fact that the pixel 66 is composed of a plurality of SPADs depends on the characteristics of the SPAD. The SPAD can detect only one photon incident, but the detection of the SPAD by the limited light from the object OBJ must be probabilistic. The addition unit 120 of the SPAD calculation unit 100 adds the output signal Sout from the SPAD, which can detect the incident light only stochastically.

ヒストグラム生成部１３０は、加算部１２０の加算結果を複数回足し合せてヒストグラムを生成し、ピーク検出部１４０に出力する。ピーク検出部１４０は、ヒストグラム生成部１３０から入力された信号強度を解析して、反射光に対応する信号のピークの位置（時間）を検出する。図６に、反射光パルスに対応する信号のピークの検出方法を模式的に示した。 The histogram generation unit 130 adds the addition results of the addition unit 120 a plurality of times to generate a histogram, and outputs the histogram to the peak detection unit 140. The peak detection unit 140 analyzes the signal intensity input from the histogram generation unit 130 to detect the peak position (time) of the signal corresponding to the reflected light. FIG. 6 schematically shows a method of detecting a peak of a signal corresponding to a reflected light pulse.

図６に示す各グラフは、横軸を時間軸とし、縦軸を信号強度とするグラフである。上述したように、受光アレイ６５の各受光領域Ｌａ２，Ｌｂ２，Ｌｃ２，Ｌｄ２は、対象物ＯＢＪからの反射光を受光する際、ノイズとしての外乱光を含む入射光として受光する。ヒストグラム生成部１３０は、図６の左上に示す入射光に対応する信号（以下、入射信号とも呼ぶ）を含む信号強度のヒストグラムから、図６の左下に示す外乱光に対応する信号（以下、外乱信号とも呼ぶ）の信号強度の平均値を差し引く。この結果、図６の右側に示すように、入射光に含まれる反射光に対応する信号強度がピークとなって現れる。ピーク検出部１４０は、ヒストグラムの中で最も大きな度数の部分をピークと判断する。 Each graph shown in FIG. 6 is a graph in which the horizontal axis is the time axis and the vertical axis is the signal strength. As described above, each of the light receiving regions La2, Lb2, Lc2, and Ld2 of the light receiving array 65 receives the reflected light from the object OBJ as incident light including ambient light as noise. The histogram generation unit 130 uses a histogram of signal intensity including a signal corresponding to the incident light shown in the upper left of FIG. 6 (hereinafter, also referred to as an incident signal) to a signal corresponding to the disturbance light (hereinafter, disturbance) shown in the lower left of FIG. Subtract the average value of the signal strength (also called a signal). As a result, as shown on the right side of FIG. 6, the signal intensity corresponding to the reflected light contained in the incident light appears as a peak. The peak detection unit 140 determines that the portion having the highest frequency in the histogram is the peak.

ピーク検出部１４０によって反射光に対応する信号のピークが検出されると、距離演算部１５０は、照射光パルスが発光されてから、反射光パルスのピークまでの時間Ｔｆを検出することで、対象物までの距離Ｄを検出する。検出された距離Ｄは、例えば、光測距装置２０を搭載する運転支援装置に出力される。距離Ｄは、運転支援装置のほかに、光測距装置２０を搭載するドローンや電車、船舶などの種々の移動体の制御装置に出力されてもよく、固定された測距装置として単独で用いられてもよい。 When the peak of the signal corresponding to the reflected light is detected by the peak detection unit 140, the distance calculation unit 150 detects the time Tf from the emission of the irradiation light pulse to the peak of the reflected light pulse, thereby detecting the target. The distance D to the object is detected. The detected distance D is output to, for example, a driving support device equipped with the optical distance measuring device 20. The distance D may be output to a control device for various moving objects such as a drone, a train, and a ship equipped with the optical distance measuring device 20 in addition to the driving support device, and is used alone as a fixed distance measuring device. May be done.

制御部１１０は、図５に示すように、発光部４０の回路基板４３に対してレーザ素子４１の発光タイミングを決定する指令信号ＳＬや、いずれの受光素子６８をアクティブにするかを決定するアドレス信号ＳＣの他、ヒストグラム生成部１３０に対するヒストグラムの生成タイミングを指示する信号Ｓｔや、投射部５０のロータリソレノイド５８に対する制御信号Ｓｍを出力する。制御部１１０が予め定めたタイミングでこれらの信号を出力することにより、ＳＰＡＤ演算部１００は、測定範囲８０に存在する対象物ＯＢＪを、その対象物ＯＢＪまでの距離Ｄと共に検出する。 As shown in FIG. 5, the control unit 110 has a command signal SL for determining the light emission timing of the laser element 41 with respect to the circuit board 43 of the light emitting unit 40, and an address for determining which light receiving element 68 is to be activated. In addition to the signal SC, the signal St instructing the histogram generation timing to the histogram generation unit 130 and the control signal Sm to the rotary solenoid 58 of the projection unit 50 are output. By outputting these signals at a predetermined timing by the control unit 110, the SPAD calculation unit 100 detects the object OBJ existing in the measurement range 80 together with the distance D to the object OBJ.

次に、図７のタイミングチャートを用いて、本実施形態の光測距装置２０が実行する入射光と外乱光との受光方法について説明する。図７の最上段には、照射領域ごとの投射部５０のＯＮ／ＯＦＦ制御が示されている。それよりも下側には、受光アレイ６５の各受光領域Ｌａ２，Ｌｂ２，Ｌｃ２，Ｌｄ２のＯＮ／ＯＦＦ制御が示されている。各受光領域Ｌａ２，Ｌｂ２，Ｌｃ２，Ｌｄ２のＯＮ／ＯＦＦ制御とは、受光領域Ｌａ２，Ｌｂ２，Ｌｃ２，Ｌｄ２ごとに個別に受光状態と非受光状態とを切り換える制御のことを表し、制御部１１０によるアドレス信号ＳＣが各受光領域Ｌａ２，Ｌｂ２，Ｌｃ２，Ｌｄ２に属する受光素子６８に選択的に入力されることによって実現される。横軸は、時間軸であり各部の制御において共通する。 Next, using the timing chart of FIG. 7, a method of receiving light of incident light and ambient light executed by the optical ranging device 20 of the present embodiment will be described. On the uppermost stage of FIG. 7, ON / OFF control of the projection unit 50 for each irradiation region is shown. Below that, ON / OFF control of each light receiving region La2, Lb2, Lc2, Ld2 of the light receiving array 65 is shown. The ON / OFF control of each light receiving region La2, Lb2, Lc2, Ld2 represents a control for individually switching between a light receiving state and a non-light receiving state for each light receiving region La2, Lb2, Lc2, Ld2, and is controlled by the control unit 110. This is realized by selectively inputting the address signal SC to the light receiving element 68 belonging to each light receiving region La2, Lb2, Lc2, Ld2. The horizontal axis is the time axis and is common to the control of each part.

図７の最上段には、投射部５０による照射光の各照射領域Ｌａ１，Ｌｂ１，Ｌｃ１，Ｌｄ１への照射方向の制御を示し、図７のそれよりも下側には、各照射領域Ｌａ１，Ｌｂ１，Ｌｃ１，Ｌｄ１に対応する受光領域Ｌａ２，Ｌｂ２，Ｌｃ２，Ｌｄ２のＯＮ／ＯＦＦの制御を示した。 The uppermost part of FIG. 7 shows the control of the irradiation direction of the irradiation light by the projection unit 50 to each irradiation area La1, Lb1, Lc1, Ld1, and below that of FIG. 7, each irradiation area La1, The ON / OFF control of the light receiving regions La2, Lb2, Lc2, and Ld2 corresponding to Lb1, Lc1, and Ld1 is shown.

本実施形態の光測距装置２０では、受光領域Ｌａ２，Ｌｂ２，Ｌｃ２，Ｌｄ２のうち一の受光領域が入射光を検出するためにオンにして受光状態にされる期間内に、他の受光領域もオンにして受光状態とする制御を行う。例えば、時間ｔ１では、照射光の照射を照射領域Ｌａ１に対応する受光領域Ｌａ２をオンにして反射光を受光可能な受光状態とする期間内に、受光領域Ｌｃ２の受光領域もオンにして受光状態とする制御を行う。このとき、受光領域Ｌｃ２は、照射領域Ｌａ１と対応付けられていないために、反射光よりも外乱光を多く受光し得ることになる。このように、本実施形態の光測距装置２０では、一の受光領域に入射光を受光させる期間内に、他の受光領域が外乱光を多く受光するように制御する。このとき、反射光を受光させる一の受光領域と、同期間内に並行して外乱光を受光させる他の受光領域とは、互いに離間されていることが好ましい。外乱光を受光させる受光領域が反射光を受光させる受光領域に近いほど、外乱光とともにノイズとしての反射光を受光し得るからである。 In the optical ranging device 20 of the present embodiment, one of the light receiving regions La2, Lb2, Lc2, and Ld2 is turned on to detect the incident light, and the other light receiving region is put into the light receiving state within the period. Is also turned on to control the light reception state. For example, at time t1, the light receiving region of the light receiving region Lc2 is also turned on during the period in which the light receiving region La2 corresponding to the irradiation region La1 is turned on so that the reflected light can be received. Control is performed. At this time, since the light receiving region Lc2 is not associated with the irradiation region La1, it is possible to receive more ambient light than the reflected light. As described above, in the optical ranging device 20 of the present embodiment, the other light receiving regions are controlled so as to receive a large amount of ambient light within the period in which the incident light is received by one light receiving region. At this time, it is preferable that one light receiving region that receives reflected light and another light receiving region that receives ambient light in parallel during the same period are separated from each other. This is because the closer the light receiving region for receiving the ambient light is to the light receiving region for receiving the reflected light, the more the reflected light as noise can be received together with the ambient light.

本実施形態の光測距装置２０は、各照射領域Ｌａ１，Ｌｂ１，Ｌｃ１，Ｌｄ１をオンとするタイミングと、各照射領域Ｌａ１〜Ｌｄ１に対応する受光領域Ｌａ２〜Ｌｄ２をオンとするタイミングとが同時になるように制御する。これにより、制御部１１０が発光部４０に指令信号ＳＬを出力する時点、すなわち発光を指示する時点から、実際に発光部４０のレーザ素子４１が発光する時点までの期間（以下、「遅延期間」とも呼ぶ）も、各受光領域Ｌａ２〜Ｌｄ２が受光状態とされる。 In the optical ranging device 20 of the present embodiment, the timing of turning on each irradiation region La1, Lb1, Lc1, Ld1 and the timing of turning on the light receiving regions La2 to Ld2 corresponding to each irradiation region La1 to Ld1 are simultaneously turned on. Control to be. As a result, a period from the time when the control unit 110 outputs the command signal SL to the light emitting unit 40, that is, the time when the laser element 41 of the light emitting unit 40 actually emits light (hereinafter, “delay period””. Also referred to as), each light receiving region La2 to Ld2 is in a light receiving state.

次に時間ｔ２において、投射部５０によって照射光が照射領域Ｌｂ１に照射されるとともに、受光領域Ｌｂ２をオンにして反射光を受光可能な受光状態とされるとともに、外乱光の受光のために受光領域Ｌｄ２もオンとする制御を行う。受光領域Ｌｂ２と受光領域Ｌｄ２とが組み合わされるのは、上述の受光領域Ｌａ２と受光領域Ｌｃ２との関係と同様、受光領域Ｌｂ２と受光領域Ｌｄ２とが互いに離間した位置に配されることに基づく。 Next, at time t2, the irradiation light is irradiated to the irradiation region Lb1 by the projection unit 50, the light receiving region Lb2 is turned on to be in a light receiving state capable of receiving the reflected light, and the light is received to receive the ambient light. Control is performed so that the region Ld2 is also turned on. The combination of the light receiving region Lb2 and the light receiving region Ld2 is based on the fact that the light receiving region Lb2 and the light receiving region Ld2 are arranged at positions separated from each other, as in the relationship between the light receiving region La2 and the light receiving region Lc2 described above.

同様に時間ｔ３において、制御部１１０は、照射領域Ｌｃ１に対応する受光領域Ｌｃ２をオンとするとともに、外乱光の受光のために受光領域Ｌａ２をオンとする制御を行う。時間ｔ４において、照射領域Ｌｄ１に対応する受光領域Ｌｄ２をオンとするとともに、外乱光の受光のために受光領域Ｌｂ２をオンとする制御を行う。時間ｔ５以降では、時間ｔ１から時間ｔ５までの制御が繰り返される。 Similarly, at time t3, the control unit 110 controls to turn on the light receiving region Lc2 corresponding to the irradiation region Lc1 and to turn on the light receiving region La2 to receive the ambient light. At time t4, the light receiving region Ld2 corresponding to the irradiation region Ld1 is turned on, and the light receiving region Lb2 is turned on to receive the ambient light. After the time t5, the control from the time t1 to the time t5 is repeated.

次に、図７を用いて、本実施形態の光測距装置２０によって実行される反射光の信号強度の算出方法について説明する。上述したように、ＳＰＡＤ演算部１００は、入射信号の信号強度のヒストグラムから外乱信号の信号強度の平均値を差し引くことにより、反射光に対応するピークを検出する。図７に、反射光のピーク検出に用いられる外乱信号と入射信号との関係を、方向Ｄ１１，Ｄ１２，Ｄ１３，Ｄ１４によって概念的に表した。 Next, a method of calculating the signal intensity of the reflected light executed by the optical ranging device 20 of the present embodiment will be described with reference to FIG. 7. As described above, the SPAD calculation unit 100 detects the peak corresponding to the reflected light by subtracting the average value of the signal strength of the disturbance signal from the histogram of the signal strength of the incident signal. In FIG. 7, the relationship between the disturbance signal and the incident signal used for peak detection of the reflected light is conceptually represented by the directions D11, D12, D13, and D14.

方向Ｄ１１，Ｄ１２，Ｄ１３，Ｄ１４で示すように、反射光に対応する信号強度のピークを検出するために用いられる入射信号と外乱信号とを取得する受光領域が同一となるように制御される。例えば、方向Ｄ１１は、時間ｔ５に受光領域Ｌａ２で検出した入射信号のヒストグラムと、時間ｔ３に受光領域Ｌｃ２がオンとされる期間内に受光領域Ｌａ２が検出した外乱信号の信号強度の平均値とを用いて反射光の信号強度を算出することを表す。このように、本実施形態では、一の受光領域が検出した入射光に対応する入射信号と、他の受光領域をオンとする期間内にこの一の受光領域が検出した外乱光に対応する外乱信号とを用いる。 As shown in the directions D11, D12, D13, and D14, the light receiving region for acquiring the incident signal and the disturbance signal used for detecting the peak of the signal intensity corresponding to the reflected light is controlled to be the same. For example, the direction D11 is a histogram of the incident signal detected in the light receiving region La2 at time t5, and a mean value of the signal intensities of the disturbance signal detected by the light receiving region La2 during the period when the light receiving region Lc2 is turned on at time t3. Indicates that the signal intensity of the reflected light is calculated using. As described above, in the present embodiment, the incident signal corresponding to the incident light detected by one light receiving region and the disturbance corresponding to the disturbance light detected by this one light receiving region within the period when the other light receiving region is turned on. Use with a signal.

以上のように、本実施形態の光測距装置２０によれば、受光領域Ｌａ２，Ｌｂ２，Ｌｃ２，Ｌｄ２のうち一の受光領域に入射光を受光させる期間内に、他の受光領域に外乱光を受光させる制御が実行される。一の受光領域に入射光を受光させる期間内に、他の受光領域に外乱光を受光させる制御がひとつの受光アレイ６５で実行されるので、部品点数を増加させることなく入射光と外乱光とを受光できるとともに、外乱光のみを受光させるための期間を別に設けることなく効率良く入射光と外乱光とを受光させることができる。 As described above, according to the optical ranging device 20 of the present embodiment, the ambient light is emitted to the other light receiving region within the period in which the incident light is received by one of the light receiving regions La2, Lb2, Lc2, and Ld2. The control to receive light is executed. Since the control for receiving the ambient light to the other light receiving region is executed by one light receiving array 65 within the period during which the incident light is received by one light receiving region, the incident light and the ambient light can be obtained without increasing the number of parts. Can receive light, and can efficiently receive incident light and ambient light without providing a separate period for receiving only ambient light.

本実施形態の光測距装置２０によれば、同一の受光領域で検出した外乱信号と入射信号とを用いて反射光に対応する信号強度のピークを検出する。同一の位置の受光領域に受光した入射光と外乱光とを用いることにより、入射信号に含まれる外乱信号の検出精度を高めることができ、反射光の検出精度を向上させることができる。 According to the optical ranging device 20 of the present embodiment, the peak of the signal intensity corresponding to the reflected light is detected by using the disturbance signal and the incident signal detected in the same light receiving region. By using the incident light and the disturbance light received in the light receiving region at the same position, the detection accuracy of the disturbance signal included in the incident signal can be improved, and the detection accuracy of the reflected light can be improved.

本実施形態の光測距装置２０によれば、反射光を受光させる一の受光領域と、同期間内に並行して外乱光を受光させる他の受光領域とが互いに離間されて配置されるので、外乱光を受光させる他の受光領域に外乱光とともにノイズとしての反射光が入射してしまう不具合を抑制することができる。 According to the optical ranging device 20 of the present embodiment, one light receiving region for receiving reflected light and another light receiving region for receiving ambient light in parallel during the same period are arranged so as to be separated from each other. It is possible to suppress the problem that the reflected light as noise is incident on the other light receiving region that receives the disturbance light together with the disturbance light.

本実施形態の光測距装置２０では、受光領域Ｌａ２，Ｌｂ２，Ｌｃ２，Ｌｄ２からなる３以上の複数の受光領域が直線状に配列される。受光領域Ｌａ２と受光領域Ｌｃ２とのように互いに離間する受光領域間に、受光領域Ｌｂ２といった第三の受光領域を更に備えることによって、離間する受光領域間の領域を利用して効率良く入射光と外乱光とを検出させることができる。本実施形態では、受光領域Ｌａ２，Ｌｂ２，Ｌｃ２，Ｌｄ２からなる４つの領域を直線状に配列し、受光領域Ｌａ２と受光領域Ｌｃ２、受光領域Ｌｂ２と受光領域Ｌｄ２のように、互いに離間する２つの受光領域を組み合わせているので、より効率良く入射光と外乱光とを受光させることができる。 In the optical ranging device 20 of the present embodiment, a plurality of three or more light receiving regions including the light receiving regions La2, Lb2, Lc2, and Ld2 are linearly arranged. By further providing a third light receiving region such as the light receiving region Lb2 between the light receiving regions separated from each other such as the light receiving region La2 and the light receiving region Lc2, the region between the separated light receiving regions can be efficiently used for the incident light. It is possible to detect ambient light. In the present embodiment, four regions consisting of light receiving regions La2, Lb2, Lc2, and Ld2 are linearly arranged, and two regions separated from each other, such as light receiving region La2 and light receiving region Lc2, and light receiving region Lb2 and light receiving region Ld2. Since the light receiving regions are combined, the incident light and the ambient light can be received more efficiently.

本実施形態の光測距装置２０によれば、各照射領域Ｌａ１，Ｌｂ１，Ｌｃ１，Ｌｄ１をオンとするタイミングと、各照射領域Ｌａ１〜Ｌｄ１に対応する受光領域Ｌａ２〜Ｌｄ２をオンとするタイミングとが同時になるように制御される。これにより、制御部１１０による発光指示の時点から発光部４０が実際に発光する時点までの遅延期間内、受光領域Ｌａ２〜Ｌｄ２は外乱光を受光し得る。したがって、一つの受光領域が、遅延期間を利用して効率良く外乱光を検出できるとともに、入射光を取得する直前での外乱光を取得し得るので、反射光の検出精度を向上させることができる。また、外乱光の取得と入射光の取得とを同じ受光領域で取得し得るので、入射信号に含まれる外乱信号の検出精度を高めることができ、反射光の検出精度を向上させることができる。 According to the optical ranging device 20 of the present embodiment, the timing of turning on each irradiation region La1, Lb1, Lc1, Ld1 and the timing of turning on the light receiving regions La2 to Ld2 corresponding to each irradiation region La1 to Ld1. Are controlled to be at the same time. As a result, the light receiving regions La2 to Ld2 can receive ambient light within the delay period from the time when the light emitting unit 110 is instructed to emit light to the time when the light emitting unit 40 actually emits light. Therefore, one light receiving region can efficiently detect the disturbance light by utilizing the delay period, and can acquire the disturbance light immediately before acquiring the incident light, so that the detection accuracy of the reflected light can be improved. .. Further, since the acquisition of the disturbance light and the acquisition of the incident light can be acquired in the same light receiving region, the detection accuracy of the disturbance signal included in the incident signal can be improved, and the detection accuracy of the reflected light can be improved.

Ｂ．第２実施形態：
図８を用いて、第２実施形態の光測距装置２０について説明する。第２実施形態の光測距装置２０の各部の構成は、第１実施形態の光測距装置２０と同様であるが、反射光の信号強度の算出方法が第１実施形態とは異なる。 B. Second embodiment:
The optical ranging device 20 of the second embodiment will be described with reference to FIG. The configuration of each part of the optical ranging device 20 of the second embodiment is the same as that of the optical ranging device 20 of the first embodiment, but the method of calculating the signal intensity of the reflected light is different from that of the first embodiment.

図８に、第２実施形態においてＳＰＡＤ演算部１００が反射光のピーク検出に用いる外乱信号と入射信号との関係を方向Ｄ２１，Ｄ２２，Ｄ２３，Ｄ２４によって概念的に表した。方向Ｄ２１，Ｄ２２，Ｄ２３，Ｄ２４で示すように、反射光に対応する信号強度のピークを検出するために用いられる入射信号と外乱信号とを取得する期間が同一となるように制御される。例えば、方向Ｄ２１は、時間ｔ１に受光領域Ｌａ２で検出した入射信号のヒストグラムと、同期間中に受光領域Ｌｃ２で検出した外乱信号の信号強度の平均値とを用いて反射光の信号強度を算出することを表す。このように、本実施形態では、一の受光領域をオンとする期間内に、一の受光領域が検出した入射光に対応する入射信号と、同期間内に他の受光領域が検出した外乱光に対応する外乱信号とを用いる。 FIG. 8 conceptually shows the relationship between the disturbance signal and the incident signal used by the SPAD calculation unit 100 for detecting the peak of the reflected light in the second embodiment by the directions D21, D22, D23, and D24. As shown in the directions D21, D22, D23, and D24, the period for acquiring the incident signal and the disturbance signal used for detecting the peak of the signal intensity corresponding to the reflected light is controlled to be the same. For example, in the direction D21, the signal intensity of the reflected light is calculated by using the histogram of the incident signal detected in the light receiving region La2 at time t1 and the average value of the signal intensities of the disturbance signal detected in the light receiving region Lc2 during the same period. Represents to do. As described above, in the present embodiment, the incident signal corresponding to the incident light detected by one light receiving region and the ambient light detected by the other light receiving region within the same period during the period when one light receiving region is turned on. The disturbance signal corresponding to is used.

第２実施形態の光測距装置２０によれば、一の受光領域が検出する入射信号と、この一の受光領域が入射信号を検出する期間中に他の受光領域が検出した外乱信号とを用いて、反射光に対応する信号強度のピークを検出する。同期間中に受光した入射光と外乱光とを用いることにより、入射光の受光時点の環境に応じた外乱光を検出することができ、反射光の検出精度を高めることができる。 According to the optical ranging device 20 of the second embodiment, the incident signal detected by one light receiving region and the disturbance signal detected by the other light receiving region while the one light receiving region detects the incident signal. It is used to detect the peak of the signal intensity corresponding to the reflected light. By using the incident light received during the same period and the ambient light, it is possible to detect the ambient light according to the environment at the time of receiving the incident light, and it is possible to improve the detection accuracy of the reflected light.

Ｃ．他の実施形態：
（Ｃ１）上記各実施形態では、受光アレイ６５は、直線状に配列された、受光領域Ｌａ２，Ｌｂ２，Ｌｃ２，Ｌｄ２の４つの受光領域で構成されるが、受光領域は４つに限定されず、２つであるほか、３以上の任意の数の受光領域を備える態様であってよい。受光領域の配列は、直線状でなくとも正方形状や円形状など照射光の照射領域の形状に応じた任意の形状で配列されてもよい。また、各領域は、互いに隣接せずそれぞれが互いに離間した位置関係となるように配置されてもよい。 C. Other embodiments:
(C1) In each of the above embodiments, the light receiving array 65 is composed of four light receiving regions La2, Lb2, Lc2, and Ld2 arranged in a straight line, but the light receiving region is not limited to four. In addition to the number of 2, the mode may include any number of light receiving regions of 3 or more. The arrangement of the light receiving regions may be any shape according to the shape of the irradiation region of the irradiation light, such as a square shape or a circular shape, even if it is not linear. Further, the regions may be arranged so as not to be adjacent to each other but to be separated from each other.

（Ｃ２）上記各実施形態では、受光領域Ｌａ２と受光領域Ｌｃ２、受光領域Ｌｂ２と受光領域Ｌｄ２のように、外乱光を受光させる受光領域と、入射光を受光させる受光領域とが互いに離間する位置関係を示したが、受光領域Ｌａ２と受光領域Ｌｂ２、受光領域Ｌｂ２と受光領域Ｌｃ２、受光領域Ｌｃ２と受光領域Ｌｄ２などのように互いに離間せず隣接する位置関係の受光領域が用いられてもよい。 (C2) In each of the above embodiments, positions such as the light receiving region La2 and the light receiving region Lc2, the light receiving region Lb2 and the light receiving region Ld2, where the light receiving region that receives the ambient light and the light receiving region that receives the incident light are separated from each other. Although the relationship is shown, light receiving regions having a positional relationship adjacent to each other, such as the light receiving region La2 and the light receiving region Lb2, the light receiving region Lb2 and the light receiving region Lc2, and the light receiving region Lc2 and the light receiving region Ld2, may be used. ..

（Ｃ３）上記各実施形態では、受光領域Ｌａ２と受光領域Ｌｃ２、受光領域Ｌｂ２と受光領域Ｌｄ２のように、互いに離間した位置関係にある受光領域で受光した外乱信号と入射信号とを用いて信号強度を算出するが、受光領域Ｌａ２と受光領域Ｌｂ２、受光領域Ｌｂ２と受光領域Ｌｃ２、受光領域Ｌｃ２と受光領域Ｌｄ２などのように互いに離間せず隣接する位置関係の受光領域で検出した外乱信号と入射信号とを用いてもよい。 (C3) In each of the above embodiments, a signal is used by using the disturbance signal and the incident signal received in the light receiving regions that are separated from each other, such as the light receiving region La2 and the light receiving region Lc2, and the light receiving region Lb2 and the light receiving region Ld2. The intensity is calculated, but the disturbance signal detected in the light receiving area of the adjacent positional relationship such as the light receiving area La2 and the light receiving area Lb2, the light receiving area Lb2 and the light receiving area Lc2, the light receiving area Lc2 and the light receiving area Ld2, etc. An incident signal may be used.

（Ｃ４）上記各実施形態では、投射部５０は、１つの平面状のミラーを備える一次元スキャナによって構成されるが、２つのミラーを組み合わせて二次元スキャナとして構成されてもよく、互いに交差する２つの回転軸で回転する１つのミラーによって二次元スキャナとして構成されてもよい。投射部５０は、平面状のミラーに限らず、ポリゴンミラー、多面体ミラー、ＭＥＭＳミラー、ガルバノミラーといった種々のミラーで構成されてもよい。 (C4) In each of the above embodiments, the projection unit 50 is composed of a one-dimensional scanner including one planar mirror, but the two mirrors may be combined to form a two-dimensional scanner and intersect with each other. It may be configured as a two-dimensional scanner by one mirror rotating on two rotation axes. The projection unit 50 is not limited to a flat mirror, and may be composed of various mirrors such as a polygon mirror, a polyhedral mirror, a MEMS mirror, and a galvano mirror.

（Ｃ５）上記各実施形態では、受光素子６８として、ピンフォトダイオードやアバランシェフォトダイオード等のＳＰＡＤを備える例を示したが、ＳＰＡＤ以外の受光素子によって構成されてもよい。例えば、受光素子６８には、外部光電効果（光電子放出）を用いた光電管や光電子増倍管のほか、半導体の内部光電効果を利用したフォトトランジスタ、光導電セル、イメージセンサが用いられてもよく、光吸収による熱を検出する放射用熱電対、サーモパイルが用いられてもよい。 (C5) In each of the above embodiments, the light receiving element 68 includes a SPAD such as a pin photodiode or an avalanche photodiode, but it may be composed of a light receiving element other than the SPAD. For example, as the light receiving element 68, a photocell or a photomultiplier tube using the external photoelectric effect (photoelectron emission), a phototransistor using the internal photoelectric effect of the semiconductor, a photoconductive cell, or an image sensor may be used. , A thermocouple for radiation that detects heat due to light absorption, or a thermopile may be used.

（Ｃ６）上記各実施形態では、投射部５０の照射光の光軸と、受光の光軸とが一致する同軸型の光学系を採用しているが、照射光の光軸と受光の光軸とが異なる異軸型の光学系を採用してもよい。 (C6) In each of the above embodiments, a coaxial optical system in which the optical axis of the irradiation light of the projection unit 50 and the optical axis of the light reception are aligned with each other is adopted, but the optical axis of the irradiation light and the optical axis of the light reception An different axis type optical system different from the above may be adopted.

本開示に記載の制御部及びその手法は、コンピュータプログラムにより具体化された一つ乃至は複数の機能を実行するようにプログラムされたプロセッサ及びメモリを構成することによって提供された専用コンピュータにより、実現されてもよい。あるいは、本開示に記載の制御部及びその手法は、一つ以上の専用ハードウエア論理回路によってプロセッサを構成することによって提供された専用コンピュータにより、実現されてもよい。もしくは、本開示に記載の制御部及びその手法は、一つ乃至は複数の機能を実行するようにプログラムされたプロセッサ及びメモリと一つ以上のハードウエア論理回路によって構成されたプロセッサとの組み合わせにより構成された一つ以上の専用コンピュータにより、実現されてもよい。また、コンピュータプログラムは、コンピュータにより実行されるインストラクションとして、コンピュータ読み取り可能な非遷移有形記録媒体に記憶されていてもよい。 The controls and methods thereof described in the present disclosure are realized by a dedicated computer provided by configuring a processor and memory programmed to perform one or more functions embodied by a computer program. May be done. Alternatively, the controls and methods thereof described in the present disclosure may be implemented by a dedicated computer provided by configuring the processor with one or more dedicated hardware logic circuits. Alternatively, the control unit and method thereof described in the present disclosure may be a combination of a processor and memory programmed to perform one or more functions and a processor composed of one or more hardware logic circuits. It may be realized by one or more dedicated computers configured. Further, the computer program may be stored in a computer-readable non-transitional tangible recording medium as an instruction executed by the computer.

本開示は、上述の実施形態に限られるものではなく、その趣旨を逸脱しない範囲において種々の構成で実現することができる。例えば、発明の概要の欄に記載した各形態中の技術的特徴に対応する実施形態の技術的特徴は、上述の課題の一部又は全部を解決するために、あるいは、上述の効果の一部又は全部を達成するために、適宜、差し替えや、組み合わせを行うことが可能である。また、その技術的特徴が本明細書中に必須なものとして説明されていなければ、適宜、削除することが可能である。 The present disclosure is not limited to the above-described embodiment, and can be realized by various configurations within a range not deviating from the gist thereof. For example, the technical features of the embodiments corresponding to the technical features in each embodiment described in the column of the outline of the invention are for solving a part or all of the above-mentioned problems, or a part of the above-mentioned effects. Or, in order to achieve all of them, it is possible to replace or combine them as appropriate. Further, if the technical feature is not described as essential in the present specification, it can be appropriately deleted.

２０ 光測距装置、４０ 発光部、６０ 受光部、Ｌａ２〜Ｌｄ２ 受光領域 20 optical ranging device, 40 light emitting part, 60 light receiving part, La2 to Ld2 light receiving area

Claims (5)

光測距装置（２０）であって、
入射光を受光するための複数の受光領域（Ｌａ２，Ｌｂ２，Ｌｃ２，Ｌｄ２）を有し、前記受光領域のそれぞれを単位として前記入射光の受光を実行する受光部（６０）と、
前記受光領域のそれぞれに対応して排他的に照射光の照射を実行する発光部（４０）と、を備え、
前記発光部による前記照射光の照射に応じて前記受光部により前記入射光を受光する際に、
前記複数の受光領域のうち前記照射光の照射に対応する一の受光領域をオンにして受光状態とする期間内に、前記一の受光領域とは異なる他の受光領域をオンにして受光状態とする、
光測距装置。 Optical ranging device (20)
A light receiving unit (60) having a plurality of light receiving regions (La2, Lb2, Lc2, Ld2) for receiving the incident light and executing the light receiving of the incident light in each of the light receiving regions as a unit.
A light emitting unit (40) that exclusively executes irradiation of irradiation light corresponding to each of the light receiving regions is provided.
When the incident light is received by the light receiving unit in response to the irradiation of the irradiation light by the light emitting unit,
Within the period in which one of the plurality of light receiving regions corresponding to the irradiation of the irradiation light is turned on to be in the light receiving state, another light receiving region different from the one light receiving region is turned on to be in the light receiving state. To do,
Optical ranging device. 前記一の受光領域を受光状態とする期間内に前記一の受光領域が検出した入射光に対応する入射信号と、前記他の受光領域を受光状態とする期間内に前記一の受光領域が検出した外乱光に対応する外乱信号とを用いて前記照射光に対応する信号強度を算出する、請求項１に記載の光測距装置。 The incident signal corresponding to the incident light detected by the one light receiving region during the period when the one light receiving region is in the light receiving state and the one light receiving region are detected during the period when the other light receiving region is in the light receiving state. The optical ranging device according to claim 1, wherein the signal intensity corresponding to the irradiation light is calculated by using the disturbance signal corresponding to the disturbance light. 前記一の受光領域を受光状態とする期間内に前記一の受光領域が検出した入射光に対応する入射信号と、前記一の受光領域を受光状態とする期間内に前記他の受光領域が検出した外乱光に対応する外乱信号とを用いて前記照射光に対応する信号強度を算出する、
請求項１に記載の光測距装置。 The incident signal corresponding to the incident light detected by the one light receiving region during the period when the one light receiving region is in the light receiving state and the other light receiving region are detected during the period when the one light receiving region is in the light receiving state. The signal intensity corresponding to the irradiation light is calculated by using the disturbance signal corresponding to the disturbance light.
The optical ranging device according to claim 1. 前記一の受光領域と、前記他の受光領域とは互いに離間した位置に配される、請求項１から請求項３のいずれか一項に記載の光測距装置。 The optical ranging device according to any one of claims 1 to 3, wherein the one light receiving region and the other light receiving region are arranged at positions separated from each other. 前記複数の受光領域は、直線状に配列された３以上の受光領域で構成され、
前記一の受光領域と、前記他の受光領域との間には、少なくとも前記一の受光領域と前記他の受光領域とは異なる第三の受光領域を備える、請求項４に記載の光測距装置。 The plurality of light receiving regions are composed of three or more light receiving regions arranged in a straight line.
The optical ranging according to claim 4, wherein at least a third light receiving region different from the one light receiving region and the other light receiving region is provided between the one light receiving region and the other light receiving region. apparatus.
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022118552A1 (en) * 2020-12-04 2022-06-09 ソニーセミコンダクタソリューションズ株式会社 Light detection device and light detection system
WO2024048242A1 (en) * 2022-09-02 2024-03-07 株式会社デンソー Ranging device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022118552A1 (en) * 2020-12-04 2022-06-09 ソニーセミコンダクタソリューションズ株式会社 Light detection device and light detection system
WO2024048242A1 (en) * 2022-09-02 2024-03-07 株式会社デンソー Ranging device

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