JP2020181648A - 回路モジュールと回路モジュールの製造方法 - Google Patents
回路モジュールと回路モジュールの製造方法 Download PDFInfo
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- JP2020181648A JP2020181648A JP2019082138A JP2019082138A JP2020181648A JP 2020181648 A JP2020181648 A JP 2020181648A JP 2019082138 A JP2019082138 A JP 2019082138A JP 2019082138 A JP2019082138 A JP 2019082138A JP 2020181648 A JP2020181648 A JP 2020181648A
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- circuit
- thickness
- circuit module
- coaxial cable
- inner conductor
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 238000000034 method Methods 0.000 title abstract description 17
- 239000004020 conductor Substances 0.000 claims abstract description 83
- 229910000679 solder Inorganic materials 0.000 claims abstract description 12
- 239000012212 insulator Substances 0.000 claims description 21
- 230000006835 compression Effects 0.000 claims description 19
- 238000007906 compression Methods 0.000 claims description 19
- 238000010586 diagram Methods 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 230000002093 peripheral effect Effects 0.000 description 6
- 238000005259 measurement Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 238000002847 impedance measurement Methods 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229920003020 cross-linked polyethylene Polymers 0.000 description 1
- 239000004703 cross-linked polyethylene Substances 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
- H05K1/0221—Coaxially shielded signal lines comprising a continuous shielding layer partially or wholly surrounding the signal lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/53—Fixed connections for rigid printed circuits or like structures connecting to cables except for flat or ribbon cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R9/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
- H01R9/03—Connectors arranged to contact a plurality of the conductors of a multiconductor cable, e.g. tapping connections
- H01R9/05—Connectors arranged to contact a plurality of the conductors of a multiconductor cable, e.g. tapping connections for coaxial cables
- H01R9/0515—Connection to a rigid planar substrate, e.g. printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10356—Cables
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Abstract
Description
2 絶縁体
3 外部導体
4 シース
5 接続部
6 非露出部
h1 接続部5の厚み
w1 接続部5の幅
h2 非露出部6の厚み
w2 非露出部6の幅
11 素線
20 回路体
21 誘電体
22 グランド体
30 ハンダ
40 金型
50 アンテナ
100 回路モジュール
200 同軸ケーブル
300 回路基板
Claims (5)
- 回路基板の回路体に、同軸ケーブルの内部導体をハンダで接続する、回路モジュールであって、
前記回路基板は、
誘電体と、
前記誘電体の表面上に形成された回路体と、
前記誘電体の裏面上に形成されたグランド体と、
を備え、
前記同軸ケーブルは、
内部導体と、
前記内部導体を囲うように設けられた絶縁体と、
前記絶縁体を囲うように設けられた外部導体と、
前記外部導体を囲うように設けられたシースと、
を備え、
前記内部導体は、前記回路体に接続する接続部と、前記シースの内部にある非露出部と、を有し、
前記接続部の厚みは、前記非露出部の厚みの35%以下で、且つ、前記接続部の断面積と前記非露出部の断面積が同一であることを特徴とする回路モジュール。 - 前記接続部の厚みは、前記非露出部の厚みの25%〜35%であることを特徴とする請求項1に記載の回路モジュール。
- 前記接続部の幅が、前記非露出部の幅よりも大きいことを特徴とする請求項1または請求項2に記載の回路モジュール。
- 前記外部導体は、前記グランド体と接続することを特徴とする請求項1〜3のいずれか1項に記載の回路モジュール。
- 回路基板の回路体に、同軸ケーブルの内部導体をハンダで接続する、回路モジュールの製造方法であって、
前記回路基板は、
誘電体と、
前記誘電体の表面上に形成された回路体と、
前記誘電体の裏面上に形成されたグランド体と、を備え、
前記同軸ケーブルは、
内部導体と、
前記内部導体を囲うように設けられた絶縁体と、
前記絶縁体を囲うように設けられた外部導体と、
前記外部導体を囲うように設けられたシースと、
を備え、
前記内部導体は、前記回路体に接続する接続部と、前記シースの内部にある非露出部と、を有し、
前記同軸ケーブルの前記絶縁体、前記外部導体及び前記シースを取り除いて前記接続部を外部に露出させる露出工程と、
前記接続部の厚みが、前記非露出部の厚みの35%以下で、且つ、前記接続部の断面積と前記非露出部の断面積とが同一となるように圧縮する圧縮工程と、
前記接続部を、前記回路体にハンダで接続する接続工程と、
を含むことを特徴とする回路モジュールの製造方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019082138A JP7005116B2 (ja) | 2019-04-23 | 2019-04-23 | 回路モジュールと回路モジュールの製造方法 |
DE102020203697.7A DE102020203697A1 (de) | 2019-04-23 | 2020-03-23 | Schaltungsmodul und verfahren zum herstellen eines schaltungsmoduls |
US16/836,990 US10910783B2 (en) | 2019-04-23 | 2020-04-01 | Circuit module and method for manufacturing circuit module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019082138A JP7005116B2 (ja) | 2019-04-23 | 2019-04-23 | 回路モジュールと回路モジュールの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020181648A true JP2020181648A (ja) | 2020-11-05 |
JP7005116B2 JP7005116B2 (ja) | 2022-01-21 |
Family
ID=72840010
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019082138A Active JP7005116B2 (ja) | 2019-04-23 | 2019-04-23 | 回路モジュールと回路モジュールの製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US10910783B2 (ja) |
JP (1) | JP7005116B2 (ja) |
DE (1) | DE102020203697A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11555731B2 (en) | 2017-11-14 | 2023-01-17 | Rochester Sensors, Llc | TDR transducer with boomerang waveguide |
US11099052B2 (en) * | 2017-11-14 | 2021-08-24 | Rochester Gauges, Inc. | Low-cost measurement system using time domain reflectometry |
EP3647745B1 (en) | 2018-10-29 | 2023-07-05 | Rochester Sensors, LLC | Tdr transducer |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2000277218A (ja) * | 1999-03-19 | 2000-10-06 | Ace Five:Kk | ケーブル組立体 |
JP2004335155A (ja) * | 2003-04-30 | 2004-11-25 | Hitachi Cable Ltd | アンテナ装置 |
JP2013016457A (ja) * | 2011-06-09 | 2013-01-24 | Sumitomo Electric Ind Ltd | 極細電線の接続方法及び回路基板の製造方法 |
JP2014509061A (ja) * | 2011-03-24 | 2014-04-10 | ケーエムダブリュ・インコーポレーテッド | ケーブル接続装置 |
JP2016127008A (ja) * | 2014-12-26 | 2016-07-11 | 日本電業工作株式会社 | 同軸ケーブル接続部材、通信回路及び通信装置 |
Family Cites Families (13)
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JPS6032402A (ja) * | 1983-08-01 | 1985-02-19 | Matsushita Electric Ind Co Ltd | 同軸−ストリップライン変換装置 |
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JP4998741B2 (ja) | 2008-03-11 | 2012-08-15 | 住友電気工業株式会社 | アダプタ構造,高周波ケーブル体および配線板接続体 |
US8357998B2 (en) * | 2009-02-09 | 2013-01-22 | Advanced Semiconductor Engineering, Inc. | Wirebonded semiconductor package |
US9271391B2 (en) * | 2012-05-28 | 2016-02-23 | Waka Manufacturing Co., Ltd. | Multilayer wiring board |
JP6853998B2 (ja) | 2016-10-14 | 2021-04-07 | 日本圧着端子製造株式会社 | 同軸コネクタの実装構造 |
-
2019
- 2019-04-23 JP JP2019082138A patent/JP7005116B2/ja active Active
-
2020
- 2020-03-23 DE DE102020203697.7A patent/DE102020203697A1/de active Pending
- 2020-04-01 US US16/836,990 patent/US10910783B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000277218A (ja) * | 1999-03-19 | 2000-10-06 | Ace Five:Kk | ケーブル組立体 |
JP2004335155A (ja) * | 2003-04-30 | 2004-11-25 | Hitachi Cable Ltd | アンテナ装置 |
JP2014509061A (ja) * | 2011-03-24 | 2014-04-10 | ケーエムダブリュ・インコーポレーテッド | ケーブル接続装置 |
JP2013016457A (ja) * | 2011-06-09 | 2013-01-24 | Sumitomo Electric Ind Ltd | 極細電線の接続方法及び回路基板の製造方法 |
JP2016127008A (ja) * | 2014-12-26 | 2016-07-11 | 日本電業工作株式会社 | 同軸ケーブル接続部材、通信回路及び通信装置 |
Also Published As
Publication number | Publication date |
---|---|
US20200343678A1 (en) | 2020-10-29 |
DE102020203697A1 (de) | 2020-10-29 |
JP7005116B2 (ja) | 2022-01-21 |
US10910783B2 (en) | 2021-02-02 |
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