JP2020175472A - Holding surface formation method - Google Patents

Holding surface formation method Download PDF

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Publication number
JP2020175472A
JP2020175472A JP2019079238A JP2019079238A JP2020175472A JP 2020175472 A JP2020175472 A JP 2020175472A JP 2019079238 A JP2019079238 A JP 2019079238A JP 2019079238 A JP2019079238 A JP 2019079238A JP 2020175472 A JP2020175472 A JP 2020175472A
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holding surface
grinding
grinding wheel
holding
rotating shaft
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JP7424755B2 (en
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徹雄 久保
Tetsuo Kubo
徹雄 久保
壮一 松原
Soichi Matsubara
壮一 松原
山下　真司
Shinji Yamashita
真司 山下
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Disco Corp
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Disco Abrasive Systems Ltd
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Priority to JP2019079238A priority Critical patent/JP7424755B2/en
Priority to KR1020200038872A priority patent/KR20200123002A/en
Priority to CN202010294888.XA priority patent/CN111843621B/en
Priority to TW109112728A priority patent/TWI834865B/en
Publication of JP2020175472A publication Critical patent/JP2020175472A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
    • B24B19/22—Single-purpose machines or devices for particular grinding operations not covered by any other main group characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/04—Headstocks; Working-spindles; Features relating thereto
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
    • B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/20—Drives or gearings; Equipment therefor relating to feed movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/22—Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Jigs For Machine Tools (AREA)

Abstract

To prevent a gap from being generated between a work-piece and a holding surface.SOLUTION: In a holding surface formation method in which a holding surface 500 is formed by grinding the holding surface using a grinding stone 340, a first holding surface formation step, in which a first rotating shaft, a rotating shaft of a grinding wheel 34 and a second rotating shaft, a rotating shaft of a chuck table 5 are adjusted to form an angle θ3 with a predetermined size by inclining the chuck table 5, so as to bring an inclination relation between both shafts into a first inclination relation, and then the holding surface 500 is ground to form a first surface 50C having a conical surface shape, is performed; and then a second holding surface formation step, in which the chuck table 5 is inclined further so that the angle formed by both shafts becomes an angle θ4 larger than the angle θ3 between both shafts in the first inclination relation, to bring the inclination relation between both shafts into a second inclination relation, and the holding surface 500 is ground again to form a second surface 50D having a conical side surface shape leading to an outer periphery of the first surface 50C, is performed.SELECTED DRAWING: Figure 3

Description

本発明は、保持面形成方法に関する。 The present invention relates to a method for forming a holding surface.

ウェーハを研削する研削装置は、ウェーハを保持する保持テーブルと、保持テーブルに保持されたウェーハを研削する研削砥石が配設された研削手段とを備えている。 A grinding device for grinding a wafer includes a holding table for holding the wafer and a grinding means provided with a grinding wheel for grinding the wafer held on the holding table.

研削装置において、研削ホイールや保持テーブルの交換等をした後は、保持テーブルの保持面と研削砥石の研削面とを平行にするため、研削砥石で保持面を研削するセルフグラインドを実施している（例えば、下記の特許文献１を参照）。 After replacing the grinding wheel and holding table in the grinding device, self-grinding is performed to grind the holding surface with the grinding wheel in order to make the holding surface of the holding table parallel to the grinding surface of the grinding wheel. (See, for example, Patent Document 1 below).

特開２０１４−２３７２１０号公報Japanese Unexamined Patent Publication No. 2014-237210

上記のセルフグラインドは、保持テーブルの回転軸に対して研削ホイールの回転軸を若干傾斜させ、研削砥石を保持テーブルの保持面の中心を通るように接触させて保持面の研削が行われ、保持テーブルの保持面が円錐面に形成される。ウェーハが厚い場合、保持面にウェーハを保持させた際に保持面の円錐面形状にならわずに保持面の円錐面の頂点付近とウェーハの下面の中央との間に隙間が生じてしまうため、この状態でウェーハの研削を行うとウェーハの中央が研削され過ぎて薄くなるという問題がある。
研削ホイールを回転させ回転する被加工物をインフィード研削する研削装置においては、被加工物の中央が薄くなることを防止して平坦なウェーハに仕上げるという解決すべき課題がある。 In the above self-grinding, the rotation axis of the grinding wheel is slightly tilted with respect to the rotation axis of the holding table, and the grinding wheel is brought into contact with the rotation axis of the holding table so as to pass through the center of the holding surface, and the holding surface is ground and held. The holding surface of the table is formed into a conical surface. When the wafer is thick, when the wafer is held on the holding surface, a gap is created between the vicinity of the apex of the conical surface of the holding surface and the center of the lower surface of the wafer instead of following the conical shape of the holding surface. If the wafer is ground in this state, there is a problem that the center of the wafer is ground too much and becomes thin.
In a grinding device that in-feed grinds a rotating workpiece by rotating a grinding wheel, there is a problem to be solved that the center of the workpiece is prevented from becoming thin and a flat wafer is finished.

本発明は、研削砥石を環状に配置した研削ホイールの中心を軸に該研削ホイールを回転させ、被加工物を吸引保持するチャックテーブルの保持面の中心を軸に該チャックテーブルを回転させ該保持面に保持された被加工物を研削砥石で研削する研削装置において、該研削砥石で該保持面を研削して該保持面を形成する保持面形成方法であって、該研削ホイールを回転させる際の軸となる該研削ホイールの中心を通る第１回転軸と、該チャックテーブルを回転させる際の軸となる該保持面の中心を通る第２回転軸とを所定の角度の第１傾き関係で配置し、該研削砥石を該保持面の中心を通過する位置に位置づけて該保持面を研削し、少なくとも該保持面中央に円形の第１面を形成する第１保持面形成工程と、該第１回転軸と該第２回転軸とを該第１傾き関係より大きい角度で傾けた第２傾き関係で配置し、該研削砥石で該保持面の外周部分を研削して、該保持面中央に円形の該第１面を残し、該第１面からつながる円錐台の側面形状である円環形状の第２面を形成する第２保持面形成工程と、を備え、異なる傾き関係の下で該研削砥石で該保持面を少なくとも２回研削して保持面を形成する保持面形成方法である。
本発明に備える該第１保持面形成工程においては、該第１回転軸と該第２回転軸とを平行に配置させ、平坦面の該第１面を形成することが望ましい。
本発明に備える該第１保持面形成工程においては、該第１傾き関係で、該保持面中心を頂点とした円錐面の該第１面を形成することが望ましい。 In the present invention, the grinding wheel is rotated around the center of the grinding wheel in which the grinding wheels are arranged in an annular shape, and the chuck table is rotated and held around the center of the holding surface of the chuck table that sucks and holds the workpiece. In a grinding device that grinds a workpiece held on a surface with a grinding wheel, a holding surface forming method for forming the holding surface by grinding the holding surface with the grinding wheel, when rotating the grinding wheel. The first rotation axis passing through the center of the grinding wheel, which is the axis of the above, and the second rotation axis passing through the center of the holding surface, which is the axis for rotating the chuck table, have a first inclination relationship of a predetermined angle. A first holding surface forming step of arranging, positioning the grinding wheel at a position passing through the center of the holding surface, grinding the holding surface, and forming at least a circular first surface in the center of the holding surface, and the first The 1-rotation axis and the 2nd rotation axis are arranged in a second inclination relationship tilted at an angle larger than the first inclination relationship, and the outer peripheral portion of the holding surface is ground with the grinding grind to the center of the holding surface. A second holding surface forming step of forming a ring-shaped second surface, which is a side surface shape of a conical stand connected to the first surface, while leaving the circular first surface, is provided under different tilt relationships. This is a holding surface forming method for forming a holding surface by grinding the holding surface at least twice with a grinding wheel.
In the first holding surface forming step prepared for the present invention, it is desirable that the first rotating shaft and the second rotating shaft are arranged in parallel to form the first flat surface.
In the first holding surface forming step prepared for the present invention, it is desirable to form the first surface of the conical surface having the center of the holding surface as the apex in the first inclination relationship.

本発明では、保持面に被加工物を保持したときに、保持面の中心付近に形成される保持面と被加工物との隙間をなくすために、２回の研削加工を施して第１面と第２面とを形成している。そのため、保持面の中心で被加工物が変形させられる原因となるような力が加わらなくなるため、保持面と被加工物との間に隙間ができなくなり、保持面の中央部分の被加工物が研削されすぎて薄くなるという問題を解決することができる。
これにより、従来はφ２００ｍｍのシリコンウェーハは２００〜３００ｎｍ以内の厚み差に仕上げることが限界であったが、本発明では、１００ｎｍ以内の厚み差に仕上げることが可能になった。
また、第２面に加えてさらに第３面、第４面、・・・といったようにさらに複数の面を形成することも可能であり、これによって、さらに確実に保持面に被加工物を保持することが可能となった。 In the present invention, when the workpiece is held on the holding surface, the first surface is subjected to two grinding processes in order to eliminate the gap between the holding surface and the workpiece formed near the center of the holding surface. And the second surface. Therefore, a force that causes the work piece to be deformed is not applied at the center of the holding surface, so that a gap cannot be formed between the holding surface and the work piece, and the work piece at the center of the holding surface becomes It can solve the problem of being over-ground and thinned.
As a result, conventionally, a silicon wafer having a diameter of 200 mm can be finished with a thickness difference of 200 to 300 nm or less, but in the present invention, it is possible to finish a silicon wafer with a thickness difference of 100 nm or less.
Further, in addition to the second surface, it is also possible to form a plurality of surfaces such as a third surface, a fourth surface, and so on, whereby the workpiece is more reliably held on the holding surface. It became possible to do.

研削装置の全体を表す斜視図である。It is a perspective view which shows the whole of a grinding apparatus. （ａ）は、研削手段を用いて保持面を研削して平坦な第１面を形成する第１保持面形成工程の様子を表す断面図であり、（ｂ）は、第１保持面形成工程の実施後に研削手段とチャックテーブル５との傾きを変えてから再び研削手段を用いて保持面を研削して第１面の円の外側に連なる円錐台側面形状の第２面を形成する第２保持面形成工程の様子を表す断面図であり、（ｃ）は、両工程を経て形成された保持面を表す断面図である。(A) is a cross-sectional view showing a state of the 1st holding surface forming process which grinds a holding surface using a grinding means and forms a flat 1st surface, and (b) is a 1st holding surface forming process. After the above is performed, the inclination of the grinding means and the chuck table 5 is changed, and then the holding surface is ground again by using the grinding means to form the second surface having a conical base side surface shape continuous with the outside of the circle of the first surface. It is sectional drawing which shows the state of the holding surface forming process, and (c) is the sectional view which shows the holding surface formed through both steps. （ａ）は、研削手段を用いて保持面を研削して円錐面形状の第１面を形成する第１保持面形成工程の様子を表す断面図であり、（ｂ）は、第１保持面形成工程の実施後に研削手段とチャックテーブル５との傾きを変えてから再び研削手段を用いて保持面を研削して第１面の外側に連なる円錐台側面形状の第２面を形成する第２保持面形成工程の様子を表す断面図であり、（ｃ）は、両工程を経て形成された保持面を表す断面図である。(A) is a cross-sectional view showing a state of a first holding surface forming process which grinds a holding surface using a grinding means and forms a conical first surface, and (b) is a 1st holding surface. After performing the forming step, the inclination of the grinding means and the chuck table 5 is changed, and then the holding surface is ground again using the grinding means to form the second surface having a conical base side surface shape connected to the outside of the first surface. It is sectional drawing which shows the state of the holding surface forming process, and (c) is the sectional view which shows the holding surface formed through both steps. （ａ）は、チャックテーブルを紙面奥行き側にも傾けてから、研削手段を用いて保持面を研削してドーム状の第１面を形成する第１保持面形成工程の様子を表す断面図であり、（ｂ）は、第１保持面形成工程の実施後に研削手段とチャックテーブル５との傾きを変えてから再び研削手段を用いて保持面を研削して第１面の外側に連なる円錐台側面形状の第２面を形成する第２保持面形成工程の様子を表す断面図であり、（ｃ）は、両工程を経て形成された保持面を表す断面図である。(A) is a cross-sectional view showing a state of a first holding surface forming step of tilting the chuck table to the depth side of the paper surface and then grinding the holding surface using a grinding means to form a dome-shaped first surface. In (b), after the first holding surface forming step is performed, the inclination of the grinding means and the chuck table 5 is changed, and then the holding surface is ground again by using the grinding means to form a conical base connected to the outside of the first surface. It is sectional drawing which shows the state of the 2nd holding surface forming process which forms the 2nd surface of a side shape, and (c) is the sectional view which shows the holding surface formed through both steps.

１ 研削装置の構成
図１に示す研削装置１は、チャックテーブル５に保持された半導体ウェーハ等の被加工物Ｗを、研削手段３を用いて研削する研削装置である。以下、研削装置１の構成について説明する。 1 Configuration of Grinding Device The grinding device 1 shown in FIG. 1 is a grinding device that grinds a workpiece W such as a semiconductor wafer held on a chuck table 5 by using a grinding means 3. Hereinafter, the configuration of the grinding device 1 will be described.

研削装置１には、研削装置１に備える各種の機構を電気的に制御する制御手段２が備えられている。 The grinding device 1 is provided with a control means 2 for electrically controlling various mechanisms provided in the grinding device 1.

図１に示すように、研削装置１には、Ｙ軸方向に延設されたベース１０と、ベース１０の上における＋Ｙ方向側に立設されたコラム１１とが備えられている。 As shown in FIG. 1, the grinding apparatus 1 is provided with a base 10 extending in the Y-axis direction and a column 11 erected on the base 10 on the + Y direction side.

コラム１１の−Ｙ方向側の側面には、研削手段３と研削送り手段４とが備えられている。
研削手段３には、Ｚ軸方向の第１回転軸３５を有するスピンドル３０と、スピンドル３０を、第１回転軸３５を軸にして回転駆動するスピンドルモータ３２と、スピンドル３０を回転可能に支持するハウジング３１とが備えられている。スピンドル３０の下端には、マウント３３が接続されており、マウント３３の下面には、研削ホイール３４が着脱可能に配設されている。研削ホイール３４は、基台３４１と基台３４１の下面に環状に配設された複数の研削砥石３４０とから構成されている。研削砥石３４０は、例えば、レジンボンドやメタルボンド等によって固着されたダイヤモンド砥粒等によって形成されており、その下面３４０ａは被加工物Ｗを研削する研削面となっている。 A grinding means 3 and a grinding feeding means 4 are provided on the side surface of the column 11 on the −Y direction side.
The grinding means 3 rotatably supports a spindle 30 having a first rotating shaft 35 in the Z-axis direction, a spindle motor 32 for rotationally driving the spindle 30 around the first rotating shaft 35, and a spindle 30. A housing 31 is provided. A mount 33 is connected to the lower end of the spindle 30, and a grinding wheel 34 is detachably arranged on the lower surface of the mount 33. The grinding wheel 34 is composed of a base 341 and a plurality of grinding wheels 340 arranged in an annular shape on the lower surface of the base 341. The grinding wheel 340 is formed of, for example, diamond abrasive grains fixed by a resin bond, a metal bond, or the like, and the lower surface 340a thereof is a grinding surface for grinding the workpiece W.

研削送り手段４には、Ｚ軸方向の回転軸４５を有するボールネジ４０と、ボールネジ４０に対して平行に配設された一対のガイドレール４１と、ボールネジ４０を回転軸４５を軸にして回動させるＺ軸モータ４２と、内部のナットがボールネジ４０に螺合して側部がガイドレール４１に摺接する昇降板４３と、昇降板４３に連結され研削手段３を保持するホルダ４４とが備えられている。
Ｚ軸モータ４２によってボールネジ４０が駆動されて、回転軸４５を軸にして回転すると、これに伴い、昇降板４３がガイドレール４１に案内されてＺ軸方向に昇降移動して、ホルダ４４に保持されている研削手段３がＺ軸方向に昇降移動する構成となっている。研削送り手段４を用いて研削手段３を駆動して、研削砥石３４０をチャックテーブル５に保持されている被加工物Ｗに対して接近及び離間させることができる。 The grinding feed means 4 rotates a ball screw 40 having a rotation shaft 45 in the Z-axis direction, a pair of guide rails 41 arranged parallel to the ball screw 40, and a ball screw 40 about the rotation shaft 45. A Z-axis motor 42 is provided, an elevating plate 43 in which an internal nut is screwed into a ball screw 40 and a side portion is in sliding contact with a guide rail 41, and a holder 44 connected to the elevating plate 43 to hold the grinding means 3. ing.
When the ball screw 40 is driven by the Z-axis motor 42 and rotates about the rotating shaft 45, the elevating plate 43 is guided by the guide rail 41 to move up and down in the Z-axis direction and is held by the holder 44. The grinding means 3 is moved up and down in the Z-axis direction. The grinding means 3 can be driven by using the grinding feed means 4 to bring the grinding wheel 340 closer to and further from the workpiece W held on the chuck table 5.

図１に示すように、研削装置１のベース１０の上には、チャックテーブル５が備えられている。チャックテーブル５は、被加工物Ｗを保持する円板形状のテーブルであり、保持面５００を有する吸引部５０と吸引部５０を囲繞する枠体５１とを備えている。また、チャックテーブル５は、吸引路５２を介して吸引源５３に接続されている。例えば、吸引源５３によって発揮される吸引力を、吸引路５２を通じて保持面５００に伝達することによって、保持面５００の上に被加工物Ｗを吸引保持することができる。
チャックテーブル５には、チャックテーブル５をＺ軸方向の第２回転軸５５を軸にして回転させる回転手段５４が配設されている。
また、チャックテーブル５には、図示しない傾き調整手段が配設されている。傾き調整手段を用いてチャックテーブル５を傾けることによって、第２回転軸５５がＺ軸方向に対して傾斜することとなる。なお、傾き調整手段としては、例えば特許文献１の可動支持部を用いることができる。
さらに、チャックテーブル５の周囲にはカバー１２が配設されており、カバー１２には蛇腹１３が伸縮自在に連結されている。カバー１２とチャックテーブル５とは、被加工物Ｗの研削加工の際に、ベース１０の内部に配設されている図示しないＹ軸方向への移動手段によって駆動されて、Ｙ軸方向に一体的に往復移動する。このとき、カバー１２のＹ軸方向の移動に伴って蛇腹１３が伸縮することとなる。 As shown in FIG. 1, a chuck table 5 is provided on the base 10 of the grinding device 1. The chuck table 5 is a disk-shaped table that holds the workpiece W, and includes a suction portion 50 having a holding surface 500 and a frame body 51 that surrounds the suction portion 50. Further, the chuck table 5 is connected to the suction source 53 via the suction path 52. For example, the workpiece W can be suction-held on the holding surface 500 by transmitting the suction force exerted by the suction source 53 to the holding surface 500 through the suction path 52.
The chuck table 5 is provided with rotating means 54 for rotating the chuck table 5 about a second rotating shaft 55 in the Z-axis direction.
Further, the chuck table 5 is provided with tilt adjusting means (not shown). By tilting the chuck table 5 using the tilt adjusting means, the second rotating shaft 55 is tilted in the Z-axis direction. As the tilt adjusting means, for example, the movable support portion of Patent Document 1 can be used.
Further, a cover 12 is arranged around the chuck table 5, and a bellows 13 is stretchably connected to the cover 12. The cover 12 and the chuck table 5 are driven by a moving means in the Y-axis direction (not shown) arranged inside the base 10 when grinding the workpiece W, and are integrated in the Y-axis direction. Move back and forth to. At this time, the bellows 13 expands and contracts as the cover 12 moves in the Y-axis direction.

図１に示すように、研削装置１のベース１０の上には、ウェーハ上面ハイトゲージ６０、保持面ハイトゲージ６１、及び算出手段６２を備えた厚み測定手段６が配設されている。研削加工中、ウェーハ上面ハイトゲージ６０を被加工物Ｗの表面Ｗａに当接させつつ、保持面ハイトゲージ６１をチャックテーブル５の保持面５００に当接させることによって、被加工物Ｗの表面Ｗａ及びチャックテーブル５の保持面５００の高さを測定して、測定された両者の高さの値を基に、算出手段６２において被加工物Ｗの厚みを算出することができる。 As shown in FIG. 1, a thickness measuring means 6 including a wafer upper surface height gauge 60, a holding surface height gauge 61, and a calculating means 62 is arranged on the base 10 of the grinding apparatus 1. During the grinding process, the wafer top surface height gauge 60 is brought into contact with the surface Wa of the workpiece W, and the holding surface height gauge 61 is brought into contact with the holding surface 500 of the chuck table 5, so that the surface Wa and chuck of the workpiece W are brought into contact with each other. The height of the holding surface 500 of the table 5 is measured, and the thickness of the workpiece W can be calculated by the calculation means 62 based on the measured height values of both.

２ 保持面形成方法
上記の研削装置１を用いて保持面５００を研削して、所望の形状を有する保持面５００を形成する保持面形成方法について説明する。 2 Holding surface forming method A holding surface forming method for forming a holding surface 500 having a desired shape by grinding the holding surface 500 using the above-mentioned grinding device 1 will be described.

［第１実施形態］
（第１保持面形成工程）
まず、図１に示すチャックテーブル５を図示しないＹ軸方向への移動手段を用いてＹ軸方向に移動させて、図２（ａ）に示すように、研削砥石３４０の下面３４０ｂがチャックテーブル５の保持面５００の中心Ｏを通るように位置合わせする。
次に、第１回転軸３５と第２回転軸５５との傾き関係が第１傾き関係となるように第２回転軸５５の傾きを調整する。第１実施形態においては、第１傾き関係を、図２（ａ）に示すような、第１回転軸３５と第２回転軸５５とが互いに平行となる関係とする。従って、図示しない傾き調整手段を用いてチャックテーブル５を傾斜させて、第１回転軸３５と第２回転軸５５とが互いに平行になるように調整する。
なお、図２（ａ）に示すように、第１回転軸３５と第２回転軸５５とが平行であるときには、便宜上、第１回転軸３５と第２回転軸５５との間の角度θ１を０度とする。 [First Embodiment]
(First holding surface forming step)
First, the chuck table 5 shown in FIG. 1 is moved in the Y-axis direction by using a moving means in the Y-axis direction (not shown), and as shown in FIG. 2A, the lower surface 340b of the grinding wheel 340 is the chuck table 5. It is aligned so as to pass through the center O of the holding surface 500 of.
Next, the inclination of the second rotation shaft 55 is adjusted so that the inclination relationship between the first rotation shaft 35 and the second rotation shaft 55 becomes the first inclination relationship. In the first embodiment, the first inclination relationship is such that the first rotation axis 35 and the second rotation axis 55 are parallel to each other as shown in FIG. 2A. Therefore, the chuck table 5 is tilted by using a tilt adjusting means (not shown) so that the first rotating shaft 35 and the second rotating shaft 55 are adjusted to be parallel to each other.
As shown in FIG. 2A, when the first rotation axis 35 and the second rotation axis 55 are parallel, the angle θ1 between the first rotation axis 35 and the second rotation axis 55 is set for convenience. Set to 0 degrees.

その後、図１及び図２に示すように、研削手段３のスピンドルモータ３２を用いてスピンドル３０を、第１回転軸３５を軸にして回転させることによって、スピンドル３０に接続された研削砥石３４０を、第１回転軸３５を軸にして回転させるとともに、回転手段５４を用いてチャックテーブル５を、第２回転軸５５を軸にして回転させる。
研削砥石３４０とチャックテーブル５とが回転している状態で、研削送り手段４のＺ軸モータ４２を用いてボールネジ４０を回動させて、昇降板４３をガイドレール４１に沿って−Ｚ方向に降下させる。これにより、ホルダ４４を介して昇降板４３に支持されている研削手段３が−Ｚ方向に降下していき、図２（ａ）に示すように、研削砥石３４０の下面３４０ｂとチャックテーブル５の保持面５００とが当接する。
研削砥石３４０の下面３４０ｂとチャックテーブル５の保持面５００とが当接している状態で、さらに研削砥石３４０をチャックテーブル５の保持面５００に対して押し下げていくことによって保持面５００を研削して、図２（ａ）に示すようなＸＹ平面に平行な平坦な第１面５０Ａを形成する。 After that, as shown in FIGS. 1 and 2, the spindle 30 is rotated around the first rotating shaft 35 by using the spindle motor 32 of the grinding means 3, so that the grinding grind 340 connected to the spindle 30 is formed. , The chuck table 5 is rotated about the first rotation shaft 35, and the chuck table 5 is rotated about the second rotation shaft 55 by using the rotation means 54.
With the grinding wheel 340 and the chuck table 5 rotating, the ball screw 40 is rotated by using the Z-axis motor 42 of the grinding feed means 4, and the elevating plate 43 is moved along the guide rail 41 in the −Z direction. Let it descend. As a result, the grinding means 3 supported by the elevating plate 43 via the holder 44 descends in the −Z direction, and as shown in FIG. 2A, the lower surface 340b of the grinding wheel 340 and the chuck table 5 The holding surface 500 comes into contact with the holding surface 500.
With the lower surface 340b of the grinding wheel 340 and the holding surface 500 of the chuck table 5 in contact with each other, the holding surface 500 is ground by further pushing down the grinding wheel 340 with respect to the holding surface 500 of the chuck table 5. , A flat first surface 50A parallel to the XY plane as shown in FIG. 2A is formed.

（第２保持面形成工程）
次に、研削送り手段４を用いて研削砥石３４０を上昇させて、研削砥石３４０を第１面５０Ａから離間させる。そして、第１回転軸３５と第２回転軸５５との傾き関係が第２傾き関係となるように第２回転軸５５の傾きを調整する。図示しない傾き調整手段を用いて、第２回転軸５５を−Ｙ方向に傾けて、例えば、図２（ｂ）に示すように、第１回転軸３５と第２回転軸５５との間の角度がθ２（θ２≠０）となるように調整する。
なお、第２傾き関係における第１回転軸３５と第２回転軸５５とのなす角度θ２は、上記の第１傾き関係における第１回転軸３５と第２回転軸５５とのなす角度θ１よりも大きいものとする。 (Second holding surface forming step)
Next, the grinding wheel 340 is raised by using the grinding feed means 4, and the grinding wheel 340 is separated from the first surface 50A. Then, the inclination of the second rotation shaft 55 is adjusted so that the inclination relationship between the first rotation shaft 35 and the second rotation shaft 55 becomes the second inclination relationship. The second rotating shaft 55 is tilted in the −Y direction using an inclination adjusting means (not shown), and the angle between the first rotating shaft 35 and the second rotating shaft 55 is, for example, as shown in FIG. 2 (b). Is adjusted so that θ2 (θ2 ≠ 0).
The angle θ2 formed by the first rotating shaft 35 and the second rotating shaft 55 in the second tilting relationship is larger than the angle θ1 formed by the first rotating shaft 35 and the second rotating shaft 55 in the first tilting relationship. It shall be large.

その後、研削砥石３４０及びチャックテーブル５を、第１回転軸３５及び第２回転軸５５を軸としてそれぞれ回転させながら、研削送り手段４を用いて研削砥石３４０を降下させて、研削砥石３４０の下面３４０ｂとチャックテーブル５の保持面５００を構成する第１面５０Ａとを当接させる。このとき、図２（ｂ）に示すように、第１面５０Ａの中心Ｏと研削砥石３４０の下面３４０ｂとの間には隙間が空いた状態となっている。この状態で研削送り手段４を用いて、再び研削砥石３４０を−Ｚ方向に押し下げていき、第１面５０Ａの外周部分を研削して、第２面５０Ｂを形成する。 After that, while rotating the grinding wheel 340 and the chuck table 5 about the first rotating shaft 35 and the second rotating shaft 55, respectively, the grinding wheel 340 is lowered by using the grinding feed means 4, and the lower surface of the grinding wheel 340 is lowered. The 340b and the first surface 50A constituting the holding surface 500 of the chuck table 5 are brought into contact with each other. At this time, as shown in FIG. 2B, there is a gap between the center O of the first surface 50A and the lower surface 340b of the grinding wheel 340. In this state, the grinding wheel 340 is pushed down again in the −Z direction using the grinding feed means 4, and the outer peripheral portion of the first surface 50A is ground to form the second surface 50B.

このとき、図２（ｂ）に示すように、第１面５０Ａの研削を行いながら、例えば、保持面ハイトゲージ６１をチャックテーブル５の上に接触させて、研削によって変化する第２面５０Ｂの高さを監視することにより、第２面５０Ｂが予め定められた高さになるまで研削することができる。
また、第１面５０Ａの面積が予め定められた面積になるまで研削することができる。
例えば、第1面５０Ａは直径１０ｍｍの円になるまで研削する。 At this time, as shown in FIG. 2B, while grinding the first surface 50A, for example, the holding surface height gauge 61 is brought into contact with the chuck table 5, and the height of the second surface 50B changed by grinding. By monitoring the height, the second surface 50B can be ground to a predetermined height.
Further, it is possible to grind until the area of the first surface 50A becomes a predetermined area.
For example, the first surface 50A is ground until it becomes a circle with a diameter of 10 mm.

以上のように、保持面５００を研削することによって、図２（ｃ）に示すように、保持面５００の中央に平坦な円形状の第１面５０Ａを残しつつ、第1面の円の径方向と−Ｚ方向との間に延びるように、第１面５０Ａからつながる円錐面、または円錐台の側面の形状を有する第２面５０Ｂを形成することができる。 As described above, by grinding the holding surface 500, as shown in FIG. 2C, the diameter of the circle of the first surface is left while the flat circular first surface 50A is left in the center of the holding surface 500. A second surface 50B having the shape of a conical surface connected from the first surface 50A or a side surface of a truncated cone can be formed so as to extend between the direction and the −Z direction.

［第２実施形態］
（第１保持面形成工程）
まず、図１に示すチャックテーブル５を図示しないＹ軸方向への移動手段を用いてＹ軸方向に移動させて、図３（ａ）に示すように、研削砥石３４０の下面３４０ｂがチャックテーブル５の保持面５００の中心Ｏを通るように位置合わせする。
次いで、図示しない傾き調整手段を用いてチャックテーブル５を傾けることによって、第１回転軸３５と第２回転軸５５との傾き関係を第１傾き関係に調整する。第２実施形態においては、第１傾き関係を、図３（ａ）に示すような、第１回転軸３５と第２回転軸５５とが０度でない所定の角θ３をなしている関係とする。 [Second Embodiment]
(First holding surface forming step)
First, the chuck table 5 shown in FIG. 1 is moved in the Y-axis direction by using a moving means in the Y-axis direction (not shown), and as shown in FIG. 3A, the lower surface 340b of the grinding wheel 340 is the chuck table 5. It is aligned so as to pass through the center O of the holding surface 500 of.
Next, by tilting the chuck table 5 using a tilt adjusting means (not shown), the tilt relationship between the first rotating shaft 35 and the second rotating shaft 55 is adjusted to the first tilt relationship. In the second embodiment, the first inclination relationship is such that the first rotation axis 35 and the second rotation axis 55 form a predetermined angle θ3 that is not 0 degrees, as shown in FIG. 3A. ..

その後、第１実施形態と同様に、研削砥石３４０及びチャックテーブル５を第１回転軸３５及び第２回転軸５５を軸としてそれぞれ回転させる。研削砥石３４０及びチャックテーブル５が回転している状態で、研削送り手段４を用いて研削砥石３４０を−Ｚ方向に降下させる。これにより、図３（ａ）に示すように、研削砥石３４０の下面３４０ｂとチャックテーブル５の保持面５００とが当接する。 Then, as in the first embodiment, the grinding wheel 340 and the chuck table 5 are rotated about the first rotating shaft 35 and the second rotating shaft 55, respectively. With the grinding wheel 340 and the chuck table 5 rotating, the grinding wheel 340 is lowered in the −Z direction by using the grinding feed means 4. As a result, as shown in FIG. 3A, the lower surface 340b of the grinding wheel 340 and the holding surface 500 of the chuck table 5 come into contact with each other.

研削砥石３４０の下面３４０ｂとチャックテーブル５の保持面５００とが当接している状態で、さらに研削砥石３４０をチャックテーブル５の保持面５００に対して押し下げていくことによって、保持面５００を研削して、図３（ａ）に示すように、保持面５００の中心Ｏを頂点に持つ円錐面形状の第１面５０Ｃを形成する。 With the lower surface 340b of the grinding wheel 340 and the holding surface 500 of the chuck table 5 in contact with each other, the holding surface 500 is ground by further pushing down the grinding wheel 340 with respect to the holding surface 500 of the chuck table 5. As shown in FIG. 3A, a conical first surface 50C having the center O of the holding surface 500 as an apex is formed.

（第２保持面形成工程）
次に、研削送り手段４を用いて研削砥石３４０を上昇させて、研削砥石３４０を第１面５０Ｃから離間させる。そして、第１回転軸３５と第２回転軸５５との間の傾き関係が第２傾き関係となるように、図示しない傾き調整手段を用いてチャックテーブル５を傾ける。このとき、図３（ｂ）に示すように、第１回転軸３５と第２回転軸５５との間の角θ４が、第１傾き関係における第１回転軸３５と第２回転軸５５とがなす角θ３よりも大きくなるように傾ける。 (Second holding surface forming step)
Next, the grinding wheel 340 is raised by using the grinding feed means 4, and the grinding wheel 340 is separated from the first surface 50C. Then, the chuck table 5 is tilted by using a tilt adjusting means (not shown) so that the tilt relationship between the first rotary shaft 35 and the second rotary shaft 55 becomes the second tilt relationship. At this time, as shown in FIG. 3B, the angle θ4 between the first rotation axis 35 and the second rotation axis 55 is such that the first rotation axis 35 and the second rotation axis 55 in the first inclination relationship Tilt so that it is larger than the angle θ3.

その後、チャックテーブル５及び研削砥石３４０を第１回転軸３５及び第２回転軸５５を軸としてそれぞれ回転させながら、研削送り手段４を用いて研削砥石３４０を降下させて、研削砥石３４０の下面３４０ｂとチャックテーブル５の第１面５０Ｃとを当接させる。このとき、図３（ｂ）に示すように、第１面５０Ｃの中心Ｏと研削砥石３４０の下面３４０ｂとの間には隙間が空いた状態となっており、この状態で、研削砥石３４０を−Ｚ方向に押し下げていくことによって、第１面５０Ｃの外周部分を研削して、第２面５０Ｄを形成する。 After that, while rotating the chuck table 5 and the grinding wheel 340 about the first rotating shaft 35 and the second rotating shaft 55, respectively, the grinding wheel 340 is lowered by using the grinding feed means 4, and the lower surface 340b of the grinding wheel 340 is used. And the first surface 50C of the chuck table 5 are brought into contact with each other. At this time, as shown in FIG. 3B, there is a gap between the center O of the first surface 50C and the lower surface 340b of the grinding wheel 340, and in this state, the grinding wheel 340 is placed. By pushing down in the −Z direction, the outer peripheral portion of the first surface 50C is ground to form the second surface 50D.

このとき、第１実施形態と同様に、図３（ｂ）に示すように、第１面５０Ｃの研削中に、例えば、保持面ハイトゲージ６１を第２面５０Ｄの上に接触させて、研削によって変化する第２面５０Ｄの高さを監視することにより、第２面５０Ｄが予め定められた高さになるまで研削することができる。
また、第１面５０Ｃの面積が予め定められた面積になるまで研削することができる。
このようにして、保持面５００を研削することにより、図３（ｃ）に示すように、中央に円錐面の形状を有する第１面５０Ｃを残しつつ、第１面５０Ｃからつながる円錐台の側面の形状を有する第２面５０Ｄを形成することができる。 At this time, as in the first embodiment, as shown in FIG. 3B, during grinding of the first surface 50C, for example, the holding surface height gauge 61 is brought into contact with the second surface 50D and then ground. By monitoring the changing height of the second surface 50D, it is possible to grind until the second surface 50D reaches a predetermined height.
Further, it is possible to grind until the area of the first surface 50C becomes a predetermined area.
By grinding the holding surface 500 in this way, as shown in FIG. 3C, the side surface of the truncated cone connected from the first surface 50C is left while the first surface 50C having the shape of a conical surface is left in the center. The second surface 50D having the shape of can be formed.

また、例えば、第１保持面形成工程において、図４（ａ）に示すように、チャックテーブル５を−Ｙ方向に傾けて第１回転軸３５と第２回転軸５５とが角θ３をなすようにするだけでなく、チャックテーブル５をＸ軸方向にも傾斜させてから、研削砥石３４０を保持面５００に当接させて保持面５００を研削することにより、ドーム状の第１面５０Ｅを形成することができる。
その後、図４（ｂ）に示すように、さらに、チャックテーブル５を−Ｙ方向に傾けて、第１回転軸３５と第２回転軸５５との間の角を、θ３よりも大きな角度を有するθ４にした後に、再び保持面５００の研削を行うことにより、図４（ｃ）に示すような、ドーム状の第１面５０Ｅにつながる円錐台の側面形状を有する第２面５０Ｆを形成することができる。
なお、第１回転軸３５と第２回転軸５５との間の角をθ４にする際に、チャックテーブルをＸ軸方向にも傾けてもよい。 Further, for example, in the first holding surface forming step, as shown in FIG. 4A, the chuck table 5 is tilted in the −Y direction so that the first rotating shaft 35 and the second rotating shaft 55 form an angle θ3. The chuck table 5 is tilted in the X-axis direction, and then the grinding wheel 340 is brought into contact with the holding surface 500 to grind the holding surface 500 to form a dome-shaped first surface 50E. can do.
After that, as shown in FIG. 4B, the chuck table 5 is further tilted in the −Y direction, and the angle between the first rotating shaft 35 and the second rotating shaft 55 has an angle larger than θ3. After setting θ4, the holding surface 500 is ground again to form the second surface 50F having the side surface shape of the truncated cone connected to the dome-shaped first surface 50E as shown in FIG. 4C. Can be done.
The chuck table may be tilted in the X-axis direction when the angle between the first rotating shaft 35 and the second rotating shaft 55 is set to θ4.

以上のように、第１保持面形成工程と第２保持面形成工程とを順次行うことにより、円形の第１面と円環状の第２面とを形成することができる。これにより、保持面５００の第１面と第２面とに被加工物Ｗを保持したときに、中心Ｏと被加工物Ｗとの間に隙間ができなくなり、保持面５００の中央付近に位置している被加工物Ｗが研削されすぎてしまうという問題を解決することができる。 As described above, by sequentially performing the first holding surface forming step and the second holding surface forming step, a circular first surface and an annular second surface can be formed. As a result, when the workpiece W is held on the first and second surfaces of the holding surface 500, there is no gap between the center O and the workpiece W, and the position is near the center of the holding surface 500. It is possible to solve the problem that the workpiece W being processed is excessively ground.

なお、本発明にかかる保持面形成方法は、上記のような第１保持面形成工程と第２保持面形成工程とから構成されるものに限定されない。すなわち、第２保持面形成工程において第２面を形成した後に、例えば、チャックテーブル５をさらに傾けて、第１回転軸３５と第２回転軸５５とがなす角が、第２傾き関係のときの第１回転軸３５と第２回転軸５５とがなす角よりも大きな角度となるような第３傾き関係にしてから、第２面を研削することによって、第２面の外周に連なる第３面を形成することができる。同様にして、第４面、第５面、・・・というように、さらに複数の面を形成することも可能であり、被加工物Ｗを保持した際に、保持面５００と被加工物Ｗの間の隙間ができるのをより確実に防ぐことができる。 The holding surface forming method according to the present invention is not limited to the one including the first holding surface forming step and the second holding surface forming step as described above. That is, when the chuck table 5 is further tilted after the second surface is formed in the second holding surface forming step, and the angle formed by the first rotating shaft 35 and the second rotating shaft 55 has a second tilting relationship, for example. The third tilting relationship is set so that the angle is larger than the angle formed by the first rotating shaft 35 and the second rotating shaft 55, and then the second surface is ground to form a third that is continuous with the outer periphery of the second surface. A surface can be formed. Similarly, it is possible to form a plurality of surfaces such as the fourth surface, the fifth surface, and so on, and when the workpiece W is held, the holding surface 500 and the workpiece W are held. It is possible to more reliably prevent the formation of gaps between them.

１：研削装置 １０：ベース １１：コラム １２：カバー １３：蛇腹
２：制御手段 ３：研削手段 ３０：スピンドル ３１：ハウジング
３２：スピンドルモータ
３３：マウント ３４：研削ホイール ３４０：研削砥石 ３４０ｂ：研削砥石の下面
４３１：基台 ３５：第１回転軸 ４：研削送り手段 ４０：ボールネジ
４１：ガイドレール ４２：Ｚ軸モータ ４３：昇降板 ４４：ホルダ ４５：回転軸
５：チャックテーブル ５０：吸引部 ５００：保持面 ５１：枠体 ５２：吸引路
５３：吸引源 ５４：回転手段 ５５：第２回転軸
６：厚み測定手段 ６０：ウェーハ上面ハイトゲージ ６１：保持面ハイトゲージ
６２：算出手段 Ｗ：被加工物 Ｗａ：被加工物の表面 Ｏ：保持面の中心
５０Ａ：平坦な第１面 ５０Ｃ：円錐面形状の第１面 ５０Ｅ：ドーム状の第１面
５０Ｂ、５０Ｄ、５０Ｆ：円錐台の側面形状の第２面
θ１〜θ４：第１回転軸と第２回転軸とがなす角 1: Grinding device 10: Base 11: Column 12: Cover 13: Bellows 2: Control means 3: Grinding means 30: Spindle 31: Housing 32: Spindle motor 33: Mount 34: Grinding wheel 340: Grinding grind 340b: Grinding grind Bottom surface 431: Base 35: 1st rotary shaft 4: Grinding feed means 40: Ball screw 41: Guide rail 42: Z-axis motor 43: Lifting plate 44: Holder 45: Rotating shaft 5: Chuck table 50: Suction part 500: Holding Surface 51: Frame 52: Suction path 53: Suction source 54: Rotating means 55: Second rotating shaft 6: Thickness measuring means 60: Wafer top surface height gauge 61: Holding surface height gauge 62: Calculation means W: Work piece Wa: Work piece Surface of work piece O: Center of holding surface 50A: Flat first surface 50C: Conical first surface 50E: Dome-shaped first surface 50B, 50D, 50F: Conical base side surface second surface θ1 ~ Θ4: Angle formed by the first rotation axis and the second rotation axis

Claims (3)

研削砥石を環状に配置した研削ホイールの中心を軸に該研削ホイールを回転させ、被加工物を吸引保持するチャックテーブルの保持面の中心を軸に該チャックテーブルを回転させ該保持面に保持された被加工物を研削砥石で研削する研削装置において、該研削砥石で該保持面を研削して該保持面を形成する保持面形成方法であって、
該研削ホイールを回転させる際の軸となる該研削ホイールの中心を通る第１回転軸と、該チャックテーブルを回転させる際の軸となる該保持面の中心を通る第２回転軸とを所定の角度の第１傾き関係で配置し、該研削砥石を該保持面の中心を通過する位置に位置づけて該保持面を研削し、少なくとも該保持面中央に円形の第１面を形成する第１保持面形成工程と、
該第１回転軸と該第２回転軸とを該第１傾き関係より大きい角度で傾けた第２傾き関係で配置し、該研削砥石で該保持面の外周部分を研削して、該保持面中央に円形の該第１面を残し、該第１面からつながる円錐台の側面形状である円環形状の第２面を形成する第２保持面形成工程と、を備え、異なる傾き関係の下で該研削砥石で該保持面を少なくとも２回研削して保持面を形成する保持面形成方法。 The grinding wheel is rotated around the center of the grinding wheel in which the grinding wheels are arranged in an annular shape, and the chuck table is rotated around the center of the holding surface of the chuck table that sucks and holds the workpiece and is held on the holding surface. It is a holding surface forming method for forming the holding surface by grinding the holding surface with the grinding wheel in a grinding device for grinding a work piece with a grinding wheel.
A first rotating shaft passing through the center of the grinding wheel, which is an axis for rotating the grinding wheel, and a second rotating shaft passing through the center of the holding surface, which is an axis for rotating the chuck table, are predetermined. The first holding, which is arranged in the first inclination relationship of the angle, positions the grinding wheel at a position passing through the center of the holding surface, grinds the holding surface, and forms a circular first surface at least in the center of the holding surface. Surface formation process and
The first rotation axis and the second rotation axis are arranged in a second inclination relationship tilted at an angle larger than the first inclination relationship, and the outer peripheral portion of the holding surface is ground with the grinding wheel to perform the holding surface. A second holding surface forming step of forming a ring-shaped second surface which is a side surface shape of a truncated cone connected to the first surface while leaving the circular first surface in the center is provided, and under different inclination relationships. A method for forming a holding surface by grinding the holding surface at least twice with the grinding wheel. 該第１保持面形成工程は、該第１回転軸と該第２回転軸とを平行に配置し、平坦面の該第１面を形成する、請求項１記載の保持面形成方法。 The holding surface forming method according to claim 1, wherein in the first holding surface forming step, the first rotating shaft and the second rotating shaft are arranged in parallel to form the first surface of a flat surface. 該第１保持面形成工程は、該第１傾き関係で、該保持面中心を頂点とした円錐面の該第１面を形成する、請求項１記載の保持面形成方法。 The holding surface forming method according to claim 1, wherein the first holding surface forming step forms the first surface of a conical surface having the center of the holding surface as an apex in the first inclination relationship.
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