JP2020155629A - Substrate transport device - Google Patents

Substrate transport device Download PDF

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JP2020155629A
JP2020155629A JP2019053567A JP2019053567A JP2020155629A JP 2020155629 A JP2020155629 A JP 2020155629A JP 2019053567 A JP2019053567 A JP 2019053567A JP 2019053567 A JP2019053567 A JP 2019053567A JP 2020155629 A JP2020155629 A JP 2020155629A
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substrate
holding member
pin holding
transfer device
moving mechanism
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JP7406306B2 (en
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佐藤　史朗
Shiro Sato
史朗 佐藤
正 荒井
Tadashi Arai
正 荒井
茂 倉田
Shigeru Kurata
茂 倉田
多津次 小松
Tatsuji Komatsu
多津次 小松
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Nidec Sankyo Corp
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Nidec Sankyo Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

To provide a substrate transport device conveying a substrate and capable of shortening a cycle time of a production line in which a substrate transport device is incorporated and used even when rotating a substrate to change an orientation of the substrate or correcting a position of the substrate.SOLUTION: The substrate transport device includes: a plurality of support pins 7 on which a substrate 2 is mounted; a pin holding member 8 for holding the support pins 7; a first moving mechanism 9 for moving the pin holding member 8 in an X direction to transport the substrate 2; a second moving mechanism for moving the pin holding member 8 in a Y direction; and a rotation mechanism 11 for rotating the pin holding member 8 with a vertical direction as an axial direction of rotation. The first moving mechanism 9 moves the rotation mechanism 11 in the X direction together with the pin holding member 8.SELECTED DRAWING: Figure 5

Description

本発明は、ガラス基板等の基板を搬送する基板搬送装置に関する。 The present invention relates to a substrate transfer device that conveys a substrate such as a glass substrate.

従来、液晶表示装置等で使用されるガラス基板を処理するための基板処理装置が知られている（たとえば、特許文献１参照）。特許文献１に記載の基板処理装置は、複数枚のガラス基板が収容されるカセットからガラス基板を取り出す搬送ロボットと、基板に対して処理を行う処理部と、搬送ロボットと処理部との間でガラス基板を搬送する搬送コンベヤとを備えている。搬送コンベヤは、ガラス基板を搬送する複数の搬送ローラと、搬送ロボットからガラス基板を受け取るために昇降する複数本のプッシャピンとを備えている。 Conventionally, a substrate processing device for processing a glass substrate used in a liquid crystal display device or the like is known (see, for example, Patent Document 1). The substrate processing apparatus described in Patent Document 1 is between a transfer robot that takes out a glass substrate from a cassette containing a plurality of glass substrates, a processing unit that processes the substrate, and the transfer robot and the processing unit. It is equipped with a transport conveyor that transports a glass substrate. The transfer conveyor includes a plurality of transfer rollers that transfer the glass substrate, and a plurality of pusher pins that move up and down to receive the glass substrate from the transfer robot.

特許文献１に記載の基板処理装置では、複数本のプッシャピンの上端が搬送ローラの上端よりも上側に上昇した状態で、複数本のプッシャピンの上にガラス基板を載置することで、搬送ロボットは、搬送コンベヤにガラス基板を引き渡す。複数本のプッシャピンの上にガラス基板が載置されると、プッシャピンが下降して、搬送ローラにガラス基板が載置される。搬送ローラにガラス基板が載置されると、搬送ローラが回転して、処理部にガラス基板が搬入される。特許文献１に記載の基板処理装置では、昇降可能な複数本のプッシャピンを搬送コンベヤが備えているため、搬送ロボットのハンドフォークと搬送ローラとの干渉を防止しつつ、搬送ロボットから搬送コンベヤにガラス基板を引き渡すことが可能になっている。 In the substrate processing apparatus described in Patent Document 1, a transfer robot can be formed by placing a glass substrate on a plurality of pusher pins in a state where the upper ends of a plurality of pusher pins are raised above the upper ends of the transfer rollers. , Hand over the glass substrate to the transport conveyor. When the glass substrate is placed on the plurality of pusher pins, the pusher pins are lowered and the glass substrate is placed on the transfer roller. When the glass substrate is placed on the transfer roller, the transfer roller rotates and the glass substrate is carried into the processing unit. In the substrate processing apparatus described in Patent Document 1, since the transfer conveyor is provided with a plurality of pusher pins that can be raised and lowered, glass is transferred from the transfer robot to the transfer conveyor while preventing interference between the hand fork of the transfer robot and the transfer roller. It is possible to hand over the board.

特開平１０−３１０２４０号公報Japanese Unexamined Patent Publication No. 10-310240

特許文献１に記載の基板処理装置では、たとえば、搬送ローラに載置されたガラス基板の向きを変えてからガラス基板を処理部に搬入しなければならない場合や、搬送ローラに載置されたガラス基板の位置補正（アライメント）を行ってからガラス基板を処理部に搬入しなければならない場合に、搬送ローラに載置された状態でガラス基板を回動させたり、ガラス基板の位置補正を行ったりすると、ガラス基板が傷つくおそれがある。そのため、特許文献１に記載の基板処理装置では、ガラス基板を回動させてガラス基板の向きを変えたり、ガラス基板の位置補正を行ったりする際に、プッシャピンでガラス基板を搬送ローラから持ち上げてから、ガラス基板を回動させたり、ガラス基板の位置補正を行ったりする必要がある。 In the substrate processing apparatus described in Patent Document 1, for example, when the direction of the glass substrate placed on the transport roller must be changed and then the glass substrate must be carried into the processing unit, or the glass mounted on the transport roller When the glass substrate must be carried into the processing unit after the position correction (alignment) of the substrate is performed, the glass substrate may be rotated while being mounted on the transport roller, or the position of the glass substrate may be corrected. Then, the glass substrate may be damaged. Therefore, in the substrate processing apparatus described in Patent Document 1, when the glass substrate is rotated to change the orientation of the glass substrate or the position of the glass substrate is corrected, the glass substrate is lifted from the transport roller by a pusher pin. Therefore, it is necessary to rotate the glass substrate and correct the position of the glass substrate.

しかしながら、搬送コンベヤにおいて、ガラス基板を回動させてガラス基板の向きを変えたり、ガラス基板の位置補正を行ったりする際に、プッシャピンでガラス基板を搬送ローラから持ち上げてから、ガラス基板を回動させたり、ガラス基板の位置補正を行ったりすると、搬送ロボットから受け取ったガラス基板を処理部に引き渡すまでの時間が長くなって、基板処理装置のサイクルタイムが長くなるおそれがある。 However, in the transport conveyor, when the glass substrate is rotated to change the orientation of the glass substrate or the position of the glass substrate is corrected, the glass substrate is lifted from the transport roller by the pusher pin and then the glass substrate is rotated. If the glass substrate is moved or the position of the glass substrate is corrected, the time until the glass substrate received from the transfer robot is delivered to the processing unit becomes long, and the cycle time of the substrate processing apparatus may become long.

そこで、本発明の課題は、基板を搬送する基板搬送装置において、基板を回動させて基板の向きを変えたり、基板の位置補正を行ったりする場合であっても、基板搬送装置が組み込まれて使用される製造ラインのサイクルタイムを短縮することが可能な基板搬送装置を提供することにある。 Therefore, an object of the present invention is that in a substrate transporting device for transporting a substrate, the substrate transporting device is incorporated even when the substrate is rotated to change the orientation of the substrate or the position of the substrate is corrected. It is an object of the present invention to provide a substrate transfer device capable of shortening the cycle time of a production line used therein.

上記の課題を解決するため、本発明の基板搬送装置は、基板を搬送する基板搬送装置において、基板が載置される複数本の支持ピンと、複数本の支持ピンを保持するピン保持部材と、水平方向のうちの所定の方向である第１方向にピン保持部材を移動させて基板を搬送する第１移動機構と、上下方向と第１方向とに直交する第２方向にピン保持部材を移動させる第２移動機構と、上下方向を回動の軸方向としてピン保持部材を回動させる回動機構とを備え、第１移動機構は、ピン保持部材と一緒に回動機構を第１方向に移動させることを特徴とする。 In order to solve the above problems, the substrate transport device of the present invention includes a plurality of support pins on which the substrate is placed, a pin holding member for holding the plurality of support pins, and a pin holding member for transporting the substrate. The first moving mechanism that moves the pin holding member in the first direction, which is a predetermined direction in the horizontal direction, to convey the substrate, and the pin holding member is moved in the second direction orthogonal to the vertical direction and the first direction. A second moving mechanism for rotating the pin holding member and a rotating mechanism for rotating the pin holding member with the vertical direction as the axial direction of rotation are provided, and the first moving mechanism moves the rotating mechanism in the first direction together with the pin holding member. It is characterized by moving.

本発明の基板搬送装置は、第１方向にピン保持部材を移動させて基板を搬送する第１移動機構と、第２方向にピン保持部材を移動させる第２移動機構と、上下方向を回動の軸方向としてピン保持部材を回動させる回動機構とを備えている。そのため、本発明では、基板を持ち上げなくても、複数本の支持ピンに載置される基板を回動機構によって回動させて基板の向きを変えることが可能になる。また、本発明では、基板を持ち上げなくても、複数本の支持ピンに載置される基板を回動機構によって回動させ、第２移動機構によって第２方向に移動させるとともに第１移動機構によって第１方向に移動させて基板の位置補正を行うことが可能になる。 The substrate transfer device of the present invention rotates in the vertical direction with a first moving mechanism that moves the pin holding member in the first direction to convey the substrate, a second moving mechanism that moves the pin holding member in the second direction, and so on. It is provided with a rotation mechanism for rotating the pin holding member in the axial direction of the above. Therefore, in the present invention, it is possible to change the orientation of the substrate by rotating the substrate mounted on the plurality of support pins by the rotation mechanism without lifting the substrate. Further, in the present invention, the substrate mounted on the plurality of support pins is rotated by the rotation mechanism without lifting the substrate, and is moved in the second direction by the second moving mechanism and by the first moving mechanism. It becomes possible to correct the position of the substrate by moving it in the first direction.

すなわち、本発明では、基板を持ち上げなくても、基板を回動させて基板の向きを変えたり、基板の位置補正を行ったりすることが可能になる。したがって、本発明では、基板搬送装置において、基板を回動させて基板の向きを変えたり、基板の位置補正を行ったりする場合であっても、基板搬送装置が組み込まれて使用される製造ラインのサイクルタイムを短縮することが可能になる。 That is, in the present invention, it is possible to rotate the substrate to change the orientation of the substrate and to correct the position of the substrate without lifting the substrate. Therefore, in the present invention, in the substrate transfer device, even when the substrate is rotated to change the orientation of the substrate or the position of the substrate is corrected, the production line in which the substrate transfer device is incorporated and used is used. It is possible to shorten the cycle time of.

また、本発明では、第１移動機構は、ピン保持部材と一緒に回動機構を第１方向に移動させているため、第１移動機構によって第１方向の一方に基板を搬送しながら、複数本の支持ピンに載置される基板を回動機構によって回動させて基板の向きを変えることが可能になる。また、第１移動機構がピン保持部材と一緒に回動機構を第１方向に移動させているため、第１移動機構によって第１方向の一方に基板を搬送しながら、複数本の支持ピンに載置される基板を回動機構によって回動させるとともに第２移動機構によって第２方向に移動させて基板の位置補正を行うことが可能になる。 Further, in the present invention, since the first moving mechanism moves the rotating mechanism in the first direction together with the pin holding member, a plurality of the rotating mechanisms are conveyed while the substrate is conveyed in one of the first directions by the first moving mechanism. It is possible to change the orientation of the substrate by rotating the substrate mounted on the support pin of the book by the rotation mechanism. Further, since the first moving mechanism moves the rotating mechanism in the first direction together with the pin holding member, the first moving mechanism conveys the substrate in one of the first directions to a plurality of support pins. It is possible to correct the position of the substrate by rotating the substrate to be mounted by the rotation mechanism and moving it in the second direction by the second moving mechanism.

すなわち、本発明では、第１方向の一方に基板を搬送しながら、基板を回動させて基板の向きを変えたり、基板の位置補正を行ったりすることが可能になる。したがって、本発明では、基板搬送装置において、基板を回動させて基板の向きを変えたり、基板の位置補正を行ったりする場合であっても、基板搬送装置が組み込まれて使用される製造ラインのサイクルタイムをより短縮することが可能になる。 That is, in the present invention, it is possible to rotate the substrate to change the orientation of the substrate and to correct the position of the substrate while transporting the substrate in one of the first directions. Therefore, in the present invention, in the substrate transfer device, even when the substrate is rotated to change the orientation of the substrate or the position of the substrate is corrected, the production line in which the substrate transfer device is incorporated and used is used. It becomes possible to further shorten the cycle time of.

本発明において、複数本の支持ピンには、基板の下面を吸着して基板を把持する吸着支持ピンが含まれていることが好ましい。このように構成すると、複数本の支持ピンに載置される基板のずれを確実に防止することが可能になる。 In the present invention, it is preferable that the plurality of support pins include suction support pins that attract the lower surface of the substrate to grip the substrate. With this configuration, it is possible to reliably prevent the substrate mounted on the plurality of support pins from shifting.

本発明において、たとえば、第２移動機構は、ピン保持部材と一緒に回動機構を第２方向に移動させ、第１移動機構は、ピン保持部材と一緒に回動機構および第２移動機構を第１方向に移動させる。 In the present invention, for example, the second moving mechanism moves the rotating mechanism in the second direction together with the pin holding member, and the first moving mechanism moves the rotating mechanism and the second moving mechanism together with the pin holding member. Move in the first direction.

本発明において、たとえば、第１移動機構が基板を第１方向の一方に搬送しながら、回動機構がピン保持部材を回動させる。この場合には、第１移動機構によって第１方向の一方に基板を搬送しながら、複数本の支持ピンに載置される基板を回動機構によって回動させて基板の向きを変えることができる。 In the present invention, for example, the rotating mechanism rotates the pin holding member while the first moving mechanism conveys the substrate in one of the first directions. In this case, the orientation of the substrate can be changed by rotating the substrate mounted on the plurality of support pins by the rotation mechanism while transporting the substrate in one direction in the first direction by the first moving mechanism. ..

また、本発明において、たとえば、第１移動機構が基板を第１方向の一方に搬送しながら、第２移動機構がピン保持部材および回動機構を第２方向に移動させるとともに、回動機構がピン保持部材を回動させる。この場合には、第１移動機構によって第１方向の一方に基板を搬送しながら、複数本の支持ピンに載置される基板を回動機構によって回動させるとともに第２移動機構によって第２方向に移動させて基板の位置補正を行うことができる。 Further, in the present invention, for example, while the first moving mechanism conveys the substrate in one of the first directions, the second moving mechanism moves the pin holding member and the rotating mechanism in the second direction, and the rotating mechanism Rotate the pin holding member. In this case, while the substrate is conveyed in one direction in the first direction by the first moving mechanism, the substrate mounted on the plurality of support pins is rotated by the rotating mechanism and the second direction by the second moving mechanism. The position of the board can be corrected by moving to.

本発明において、基板搬送装置は、たとえば、複数本の支持ピンに載置される基板の、第１方向の位置と第２方向の位置と第１方向または第２方向に対する傾きとを検知するための検知機構を備えている。この場合には、検知機構の検知結果に基づいて基板の位置補正が行われる。また、本発明において、基板搬送装置は、たとえば、基板に記録されたデータを読み取るデータ読取機構を備えている。 In the present invention, for example, the substrate transfer device detects a position in the first direction, a position in the second direction, and an inclination with respect to the first direction or the second direction of a substrate mounted on a plurality of support pins. It is equipped with a detection mechanism. In this case, the position of the substrate is corrected based on the detection result of the detection mechanism. Further, in the present invention, the substrate transfer device includes, for example, a data reading mechanism for reading data recorded on the substrate.

本発明において、基板搬送装置は、基板の端部の割れの有無を検知するための割れ検知機構を備え、割れ検知機構は、支持ピンよりも上側に配置されるカメラおよび照明を備え、第１搬送機構が基板を第１方向の一方に搬送しながら、割れ検知機構が基板の端部の割れの有無を検知することが好ましい。このように構成すると、基板の端部の割れの有無を割れ検知機構によって検知する場合であっても、基板搬送装置が組み込まれて使用される製造ラインのサイクルタイムを短縮することが可能になる。 In the present invention, the substrate transfer device includes a crack detection mechanism for detecting the presence or absence of cracks at the edges of the substrate, and the crack detection mechanism includes a camera and illumination arranged above the support pins, and is the first. It is preferable that the crack detection mechanism detects the presence or absence of cracks at the edges of the substrate while the transport mechanism transports the substrate in one of the first directions. With this configuration, even when the presence or absence of cracks at the edges of the substrate is detected by the crack detection mechanism, it is possible to shorten the cycle time of the production line in which the substrate transfer device is incorporated and used. ..

本発明において、基板搬送装置は、カメラの下側であってかつ基板よりも下側に配置されるとともに、上側から見たときに少なくとも一部が基板の第２方向の端面よりも第２方向の外側に配置される低反射部材を備え、低反射部材の上面は、黒色であり、かつ、第２方向の外側に向かうにしたがって下側に向かうように傾斜する傾斜面となっていることが好ましい。このように構成すると、割れ検知機構によって基板の端部の割れの有無を検知する際に、基板の第２方向の端面の外側で照明光がカメラに向かって反射されにくくなる。したがって、基板の第２方向の端部の割れの有無を精度良く検知することが可能になる。 In the present invention, the substrate transfer device is arranged below the camera and below the substrate, and at least a part thereof is in the second direction from the end face in the second direction of the substrate when viewed from above. The low-reflection member is provided on the outside of the low-reflection member, and the upper surface of the low-reflection member is black and has an inclined surface that inclines downward toward the outside in the second direction. preferable. With this configuration, when the crack detection mechanism detects the presence or absence of cracks at the edges of the substrate, the illumination light is less likely to be reflected toward the camera outside the end faces in the second direction of the substrate. Therefore, it is possible to accurately detect the presence or absence of cracks at the end portion of the substrate in the second direction.

本発明において、カメラの下側であってかつ基板よりも下側に配置される部材の上面が黒色となっていることが好ましい。このように構成すると、割れ検知機構によって基板の端部の割れの有無を検知する際に、基板の端面の外側で照明光がカメラに向かって反射されにくくなる。したがって、基板の端部の割れの有無を精度良く検知することが可能になる。 In the present invention, it is preferable that the upper surface of the member arranged below the camera and below the substrate is black. With this configuration, when the crack detection mechanism detects the presence or absence of cracks at the edges of the substrate, the illumination light is less likely to be reflected toward the camera outside the end faces of the substrate. Therefore, it is possible to accurately detect the presence or absence of cracks at the edges of the substrate.

以上のように、本発明では、基板を搬送する基板搬送装置において、基板を回動させて基板の向きを変えたり、基板の位置補正を行ったりする場合であっても、基板搬送装置が組み込まれて使用される製造ラインのサイクルタイムを短縮することが可能になる。 As described above, in the present invention, in the substrate transporting device for transporting the substrate, the substrate transporting device is incorporated even when the substrate is rotated to change the orientation of the substrate or the position of the substrate is corrected. It is possible to shorten the cycle time of the production line used.

本発明の実施の形態にかかる基板搬送装置の側面図である。It is a side view of the substrate transfer apparatus which concerns on embodiment of this invention. 図１に示す基板搬送装置の構成を説明するための平面図である。It is a top view for demonstrating the structure of the substrate transfer apparatus shown in FIG. 図１のＥ−Ｅ方向から基板搬送装置の構成を説明するための図である。It is a figure for demonstrating the structure of the substrate transfer apparatus from the EE direction of FIG. 図１のＦ部の構成を説明するための図である。It is a figure for demonstrating the structure of the F part of FIG. 図１のＧ−Ｇ方向から基板搬送装置の構成を説明するための図である。It is a figure for demonstrating the structure of the substrate transfer apparatus from the GG direction of FIG. 図２のＨ部の構成を説明するための図である。It is a figure for demonstrating the structure of the H part of FIG. 図２のＪ部の構成を説明するための図である。It is a figure for demonstrating the structure of the J part of FIG. 図１に示す基板搬送装置での基板の位置補正方法を説明するための図である。It is a figure for demonstrating the position correction method of the substrate in the substrate transfer apparatus shown in FIG.

以下、図面を参照しながら、本発明の実施の形態を説明する。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.

（基板搬送装置の概略構成）
図１は、本発明の実施の形態にかかる基板搬送装置１の側面図である。図２は、図１に示す基板搬送装置１の構成を説明するための平面図である。図３は、図１のＥ−Ｅ方向から基板搬送装置１の構成を説明するための図である。図４は、図１のＦ部の構成を説明するための図である。図５は、図１のＧ−Ｇ方向から基板搬送装置１の構成を説明するための図である。 (Outline configuration of board transfer device)
FIG. 1 is a side view of the substrate transfer device 1 according to the embodiment of the present invention. FIG. 2 is a plan view for explaining the configuration of the substrate transfer device 1 shown in FIG. FIG. 3 is a diagram for explaining the configuration of the substrate transfer device 1 from the EE direction of FIG. FIG. 4 is a diagram for explaining the configuration of the F portion of FIG. FIG. 5 is a diagram for explaining the configuration of the substrate transfer device 1 from the GG direction of FIG.

本形態の基板搬送装置１は、基板２を水平方向へ搬送するための装置である。基板２は、液晶表示装置で使用される大型のガラス基板であり、長方形の平板状に形成されている。基板搬送装置１は、液晶表示装置の製造ラインに組み込まれて使用される。液晶表示装置の製造ラインは、基板搬送装置１に基板２を１枚ずつ供給する上流側のロボットと、基板搬送装置１から基板２を１枚ずつ排出する下流側のロボットとを備えている。ロボットは、水平多関節型のロボットであり、ハンド３と、ハンド３が先端側に回動可能に連結されるアームと、アームの基端側が回動可能に連結される本体部とを備えている。ハンド３は、基板２が搭載される複数本のハンドフォーク４を備えている。 The substrate transport device 1 of this embodiment is a device for transporting the substrate 2 in the horizontal direction. The substrate 2 is a large glass substrate used in a liquid crystal display device, and is formed in a rectangular flat plate shape. The substrate transfer device 1 is used by being incorporated in a production line of a liquid crystal display device. The production line of the liquid crystal display device includes an upstream robot that supplies the substrate 2 to the substrate transfer device 1 one by one, and a downstream robot that discharges the substrate 2 from the substrate transfer device 1 one by one. The robot is a horizontal articulated robot, and includes a hand 3, an arm to which the hand 3 is rotatably connected to the tip side, and a main body portion to which the base end side of the arm is rotatably connected. There is. The hand 3 includes a plurality of hand forks 4 on which the substrate 2 is mounted.

基板搬送装置１は、基板２が載置される複数本の支持ピン７と、複数本の支持ピン７を保持するピン保持部材８と、水平方向のうちの所定の方向へピン保持部材８を直線的に移動させる第１移動機構としての移動機構９（図５参照）と、移動機構９によって移動するピン保持部材８の移動方向と上下方向とに直交する方向へピン保持部材８を移動させる第２移動機構としての移動機構１０（図４参照）と、上下方向を回動の軸方向としてピン保持部材８を回動させる回動機構１１とを備えている。 The board transfer device 1 has a plurality of support pins 7 on which the board 2 is placed, a pin holding member 8 for holding the plurality of support pins 7, and a pin holding member 8 in a predetermined direction in the horizontal direction. The moving mechanism 9 (see FIG. 5) as the first moving mechanism for linearly moving the pin holding member 8 and the pin holding member 8 moved by the moving mechanism 9 in a direction orthogonal to the moving direction and the vertical direction. A moving mechanism 10 (see FIG. 4) as a second moving mechanism and a rotating mechanism 11 for rotating the pin holding member 8 with the vertical direction as the axial direction of rotation are provided.

以下の説明では、移動機構９によるピン保持部材８の移動方向（図１等のＸ方向）を「前後方向」とし、上下方向と前後方向とに直交する図１等のＹ方向を「左右方向」とする。また、以下の説明では、前後方向の一方である図１等のＸ２方向を「後ろ」方向とし、その反対方向である図１等のＸ１方向を「前」方向とし、左右方向の一方である図２等のＹ１方向を「右」方向とし、その反対方向である図２等のＹ２方向を「左」方向とする。本形態の前後方向（Ｘ方向）は、第１方向であり、左右方向（Ｙ方向）は、第２方向である。 In the following description, the moving direction of the pin holding member 8 by the moving mechanism 9 (X direction in FIG. 1 and the like) is defined as the “front-back direction”, and the Y direction in FIG. 1 and the like orthogonal to the vertical and front-back directions is the “horizontal direction”. ". Further, in the following description, the X2 direction of FIG. 1 and the like, which is one of the front-rear directions, is defined as the "back" direction, and the X1 direction of FIG. 1, etc., which is the opposite direction, is defined as the "front" direction, and is one of the left-right directions. The Y1 direction of FIG. 2 and the like is defined as the “right” direction, and the opposite direction, the Y2 direction of FIG. 2 and the like, is defined as the “left” direction. The front-rear direction (X direction) of this embodiment is the first direction, and the left-right direction (Y direction) is the second direction.

液晶表示装置の製造ラインにおいて、上流側のロボットの本体部は、基板搬送装置１の前側に配置され、下流側のロボットの本体部は、基板搬送装置１の後ろ側に配置されている。基板搬送装置１は、上流側のロボットから供給された基板２を後ろ側に向かって搬送する。すなわち、移動機構９は、ピン保持部材８を後ろ側へ移動させることで、基板２を後ろ側に向かって搬送する。基板搬送装置１による基板２の搬送量は、たとえば、８〜９（ｍ）である。 In the production line of the liquid crystal display device, the main body of the robot on the upstream side is arranged on the front side of the substrate transfer device 1, and the main body of the robot on the downstream side is arranged on the rear side of the substrate transfer device 1. The substrate transfer device 1 conveys the substrate 2 supplied from the robot on the upstream side toward the rear side. That is, the moving mechanism 9 conveys the substrate 2 toward the rear side by moving the pin holding member 8 to the rear side. The amount of the substrate 2 transported by the substrate transport device 1 is, for example, 8 to 9 (m).

また、基板搬送装置１は、移動機構９等が取り付けられる門型のフレーム１２と、フレーム１２を下側から支持する支持脚１３とを備えている。さらに、基板搬送装置１は、基板２に記録されたデータを読み取るためのデータ読取機構１４と、複数本の支持ピン７に載置される基板２の、前後方向の位置と左右方向の位置と前後方向または左右方向に対する傾きを検知するための検知機構１５と、基板２の端部の割れの有無を検知するための割れ検知機構１６とを備えている。なお、図２では、フレーム１２および支持脚１３の図示を省略している。 Further, the substrate transfer device 1 includes a gate-shaped frame 12 to which the moving mechanism 9 and the like are attached, and support legs 13 for supporting the frame 12 from below. Further, the substrate transfer device 1 includes a data reading mechanism 14 for reading the data recorded on the substrate 2, and a position in the front-rear direction and a position in the left-right direction of the substrate 2 mounted on the plurality of support pins 7. A detection mechanism 15 for detecting an inclination in the front-rear direction or a left-right direction and a crack detection mechanism 16 for detecting the presence or absence of cracks at the end portion of the substrate 2 are provided. In FIG. 2, the frame 12 and the support legs 13 are not shown.

（支持ピン、ピン保持部材、回動機構および移動機構の構成）
図６は、図２のＨ部の構成を説明するための図である。 (Structure of support pin, pin holding member, rotating mechanism and moving mechanism)
FIG. 6 is a diagram for explaining the configuration of the H portion of FIG.

ピン保持部材８は、支持ピン７が固定される細長い四角筒状の複数本のピン固定部材１９と、複数本のピン固定部材１９を繋ぐ細長い四角筒状の２本の連結部材２０と、２本の連結部材２０を支持する平板状の支持板２１とを備えている。ピン保持部材８の外形は、基板２の外形よりも小さくなっている。そのため、複数本の支持ピン７に基板２が載置された状態で上側からピン保持部材８を見ると、ピン保持部材８は、基板２の外形の中に収まっている。 The pin holding member 8 includes a plurality of elongated square tubular pin fixing members 19 to which the support pins 7 are fixed, and two elongated square tubular connecting members 20 connecting the plurality of pin fixing members 19. It includes a flat plate-shaped support plate 21 that supports the connecting member 20 of the book. The outer shape of the pin holding member 8 is smaller than the outer shape of the substrate 2. Therefore, when the pin holding member 8 is viewed from above with the substrate 2 mounted on the plurality of support pins 7, the pin holding member 8 is contained in the outer shape of the substrate 2.

ピン固定部材１９は、ピン固定部材１９の長手方向と前後方向とが一致するように配置されている。複数本のピン固定部材１９は、左右方向において所定の間隔をあけた状態で配置されている。本形態では、ピン保持部材８は、５本のピン固定部材１９を備えている。連結部材２０は、連結部材２０の長手方向と左右方向とが一致するように配置されている。２本の連結部材２０は、前後方向に間隔をあけた状態で配置されている。支持板２１は、支持板２１の厚さ方向と上下方向とが一致するように配置されている。ピン固定部材１９は、２本の連結部材２０の上面に固定されている。連結部材２０は、支持板２１の上面に固定されている。上下方向から見ると、支持板２１の中心は、ピン保持部材８の中心と一致している。 The pin fixing member 19 is arranged so that the longitudinal direction and the front-rear direction of the pin fixing member 19 coincide with each other. The plurality of pin fixing members 19 are arranged in a state of being spaced apart from each other in the left-right direction. In this embodiment, the pin holding member 8 includes five pin fixing members 19. The connecting member 20 is arranged so that the longitudinal direction and the left-right direction of the connecting member 20 coincide with each other. The two connecting members 20 are arranged so as to be spaced apart from each other in the front-rear direction. The support plate 21 is arranged so that the thickness direction and the vertical direction of the support plate 21 coincide with each other. The pin fixing member 19 is fixed to the upper surface of the two connecting members 20. The connecting member 20 is fixed to the upper surface of the support plate 21. When viewed from the vertical direction, the center of the support plate 21 coincides with the center of the pin holding member 8.

支持ピン７の下端は、ピン固定部材１９に直接または所定のブラケットを介して固定されており、支持ピン７は、ピン固定部材１９の上面から上側に突出している。複数本の支持ピン７は、複数本のピン固定部材１９のそれぞれに前後方向に一定の間隔をあけた状態で固定されている。複数本の支持ピン７の中には、基板２の下面を吸着して基板２を把持する吸着支持ピン７Ａが含まれている。本形態では、左右の両端に配置される２本のピン固定部材１９のそれぞれの前後の両端側に固定される４本の支持ピン７が吸着支持ピン７Ａとなっている。そのため、長方形状に形成される基板２の四隅の下面が吸着支持ピン７Ａに吸着されて把持される。吸着支持ピン７Ａは、吸着パッドを備えている。吸着支持ピン７Ａには、吸引ポンプ等を有する吸引機構が接続されている。 The lower end of the support pin 7 is fixed to the pin fixing member 19 directly or via a predetermined bracket, and the support pin 7 projects upward from the upper surface of the pin fixing member 19. The plurality of support pins 7 are fixed to each of the plurality of pin fixing members 19 at regular intervals in the front-rear direction. The plurality of support pins 7 include suction support pins 7A that attract the lower surface of the substrate 2 to grip the substrate 2. In this embodiment, the four support pins 7 fixed to the front and rear ends of the two pin fixing members 19 arranged at the left and right ends are the suction support pins 7A. Therefore, the lower surfaces of the four corners of the rectangular substrate 2 are attracted to and gripped by the suction support pins 7A. The suction support pin 7A includes a suction pad. A suction mechanism having a suction pump or the like is connected to the suction support pin 7A.

回動機構１１は、ピン保持部材８の下側に配置されている。回動機構１１は、モータ２２を備えている。モータ２２は、モータ２２の出力軸が上側に突出するように配置されている。モータ２２の出力軸には、支持板２１が固定されている。上下方向から見たときに、モータ２２の出力軸の中心は、ピン保持部材８の中心と一致している。 The rotating mechanism 11 is arranged below the pin holding member 8. The rotation mechanism 11 includes a motor 22. The motor 22 is arranged so that the output shaft of the motor 22 projects upward. A support plate 21 is fixed to the output shaft of the motor 22. When viewed from the vertical direction, the center of the output shaft of the motor 22 coincides with the center of the pin holding member 8.

移動機構１０は、図４に示すように、モータ２２が固定されるスライド部材２４と、スライド部材２４を左右方向に移動させるためのモータ（図示省略）と、このモータの動力をスライド部材２４に伝達する動力伝達機構２５と、スライド部材２４を左右方向に案内するガイド機構２６とを備えている。モータ２２は、スライド部材２４の上面側に固定されている。すなわち、モータ２２の下端部がスライド部材２４の上面側に固定されており、回動機構１１は、スライド部材２４に搭載されている。 As shown in FIG. 4, the moving mechanism 10 transfers the power of the slide member 24 to which the motor 22 is fixed, the motor for moving the slide member 24 in the left-right direction (not shown), and the power of the motor to the slide member 24. It includes a power transmission mechanism 25 for transmitting power and a guide mechanism 26 for guiding the slide member 24 in the left-right direction. The motor 22 is fixed to the upper surface side of the slide member 24. That is, the lower end of the motor 22 is fixed to the upper surface side of the slide member 24, and the rotation mechanism 11 is mounted on the slide member 24.

動力伝達機構２５は、ネジ軸およびネジ軸に係合するナット部材を有するボールねじである。したがって、以下では、動力伝達機構２５を「ボールねじ２５」とする。ボールねじ２５のネジ軸は、移動機構９の一部を構成する後述のスライド部材２８に回転可能に取り付けられている。ネジ軸は、ネジ軸の軸方向と左右方向とが一致するように配置されている。また、ネジ軸は、スライド部材２８の前端部に取り付けられている。ネジ軸は、移動機構１０のモータの動力で回転する。このモータは、スライド部材２８に固定されている。ボールねじ２５のナット部材は、スライド部材２４の前端部に取り付けられている。 The power transmission mechanism 25 is a ball screw having a screw shaft and a nut member that engages with the screw shaft. Therefore, in the following, the power transmission mechanism 25 will be referred to as a “ball screw 25”. The screw shaft of the ball screw 25 is rotatably attached to a slide member 28, which will be described later, which constitutes a part of the moving mechanism 9. The screw shafts are arranged so that the axial direction of the screw shaft and the left-right direction coincide with each other. Further, the screw shaft is attached to the front end portion of the slide member 28. The screw shaft is rotated by the power of the motor of the moving mechanism 10. This motor is fixed to the slide member 28. The nut member of the ball screw 25 is attached to the front end portion of the slide member 24.

ガイド機構２６は、スライド部材２８に固定されるガイドレールと、ガイドレールに係合するガイドブロックとを備えている。ガイド機構２６は、スライド部材２４の前後の両端側のそれぞれに配置されている。ガイド機構２６のガイドレールは、スライド部材２８の上面側に固定されている。このガイドレールは、ガイドレールの長手方向と左右方向とが一致するように配置されている。ガイド機構２６のガイドブロックは、スライド部材２４の下面側に固定されている。このガイドブロックは、上側からガイドレールに係合している。 The guide mechanism 26 includes a guide rail fixed to the slide member 28 and a guide block engaged with the guide rail. The guide mechanism 26 is arranged on each of the front and rear ends of the slide member 24. The guide rail of the guide mechanism 26 is fixed to the upper surface side of the slide member 28. The guide rails are arranged so that the longitudinal direction and the left-right direction of the guide rails coincide with each other. The guide block of the guide mechanism 26 is fixed to the lower surface side of the slide member 24. This guide block is engaged with the guide rail from above.

移動機構１０のモータが駆動して、ボールねじ２５のネジ軸が回転すると、回動機構１１が搭載されるスライド部材２４がガイド機構２６のガイドレールに案内されて左右方向に移動する。すなわち、移動機構１０は、ピン保持部材８と一緒に回動機構１１を左右方向に移動させる。移動機構１０によって移動するスライド部材２４の左右方向の移動可能量は、たとえば、１００（ｍｍ）である。 When the motor of the moving mechanism 10 is driven and the screw shaft of the ball screw 25 is rotated, the slide member 24 on which the rotating mechanism 11 is mounted is guided by the guide rail of the guide mechanism 26 and moves in the left-right direction. That is, the moving mechanism 10 moves the rotating mechanism 11 in the left-right direction together with the pin holding member 8. The movable amount of the slide member 24 moved by the moving mechanism 10 in the left-right direction is, for example, 100 (mm).

移動機構９は、図５に示すように、ボールねじ２５のネジ軸およびガイド機構２６のガイドレールが取り付けられるスライド部材２８と、スライド部材２８を前後方向に移動させるモータ２９と、モータ２９の動力をスライド部材２８に伝達する動力伝達機構３０と、スライド部材２８を前後方向に案内するガイド機構３１とを備えている。移動機構１０のモータ、ボールねじ２５のネジ軸およびガイド機構２６のガイドレールは、スライド部材２８の上面側に取り付けられており、移動機構１０は、スライド部材２８に搭載されている。 As shown in FIG. 5, the moving mechanism 9 includes a slide member 28 to which the screw shaft of the ball screw 25 and the guide rail of the guide mechanism 26 are attached, a motor 29 for moving the slide member 28 in the front-rear direction, and power of the motor 29. Is provided with a power transmission mechanism 30 for transmitting the above to the slide member 28, and a guide mechanism 31 for guiding the slide member 28 in the front-rear direction. The motor of the moving mechanism 10, the screw shaft of the ball screw 25, and the guide rail of the guide mechanism 26 are attached to the upper surface side of the slide member 28, and the moving mechanism 10 is mounted on the slide member 28.

モータ２９および動力伝達機構３０は、スライド部材２８の右端側に配置されている。モータ２９は、フレーム１２に固定されている。動力伝達機構３０は、たとえば、モータ２９の動力で回転する駆動プーリ、従動プーリ、および、駆動プーリと従動プーリとに架け渡されるベルト等を備えている。駆動プーリおよび従動プーリは、フレーム１２に回転可能に支持されている。ベルトの一部は、スライド部材２８に固定されている。 The motor 29 and the power transmission mechanism 30 are arranged on the right end side of the slide member 28. The motor 29 is fixed to the frame 12. The power transmission mechanism 30 includes, for example, a drive pulley that is rotated by the power of the motor 29, a driven pulley, and a belt that is bridged between the drive pulley and the driven pulley. The drive pulley and the driven pulley are rotatably supported by the frame 12. A part of the belt is fixed to the slide member 28.

ガイド機構３１は、フレーム１２の底面部に固定されるガイドレールと、ガイドレールに係合するガイドブロックとを備えている。ガイド機構３１は、スライド部材２８の左右の両端側のそれぞれに配置されている。ガイド機構３１のガイドレールは、フレーム１２の底面部の上面側に固定されている。このガイドレールは、ガイドレールの長手方向と前後方向とが一致するように配置されている。ガイド機構３１のガイドブロックは、スライド部材２８の下面側に固定されている。このガイドブロックは、上側からガイドレールに係合している。 The guide mechanism 31 includes a guide rail fixed to the bottom surface of the frame 12 and a guide block that engages with the guide rail. The guide mechanism 31 is arranged on each of the left and right ends of the slide member 28. The guide rail of the guide mechanism 31 is fixed to the upper surface side of the bottom surface portion of the frame 12. The guide rails are arranged so that the longitudinal direction and the front-rear direction of the guide rails coincide with each other. The guide block of the guide mechanism 31 is fixed to the lower surface side of the slide member 28. This guide block is engaged with the guide rail from above.

モータ２９が駆動して、動力伝達機構３０の駆動プーリ等が回転すると、移動機構１０が搭載されるスライド部材２８がガイド機構３１のガイドレールに案内されて前後方向に移動する。すなわち、移動機構９は、ピン保持部材８と一緒に回動機構１１および移動機構１０を前後方向に移動させる。また、移動機構９は、上述のように、ピン保持部材８に載置される基板２を後ろ側へ搬送する。上述のように、基板搬送装置１による基板２の搬送量は、たとえば、８〜９（ｍ）となっており、移動機構９によって移動するスライド部材２８の前後方向の移動可能量は、８〜９（ｍ）となっている。 When the motor 29 is driven and the drive pulley or the like of the power transmission mechanism 30 is rotated, the slide member 28 on which the moving mechanism 10 is mounted is guided by the guide rail of the guide mechanism 31 and moves in the front-rear direction. That is, the moving mechanism 9 moves the rotating mechanism 11 and the moving mechanism 10 in the front-rear direction together with the pin holding member 8. Further, as described above, the moving mechanism 9 conveys the substrate 2 mounted on the pin holding member 8 to the rear side. As described above, the transfer amount of the substrate 2 by the substrate transfer device 1 is, for example, 8 to 9 (m), and the movable amount of the slide member 28 moved by the moving mechanism 9 in the front-rear direction is 8 to 9. It is 9 (m).

（データ読取機構、検知機構および割れ検知機構の構成）
図７は、図２のＪ部の構成を説明するための図である。図８は、図１に示す基板搬送装置１での基板２の位置補正方法を説明するための図である。 (Configuration of data reading mechanism, detection mechanism and crack detection mechanism)
FIG. 7 is a diagram for explaining the configuration of the J portion of FIG. FIG. 8 is a diagram for explaining a method of correcting the position of the substrate 2 in the substrate transport device 1 shown in FIG.

データ読取機構１４は、基板２の端部に記録された光学的に読取可能なデータを読み取るカメラ等を備えている。データ読取機構１４のカメラは、複数本の支持ピン７に載置される基板２よりも上側に配置されている。また、データ読取機構１４のカメラは、たとえば、基板搬送装置１の前端部に配置されており、基板２の前端部の上面に記録されたデータを読み取る。具体的には、データ読取機構１４のカメラは、基板２の上面の二次元バーコードを読み取る。二次元バーコードには、基板２のＩＤコードが記録されている。 The data reading mechanism 14 includes a camera or the like that reads optically readable data recorded on the edge of the substrate 2. The camera of the data reading mechanism 14 is arranged above the substrate 2 mounted on the plurality of support pins 7. Further, the camera of the data reading mechanism 14 is arranged at the front end portion of the substrate transfer device 1, for example, and reads the data recorded on the upper surface of the front end portion of the substrate 2. Specifically, the camera of the data reading mechanism 14 reads the two-dimensional bar code on the upper surface of the substrate 2. The ID code of the substrate 2 is recorded on the two-dimensional bar code.

検知機構１５は、基板搬送装置１の後端部に配置されている。検知機構１５は、基板２の左右方向の位置および前後方向に対する傾きを検知するための２個のセンサ３３と、基板２の前後方向の位置を検知するための１個のセンサ３４とを備えている。センサ３３、３４は、発光部３５と受光部３６とを有する透過型の光学式センサである。また、センサ３３、３４は、直線状に配列される複数の受光素子を備えるラインセンサである。センサ３３、３４の発光部３５および受光部３６は、複数本の支持ピン７に載置される基板２の端部を上下方向で挟むように配置されている。 The detection mechanism 15 is arranged at the rear end of the substrate transfer device 1. The detection mechanism 15 includes two sensors 33 for detecting the position of the substrate 2 in the left-right direction and the inclination in the front-rear direction, and one sensor 34 for detecting the position of the substrate 2 in the front-rear direction. There is. The sensors 33 and 34 are transmissive optical sensors having a light emitting unit 35 and a light receiving unit 36. Further, the sensors 33 and 34 are line sensors including a plurality of light receiving elements arranged in a straight line. The light emitting unit 35 and the light receiving unit 36 of the sensors 33 and 34 are arranged so as to sandwich the end portions of the substrate 2 mounted on the plurality of support pins 7 in the vertical direction.

ラインセンサであるセンサ３３は、センサ３３の長手方向（受光素子の配列方向）と左右方向とが一致するように配置され、ラインセンサであるセンサ３４は、センサ３４の長手方向と前後方向とが一致するように配置されている。２個のセンサ３３のうちの一方のセンサ３３は、複数本の支持ピン７に載置される基板２の右端面の前端部を検知可能な位置に配置され、他方のセンサ３３は、複数本の支持ピン７に載置される基板２の右端面の後端部を検知可能な位置に配置されている。センサ３４は、複数本の支持ピン７に載置される基板２の後端面の左端部を検知可能な位置に配置されている。 The sensor 33, which is a line sensor, is arranged so that the longitudinal direction of the sensor 33 (arrangement direction of the light receiving elements) and the left-right direction coincide with each other, and the sensor 34, which is a line sensor, has the longitudinal direction and the front-rear direction of the sensor 34. Arranged to match. One of the two sensors 33 is arranged at a position where the front end of the right end surface of the substrate 2 mounted on the plurality of support pins 7 can be detected, and the other sensor 33 is a plurality of sensors 33. The rear end portion of the right end surface of the substrate 2 mounted on the support pin 7 of the above is arranged at a position where it can be detected. The sensor 34 is arranged at a position where the left end portion of the rear end surface of the substrate 2 mounted on the plurality of support pins 7 can be detected.

本形態では、２個のセンサ３３による基板２の右端面の検知位置の差ΔＹ（図８（Ａ）参照）に基づいて、回動機構１１がピン保持部材８を回動させて基板２の前後方向に対する傾きを補正する。基板２の前後方向に対する傾きを補正するときには、たとえば、オペレータが、基板２の右端面の検知位置の差ΔＹを確認しながら、回動機構１１のジョグ操作を行って、基板２の前後方向に対する傾きを補正する（図８（Ｂ）参照）。あるいは、基板２の右端面の検知位置の差ΔＹに基づいて、基板２の前後方向に対する傾きΔθを自動で算出するとともに、傾きΔθ分、回動機構１１を駆動して、基板２の前後方向に対する傾きを補正する。 In this embodiment, the rotating mechanism 11 rotates the pin holding member 8 on the substrate 2 based on the difference ΔY (see FIG. 8A) in the detection positions of the right end surfaces of the substrate 2 by the two sensors 33. Correct the tilt in the front-back direction. When correcting the inclination of the substrate 2 in the front-rear direction, for example, the operator performs a jog operation of the rotating mechanism 11 while checking the difference ΔY of the detection positions on the right end surface of the substrate 2 with respect to the front-rear direction of the substrate 2. Correct the tilt (see FIG. 8B). Alternatively, the inclination Δθ with respect to the front-rear direction of the substrate 2 is automatically calculated based on the difference ΔY of the detection position of the right end surface of the substrate 2, and the rotation mechanism 11 is driven by the inclination Δθ to drive the rotation mechanism 11 in the front-rear direction of the substrate 2. Correct the tilt with respect to.

基板２の前後方向に対する傾きが補正されると、センサ３３による基板２の右端面の検知結果に基づいて、基準位置からの基板２の左右方向のずれ量ΔＹ１を自動で算出するともに、センサ３４による基板２の後端面の検知結果に基づいて、基準位置からの基板２の前後方向のずれ量ΔＸ１を自動で算出する（図８（Ｂ）参照）。また、ずれ量ΔＹ１分、移動機構１０を駆動するとともに、ずれ量ΔＸ１分、移動機構９を駆動して、基板２の前後左右方向の位置を補正する。 When the inclination of the substrate 2 in the front-rear direction is corrected, the amount of deviation ΔY1 in the left-right direction of the substrate 2 from the reference position is automatically calculated based on the detection result of the right end surface of the substrate 2 by the sensor 33, and the sensor 34 The amount of deviation ΔX1 in the front-rear direction of the substrate 2 from the reference position is automatically calculated based on the detection result of the rear end surface of the substrate 2 (see FIG. 8B). Further, the moving mechanism 10 is driven by the deviation amount ΔY 1 minute, and the moving mechanism 9 is driven by the deviation amount ΔX 1 minute to correct the position of the substrate 2 in the front-back and left-right directions.

割れ検知機構１６は、基板搬送装置１の前端側に配置されている。割れ検知機構１６は、支持ピン７よりも上側に配置される複数のカメラ３８および照明３９を備えている。複数のカメラ３８は、左右方向に配列されている。照明３９は、カメラ３８よりも下側に配置されている。複数のカメラ３８および照明３９は、支持フレーム４０に取り付けられている。支持フレーム４０は、フレーム１２の上端面に固定されている。照明３９は、カメラ３８の下側を通過する基板２の上面に光を照射する。カメラ３８は、カメラ３８の下側を通過する基板２の上面の画像を撮影する。割れ検知機構１６は、カメラ３８で撮影された画像に基づいて、基板２の前端部、後端部、右端部および左端部の割れ（欠け）の有無を検知する。 The crack detection mechanism 16 is arranged on the front end side of the substrate transfer device 1. The crack detection mechanism 16 includes a plurality of cameras 38 and illuminations 39 arranged above the support pins 7. The plurality of cameras 38 are arranged in the left-right direction. The illumination 39 is arranged below the camera 38. The plurality of cameras 38 and the illumination 39 are attached to the support frame 40. The support frame 40 is fixed to the upper end surface of the frame 12. The illumination 39 irradiates the upper surface of the substrate 2 passing under the camera 38 with light. The camera 38 captures an image of the upper surface of the substrate 2 passing under the camera 38. The crack detection mechanism 16 detects the presence or absence of cracks (chips) in the front end portion, the rear end portion, the right end portion, and the left end portion of the substrate 2 based on the image taken by the camera 38.

図５に示すように、前後方向において割れ検知機構１６が配置される箇所には、低反射部材４１が配置されている。低反射部材４１は、長方形の平板状に形成されている。低反射部材４１は、カメラ３８の下側に配置されている。また、低反射部材４１は、複数本の支持ピン７に載置される基板２よりも下側に配置されている。低反射部材４１は、左右の両端側の２箇所に配置されている。また、低反射部材４１は、カメラ３８の下側を通過するピン保持部材８の左右方向の外側に配置されている。 As shown in FIG. 5, a low reflection member 41 is arranged at a position where the crack detection mechanism 16 is arranged in the front-rear direction. The low reflection member 41 is formed in a rectangular flat plate shape. The low reflection member 41 is arranged below the camera 38. Further, the low reflection member 41 is arranged below the substrate 2 mounted on the plurality of support pins 7. The low-reflection members 41 are arranged at two locations on the left and right ends. Further, the low reflection member 41 is arranged outside the pin holding member 8 passing under the camera 38 in the left-right direction.

上側から見たときに、低反射部材４１の一部は、カメラ３８の下側を通過する基板２の左右方向の端面よりも左右方向の外側に配置されている。すなわち、右側に配置される低反射部材４１の右側部分は、基板２の右端面よりも右側に配置され、右側に配置される低反射部材４１の左側部分は、上下方向において基板２の右端部と重なっている。また、左側に配置される低反射部材４１の左側部分は、基板２の左端面よりも左側に配置され、左側に配置される低反射部材４１の右側部分は、上下方向において基板２の左端部と重なっている。なお、上側から見たときに、低反射部材４１の全体が基板２の左右方向の端面より左右方向の外側に配置されていても良い。 When viewed from above, a part of the low reflection member 41 is arranged outside the left-right end surface of the substrate 2 passing under the camera 38 in the left-right direction. That is, the right side portion of the low reflection member 41 arranged on the right side is arranged on the right side of the right end surface of the substrate 2, and the left side portion of the low reflection member 41 arranged on the right side is the right end portion of the substrate 2 in the vertical direction. It overlaps with. Further, the left side portion of the low reflection member 41 arranged on the left side is arranged on the left side of the left end surface of the substrate 2, and the right side portion of the low reflection member 41 arranged on the left side is the left end portion of the substrate 2 in the vertical direction. It overlaps with. When viewed from above, the entire low-reflection member 41 may be arranged outside the left-right end surface of the substrate 2 in the left-right direction.

低反射部材４１の上面は、黒色となっている。また、低反射部材４１の上面は、左右方向の外側に向かうにしたがって下側に向かうように傾斜する傾斜面となっている。すなわち、右側に配置される低反射部材４１の上面は、右側に向かうにしたがって下側に向かうように傾斜する傾斜面となっており、左側に配置される低反射部材４１の上面は、左側に向かうにしたがって下側に向かうように傾斜する傾斜面となっている。また、本形態では、カメラ３８の下側であってかつ基板２よりも下側に配置される部材の上面は、黒色となっている。 The upper surface of the low reflection member 41 is black. Further, the upper surface of the low reflection member 41 is an inclined surface that inclines downward toward the outside in the left-right direction. That is, the upper surface of the low-reflection member 41 arranged on the right side is an inclined surface that inclines downward toward the right side, and the upper surface of the low-reflection member 41 arranged on the left side is on the left side. It is an inclined surface that inclines downward as it goes toward it. Further, in the present embodiment, the upper surface of the member arranged below the camera 38 and below the substrate 2 is black.

（基板搬送装置の動作）
基板搬送装置１では、スライド部材２８が基板搬送装置１の前端部に配置された状態で、上流側のロボットが複数本の支持ピン７に基板２を載置する。このときには、上流側のロボットのハンドフォーク４が基板搬送装置１の前端部に入り込む（図１、図２参照）。ハンドフォーク４は、支持ピン７およびピン固定部材１９と干渉しない位置で、基板搬送装置１の前端部に入り込む。複数本の支持ピン７に基板２が載置されると、回動機構１１が基板２を１８０°回動させる。 (Operation of board transfer device)
In the board transfer device 1, the robot on the upstream side mounts the board 2 on a plurality of support pins 7 in a state where the slide member 28 is arranged at the front end portion of the board transfer device 1. At this time, the hand fork 4 of the robot on the upstream side enters the front end portion of the substrate transfer device 1 (see FIGS. 1 and 2). The hand fork 4 enters the front end portion of the substrate transport device 1 at a position where it does not interfere with the support pin 7 and the pin fixing member 19. When the substrate 2 is placed on the plurality of support pins 7, the rotating mechanism 11 rotates the substrate 2 by 180 °.

基板２が１８０°回動すると、データ読取機構１４が基板２に記録されたデータを読み取る。また、基板２に記録されたデータが読み取られると、移動機構９がスライド部材２８を後ろ側へ移動させて基板２を後ろ側へ搬送する。割れ検知機構１６は、搬送される基板２の端部の割れの有無を検知する。すなわち、移動機構９が基板２を後ろ側へ搬送しながら、割れ検知機構１６が基板２の端部の割れの有無を検知する。割れ検知機構１６が基板２の端部の割れの有無を検知するときには、移動機構９は、基板２の搬送速度を下げる。 When the substrate 2 rotates 180 °, the data reading mechanism 14 reads the data recorded on the substrate 2. When the data recorded on the substrate 2 is read, the moving mechanism 9 moves the slide member 28 to the rear side and conveys the substrate 2 to the rear side. The crack detection mechanism 16 detects the presence or absence of cracks at the end portion of the conveyed substrate 2. That is, while the moving mechanism 9 conveys the substrate 2 to the rear side, the crack detection mechanism 16 detects the presence or absence of cracks at the end portion of the substrate 2. When the crack detection mechanism 16 detects the presence or absence of cracks at the end portion of the substrate 2, the moving mechanism 9 reduces the transport speed of the substrate 2.

割れ検知機構１６で基板２の端部の割れの有無が検知されると、移動機構９は、基板２の搬送速度を上げる。基板２が基板搬送装置１の後端部に到達して停止すると（すなわち、スライド部材２８が基板搬送装置１の後端部に到達して停止すると）、検知機構１５によって、基板２の前後方向の位置、左右方向の位置および前後方向に対する傾きが検知される。移動機構９、１０および回動機構１１は、検知機構１５の検知結果に基づいて、上述のように、基板２の前後方向に対する傾きおよび前後左右方向の位置を補正する。 When the crack detection mechanism 16 detects the presence or absence of cracks at the end of the substrate 2, the moving mechanism 9 increases the transport speed of the substrate 2. When the substrate 2 reaches the rear end of the substrate transfer device 1 and stops (that is, when the slide member 28 reaches the rear end of the substrate transfer device 1 and stops), the detection mechanism 15 causes the substrate 2 to move in the front-rear direction. Position, position in the left-right direction, and inclination with respect to the front-back direction are detected. Based on the detection result of the detection mechanism 15, the moving mechanisms 9, 10 and the rotating mechanism 11 correct the inclination of the substrate 2 with respect to the front-rear direction and the position in the front-back and left-right directions as described above.

基板２の位置が補正されると、複数本の支持ピン７に載置される基板２を下流側のロボットが取り出す。このときには、下流側のロボットのハンドフォーク４が基板搬送装置１の後端部に入り込む（図１、図２参照）。ハンドフォーク４は、支持ピン７およびピン固定部材１９と干渉しない位置で、基板搬送装置１の後端部に入り込む（図３参照）。 When the position of the board 2 is corrected, the robot on the downstream side takes out the board 2 mounted on the plurality of support pins 7. At this time, the hand fork 4 of the robot on the downstream side enters the rear end portion of the substrate transfer device 1 (see FIGS. 1 and 2). The hand fork 4 enters the rear end of the substrate transfer device 1 at a position where it does not interfere with the support pin 7 and the pin fixing member 19 (see FIG. 3).

（本形態の主な効果）
以上説明したように、本形態の基板搬送装置１は、前後方向にピン保持部材８を移動させる移動機構９と、左右方向にピン保持部材８を移動させる移動機構１０と、上下方向を回動の軸方向としてピン保持部材８を回動させる回動機構１１とを備えている。そのため、本形態では、基板２を持ち上げなくても、複数本の支持ピン７に載置される基板２を回動機構１１によって回動させて基板２の向きを変えることができる。また、本形態では、基板２を持ち上げなくても、複数本の支持ピン７に載置される基板２を回動機構１１によって回動させ、移動機構１０によって左右方向に移動させるとともに移動機構９によって前後方向に移動させて基板２の位置補正を行うことができる。 (Main effect of this form)
As described above, the substrate transport device 1 of the present embodiment has a moving mechanism 9 for moving the pin holding member 8 in the front-rear direction, a moving mechanism 10 for moving the pin holding member 8 in the left-right direction, and rotating in the vertical direction. It is provided with a rotation mechanism 11 that rotates the pin holding member 8 in the axial direction of the above. Therefore, in this embodiment, the orientation of the substrate 2 can be changed by rotating the substrate 2 mounted on the plurality of support pins 7 by the rotating mechanism 11 without lifting the substrate 2. Further, in the present embodiment, the substrate 2 mounted on the plurality of support pins 7 is rotated by the rotating mechanism 11 and moved in the left-right direction by the moving mechanism 10 without lifting the substrate 2, and the moving mechanism 9 is used. The position of the substrate 2 can be corrected by moving the substrate 2 in the front-rear direction.

すなわち、本形態では、基板２を持ち上げなくても、基板２を回動させて基板２の向きを変えたり、基板２の位置補正を行ったりすることができる。したがって、本形態では、基板搬送装置１において、基板２を回動させて基板２の向きを変えたり、基板２の位置補正を行ったりする場合であっても、基板搬送装置１が組み込まれて使用される液晶表示装置の製造ラインのサイクルタイムを短縮することが可能になる。 That is, in the present embodiment, the orientation of the substrate 2 can be changed or the position of the substrate 2 can be corrected by rotating the substrate 2 without lifting the substrate 2. Therefore, in the present embodiment, in the substrate transfer device 1, the substrate transfer device 1 is incorporated even when the substrate 2 is rotated to change the orientation of the substrate 2 or the position of the substrate 2 is corrected. It is possible to shorten the cycle time of the production line of the liquid crystal display device used.

本形態では、移動機構９が基板２を後ろ側へ搬送しながら、割れ検知機構１６が基板２の端部の割れの有無を検知している。そのため、本形態では、割れ検知機構１６によって基板２の端部の割れの有無を検知する場合であっても、基板搬送装置１が組み込まれて使用される液晶表示装置の製造ラインのサイクルタイムを短縮することが可能になる。また、本形態では、複数本の支持ピン７に吸着支持ピン７Ａが含まれているため、複数本の支持ピン７に載置される基板２のずれを確実に防止することが可能になる。 In this embodiment, the moving mechanism 9 conveys the substrate 2 to the rear side, while the crack detecting mechanism 16 detects the presence or absence of cracks at the end portion of the substrate 2. Therefore, in the present embodiment, even when the crack detection mechanism 16 detects the presence or absence of cracks at the end of the substrate 2, the cycle time of the manufacturing line of the liquid crystal display device in which the substrate transfer device 1 is incorporated and used is set. It will be possible to shorten it. Further, in the present embodiment, since the suction support pins 7A are included in the plurality of support pins 7, it is possible to reliably prevent the substrate 2 mounted on the plurality of support pins 7 from being displaced.

本形態では、基板２よりも下側に配置される低反射部材４１の一部は、基板２の左右方向の端面よりも左右方向の外側に配置されている。また、本形態では、低反射部材４１の上面は黒色になっているとともに、左右方向の外側に向かうにしたがって下側に向かうように傾斜する傾斜面となっている。そのため、本形態では、割れ検知機構１６によって基板２の端部の割れの有無を検知する際に、基板２の左右方向の端面の外側でカメラ３８に向かって照明光が反射されにくくなる。したがって、本形態では、基板２の左右の両端部の割れの有無を精度良く検知することが可能になる。 In the present embodiment, a part of the low-reflection member 41 arranged below the substrate 2 is arranged outside the left-right end surface of the substrate 2 in the left-right direction. Further, in the present embodiment, the upper surface of the low-reflection member 41 is black, and is an inclined surface that inclines downward toward the outside in the left-right direction. Therefore, in the present embodiment, when the crack detection mechanism 16 detects the presence or absence of cracks at the end portion of the substrate 2, the illumination light is less likely to be reflected toward the camera 38 outside the end face in the left-right direction of the substrate 2. Therefore, in this embodiment, it is possible to accurately detect the presence or absence of cracks at both left and right ends of the substrate 2.

また、本形態では、カメラ３８の下側であってかつ基板２よりも下側に配置される部材の上面が黒色となっているため、割れ検知機構１６によって基板２の端部の割れを検知する際に、基板２の端面の外側で照明光がカメラ３８に向かって反射されにくくなる。したがって、本形態では、基板２の端部の割れの有無を精度良く検知することが可能になる。 Further, in the present embodiment, since the upper surface of the member arranged below the camera 38 and below the substrate 2 is black, the crack detection mechanism 16 detects the crack at the end of the substrate 2. At that time, the illumination light is less likely to be reflected toward the camera 38 on the outside of the end surface of the substrate 2. Therefore, in this embodiment, it is possible to accurately detect the presence or absence of cracks at the end portion of the substrate 2.

（他の実施の形態）
上述した形態は、本発明の好適な形態の一例ではあるが、これに限定されるものではなく本発明の要旨を変更しない範囲において種々変形実施が可能である。 (Other embodiments)
The above-described embodiment is an example of a preferred embodiment of the present invention, but the present invention is not limited to this, and various modifications can be carried out without changing the gist of the present invention.

上述した形態において、回動機構１１は、基板２を９０°回動させても良いし、基板２を２７０°回動させても良い。また、上述した形態において、移動機構１０が、ピン保持部材８と一緒に回動機構１１および移動機構９を左右方向に移動させても良い。この場合には、移動機構９は、ピン保持部材８と一緒に回動機構１１を前後方向に移動させる。 In the above-described embodiment, the rotation mechanism 11 may rotate the substrate 2 by 90 ° or may rotate the substrate 2 by 270 °. Further, in the above-described embodiment, the moving mechanism 10 may move the rotating mechanism 11 and the moving mechanism 9 in the left-right direction together with the pin holding member 8. In this case, the moving mechanism 9 moves the rotating mechanism 11 in the front-rear direction together with the pin holding member 8.

上述した形態において、移動機構９が基板２を後ろ側へ搬送しながら、回動機構１１がピン保持部材８を１８０°回動させて、基板２を１８０°回動させても良い。この場合には、基板２を後ろ側へ搬送しながら基板２を回動させて基板２の向きを変えることができるため、基板搬送装置１において、基板２を回動させて基板２の向きを変える場合であっても、基板搬送装置１が組み込まれて使用される液晶表示装置の製造ラインのサイクルタイムをより短縮することが可能になる。なお、基板２を後ろ側へ搬送しながら、回動機構１１が基板２を９０°回動させても良いし、基板２を２７０°回動させても良い。 In the above-described embodiment, the rotating mechanism 11 may rotate the pin holding member 8 by 180 ° and the substrate 2 may be rotated by 180 ° while the moving mechanism 9 conveys the substrate 2 to the rear side. In this case, the orientation of the substrate 2 can be changed by rotating the substrate 2 while transporting the substrate 2 to the rear side. Therefore, in the substrate transport device 1, the substrate 2 is rotated to change the orientation of the substrate 2. Even when changing, the cycle time of the production line of the liquid crystal display device in which the substrate transfer device 1 is incorporated and used can be further shortened. The rotating mechanism 11 may rotate the substrate 2 by 90 ° or the substrate 2 by 270 ° while transporting the substrate 2 to the rear side.

上述した形態において、検知機構１５は、基板搬送装置１の前端部に配置されていても良い。この場合には、たとえば、基板２を後ろ側へ搬送しながら、基板２の前後方向に対する傾きおよび前後左右方向の位置を補正する。すなわち、移動機構９が基板２を後ろ側へ搬送しながら、移動機構１０がピン保持部材８および回動機構１１を左右方向に移動させるとともに、回動機構１１がピン保持部材８を回動させて、基板２の前後方向に対する傾きおよび前後左右方向の位置を補正する。 In the above-described embodiment, the detection mechanism 15 may be arranged at the front end portion of the substrate transfer device 1. In this case, for example, while transporting the substrate 2 to the rear side, the inclination of the substrate 2 with respect to the front-rear direction and the position in the front-back and left-right directions are corrected. That is, while the moving mechanism 9 conveys the substrate 2 to the rear side, the moving mechanism 10 moves the pin holding member 8 and the rotating mechanism 11 in the left-right direction, and the rotating mechanism 11 rotates the pin holding member 8. The tilt of the substrate 2 with respect to the front-rear direction and the position in the front-back and left-right directions are corrected.

この場合には、後ろ側に基板２を搬送しながら、基板２の位置補正を行うことができるため、基板搬送装置１において、基板２の位置補正を行う場合であっても、基板搬送装置１が組み込まれて使用される液晶表示装置の製造ラインのサイクルタイムをより短縮することが可能になる。この場合には、２個のセンサ３３による基板２の右端面の検知位置の差ΔＹに基づいて、基板２の前後方向に対する傾きΔθが自動で算出されて、傾きΔθ分、回動機構１１が駆動する。なお、検知機構１５が基板搬送装置１の前端部に配置されている場合に、基板搬送装置１の前端部において、上述した形態と同様に、基板２の前後方向に対する傾きおよび前後左右方向の位置を補正しても良い。 In this case, since the position of the substrate 2 can be corrected while the substrate 2 is conveyed to the rear side, the substrate transfer device 1 even when the position of the substrate 2 is corrected in the substrate transfer device 1. It becomes possible to further shorten the cycle time of the production line of the liquid crystal display device used by incorporating the above. In this case, the inclination Δθ with respect to the front-rear direction of the substrate 2 is automatically calculated based on the difference ΔY of the detection positions of the right end surfaces of the substrate 2 by the two sensors 33, and the rotation mechanism 11 rotates by the inclination Δθ. Drive. When the detection mechanism 15 is arranged at the front end portion of the substrate transport device 1, the inclination of the substrate 2 with respect to the front-rear direction and the position in the front-rear left-right direction at the front end portion of the substrate transport device 1 are the same as in the above-described embodiment. May be corrected.

上述した形態において、基板搬送装置１は、ピン固定部材１９を左右方向に移動させる固定部材移動機構を備えていても良い。この場合には、ハンド３のハンドフォーク４の本数やピッチが変わっても、基板搬送装置１に基板２を受け渡す際の、支持ピン７およびピン固定部材１９と、ハンドフォーク４との干渉を防止することが可能になる。また、上述した形態において、検知機構１５は、基板２の前後方向の位置および左右方向に対する傾きを検知するための２個のセンサと、基板２の左右方向の位置を検知するための１個のセンサとを備えていても良い。 In the above-described embodiment, the substrate transfer device 1 may include a fixing member moving mechanism for moving the pin fixing member 19 in the left-right direction. In this case, even if the number and pitch of the hand forks 4 of the hand 3 change, the support pins 7 and the pin fixing members 19 and the hand forks 4 interfere with each other when the board 2 is delivered to the board transfer device 1. It becomes possible to prevent. Further, in the above-described embodiment, the detection mechanism 15 has two sensors for detecting the position of the substrate 2 in the front-rear direction and the inclination in the left-right direction, and one sensor for detecting the position of the substrate 2 in the left-right direction. It may be provided with a sensor.

上述した形態において、データ読取機構１４は、基板搬送装置１の後端部に配置されていても良い。また、上述した形態において、基板搬送装置１は、割れ検知機構１６を備えていなくても良い。また、上述した形態において、基板搬送装置１で搬送される基板２は、液晶表示装置以外の装置で使用されるガラス基板であっても良いし、ガラス基板以外の基板であっても良い。なお、基板搬送装置１は、ピン保持部材８を昇降させる昇降機構を備えていても良い。 In the above-described embodiment, the data reading mechanism 14 may be arranged at the rear end of the substrate transfer device 1. Further, in the above-described embodiment, the substrate transfer device 1 does not have to include the crack detection mechanism 16. Further, in the above-described embodiment, the substrate 2 transported by the substrate transport device 1 may be a glass substrate used in a device other than the liquid crystal display device, or may be a substrate other than the glass substrate. The substrate transfer device 1 may include an elevating mechanism for elevating and lowering the pin holding member 8.

１ 基板搬送装置
２ 基板
７ 支持ピン
７Ａ 吸着支持ピン
８ ピン保持部材
９ 移動機構（第１移動機構）
１０ 移動機構（第２移動機構）
１１ 回動機構
１４ データ読取機構
１５ 検知機構
１６ 割れ検知機構
３８ カメラ
３９ 照明
４１ 低反射部材
Ｘ 第１方向
Ｙ 第２方向 1 Substrate transfer device 2 Substrate 7 Support pin 7A Suction support pin 8 Pin holding member 9 Movement mechanism (first movement mechanism)
10 Moving mechanism (second moving mechanism)
11 Rotation mechanism 14 Data reading mechanism 15 Detection mechanism 16 Crack detection mechanism 38 Camera 39 Lighting 41 Low-reflection member X 1st direction Y 2nd direction

Claims (10)

基板を搬送する基板搬送装置において、
前記基板が載置される複数本の支持ピンと、複数本の前記支持ピンを保持するピン保持部材と、水平方向のうちの所定の方向である第１方向に前記ピン保持部材を移動させて前記基板を搬送する第１移動機構と、上下方向と第１方向とに直交する第２方向に前記ピン保持部材を移動させる第２移動機構と、上下方向を回動の軸方向として前記ピン保持部材を回動させる回動機構とを備え、
前記第１移動機構は、前記ピン保持部材と一緒に前記回動機構を第１方向に移動させることを特徴とする基板搬送装置。 In a substrate transfer device that conveys a substrate
The pin holding member is moved by moving the plurality of support pins on which the substrate is placed, the pin holding member for holding the plurality of the support pins, and the pin holding member in the first direction which is a predetermined direction in the horizontal direction. A first moving mechanism for transporting a substrate, a second moving mechanism for moving the pin holding member in a second direction orthogonal to the vertical direction and the first direction, and the pin holding member with the vertical direction as the axial direction of rotation. Equipped with a rotation mechanism to rotate
The first moving mechanism is a substrate transfer device characterized in that the rotating mechanism is moved in a first direction together with the pin holding member. 複数本の前記支持ピンには、前記基板の下面を吸着して前記基板を把持する吸着支持ピンが含まれていることを特徴とする請求項１記載の基板搬送装置。 The substrate transfer device according to claim 1, wherein the plurality of the support pins include suction support pins that attract the lower surface of the substrate to grip the substrate. 前記第２移動機構は、前記ピン保持部材と一緒に前記回動機構を第２方向に移動させ、
前記第１移動機構は、前記ピン保持部材と一緒に前記回動機構および前記第２移動機構を第１方向に移動させることを特徴とする請求項１または２記載の基板搬送装置。 The second moving mechanism moves the rotating mechanism in the second direction together with the pin holding member.
The substrate transfer device according to claim 1 or 2, wherein the first moving mechanism moves the rotating mechanism and the second moving mechanism in a first direction together with the pin holding member. 前記第１移動機構が前記基板を第１方向の一方に搬送しながら、前記回動機構が前記ピン保持部材を回動させることを特徴とする請求項１から３のいずれかに記載の基板搬送装置。 The substrate transfer according to any one of claims 1 to 3, wherein the rotating mechanism rotates the pin holding member while the first moving mechanism conveys the substrate in one of the first directions. apparatus. 前記第１移動機構が前記基板を第１方向の一方に搬送しながら、前記第２移動機構が前記ピン保持部材および前記回動機構を第２方向に移動させるとともに、前記回動機構が前記ピン保持部材を回動させることを特徴とする請求項３記載の基板搬送装置。 While the first moving mechanism conveys the substrate in one of the first directions, the second moving mechanism moves the pin holding member and the rotating mechanism in the second direction, and the rotating mechanism moves the pin. The substrate transfer device according to claim 3, wherein the holding member is rotated. 複数本の前記支持ピンに載置される前記基板の、第１方向の位置と第２方向の位置と第１方向または第２方向に対する傾きとを検知するための検知機構を備えることを特徴とする請求項１から５のいずれかに記載の基板搬送装置。 It is characterized by including a detection mechanism for detecting a position in a first direction, a position in a second direction, and an inclination with respect to the first direction or the second direction of the substrate mounted on a plurality of the support pins. The substrate transfer device according to any one of claims 1 to 5. 前記基板に記録されたデータを読み取るデータ読取機構を備えることを特徴とする請求項１から６のいずれかに記載の基板搬送装置。 The substrate transfer device according to any one of claims 1 to 6, further comprising a data reading mechanism for reading data recorded on the substrate. 前記基板の端部の割れの有無を検知するための割れ検知機構を備え、
前記割れ検知機構は、前記支持ピンよりも上側に配置されるカメラおよび照明を備え、
前記第１搬送機構が前記基板を第１方向の一方に搬送しながら、前記割れ検知機構が前記基板の端部の割れの有無を検知することを特徴とする請求項１から７のいずれかに記載の基板搬送装置。 A crack detection mechanism for detecting the presence or absence of cracks at the edges of the substrate is provided.
The crack detection mechanism comprises a camera and illumination located above the support pins.
The invention according to any one of claims 1 to 7, wherein the crack detection mechanism detects the presence or absence of cracks at the end portion of the substrate while the first transport mechanism transports the substrate in one of the first directions. The substrate transfer device described. 前記カメラの下側であってかつ前記基板よりも下側に配置されるとともに、上側から見たときに少なくとも一部が前記基板の第２方向の端面よりも第２方向の外側に配置される低反射部材を備え、
前記低反射部材の上面は、黒色であり、かつ、第２方向の外側に向かうにしたがって下側に向かうように傾斜する傾斜面となっていることを特徴とする請求項８記載の基板搬送装置。 It is arranged below the camera and below the substrate, and at least a part of the substrate is arranged outside the end face of the substrate in the second direction when viewed from above. Equipped with low reflection member,
The substrate transport device according to claim 8, wherein the upper surface of the low-reflection member is black and has an inclined surface that inclines downward toward the outside in the second direction. .. 前記カメラの下側であってかつ前記基板よりも下側に配置される部材の上面が黒色となっていることを特徴とする請求項８または９記載の基板搬送装置。 The substrate transfer device according to claim 8 or 9, wherein the upper surface of the member arranged below the camera and below the substrate is black.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220099586A1 (en) * 2020-09-25 2022-03-31 Hongfujin Precision Electronics (Zhengzhou) Co., Ltd. Detection device

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11214284A (en) * 1998-01-22 1999-08-06 Sharp Corp Photolithographical process apparatus
JPH11251398A (en) * 1998-02-26 1999-09-17 Dainippon Screen Mfg Co Ltd Device for carrying substrate, device for cleaning substrate using the same, and method for carrying substrate
JP2006088235A (en) * 2004-09-21 2006-04-06 Hirata Corp Substrate transfer-loading robot device
JP2006088295A (en) * 2004-09-27 2006-04-06 Nachi Fujikoshi Corp Broach
WO2009072199A1 (en) * 2007-12-05 2009-06-11 Hirata Corporation Substrate conveying apparatus and method of controlling the apparatus
JP2010541201A (en) * 2007-09-22 2010-12-24 ダイナミック マイクロシステムズ セミコンダクター イクイップメント ゲーエムベーハー Delivery mechanism with the ability to handle multiple wafers
JP2015170688A (en) * 2014-03-06 2015-09-28 株式会社ダイヘン Substrate damage detection device, substrate transfer robot including the same, and substrate damage detection method
JP2018120156A (en) * 2017-01-27 2018-08-02 日本電産サンキョー株式会社 Alignment device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2954332B2 (en) * 1990-11-28 1999-09-27 株式会社日立製作所 Image input method and device
JP2000200810A (en) * 1999-01-07 2000-07-18 Micronics Japan Co Ltd Prober
CN100472743C (en) * 2002-11-21 2009-03-25 奥林巴斯株式会社 Chip check apparatus
JP2008251754A (en) * 2007-03-29 2008-10-16 Nikon Corp Substrate transfer method and apparatus, and exposure method and device
CN203877491U (en) * 2014-05-16 2014-10-15 日东电工株式会社 Glass substrate feeder

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11214284A (en) * 1998-01-22 1999-08-06 Sharp Corp Photolithographical process apparatus
JPH11251398A (en) * 1998-02-26 1999-09-17 Dainippon Screen Mfg Co Ltd Device for carrying substrate, device for cleaning substrate using the same, and method for carrying substrate
JP2006088235A (en) * 2004-09-21 2006-04-06 Hirata Corp Substrate transfer-loading robot device
JP2006088295A (en) * 2004-09-27 2006-04-06 Nachi Fujikoshi Corp Broach
JP2010541201A (en) * 2007-09-22 2010-12-24 ダイナミック マイクロシステムズ セミコンダクター イクイップメント ゲーエムベーハー Delivery mechanism with the ability to handle multiple wafers
WO2009072199A1 (en) * 2007-12-05 2009-06-11 Hirata Corporation Substrate conveying apparatus and method of controlling the apparatus
JP2015170688A (en) * 2014-03-06 2015-09-28 株式会社ダイヘン Substrate damage detection device, substrate transfer robot including the same, and substrate damage detection method
JP2018120156A (en) * 2017-01-27 2018-08-02 日本電産サンキョー株式会社 Alignment device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220099586A1 (en) * 2020-09-25 2022-03-31 Hongfujin Precision Electronics (Zhengzhou) Co., Ltd. Detection device
US11965833B2 (en) * 2020-09-25 2024-04-23 Hongfujin Precision Electronics (Zhengzhou) Co., Ltd. Detection device

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