JP2020109744A - 保護素子用ヒューズ素子およびそれを利用した保護素子 - Google Patents
保護素子用ヒューズ素子およびそれを利用した保護素子 Download PDFInfo
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- 239000002184 metal Substances 0.000 claims abstract description 128
- 229910052751 metal Inorganic materials 0.000 claims abstract description 128
- 239000000758 substrate Substances 0.000 claims abstract description 53
- 239000007769 metal material Substances 0.000 claims abstract description 34
- 238000010438 heat treatment Methods 0.000 claims abstract description 18
- 239000002131 composite material Substances 0.000 claims abstract description 16
- 239000000956 alloy Substances 0.000 claims description 91
- 229910045601 alloy Inorganic materials 0.000 claims description 88
- 238000002844 melting Methods 0.000 claims description 29
- 230000008018 melting Effects 0.000 claims description 27
- 230000001681 protective effect Effects 0.000 claims description 24
- 239000000463 material Substances 0.000 claims description 15
- 229910052718 tin Inorganic materials 0.000 claims description 12
- 229910020836 Sn-Ag Inorganic materials 0.000 claims description 10
- 229910020988 Sn—Ag Inorganic materials 0.000 claims description 10
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 9
- 229910000679 solder Inorganic materials 0.000 claims description 9
- 229910020830 Sn-Bi Inorganic materials 0.000 claims description 6
- 229910020888 Sn-Cu Inorganic materials 0.000 claims description 6
- 229910020935 Sn-Sb Inorganic materials 0.000 claims description 6
- 229910020994 Sn-Zn Inorganic materials 0.000 claims description 6
- 229910018725 Sn—Al Inorganic materials 0.000 claims description 6
- 229910018728 Sn—Bi Inorganic materials 0.000 claims description 6
- 229910019204 Sn—Cu Inorganic materials 0.000 claims description 6
- 229910008757 Sn—Sb Inorganic materials 0.000 claims description 6
- 229910009069 Sn—Zn Inorganic materials 0.000 claims description 6
- 239000000155 melt Substances 0.000 claims description 6
- 229910016331 Bi—Ag Inorganic materials 0.000 claims description 4
- 229910017944 Ag—Cu Inorganic materials 0.000 claims description 3
- 229910001152 Bi alloy Inorganic materials 0.000 claims description 3
- 229910016334 Bi—In Inorganic materials 0.000 claims description 3
- 229910000846 In alloy Inorganic materials 0.000 claims description 3
- 229910018956 Sn—In Inorganic materials 0.000 claims description 3
- 229910009071 Sn—Zn—Bi Inorganic materials 0.000 claims description 3
- 239000000470 constituent Substances 0.000 claims 1
- 230000033228 biological regulation Effects 0.000 abstract description 3
- 230000020169 heat generation Effects 0.000 abstract description 3
- 230000009467 reduction Effects 0.000 abstract description 3
- 239000000126 substance Substances 0.000 abstract description 3
- 238000000151 deposition Methods 0.000 abstract 1
- 230000004927 fusion Effects 0.000 abstract 1
- 230000004907 flux Effects 0.000 description 8
- 229910052709 silver Inorganic materials 0.000 description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 7
- 239000004332 silver Substances 0.000 description 7
- 238000013459 approach Methods 0.000 description 6
- 230000007423 decrease Effects 0.000 description 6
- 238000005476 soldering Methods 0.000 description 6
- 229910001316 Ag alloy Inorganic materials 0.000 description 5
- 238000009792 diffusion process Methods 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000007791 liquid phase Substances 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000003870 refractory metal Substances 0.000 description 3
- 229920000106 Liquid crystal polymer Polymers 0.000 description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 229910000743 fusible alloy Inorganic materials 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000007790 solid phase Substances 0.000 description 2
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000006023 eutectic alloy Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002905 metal composite material Substances 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 235000013619 trace mineral Nutrition 0.000 description 1
- 239000011573 trace mineral Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/05—Component parts thereof
- H01H85/055—Fusible members
- H01H85/06—Fusible members characterised by the fusible material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0233—Sheets, foils
- B23K35/0238—Sheets, foils layered
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
- F02M—SUPPLYING COMBUSTION ENGINES IN GENERAL WITH COMBUSTIBLE MIXTURES OR CONSTITUENTS THEREOF
- F02M26/00—Engine-pertinent apparatus for adding exhaust gases to combustion-air, main fuel or fuel-air mixture, e.g. by exhaust gas recirculation [EGR] systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H37/00—Thermally-actuated switches
- H01H37/74—Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
- H01H37/76—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
- H01H37/761—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material with a fusible element forming part of the switched circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H71/00—Details of the protective switches or relays covered by groups H01H73/00 - H01H83/00
- H01H71/02—Housings; Casings; Bases; Mountings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/05—Component parts thereof
- H01H85/055—Fusible members
- H01H85/08—Fusible members characterised by the shape or form of the fusible member
- H01H85/11—Fusible members characterised by the shape or form of the fusible member with applied local area of a metal which, on melting, forms a eutectic with the main material of the fusible member, i.e. M-effect devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/05—Component parts thereof
- H01H85/143—Electrical contacts; Fastening fusible members to such contacts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/46—Circuit arrangements not adapted to a particular application of the protective device
- H01H2085/466—Circuit arrangements not adapted to a particular application of the protective device with remote controlled forced fusing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/0039—Means for influencing the rupture process of the fusible element
- H01H85/0047—Heating means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/46—Circuit arrangements not adapted to a particular application of the protective device
- H01H85/463—Circuit arrangements not adapted to a particular application of the protective device with printed circuit fuse
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Combustion & Propulsion (AREA)
- General Engineering & Computer Science (AREA)
- Fuses (AREA)
Abstract
Description
特許文献2:特開2015−079608号公報
11、21、31、41・・・第1の可溶金属、
12、22、32,42・・・第2の可溶金属、
23、33、43・・・絶縁基板、
24a、24b、34、44・・・電極、
25、35、45・・・ヒューズ素子(複合金属材)、
26、36、46・・・蓋体、
27、37、47・・・ハーフ・スルーホール、
38、48・・・発熱素子。
Claims (20)
- 接合作業温度で成分の一部が溶解する第1の可溶金属と、前記第1の可溶金属よりも低い溶融温度を有し前記接合作業温度で少なくとも成分の一部が溶融する第2の可溶金属とを積層した複合金属材からなるヒューズ素子。
- 前記第1の可溶金属は、少なくとも第2の可溶金属の固相線温度を超え、かつ第1の可溶金属の液相線温度未満の所定接合作業温度で成分の一部が溶解する無鉛錫系はんだ材である請求項1に記載のヒューズ素子。
- 前記第2の可溶金属は、少なくとも第2の可溶金属の固相線温度を超え、かつ第1の可溶金属の液相線温度未満の所定接合作業温度で成分の一部または全部が溶融する錫または無鉛錫系はんだ材である請求項1または請求項2に記載のヒューズ素子。
- 前記第1の可溶金属は、Sn−Ag合金、Sn−Cu合金、Sn−Sb合金、Sn−Zn合金、Sn−Al合金の群から選択されたことを特徴とする請求項1ないし請求項3の何れか1つに記載のヒューズ素子。
- 前記第2の可溶金属は、Sn、Sn−Ag合金、Sn−Ag−Cu合金、Sn−Ag−Cu−Bi合金、Sn−Cu合金、Sn−Bi合金、Sn−In合金、Sn−Ag−In合金、Sn−Bi−Ag合金、Sn−Ag−Bi−In合金、Sn−Sb合金、Sn−Zn合金、Sn−Zn−Bi合金、Sn−Al合金の群から選択されたことを特徴とする請求項1ないし請求項4の何れか1つに記載のヒューズ素子。
- 前記第1の可溶金属は、Sn−Ag合金であり、そのAg含有量が20質量%以上30質量%以下であることを特徴とする請求項4に記載のヒューズ素子。
- 前記第1の可溶金属は、80Sn−20Ag合金または70Sn−30Ag合金であることを特徴とする請求項4に記載のヒューズ素子。
- 前記第2の可溶金属は、Sn−Bi合金であり、そのBi含有量が40質量%以上70質量%以下であることを特徴とする請求項5に記載のヒューズ素子。
- 前記第2の可溶金属は、60Sn−40Bi合金または30Sn−70Bi合金であることを特徴とする請求項5に記載のヒューズ素子。
- 絶縁基板と、この絶縁基板に設けた複数の電極と、該電極のうち所定の電極に電気接続したヒューズ素子と、このヒューズ素子を加熱して溶断させるために絶縁基板に設けられた発熱素子とを備え、前記ヒューズ素子は、接合作業温度で成分の一部が溶解する第1の可溶金属と、前記第1の可溶金属よりも低い溶融温度を有し前記接合作業温度で少なくとも成分の一部が溶融する第2の可溶金属とを積層した複合金属材からなる保護素子。
- 前記発熱素子は、前記ヒューズ素子が設けられた前記絶縁基板の基板面とは異なる基板面に設けたことを特徴とする請求項10に記載の保護素子。
- 前記発熱素子は、前記ヒューズ素子が設けられた前記絶縁基板の基板面と同一の基板面に設けたことを特徴とする請求項10に記載の保護素子。
- 前記第1の可溶金属は、少なくとも第2の可溶金属の固相線温度を超え、かつ第1の可溶金属の液相線温度未満の接合作業温度で成分の一部が溶解する無鉛錫系はんだ材である請求項10ないし請求項12の何れか1つに保護素子。
- 前記第2の可溶金属は、少なくとも第2の可溶金属の固相線温度を超え、かつ第1の可溶金属の液相線温度未満の接合作業温度で成分の一部または全部が溶融する錫または無鉛錫系はんだ材である請求項10ないし請求項13の何れか1つに記載の保護素子。
- 前記第1の可溶金属は、Sn−Ag合金、Sn−Cu合金、Sn−Sb合金、Sn−Zn合金、Sn−Al合金の群から選択されたことを特徴とする請求項10ないし請求項14の何れか1つに記載の保護素子。
- 前記第2の可溶金属は、Sn、Sn−Ag合金、Sn−Ag−Cu合金、Sn−Ag−Cu−Bi合金、Sn−Cu合金、Sn−Bi合金、Sn−In合金、Sn−Ag−In合金、Sn−Bi−Ag合金、Sn−Ag−Bi−In合金、Sn−Sb合金、Sn−Zn合金、Sn−Zn−Bi合金、Sn−Al合金の群から選択されたことを特徴とする請求項10ないし請求項15の何れか1つに記載の保護素子。
- 前記第1の可溶金属は、Sn−Ag合金であり、そのAg含有量が20質量%以上30質量%以下であることを特徴とする請求項15に記載のヒューズ素子。
- 前記第1の可溶金属は、80Sn−20Ag合金または70Sn−30Ag合金であることを特徴とする請求項15に記載のヒューズ素子。
- 前記第2の可溶金属は、Sn−Bi合金であり、そのBi含有量が40質量%以上70質量%以下であることを特徴とする請求項16に記載のヒューズ素子。
- 前記第2の可溶金属は、60Sn−40Bi合金または30Sn−70Bi合金であることを特徴とする請求項16に記載のヒューズ素子。
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CN201980062459.5A CN113169001A (zh) | 2018-12-28 | 2019-12-26 | 熔丝元件和保护元件 |
US17/274,280 US11640892B2 (en) | 2018-12-28 | 2019-12-26 | Fuse element and protective element |
DE112019004080.4T DE112019004080T5 (de) | 2018-12-28 | 2019-12-26 | Schmelzsicherungselement und Schutzelement |
PCT/JP2019/051212 WO2020138325A1 (ja) | 2018-12-28 | 2019-12-26 | ヒューズ素子および保護素子 |
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JP7154090B2 (ja) * | 2018-10-01 | 2022-10-17 | ショット日本株式会社 | 保護素子 |
JP7433811B2 (ja) * | 2019-08-23 | 2024-02-20 | デクセリアルズ株式会社 | ヒューズエレメント、ヒューズ素子および保護素子 |
JP7270521B2 (ja) | 2019-10-21 | 2023-05-10 | 河村電器産業株式会社 | 分電盤接続検査装置 |
JP7349954B2 (ja) * | 2020-04-13 | 2023-09-25 | ショット日本株式会社 | 保護素子 |
CN113600949B (zh) * | 2021-08-26 | 2022-11-01 | 深圳市台基防雷科技有限公司惠阳分公司 | 一种电涌保护器的脱离机构的焊接方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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US11640892B2 (en) | 2023-05-02 |
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JP7231527B2 (ja) | 2023-03-01 |
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