JP2020108053A - Pedestal for vibration element, transducer, and oscillator - Google Patents
Pedestal for vibration element, transducer, and oscillator Download PDFInfo
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- JP2020108053A JP2020108053A JP2018246822A JP2018246822A JP2020108053A JP 2020108053 A JP2020108053 A JP 2020108053A JP 2018246822 A JP2018246822 A JP 2018246822A JP 2018246822 A JP2018246822 A JP 2018246822A JP 2020108053 A JP2020108053 A JP 2020108053A
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Abstract
Description
本発明は、振動素子を搭載する台座に係り、特に、外部からの振動への耐性を向上させ、位相雑音特性を良好にできる振動素子用の台座、振動子及び発振器に関する。 The present invention relates to a pedestal on which a vibrating element is mounted, and more particularly, to a pedestal, a vibrator, and an oscillator for a vibrating element that can improve resistance to external vibration and have good phase noise characteristics.
［従来の技術］
従来の水晶振動子では、パッケージ及びパッケージ外部からの水晶片に与える影響を抑制する構成として、主に水晶から成る台座（水晶台座）を用いる構成が知られている。
また、パッケージを表裏に凹部が形成されたＨ構造とし、表側に水晶片と水晶台座を搭載し、裏面に発振回路のＩＣ（Integrated Circuit）を搭載した水晶発振器がある。
また、パッケージの表面又は裏面に温度補償回路を設けた温度補償型水晶発振器（ＴＣＸＯ：Temperature Compensated Crystal Oscillator）がある。
[Conventional technology]
In a conventional crystal resonator, a structure using a pedestal mainly made of crystal (crystal pedestal) is known as a structure for suppressing the influence on the crystal piece from the package and the outside of the package.
Further, there is a crystal oscillator in which a package has an H structure in which recesses are formed on the front and back sides, a crystal piece and a crystal pedestal are mounted on the front side, and an IC (Integrated Circuit) of an oscillation circuit is mounted on the back side.
There is also a temperature-compensated crystal oscillator (TCXO: Temperature Compensated Crystal Oscillator) in which a temperature compensation circuit is provided on the front surface or the back surface of the package.
［関連技術］
尚、関連する先行技術として、特許第３０１７７５０号公報「水晶振動子」（特許文献１）、特許第４７１５２５２号公報「圧電振動子」（特許文献２）、特開２０１３−０９８６７８号公報「水晶振動子」（特許文献３）がある。
[Related technology]
As related prior arts, Japanese Patent No. 3017750 "Crystal resonator" (Patent Document 1), Japanese Patent No. 4715252 "Piezoelectric vibrator" (Patent Document 2), Japanese Patent Laid-Open No. 2013-098678 "Crystal Vibration" Child” (Patent Document 3).
特許文献１には、保持用水晶板に振動子用水晶片を搭載する位置に凹部を形成し、その凹部によって形成される隙間で振動子用水晶片を確実に励振させ、振動子用水晶片の長手方向での熱によるストレスを発生させない水晶振動子が示されている。 In Patent Document 1, a recess is formed on a holding crystal plate at a position where the resonator crystal piece is mounted, and the resonator crystal piece is surely excited in a gap formed by the recess. A crystal unit is shown which does not generate heat stress.
特許文献２には、基板における熱膨張の影響を小さくするために、隙間を有するスプリング部を備える圧電振動子が示されている。
特許文献３には、温度変化に伴う水晶片の変形を防ぎ、良好な周波数温度特性が得られる構成の水晶振動子が示されている。
Patent Document 2 discloses a piezoelectric vibrator including a spring portion having a gap in order to reduce the influence of thermal expansion in the substrate.
Patent Document 3 discloses a crystal resonator configured to prevent deformation of the crystal piece due to temperature change and to obtain good frequency-temperature characteristics.
しかしながら、従来の水晶振動子又は水晶発振器における水晶台座では、外部からの振動が水晶片に影響してしまい、その振動によって位相雑音特性が劣化するという問題点があった。 However, in the crystal pedestal of the conventional crystal oscillator or crystal oscillator, there is a problem that external vibration affects the crystal piece, and the vibration deteriorates the phase noise characteristic.
本発明は上記実情に鑑みて為されたもので、外部からの振動の影響を抑えて耐振動特性を向上させ、位相雑音特性を良好にできる振動素子用の台座、振動子及び発振器を提供することを目的とする。 The present invention has been made in view of the above circumstances, and provides a pedestal for a vibrating element, a vibrator, and an oscillator that can suppress the influence of vibration from the outside to improve the vibration resistance characteristic and improve the phase noise characteristic. The purpose is to
上記従来例の問題点を解決するための本発明は、振動素子を搭載する振動素子用の台座であって、表面に振動素子が搭載される矩形形状の搭載部と、パッケージの基板に接続する複数の接続部と、搭載部の周囲に隙間を隔てて配置され、複数の接続部と搭載部とを連結する連結部と備え、連結部が、搭載部の一方の長辺において、当該長辺の中央から一方の短辺までの間で接続すると共に、搭載部の他方の長辺において、当該長辺の中央から他方の短辺までの間で接続し、接続部が、連結部の四隅の角部において、基板側に突出するよう設けられていることを特徴とする。 The present invention for solving the above-mentioned problems of the conventional example is a pedestal for a vibrating element on which a vibrating element is mounted, which is connected to a rectangular-shaped mounting portion on which the vibrating element is mounted and a package substrate. A plurality of connecting portions and a connecting portion that is arranged around the mounting portion with a gap therebetween and connects the connecting portions and the mounting portion, and the connecting portion is one of the long sides of the mounting portion. While connecting from the center to one of the short sides, and on the other long side of the mounting part, connect from the center of the long side to the other short side, and the connecting parts are the four corners of the connecting part. The corner portion is provided so as to project toward the substrate side.
本発明は、上記台座において、接続部が、連結部の四隅の角部において、搭載部に連結部が接続する部分から遠い角部に設けられていることを特徴とする。 The present invention is characterized in that, in the above-mentioned pedestal, the connecting portions are provided at corners at four corners of the connecting portion, which are far from a portion where the connecting portion is connected to the mounting portion.
本発明は、上記台座において、搭載部と連結部を同じ厚みとしたことを特徴とする。 The present invention is characterized in that, in the pedestal, the mounting portion and the connecting portion have the same thickness.
本発明は、上記台座において、搭載部には、連結部が接続する部分に振動素子の電極に接続する電極パターンが形成されていることを特徴とする。 The present invention is characterized in that, in the above-mentioned pedestal, an electrode pattern for connecting to an electrode of the vibrating element is formed in a portion of the mounting portion where the connecting portion is connected.
本発明は、振動子において、上記台座に振動素子を搭載し、パッケージ内に設置したことを特徴とする。 The present invention is characterized in that, in a vibrator, a vibrating element is mounted on the pedestal and installed in a package.
本発明は、発振器において、上記台座に振動素子を搭載して、パッケージ表面の中央凹部に発振回路を搭載し、当該凹部の周囲に形成された段差部に当該台座を設置したことを特徴とする。 The present invention is characterized in that, in the oscillator, the oscillating element is mounted on the pedestal, the oscillating circuit is mounted on the central concave portion of the package surface, and the pedestal is installed on the stepped portion formed around the concave portion. ..
本発明によれば、表面に振動素子が搭載される矩形形状の搭載部と、パッケージの基板に接続する複数の接続部と、搭載部の周囲に隙間を隔てて配置され、複数の接続部と搭載部とを連結する連結部と備え、連結部が、搭載部の一方の長辺において、当該長辺の中央から一方の短辺までの間で接続すると共に、搭載部の他方の長辺において、当該長辺の中央から他方の短辺までの間で接続し、接続部が、連結部の四隅の角部において、基板側に突出するよう設けられている台座としているので、外部からの振動が接続部に伝達されたとしても、連結部で吸収して、搭載部への影響を小さくでき、位相雑音特性を良好にできる効果がある。 According to the present invention, a rectangular-shaped mounting portion on which a vibrating element is mounted on the surface, a plurality of connecting portions for connecting to the substrate of the package, and a plurality of connecting portions arranged around the mounting portion with a gap. And a connecting portion for connecting the mounting portion, wherein the connecting portion connects on one long side of the mounting portion between the center of the long side and one short side, and on the other long side of the mounting portion. , It connects from the center of the long side to the other short side, and the connecting parts are the pedestals that are provided so as to project toward the board side at the four corners of the connecting part. Even if is transmitted to the connecting portion, it is absorbed by the connecting portion, the influence on the mounting portion can be reduced, and the phase noise characteristic can be improved.
本発明の実施の形態について図面を参照しながら説明する。
［実施の形態の概要］
本発明の実施の形態に係る台座（本台座）は、振動素子が搭載される矩形形状の搭載部と、パッケージの基板に接続する複数の接続部と、搭載部の周囲に隙間を隔てて配置され、複数の接続部と搭載部とを連結する連結部と備えるもので、連結部が、搭載部の一方の長辺において当該長辺の中央から一方の短辺までの間で接続すると共に、搭載部の他方の長辺において当該長辺の中央から他方の短辺までの間で接続し、接続部が、連結部の四隅の角部に設けられている台座としているので、外部からの振動が接続部に伝達されたとしても、連結部で吸収して、搭載部への影響を小さくでき、位相雑音特性を良好にできるものである。
Embodiments of the present invention will be described with reference to the drawings.
[Outline of Embodiment]
A pedestal (main pedestal) according to an embodiment of the present invention includes a rectangular-shaped mounting portion on which a vibrating element is mounted, a plurality of connecting portions for connecting to a substrate of a package, and a gap around the mounting portion. And a connecting part for connecting the plurality of connecting parts and the mounting part, wherein the connecting part connects between the center of the long side and one short side of the one long side of the mounting part, Vibration is applied from the outside on the other long side of the mounting part by connecting from the center of the long side to the other short side and the connecting parts are pedestals provided at the corners of the four corners of the connecting part. Even if is transmitted to the connecting portion, it is absorbed by the connecting portion, the influence on the mounting portion can be reduced, and the phase noise characteristic can be improved.
また、本発明の実施の形態に係る振動子は（本振動子）は、本台座に振動素子を搭載し、凹部を有するパッケージに本台座を設置したものである。
また、本発明の実施の形態に係る発振器（本発振器）は、本振動子のパッケージの裏面凹部等に発振回路を搭載したものである。
Further, the vibrator according to the embodiment of the present invention (main vibrator) is one in which a vibrating element is mounted on the main base, and the main base is installed in a package having a recess.
Further, the oscillator according to the embodiment of the present invention (the present oscillator) is one in which an oscillation circuit is mounted in the recessed portion on the back surface of the package of the present oscillator.
［本台座の表面と裏面：図１、図２］
次に、本発明の実施の形態に係る台座（本台座）について図１〜２を参照しながら説明する。図１は、本台座の表面説明図であり、図２は、本台座の裏面説明図である。
本台座１は、図１及び図２に示すように、振動片（水晶片）２を搭載する矩形の搭載部１１と、搭載部１１を囲むように形成され、搭載部１１の各長辺の一部に接続する連結部１３と、本体の裏面で連結部１３の角部に形成された２つの接続部１４と、搭載部１１と連結部１３との間に形成された隙間部１２ａ，１２ｂ（隙間部１２）とを備えている。
図１では、本台座１に水晶片２が搭載された状態を示している。
そして、搭載部１１には、水晶片２が導電性接着剤４で固定されている。
[Front and back of main pedestal: Figures 1 and 2]
Next, a pedestal (main pedestal) according to the embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a front surface explanatory diagram of the main pedestal, and FIG. 2 is a rear surface explanatory diagram of the main pedestal.
As shown in FIGS. 1 and 2, the main pedestal 1 is formed so as to surround the mounting portion 11 with a rectangular mounting portion 11 on which the vibrating piece (crystal piece) 2 is mounted. A connecting portion 13 connected to a part, two connecting portions 14 formed at the corners of the connecting portion 13 on the back surface of the main body, and gap portions 12a and 12b formed between the mounting portion 11 and the connecting portion 13. (Gap portion 12).
FIG. 1 shows a state in which the crystal piece 2 is mounted on the main pedestal 1.
The crystal piece 2 is fixed to the mounting portion 11 with a conductive adhesive 4.
連結部１３は、搭載部１１と接続部１４とを連結するもので、搭載部１１を囲む部分と搭載部１１に接続する部分（２箇所の接続部分）とから構成され、電極パターン１０ａ，１０ｂが形成される。
連結部１３において、搭載部１１に接続するのは、搭載部１１の長辺であって、当該長辺の中央部から水晶片２の電極が形成される短辺までの間の部分である。
The connecting portion 13 connects the mounting portion 11 and the connecting portion 14, and is composed of a portion surrounding the mounting portion 11 and a portion (two connecting portions) connected to the mounting portion 11, and the electrode patterns 10a and 10b. Is formed.
In the connecting portion 13, the long side of the mounting portion 11 is connected to the mounting portion 11, and the portion between the central portion of the long side and the short side where the electrode of the crystal blank 2 is formed.
従って、隙間部１２が、コの字形状となるが、長辺に沿った部分の形状が一方は短く、他方は長く、Ｌ字形状に近いものとなっている。図１では、隙間部１２ａは、上側の長辺に沿った部分の形状が短く、下側の長辺に沿った部分の形状が長く、隙間部１２ｂは、下側の長辺に沿った部分の形状が短く、上側の長辺に沿った部分の形状が長くなっている。
また、連結部１３は、四隅の角部が湾曲して湾曲部分となっている。
Therefore, although the gap 12 has a U-shape, the shape of the portion along the long side is short on one side and long on the other side, and is close to an L-shape. In FIG. 1, the gap 12a has a short shape along the upper long side and a long shape along the lower long side, and the gap 12b includes a portion along the lower long side. Has a short shape, and the shape of the portion along the upper long side is long.
In addition, the corners of the four corners of the connecting portion 13 are curved to form curved portions.
電極パターン１０ａは、図１において、水晶片２の電極に接続する搭載部１１の右上の角部から連結部１３によって上側に引き出され、連結部１３において、搭載部１１の右側短辺を、隙間部１２ａを介して囲むよう形成される。
電極パターン１０ｂは、図１において、水晶片２の電極に接続する搭載部１１の左下の角部から連結部１３によって下側に引き出され、連結部１３において、搭載部１１の左側短辺を、隙間部１２ｂを介して囲むよう形成される。
In FIG. 1, the electrode pattern 10a is pulled out to the upper side by the connecting portion 13 from the upper right corner of the mounting portion 11 connected to the electrode of the crystal blank 2, and in the connecting portion 13, the right short side of the mounting portion 11 is separated by a gap. It is formed so as to surround the portion 12a.
In FIG. 1, the electrode pattern 10b is pulled out downward from the lower left corner of the mounting portion 11 connected to the electrode of the crystal blank 2 by the connecting portion 13, and in the connecting portion 13, the left short side of the mounting portion 11 is The space 12b is formed so as to surround the space 12b.
そして、図２に本台座１の裏面を示すように、表面と同様の形状で、連結部１３において電極パターン１０ａ，１０ｂが裏面にも形成されている。電極パターン１０ａ，１０ｂは、表面と裏面だけでなく、側面にも形成されている。 Then, as shown in the back surface of the main pedestal 1 in FIG. 2, the electrode patterns 10a and 10b are formed on the back surface of the connecting portion 13 in the same shape as the front surface. The electrode patterns 10a and 10b are formed not only on the front and back surfaces but also on the side surfaces.
更に、連結部１３において、搭載部１１に接続する部分から遠い方の角部（婉曲部分）にパッケージ内の基板に接続する接続部１４が形成される。図１では、連結部１３が搭載部１１に接続する部分が右上と左下であるので、接続部１４が設けられるのは、連結部１３の右下と左上の角部の裏面となる。 Further, in the connecting portion 13, a connecting portion 14 for connecting to the substrate in the package is formed at a corner portion (a curved portion) farther from a portion for connecting to the mounting portion 11. In FIG. 1, since the connecting portion 13 is connected to the mounting portion 11 at the upper right and the lower left, the connecting portions 14 are provided on the back surfaces of the lower right and upper left corners of the connecting portion 13.
接続部１４は、パッケージ内の基板に向けて突出している。従って、本台座１において、搭載部１１と連結部１３が同じ厚みで、接続部１３がそれより大きい厚みとなっている。尚、連結部１３の厚みを搭載部１１の厚みより薄くしてもよい。 The connection portion 14 projects toward the substrate inside the package. Therefore, in the main pedestal 1, the mounting portion 11 and the connecting portion 13 have the same thickness, and the connecting portion 13 has a larger thickness. The thickness of the connecting portion 13 may be smaller than the thickness of the mounting portion 11.
尚、パッケージの基板に電気的に接続する接続部１４を本台座１の裏面に対角で２箇所形成したが、安定を図るために、接続部１４が形成されていない他の角部に電気的に接続しない同様の形状の接続部を設けてもよい。
接続部１４より連結部１３の厚みを薄くすることで、パッケージの基板からの振動が接続部１４に伝達したとしても、連結部１３で振動を吸収できるものである。
Although the connecting portions 14 that are electrically connected to the substrate of the package are formed on the back surface of the main pedestal 1 at two diagonal positions, electrical connection is made to other corner portions where the connecting portions 14 are not formed for the purpose of stability. You may provide the connection part of the same shape which does not connect physically.
By making the connecting portion 13 thinner than the connecting portion 14, even if the vibration from the substrate of the package is transmitted to the connecting portion 14, the connecting portion 13 can absorb the vibration.
本台座１は、例えば、耐熱プラスチック等の樹脂、ガラス、絶縁膜が表面にコーティングされた金属等の絶縁材料で形成される。
また、本台座１は、振動片（水晶片）２と同様の水晶（水晶片２と同じＡＴカットやＺ板）により形成してもよい。その場合、本台座１と水晶片２の熱膨張係数は略等しく、温度変化に伴う応力は発生しない。
The main pedestal 1 is made of, for example, a resin such as heat-resistant plastic, glass, or an insulating material such as metal having an insulating film coated on its surface.
Further, the main pedestal 1 may be formed of the same crystal as the vibrating piece (crystal piece) 2 (the same AT cut or Z plate as the crystal piece 2). In that case, the thermal expansion coefficients of the main pedestal 1 and the crystal piece 2 are substantially equal to each other, and stress due to temperature change does not occur.
また、ここでは、本台座１に搭載される振動素子として、ＡＴカットの水晶片２からなる水晶共振子を用いたが、例えば、表面弾性波（ＳＡＷ：Surface Acoustic Wave）共振子、その他の圧電振動子や微小電子機械システム（ＭＥＭＳ：Micro Electro Mechanical Systems）振動子等の発振素子（振動素子）を用いてもよい。 Further, here, a crystal resonator made of an AT-cut crystal piece 2 is used as the vibration element mounted on the main pedestal 1. However, for example, a surface acoustic wave (SAW: Surface Acoustic Wave) resonator and other piezoelectric elements are used. An oscillating element (oscillating element) such as an oscillator or a micro electro mechanical system (MEMS) oscillator may be used.
［本台座の側面：図３］
次に、本発振器について図３を参照しながら説明する。図３は、本発振器の側面説明図である。尚、パッケージ３については分かり易くするために断面を示している。
本発振器において、セラミック等で形成されたパッケージ３は、内側の凹形状が２段階となっている。具体的には、上側の凹部は間口が広く、下側の凹部は開口部が狭く形成されている。つまり、パッケージ３の内側中央の底部に下側の凹部が形成され、その下側の凹部の周囲に上側の凹部が形成されて、パッケージ３内に段差を形成している。
[Side of main pedestal: Fig. 3]
Next, this oscillator will be described with reference to FIG. FIG. 3 is a side view of the oscillator. It should be noted that the package 3 is shown in cross section for the sake of clarity.
In the present oscillator, the package 3 made of ceramic or the like has a two-stage concave shape on the inner side. Specifically, the upper recess has a wide frontage, and the lower recess has a narrow opening. That is, a lower recess is formed in the bottom of the inside center of the package 3, and an upper recess is formed around the lower recess to form a step in the package 3.
本発振器は、図３に示すように、パッケージ３の下側の凹部に発振回路（ＩＣ）６を半田５等によって搭載し、パッケージ３内の段差部分に接続部１４が導電性接着剤等で固定され、水晶片２を搭載した本台座１が設置される。
つまり、搭載部１１の下側の空間に発振回路６を収容したものとなる。
In this oscillator, as shown in FIG. 3, an oscillating circuit (IC) 6 is mounted in a concave portion on the lower side of the package 3 by solder 5 or the like, and a connecting portion 14 is made of a conductive adhesive or the like at a step portion in the package 3. The main pedestal 1 which is fixed and carries the crystal piece 2 is installed.
That is, the oscillation circuit 6 is housed in the space below the mounting portion 11.
また、パッケージ３の表面の周囲にはシームリングが形成される。
シームリングは、シーム封止を行うためにパッケージの表面周囲に銀（Ａｇ）ロウ等で形成される。
そして、パッケージ３の蓋となるリッドが、シームリングに接着するよう形成され、内部が封止される。リッドは、コバールをニッケルメッキしたもの等が用いられる。
A seam ring is formed around the surface of the package 3.
The seam ring is formed of silver (Ag) wax or the like around the surface of the package for performing seam sealing.
Then, a lid serving as a lid of the package 3 is formed so as to adhere to the seam ring, and the inside is sealed. As the lid, Kovar plated with nickel is used.
［本台座の効果］
本台座１によれば、水晶片２が搭載される矩形形状の搭載部１１と、パッケージ３の段差部の基板に接続する複数の接続部１４と、搭載部１１の周囲に隙間部１２ａ，１２ｂを隔てて配置され、複数の接続部１４と搭載部１１とを連結する連結部１３と備えるもので、連結部１３が、搭載部１１の一方の長辺において当該長辺の中央から一方の短辺までの間で接続すると共に、搭載部１１の他方の長辺において当該長辺の中央から他方の短辺までの間で接続し、接続部１４が、連結部１３の四隅の角部に設けられているので、外部からの振動が接続部１４に伝達されたとしても、連結部１３で吸収して、搭載部１１への影響を小さくでき、位相雑音特性を良好にできる効果がある。
[Effect of main pedestal]
According to the main pedestal 1, the rectangular-shaped mounting portion 11 on which the crystal piece 2 is mounted, the plurality of connecting portions 14 connected to the substrate at the stepped portion of the package 3, and the gap portions 12 a and 12 b around the mounting portion 11. And a connecting portion 13 that connects the plurality of connecting portions 14 and the mounting portion 11 to each other, and the connecting portion 13 is one long side of the mounting portion 11 and one short side from the center of the long side. Connection between the sides and connection between the center of the other long side of the mounting portion 11 and the other short side of the mounting portion 11, and the connecting portions 14 are provided at the corners of the four corners of the connecting portion 13. Therefore, even if the vibration from the outside is transmitted to the connecting portion 14, it is absorbed by the connecting portion 13 so that the influence on the mounting portion 11 can be reduced and the phase noise characteristic can be improved.
本発明は、外部からの振動の影響を抑えて耐振動性を向上させ、位相雑音特性を良好にできる振動素子用の台座、振動子及び発振器に適している。 INDUSTRIAL APPLICABILITY The present invention is suitable for a pedestal for a vibrating element, a vibrator, and an oscillator that can suppress the influence of external vibrations, improve vibration resistance, and improve phase noise characteristics.
１…本台座、 ２…振動片（水晶片） ３…パッケージ、４…導電性接着剤、 ５…半田、 １０ａ，１０ｂ…電極パターン、１１…搭載部、 １２ａ，１２ｂ…隙間部、 １３…連結部、 １４…接続部 DESCRIPTION OF SYMBOLS 1... Main pedestal, 2... Vibrating piece (crystal piece) 3... Package, 4... Conductive adhesive, 5... Solder, 10a, 10b... Electrode pattern, 11... Mounting part, 12a, 12b... Gap part, 13... Connection Part, 14... connection part
Claims (6)
表面に振動素子が搭載される矩形形状の搭載部と、
パッケージの基板に接続する複数の接続部と、
前記搭載部の周囲に隙間を隔てて配置され、前記複数の接続部と前記搭載部とを連結する連結部と備え、
前記連結部は、前記搭載部の一方の長辺において、当該長辺の中央から一方の短辺までの間で接続すると共に、前記搭載部の他方の長辺において、当該長辺の中央から他方の短辺までの間で接続し、
前記接続部が、前記連結部の四隅の角部において、前記基板側に突出するよう設けられていることを特徴とする台座。 A pedestal for a vibrating element equipped with a vibrating element,
A rectangular mounting part on which the vibration element is mounted,
A plurality of connecting parts for connecting to the substrate of the package,
A mounting portion that is disposed around the mounting portion with a gap, and that connects the plurality of connecting portions and the mounting portion,
The connecting portion connects one long side of the mounting portion from the center of the long side to one short side, and the other long side of the mounting portion connects the center of the long side to the other side. Connect up to the short side of
The pedestal, wherein the connecting portions are provided so as to project toward the substrate side at four corners of the connecting portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018246822A JP2020108053A (en) | 2018-12-28 | 2018-12-28 | Pedestal for vibration element, transducer, and oscillator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018246822A JP2020108053A (en) | 2018-12-28 | 2018-12-28 | Pedestal for vibration element, transducer, and oscillator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2020108053A true JP2020108053A (en) | 2020-07-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018246822A Pending JP2020108053A (en) | 2018-12-28 | 2018-12-28 | Pedestal for vibration element, transducer, and oscillator |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2020108053A (en) |
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2018
- 2018-12-28 JP JP2018246822A patent/JP2020108053A/en active Pending
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