JP2020107711A - 半導体装置製造方法 - Google Patents
半導体装置製造方法 Download PDFInfo
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- JP2020107711A JP2020107711A JP2018244673A JP2018244673A JP2020107711A JP 2020107711 A JP2020107711 A JP 2020107711A JP 2018244673 A JP2018244673 A JP 2018244673A JP 2018244673 A JP2018244673 A JP 2018244673A JP 2020107711 A JP2020107711 A JP 2020107711A
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- joining
- bonding
- sheet
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- semiconductor device
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
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- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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Abstract
Description
B 基材
10 接合用シート
11 接合用材料層
12 接合層
20 半導体素子モジュール
21 接合対象部
P 配列ピッチ
L 長さ(配列ピッチと同方向の長さ)
D 離隔距離(配列ピッチと同方向の距離)
S 基板
Claims (4)
- 焼結性粒子含有の接合用シートと基材とを含む積層構造を有するシート体における前記接合用シートの側を、離隔した少なくとも二つの接合対象部を有する半導体素子または半導体素子モジュールにおける前記少なくとも二つの接合対象部に対して貼り合わせた後、前記接合用シートにおいて前記接合対象部に圧着された箇所を接合用材料層として当該接合対象部上に残し且つ他の箇所を前記基材に伴わせつつ、前記基材の剥離を行う、転写工程と、
前記接合用材料層付き接合対象部をその接合用材料層を介して基板に仮固定する工程と、
仮固定された前記接合対象部と前記基板との間に介在する接合用材料層から、加熱過程を経て接合層を形成して、当該接合対象部を前記基板に接合する工程と、を含む半導体装置製造方法。 - 隣り合う接合対象部の離隔方向において、接合対象部の配列ピッチに対する各接合対象部の長さの比率は、0.01〜1である、請求項1に記載の半導体装置製造方法。
- 隣り合う接合対象部における離隔方向の長さは1〜150μmである、請求項1または2に記載の半導体装置製造方法。
- 隣り合う接合対象部の離隔距離は1〜500μmである、請求項1から3のいずれか一つに記載の半導体装置製造方法。
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TW108147564A TW202031833A (zh) | 2018-12-27 | 2019-12-25 | 半導體裝置製造方法 |
CN201911357387.5A CN111383934A (zh) | 2018-12-27 | 2019-12-25 | 半导体装置制造方法 |
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Cited By (3)
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WO2022137552A1 (ja) * | 2020-12-25 | 2022-06-30 | 昭和電工マテリアルズ株式会社 | フィルム状接着剤及びその製造方法、ダイシング・ダイボンディング一体型フィルム及びその製造方法、並びに半導体装置及びその製造方法 |
US20220271004A1 (en) * | 2020-08-18 | 2022-08-25 | Seoul National University R&Db Foundation | Electronic device and method of transferring electronic element using stamping and magnetic field alignment |
GB2616920A (en) * | 2022-03-24 | 2023-09-27 | Shenzhen Guangshe Zhaoming Tech Co Ltd | Insulating paste-based conductive device and manufacturing method thereof |
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CN114446805A (zh) * | 2020-11-04 | 2022-05-06 | 中强光电股份有限公司 | 电子元件的接合方法 |
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JP5830302B2 (ja) | 2011-08-11 | 2015-12-09 | 古河電気工業株式会社 | 加熱接合用材料、加熱接合用シート体、及び加熱接合用成形体 |
JP5558547B2 (ja) | 2012-12-05 | 2014-07-23 | ニホンハンダ株式会社 | ペースト状金属微粒子組成物、固形状金属または固形状金属合金の製造方法、金属製部材の接合方法、プリント配線板の製造方法および電気回路接続用バンプの製造方法 |
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- 2018-12-27 JP JP2018244673A patent/JP2020107711A/ja active Pending
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- 2019-12-23 KR KR1020190172670A patent/KR20200081266A/ko not_active Application Discontinuation
- 2019-12-25 TW TW108147564A patent/TW202031833A/zh unknown
- 2019-12-25 CN CN201911357387.5A patent/CN111383934A/zh active Pending
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US20220271004A1 (en) * | 2020-08-18 | 2022-08-25 | Seoul National University R&Db Foundation | Electronic device and method of transferring electronic element using stamping and magnetic field alignment |
US11848303B2 (en) * | 2020-08-18 | 2023-12-19 | Seoul National University R&Db Foundation | Electronic device and method of transferring electronic element using stamping and magnetic field alignment |
US12009339B2 (en) | 2020-08-18 | 2024-06-11 | Seoul National University R&Db Foundation | Electronic device and method of transferring electronic element using stamping and magnetic field alignment |
WO2022137552A1 (ja) * | 2020-12-25 | 2022-06-30 | 昭和電工マテリアルズ株式会社 | フィルム状接着剤及びその製造方法、ダイシング・ダイボンディング一体型フィルム及びその製造方法、並びに半導体装置及びその製造方法 |
GB2616920A (en) * | 2022-03-24 | 2023-09-27 | Shenzhen Guangshe Zhaoming Tech Co Ltd | Insulating paste-based conductive device and manufacturing method thereof |
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CN111383934A (zh) | 2020-07-07 |
TW202031833A (zh) | 2020-09-01 |
KR20200081266A (ko) | 2020-07-07 |
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