JP2020104240A - Transfer machine and bevel polishing device - Google Patents
Transfer machine and bevel polishing device Download PDFInfo
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Abstract
Description
本発明は、基板を搬送する移載機と、移載機によって搬送及び搬出される基板の周縁部を研磨するベベル研磨装置に関する。 The present invention relates to a transfer machine for transferring a substrate and a bevel polishing apparatus for polishing a peripheral portion of a substrate transferred and unloaded by the transfer machine.
従来から、ウェハ等の基板のベベルを研磨するベベル研磨装置が知られている。ベベル研磨装置で基板のベベルを研磨する際にはバラつきが発生することがあるが、このようなバラつきの発生を抑制することが試みられている。特許文献１では、ベベル研磨を行う際の研磨ヘッドの位置調整を治具を用いて行なうことが提案されている。 Conventionally, a bevel polishing apparatus for polishing the bevel of a substrate such as a wafer has been known. When the bevel polishing apparatus polishes the bevel of the substrate, variations may occur, and attempts have been made to suppress such variations. Patent Document 1 proposes that a jig is used to adjust the position of a polishing head when performing bevel polishing.
本発明は、特許文献１とは異なる観点から、基板のベベル研磨の際のバラつきを抑制する態様を提供する。 The present invention provides a mode that suppresses variation during bevel polishing of a substrate from a viewpoint different from that of Patent Document 1.
本発明の第１態様による移載機は、
基板の裏面を保持する基板保持部へと基板を搬送する移載機であって、
一対のハンドと、
前記ハンドに設けられ、基板の裏面を支持する支持部材と、
前記ハンドに設けられ、前記支持部材で支持されている基板の側面を保持する保持部材と、
を備え、
前記支持部材が３つ設けられ、
一方のハンドに２つの支持部材が設けられ、他方のハンドに１つの支持部材が設けられてもよい。
The transfer machine according to the first aspect of the present invention is
A transfer machine that conveys a substrate to a substrate holding unit that holds the back surface of the substrate,
A pair of hands,
A support member provided on the hand and supporting the back surface of the substrate,
A holding member which is provided on the hand and holds a side surface of the substrate which is supported by the supporting member,
Equipped with
Three support members are provided,
Two supporting members may be provided on one hand and one supporting member may be provided on the other hand.
本発明の第１態様による移載機において、
前記他方のハンドの長さは前記一方のハンドの長さよりも短くなってもよい。
In the transfer machine according to the first aspect of the present invention,
The length of the other hand may be shorter than the length of the one hand.
本発明の第１態様による移載機は、
少なくとも１つの支持部材の前記基板の面内方向における位置を検出する面内方向位置検出部をさらに備え、
前記支持部材の少なくとも１つが前記基板の面内方向で移動可能となってもよい。
The transfer machine according to the first aspect of the present invention is
Further comprising an in-plane direction position detection unit that detects the position of at least one support member in the in-plane direction of the substrate,
At least one of the support members may be movable in the in-plane direction of the substrate.
本発明の第２態様による移載機は、
基板の裏面を保持する基板保持部へと基板を搬送する移載機であって、
一対のハンドと、
前記ハンドに設けられ、基板の裏面を支持する支持部材と、
前記ハンドに設けられ、前記支持部材で支持されている基板の側面を保持する保持部材と、
少なくとも１つの前記支持部材の前記基板の面内方向における位置を検出する面内方向位置検出部と、
を備え、
前記支持部材の少なくとも１つは前記基板の面内方向で移動可能となってもよい。
The transfer machine according to the second aspect of the present invention is
A transfer machine that conveys a substrate to a substrate holding unit that holds the back surface of the substrate,
A pair of hands,
A support member provided on the hand and supporting the back surface of the substrate,
A holding member which is provided on the hand and holds a side surface of the substrate which is supported by the supporting member,
An in-plane direction position detection unit that detects the position of at least one of the support members in the in-plane direction of the substrate;
Equipped with
At least one of the support members may be movable in the in-plane direction of the substrate.
本発明の第１態様及び第２態様による移載機は、
前記支持部材の少なくとも１つの前記基板の法線方向に沿った位置を検出する法線方向位置検出部をさらに備え、
前記支持部材の少なくとも１つは前記基板の法線方向に沿って移動可能となってもよい。
The transfer machine according to the first aspect and the second aspect of the present invention is
Further comprising a normal direction position detection unit that detects a position of at least one of the supporting members along the normal direction of the substrate,
At least one of the support members may be movable along a direction normal to the substrate.
本発明の第１態様及び第２態様による移載機において、
前記保持部材の少なくとも１つには、前記基板に加わる圧力を検出する圧力検出部が設けられてもよい。
In the transfer machine according to the first aspect and the second aspect of the present invention,
At least one of the holding members may be provided with a pressure detection unit that detects the pressure applied to the substrate.
本発明の第１態様のベベル研磨装置は、
本発明の第１態様もしくは第２態様による移載機又はそれ以外の移載機によって搬送された基板の裏面を保持する基板保持部と、
前記基板保持部によって保持された基板のベベルを研磨する研磨ユニットと、
を備え、
前記研磨ユニットが、研磨テープと、前記研磨テープを基板に対して押し付けるための押圧部と、気体を用いて前記研磨テープの前記基板に対する押し付け力を調整する調整部と、を有し、
前記調整部に気体供給管を介して気体を供給する気体供給部が設けられ、
前記気体供給管には気体を貯留するための気体貯留部が設けられてもよい。
The bevel polishing apparatus according to the first aspect of the present invention is
A substrate holding unit that holds the back surface of the substrate transported by the transfer machine according to the first aspect or the second aspect of the present invention or another transfer machine;
A polishing unit for polishing the bevel of the substrate held by the substrate holder,
Equipped with
The polishing unit has a polishing tape, a pressing unit for pressing the polishing tape against the substrate, and an adjusting unit for adjusting the pressing force of the polishing tape against the substrate using gas,
A gas supply unit that supplies gas to the adjustment unit via a gas supply pipe is provided.
The gas supply pipe may be provided with a gas storage part for storing gas.
本発明の第２態様のベベル研磨装置は、
本発明の第１態様もしくは第２態様による移載機又はそれ以外の移載機によって搬送された基板の裏面を保持する基板保持部と、
前記基板保持部によって保持された基板のベベルを研磨する研磨ユニットと、
を備え、
前記基板保持部は前記基板の裏面を支持する支持本体部を有し、
前記基板は直径が２９９ｍｍ〜３０１ｍｍの円形状からなり、
前記支持本体部は直径が２６０ｍｍ〜２８５ｍｍの円形状となってもよい。
A bevel polishing apparatus according to a second aspect of the present invention is
A substrate holding unit that holds the back surface of the substrate transported by the transfer machine according to the first aspect or the second aspect of the present invention or another transfer machine;
A polishing unit for polishing the bevel of the substrate held by the substrate holder,
Equipped with
The substrate holding portion has a support body portion that supports the back surface of the substrate,
The substrate has a circular shape with a diameter of 299 mm to 301 mm,
The support body may have a circular shape with a diameter of 260 mm to 285 mm.
本発明の第３態様のベベル研磨装置は、
本発明の第１態様もしくは第２態様による移載機又はそれ以外の移載機によって搬送された基板の裏面を保持する基板保持部と、
前記基板保持部によって保持された基板のベベルを研磨する研磨ユニットと、
を備え、
前記基板保持部は前記基板の裏面を支持する支持本体部を有し、
前記移載機によって前記基板を前記支持本体部に載置する第一時間前に、前記支持本体部を回転させるように制御する制御部をさらに備えてもよい。
A bevel polishing apparatus according to a third aspect of the present invention is
A substrate holding unit that holds the back surface of the substrate transported by the transfer machine according to the first aspect or the second aspect of the present invention or another transfer machine;
A polishing unit for polishing the bevel of the substrate held by the substrate holder,
Equipped with
The substrate holding portion has a support body portion that supports the back surface of the substrate,
A control unit may be further provided that controls the support main body to rotate before the first time when the substrate is placed on the support main body by the transfer machine.
本発明の第４態様のベベル研磨装置は、
本発明の第１態様もしくは第２態様による移載機又はそれ以外の移載機によって搬送された基板の裏面を保持する基板保持部と、
前記基板保持部に対する前記基板の面内方向での位置調整を行った後で、前記移載機によって前記基板を前記基板保持部に向かう移動である第一移動を行わせる制御部と、
を備え、
前記制御部は、前記保持部材によって前記基板を保持してから所定時間Ｔが経過した後で、前記移載機による前記第一移動を開始させてもよい。
A bevel polishing apparatus according to a fourth aspect of the present invention is
A substrate holding unit that holds the back surface of the substrate transported by the transfer machine according to the first aspect or the second aspect of the present invention or another transfer machine;
After performing position adjustment in the in-plane direction of the substrate with respect to the substrate holding unit, a control unit for performing the first movement is a movement of the substrate toward the substrate holding unit by the transfer machine,
Equipped with
The control unit may start the first movement by the transfer machine after a predetermined time T has elapsed after holding the substrate by the holding member.
本発明の第４態様のベベル研磨装置において、
前記所定時間は２〜５秒であってもよい。
In a bevel polishing apparatus according to a fourth aspect of the present invention,
The predetermined time may be 2 to 5 seconds.
なお、本発明の第１態様及び第２態様による移載機並びに第１態様乃至第４態様のベベル研磨装置の各々は独立した態様であり、互いに従属しない態様を採用できる。 The transfer machines according to the first and second aspects of the present invention and the bevel polishing apparatus according to the first to fourth aspects are independent aspects, and aspects not dependent on each other can be adopted.
本発明において、一方のハンドに２つの支持部材を設け、他方のハンドに１つの支持部材を設ける態様を採用した場合には、３つの支持部材を用いることで、基板の載置されうる面を一意に定め、基板保持部への受け渡しの位置精度を上げることができる。その結果、基板のベベル研磨の際のバラつきを抑制することができる。 In the present invention, in the case of adopting the mode in which one hand is provided with two support members and the other hand is provided with one support member, by using three support members, the surface on which the substrate can be placed is It can be uniquely determined, and the positional accuracy of delivery to the substrate holding unit can be improved. As a result, it is possible to suppress variations in the bevel polishing of the substrate.
実施の形態
《構成》
図１１は、本発明の実施の形態によるベベル研磨装置を含むベベル研磨システムを示す平面図である。図１１に示すように、ベベル研磨システム１０００は、ロードポートであるＦＯＵＰ１００５と、ＥＦＥＭ１００７と、複数のベベル研磨装置１０（以下、第１研磨部１００１及び第２研磨部１００２と呼ぶことがある。）と、洗浄ユニット１００３と、乾燥機１００４と、複数の基板仮置き台１００８、１００９と、複数の搬送機１０１０〜１０１３と、制御部５０と、を有している。
Embodiment << Configuration>>
FIG. 11 is a plan view showing a bevel polishing system including the bevel polishing apparatus according to the embodiment of the present invention. As shown in FIG. 11, the bevel polishing system 1000 includes a load port FOUP 1005, an EFEM 1007, and a plurality of bevel polishing devices 10 (hereinafter, may be referred to as a first polishing unit 1001 and a second polishing unit 1002). The cleaning unit 1003, the dryer 1004, the plurality of temporary substrate rests 1008 and 1009, the plurality of transporters 1010 to 1013, and the controller 50.
図１１に示すようなベベル研磨システム１０００の構成において、ウェハ等からなる基板Ｗは、以下の手順で処理される。すなわち、基板Ｗは、ＦＯＵＰ１００５からＥＦＥＭ１００７内の搬送機１０１３を介して基板仮置き台１００８に載せられる。次いで、基板仮置き台１００８上の基板Ｗは、搬送機１０１０により第１研磨部１００１あるいは第２研磨部１００２のいずれかへと搬送され、研磨される。研磨された基板Ｗは、搬送機１０１０により基板仮置き台１００９へと搬送される。その後、基板仮置き台１００９上の基板Ｗは、搬送機１０１１により洗浄ユニット１００３へと搬送されて、洗浄される。次いで、洗浄された基板Ｗは、搬送機１０１２により乾燥機１００４へと搬送され、乾燥機１００４内で乾燥され、その後、搬送機１０１３によりＦＯＵＰ１００５へと搬出される。 In the configuration of the bevel polishing system 1000 as shown in FIG. 11, the substrate W made of a wafer or the like is processed by the following procedure. That is, the substrate W is placed on the temporary substrate rest 1008 from the FOUP 1005 via the carrier 1013 in the EFEM 1007. Next, the substrate W on the temporary substrate rest 1008 is transported by the transporting machine 1010 to either the first polishing section 1001 or the second polishing section 1002, and is polished. The polished substrate W is transported to the temporary substrate rest 1009 by the transport device 1010. After that, the substrate W on the temporary substrate rest 1009 is carried to the cleaning unit 1003 by the carrier 1011 and cleaned. Next, the cleaned substrate W is transferred to the dryer 1004 by the transfer machine 1012, dried in the dryer 1004, and then carried out to the FOUP 1005 by the transfer machine 1013.
図４は、本実施の形態によるベベル研磨装置１０を示す平面図である。図４に示すように、本実施の形態によるベベル研磨装置１０は、基板Ｗの周縁部（エッジとベベル）を研磨するための装置であり、ハウジング１１と、ハウジング１１内で基板Ｗを保持するための基板ステージ等からなる基板吸着保持部（基板保持部）２０と、基板吸着保持部２０に保持された基板Ｗの周縁を研磨するためのベベル研磨ユニット等からなる研磨ユニット４０と、ハウジング１１内に搬入された基板Ｗを基板吸着保持部２０に載置し、また基板吸着保持部２０に保持された基板Ｗを基板吸着保持部２０から取り上げるための移載機８０と、を有している。 FIG. 4 is a plan view showing the bevel polishing apparatus 10 according to this embodiment. As shown in FIG. 4, the bevel polishing apparatus 10 according to the present embodiment is an apparatus for polishing the peripheral edge portion (edge and bevel) of the substrate W, and holds the housing 11 and the substrate W in the housing 11. Substrate suction holding unit (substrate holding unit) 20 including a substrate stage for polishing, a polishing unit 40 including a bevel polishing unit for polishing the periphery of the substrate W held by the substrate suction holding unit 20, and the housing 11. And a transfer machine 80 for placing the substrate W loaded therein into the substrate suction holding unit 20 and picking up the substrate W held by the substrate suction holding unit 20 from the substrate suction holding unit 20. There is.
このうち研磨ユニット４０は、基板吸着保持部２０に保持された基板Ｗの周縁部を研磨するものである。図示された例では、ハウジング１１内には、４つの研磨ユニット４０が設けられているが、これに限定されず、２つ、３つ、あるいは５つ以上の研磨ユニット４０が設けられていてもよい。 Of these, the polishing unit 40 is for polishing the peripheral portion of the substrate W held by the substrate suction holding unit 20. In the illustrated example, four polishing units 40 are provided in the housing 11, but the present invention is not limited to this, and two, three, or five or more polishing units 40 may be provided. Good.
図４に示すように、ハウジング１１は、その側面に開口部１２を有している。この開口部１２は、シリンダ（図示せず）により駆動されるシャッタ１３により開閉される。ハウジング１１内への基板Ｗの搬入、搬出は、搬送機１０１０（図７参照）の搬送ロボット等の基板搬送手段により行われる。例えば、図１１に示すように、第１研磨部１００１へ基板Ｗを搬入する際には、基板仮置き台１００８にある基板Ｗが、搬送機１０１０の搬送ロボットハンド上に載せられる。次いで、図４に示すように、シャッタ１３によりハウジング１１の開口部１２が開かれ、搬送機１０１０の搬送ロボットハンドから移載機８０のハンド８１０へと基板Ｗが移され、その後、移載機８０から、基板吸着保持部２０上に基板Ｗが載せられるとともに、搬送機１０１０の退避後にハウジング１１の開口部１２が閉じられる。また、例えば、第１研磨部１００１において基板Ｗのベベル部の研磨が終了した後に基板Ｗを搬出する際には、移載機８０のハンド８１０上に基板Ｗが載せられて、シャッタ１３によりハウジング１１の開口部１２が開かれる。次いで、移載機８０のハンド８１０上にある基板Ｗが、搬送機１０１０の搬送ロボットハンド上に載せられた上で、搬送機１０１０によりハウジングから搬出されて、基板仮置き台１００９に載せられるとともに、シャッタ１３によりハウジング１１の開口部１２が閉じられる。なお、シャッタ１３によりハウジング１１の開口部１２を閉じることで、ハウジング１１の内部が外部から遮断される。これにより、研磨中にハウジング１１内のクリーン度及び機密性が維持され、ハウジング１１の外部からの基板Ｗの汚染や、ハウジング１１の内部からの研磨液、パーティクル等の飛散によるハウジング１１の外部の汚染が防止される。 As shown in FIG. 4, the housing 11 has an opening 12 on its side surface. The opening 12 is opened and closed by a shutter 13 driven by a cylinder (not shown). The loading and unloading of the substrate W into and from the housing 11 is performed by a substrate transfer unit such as a transfer robot of the transfer device 1010 (see FIG. 7). For example, as shown in FIG. 11, when the substrate W is loaded into the first polishing section 1001, the substrate W on the temporary substrate rest 1008 is placed on the transfer robot hand of the transfer machine 1010. Next, as shown in FIG. 4, the opening 12 of the housing 11 is opened by the shutter 13, the substrate W is transferred from the transfer robot hand of the transfer machine 1010 to the hand 810 of the transfer machine 80, and then the transfer machine. From 80, the substrate W is placed on the substrate suction holding unit 20, and the opening 12 of the housing 11 is closed after the carrier 1010 is retracted. Further, for example, when the substrate W is carried out after the bevel portion of the substrate W is finished being polished by the first polishing section 1001, the substrate W is placed on the hand 810 of the transfer machine 80, and the shutter 13 causes the housing to move. The opening 12 of 11 is opened. Next, the substrate W on the hand 810 of the transfer device 80 is placed on the transfer robot hand of the transfer device 1010, and is then carried out of the housing by the transfer device 1010 and placed on the temporary substrate placement table 1009. The shutter 12 closes the opening 12 of the housing 11. By closing the opening 12 of the housing 11 with the shutter 13, the inside of the housing 11 is shut off from the outside. As a result, the cleanliness and airtightness inside the housing 11 are maintained during polishing, and the contamination of the substrate W from the outside of the housing 11 and the outside of the housing 11 due to the scattering of the polishing liquid, particles and the like from the inside of the housing 11 are maintained. Contamination is prevented.
次に、本実施の形態による移載機８０の構造について説明する。移載機８０は、基板Ｗの裏面を保持する基板吸着保持部２０へと基板Ｗを搬送するための装置である。基板吸着保持部２０は、例えば基板Ｗの裏面を吸着保持するステージである。 Next, the structure of the transfer machine 80 according to the present embodiment will be described. The transfer machine 80 is a device for transporting the substrate W to the substrate suction holding unit 20 that holds the back surface of the substrate W. The substrate suction holding unit 20 is, for example, a stage that holds the back surface of the substrate W by suction.
図１に示すように、移載機８０は、一対のハンド８１０と、基板Ｗの裏面を支持する支持部材８２１を有する支持部８２０と、基板Ｗの側面を保持するチャックコマ等からなる保持部材８３１を有する保持部８３０と、を有してもよい。一方のハンド８１１に２つの支持部材８２１が設けられ、他方のハンド８１２に１つの支持部材８２１が設けられ、合計３つの支持部材８２１が設けられてもよい。一方のハンド８１１に２つの保持部材８３１が設けられ、他方のハンド８１２に１つの保持部材８３１が設けられ、合計３つの保持部材８３１が設けられてもよい。移載機８０は、一対のハンド８１０を開閉方向に互いに対称に接近又は離間するように移動させる駆動部３０を有してもよい。駆動部３０による駆動は、ボールねじとＬＭガイドを用いて行われてもよい。また、特開２０１７−１１２２９１号公報で示されているように、環状ベルトを用いる構成を採用してもよい。保持部材８３１の形状としては直方体形状、立方体形状、円柱形状等の様々な形状を採用できる。図１では保持部材８３１を平面視した場合に、その形状が矩形状となる態様を示しているが、これに限られることはなく、保持部材８３１を平面視した場合に、その形状は円弧形状でもあってもよい。 As shown in FIG. 1, the transfer machine 80 includes a pair of hands 810, a support portion 820 having a support member 821 that supports the back surface of the substrate W, and a holding member including a chuck piece that holds the side surface of the substrate W. And a holding portion 830 having 831. One hand 811 may be provided with two support members 821, the other hand 812 may be provided with one support member 821, and a total of three support members 821 may be provided. One hand 811 may be provided with two holding members 831, the other hand 812 may be provided with one holding member 831, and a total of three holding members 831 may be provided. The transfer machine 80 may include the drive unit 30 that moves the pair of hands 810 so as to approach or separate from each other symmetrically in the opening/closing direction. The driving by the driving unit 30 may be performed using a ball screw and an LM guide. Further, as shown in Japanese Unexamined Patent Application Publication No. 2017-112291, a configuration using an annular belt may be adopted. As the shape of the holding member 831, various shapes such as a rectangular parallelepiped shape, a cubic shape, and a columnar shape can be adopted. Although FIG. 1 shows a mode in which the holding member 831 has a rectangular shape when viewed in plan, the shape is not limited to this, and when the holding member 831 is viewed in plan, the shape is an arc shape. May also be.
図１に示すように、他方のハンド８１２の長さは一方のハンド８１１の長さよりも短くなってもよい。但し、このような態様に限られることはなく、図４で示すように、他方のハンド８１２は一方のハンド８１１と同じ長さとなってもよい。 As shown in FIG. 1, the length of the other hand 812 may be shorter than the length of the one hand 811. However, the present invention is not limited to such an aspect, and as shown in FIG. 4, the other hand 812 may have the same length as the one hand 811.
本実施の形態では、一方のハンド８１１に設けられる２つの保持部材８３１を第一保持部材８３１ａ及び第二保持部材８３１ｂと呼び、他方のハンド８１２に設けられる１つの保持部材８３１を第三保持部材８３１ｃと呼ぶ。また、一方のハンド８１１に設けられる２つの支持部材８２１を第一支持部材８２１ａ及び第二支持部材８２１ｂと呼び、他方のハンド８１２に設けられる１つの支持部材８２１を第三支持部材８２１ｃと呼ぶ。また、一方のハンド ８１１を第一ハンド８１１と呼び、他方のハンド８１２を第二ハンド８１２と呼ぶ。ハンド８１０の延在する方向（図１の上下方向）において、第一保持部材８３１ａと第二保持部材８３１ｂとの間に第三保持部材８３１ｃが設けられてもよい。また、ハンド８１０の延在する方向において、第一支持部材８２１ａと第二支持部材８２１ｂとの間に第三支持部材８２１ｃが設けられてもよい。３つの保持部材８３１及び３つの支持部材８２１は等間隔（１２０度の角度）で配置されてもよい。 In the present embodiment, the two holding members 831 provided on one hand 811 are referred to as a first holding member 831a and a second holding member 831b, and one holding member 831 provided on the other hand 812 is referred to as a third holding member. Called 831c. The two support members 821 provided on the one hand 811 are referred to as a first support member 821a and a second support member 821b, and the one support member 821 provided on the other hand 812 is referred to as a third support member 821c. Further, one hand 811 is called a first hand 811 and the other hand 812 is called a second hand 812. A third holding member 831c may be provided between the first holding member 831a and the second holding member 831b in the extending direction of the hand 810 (vertical direction in FIG. 1). Further, the third support member 821c may be provided between the first support member 821a and the second support member 821b in the extending direction of the hand 810. The three holding members 831 and the three support members 821 may be arranged at equal intervals (angle of 120 degrees).
図３に示すように、少なくとも１つの支持部材８２１の基板Ｗの面内方向における位置を検出する面内方向位置検出部５００が設けられてもよい。面内方向位置検出部５００としてはレーザ変位計、ＣＣＤカメラ等を用いてもよい。支持部材８２１の少なくとも１つは基板Ｗの面内方向（図３の左右方向）で移動可能となってもよい。支持部材８２１の基板Ｗの面内方向における移動は第一ハンド８１１及び／又は第二ハンド８１２を駆動部３０で駆動することで調整してもよいし、支持部材８２１がハンド８１０に対して移動可能となり、ハンド８１０に対する支持部材８２１の位置が変化することで、支持部材８２１が基板Ｗの面内方向で移動してもよい。なお、本実施の形態では、基板Ｗの面内方向を水平方向とし、基板Ｗの法線方向を鉛直方向として説明するが、必ずしもこれに限られることはなく、基板Ｗの面内方向が水平方向から傾斜し、基板Ｗの法線方向が鉛直方向から傾斜してもよい。 As shown in FIG. 3, an in-plane direction position detection unit 500 that detects the position of at least one support member 821 in the in-plane direction of the substrate W may be provided. A laser displacement meter, a CCD camera, or the like may be used as the in-plane direction position detection unit 500. At least one of the support members 821 may be movable in the in-plane direction of the substrate W (left-right direction in FIG. 3). The movement of the support member 821 in the in-plane direction of the substrate W may be adjusted by driving the first hand 811 and/or the second hand 812 by the drive unit 30, or the support member 821 moves with respect to the hand 810. When the position of the supporting member 821 with respect to the hand 810 changes, the supporting member 821 may move in the in-plane direction of the substrate W. In this embodiment, the in-plane direction of the substrate W is horizontal and the normal direction of the substrate W is vertical. However, the present invention is not limited to this, and the in-plane direction of the substrate W is horizontal. May be inclined from the vertical direction, and the normal direction of the substrate W may be inclined from the vertical direction.
支持部材８２１の基板Ｗの面内方向における位置調整がハンド８１０の移動によって行われる場合には、第一ハンド８１１及び第二ハンド８１２のいずれか一方が移動可能となり、他方が固定されていてもよい。つまり、第二ハンド８１２が固定され、第一ハンド８１１が駆動部３０によって基板Ｗの面内方向で移動可能となってもよいし、第一ハンド８１１が固定され、第二ハンド８１２が駆動部３０によって基板Ｗの面内方向で移動可能となってもよい。 When the position adjustment of the support member 821 in the in-plane direction of the substrate W is performed by the movement of the hand 810, either one of the first hand 811 and the second hand 812 becomes movable, and the other hand is fixed. Good. That is, the second hand 812 may be fixed and the first hand 811 may be movable in the in-plane direction of the substrate W by the drive unit 30, or the first hand 811 may be fixed and the second hand 812 may be the drive unit. 30 may be movable in the in-plane direction of the substrate W.
ハンド８１０に対して支持部材８２１が移動可能になる態様では、第一支持部材８２１ａ、第二支持部材８２１ｂ及び第三支持部材８２１ｃのいずれか一つ以上がハンド８１０に対して移動可能となってもよい。例えば第三支持部材８３１ｃが第二ハンド８１２に対して移動可能となり、第一支持部材８２１ａ及び／又は第二支持部材８２１ｂは第一ハンド８１１に対して固定されていてもよい。また、例えば第三支持部材８２１ｃが第二ハンド８１２に対して固定されており、第一支持部材８２１ａ及び／又は第二支持部材８２１ｂが第一ハンド８１１に対して移動可能となってもよい。 In the aspect in which the support member 821 is movable with respect to the hand 810, at least one of the first support member 821a, the second support member 821b, and the third support member 821c is movable with respect to the hand 810. Good. For example, the third support member 831c may be movable with respect to the second hand 812, and the first support member 821a and/or the second support member 821b may be fixed to the first hand 811. In addition, for example, the third support member 821c may be fixed to the second hand 812, and the first support member 821a and/or the second support member 821b may be movable with respect to the first hand 811.
保持部材８３１の基板Ｗの面内方向における移動は、第一ハンド８１１及び／又は第二ハンド８１２を駆動部３０で駆動することで調整してもよいし、保持部材８３１がハンド８１０に対して面内方向調整部５５０によって移動可能となり、ハンド８１０に対する保持部材８３１の位置が変化することで、保持部材８３１が基板Ｗの面内方向で移動してもよい。面内方向調整部５５０は電気モータとリニアガイドを用いる。保持部材８３１の基板Ｗの面内方向の位置が調整されることで保持部材８３１に連結された支持部材８２１の基板Ｗの面内方向の位置も同時に調整されてもよい。 The movement of the holding member 831 in the in-plane direction of the substrate W may be adjusted by driving the first hand 811 and/or the second hand 812 with the driving unit 30, or the holding member 831 with respect to the hand 810. The holding member 831 may move in the in-plane direction of the substrate W by being movable by the in-plane direction adjusting unit 550 and changing the position of the holding member 831 with respect to the hand 810. The in-plane direction adjustment unit 550 uses an electric motor and a linear guide. By adjusting the position of the holding member 831 in the in-plane direction of the substrate W, the position of the supporting member 821 connected to the holding member 831 in the in-plane direction of the substrate W may also be adjusted at the same time.
ハンド８１０に対して保持部材８３１が移動可能になる態様では、第一保持部材８３１ａ、第二保持部材８３１ｂ及び第三保持部材８３１ｃのいずれか一つ以上がハンド８１０に対して移動可能となってもよい。例えば第三保持部材８３１ｃが第二ハンド８１２に対して移動可能となり、第一保持部材８３１ａ及び／又は第二保持部材８３１ｂは第一ハンド８１１に対して固定されていてもよい。また、例えば第三保持部材８３１ｃが第二ハンド８１２に対して固定されており、第一保持部材８３１ａ及び／又は第二保持部材８３１ｂが第一ハンド８１１に対して移動可能となってもよい。 In the aspect in which the holding member 831 is movable with respect to the hand 810, any one or more of the first holding member 831a, the second holding member 831b, and the third holding member 831c are movable with respect to the hand 810. Good. For example, the third holding member 831c may be movable with respect to the second hand 812, and the first holding member 831a and/or the second holding member 831b may be fixed to the first hand 811. Further, for example, the third holding member 831c may be fixed to the second hand 812, and the first holding member 831a and/or the second holding member 831b may be movable with respect to the first hand 811.
ハンド８１０に対する支持部材８２１及び保持部材８３１の移動は電気モータ等の駆動部８３９によって行われてもよい。支持部材８２１及び保持部材８３１の移動を行う駆動部８３９は、各支持部材８２１及び各保持部材８３１に対応してハンド８１０に取り付けられてもよいし、ハンド８１０の根元部であるボックス３５内に設けられてもよい。ハンド８１０に対する支持部材８２１及び保持部材８３１の移動は個別に行われてもよいし、ハンド８１０に対する支持部材８２１及び保持部材８３１の移動が連動して行われてもよい。 The movement of the support member 821 and the holding member 831 with respect to the hand 810 may be performed by a driving unit 839 such as an electric motor. The drive unit 839 that moves the support member 821 and the holding member 831 may be attached to the hand 810 corresponding to each support member 821 and each holding member 831, or inside the box 35 that is the base portion of the hand 810. It may be provided. The movement of the support member 821 and the holding member 831 with respect to the hand 810 may be performed individually, or the movement of the support member 821 and the holding member 831 with respect to the hand 810 may be performed together.
図２に示すように、少なくとも１つの支持部材８２１の基板Ｗの法線方向に沿った位置を検出する法線方向位置検出部５１０が設けられてもよい。法線方向位置検出部５１０としてはレーザ変位計、ＣＣＤカメラ等を用いてもよい。支持部材８２１の少なくとも１つは法線方向調整部５６０によって基板Ｗの法線方向に沿って移動可能となってもよい。支持部材８２１の基板Ｗの法線方向における移動は第一ハンド８１１及び／又は第二ハンド８１２を駆動部３０で駆動することで調整してもよいし、支持部材８２１がハンド８１０に対して移動可能となり、ハンド８１０に対する支持部材８２１の位置が変化することで、支持部材８２１が基板Ｗの法線方向で移動してもよい。支持部材８２１の位置調整にはボールねじが用いられてもよい。法線方向調整部５６０は、例えば電気モータとリニアガイドを用いる。 As shown in FIG. 2, a normal direction position detection unit 510 that detects the position of at least one support member 821 along the normal direction of the substrate W may be provided. A laser displacement meter, a CCD camera, or the like may be used as the normal direction position detection unit 510. At least one of the support members 821 may be movable along the normal direction of the substrate W by the normal direction adjustment unit 560. The movement of the support member 821 in the normal direction of the substrate W may be adjusted by driving the first hand 811 and/or the second hand 812 by the drive unit 30, or the support member 821 moves with respect to the hand 810. When the position of the supporting member 821 with respect to the hand 810 changes, the supporting member 821 may move in the normal direction of the substrate W. A ball screw may be used to adjust the position of the support member 821. The normal direction adjustment unit 560 uses, for example, an electric motor and a linear guide.
支持部材８２１の基板Ｗの法線方向における位置調整がハンド８１０の移動によって行われる場合には、第一ハンド８１１及び第二ハンド８１２のいずれか一方が移動可能となり、他方が固定されていてもよい。つまり、第二ハンド８１２が固定され、第一ハンド８１１が駆動部３０によって基板Ｗの法線方向で移動可能となってもよいし、第一ハンド８１１が固定され、第二ハンド８１２が駆動部３０によって基板Ｗの法線方向で移動可能となってもよい。 When the position of the support member 821 in the normal direction of the substrate W is adjusted by the movement of the hand 810, either one of the first hand 811 and the second hand 812 becomes movable, and the other hand is fixed. Good. That is, the second hand 812 may be fixed and the first hand 811 may be movable in the normal direction of the substrate W by the drive unit 30, or the first hand 811 may be fixed and the second hand 812 may be the drive unit. 30 may be movable in the normal direction of the substrate W.
ハンド８１０に対して支持部材８２１が移動可能になる態様では、第一支持部材８２１ａ、第二支持部材８２１ｂ及び第三支持部材８２１ｃのいずれか一つ以上がハンド８１０に対して基板Ｗの法線方向に移動可能となってもよい。例えば第三支持部材８２１ｃが第二ハンド８１２に対して基板Ｗの法線方向に移動可能となり、第一支持部材８２１ａ及び／又は第二支持部材８２１ｂは第一ハンド８１１に対して固定されていてもよい。また、例えば第三支持部材８２１ｃが第二ハンド８１２に対して固定されており、第一支持部材８２１ａ及び／又は第二支持部材８２１ｂが第一ハンド８１１に対して基板Ｗの法線方向に移動可能となってもよい。 In the mode in which the support member 821 is movable with respect to the hand 810, at least one of the first support member 821a, the second support member 821b, and the third support member 821c is a normal line of the substrate W with respect to the hand 810. It may be movable in any direction. For example, the third support member 821c is movable in the normal direction of the substrate W with respect to the second hand 812, and the first support member 821a and/or the second support member 821b is fixed to the first hand 811. Good. Further, for example, the third support member 821c is fixed to the second hand 812, and the first support member 821a and/or the second support member 821b moves in the normal direction of the substrate W with respect to the first hand 811. May be possible.
第一保持部材８３１ａと第二保持部材８３１ｂの第一ハンド８１１に対する基板Ｗの面内方向及び基板Ｗの法線方向の移動は独立して行われてもよく、第一保持部材８３１ａ及び第二保持部材８３１ｂのいずれか一方だけが第一ハンド８１１に対して移動可能となってもよい。同様に、第一支持部材８２１ａと第二支持部材８２１ｂの第一ハンド８１１に対する基板Ｗの面内方向及び基板Ｗの法線方向の移動は独立して行われてもよく、第一支持部材８２１ａ及び第二支持部材８２１ｂのいずれか一方だけが第一ハンド８１１に対して移動可能となってもよい。 The movements of the first holding member 831a and the second holding member 831b with respect to the first hand 811 in the in-plane direction of the substrate W and the normal direction of the substrate W may be performed independently. Only one of the holding members 831b may be movable with respect to the first hand 811. Similarly, the movement of the first support member 821a and the second support member 821b with respect to the first hand 811 in the in-plane direction of the substrate W and the normal direction of the substrate W may be performed independently. Only one of the second support member 821b and the second support member 821b may be movable with respect to the first hand 811.
図３に示す面内方向位置検出部５００は保持部材８３１の基板Ｗの面内方向における位置を検出可能となってもよい。また、保持部材８３１の基板Ｗの法線方向の位置を検出できる法線方向位置検出部が設けられてもよい。 The in-plane direction position detection unit 500 shown in FIG. 3 may be able to detect the position of the holding member 831 in the in-plane direction of the substrate W. Further, a normal direction position detection unit that can detect the position of the holding member 831 in the normal direction of the substrate W may be provided.
図３に示すように、保持部材８３１の少なくとも１つには、基板Ｗから当該保持部材８３１に加わる圧力を検出するロードセル等からなる圧力検出部５３０が設けられてもよい。圧力検出部５３０は基板Ｗの側面と当接する位置に設けられてもよい。圧力検出部５３０による検出結果に基づいて、保持部材８３１の基板Ｗの面内方向における位置が調整されてもよいし、支持部材８２１の基板Ｗの面内方向における位置が調整されてもよい。 As shown in FIG. 3, at least one of the holding members 831 may be provided with a pressure detection unit 530 including a load cell or the like that detects the pressure applied to the holding member 831 from the substrate W. The pressure detection unit 530 may be provided at a position where it contacts the side surface of the substrate W. The position of the holding member 831 in the in-plane direction of the substrate W may be adjusted, or the position of the support member 821 in the in-plane direction of the substrate W may be adjusted based on the detection result of the pressure detection unit 530.
前述したように（図４に示すように）、ベベル研磨装置は、移載機８０によって搬送された基板Ｗの裏面を例えば吸着保持する基板吸着保持部（基板保持部）２０と、基板吸着保持部２０によって保持された基板Ｗのベベルを研磨する研磨ユニット４０と、を有してもよい。移載機８０による基板Ｗの基板吸着保持部２０への受け渡しは図５で示されるようにして行われてもよい。より具体的には、図５（ａ）で示すように、支持部材８２１によって裏面（図５における下面）が支持され及び保持部材８３１によって側面が保持された基板Ｗが移載機８０によって搬入される。そして、図５（ｂ）に示すように、移載機８０によって搬入された基板Ｗが基板吸着保持部２０に載置され、基板Ｗの裏面が吸着保持される。その後、図５（ｃ）に示すように、移載機８０による基板Ｗの支持及び保持が解消され、移載機８０から基板Ｗが離隔される。 As described above (as shown in FIG. 4), the bevel polishing apparatus includes a substrate suction holding unit (substrate holding unit) 20 that holds the back surface of the substrate W conveyed by the transfer machine 80, for example, by suction. And a polishing unit 40 for polishing the bevel of the substrate W held by the unit 20. The transfer of the substrate W by the transfer device 80 to the substrate suction holding unit 20 may be performed as shown in FIG. More specifically, as shown in FIG. 5A, the substrate W whose back surface (lower surface in FIG. 5) is supported by the supporting member 821 and whose side surface is held by the holding member 831 is carried in by the transfer device 80. It Then, as shown in FIG. 5B, the substrate W carried in by the transfer device 80 is placed on the substrate suction holding unit 20, and the back surface of the substrate W is suction-held. After that, as shown in FIG. 5C, the support and holding of the substrate W by the transfer device 80 is released, and the substrate W is separated from the transfer device 80.
図７及び図８に示すように、研磨ユニット４０は、研磨テープ４１６と、研磨テープ４１６を基板Ｗに対して押し付けるための押圧部である研磨パッド４１２と、気体を用いて研磨テープ４１６の基板Ｗに対する押し付け力を調整する調整部であるエアシリンダ４１０とを有してもよい。 As shown in FIGS. 7 and 8, the polishing unit 40 includes a polishing tape 416, a polishing pad 412 that is a pressing portion for pressing the polishing tape 416 against the substrate W, and a substrate of the polishing tape 416 using gas. It may have an air cylinder 410 which is an adjusting unit for adjusting the pressing force against W.
図６に示すように、エアシリンダ４１０に気体供給管４５０を介して気体を供給する気体供給部４９０が設けられてもよい。気体供給管４５０には気体を貯留するための気体貯留部４４０が設けられてもよい。気体貯留部４４０は気体を貯留するためのバッファタンク等の気体貯留タンクであってもよいし（図６参照）、気体供給管４５０の一部の径が大きくなり、当該径が大きくなった部分（大径部）によって気体貯留部４４０が構成されてもよい。気体貯留部４４０は２つ以上設けられてもよいし、複数の研磨パッド４１２が用いられる場合には、各研磨パッド４１２に対応して設けられてもよい。気体貯留部４４０が気体貯留タンクからなり、複数の気体貯留タンクが設けられる場合には、１つ以上の気体貯留タンクがプロセスチャンバ内に設けられ、１つ以上の気体貯留タンクがプロセスチャンバ外に設けられてもよい。なお、気体貯留部４４０を設ける態様では、既存の装置に気体貯留部４４０を追加するだけでよいことから、設計変更が容易となる点で有益である。 As shown in FIG. 6, a gas supply unit 490 that supplies gas to the air cylinder 410 via a gas supply pipe 450 may be provided. The gas supply pipe 450 may be provided with a gas storage part 440 for storing gas. The gas storage section 440 may be a gas storage tank such as a buffer tank for storing gas (see FIG. 6), or the diameter of a part of the gas supply pipe 450 is increased and the diameter is increased. The gas storage portion 440 may be configured by the (large diameter portion). Two or more gas storage parts 440 may be provided, and when a plurality of polishing pads 412 are used, they may be provided corresponding to each polishing pad 412. When the gas storage unit 440 includes a gas storage tank and a plurality of gas storage tanks are provided, the one or more gas storage tanks are provided inside the process chamber and the one or more gas storage tanks are provided outside the process chamber. It may be provided. In addition, in the aspect in which the gas storage section 440 is provided, it is only necessary to add the gas storage section 440 to the existing device, which is advantageous in that the design change becomes easy.
図６に示すように、研磨ヘッド４１０はエアシリンダ４１１と、研磨パッド４１２とを有してもよい。エアシリンダ４１１では調圧弁４３０で調圧されたエアが作動室４１３へ供給され、研磨パッド４１２を基板Ｗへ押し付け研磨を行うようになってもよい。研磨完了後、電磁弁４２０が切り替わり作動室４１４へエアが供給されて研磨パッド４１２が退避してもよい。作動室４１３又は作動室４１４にエアを供給することで研磨パッド４１２の位置が調整されてもよい。 As shown in FIG. 6, the polishing head 410 may include an air cylinder 411 and a polishing pad 412. In the air cylinder 411, the air whose pressure is regulated by the pressure regulating valve 430 may be supplied to the working chamber 413 and the polishing pad 412 may be pressed against the substrate W to perform polishing. After the completion of polishing, the solenoid valve 420 may be switched and air may be supplied to the working chamber 414 to retract the polishing pad 412. The position of the polishing pad 412 may be adjusted by supplying air to the working chamber 413 or the working chamber 414.
研磨中の研磨ヘッド４１０の位置検出を行ってもよい。研磨ヘッド４１０の位置検出はＣＣＤカメラが設けられることで行われてもよいし、研磨ヘッド４１０内に磁気センサが設けられることで行われてもよい。位置ずれがある場合には、研磨ヘッド４１０が設定位置へ移動するようにしてもよい。研磨量と偏芯量の関係から、予め研磨ヘッド４１０の位置に関する第三閾値を設け、第三閾値を超えた場合にはエラーが発生した旨を報知部（図示せず）が報知するようにしてもよい。 The position of the polishing head 410 during polishing may be detected. The position detection of the polishing head 410 may be performed by providing a CCD camera, or may be performed by providing a magnetic sensor in the polishing head 410. When there is a positional deviation, the polishing head 410 may be moved to the set position. Based on the relationship between the polishing amount and the eccentricity amount, a third threshold value relating to the position of the polishing head 410 is set in advance, and when the third threshold value is exceeded, a notification unit (not shown) notifies that an error has occurred. May be.
図７及び図８に示すように、基板吸着保持部２０は基板Ｗの裏面を支持する支持本体部２２を有してもよい。この支持本体部２２は直径ＳＤが２６０ｍｍ〜２８５ｍｍの円形状となってもよい（図８参照）。基板Ｗがウェハからなる場合には、その直径ＷＤは２９０ｍｍ〜３１０ｍｍの円形状であってもよく、典型的には３００ｍｍの円形状となっている。このように基板Ｗの直径ＷＤと支持本体部２２の直径ＳＤとの差を小さくすることで、支持本体部２２による支点をベベル研磨ユニット４０の研磨ヘッドの作用点の近くに位置づけることができ、研磨ヘッドによる研磨中の反り量を減らすことができる。このため、多少の基板Ｗの偏芯（図７の偏芯量ｄ１参照）があっても、ベベル研磨形状のばらつきを抑えることができる。特に基板保持部として基板吸着保持部２０を採用する場合には基板Ｗは裏面側に吸引されることから支持本体部２２で支持されていない基板Ｗの周縁部が裏面側にだれる傾向になる。したがって、支持本体部２２の直径ＳＤを大きくすることはより有益となる。なお、直径３００ｍｍのウェハを基板Ｗとして用いる場合には、典型的には支持本体部２２の直径は２３５ｍｍ程度であることから、支持本体部２２の直径を２６０ｍｍ以上とすることによって支点と作用点とをかなり近づけることができ、支持本体部２２の直径を２６５ｍｍ以上とすることによってより一層近づけることができる。この結果、研磨ヘッドによる研磨中の反り量をより確実に減らすことができる。但し、図８で示すように基板Ｗの裏面を研磨する必要がある場合には、支持本体部２２の直径ＳＤの大きさを大きくしすぎることはできず、例えば支持本体部２２の直径ＳＤを２６５ｍｍ〜２７０ｍｍとすることが考えられる。 As shown in FIGS. 7 and 8, the substrate suction holder 20 may include a support body 22 that supports the back surface of the substrate W. The support body 22 may have a circular shape with a diameter SD of 260 mm to 285 mm (see FIG. 8). When the substrate W is a wafer, its diameter WD may be a circular shape of 290 mm to 310 mm, and is typically a circular shape of 300 mm. By reducing the difference between the diameter WD of the substrate W and the diameter SD of the support body portion 22 in this way, the fulcrum of the support body portion 22 can be positioned near the working point of the polishing head of the bevel polishing unit 40. The amount of warpage during polishing by the polishing head can be reduced. Therefore, even if there is some eccentricity of the substrate W (see the eccentricity amount d1 in FIG. 7), it is possible to suppress variations in the bevel polishing shape. In particular, when the substrate suction holding unit 20 is adopted as the substrate holding unit, the substrate W is sucked to the back surface side, so that the peripheral edge of the substrate W not supported by the support body 22 tends to sag to the back surface side. .. Therefore, it is more beneficial to increase the diameter SD of the support body portion 22. When a wafer having a diameter of 300 mm is used as the substrate W, the diameter of the support main body 22 is typically about 235 mm. Therefore, by setting the diameter of the support main body 22 to 260 mm or more, the fulcrum and the operating point Can be made to be considerably close to each other, and can be further made closer by setting the diameter of the support main body portion 22 to be 265 mm or more. As a result, the amount of warpage during polishing by the polishing head can be reduced more reliably. However, as shown in FIG. 8, when the back surface of the substrate W needs to be polished, the diameter SD of the support body 22 cannot be made too large. It can be considered to be 265 mm to 270 mm.
発明者らが確認したところ、支持部材８２１と基板吸着保持部２０で保持される基板Ｗの裏面との距離ｄ２（図１０（ａ）参照）が大きくなり、例えば０．５０ｍｍ以上となると、移載機８０のハンド８１０が下降して基板Ｗが基板吸着保持部２０に受け渡される際に基板Ｗのたわみが大きくなる（図１０（ｂ）参照）。このようなたわみは移載機８０の保持部材８３１が離隔する際に解消するが基板Ｗの面内方向でのずれとして残ってしまい、偏芯の原因となり得る。このため、移載機８０のハンド８１０が下降して基板Ｗが基板吸着保持部２０に受け渡される際の支持部材８２１と基板吸着保持部２０で保持される基板Ｗの裏面との距離ｄ２を小さくして、０．２０ｍｍ〜０．４０ｍｍ（例えば０．３５ｍｍ）とすることで、基板Ｗの面内のいかなる場所でもこのようなたわみが発生することを防止でき、ひいては基板Ｗの偏芯を防止できる。 As a result of confirmation by the inventors, when the distance d2 (see FIG. 10A) between the support member 821 and the back surface of the substrate W held by the substrate suction holding unit 20 becomes large, for example, 0.50 mm or more, the transfer When the hand 810 of the mounting machine 80 descends and the substrate W is transferred to the substrate suction holding unit 20, the deflection of the substrate W increases (see FIG. 10B). Such deflection is resolved when the holding member 831 of the transfer machine 80 separates, but remains as a shift in the in-plane direction of the substrate W, which may cause eccentricity. Therefore, the distance d2 between the support member 821 and the back surface of the substrate W held by the substrate suction holding unit 20 when the hand 810 of the transfer machine 80 is lowered to transfer the substrate W to the substrate suction holding unit 20. By reducing the size to 0.20 mm to 0.40 mm (for example, 0.35 mm), it is possible to prevent such deflection from occurring anywhere in the plane of the substrate W, and thus to prevent the eccentricity of the substrate W from occurring. It can be prevented.
基板吸着保持部２０は、ダスト付着を防止するためにノズルから供給される純水等のリンス液により保湿されてもよい（図９（ａ）の（１）参照）。但し、この場合には、リンス液が支持本体部２２に存在することから、移載機８０から基板吸着保持部２０へと基板Ｗを受け渡す際にリンス液によって基板Ｗが滑ってしまい、基板Ｗの位置が定まらないことも考えられる。このため、移載機８０によって基板Ｗを支持本体部２２に載置する第一時間前に、支持本体部２２を回転させるように制御されてもよい（図９（ａ）の（２）及び図９（ｂ）参照）。この際の回転（液切り回転）は例えば２００ｒｐｍで４秒間行われてもよい。この結果、基板Ｗが滑る要因となるリンス液を支持本体部２２から取り除くことができる。前述した第一時間は例えば５〜１０秒であり、第一時間前に支持本体部２２が回転され、当該回転が終了した後で移載機８０から基板吸着保持部２０へと基板Ｗが受け渡されることになる。 The substrate adsorption holding unit 20 may be moisturized with a rinse liquid such as pure water supplied from a nozzle to prevent dust adhesion (see (1) in FIG. 9A). However, in this case, since the rinse liquid is present in the support body portion 22, the substrate W is slipped by the rinse liquid when the substrate W is transferred from the transfer machine 80 to the substrate suction holding portion 20, and the substrate W It is also possible that the position of W is not fixed. Therefore, it may be controlled to rotate the support main body 22 by the transfer device 80 before the first time of placing the substrate W on the support main body 22 ((2) and (2) in FIG. 9A). See FIG. 9B). The rotation (drainage rotation) at this time may be performed, for example, at 200 rpm for 4 seconds. As a result, the rinse liquid that causes the substrate W to slip can be removed from the support body portion 22. The above-mentioned first time is, for example, 5 to 10 seconds, and the support body 22 is rotated before the first time, and after the rotation is completed, the substrate W is received from the transfer machine 80 to the substrate suction holder 20. Will be handed over.
《効果》
次に、上述した構成からなる本実施の形態による効果であって、未だ説明していないものを中心に説明する。「構成」で記載されていない場合であっても、「効果」で説明するあらゆる構成を本件発明において採用することができる。
"effect"
Next, the effects of the present embodiment having the above-described configuration, which are not described yet, will be mainly described. Even if it is not described in “configuration”, any configuration described in “effect” can be adopted in the present invention.
保持部８３０が第一ハンド８１１に設けられた２つの支持部材８２１と第二ハンド８１２に設けられた１つの支持部材８２１とを有する態様を採用した場合には、３つの支持部材８２１を用いることで、基板Ｗの載置されうる面を一意に定め、基板吸着保持部２０への受け渡しの位置精度を上げることができる。４つの支持部材８２１を用いた場合、基板Ｗは支持部材８２１の高さのばらつきによって１つの支持部材８２１が基板Ｗの裏面に当接せず、基板Ｗの裏面が浮いてしまうことがある。そして、どの支持部材８２１が基板Ｗの裏面に当接しないかは基板Ｗの移載機８０への置き方や基板Ｗの重心等によって一義的に決まらないことがある。例えば対角線上にある２つの支持部材８２１の高さが高い場合には、一方のアームに設けられた支持部材８２１に基板Ｗの裏面が当接するのか、他方のアームに設けられた支持部材８２１に基板Ｗの裏面が当接するのかが一義的に決まらない。この結果、４つの支持部材８２１を用いた場合には、基板吸着保持部２０への受け渡しの位置精度が悪くなり、受け渡し位置がずれてしまい、ひいては、基板吸着保持部２０の中心と基板Ｗの中心との間の偏芯量ｄ１（図７参照）が大きくなることがある。他方、前述した態様を採用した場合には、このような問題を解決することができる。 When the holding portion 830 adopts a mode having two support members 821 provided on the first hand 811 and one support member 821 provided on the second hand 812, use three support members 821. Thus, the surface on which the substrate W can be placed is uniquely determined, and the position accuracy of delivery to the substrate suction holding unit 20 can be improved. When the four support members 821 are used, in the substrate W, one support member 821 may not come into contact with the back surface of the substrate W due to variations in the height of the support member 821, and the back surface of the substrate W may float. Which of the support members 821 does not contact the back surface of the substrate W may not be uniquely determined depending on the placement of the substrate W on the transfer device 80, the center of gravity of the substrate W, and the like. For example, when the heights of the two support members 821 on the diagonal line are high, the back surface of the substrate W abuts on the support member 821 provided on one arm, or the support member 821 provided on the other arm. It is not uniquely determined whether the back surface of the substrate W contacts. As a result, when the four support members 821 are used, the position accuracy of delivery to the substrate suction holding unit 20 becomes poor, the delivery position is displaced, and by extension, the center of the substrate suction holding unit 20 and the substrate W. The eccentricity d1 (see FIG. 7) between the center and the center may increase. On the other hand, when the above-mentioned aspect is adopted, such a problem can be solved.
図１に示すように第二ハンド８１２の長さを第一ハンド８１１の長さよりも短くする態様を採用した場合には、第二ハンド８１２の面内方向でスペースを形成することができる。この結果、装置全体の大きさを小型化することができる。 When a mode in which the length of the second hand 812 is shorter than the length of the first hand 811 as shown in FIG. 1 is adopted, a space can be formed in the in-plane direction of the second hand 812. As a result, the size of the entire device can be reduced.
少なくとも１つの支持部材８２１の基板Ｗの面内方向における位置を検出する面内方向位置検出部５００が設けられる態様を採用した場合には（図３参照）、面内方向位置検出部５００の検出結果に基づいて支持部材８２１の基板Ｗの面内方向における位置を調整することができる。複数の支持部材８２１の基板Ｗの中心からの距離に第一閾値以上の差異があると、保持部材８３１によるクランプ時に基板Ｗが保持部材８３１と均等に当接せずに隙間が空いてしまうことがある。この結果、移載機８０から基板吸着保持部２０への基板Ｗの受け渡し位置がずれてしまうことがある。この点、面内方向位置検出部５００の検出結果に基づいて支持部材８２１の基板Ｗの面内方向における位置を調整することで、このような事態が発生することを防止できる。 When the aspect in which the in-plane direction position detection unit 500 that detects the position of at least one support member 821 in the in-plane direction of the substrate W is provided (see FIG. 3), the detection of the in-plane direction position detection unit 500 is performed. The position of the supporting member 821 in the in-plane direction of the substrate W can be adjusted based on the result. If the distances of the plurality of supporting members 821 from the center of the substrate W differ by a first threshold value or more, the substrate W may not evenly contact the holding member 831 during clamping by the holding member 831 and a gap may be left. There is. As a result, the transfer position of the substrate W from the transfer machine 80 to the substrate suction holding unit 20 may be displaced. In this respect, such a situation can be prevented from occurring by adjusting the position of the support member 821 in the in-plane direction of the substrate W based on the detection result of the in-plane direction position detection unit 500.
少なくとも１つの支持部材８２１の基板Ｗの法線方向に沿った位置を検出する法線方向位置検出部５１０が設けられる態様を採用した場合には（図２参照）、法線方向位置検出部５１０の検出結果に基づいて支持部材８２１の基板Ｗの法線方向における位置を調整することができる。複数の支持部材８２１において高さ方向の位置が第二閾値以上でずれていると基板Ｗが傾いてしまい、移載機８０から基板吸着保持部２０への基板Ｗの受け渡し位置がずれてしまうことがある。この点、法線方向位置検出部５１０の検出結果に基づいて支持部材８２１の基板Ｗの法線方向における位置を調整することで、基板Ｗの傾きを調整することができ、基板吸着保持部２０への受け渡しの位置精度を向上させることができる。 When the aspect in which the normal direction position detection unit 510 that detects the position of at least one support member 821 along the normal direction of the substrate W is provided (see FIG. 2), the normal direction position detection unit 510 is used. The position of the supporting member 821 in the normal direction of the substrate W can be adjusted based on the detection result of 1. If the positions in the height direction of the plurality of support members 821 are displaced by a second threshold value or more, the substrate W is tilted, and the transfer position of the substrate W from the transfer machine 80 to the substrate suction holding unit 20 is displaced. There is. In this regard, the tilt of the substrate W can be adjusted by adjusting the position of the support member 821 in the normal direction of the substrate W based on the detection result of the normal direction position detection unit 510, and the substrate suction holding unit 20. It is possible to improve the positional accuracy of delivery to and from.
基板Ｗから保持部材８３１に加わる圧力を検出する圧力検出部５３０が設けられる態様を採用した場合には、圧力検出部５３０によって検出される圧力が同程度の値になるように制御部５０が制御することで基板Ｗを複数配設された保持部材８３１によって均等にクランプすることができ、基板吸着保持部２０への受け渡しの位置精度を向上させることができる。 When the aspect in which the pressure detection unit 530 that detects the pressure applied to the holding member 831 from the substrate W is provided is adopted, the control unit 50 controls so that the pressures detected by the pressure detection unit 530 have the same value. By doing so, the plurality of substrates W can be uniformly clamped by the plurality of holding members 831 provided, and the positional accuracy of delivery to the substrate suction holding unit 20 can be improved.
エアシリンダ４１０等の調整部に気体を供給する気体供給管４５０にエア等の気体を貯留するための気体貯留部４４０が設けられる態様を採用した場合には（図６参照）、エアシリンダ４１０等の調整部への気体の供給を即座に行うことができ、基板Ｗの外周位置の変化に追従することができる。図６に示す例で説明すると、回転中の偏芯が所定距離より大きくなると、研磨中に瞬間的に研磨パッド４１２が基板Ｗの側面から離れる瞬間が発生する。この点、バッファタンク等からなる気体貯留部４４０にエアが充填されている場合には、即座に作動室４１３へとエア等の気体が供給され、基板Ｗの外周位置の変化に追従することができる。このため、基板Ｗのベベル部を均一に研磨することができる。またこのような気体貯留部４４０を設けることで、変動容積が減少し、圧力変動率が低下する。このため、円形状からなるウェハ等の基板Ｗに偏芯があったとしても、基板Ｗの全周を一定圧力にて研磨することができる。研磨パッド４１２の基板Ｗへの追従を高めたい場合にはエアシリンダ４１０に供給されるエア等の気体の圧力を上げてもよい。また気体貯留部４４０が設けられる態様では、研磨パッド４１２が押し返されたときに、ショックアブソーバとしての効果も発揮する。 When the gas supply pipe 450 for supplying gas to the adjustment unit such as the air cylinder 410 is provided with the gas storage unit 440 for storing gas such as air (see FIG. 6), the air cylinder 410, etc. It is possible to immediately supply the gas to the adjusting section of (3) and follow the change of the outer peripheral position of the substrate W. In the example shown in FIG. 6, when the eccentricity during rotation becomes larger than a predetermined distance, the polishing pad 412 momentarily separates from the side surface of the substrate W during polishing. In this respect, when air is filled in the gas storage portion 440 including a buffer tank or the like, a gas such as air is immediately supplied to the working chamber 413 to follow the change in the outer peripheral position of the substrate W. it can. Therefore, the bevel portion of the substrate W can be uniformly polished. Further, by providing such a gas storage section 440, the fluctuating volume decreases and the pressure fluctuation rate decreases. Therefore, even if the substrate W such as a circular wafer has eccentricity, the entire circumference of the substrate W can be polished at a constant pressure. When it is desired to increase the followability of the polishing pad 412 to the substrate W, the pressure of gas such as air supplied to the air cylinder 410 may be increased. Further, in the aspect in which the gas storage section 440 is provided, when the polishing pad 412 is pushed back, the effect as a shock absorber is also exhibited.
研磨パッド４１２の材料としては反発弾性に優れた材料を用いてもよい。反発弾性に優れた材料を採用した場合には、研磨パッド４１２が変形した後の回復速度が速くなり、基板Ｗの外周位置変化に対する追従性を高めることができる。反発弾性に優れた材料としては例えばシリコンスポンジ等を用いることができる。 A material having excellent impact resilience may be used as the material of the polishing pad 412. When a material excellent in impact resilience is adopted, the recovery speed after the polishing pad 412 is deformed is increased, and the followability to the change in the outer peripheral position of the substrate W can be improved. As a material having excellent impact resilience, for example, silicon sponge can be used.
４つの保持部材８３１と比較して３つの保持部材８３１を採用する場合には基板Ｗの製造誤差による影響を受けやすくなる懸念がある。つまり、基板Ｗがウェハからなる場合には直径３００±０．２ｍｍの製造誤差が認められている関係で、基板Ｗの大きさの製造誤差によって基板Ｗの中心がずれてしまい、偏芯の原因となり得る。また、装置の繰り返し誤差によって基板Ｗの中心がずれて偏芯してしまうこともある。このため、３つの保持部材８３１が設けられる態様で保持部材８３１の面内方向の位置（駆動開始位置）を調整できる態様を採用することは非常に有益である。また、基板Ｗの製造誤差の影響を受け難くするために、保持部材８３１の移動量が常に同じ値になるような機構を採用してもよい。一例としては、保持部材８３１の面内方向の駆動開始位置が基板Ｗの中心から同じ距離になるように面内方向位置検出部５００及び面内方向調整部５５０を用いて調整したうえで、各保持部材８３１が面内方向で同じ距離だけ移動するように制御してもよいし、各保持部材８３１の移動距離が同じ値となるような機械的な構成を採用してもよい。 When the three holding members 831 are adopted as compared with the four holding members 831, there is a concern that the manufacturing error of the substrate W may be more likely to be affected. That is, when the substrate W is made of a wafer, a manufacturing error of 300±0.2 mm in diameter is recognized, and the center of the substrate W is displaced due to the manufacturing error of the size of the substrate W, which causes the eccentricity. Can be. Further, the center of the substrate W may be deviated and eccentric due to a repeat error of the apparatus. Therefore, it is very useful to adopt a mode in which the position (driving start position) of the holding member 831 in the in-plane direction can be adjusted in a mode in which the three holding members 831 are provided. Further, in order to make it difficult to be influenced by the manufacturing error of the substrate W, a mechanism may be adopted in which the movement amount of the holding member 831 is always the same value. As an example, after adjusting using the in-plane direction position detection unit 500 and the in-plane direction adjustment unit 550 such that the drive start position of the holding member 831 in the in-plane direction is the same distance from the center of the substrate W, The holding members 831 may be controlled to move by the same distance in the in-plane direction, or a mechanical configuration may be adopted in which the holding members 831 have the same moving distance.
保持部材８３１によって基板Ｗの側面が保持された後、基板吸着保持部２０に対する基板Ｗのセンタリング（基板の面内方向での位置調整）が行われ、その後、基板Ｗを基板吸着保持部２０へ向かう搬送が行われる場合において、保持部材８３１によって基板Ｗの側面が保持されてから保持部材８３１及び支持部材８２１が基板Ｗを基板吸着保持部２０へ向かう移動（第一移動）を開始するまで（下降を開始するまで）の時間が所定時間Ｔ（例えば２〜５秒のいずれかの値であり、好ましくは３〜５秒のいずれかの値）となるように制御部５０が制御してもよい。一例として、保持部材８３１による基板Ｗの保持、基板Ｗの基板吸着保持部２０へ向かう移動（第一移動）、基板吸着保持部２０への接触の関係は図１２に示すような関係となる。つまり、（１）保持部材８３１によって基板Ｗの側面が保持されてから所定時間Ｔの間、基板Ｗの基板吸着保持部２０へ向かう移動（第一移動）を開始せず、（２）基板Ｗの側面が保持されてから所定時間Ｔが経過した時点で基板Ｗの基板吸着保持部２０へ向かう移動（第一移動）を開始し（図５（ａ）では下降を開始しており、図１２では「ハンドの下降」として記載している。）、（３）基板Ｗの裏面が板吸着保持部２０に接触して載置された後で保持部材８３１による基板Ｗの保持が解消される（図５（ｂ）（ｃ）参照）。 After the side surface of the substrate W is held by the holding member 831, the substrate W is centered (positional adjustment in the in-plane direction of the substrate) with respect to the substrate suction holding unit 20, and then the substrate W is moved to the substrate suction holding unit 20. In the case where the conveyance is performed toward the side, until the side surface of the substrate W is held by the holding member 831 and the holding member 831 and the supporting member 821 start moving the substrate W toward the substrate suction holding unit 20 (first movement) ( Even if the control unit 50 controls such that the time (until the descent is started) becomes the predetermined time T (for example, any value of 2 to 5 seconds, preferably any value of 3 to 5 seconds). Good. As an example, the relationship between the holding of the substrate W by the holding member 831, the movement of the substrate W toward the substrate suction holding unit 20 (first movement), and the contact with the substrate suction holding unit 20 is as shown in FIG. That is, (1) the movement (first movement) of the substrate W toward the substrate suction holding unit 20 does not start for a predetermined time T after the side surface of the substrate W is held by the holding member 831, and (2) the substrate W When the predetermined time T elapses after the side surface of the substrate W is held, the movement (first movement) of the substrate W toward the substrate suction holding unit 20 is started (in FIG. 5A, the descent is started, and FIG. Is described as "hand lowering"). (3) The holding of the substrate W by the holding member 831 is released after the back surface of the substrate W is placed in contact with the plate suction holding unit 20 ( 5(b)(c)).
一般的に、保持部材８３１によるクランプ力は、基板Ｗの把持開始から徐々に上昇することが分かっている。また、基板Ｗの把持直後（例えば基板Ｗの側面を把持して１秒後）は保持部材８３１によるクランプ力がバラつくことも分かっている。一例を示すと、図１３に示すようなバラつきがみられる。このようにクランプ力がバラつくことは、移載機８０において基板Ｗのクランプ位置がバラつくことを意味する。そして、クランプ力が一定でない状態でハンド８１０が移動して基板Ｗを基板吸着保持部２０に受け渡すと、基板Ｗの基板吸着保持部２０への当接状態や基板Ｗと保持部材８３１との当接状態が変化することから、基板吸着保持部２０への基板Ｗの受け渡し位置がバラついてしまう。 It is generally known that the clamping force of the holding member 831 gradually increases from the start of gripping the substrate W. It is also known that the clamping force by the holding member 831 varies immediately after the substrate W is gripped (for example, 1 second after the side surface of the substrate W is gripped). As an example, there are variations as shown in FIG. The variation in the clamping force means that the clamping position of the substrate W in the transfer machine 80 varies. Then, when the hand 810 moves and delivers the substrate W to the substrate suction holding unit 20 in a state where the clamping force is not constant, the contact state of the substrate W with the substrate suction holding unit 20 or the substrate W and the holding member 831. Since the contact state changes, the delivery position of the substrate W to the substrate suction holding unit 20 varies.
この点、本態様のように保持部材８３１によって基板Ｗの側面が保持されてから、保持部材８３１及び支持部材８２１が基板Ｗを基板吸着保持部２０へ向かう搬送を開始するまでの時間が所定時間Ｔとなるように制御部５０が制御することで、保持部材８３１によるクランプ力を一定の状態として基板Ｗの基板吸着保持部２０への受け渡しを行うことができ、基板Ｗの基板吸着保持部２０への受け渡しの位置精度を向上させることができる。なお、所定時間Ｔとして２〜５秒（好ましくは３〜５秒）の値を採用することで、スループットへ影響がでることを極力抑えつつ、基板Ｗの基板吸着保持部２０への受け渡しの位置精度を向上させることができる点で有益である。移載機８０の待機時間が長い場合、移載機８０のハンド８１０の摺動部材、例えばボールスプラインシャフトの摺動部の固着を防ぐため、ハンド８１０を定期的に、基板Ｗを持たない状態で、クランプ及びアンクランプを繰り返してもよい。例えば、移載機８０が基板Ｗをセンタリングする前に、クランプ、アンクランプを１〜３回繰り返してもよい。 In this respect, the time from when the side surface of the substrate W is held by the holding member 831 as in the present embodiment until when the holding member 831 and the supporting member 821 start transporting the substrate W toward the substrate suction holding unit 20 is a predetermined time. When the control unit 50 controls the holding force of the holding member 831 to be T, the substrate W can be transferred to the substrate suction holding unit 20 with the clamping force of the holding member 831 kept constant. It is possible to improve the positional accuracy of delivery to and from. By adopting a value of 2 to 5 seconds (preferably 3 to 5 seconds) as the predetermined time T, the position at which the substrate W is transferred to the substrate suction holding unit 20 is suppressed while minimizing the influence on the throughput. This is useful in that the accuracy can be improved. When the waiting time of the transfer machine 80 is long, in order to prevent the sliding member of the hand 810 of the transfer machine 80, for example, the sliding portion of the ball spline shaft from sticking, the hand 810 is regularly held without the substrate W. Then, the clamp and unclamp may be repeated. For example, clamping and unclamping may be repeated 1 to 3 times before the transfer machine 80 centers the substrate W.
上述した態様では３つの保持部材８３１及び３つの支持部材８２１を用いる態様を用いて説明したが、これに限られることはなく、図１４に示すように４つ以上の保持部材８３１及び４つ以上の支持部材８２１が用いられてもよい。 In the above-described mode, the mode using the three holding members 831 and the three supporting members 821 has been described, but the present invention is not limited to this, and as illustrated in FIG. 14, four or more holding members 831 and four or more holding members 831. The supporting member 821 may be used.
上述した実施の形態の記載及び図面の開示は、特許請求の範囲に記載された発明を説明するための一例に過ぎず、上述した実施の形態の記載又は図面の開示によって特許請求の範囲に記載された発明が限定されることはない。また、出願当初の請求項の記載はあくまでも一例であり、明細書、図面等の記載に基づき、請求項の記載を適宜変更することもできる。 The above description of the embodiments and the disclosure of the drawings are merely examples for explaining the invention described in the claims, and are described in the claims by the description of the above embodiments or the disclosure of the drawings. The claimed invention is not limited. Further, the description of the claims at the beginning of the application is merely an example, and the description of the claims may be appropriately changed based on the description of the specification, drawings and the like.
２０・・・基板吸着保持部、２２・・・支持本体部、４０・・・研磨ユニット、８０・・・移載機、４４０・・・気体貯留部、４５０・・・気体供給管、４９０・・・気体供給部、５００・・・面内方向位置検出部、５１０・・・法線方向位置検出部、５３０・・・圧力検出部、８１０・・・ハンド、８２０・・・支持部、８２１・・・支持部材、８３０・・・保持部、８３１・・・保持部材、Ｗ・・・基板 20... Substrate adsorption and holding section, 22... Support main body section, 40... Polishing unit, 80... Transfer machine, 440... Gas storage section, 450... Gas supply pipe, 490... ..Gas supply unit, 500... In-plane direction position detection unit, 510... Normal direction position detection unit, 530... Pressure detection unit, 810... Hand, 820... Support unit, 821 ... Supporting member, 830... Holding part, 831... Holding member, W... Substrate
Claims (11)
一対のハンドと、
前記ハンドに設けられ、基板の裏面を支持する支持部材と、
前記ハンドに設けられ、前記支持部材で支持されている基板の側面を保持する保持部材と、
を備え、
前記支持部材は３つ設けられ、
一方のハンドに２つの支持部材が設けられ、他方のハンドに１つの支持部材が設けられる、移載機。 A transfer machine that conveys a substrate to a substrate holding unit that holds the back surface of the substrate,
A pair of hands,
A support member provided on the hand and supporting the back surface of the substrate,
A holding member which is provided on the hand and holds a side surface of the substrate which is supported by the supporting member,
Equipped with
Three support members are provided,
A transfer machine in which one hand is provided with two support members and the other hand is provided with one support member.
前記支持部材の少なくとも１つは前記基板の面内方向で移動可能となる、請求項１又は２のいずれかに記載の移載機。 Further comprising an in-plane direction position detection unit that detects the position of at least one support member in the in-plane direction of the substrate,
The transfer machine according to claim 1, wherein at least one of the support members is movable in the in-plane direction of the substrate.
一対のハンドと、
前記ハンドに設けられ、基板の裏面を支持する支持部材と、
前記ハンドに設けられ、前記支持部材で支持されている基板の側面を保持する保持部材と、
少なくとも１つの前記支持部材の前記基板の面内方向における位置を検出する面内方向位置検出部と、
を備え、
前記支持部材の少なくとも１つは前記基板の面内方向で移動可能となる、移載機。 A transfer machine that conveys a substrate to a substrate holding unit that holds the back surface of the substrate,
A pair of hands,
A support member provided on the hand and supporting the back surface of the substrate,
A holding member which is provided on the hand and holds a side surface of the substrate which is supported by the supporting member,
An in-plane direction position detection unit that detects the position of at least one of the support members in the in-plane direction of the substrate;
Equipped with
A transfer machine in which at least one of the support members is movable in the in-plane direction of the substrate.
前記支持部材の少なくとも１つは前記基板の法線方向に沿って移動可能となる、請求項１乃至４のいずれか１項に記載の移載機。 Further comprising a normal direction position detection unit that detects a position of at least one of the supporting members along the normal direction of the substrate,
The transfer machine according to claim 1, wherein at least one of the support members is movable along a direction normal to the substrate.
前記基板保持部によって保持された基板のベベルを研磨する研磨ユニットと、
を備え、
前記研磨ユニットは、研磨テープと、前記研磨テープを基板に対して押し付けるための押圧部と、気体を用いて前記研磨テープの前記基板に対する押し付け力を調整する調整部と、を有し、
前記調整部に気体供給管を介して気体を供給する気体供給部が設けられ、
前記気体供給管には気体を貯留するための気体貯留部が設けられる、ベベル研磨装置。 A substrate holding unit that holds the back surface of the substrate transported by the transfer machine according to claim 1.
A polishing unit for polishing the bevel of the substrate held by the substrate holder,
Equipped with
The polishing unit has a polishing tape, a pressing unit for pressing the polishing tape against the substrate, and an adjusting unit for adjusting the pressing force of the polishing tape against the substrate using gas,
A gas supply unit that supplies gas to the adjustment unit via a gas supply pipe is provided.
A bevel polishing device, wherein the gas supply pipe is provided with a gas storage part for storing gas.
前記基板は直径が２９９ｍｍ〜３０１ｍｍの円形状からなり、
前記支持本体部は直径が２６０ｍｍ〜２８５ｍｍの円形状となっている、請求項７に記載のベベル研磨装置。 The substrate holding portion has a support body portion that supports the back surface of the substrate,
The substrate has a circular shape with a diameter of 299 mm to 301 mm,
The bevel polishing apparatus according to claim 7, wherein the support body has a circular shape with a diameter of 260 mm to 285 mm.
前記移載機によって前記基板を前記支持本体部に載置する第一時間前に、前記支持本体部を回転させるように制御する制御部が設けられる、請求項７又は８のいずれかに記載のベベル研磨装置。 The substrate holding portion has a support body portion that supports the back surface of the substrate,
9. The controller according to claim 7, wherein a control unit that controls to rotate the support main body is provided before a first time when the substrate is placed on the support main body by the transfer machine. Bevel polishing device.
前記制御部は、前記保持部材によって前記基板を保持してから所定時間Ｔが経過した後で、前記移載機による前記第一移動を開始させる、請求項７乃至９のいずれか１項に記載のベベル研磨装置。 After adjusting the position of the substrate in the in-plane direction with respect to the substrate holding unit, a control unit for performing a first movement that is a movement of the substrate toward the substrate holding unit by the transfer machine,
10. The control section starts the first movement by the transfer machine after a predetermined time T has elapsed after the substrate is held by the holding member. Bevel polishing equipment.
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