JP2020077653A - 載置台、エッジリングの位置決め方法及び基板処理装置 - Google Patents
載置台、エッジリングの位置決め方法及び基板処理装置 Download PDFInfo
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Abstract
Description
図1は、一実施形態に係る基板処理装置1の一例を示す図である。本実施形態にかかる基板処理装置1は、容量結合型の平行平板処理装置であり、例えば表面が陽極酸化処理されたアルミニウムからなる円筒状の処理容器10を有している。処理容器10は接地されている。
次に、温度変化による伸縮に基づくエッジリング24の位置の偏りについて、図2を参照して説明する。図2(a)〜(d)の上段は、ウエハWを載置する静電チャック20の載置面120とエッジリング24とを平面視した図である。図2(a)〜(d)の下段は、図2(a)〜(d)の上段のA−A面で示した、静電チャック20とエッジリング24との断面の一部を拡大した図である。
以下、本実施形態に係るエッジリング24の調芯動作について、図3を参照して説明する。図3(a)〜(d)の上段は、載置面120とエッジリング24とを平面視した図である。図3(a)〜(d)の下段は、図3(a)〜(d)の上段に対応する静電チャック20とエッジリング24との断面の一部を拡大した図である。
図4を参照して、本実施形態に係るエッジリング24の調芯動作の結果を、比較例と比較して説明する。図4の比較例は、図2にて説明したエッジリング24と静電チャック20との隙間Sの実験結果の一例を示す。図4の本実施形態は、図3にて説明したエッジリング24と静電チャック20との隙間Sの実験結果の一例を示す。両グラフの横軸は、「Measurement point」に示すエッジリング24と静電チャック20との隙間Sを、真上の方向を0°(360°)として、右横方向(90°)、下方向(180°)、左横方向(270°)に対して45°の間隔で測定する。そして、その測定値を、縦軸のクリアランスに示す。縦軸には各角度における隙間Sの測定値が任意単位(arbitrary unit)で示されている。
次に、図5を参照して伸縮性のある部材について例を挙げて説明する。図5の実施例1及び実施例2は、伸縮性のある部材の一例を示す。図5の実施例1及び実施例2は、図3(a)及び(d)に示す載置面121の高さにて、静電チャック20と、バネ部材25と、段差部26aに設けられたインシュレータリング26とを上面から見た図である。
次に、図6を参照して一実施形態の変形例に係る載置台16の構成について例を挙げて説明する。図6(a)〜(d)は、変形例に係る載置台16の静電チャック20とエッジリング24との断面の一部を拡大した図である。
最後に、一実施形態に係るエッジリングの位置決め方法について、図7のフローチャートを参照して説明する。本処理は、主に制御部200により制御される。
10 処理容器
16 載置台
16a 基台
20 静電チャック
20a 第1の電極
20c 凹部
21 第2の電極
22、23 直流電源
24 エッジリング
24a 凹部
25 バネ部材
26 インシュレータリング
26a 段差部
34 上部電極
48 第2の高周波電源
50 可変直流電源
90 第1の高周波電源
120、121 載置面
200 制御部
S エッジリングと静電チャックとの隙間
Claims (10)
- 基板の周囲に配置され、下部に第1の凹部を有するエッジリングと、
前記基板を載置する第1載置面と前記エッジリングを載置する第2載置面とを有し、前記第2載置面に対向して電極が埋め込まれた静電チャックと、
前記静電チャックの周囲に配置され、第2の凹部を有する環状部材と、
前記第1の凹部と前記静電チャックと前記第2の凹部とで囲まれる空間に配置された、伸縮性のある部材と、
を有する載置台。 - 基板の周囲に配置され、下部に第1の凹部が形成されたエッジリングと、
前記基板を載置する第1載置面と前記エッジリングを載置する第2載置面とを有し、前記第2載置面に対向して電極が埋め込まれ、前記第2載置面に第2の凹部を有する静電チャックと、
前記第1の凹部と前記第2の凹部とで囲まれる空間に配置された、伸縮性のある部材と、
を有する載置台。 - 前記伸縮性のある部材は、シート状、フィルム状又はバネ状である、
請求項1又は2に記載の載置台。 - 前記伸縮性のある部材は、周方向又は径方向に伸縮する、
請求項1〜3のいずれか一項に記載の載置台。
記載の載置台。 - 前記伸縮性のある部材は、
樹脂により形成される、
請求項1〜4のいずれか一項に記載の載置台。 - 前記伸縮性のある部材は、
周方向に1つ又は複数設けられる、
請求項1〜5のいずれか一項に記載の載置台。 - エッジリングの位置決め方法であって、
基板の周囲に配置され、下部に第1の凹部を有するエッジリングと、
前記基板を載置する第1載置面と前記エッジリングを載置する第2載置面とを有し、前記第2載置面に対向して電極が埋め込まれた静電チャックと、
前記静電チャックの周囲に配置され、第2の凹部を有する環状部材と、
前記第1の凹部と前記静電チャックと前記第2の凹部とで囲まれる空間に配置された、伸縮性のある部材と、を有し、
前記電極に電圧を印加する工程と、
前記エッジリングを第1の温度に設定する工程と、
前記エッジリングを前記第1の温度と異なる第2の温度に設定する工程と、
前記エッジリングが前記第2の温度に設定された後に前記電極への電圧の印加を停止する工程とを有する、
エッジリングの位置決め方法。 - エッジリングの位置決め方法であって、
基板の周囲に配置され、下部に第1の凹部が形成されたエッジリングと、
前記基板を載置する第1載置面と前記エッジリングを載置する第2載置面とを有し、前記第2載置面に対向して電極が埋め込まれ、前記第2載置面に第2の凹部が形成された静電チャックと、
前記第1の凹部と前記第2の凹部とで囲まれる空間に配置された、伸縮性のある部材と、を有し、
前記電極に電圧を印加する工程と、
前記エッジリングを第1の温度に設定する工程と、
前記エッジリングを前記第1の温度と異なる第2の温度に設定する工程と、
前記エッジリングが前記第2の温度に設定された後に前記電極への電圧の印加を停止する工程とを有する、
エッジリングの位置決め方法。 - 基板の周囲に配置され、下部に第1の凹部を有するエッジリングと、
前記基板を載置する第1載置面と前記エッジリングを載置する第2載置面とを有し、前記第2載置面に対向して電極が埋め込まれた静電チャックと、
前記静電チャックの周囲に配置され、第2の凹部を有する環状部材と、
前記第1の凹部と前記静電チャックと前記第2の凹部とで囲まれる空間に配置された、伸縮性のある部材と、を有する載置台を備えた基板処理装置。 - 基板の周囲に配置され、下部に第1の凹部が形成されたエッジリングと、
前記基板を載置する第1載置面と前記エッジリングを載置する第2載置面とを有し、前記第2載置面に対向して電極が埋め込まれ、前記第2載置面に第2の凹部が形成された静電チャックと、
前記第1の凹部と前記第2の凹部とで囲まれる空間に配置された、伸縮性のある部材と、を有する載置台を備えた基板処理装置。
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JP2018207907A JP7228989B2 (ja) | 2018-11-05 | 2018-11-05 | 載置台、エッジリングの位置決め方法及び基板処理装置 |
TW108138379A TWI820239B (zh) | 2018-11-05 | 2019-10-24 | 載置台、邊環之定位方法及基板處理裝置 |
KR1020190138553A KR20200051494A (ko) | 2018-11-05 | 2019-11-01 | 배치대, 엣지 링의 위치 결정 방법 및 기판 처리 장치 |
US16/671,416 US11664200B2 (en) | 2018-11-05 | 2019-11-01 | Placing table, positioning method of edge ring and substrate processing apparatus |
CN201911070993.9A CN111146066A (zh) | 2018-11-05 | 2019-11-05 | 载置台、边环的定位方法和基板处理装置 |
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WO2022225808A1 (en) * | 2021-04-19 | 2022-10-27 | Lam Research Corporation | Shadow ring alignment for substrate support |
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CN112599399A (zh) * | 2019-10-02 | 2021-04-02 | 东京毅力科创株式会社 | 等离子体处理装置 |
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CN111146066A (zh) | 2020-05-12 |
US11664200B2 (en) | 2023-05-30 |
TW202022977A (zh) | 2020-06-16 |
TWI820239B (zh) | 2023-11-01 |
US20200144036A1 (en) | 2020-05-07 |
JP7228989B2 (ja) | 2023-02-27 |
KR20200051494A (ko) | 2020-05-13 |
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