JP2020057712A - プラズマ処理装置、及びリング部材の厚さ測定方法 - Google Patents
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Abstract
Description
[プラズマ処理装置の構成]
図1は、第1実施形態に係るプラズマ処理装置10の構成を示す概略断面図である。プラズマ処理装置10は、気密に構成され、電気的に接地電位とされた処理容器1を有している。処理容器1は、円筒状とされ、例えばアルミニウム等から構成されている。処理容器1は、プラズマが生成される処理空間を画成する。処理容器1内には、被処理体(work-piece)である半導体ウェハ(以下、単に「ウェハ」という。)Wを水平に支持する載置台2が設けられている。載置台2は、ウェハWの他に、ウェハWの周囲に配置されるフォーカスリング5の厚さ測定に用いられる治具51(図2参照)も支持する。治具51の構造については、後述する。載置台2は、基材(ベース)2a及び静電チャック(ESC:Electrostatic chuck)6を含んで構成されている。
次に、図2を参照して、第1実施形態に係る載置台2の要部構成について説明する。図2は、第1実施形態に係る載置台2の要部構成を示す概略断面図である。
次に、制御部100について詳細に説明する。図3は、第1実施形態に係るプラズマ処理装置10を制御する制御部100の概略的な構成を示すブロック図である。制御部100は、プロセスコントローラ110、ユーザインタフェース120及び記憶部130を有する。
次に、第1実施形態に係るプラズマ処理装置10を用いたフォーカスリング5の厚さ測定処理について説明する。図4は、フォーカスリング5の厚さ測定処理の流れの一例を示すフローチャートである。このフォーカスリング5の厚さ測定処理は、例えば、ウェハWに対するプラズマ処理が終了したタイミングで実行される。
次に、第2実施形態について説明する。第2実施形態に係るプラズマ処理装置10は、図1及び図2に示す第1実施形態に係るプラズマ処理装置10の構成と同様であるため、説明を省略する。
2 載置台
2a 基材
2e 載置面
5 フォーカスリング
5a 本体部
5b 突出部
5c 境界部分
6 静電チャック
6c 載置面
10 プラズマ処理装置
51、52、53 治具
51a、52a、53a 対向部
63 リフターピン
64 昇降機構
100 制御部
111 取得部
112 計測部
113 厚さ算出部
114 昇降制御部
115 アラート部
121 高さ算出部
122 昇降制御部
131 間隔情報
W ウェハ
Claims (11)
- 被処理体の周囲に配置されるリング部材の厚さ測定に用いられる治具であって前記リング部材の上面と対向する対向部を有する前記治具又は前記被処理体を載置する第1の載置面と、前記リング部材を載置する第2の載置面とを有する載置台と、
前記第2の載置面に対して前記リング部材を昇降させる昇降機構と、
前記第2の載置面と前記第1の載置面に載置された前記治具の前記対向部との間隔寸法を示す間隔情報を取得する取得部と、
前記第1の載置面に前記治具が載置された状態で、前記昇降機構により前記リング部材を上昇させ、前記治具の前記対向部に前記リング部材の上面が接触する場合に、前記第2の載置面からの前記リング部材の上昇距離を計測する計測部と、
取得された前記間隔情報により示される前記間隔寸法と、計測された前記リング部材の上昇距離とに基づき、前記リング部材の厚さを算出する厚さ算出部と、
を有する、プラズマ処理装置。 - 前記間隔寸法は、前記第2の載置面と前記第1の載置面との間の距離と、前記第1の載置面と前記第1の載置面に載置された前記治具の前記対向部との間の距離とに基づき、予め決定される、請求項1に記載のプラズマ処理装置。
- 前記載置台には、前記第1の載置面に載置された前記治具又は前記被処理体を吸着する静電チャックが設けられ
前記計測部は、前記第1の載置面に前記治具が載置され且つ前記治具が前記静電チャックにより吸着された状態で、前記昇降機構により前記リング部材を上昇させる、請求項1又は2に記載のプラズマ処理装置。 - 前記リング部材は、本体部と、前記本体部の内側側面から径方向内側へ突出し、且つ上面が前記本体部の上面よりも低い突出部とを含み、
前記治具の前記対向部は、前記第1の載置面に前記治具が載置された状態で、前記本体部及び前記突出部の上方に位置し、
前記計測部は、前記治具の前記対向部に前記本体部の上面が接触する場合に、前記第2の載置面からの前記リング部材の上昇距離を計測し、
前記厚さ算出部は、取得された前記間隔情報により示される前記間隔寸法と、計測された前記リング部材の上昇距離とに基づき、前記本体部の厚さを算出する、請求項1〜3のいずれか一つに記載のプラズマ処理装置。 - 前記リング部材は、本体部と、前記本体部の内側側面から径方向内側へ突出し、且つ上面が前記本体部の上面よりも低い突出部とを含み、
前記治具の前記対向部は、前記第1の載置面に前記治具が載置された状態で、前記突出部の上方に位置し、
前記計測部は、前記治具の前記対向部に前記突出部の上面が接触する場合に、前記第2の載置面からの前記リング部材の上昇距離を計測し、
前記厚さ算出部は、取得された前記間隔情報により示される前記間隔寸法と、計測された前記リング部材の上昇距離とに基づき、前記突出部の厚さを算出する、請求項1〜3のいずれか一つに記載のプラズマ処理装置。 - 前記リング部材は、本体部と、前記本体部の内側側面から径方向内側へ突出し、且つ上面が前記本体部の上面よりも低い突出部とを含み、
前記治具の前記対向部は、前記第1の載置面に前記治具が載置された状態で、前記本体部と前記突出部との境界部分に向けて湾曲する形状を有し、
前記計測部は、前記治具の前記対向部に前記境界部分の上面が接触する場合に、前記第2の載置面からの前記リング部材の上昇距離を計測し、
前記厚さ算出部は、取得された前記間隔情報により示される前記間隔寸法と、計測された前記リング部材の上昇距離とに基づき、前記境界部分の厚さを算出する、請求項1〜3のいずれか一つに記載のプラズマ処理装置。 - 前記昇降機構は、前記リング部材の周方向の複数の位置にそれぞれ設けられ、
前記計測部は、前記リング部材の周方向の複数の位置にそれぞれ設けられた前記昇降機構により前記リング部材を上昇させ、前記治具の前記対向部に前記リング部材の上面が接触する場合に、前記リング部材の周方向の複数の位置の各々について、前記第2の載置面からの前記リング部材の上昇距離を計測し、
前記厚さ算出部は、取得された前記間隔情報により示される前記間隔寸法と、計測された前記リング部材の上昇距離とに基づき、前記リング部材の周方向の複数の位置の各々について、前記リング部材の厚さを算出する、請求項1〜6のいずれか一つに記載のプラズマ処理装置。 - 算出された前記リング部材の厚さに基づき、前記リング部材の上面が所定の高さを保つように前記昇降機構を独立に制御する昇降制御部をさらに有することを特徴とする請求項7に記載のプラズマ処理装置。
- 算出された前記リング部材の厚さに基づき、前記被処理体の上面と、前記リング部材の上面との位置関係が予め定められた距離間隔になる前記リング部材の高さを算出する高さ算出部と、
前記リング部材が算出された高さとなるように前記昇降機構を制御する昇降制御部と、
をさらに有する、請求項1〜7のいずれか一つに記載のプラズマ処理装置。 - 算出された前記リング部材の厚さに基づき、アラートを行うアラート部をさらに有する、請求項1〜9のいずれか一つに記載のプラズマ処理装置。
- 被処理体の周囲に配置されるリング部材の厚さ測定に用いられる治具であって前記リング部材の上面と対向する対向部を有する前記治具又は前記被処理体を載置する第1の載置面と、前記リング部材を載置する第2の載置面とを有する載置台の前記第2の載置面と前記第1の載置面に載置された前記治具の前記対向部との間隔寸法を示す間隔情報を取得し、
前記第1の載置面に前記治具が載置された状態で、前記第2の載置面に対して前記リング部材を昇降させる昇降機構により前記リング部材を上昇させ、前記治具の前記対向部に前記リング部材の上面が接触する場合に、前記第2の載置面からの前記リング部材の上昇距離を計測し、
取得された前記間隔情報により示される前記間隔寸法と、計測された前記リング部材の上昇距離とに基づき、前記リング部材の厚さを算出する、
処理を含む、リング部材の厚さ測定方法。
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