JP2020044737A - Molded sheet, method for manufacturing molded sheet, sheet and method for manufacturing sheet - Google Patents

Molded sheet, method for manufacturing molded sheet, sheet and method for manufacturing sheet Download PDF

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JP2020044737A
JP2020044737A JP2018175282A JP2018175282A JP2020044737A JP 2020044737 A JP2020044737 A JP 2020044737A JP 2018175282 A JP2018175282 A JP 2018175282A JP 2018175282 A JP2018175282 A JP 2018175282A JP 2020044737 A JP2020044737 A JP 2020044737A
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thermal expansion
layer
fine particles
expanded
main surface
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高橋　秀樹
Hideki Takahashi
秀樹 高橋
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Casio Computer Co Ltd
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Abstract

To provide a molded sheet in which peeling of a thermal-expansion layer from a base material is suppressed, a method for manufacturing a molded sheet, a sheet and a method for manufacturing a sheet.SOLUTION: The molded sheet includes a base material having a first main surface 22 and a second main surface opposite to the first main surface, N (where N is an integer of 2 or more) of thermal expansion layers 32, 34 containing thermal expansion fine particles 33b, 35b and stacked on the first main surface 22. The average particle diameter of the thermal expansion fine particles 35b included in the M-th (where M is an integer of 2 or more and N or less) thermal expansion layer 34 is greater than the average particle diameter of the thermal expansion fine particles 33b included in the M-1-th thermal expansion layer 32.SELECTED DRAWING: Figure 3

Description

本発明は、加熱により膨張する熱膨張微粒子を利用した成形シート、成形シートの製造方法、シート及びシートの製造方法に関する。   The present invention relates to a molded sheet, a method for producing a molded sheet, a sheet, and a method for producing a sheet using thermally expanded fine particles that expand when heated.

熱膨張性シートの表面に光吸収性の高い材料で画像を形成し、画像を形成された熱膨張性シートに光照射を行い、画像部を選択的に加熱***させることによって、立体画像（造形物）を形成されたシートを製造する技術が知られている（例えば、特許文献１）。   An image is formed on the surface of the heat-expandable sheet with a material having a high light-absorbing property, light is irradiated on the heat-expandable sheet on which the image is formed, and the image portion is selectively heated and raised, thereby forming a three-dimensional image (modeling A technique for manufacturing a sheet on which an article is formed is known (for example, Patent Document 1).

特公昭５９−３５３５９号JP-B-59-35359

特許文献１では、紙（基材シート）に、粒径１０μｍ〜３０μｍの熱膨張性微小球（２０重量部）と熱可塑性被覆剤（８０重量部）の混合物を塗布して、厚さ２００μｍの熱膨張性シートを形成している。熱膨張性微小球は、加熱により、体積比で３０倍〜１００倍に膨張するので、造形物を形成されたシートでは、熱膨張性微小球と熱可塑性被覆剤の混合物から構成される層（以下、熱膨張層と記載）における熱膨張性微小球が占める体積が、非常に大きくなる。一般に、熱膨張性微小球は基材との密着性を有しておらず、熱可塑性被覆剤が基材と密着するので、熱膨張層における熱膨張性微小球が占める体積が大きくなると、熱膨張層が基材シートから剥離するおそれがある。一方、熱膨張性微小球の比率を減らすと、造形物の高さを十分に高くできない。   In Patent Document 1, a paper (base sheet) is coated with a mixture of thermally expandable microspheres (20 parts by weight) having a particle size of 10 μm to 30 μm and a thermoplastic coating agent (80 parts by weight). A heat-expandable sheet is formed. Since the heat-expandable microspheres expand 30 to 100 times in volume ratio by heating, in the sheet on which the molded article is formed, a layer (a mixture of the heat-expandable microspheres and the thermoplastic coating agent) is used. The volume occupied by the heat-expandable microspheres in the heat-expandable layer will be extremely large. Generally, the heat-expandable microspheres do not have adhesion to the substrate, and the thermoplastic coating agent adheres to the substrate. The expansion layer may be peeled off from the base sheet. On the other hand, if the ratio of the heat-expandable microspheres is reduced, the height of the modeled object cannot be increased sufficiently.

本発明は、上記実情に鑑みてなされたものであり、熱膨張層の基材からの剥離を抑制した成形シート、成形シートの製造方法、シート及びシートの製造方法を提供することを目的とする。   The present invention has been made in view of the above circumstances, and has as its object to provide a molded sheet, a method for producing a molded sheet, a sheet, and a method for producing a sheet, in which peeling of a thermal expansion layer from a substrate is suppressed. .

上記目的を達成するため、本発明の第１の観点に係る成形シートは、
第１主面と前記第１主面の反対側の第２主面とを有する基材と、
熱膨張微粒子を含み前記第１主面の上に積層された、Ｎ（Ｎは２以上の整数）層の熱膨張層と、を備え、
Ｍ（Ｍは２以上Ｎ以下の整数）層目の前記熱膨張層に含まれる前記熱膨張微粒子の平均粒径は、Ｍ−１層目の前記熱膨張層に含まれる前記熱膨張微粒子の平均粒径よりも大きい。 In order to achieve the above object, the molded sheet according to the first aspect of the present invention includes:
A base material having a first main surface and a second main surface opposite to the first main surface;
An N (N is an integer of 2 or more) thermal expansion layer laminated on the first main surface and including thermal expansion fine particles,
The average particle diameter of the thermally expanded fine particles contained in the M (M is an integer of 2 or more and N or less) layer is the average of the thermally expanded particles contained in the M-1 layer. Larger than the particle size.

本発明の第２の観点に係る成形シートの製造方法は、
基材の第１主面の上に、バインダと熱膨張微粒子とを含む、Ｎ層（Ｎは２以上の整数）の熱膨張層を備えた成形シートの製造方法であって、
前記第１主面の上に、１層目の前記熱膨張層を積層する第１熱膨張層形成工程と、
前記１層目の熱膨張層の上に、Ｎ−１層の前記熱膨張層を積層する積層工程と、を含み、
Ｍ（Ｍは２以上Ｎ以下の整数）層目の前記熱膨張層に含まれる前記熱膨張微粒子の平均粒径は、Ｍ−１層目の前記熱膨張層に含まれる前記熱膨張微粒子の平均粒径よりも大きい。 The method for producing a molded sheet according to the second aspect of the present invention includes:
A method for producing a molded sheet comprising a thermal expansion layer of N layers (N is an integer of 2 or more), comprising a binder and thermal expansion fine particles, on a first main surface of a base material,
A first thermal expansion layer forming step of laminating the first thermal expansion layer on the first main surface;
A laminating step of laminating the N-1 layers of the thermal expansion layer on the first thermal expansion layer,
The average particle diameter of the thermally expanded fine particles contained in the M (M is an integer of 2 or more and N or less) layer is the average of the thermally expanded particles contained in the M-1 layer. Larger than the particle size.

本発明の第３の観点に係るシートは、
第１主面と前記第１主面の反対側の第２主面とを有する基材と、
膨張した熱膨張微粒子を含み前記第１主面の上に積層されたＮ（Ｎは２以上の整数）層の膨張した熱膨張層を有する造形物と、を備え、
Ｍ（Ｍは２以上Ｎ以下の整数）層目の前記膨張した熱膨張層に含まれる前記膨張した熱膨張微粒子の平均粒径は、Ｍ−１層目の前記膨張した熱膨張層に含まれる前記膨張した熱膨張微粒子の平均粒径よりも大きい。 The sheet according to the third aspect of the present invention includes:
A base material having a first main surface and a second main surface opposite to the first main surface;
A shaped object having expanded thermal expansion layers of N (N is an integer of 2 or more) layers including expanded thermal expansion fine particles and laminated on the first main surface;
The average particle diameter of the expanded thermal expansion fine particles contained in the expanded thermal expansion layer of the M-th (M is an integer of 2 to N) layer is included in the expanded thermal expansion layer of the (M-1) -th layer. It is larger than the average particle size of the expanded thermally expanded fine particles.

本発明の第４の観点に係るシートの製造方法は、
第１主面と前記第１主面の反対側の第２主面とを有する基材と、熱膨張微粒子を含み前記第１主面の上に積層された、Ｎ（Ｎは２以上の整数）層の熱膨張層と、を備え、Ｍ（Ｍは２以上Ｎ以下の整数）層目の前記熱膨張層に含まれる前記熱膨張微粒子の平均粒径は、Ｍ−１層目の前記熱膨張層に含まれる前記熱膨張微粒子の平均粒径よりも大きい、成形シートを準備する準備工程と、
前記成形シートの前記第２主面と前記Ｎ層の熱膨張層の一方の上に、電磁波を熱に変換する熱変換層を積層する熱変換層積層工程と、
前記熱変換層に前記電磁波を照射して前記熱変換層に熱を発生させることによって、前記Ｎ層の熱膨張層を加熱して、前記Ｎ層の熱膨張層を膨張させ、造形物を形成する膨張工程と、を含む。 The method for manufacturing a sheet according to the fourth aspect of the present invention includes:
A base material having a first main surface and a second main surface opposite to the first main surface; and N (where N is an integer of 2 or more) laminated on the first main surface including the thermally expandable fine particles. ) Layer, and the average particle diameter of the thermally expandable fine particles contained in the M (M is an integer of 2 or more and N or less) layer is the thermal expansion layer of the M-1 layer. A preparation step of preparing a molded sheet, which is larger than the average particle diameter of the thermally expanded fine particles contained in the expansion layer,
A heat conversion layer stacking step of stacking a heat conversion layer that converts electromagnetic waves into heat on one of the second main surface of the molded sheet and the thermal expansion layer of the N layer;
By irradiating the electromagnetic wave to the heat conversion layer to generate heat in the heat conversion layer, the thermal expansion layer of the N layer is heated, and the thermal expansion layer of the N layer is expanded to form a molded article. Expanding step.

本発明によれば、基材側に位置する熱膨張微粒子の平均粒径が小さいので、熱膨張層の基材からの剥離を抑制した成形シート、成形シートの製造方法、シート及びシートの製造方法を提供できる。   ADVANTAGE OF THE INVENTION According to this invention, since the average particle diameter of the thermal expansion fine particle located in a base material side is small, the molded sheet which suppressed peeling of the thermal expansion layer from the substrate, the manufacturing method of a molded sheet, the sheet, and the manufacturing method of a sheet Can be provided.

本発明の実施形態１に係る成形シートを示す模式図である。It is a schematic diagram which shows the molded sheet which concerns on Embodiment 1 of this invention. 図１に示す成形シートをＡ−Ａ線で矢視した断面図である。FIG. 2 is a cross-sectional view of the molded sheet shown in FIG. 1 taken along line AA. 本発明の実施形態１に係る第１熱膨張層と第２熱膨張層を示す模式図である。FIG. 2 is a schematic diagram illustrating a first thermal expansion layer and a second thermal expansion layer according to Embodiment 1 of the present invention. 本発明の実施形態１に係るシートを示す模式図である。FIG. 2 is a schematic diagram illustrating a sheet according to Embodiment 1 of the present invention. 図４に示すシートをＢ−Ｂ線で矢視した断面図である。FIG. 5 is a cross-sectional view of the sheet shown in FIG. 4 taken along line BB. 本発明の実施形態１に係る膨張した第１熱膨張層と膨張した第２熱膨張層を示す模式図である。FIG. 2 is a schematic diagram illustrating an expanded first thermal expansion layer and an expanded second thermal expansion layer according to Embodiment 1 of the present invention. 本発明の実施形態１に係る成形シートの製造方法を示すフローチャートである。It is a flowchart which shows the manufacturing method of the molded sheet which concerns on Embodiment 1 of this invention. 本発明の実施形態１に係るシートの製造方法を示すフローチャートである。4 is a flowchart illustrating a sheet manufacturing method according to Embodiment 1 of the present invention. 本発明の実施形態２に係る成形シートを示す模式図である。It is a mimetic diagram showing a forming sheet concerning Embodiment 2 of the present invention. 本発明の実施形態２に係る第１熱膨張層と第２熱膨張層と第３熱膨張層を示す模式図である。It is a schematic diagram which shows the 1st thermal expansion layer, the 2nd thermal expansion layer, and the 3rd thermal expansion layer which concern on Embodiment 2 of this invention. 本発明の実施形態２に係るシートを示す模式図である。It is a schematic diagram which shows the sheet | seat which concerns on Embodiment 2 of this invention. 本発明の実施形態２に係る成形シートの製造方法を示すフローチャートである。It is a flowchart which shows the manufacturing method of the molded sheet which concerns on Embodiment 2 of this invention. 本発明の実施形態２に係るオフセット印刷による第１熱膨張層の形成を説明するための模式図である。It is a mimetic diagram for explaining formation of the 1st thermal expansion layer by offset printing concerning Embodiment 2 of the present invention. 本発明の実施形態２に係るオフセット印刷による第１熱膨張層の形成を説明するための模式図である。It is a mimetic diagram for explaining formation of the 1st thermal expansion layer by offset printing concerning Embodiment 2 of the present invention. 本発明の実施形態２に係るオフセット印刷による第１熱膨張層の形成を説明するための模式図である。It is a mimetic diagram for explaining formation of the 1st thermal expansion layer by offset printing concerning Embodiment 2 of the present invention. 本発明の変形例に係る成形シートの断面を示す模式図である。It is a schematic diagram which shows the cross section of the molded sheet which concerns on the modification of this invention. 本発明の変形例に係るシートの断面を示す模式図である。It is a schematic diagram which shows the cross section of the sheet | seat which concerns on the modification of this invention.

以下、本発明の実施形態に係る成形シート１０とシート１００について、図面を参照して説明する。   Hereinafter, the molded sheet 10 and the sheet 100 according to the embodiment of the present invention will be described with reference to the drawings.

＜実施形態１＞
（成形シート）
成形シート１０は、図１、図２に示すように、基材２０と、基材２０の第１主面２２の上に積層された２層の熱膨張層、すなわち第１熱膨張層３２と第２熱膨張層３４とを備える。図３に示すように、第１熱膨張層３２は第１熱膨張微粒子３３ｂを含み、第２熱膨張層３４は第２熱膨張微粒子３５ｂを含む。なお、以下では、第１熱膨張層３２を熱膨張層３２と、第２熱膨張層３４を熱膨張層３４と記載する場合がある。また、第１熱膨張微粒子３３ｂを熱膨張微粒子３３ｂと、第２熱膨張微粒子３５ｂを熱膨張微粒子３５ｂと記載する場合がある。 <First embodiment>
(Molded sheet)
As shown in FIGS. 1 and 2, the molded sheet 10 includes a base material 20 and two thermal expansion layers laminated on the first main surface 22 of the base material 20, that is, a first thermal expansion layer 32. And a second thermal expansion layer 34. As shown in FIG. 3, the first thermal expansion layer 32 includes first thermal expansion fine particles 33b, and the second thermal expansion layer 34 includes second thermal expansion fine particles 35b. In addition, below, the 1st thermal expansion layer 32 may be described as the thermal expansion layer 32 and the 2nd thermal expansion layer 34 may be described as the thermal expansion layer 34. Further, the first thermally expanded fine particles 33b may be described as a thermally expanded fine particle 33b, and the second thermally expanded fine particles 35b may be described as a thermally expanded fine particle 35b.

成形シート１０は、図４に示す、円柱凸形状の造形物１２０を備えるシート１００の製造に用いられる。円柱凸形状の造形物１２０は、図５に示すように、後述する、膨張した第１熱膨張層３２ａと膨張した第２熱膨張層３４ａとを有する。また、図６に示すように、膨張した第１熱膨張層３２ａは膨張した第１熱膨張微粒子３３ｃを含み、膨張した第２熱膨張層３４ａは膨張した第２熱膨張微粒子３５ｃを含む。本明細書において、「造形物」は、造形物１２０のように凸形状を有するものに限らず、凹形状、幾何学形状等の形状を有するものを含む。また、造形物は、文字、模様、装飾等を構成してもよい。ここで、「装飾」とは、視覚及び／又は触覚を通じて美感を想起させるものである。「造形（又は造型）」は、単に造形物を形成することに限らず、装飾を加える加飾、装飾を形成する造飾のような概念をも含む。また、本実施形態のシート１００は、所定の面に造形物を有する立体物であるが、いわゆる３Ｄプリンタにより製造された立体物と区別するため、本実施形態のシート１００を２．５次元（２．５Ｄ）オブジェクト又は疑似三次元（Ｐｓｅｕｄｏ−３Ｄ）オブジェクトとも呼ぶ。本実施形態のシート１００を製造する技術は、２．５Ｄ印刷技術又はＰｓｅｕｄｏ−３Ｄ印刷技術とも呼べる。   The molded sheet 10 is used for manufacturing a sheet 100 including a modeled object 120 having a cylindrical convex shape shown in FIG. As shown in FIG. 5, the cylindrically-shaped convex shaped object 120 has an expanded first thermal expansion layer 32a and an expanded second thermal expansion layer 34a, which will be described later. As shown in FIG. 6, the expanded first thermal expansion layer 32a includes expanded first thermal expansion particles 33c, and the expanded second thermal expansion layer 34a includes expanded second thermal expansion particles 35c. In the present specification, the “modeled object” is not limited to a model having a convex shape like the modeled object 120, but includes a product having a shape such as a concave shape or a geometric shape. Further, the modeled object may constitute characters, patterns, decorations, and the like. Here, the “decoration” refers to recalling beauty through visual and / or tactile sensation. "Shaping (or shaping)" is not limited to simply forming a shaped object, but includes concepts such as decoration for adding decoration and decoration for forming decoration. The sheet 100 of the present embodiment is a three-dimensional object having a modeled object on a predetermined surface. However, in order to distinguish the sheet 100 of the present embodiment from a three-dimensional object manufactured by a so-called 3D printer, the sheet 100 of the present embodiment is 2.5-dimensional ( 2.5D) Also called an object or a pseudo three-dimensional (Pseudo-3D) object. The technology for manufacturing the sheet 100 of the present embodiment can be called a 2.5D printing technology or a Pseudo-3D printing technology.

成形シート１０の基材２０は、図２に示すように、第１熱膨張層３２と第２熱膨張層３４とを積層される第１主面２２と、第１主面２２の反対側の第２主面２４とを有する。基材２０は第１熱膨張層３２と第２熱膨張層３４を支持する。基材２０は、例えば、シート状に形成される。基材２０を構成する材料は、例えば、ポリオレフィン系樹脂（ポリエチレン（ＰＥ）、ポリプロピレン（ＰＰ）等）、ポリエステル系樹脂（ポリエチレンテレフタレート（ＰＥＴ）、ポリブチレンテレフタレート（ＰＢＴ）等）等の熱可塑性樹脂から構成される。基材２０を構成する材料の種類と基材２０の厚さは、例えば、成形シート１０から製造されるシート１００の用途に応じて設定される。   As shown in FIG. 2, the base material 20 of the molded sheet 10 has a first main surface 22 on which a first thermal expansion layer 32 and a second thermal expansion layer 34 are laminated, and a first main surface 22 opposite to the first main surface 22. And a second main surface 24. The substrate 20 supports the first thermal expansion layer 32 and the second thermal expansion layer 34. The base material 20 is formed in a sheet shape, for example. The material forming the substrate 20 is, for example, a thermoplastic resin such as a polyolefin resin (polyethylene (PE), polypropylene (PP), etc.), a polyester resin (polyethylene terephthalate (PET), polybutylene terephthalate (PBT), etc.). Consists of The type of the material constituting the base material 20 and the thickness of the base material 20 are set according to, for example, the use of the sheet 100 manufactured from the molded sheet 10.

成形シート１０の第１熱膨張層３２は、シート１００の造形物１２０の配置と形状に対応した所定のパターンで基材２０の第１主面２２の上に積層される。第１熱膨張層３２は、加熱される熱量（具体的には、加熱温度、加熱時間等）に応じた大きさに膨張する層である。   The first thermal expansion layer 32 of the molded sheet 10 is laminated on the first main surface 22 of the base material 20 in a predetermined pattern corresponding to the arrangement and the shape of the molded article 120 of the sheet 100. The first thermal expansion layer 32 is a layer that expands to a size corresponding to the amount of heat to be heated (specifically, a heating temperature, a heating time, and the like).

第１熱膨張層３２は、図３に示すように、第１バインダ３３ａと第１バインダ３３ａ中に分散された第１熱膨張微粒子３３ｂとを含む。第１熱膨張層３２は、第１熱膨張微粒子３３ｂの膨張により膨張する。第１熱膨張層３２が膨張することによって、シート１００における膨張した第１熱膨張層３２ａが形成される。   As shown in FIG. 3, the first thermal expansion layer 32 includes a first binder 33a and first thermal expansion fine particles 33b dispersed in the first binder 33a. The first thermal expansion layer 32 expands due to expansion of the first thermal expansion fine particles 33b. When the first thermal expansion layer 32 expands, the expanded first thermal expansion layer 32a in the sheet 100 is formed.

第１バインダ３３ａは、酢酸ビニル系ポリマー、アクリル系ポリマー等の任意の熱可塑性樹脂であり、第１熱膨張微粒子３３ｂよりも基材２０に対する密着性が高い。第１熱膨張微粒子３３ｂは、例えば、熱膨張性マイクロカプセルであり、所定の温度以上に加熱されることにより、加熱される熱量に応じた大きさに膨張する。第１熱膨張微粒子３３ｂが膨張することによって、シート１００における膨張した第１熱膨張微粒子３３ｃが形成される。第１熱膨張微粒子３３ｂの膨張前の平均粒径は、後述する第２熱膨張微粒子３５ｂの膨張前の平均粒径よりも小さく、例えば０．５μｍ以上３．０μｍ以下である。なお、図３では、理解を容易にするためにハッチングを省略している。   The first binder 33a is an arbitrary thermoplastic resin such as a vinyl acetate polymer or an acrylic polymer, and has higher adhesion to the substrate 20 than the first thermally expanded fine particles 33b. The first thermally expandable fine particles 33b are, for example, thermally expandable microcapsules, and when heated to a predetermined temperature or higher, expand to a size corresponding to the amount of heat to be heated. When the first thermally expanded fine particles 33b expand, the expanded first thermally expanded fine particles 33c in the sheet 100 are formed. The average particle diameter of the first thermal expansion fine particles 33b before expansion is smaller than the average particle diameter of the second thermal expansion fine particles 35b described below before expansion, for example, 0.5 μm or more and 3.0 μm or less. In FIG. 3, hatching is omitted for easy understanding.

熱膨張性マイクロカプセルは、プロパン、ブタン、その他の低沸点物質から構成された発泡剤を、熱可塑性樹脂製の殻内に包み込んだマイクロカプセルである。熱膨張性マイクロカプセルの殻は、例えば、ポリスチレン、ポリ塩化ビニル、ポリ塩化ビニリデン、ポリ酢酸ビニル、ポリアクリル酸エステル、ポリアクリロニトリル、ポリブタジエン、これらの共重合体等の熱可塑性樹脂から形成される。熱膨張性マイクロカプセルは、膨張開始温度以上に加熱されると、殻が軟化すると共に発泡剤が気化し、発泡剤が気化した圧力により、殻がバルーン状に膨張する。熱膨張性マイクロカプセルは、膨張前の体積の３０倍〜１００倍に膨張する。   The heat-expandable microcapsules are microcapsules in which a foaming agent composed of propane, butane, and other low-boiling substances is wrapped in a shell made of a thermoplastic resin. The shell of the heat-expandable microcapsule is formed of a thermoplastic resin such as polystyrene, polyvinyl chloride, polyvinylidene chloride, polyvinyl acetate, polyacrylate, polyacrylonitrile, polybutadiene, and a copolymer thereof. When the heat-expandable microcapsules are heated to a temperature equal to or higher than the expansion start temperature, the shell softens and the foaming agent evaporates, and the shell expands into a balloon by the pressure at which the foaming agent evaporates. The heat-expandable microcapsules expand 30 to 100 times the volume before expansion.

成形シート１０の第２熱膨張層３４は、造形物１２０の配置と形状に対応した所定のパターンで第１熱膨張層３２の上に積層され、加熱される熱量に応じた大きさに膨張する。第２熱膨張層３４は、第２バインダ３５ａと第２バインダ３５ａ中に分散された第２熱膨張微粒子３５ｂとを含む。第２熱膨張層３４は、第２熱膨張微粒子３５ｂの膨張により膨張する。第２熱膨張層３４が膨張することによって、シート１００における膨張した第２熱膨張層３４ａが形成される。   The second thermal expansion layer 34 of the molded sheet 10 is laminated on the first thermal expansion layer 32 in a predetermined pattern corresponding to the arrangement and shape of the modeled object 120, and expands to a size corresponding to the amount of heat to be heated. . The second thermal expansion layer 34 includes a second binder 35a and second thermal expansion fine particles 35b dispersed in the second binder 35a. The second thermal expansion layer 34 expands due to the expansion of the second thermal expansion fine particles 35b. When the second thermal expansion layer 34 expands, the expanded second thermal expansion layer 34a in the sheet 100 is formed.

第２バインダ３５ａは、第１バインダ３３ａと同様に、酢酸ビニル系ポリマー、アクリル系ポリマー等の任意の熱可塑性樹脂である。第２熱膨張微粒子３５ｂは、第１熱膨張微粒子３３ｂと同様に、所定の温度以上に加熱されることにより膨張する微粒子であり、例えば、熱膨張性マイクロカプセルから構成される。第２熱膨張微粒子３５ｂが膨張することによって、シート１００における膨張した第２熱膨張微粒子３５ｃが形成される。第２熱膨張微粒子３５ｂの膨張前の平均粒径は、第１熱膨張微粒子３３ｂの膨張前の平均粒径よりも大きい。第２熱膨張微粒子３５ｂの膨張前の平均粒径は、例えば、３．０μｍよりも大きく３０μｍ以下である。   Like the first binder 33a, the second binder 35a is an arbitrary thermoplastic resin such as a vinyl acetate polymer or an acrylic polymer. The second thermally expanded fine particles 35b are fine particles that expand when heated to a predetermined temperature or higher, like the first thermally expanded fine particles 33b, and are made of, for example, thermally expandable microcapsules. The expanded second thermally expanded fine particles 35c in the sheet 100 are formed by the expansion of the second thermally expanded fine particles 35b. The average particle diameter of the second thermal expansion fine particles 35b before expansion is larger than the average particle diameter of the first thermal expansion fine particles 33b before expansion. The average particle size of the second thermally expanded fine particles 35b before expansion is, for example, greater than 3.0 μm and 30 μm or less.

本実施形態では、第１熱膨張微粒子３３ｂの膨張前の平均粒径が、第２熱膨張微粒子３５ｂの膨張前の平均粒径よりも小さい。したがって、第１熱膨張層３２と第２熱膨張層３４が加熱により膨張した場合に、基材２０の第１主面２２側に位置する膨張した第１熱膨張層３２ａに含まれる膨張した第１熱膨張微粒子３３ｃの平均粒径が、膨張した第２熱膨張層３４ａに含まれる膨張した第２熱膨張微粒子３５ｃの平均粒径よりも小さくなる。これにより、基材２０の第１主面２２側に位置する膨張した第１熱膨張層３２ａにおいて、膨張した第１熱膨張微粒子３３ｃの占める体積の割合が小さく、基材２０に対する密着性が高い第１バインダ３３ａの占める体積の割合が大きくなり、膨張した第１熱膨張層３２ａの基材２０からの剥離を抑制できる。さらに、第２熱膨張微粒子３５ｂの平均粒径を、第１熱膨張微粒子３３ｂの平均粒径よりも大きくすることにより、第２熱膨張微粒子３５ｂがより大きく膨張し、膨張した第１熱膨張層３２ａと膨張した第２熱膨張層３４ａから構成される造形物１２０の高さを高くできる。   In the present embodiment, the average particle size of the first thermally expanded fine particles 33b before expansion is smaller than the average particle size of the second thermally expanded fine particles 35b before expansion. Therefore, when the first thermal expansion layer 32 and the second thermal expansion layer 34 are expanded by heating, the expanded first thermal expansion layer 32a located on the first main surface 22 side of the base material 20 has the expanded second thermal expansion layer 32a. The average particle size of the first thermal expansion fine particles 33c is smaller than the average particle size of the expanded second thermal expansion fine particles 35c included in the expanded second thermal expansion layer 34a. Thereby, in the expanded first thermal expansion layer 32 a located on the first main surface 22 side of the base material 20, the ratio of the volume occupied by the expanded first thermal expansion fine particles 33 c is small, and the adhesion to the base material 20 is high. The ratio of the volume occupied by the first binder 33a is increased, and the exfoliation of the expanded first thermal expansion layer 32a from the substrate 20 can be suppressed. Furthermore, by making the average particle diameter of the second thermal expansion fine particles 35b larger than the average particle diameter of the first thermal expansion fine particles 33b, the second thermal expansion fine particles 35b expand more greatly and the expanded first thermal expansion layer 35b. The height of the modeled object 120 composed of the second thermal expansion layer 34a and the expanded second thermal expansion layer 34a can be increased.

次に、成形シート１０の製造方法を説明する。図７は、成形シート１０の製造方法を示すフローチャートである。成形シート１０の製造方法は、基材２０の第１主面２２の上に、第１バインダ３３ａと第１熱膨張微粒子３３ｂを含む第１熱膨張層３２を積層する第１熱膨張層形成工程（ステップＳ１０）と、第１熱膨張層３２の上に、第２バインダ３５ａと第２熱膨張微粒子３５ｂを含む第２熱膨張層３４を積層する積層工程（ステップＳ２０）と、を含む。上述のように、第２熱膨張微粒子３５ｂの平均粒径は、第１熱膨張微粒子３３ｂの平均粒径よりも大きい。   Next, a method for manufacturing the molded sheet 10 will be described. FIG. 7 is a flowchart illustrating a method for manufacturing the molded sheet 10. The method for manufacturing the molded sheet 10 includes a first thermal expansion layer forming step of laminating the first thermal expansion layer 32 including the first binder 33 a and the first thermal expansion fine particles 33 b on the first main surface 22 of the base material 20. (Step S10) and a laminating step (Step S20) of laminating the second thermal expansion layer 34 including the second binder 35a and the second thermal expansion fine particles 35b on the first thermal expansion layer 32. As described above, the average particle size of the second thermally expanded fine particles 35b is larger than the average particle size of the first thermally expanded fine particles 33b.

まず、基材２０と、第１熱膨張層３２を形成するための第１塗布液と、第２熱膨張層３４を形成するための第２塗布液を準備する。基材２０は、例えば、Ａ４用紙サイズのＰＥＴシートである。第１塗布液は、例えば、第１バインダ３３ａと第１熱膨張微粒子３３ｂとを混合することにより、調製される。第２塗布液は、例えば、第２バインダ３５ａと第２熱膨張微粒子３５ｂとを混合することにより、調製される。   First, a substrate 20, a first coating liquid for forming the first thermal expansion layer 32, and a second coating liquid for forming the second thermal expansion layer 34 are prepared. The base material 20 is, for example, an A4 paper size PET sheet. The first coating liquid is prepared, for example, by mixing the first binder 33a and the first thermally expandable fine particles 33b. The second coating liquid is prepared, for example, by mixing the second binder 35a and the second thermally expandable fine particles 35b.

第１熱膨張層形成工程（ステップＳ１０）では、まず、塗布装置を用いて、基材２０の第１主面２２の上に、所定のパターンで第１塗布液を塗布する。塗布装置は、例えばスクリーン印刷装置である。次に、基材２０の第１主面２２に塗布された第１塗布液を乾燥させる。これにより、第１熱膨張層３２が基材２０の第１主面２２の上に積層される。なお、第１熱膨張層３２の所定の厚み（例えば、５０μｍ）を得るために、第１塗布液の塗布と乾燥とを、繰り返してもよい。   In the first thermal expansion layer forming step (Step S10), first, a first coating liquid is applied in a predetermined pattern on the first main surface 22 of the base material 20 using an application device. The application device is, for example, a screen printing device. Next, the first coating liquid applied to the first main surface 22 of the substrate 20 is dried. Thus, the first thermal expansion layer 32 is laminated on the first main surface 22 of the base material 20. Note that, in order to obtain a predetermined thickness (for example, 50 μm) of the first thermal expansion layer 32, the application and drying of the first application liquid may be repeated.

積層工程（ステップＳ２０）では、塗布装置を用いて、第１熱膨張層３２の上に第２塗布液を所定のパターンで塗布し、塗布された第２塗布液を乾燥させる。これにより、第２熱膨張層３４が第１熱膨張層３２の上に積層される。第１熱膨張層３２と同様に、第２熱膨張層３４の所定の厚み（例えば、１００μｍ）を得るために、第２塗布液の塗布と乾燥とを、繰り返してもよい。
以上により、成形シート１０を製造できる。 In the laminating step (Step S20), a second coating liquid is applied on the first thermal expansion layer 32 in a predetermined pattern using a coating apparatus, and the applied second coating liquid is dried. Thereby, the second thermal expansion layer 34 is laminated on the first thermal expansion layer 32. Similarly to the first thermal expansion layer 32, the application and drying of the second coating liquid may be repeated in order to obtain a predetermined thickness (for example, 100 μm) of the second thermal expansion layer 34.
As described above, the molded sheet 10 can be manufactured.

（シート）
次に、図４〜図６を参照して、成形シート１０から製造されるシート１００を説明する。シート１００は、図４、図５に示すように、基材２０と、膨張した第１熱膨張層３２ａと膨張した第２熱膨張層３４ａとを有する造形物１２０と、基材２０の第２主面２４に積層された熱変換層１１０とを有する。シート１００の基材２０は、成形シート１０の基材２０と同様であるので、ここでは、熱変換層１１０と造形物１２０について、説明する。 (Sheet)
Next, a sheet 100 manufactured from the molded sheet 10 will be described with reference to FIGS. As shown in FIGS. 4 and 5, the sheet 100 includes a substrate 120, a modeled object 120 having an expanded first thermal expansion layer 32 a and an expanded second thermal expansion layer 34 a, and a second And a heat conversion layer 110 laminated on the main surface 24. Since the base material 20 of the sheet 100 is the same as the base material 20 of the molded sheet 10, the heat conversion layer 110 and the modeled object 120 will be described here.

シート１００の造形物１２０は、基材２０の第１主面２２に円柱状に形成され、膨張した第１熱膨張層３２ａと膨張した第２熱膨張層３４ａとを有する。膨張した第１熱膨張層３２ａは成形シート１０の第１熱膨張層３２が膨張した層であり、膨張した第２熱膨張層３４ａは成形シート１０の第２熱膨張層３４が膨張した層である。なお、以下では、膨張した第１熱膨張層３２ａを膨張した熱膨張層３２ａと、膨張した第２熱膨張層３４ａを膨張した熱膨張層３４ａと記載する場合がある。   The molded object 120 of the sheet 100 is formed in a columnar shape on the first main surface 22 of the base material 20, and has an expanded first thermal expansion layer 32a and an expanded second thermal expansion layer 34a. The expanded first thermal expansion layer 32a is a layer in which the first thermal expansion layer 32 of the molded sheet 10 is expanded, and the expanded second thermal expansion layer 34a is a layer in which the second thermal expansion layer 34 of the molded sheet 10 is expanded. is there. Hereinafter, the expanded first thermal expansion layer 32a may be referred to as an expanded thermal expansion layer 32a, and the expanded second thermal expansion layer 34a may be referred to as an expanded thermal expansion layer 34a.

膨張した第１熱膨張層３２ａは、図６に示すように、第１バインダ３３ａと、成形シート１０の第１熱膨張微粒子３３ｂが膨張した、膨張した第１熱膨張微粒子３３ｃとを含む。膨張した第２熱膨張層３４ａは、第２バインダ３５ａと、成形シート１０の第２熱膨張微粒子３５ｂが膨張した、膨張した第２熱膨張微粒子３５ｃとを含む。なお、膨張した第１熱膨張層３２ａの第１バインダ３３ａと膨張した第２熱膨張層３４ａの第２バインダ３５ａは、それぞれ、第１熱膨張層３２の第１バインダ３３ａと第２熱膨張層３４の第２バインダ３５ａと同様である。また、図６では、理解を容易にするためにハッチングを省略している。   As shown in FIG. 6, the expanded first thermal expansion layer 32a includes a first binder 33a and expanded first thermal expansion particles 33c in which the first thermal expansion particles 33b of the molded sheet 10 are expanded. The expanded second thermal expansion layer 34a includes a second binder 35a and expanded second thermal expansion fine particles 35c in which the second thermal expansion fine particles 35b of the molded sheet 10 are expanded. The first binder 33a of the expanded first thermal expansion layer 32a and the second binder 35a of the expanded second thermal expansion layer 34a correspond to the first binder 33a and the second thermal expansion layer of the first thermal expansion layer 32, respectively. 34 is the same as the second binder 35a. In FIG. 6, hatching is omitted for easy understanding.

本実施形態では、基材２０の第１主面２２側に位置する膨張した第１熱膨張層３２ａに含まれる膨張した第１熱膨張微粒子３３ｃの平均粒径が、膨張した第２熱膨張層３４ａに含まれる膨張した第２熱膨張微粒子３５ｃの平均粒径よりも小さい。これにより、基材２０の第１主面２２側に位置する膨張した第１熱膨張層３２ａにおいて、膨張した第１熱膨張微粒子３３ｃの占める体積の割合が小さく、基材２０に対する密着性が高い第１バインダ３３ａの占める体積の割合が大きくなり、膨張した第１熱膨張層３２ａの基材２０からの剥離を抑制できる。   In the present embodiment, the average particle diameter of the expanded first thermal expansion fine particles 33c included in the expanded first thermal expansion layer 32a located on the first main surface 22 side of the base material 20 is equal to the expanded second thermal expansion layer. The average particle diameter of the expanded second thermally expanded fine particles 35c included in the expanded thermal expansion particles 34a is smaller than the average diameter. Thereby, in the expanded first thermal expansion layer 32 a located on the first main surface 22 side of the base material 20, the ratio of the volume occupied by the expanded first thermal expansion fine particles 33 c is small, and the adhesion to the base material 20 is high. The ratio of the volume occupied by the first binder 33a is increased, and the exfoliation of the expanded first thermal expansion layer 32a from the substrate 20 can be suppressed.

シート１００の熱変換層１１０は、基材２０の第２主面２４の全面に積層される。熱変換層１１０は、照射された電磁波を熱に変換し、変換された熱を放出する。熱変換層１１０は、放出した熱により、成形シート１０の第１熱膨張層３２と第２熱膨張層３４を加熱する。具体的には、熱変換層１１０は、成形シート１０の第１熱膨張層３２と第２熱膨張層３４を、第１熱膨張微粒子３３ｂと第２熱膨張微粒子３５ｂが膨張する所定の温度以上に加熱する。そして、第１熱膨張層３２と第２熱膨張層３４は、加熱温度、加熱時間等に応じた大きさに膨張する。   The heat conversion layer 110 of the sheet 100 is laminated on the entire surface of the second main surface 24 of the substrate 20. The heat conversion layer 110 converts the irradiated electromagnetic wave into heat and emits the converted heat. The heat conversion layer 110 heats the first thermal expansion layer 32 and the second thermal expansion layer 34 of the molded sheet 10 by the released heat. Specifically, the heat conversion layer 110 is configured to move the first thermal expansion layer 32 and the second thermal expansion layer 34 of the molded sheet 10 to a predetermined temperature or higher at which the first thermal expansion particles 33b and the second thermal expansion particles 35b expand. Heat to Then, the first thermal expansion layer 32 and the second thermal expansion layer 34 expand to a size according to the heating temperature, the heating time, and the like.

熱変換層１１０は、吸収した電磁波を熱に変換する熱変換材料から構成される。熱変換材料は、カーボン分子であるカーボンブラック、六ホウ化金属化合物、酸化タングステン系化合物等である。例えば、カーボンブラックは、可視光、赤外光等を吸収して熱に変換する。また、六ホウ化金属化合物と酸化タングステン系化合物は、近赤外光を吸収して熱に変換する。六ホウ化金属化合物と酸化タングステン系化合物の中では、近赤外光領域で吸収率が高く、かつ可視光領域の透過率が高いことから、六ホウ化ランタン（ＬａＢ６）とセシウム酸化タングステン（Ｃｓ２ＷＯ４）が好ましい。 The heat conversion layer 110 is made of a heat conversion material that converts absorbed electromagnetic waves into heat. The heat conversion material is carbon black which is a carbon molecule, a metal hexaboride compound, a tungsten oxide-based compound, or the like. For example, carbon black absorbs visible light, infrared light and the like and converts it into heat. Further, the metal hexaboride compound and the tungsten oxide-based compound absorb near-infrared light and convert it to heat. Among the metal hexaboride compound and the tungsten oxide-based compound, lanthanum hexaboride (LaB 6 ) and cesium tungsten oxide ( Cs 2 WO 4 ) is preferred.

次に、シート１００の製造方法を説明する。図８は、シート１００の製造方法を示すフローチャートである。シート１００の製造方法は、成形シート１０を準備する準備工程（ステップＳ３０）と、成形シート１０の基材２０の第２主面２４の上に熱変換層１１０を積層する熱変換層積層工程（ステップＳ４０）と、熱変換層１１０に電磁波を照射して、熱変換層１１０に熱を発生させることによって、第１熱膨張層３２と第２熱膨張層３４を加熱して膨張させ、造形物１２０を形成する膨張工程（ステップＳ５０）とを含む。   Next, a method for manufacturing the sheet 100 will be described. FIG. 8 is a flowchart illustrating a method for manufacturing the sheet 100. The method for manufacturing the sheet 100 includes a preparation step of preparing the molded sheet 10 (step S30) and a heat conversion layer laminating step of laminating the heat conversion layer 110 on the second main surface 24 of the base material 20 of the molded sheet 10 ( Step S40), irradiating the heat conversion layer 110 with electromagnetic waves to generate heat in the heat conversion layer 110, thereby heating and expanding the first thermal expansion layer 32 and the second thermal expansion layer 34, and (Step S50).

準備工程（ステップＳ３０）では、成形シート１０と熱変換材料を含むインクを準備する。成形シート１０は、例えば、上述した成形シート１０の製造方法（ステップＳ１０とステップＳ２０）により製造される。また、熱変換材料を含むインクは、例えば、カーボンブラックを含むインクである。   In the preparation step (step S30), an ink containing the molded sheet 10 and the heat conversion material is prepared. The molded sheet 10 is manufactured by, for example, the above-described method of manufacturing the molded sheet 10 (Step S10 and Step S20). The ink containing the heat conversion material is, for example, ink containing carbon black.

熱変換層積層工程（ステップＳ４０）では、基材２０の第２主面２４の上に熱変換層１１０を積層する。具体的には、印刷装置によって、基材２０の第２主面２４の全面に、カーボンブラックを含むインクを印刷する。印刷装置は、例えば、インクジェットプリンタである。   In the heat conversion layer stacking step (step S40), the heat conversion layer 110 is stacked on the second main surface 24 of the base material 20. Specifically, an ink containing carbon black is printed on the entire surface of the second main surface 24 of the base material 20 by a printing device. The printing device is, for example, an ink jet printer.

膨張工程（ステップＳ５０）では、熱変換層１１０に電磁波を照射して、熱変換層１１０に熱を発生させることによって、第１熱膨張層３２と第２熱膨張層３４を加熱して膨張させ、造形物１２０を形成する。具体的には、図示しない照射装置によって、熱変換層１１０が吸収し熱に変換する電磁波を、基材２０の第２主面２４の全面に積層された熱変換層１１０に照射する。照射装置は、例えば、ハロゲンランプを備え、近赤外領域（波長７５０ｎｍ〜１４００ｎｍ）、可視光領域（波長３８０ｎｍ〜７５０ｎｍ）、中赤外領域（波長１４００ｎｍ〜４０００ｎｍ）等の電磁波を照射する。これにより、第１熱膨張層３２の第１熱膨張微粒子３３ｂと第２熱膨張層３４の第２熱膨張微粒子３５ｂが、熱変換層１１０に発生した熱によって膨張して、膨張した第１熱膨張微粒子３３ｃと膨張した第２熱膨張微粒子３５ｃが形成され、第１熱膨張層３２と第２熱膨張層３４が膨張する。   In the expansion step (Step S50), the first heat expansion layer 32 and the second heat expansion layer 34 are heated and expanded by irradiating the heat conversion layer 110 with electromagnetic waves to generate heat in the heat conversion layer 110. To form the shaped object 120. Specifically, an irradiation device (not shown) irradiates the heat conversion layer 110 laminated on the entire surface of the second main surface 24 of the base material 20 with an electromagnetic wave absorbed by the heat conversion layer 110 and converted into heat. The irradiation device includes, for example, a halogen lamp, and irradiates electromagnetic waves in the near-infrared region (wavelength 750 nm to 1400 nm), visible light region (wavelength 380 nm to 750 nm), mid-infrared region (wavelength 1400 nm to 4000 nm) and the like. As a result, the first thermal expansion fine particles 33b of the first thermal expansion layer 32 and the second thermal expansion fine particles 35b of the second thermal expansion layer 34 expand due to the heat generated in the heat conversion layer 110, and the expanded first thermal expansion fine particles 33b. The expanded thermal expansion particles 33c and the expanded thermal expansion fine particles 35c are formed, and the first thermal expansion layer 32 and the second thermal expansion layer 34 expand.

本実施形態では、膨張した第１熱膨張微粒子３３ｃの平均粒径が、膨張した第２熱膨張層３４ａに含まれる膨張した第２熱膨張微粒子３５ｃの平均粒径よりも小さい。これにより、基材２０の第１主面２２側に位置する膨張した第１熱膨張層３２ａにおいて、基材２０に対する密着性が高い第１バインダ３３ａの占める体積の割合が大きくなり、膨張した第１熱膨張層３２ａの基材２０からの剥離を抑制できる。   In the present embodiment, the average particle size of the expanded first thermal expansion fine particles 33c is smaller than the average particle size of the expanded second thermal expansion fine particles 35c included in the expanded second thermal expansion layer 34a. Thereby, in the expanded first thermal expansion layer 32a located on the first main surface 22 side of the base material 20, the ratio of the volume occupied by the first binder 33a having high adhesion to the base material 20 is increased, and the expanded 1 The exfoliation of the thermal expansion layer 32a from the substrate 20 can be suppressed.

以上により、造形物１２０を有するシート１００を製造できる。ここで、熱変換層１１０から放出される熱の熱量は、カーボンブラックの濃度と熱変換層１１０に照射される電磁波のエネルギー量とに依存する。したがって、カーボンブラックを含むインクの濃淡と熱変換層１１０に照射される電磁波のエネルギー量とにより、第１熱膨張層３２と第２熱膨張層３４とを加熱する温度を制御でき、造形物１２０の高さを制御できる。また、造形物１２０の高さは、第１熱膨張層３２と第２熱膨張層３４の厚さ、第１熱膨張微粒子３３ｂと第２熱膨張微粒子３５ｂの膨張前の平均粒径等を変えることによって、制御できる。   As described above, the sheet 100 having the modeled object 120 can be manufactured. Here, the amount of heat released from the heat conversion layer 110 depends on the concentration of carbon black and the amount of energy of electromagnetic waves applied to the heat conversion layer 110. Therefore, the temperature at which the first thermal expansion layer 32 and the second thermal expansion layer 34 are heated can be controlled by the density of the ink containing the carbon black and the amount of energy of the electromagnetic wave applied to the thermal conversion layer 110, and the shaped object 120 Height can be controlled. Further, the height of the modeled object 120 changes the thickness of the first thermal expansion layer 32 and the second thermal expansion layer 34, the average particle diameter of the first thermal expansion fine particles 33b and the second thermal expansion fine particles 35b before expansion, and the like. By doing so, it can be controlled.

以上のように、成形シート１０では、第１熱膨張微粒子３３ｂの膨張前の平均粒径が、第２熱膨張微粒子３５ｂの膨張前の平均粒径よりも小さいので、シート１００の膨張した第１熱膨張層３２ａの基材２０からの剥離を抑制できる。さらに、第２熱膨張微粒子３５ｂの膨張前の平均粒径を、第１熱膨張微粒子３３ｂの膨張前の平均粒径よりも大きくすることにより、造形物１２０の高さを高くできる。
また、シート１００においても、膨張した第１熱膨張微粒子３３ｃの平均粒径が、膨張した第２熱膨張層３４ａに含まれる膨張した第２熱膨張微粒子３５ｃの平均粒径よりも小さいので、基材２０の第１主面２２側に位置する膨張した第１熱膨張層３２ａにおいて、基材２０に対する密着性が高い第１バインダ３３ａの占める体積の割合が大きくなり、膨張した第１熱膨張層３２ａの基材２０からの剥離を抑制できる。 As described above, in the molded sheet 10, since the average particle diameter of the first thermally expanded fine particles 33b before expansion is smaller than the average particle diameter of the second thermally expanded fine particles 35b before expansion, the expanded first expanded particles of the sheet 100 are reduced. The peeling of the thermal expansion layer 32a from the substrate 20 can be suppressed. Furthermore, by making the average particle diameter of the second thermally expanded fine particles 35b before expansion larger than the average diameter of the first thermally expanded fine particles 33b before expansion, the height of the modeled object 120 can be increased.
Also in the sheet 100, the average particle size of the expanded first thermal expansion fine particles 33c is smaller than the average particle size of the expanded second thermal expansion fine particles 35c included in the expanded second thermal expansion layer 34a. In the expanded first thermal expansion layer 32a located on the first main surface 22 side of the material 20, the ratio of the volume occupied by the first binder 33a having high adhesion to the base material 20 increases, and the expanded first thermal expansion layer 32a can be prevented from peeling from the base material 20.

＜実施形態２＞
実施形態１では、成形シート１０は２層の熱膨張層３２、３４を備え、シート１００の造形物１２０は２層の膨張した熱膨張層３２ａ、３４ａを有するが、熱膨張層の層数はこれらに限られない。 <Embodiment 2>
In the first embodiment, the molded sheet 10 includes two thermal expansion layers 32 and 34, and the modeled object 120 of the sheet 100 includes two expanded thermal expansion layers 32a and 34a. It is not limited to these.

本実施形態の成形シート１０は、図９に示す、膨張した第１熱膨張層５２ａと膨張した第２熱膨張層５４ａと膨張した第３熱膨張層５６ａとを有する造形物１２０を備える、シート１００の製造に用いられる。本実施形態の成形シート１０は、図１０に示すように、実施形態１における第１熱膨張層３２と第２熱膨張層３４に代えて、第１熱膨張層５２と第２熱膨張層５４と第３熱膨張層５６とを備える。すなわち、本実施形態の成形シート１０は、基材２０の第１主面２２の上に、造形物１２０の配置と形状に対応した所定のパターンで積層された、３層の熱膨張層５２、５４、５６を備える。本実施形態の成形シート１０のその他の構成は、実施形態１の成形シート１０と同様である。   The molded sheet 10 of the present embodiment includes a molded object 120 shown in FIG. 9 having an expanded first thermal expansion layer 52a, an expanded second thermal expansion layer 54a, and an expanded third thermal expansion layer 56a. Used for the manufacture of 100. As shown in FIG. 10, the molded sheet 10 according to the present embodiment includes a first thermal expansion layer 52 and a second thermal expansion layer 54 instead of the first thermal expansion layer 32 and the second thermal expansion layer 34 in the first embodiment. And a third thermal expansion layer 56. That is, the molded sheet 10 of the present embodiment has three thermal expansion layers 52 laminated on the first main surface 22 of the base material 20 in a predetermined pattern corresponding to the arrangement and shape of the modeled object 120, 54 and 56 are provided. Other configurations of the molded sheet 10 of the present embodiment are the same as those of the molded sheet 10 of the first embodiment.

第１熱膨張層５２と第２熱膨張層５４と第３熱膨張層５６は、実施形態１の第１熱膨張層３２と第２熱膨張層３４と同様に、基材２０の第１主面２２の上に順次積層されており、加熱される熱量に応じた大きさに膨張する。第１熱膨張層５２と第２熱膨張層５４と第３熱膨張層５６のそれぞれは、膨張によって、造形物１２０の膨張した第１熱膨張層５２ａと膨張した第２熱膨張層５４ａと膨張した第３熱膨張層５６ａのそれぞれを形成する。   The first thermal expansion layer 52, the second thermal expansion layer 54, and the third thermal expansion layer 56 are, like the first thermal expansion layer 32 and the second thermal expansion layer 34 of the first embodiment, the first main expansion layer of the base material 20. The layers are sequentially stacked on the surface 22 and expand to a size corresponding to the amount of heat to be heated. Each of the first thermal expansion layer 52, the second thermal expansion layer 54, and the third thermal expansion layer 56 expands with the expanded first thermal expansion layer 52 a and the expanded second thermal expansion layer 54 a of the modeled object 120. Each of the thus formed third thermal expansion layers 56a is formed.

第１熱膨張層５２は、図１１に示すように、第１バインダ５３ａと第１バインダ５３ａ中に分散された第１熱膨張微粒子５３ｂとを含む。第１熱膨張層５２は、第１熱膨張微粒子５３ｂの膨張により膨張する。第２熱膨張層５４は第２バインダ５５ａと第２バインダ５５ａ中に分散された第２熱膨張微粒子５５ｂとを含み、第３熱膨張層５６は第３バインダ５７ａと第３バインダ５７ａ中に分散された第３熱膨張微粒子５７ｂとを含む。第２熱膨張層５４は第２熱膨張微粒子５５ｂの膨張により膨張し、第３熱膨張層５６は第３熱膨張微粒子５７ｂの膨張により膨張する。なお、図１１では、理解を容易にするためにハッチングを省略している。   As shown in FIG. 11, the first thermal expansion layer 52 includes a first binder 53a and first thermal expansion fine particles 53b dispersed in the first binder 53a. The first thermal expansion layer 52 expands due to expansion of the first thermal expansion fine particles 53b. The second thermal expansion layer 54 includes a second binder 55a and second thermal expansion fine particles 55b dispersed in the second binder 55a, and the third thermal expansion layer 56 disperses in the third binder 57a and the third binder 57a. And third thermally expanded fine particles 57b. The second thermal expansion layer 54 expands due to the expansion of the second thermal expansion fine particles 55b, and the third thermal expansion layer 56 expands due to the expansion of the third thermal expansion fine particles 57b. In FIG. 11, hatching is omitted for easy understanding.

本実施形態では、第２熱膨張微粒子５５ｂの膨張前の平均粒径は第１熱膨張微粒子５３ｂの膨張前の平均粒径よりも大きく、第３熱膨張微粒子５７ｂの膨張前の平均粒径は第２熱膨張微粒子５５ｂの膨張前の平均粒径よりも大きい。例えば、第１熱膨張微粒子５３ｂの膨張前の平均粒径は０．５μｍ以上３．０μｍ以下、第２熱膨張微粒子５５ｂの膨張前の平均粒径は３．０μｍよりも大きく１０μｍ以下、第３熱膨張微粒子５７ｂの膨張前の平均粒径は１０．０μｍよりも大きく３０μｍ以下である。   In the present embodiment, the average particle size of the second thermal expansion fine particles 55b before expansion is larger than the average particle size of the first thermal expansion fine particles 53b before expansion, and the average particle size of the third thermal expansion fine particles 57b before expansion is: The second thermal expansion fine particles 55b are larger than the average particle diameter before expansion. For example, the average particle size of the first thermally expanded fine particles 53b before expansion is 0.5 μm or more and 3.0 μm or less, and the average particle size of the second thermal expansion fine particles 55b before expansion is more than 3.0 μm and 10 μm or less. The average particle diameter of the thermally expanded fine particles 57b before expansion is larger than 10.0 μm and 30 μm or less.

本実施形態の成形シート１０では、基材２０の第１主面２２側に位置する第１熱膨張層５２の第１熱膨張微粒子５３ｂの膨張前の平均粒径が、最も小さい。したがって、第１熱膨張層５２と第２熱膨張層５４と第３熱膨張層５６が膨張した場合に、基材２０の第１主面２２側に位置する膨張した第１熱膨張層５２ａにおいて、図示しない第１熱膨張層５２ａの膨張した第１熱膨張微粒子の占める体積の割合が小さく、基材２０に対する密着性が高い第１バインダ５３ａの占める体積の割合が大きくなり、膨張した第１熱膨張層５２ａの基材２０からの剥離を抑制できる。   In the molded sheet 10 of the present embodiment, the first thermal expansion fine particles 53b of the first thermal expansion layer 52 located on the first main surface 22 side of the base material 20 have the smallest average particle diameter before expansion. Therefore, when the first thermal expansion layer 52, the second thermal expansion layer 54, and the third thermal expansion layer 56 expand, the first thermal expansion layer 52 a located on the first main surface 22 side of the base material 20 expands. The ratio of the volume occupied by the expanded first thermal expansion fine particles of the first thermal expansion layer 52a (not shown) is small, and the ratio of the volume occupied by the first binder 53a having high adhesion to the base material 20 is increased. The exfoliation of the thermal expansion layer 52a from the substrate 20 can be suppressed.

また、本実施形態の成形シート１０では、第１熱膨張微粒子５３ｂ、第２熱膨張微粒子５５ｂ、第３熱膨張微粒子５７ｂの順に、平均粒径が大きくなっていくので、膨張した第１熱膨張層５２ａと膨張した第２熱膨張層５４ａと膨張した第３熱膨張層５６ａとの間の剥離も抑制でき、造形物１２０の高さを高くできる。   Also, in the molded sheet 10 of the present embodiment, the first thermal expansion fine particles 53b, the second thermal expansion fine particles 55b, and the third thermal expansion fine particles 57b increase in average particle size in this order, so that the expanded first thermal expansion fine particles 53b. Separation between the layer 52a, the expanded second thermal expansion layer 54a, and the expanded third thermal expansion layer 56a can also be suppressed, and the height of the modeled object 120 can be increased.

次に、本実施形態の成形シート１０の製造方法を説明する。図１２は、成形シート１０の製造方法を示すフローチャートである。本実施形態の成形シート１０の製造方法は、基材２０の第１主面２２の上に、第１熱膨張層５２を積層する第１熱膨張層形成工程（ステップＳ１０）と、第１熱膨張層５２の上に、第２熱膨張層５４と第３熱膨張層５６を順に積層する積層工程（ステップＳ２０）と、を含む。   Next, a method for manufacturing the molded sheet 10 of the present embodiment will be described. FIG. 12 is a flowchart illustrating a method for manufacturing the molded sheet 10. The method for manufacturing the molded sheet 10 according to the present embodiment includes a first thermal expansion layer forming step of stacking the first thermal expansion layer 52 on the first main surface 22 of the base material 20 (step S10); A laminating step (Step S20) of sequentially laminating the second thermal expansion layer 54 and the third thermal expansion layer 56 on the expansion layer 52 is included.

まず、基材２０と、第１熱膨張層５２を形成するための第１塗布液と、第２熱膨張層５４を形成するための第２塗布液と、第３熱膨張層５６を形成するための第３塗布液とを準備する。第１塗布液と第２塗布液と第３塗布液のそれぞれは、第１バインダ５３ａと第１熱膨張微粒子５３ｂ、第２バインダ５５ａと第２熱膨張微粒子５５ｂ、第３バインダ５７ａと第３熱膨張微粒子５７ｂのそれぞれを混合することにより、調製される。なお、上述のように、第１熱膨張微粒子５３ｂと第２熱膨張微粒子５５ｂと第３熱膨張微粒子５７ｂの膨張前の平均粒径の大きさは、第３熱膨張微粒子５７ｂ＞第２熱膨張微粒子５５ｂ＞第１熱膨張微粒子５３ｂの順である。   First, the base 20, the first coating liquid for forming the first thermal expansion layer 52, the second coating liquid for forming the second thermal expansion layer 54, and the third thermal expansion layer 56 are formed. And a third coating liquid for the preparation. The first coating liquid, the second coating liquid, and the third coating liquid are respectively composed of the first binder 53a and the first thermal expansion fine particles 53b, the second binder 55a and the second thermal expansion fine particles 55b, and the third binder 57a and the third thermal expansion fine particles. It is prepared by mixing each of the expanded fine particles 57b. As described above, the size of the average particle diameter before expansion of the first thermal expansion fine particles 53b, the second thermal expansion fine particles 55b, and the third thermal expansion fine particles 57b is determined by the following equation. Fine particles 55b> first thermal expansion fine particles 53b.

本実施形態の第１熱膨張層形成工程（ステップＳ１０）では、オフセット印刷により、基材２０の第１主面２２の上に、所定のパターンで第１塗布液を印刷する。具体的には、まず、図示しないオフセット印刷機によって、第１塗布液を第１主面２２の上に転写して１回目のオフセット印刷を行い、印刷された第１塗布液を乾燥させる。これにより、図１３に示すように、第１熱膨張層５２の１回目のオフセット印刷による層２０１を第１主面２２の上に形成する。次に、層２０１と同様に、２回目のオフセット印刷と乾燥とを行い、図１４に示すように、層２０１の上に２回目のオフセット印刷による層２０２を形成する。さらに、層２０１、２０２と同様に、３回目のオフセット印刷と乾燥とを行い、図１５に示すように、層２０２の上に３回目のオフセット印刷による層２０３を形成する。以上により、第１熱膨張層５２が基材２０の第１主面２２の上に積層される。   In the first thermal expansion layer forming step (Step S10) of the present embodiment, the first coating liquid is printed on the first main surface 22 of the base material 20 in a predetermined pattern by offset printing. Specifically, first, the first coating liquid is transferred onto the first main surface 22 by an offset printing machine (not shown) to perform the first offset printing, and the printed first coating liquid is dried. Thereby, as shown in FIG. 13, a layer 201 of the first thermal expansion layer 52 by the first offset printing is formed on the first main surface 22. Next, similarly to the layer 201, the second offset printing and drying are performed to form a layer 202 by the second offset printing on the layer 201 as shown in FIG. Further, similarly to the layers 201 and 202, the third offset printing and drying are performed to form a layer 203 by the third offset printing on the layer 202 as shown in FIG. As described above, the first thermal expansion layer 52 is laminated on the first main surface 22 of the base material 20.

第１熱膨張層５２をオフセット印刷により形成する場合、印刷する対象（すなわち、第１熱膨張層５２の下地）が基材２０であるので、第１熱膨張微粒子５３ｂの膨張前の平均粒径が１回の印刷で転写される第１バインダ５３ａの厚さＤの３倍よりも大きいと、第１熱膨張微粒子５３ｂが第１主面２２の上に転写されず、層２０１〜２０３にむらが生じ易い。したがって、第１熱膨張微粒子５３ｂの膨張前の平均粒径は、１回の印刷で転写される第１バインダ５３ａの厚さＤの３倍以下であることが好ましい。なお、１回の印刷で転写される第１バインダ５３ａの厚さＤは、図１３に示すように、例えば層２０１における第１熱膨張微粒子５３ｂが存在しない部分の厚さである。また、図１３〜図１５では、理解を容易にするためにハッチングを省略している。   When the first thermal expansion layer 52 is formed by offset printing, the target to be printed (that is, the base of the first thermal expansion layer 52) is the substrate 20, so the average particle diameter of the first thermal expansion fine particles 53b before expansion is increased. Is larger than three times the thickness D of the first binder 53a transferred in one printing, the first thermally expanded fine particles 53b are not transferred onto the first main surface 22 and the layers 201 to 203 are uneven. Tends to occur. Therefore, it is preferable that the average particle diameter of the first thermally expanded fine particles 53b before expansion is not more than three times the thickness D of the first binder 53a transferred by one printing. As shown in FIG. 13, the thickness D of the first binder 53a transferred by one printing is, for example, the thickness of a portion of the layer 201 where the first thermally expandable fine particles 53b are not present. 13 to 15, hatching is omitted to facilitate understanding.

本実施形態の積層工程（ステップＳ２０）では、第２熱膨張層５４を、第１熱膨張層５２と同様に、第２塗布液のオフセット印刷を複数回行うことにより、第１熱膨張層５２の上に積層する。次に、第３熱膨張層５６を、第１熱膨張層５２と第２熱膨張層５４と同様に、オフセット印刷により、第２熱膨張層５４の上に積層する。積層工程（ステップＳ２０）では、印刷する対象である第１熱膨張層５２が第１バインダ５３ａを含むので、第２熱膨張微粒子５５ｂの膨張前の平均粒径は１回の印刷で転写される第２バインダ５５ａの厚さの３倍以下でなくともよい。また、第２熱膨張層５４が第２バインダ５５ａを含むので、第３熱膨張微粒子５７ｂの膨張前の平均粒径は１回の印刷で転写される第３バインダ５７ａの厚さの３倍以下でなくともよい。
以上により、本実施形態の成形シート１０を製造できる。 In the laminating step (Step S20) of the present embodiment, the second thermal expansion layer 54 is subjected to offset printing of the second coating liquid a plurality of times, like the first thermal expansion layer 52, so that the first thermal expansion layer 52 is formed. On top of each other. Next, like the first thermal expansion layer 52 and the second thermal expansion layer 54, the third thermal expansion layer 56 is laminated on the second thermal expansion layer 54 by offset printing. In the laminating step (step S20), since the first thermal expansion layer 52 to be printed includes the first binder 53a, the average particle diameter of the second thermal expansion fine particles 55b before expansion is transferred by one printing. The thickness may not be three times or less the thickness of the second binder 55a. Further, since the second thermal expansion layer 54 includes the second binder 55a, the average particle diameter of the third thermal expansion fine particles 57b before expansion is not more than three times the thickness of the third binder 57a transferred by one printing. It is not necessary.
As described above, the molded sheet 10 of the present embodiment can be manufactured.

本実施形態のシート１００は、実施形態１のシート１００と同様に、準備工程（ステップＳ３０）と熱変換層積層工程（ステップＳ４０）と膨張工程（ステップＳ５０）により、本実施形態の成形シート１０から製造できる。   Similarly to the sheet 100 of the first embodiment, the sheet 100 of the present embodiment is formed by the preparation step (Step S30), the heat conversion layer laminating step (Step S40), and the expansion step (Step S50). Can be manufactured from

以上のように、成形シート１０では、第１熱膨張層５２の第１熱膨張微粒子５３ｂの膨張前の平均粒径が最も小さいので、膨張した第１熱膨張層５２ａの基材２０からの剥離を抑制できる。また、基材２０の第１主面２２側から、第１熱膨張微粒子５３ｂ、第２熱膨張微粒子５５ｂ、第３熱膨張微粒子５７ｂの順に平均粒径が大きくなっていくので、膨張した第１熱膨張層５２ａと膨張した第２熱膨張層５４ａと膨張した第３熱膨張層５６ａとの間の剥離も抑制でき、造形物１２０の高さを高くできる。さらに、シート１００においても、膨張した第１熱膨張層５２ａの基材２０からの剥離と、膨張した第１熱膨張層５２ａと膨張した第２熱膨張層５４ａと膨張した第３熱膨張層５６ａとの間の剥離とを抑制できる。   As described above, in the molded sheet 10, since the average particle diameter of the first thermal expansion particles 53b of the first thermal expansion layer 52 before expansion is smallest, the expanded first thermal expansion layer 52a is separated from the base material 20. Can be suppressed. Further, from the first main surface 22 side of the base material 20, the average particle size increases in the order of the first thermal expansion fine particles 53b, the second thermal expansion fine particles 55b, and the third thermal expansion fine particles 57b. Separation between the thermal expansion layer 52a, the expanded second thermal expansion layer 54a, and the expanded third thermal expansion layer 56a can also be suppressed, and the height of the modeled object 120 can be increased. Further, also in the sheet 100, the expanded first thermal expansion layer 52a is separated from the base material 20, the expanded first thermal expansion layer 52a, the expanded second thermal expansion layer 54a, and the expanded third thermal expansion layer 56a. Separation between them can be suppressed.

以上、本発明の実施形態を説明したが、本発明は、本発明の要旨を逸脱しない範囲で種々の変更が可能である。   Although the embodiments of the present invention have been described above, the present invention can be variously modified without departing from the gist of the present invention.

例えば、成形シート１０はロール状に製造され、シート１００はロール状の成形シート１０からロール状に製造されてもよい。   For example, the formed sheet 10 may be manufactured in a roll shape, and the sheet 100 may be manufactured from the roll-shaped formed sheet 10 in a roll shape.

基材２０を構成する材料は、熱可塑性樹脂に限られず、紙、布等であってもよい。基材２０を構成する熱可塑性樹脂は、ポリオレフィン系樹脂とポリエステル系樹脂に限られず、ポリアミド系樹脂、ポリ塩化ビニル（ＰＶＣ）系樹脂、ポリイミド系樹脂等であってもよい。   The material forming the substrate 20 is not limited to a thermoplastic resin, but may be paper, cloth, or the like. The thermoplastic resin forming the base material 20 is not limited to the polyolefin resin and the polyester resin, but may be a polyamide resin, a polyvinyl chloride (PVC) resin, a polyimide resin, or the like.

基材２０の第１主面２２に積層される熱膨張層の層数Ｎは、２又は３に限らず、複数（Ｎは２以上の整数）であればよい。すなわち、成形シート１０は、第１主面２２の上に積層されたＮ（Ｎは２以上の整数）層の熱膨張層を備えればよく、さらに、成形シート１０においては、Ｍ（Ｍは２以上Ｎ以下の整数）層目の熱膨張層に含まれる熱膨張微粒子の平均粒径が、Ｍ−１層目の熱膨張層に含まれる熱膨張微粒子の平均粒径よりも大きい。また、シート１００の造形物１２０は、第１主面２２の上に積層されたＮ（Ｎは２以上の整数）層の膨張した熱膨張層を有すればよく、Ｍ（Ｍは２以上Ｎ以下の整数）層目の熱膨張層に含まれる熱膨張微粒子の平均粒径が、Ｍ−１層目の熱膨張層に含まれる熱膨張微粒子の平均粒径よりも大きい。   The number N of thermal expansion layers laminated on the first main surface 22 of the base material 20 is not limited to two or three, and may be a plurality (N is an integer of 2 or more). That is, the molded sheet 10 may include an N (N is an integer of 2 or more) thermal expansion layer laminated on the first main surface 22. Further, in the molded sheet 10, M (M is The average particle diameter of the thermal expansion fine particles contained in the thermal expansion layer of the (number 2 or more and N or less) layer is larger than the average particle diameter of the thermal expansion particles contained in the thermal expansion layer of the (M-1) th layer. The molded object 120 of the sheet 100 may have an expanded N (N is an integer of 2 or more) thermal expansion layer laminated on the first main surface 22, and M (M is 2 or more N The average particle diameter of the thermal expansion fine particles contained in the thermal expansion layer of the (integer) layer is larger than the average particle diameter of the thermal expansion fine particles contained in the thermal expansion layer of the (M-1) th layer.

実施形態２では、第１熱膨張層５２を３回のオフセット印刷により形成しているが、オフセット印刷は、３回に限らず、１回又は所定の厚みを得るために複数回繰り返されてもよい。   In the second embodiment, the first thermal expansion layer 52 is formed by three times of offset printing. However, the offset printing is not limited to three times, and may be performed once or a plurality of times to obtain a predetermined thickness. Good.

実施形態１の第１熱膨張層３２と第２熱膨張層３４と、実施形態２の第１熱膨張層５２と第２熱膨張層５４と第３熱膨張層５６は、造形物１２０の配置と形状に対応した所定のパターンで、基材２０の第１主面２２に積層されているが、第１主面２２に積層されるＮ層の熱膨張層は、図１６に示すように、均一に積層されてもよい。この場合、造形物１２０の配置と形状に対応した所定のパターンで基材２０の第２主面２４の上に熱変換層１１０を積層し（熱変換層積層工程：ステップＳ４０）、積層されたＮ層の熱膨張層を膨張させ造形物１２０を形成する（膨張工程：ステップＳ５０）ことによって、図１７に示す、造形物１２０を有するシート１００を製造できる。   The first thermal expansion layer 32 and the second thermal expansion layer 34 of the first embodiment, and the first thermal expansion layer 52, the second thermal expansion layer 54, and the third thermal expansion layer 56 of the second embodiment, Is laminated on the first main surface 22 of the base material 20 in a predetermined pattern corresponding to the shape. The N-layer thermal expansion layer laminated on the first main surface 22 is, as shown in FIG. They may be evenly stacked. In this case, the heat conversion layer 110 is stacked on the second main surface 24 of the base material 20 in a predetermined pattern corresponding to the arrangement and shape of the modeled object 120 (heat conversion layer stacking step: step S40), and the heat conversion layer 110 is stacked. The sheet 100 having the modeled object 120 shown in FIG. 17 can be manufactured by expanding the N-layer thermal expansion layer to form the modeled object 120 (expansion step: step S50).

また、実施形態１の熱変換層１１０は基材２０の第２主面２４に積層されているが、熱変換層１１０は積層された２層の熱膨張層３２、３４の上、具体的には第２熱膨張層３４の上に積層されてもよい。さらに、シート１００は熱変換層１１０を備えなくともよい。例えば、実施形態１の成形シート１０を、オーブン中で、所定の温度で加熱することによって、実施形態１のシート１００を製造できる。また、熱変換層１１０は、膨張工程（ステップＳ５０）の後、除去されてもよい。   In addition, the heat conversion layer 110 according to the first embodiment is stacked on the second main surface 24 of the base material 20. The heat conversion layer 110 is formed on the stacked two thermal expansion layers 32 and 34, specifically. May be laminated on the second thermal expansion layer 34. Further, the sheet 100 may not include the heat conversion layer 110. For example, the sheet 100 of Embodiment 1 can be manufactured by heating the molded sheet 10 of Embodiment 1 at a predetermined temperature in an oven. Further, the heat conversion layer 110 may be removed after the expansion step (Step S50).

実施形態１と実施形態２の成形シート１０とシート１００は、各層の間に他の任意の材料による層を形成されてもよい。例えば、基材２０と第１熱膨張層３２、５２との間に、基材２０と第１熱膨張層３２、５２とをより密着させる密着層が形成されてもよい。密着層は、例えば、表面改質剤から構成される。また、成形シート１０とシート１００は、カラー画像を印刷されてもよい。例えば、成形シート１０とシート１００は、第２熱膨張層３４又は第３熱膨張層５６の上に、シアンＣとマゼンタＭとイエローＹとブラックＫの４色のインクから構成され、カラー画像を表すカラーインク層を積層されてもよい。   The molded sheet 10 and the sheet 100 of the first and second embodiments may have a layer made of any other material between the layers. For example, an adhesive layer may be formed between the base material 20 and the first thermal expansion layers 32 and 52 to make the base material 20 and the first thermal expansion layers 32 and 52 more closely adhere to each other. The adhesion layer is made of, for example, a surface modifier. Further, the molded sheet 10 and the sheet 100 may be printed with a color image. For example, the molded sheet 10 and the sheet 100 are composed of four color inks of cyan C, magenta M, yellow Y, and black K on the second thermal expansion layer 34 or the third thermal expansion layer 56, and form a color image. May be laminated.

以上、本発明の好ましい実施形態について説明したが、本発明は係る特定の実施形態に限定されるものではなく、本発明には、特許請求の範囲に記載された発明とその均等の範囲が含まれる。以下に、本願出願の当初の特許請求の範囲に記載された発明を付記する。   As described above, the preferred embodiments of the present invention have been described, but the present invention is not limited to the specific embodiments, and the present invention includes the inventions described in the claims and equivalents thereof. It is. Hereinafter, the inventions described in the claims of the present application will be additionally described.

（付記１）
第１主面と前記第１主面の反対側の第２主面とを有する基材と、
熱膨張微粒子を含み前記第１主面の上に積層された、Ｎ（Ｎは２以上の整数）層の熱膨張層と、を備え、
Ｍ（Ｍは２以上Ｎ以下の整数）層目の前記熱膨張層に含まれる前記熱膨張微粒子の平均粒径は、Ｍ−１層目の前記熱膨張層に含まれる前記熱膨張微粒子の平均粒径よりも大きい、
成形シート。 (Appendix 1)
A base material having a first main surface and a second main surface opposite to the first main surface;
An N (N is an integer of 2 or more) thermal expansion layer laminated on the first main surface and including thermal expansion fine particles,
The average particle diameter of the thermally expanded fine particles contained in the M (M is an integer of 2 or more and N or less) layer is the average of the thermally expanded particles contained in the M-1 layer. Larger than the particle size,
Molded sheet.

（付記２）
前記Ｎ層の熱膨張層は、前記第１主面の上に所定のパターンで積層されている、
付記１に記載の成形シート。 (Appendix 2)
The thermal expansion layer of the N layer is laminated in a predetermined pattern on the first main surface,
The molded sheet according to supplementary note 1.

（付記３）
基材の第１主面の上に、バインダと熱膨張微粒子とを含む、Ｎ層（Ｎは２以上の整数）の熱膨張層を備えた成形シートの製造方法であって、
前記第１主面の上に、１層目の前記熱膨張層を積層する第１熱膨張層形成工程と、
前記１層目の熱膨張層の上に、Ｎ−１層の前記熱膨張層を積層する積層工程と、を含み、
Ｍ（Ｍは２以上Ｎ以下の整数）層目の前記熱膨張層に含まれる前記熱膨張微粒子の平均粒径は、Ｍ−１層目の前記熱膨張層に含まれる前記熱膨張微粒子の平均粒径よりも大きい、
成形シートの製造方法。 (Appendix 3)
A method for producing a molded sheet comprising a thermal expansion layer of N layers (N is an integer of 2 or more), comprising a binder and thermal expansion fine particles, on a first main surface of a base material,
A first thermal expansion layer forming step of laminating the first thermal expansion layer on the first main surface;
A laminating step of laminating the N-1 layers of the thermal expansion layer on the first thermal expansion layer,
The average particle diameter of the thermally expanded fine particles contained in the M (M is an integer of 2 or more and N or less) layer is the average of the thermally expanded particles contained in the M-1 layer. Larger than the particle size,
Manufacturing method of molded sheet.

（付記４）
前記第１熱膨張層形成工程では、オフセット印刷により、前記バインダと、該バインダの厚さの３倍以下の平均粒子径を有する前記熱膨張微粒子を転写する、
付記３に記載の成形シートの製造方法。 (Appendix 4)
In the first thermal expansion layer forming step, the binder and the thermally expandable fine particles having an average particle diameter of three times or less the thickness of the binder are transferred by offset printing.
A method for producing a molded sheet according to supplementary note 3.

（付記５）
第１主面と前記第１主面の反対側の第２主面とを有する基材と、
膨張した熱膨張微粒子を含み前記第１主面の上に積層されたＮ（Ｎは２以上の整数）層の膨張した熱膨張層を有する造形物と、を備え、
Ｍ（Ｍは２以上Ｎ以下の整数）層目の前記膨張した熱膨張層に含まれる前記膨張した熱膨張微粒子の平均粒径は、Ｍ−１層目の前記膨張した熱膨張層に含まれる前記膨張した熱膨張微粒子の平均粒径よりも大きい、
シート。 (Appendix 5)
A base material having a first main surface and a second main surface opposite to the first main surface;
A shaped object having expanded thermal expansion layers of N (N is an integer of 2 or more) layers including expanded thermal expansion fine particles and laminated on the first main surface;
The average particle diameter of the expanded thermal expansion fine particles contained in the expanded thermal expansion layer of the M-th (M is an integer of 2 to N) layer is included in the expanded thermal expansion layer of the (M-1) -th layer. Larger than the average particle size of the expanded thermally expanded fine particles,
Sheet.

（付記６）
第１主面と前記第１主面の反対側の第２主面とを有する基材と、熱膨張微粒子を含み前記第１主面の上に積層された、Ｎ（Ｎは２以上の整数）層の熱膨張層と、を備え、Ｍ（Ｍは２以上Ｎ以下の整数）層目の前記熱膨張層に含まれる前記熱膨張微粒子の平均粒径は、Ｍ−１層目の前記熱膨張層に含まれる前記熱膨張微粒子の平均粒径よりも大きい、成形シートを準備する準備工程と、
前記成形シートの前記第２主面と前記Ｎ層の熱膨張層の一方の上に、電磁波を熱に変換する熱変換層を積層する熱変換層積層工程と、
前記熱変換層に前記電磁波を照射して前記熱変換層に熱を発生させることによって、前記Ｎ層の熱膨張層を加熱して、前記Ｎ層の熱膨張層を膨張させ、造形物を形成する膨張工程と、を含む、
シートの製造方法。 (Appendix 6)
A base material having a first main surface and a second main surface opposite to the first main surface; and N (where N is an integer of 2 or more) laminated on the first main surface including the thermally expandable fine particles. ) Layer, and the average particle diameter of the thermally expandable fine particles contained in the M (M is an integer of 2 or more and N or less) layer is the thermal expansion layer of the M-1 layer. A preparation step of preparing a molded sheet, which is larger than the average particle diameter of the thermally expanded fine particles contained in the expansion layer,
A heat conversion layer stacking step of stacking a heat conversion layer that converts electromagnetic waves into heat on one of the second main surface of the molded sheet and the thermal expansion layer of the N layer;
By irradiating the electromagnetic wave to the heat conversion layer to generate heat in the heat conversion layer, the thermal expansion layer of the N layer is heated, and the thermal expansion layer of the N layer is expanded to form a molded article. Expanding step;
Sheet manufacturing method.

１０・・・成形シート、２０・・・基材、２２・・・第１主面、２４・・・第２主面、３２・・・第１熱膨張層，熱膨張層、３２ａ・・・膨張した第１熱膨張層，膨張した熱膨張層、３３ａ・・・第１バインダ、３３ｂ・・・第１熱膨張微粒子，熱膨張微粒子、３３ｃ・・・膨張した第１熱膨張微粒子、３４・・・第２熱膨張層，熱膨張層、３４ａ・・・膨張した第２熱膨張層，膨張した熱膨張層、３５ａ・・・第２バインダ、３５ｂ・・・第２熱膨張微粒子，熱膨張微粒子、３５ｃ・・・膨張した第２熱膨張微粒子、５２・・・第１熱膨張層，熱膨張層、５２ａ・・・膨張した第１熱膨張層、５３ａ・・・第１バインダ、５３ｂ・・・第１熱膨張微粒子、５４・・・第２熱膨張層，熱膨張層、５４ａ・・・膨張した第２熱膨張層、５５ａ・・・第２バインダ、５５ｂ・・・第２熱膨張微粒子、５６・・・第３熱膨張層，熱膨張層、５６ａ・・・膨張した第３熱膨張層、５７ａ・・・第３バインダ、５７ｂ・・・第３熱膨張微粒子、１００・・・シート、１１０・・・熱変換層、１２０・・・造形物、２０１，２０２，２０３・・・層、Ｄ・・・厚さ DESCRIPTION OF SYMBOLS 10 ... Molded sheet, 20 ... Base material, 22 ... 1st main surface, 24 ... 2nd main surface, 32 ... 1st thermal expansion layer, thermal expansion layer, 32a ... Expanded first thermal expansion layer, expanded thermal expansion layer, 33a... First binder, 33b... First thermally expanded fine particles, thermally expanded fine particles, 33c. ..Second thermal expansion layer, thermal expansion layer, 34a ... expanded second thermal expansion layer, expanded thermal expansion layer, 35a ... second binder, 35b ... second thermal expansion fine particles, thermal expansion Fine particles, 35c: expanded second thermally expanded fine particles, 52: first thermal expansion layer, thermal expansion layer, 52a: expanded first thermal expansion layer, 53a: first binder, 53b. ..First thermal expansion fine particles, 54 ... second thermal expansion layer, thermal expansion layer, 54a ... expanded second thermal expansion layer, 55a. Second binder, 55b second thermal expansion fine particles, 56 third thermal expansion layer, thermal expansion layer, 56a expanded third thermal expansion layer, 57a third binder, 57b ... 3rd thermal expansion fine particles, 100 ... sheet, 110 ... heat conversion layer, 120 ... modeled object, 201, 202, 203 ... layer, D ... thickness

Claims (6)

第１主面と前記第１主面の反対側の第２主面とを有する基材と、
熱膨張微粒子を含み前記第１主面の上に積層された、Ｎ（Ｎは２以上の整数）層の熱膨張層と、を備え、
Ｍ（Ｍは２以上Ｎ以下の整数）層目の前記熱膨張層に含まれる前記熱膨張微粒子の平均粒径は、Ｍ−１層目の前記熱膨張層に含まれる前記熱膨張微粒子の平均粒径よりも大きい、
成形シート。 A base material having a first main surface and a second main surface opposite to the first main surface;
An N (N is an integer of 2 or more) thermal expansion layer laminated on the first main surface and including thermal expansion fine particles,
The average particle diameter of the thermally expanded fine particles contained in the M (M is an integer of 2 or more and N or less) layer is the average of the thermally expanded particles contained in the M-1 layer. Larger than the particle size,
Molded sheet. 前記Ｎ層の熱膨張層は、前記第１主面の上に所定のパターンで積層されている、
請求項１に記載の成形シート。 The thermal expansion layer of the N layer is laminated in a predetermined pattern on the first main surface,
The molded sheet according to claim 1. 基材の第１主面の上に、バインダと熱膨張微粒子とを含む、Ｎ層（Ｎは２以上の整数）の熱膨張層を備えた成形シートの製造方法であって、
前記第１主面の上に、１層目の前記熱膨張層を積層する第１熱膨張層形成工程と、
前記１層目の熱膨張層の上に、Ｎ−１層の前記熱膨張層を積層する積層工程と、を含み、
Ｍ（Ｍは２以上Ｎ以下の整数）層目の前記熱膨張層に含まれる前記熱膨張微粒子の平均粒径は、Ｍ−１層目の前記熱膨張層に含まれる前記熱膨張微粒子の平均粒径よりも大きい、
成形シートの製造方法。 A method for producing a molded sheet comprising a thermal expansion layer of N layers (N is an integer of 2 or more), comprising a binder and thermal expansion fine particles, on a first main surface of a base material,
A first thermal expansion layer forming step of laminating the first thermal expansion layer on the first main surface;
A laminating step of laminating the N-1 layers of the thermal expansion layer on the first thermal expansion layer,
The average particle diameter of the thermally expanded fine particles contained in the M (M is an integer of 2 or more and N or less) layer is the average of the thermally expanded particles contained in the M-1 layer. Larger than the particle size,
Manufacturing method of molded sheet. 前記第１熱膨張層形成工程では、オフセット印刷により、前記バインダと、該バインダの厚さの３倍以下の平均粒子径を有する前記熱膨張微粒子を転写する、
請求項３に記載の成形シートの製造方法。 In the first thermal expansion layer forming step, the binder and the thermally expandable fine particles having an average particle diameter of three times or less the thickness of the binder are transferred by offset printing.
A method for producing a molded sheet according to claim 3. 第１主面と前記第１主面の反対側の第２主面とを有する基材と、
膨張した熱膨張微粒子を含み前記第１主面の上に積層されたＮ（Ｎは２以上の整数）層の膨張した熱膨張層を有する造形物と、を備え、
Ｍ（Ｍは２以上Ｎ以下の整数）層目の前記膨張した熱膨張層に含まれる前記膨張した熱膨張微粒子の平均粒径は、Ｍ−１層目の前記膨張した熱膨張層に含まれる前記膨張した熱膨張微粒子の平均粒径よりも大きい、
シート。 A base material having a first main surface and a second main surface opposite to the first main surface;
A shaped object having expanded thermal expansion layers of N (N is an integer of 2 or more) layers including expanded thermal expansion fine particles and laminated on the first main surface;
The average particle diameter of the expanded thermal expansion fine particles contained in the expanded thermal expansion layer of the M-th (M is an integer of 2 to N) layer is included in the expanded thermal expansion layer of the (M-1) -th layer. Larger than the average particle size of the expanded thermally expanded fine particles,
Sheet. 第１主面と前記第１主面の反対側の第２主面とを有する基材と、熱膨張微粒子を含み前記第１主面の上に積層された、Ｎ（Ｎは２以上の整数）層の熱膨張層と、を備え、Ｍ（Ｍは２以上Ｎ以下の整数）層目の前記熱膨張層に含まれる前記熱膨張微粒子の平均粒径は、Ｍ−１層目の前記熱膨張層に含まれる前記熱膨張微粒子の平均粒径よりも大きい、成形シートを準備する準備工程と、
前記成形シートの前記第２主面と前記Ｎ層の熱膨張層の一方の上に、電磁波を熱に変換する熱変換層を積層する熱変換層積層工程と、
前記熱変換層に前記電磁波を照射して前記熱変換層に熱を発生させることによって、前記Ｎ層の熱膨張層を加熱して、前記Ｎ層の熱膨張層を膨張させ、造形物を形成する膨張工程と、を含む、
シートの製造方法。 A base material having a first main surface and a second main surface opposite to the first main surface; and N (where N is an integer of 2 or more) laminated on the first main surface including the thermally expandable fine particles. ) Layer, and the average particle diameter of the thermally expandable fine particles contained in the M (M is an integer of 2 or more and N or less) layer is the thermal expansion layer of the M-1 layer. A preparation step of preparing a molded sheet, which is larger than the average particle diameter of the thermally expanded fine particles contained in the expansion layer,
A heat conversion layer stacking step of stacking a heat conversion layer that converts electromagnetic waves into heat on one of the second main surface of the molded sheet and the thermal expansion layer of the N layer;
By irradiating the electromagnetic wave to the heat conversion layer to generate heat in the heat conversion layer, the thermal expansion layer of the N layer is heated, and the thermal expansion layer of the N layer is expanded to form a molded article. Expanding step;
Sheet manufacturing method.
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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63120180A (en) * 1986-11-10 1988-05-24 Bando Chem Ind Ltd Production of synthetic leather having anisotropic foamed structure

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63120180A (en) * 1986-11-10 1988-05-24 Bando Chem Ind Ltd Production of synthetic leather having anisotropic foamed structure

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