JP2020043537A - オンチップアンテナ - Google Patents
オンチップアンテナ Download PDFInfo
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- JP2020043537A JP2020043537A JP2018171546A JP2018171546A JP2020043537A JP 2020043537 A JP2020043537 A JP 2020043537A JP 2018171546 A JP2018171546 A JP 2018171546A JP 2018171546 A JP2018171546 A JP 2018171546A JP 2020043537 A JP2020043537 A JP 2020043537A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
- H01Q21/061—Two dimensional planar arrays
- H01Q21/065—Patch antenna array
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- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
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- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5227—Inductive arrangements or effects of, or between, wiring layers
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- H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
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- H01Q19/104—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using reflecting surfaces using a substantially flat reflector for deflecting the radiated beam, e.g. periscopic antennas
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Abstract
Description
0.比較例
1.第1の実施の形態(図1〜図7)
1.1 第1の実施の形態に係るオンチップアンテナの説明
1.2 オンチップアンテナのプリント基板への接続例
1.3 第1の実施の形態の変形例
2.第2の実施の形態(図8〜図9)
2.1 第2の実施の形態に係るオンチップアンテナの説明
2.2 第2の実施の形態の変形例
5G(第5世代移動通信システム)では、従来よりも高い24.25GHzから86GHzまでの周波数帯域の中から、国際標準で利用可能なバンドの選択が検討されている。これは、無線通信に連続した広い帯域を確保するためであり、より高速データ、多端末、および低遅延の通信を目指すことからして、必然的な動向といえる。さらにBeyond5G(5Gの次世代通信)では、この動向は強まると予想され、総務省のプロジェクトにおいてテラヘルツ帯の利用検討が進められている。
[1.1 第1の実施の形態に係るオンチップアンテナの説明]
(オンチップアンテナの構成例)
図1は、本発明の第1の実施の形態に係るオンチップアンテナ1の断面構成例を示している。
アクティブ面11のRF回路52およびBB信号処理回路53により生成され、増幅された高周波送信信号は、第2のカプラCPL2に伝達される。さらに、高周波送信信号は、アクティブ面11の第2のカプラCPL2と裏面12の上の第1のカプラCPL1とが形成する電磁界結合の作用により、第1のカプラCPL1と貫通ビア41とを介してパッチアンテナエレメント21に伝達される。高周波送信信号は、パッチアンテナエレメント21と反射導体22とにより形成されるパッチアンテナにより、上部空間に放射される。
パッチアンテナエレメント21と反射導体22とにより形成されるパッチアンテナにより、上部空間より受信された高周波受信信号は、アクティブ面11の第2のカプラCPL2と裏面12の上の第1のカプラCPL1とが形成する電磁界結合の作用により、アクティブ面11の第2のカプラCPL2に伝達される。さらに、高周波受信信号は、アクティブ面11において、第2のカプラCPL2からRF回路52に伝達され、RF回路52およびBB信号処理回路53によって受信処理される。
第1の実施の形態に係るオンチップアンテナ1によれば、第1のカプラCPL1と第2のカプラCPL2との間をシリコン貫通ビアを介して接続して給電する場合に比べて、シリコン貫通ビアによる導体損失を抑制することが可能となる。また、第1の実施の形態に係るオンチップアンテナ1によれば、パッチアンテナエレメント21への給電にシリコン貫通ビアを用いることなく、コスト改善が可能となる。
図4は、第1の実施の形態に係るオンチップアンテナ1をプリント基板60へ接続した構成例を示している。
(第1の変形例)
図5は、第1の実施の形態の第1の変形例に係るオンチップアンテナ1Aの断面構成例を示している。
図6は、第1の実施の形態の第2の変形例に係るオンチップアンテナ1Bの断面構成例を示している。
図7は、第1の実施の形態の第3の変形例に係るオンチップアンテナ1Cの断面構成例を示している。
第1の実施の形態の各変形例に係るオンチップアンテナを、第1の実施の形態に係るオンチップアンテナ1と同様にして、プリント基板60(図4)に実装してもよい。これらの場合、図4に示すワイヤボンド65は無くてもよい。
次に、本発明の第2の実施の形態に係るオンチップアンテナについて説明する。なお、以下では、上記第1の実施の形態に係るオンチップアンテナの構成要素と略同じ部分については、同一符号を付し、適宜説明を省略する。
図8は、本発明の第2の実施の形態に係るオンチップアンテナ2の断面構成例を示している。
図9は、第2の実施の形態の一変形例に係るオンチップアンテナ2Aの断面構成例を示している。
第2の実施の形態に係るオンチップアンテナ2およびその変形例に係るオンチップアンテナ2Aを、第1の実施の形態に係るオンチップアンテナ1と同様にして、プリント基板60(図4)に実装してもよい。オンチップアンテナ2Aをプリント基板60に実装する場合には、図4に示すワイヤボンド65は無くてもよい。
Claims (8)
- 半導体で構成され、互いに対向するように配置されたアクティブ面および裏面と、前記アクティブ面に形成された半導体回路とを有する集積回路チップと、
前記アクティブ面の側を下方向とし、前記裏面の側を上方向としたときに、前記裏面よりも上側に配置された反射導体と、
前記裏面と前記反射導体との間に配置された少なくとも1つの第1のカプラと、
前記反射導体よりも上側に配置された少なくとも1つのパッチアンテナエレメントと、
前記パッチアンテナエレメントと前記第1のカプラとを接続する接続部と、
前記半導体回路に導通するように前記アクティブ面に形成され、前記第1のカプラと非接触で対向配置された少なくとも1つの第2のカプラと
を備える
オンチップアンテナ。 - 前記裏面と前記反射導体との間に配置された第1の誘電体層、をさらに備える
請求項1に記載のオンチップアンテナ。 - 前記反射導体と前記パッチアンテナエレメントとの間に配置された第2の誘電体層、をさらに備える
請求項2に記載のオンチップアンテナ。 - 前記アクティブ面に形成され、基準電位に接続される基準導体、をさらに備える
請求項1ないし3のいずれか1つに記載のオンチップアンテナ。 - 前記反射導体と前記基準導体とを接続する貫通ビア、をさらに備える
請求項4に記載のオンチップアンテナ。 - 前記パッチアンテナエレメント、前記第1のカプラ、および前記第2のカプラをそれぞれ複数備え、
前記基準導体は、前記アクティブ面において、少なくとも、複数の前記第2のカプラの隣接するもの同士の間に形成され、
前記貫通ビアは、複数の前記第1のカプラの隣接するもの同士の間を通り、複数の前記第2のカプラの隣接するもの同士の間に形成された前記基準導体に接続されている
請求項5に記載のオンチップアンテナ。 - 接合部材、をさらに備え、
前記パッチアンテナエレメント、前記反射導体、前記第1のカプラ、前記第1の誘電体層および前記第2の誘電体層を含むアンテナモジュールが形成され、
前記アンテナモジュールが前記裏面に対して離間して対向配置されると共に、前記アンテナモジュールが前記接合部材によって前記集積回路チップの前記裏面に接合されている
請求項3に記載のオンチップアンテナ。 - 前記アクティブ面に形成され、基準電位に接続される基準導体と、
前記アンテナモジュールに形成され、前記第1の誘電体層を貫通し、一端が前記反射導体に接続された第1の貫通ビアと、
前記集積回路チップに形成され、一端が前記基準導体に接続された第2の貫通ビアと
をさらに備え、
前記接合部材は導電材料で構成され、
前記第1の貫通ビアの他端と前記第2の貫通ビアの他端とが前記接合部材に接続されることにより、前記反射導体と前記基準導体とが導通されている
請求項7に記載のオンチップアンテナ。
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