JP2020041008A - 粘着シート - Google Patents
粘着シート Download PDFInfo
- Publication number
- JP2020041008A JP2020041008A JP2018166994A JP2018166994A JP2020041008A JP 2020041008 A JP2020041008 A JP 2020041008A JP 2018166994 A JP2018166994 A JP 2018166994A JP 2018166994 A JP2018166994 A JP 2018166994A JP 2020041008 A JP2020041008 A JP 2020041008A
- Authority
- JP
- Japan
- Prior art keywords
- pressure
- sensitive adhesive
- adhesive layer
- adhesive sheet
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 60
- 239000000853 adhesive Substances 0.000 title claims abstract description 59
- 239000000758 substrate Substances 0.000 claims abstract description 93
- 238000000227 grinding Methods 0.000 claims abstract description 44
- 238000007373 indentation Methods 0.000 claims abstract description 29
- 239000012790 adhesive layer Substances 0.000 claims abstract description 25
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 290
- 239000010410 layer Substances 0.000 claims description 161
- 229920005989 resin Polymers 0.000 claims description 65
- 239000011347 resin Substances 0.000 claims description 65
- 238000004519 manufacturing process Methods 0.000 claims description 44
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Natural products C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 41
- 238000000034 method Methods 0.000 claims description 40
- 239000000463 material Substances 0.000 claims description 34
- 229920005601 base polymer Polymers 0.000 claims description 26
- 229920001971 elastomer Polymers 0.000 claims description 22
- 239000000806 elastomer Substances 0.000 claims description 20
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 10
- 229910052710 silicon Inorganic materials 0.000 claims description 10
- 229920002725 thermoplastic elastomer Polymers 0.000 claims description 10
- 239000010703 silicon Substances 0.000 claims description 9
- 230000007613 environmental effect Effects 0.000 claims description 8
- 238000012545 processing Methods 0.000 claims description 8
- 239000005038 ethylene vinyl acetate Substances 0.000 claims description 7
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims description 7
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 5
- 125000003011 styrenyl group Chemical group [H]\C(*)=C(/[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 claims description 5
- -1 2-ethylhexyl Chemical group 0.000 description 78
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 63
- 239000000126 substance Substances 0.000 description 45
- 239000004094 surface-active agent Substances 0.000 description 45
- 239000011342 resin composition Substances 0.000 description 40
- 229920000103 Expandable microsphere Polymers 0.000 description 37
- 239000003431 cross linking reagent Substances 0.000 description 29
- 239000000178 monomer Substances 0.000 description 29
- 125000000217 alkyl group Chemical group 0.000 description 25
- 238000011156 evaluation Methods 0.000 description 21
- 239000002585 base Substances 0.000 description 19
- 150000003505 terpenes Chemical class 0.000 description 17
- 235000007586 terpenes Nutrition 0.000 description 17
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 16
- 229910052799 carbon Inorganic materials 0.000 description 16
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 16
- 239000000523 sample Substances 0.000 description 16
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 15
- 235000014113 dietary fatty acids Nutrition 0.000 description 15
- 239000000194 fatty acid Substances 0.000 description 15
- 229930195729 fatty acid Natural products 0.000 description 15
- 238000010438 heat treatment Methods 0.000 description 15
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 14
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 13
- 239000010980 sapphire Substances 0.000 description 13
- 229910052594 sapphire Inorganic materials 0.000 description 13
- 239000004593 Epoxy Substances 0.000 description 12
- 229920001577 copolymer Polymers 0.000 description 12
- 239000004088 foaming agent Substances 0.000 description 11
- 238000002360 preparation method Methods 0.000 description 11
- 150000003839 salts Chemical class 0.000 description 11
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 10
- 239000002253 acid Substances 0.000 description 10
- 239000000654 additive Substances 0.000 description 10
- 239000002245 particle Substances 0.000 description 10
- 229920000139 polyethylene terephthalate Polymers 0.000 description 10
- 239000005020 polyethylene terephthalate Substances 0.000 description 10
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 9
- 239000005977 Ethylene Substances 0.000 description 9
- 238000001035 drying Methods 0.000 description 9
- 239000000203 mixture Substances 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 8
- 238000005187 foaming Methods 0.000 description 8
- 238000005259 measurement Methods 0.000 description 8
- 239000004745 nonwoven fabric Substances 0.000 description 8
- 235000011007 phosphoric acid Nutrition 0.000 description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 7
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 7
- 150000005215 alkyl ethers Chemical class 0.000 description 7
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 7
- 238000011049 filling Methods 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 229920000642 polymer Polymers 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- JREYOWJEWZVAOR-UHFFFAOYSA-N triazanium;[3-methylbut-3-enoxy(oxido)phosphoryl] phosphate Chemical compound [NH4+].[NH4+].[NH4+].CC(=C)CCOP([O-])(=O)OP([O-])([O-])=O JREYOWJEWZVAOR-UHFFFAOYSA-N 0.000 description 7
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 6
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 6
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 6
- 230000000996 additive effect Effects 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 239000007789 gas Substances 0.000 description 6
- KZNICNPSHKQLFF-UHFFFAOYSA-N succinimide Chemical compound O=C1CCC(=O)N1 KZNICNPSHKQLFF-UHFFFAOYSA-N 0.000 description 6
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 6
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 6
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 6
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 5
- 239000004925 Acrylic resin Substances 0.000 description 5
- 229920000178 Acrylic resin Polymers 0.000 description 5
- 229910019142 PO4 Inorganic materials 0.000 description 5
- 239000003963 antioxidant agent Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 230000001747 exhibiting effect Effects 0.000 description 5
- 150000004665 fatty acids Chemical class 0.000 description 5
- 239000006260 foam Substances 0.000 description 5
- 230000005484 gravity Effects 0.000 description 5
- 239000002736 nonionic surfactant Substances 0.000 description 5
- 235000021317 phosphate Nutrition 0.000 description 5
- 238000003825 pressing Methods 0.000 description 5
- 229920001935 styrene-ethylene-butadiene-styrene Polymers 0.000 description 5
- 150000003440 styrenes Chemical class 0.000 description 5
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 4
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 4
- 239000013032 Hydrocarbon resin Substances 0.000 description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 4
- FLIACVVOZYBSBS-UHFFFAOYSA-N Methyl palmitate Chemical compound CCCCCCCCCCCCCCCC(=O)OC FLIACVVOZYBSBS-UHFFFAOYSA-N 0.000 description 4
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 4
- 239000003945 anionic surfactant Substances 0.000 description 4
- 230000003078 antioxidant effect Effects 0.000 description 4
- CADWTSSKOVRVJC-UHFFFAOYSA-N benzyl(dimethyl)azanium;chloride Chemical compound [Cl-].C[NH+](C)CC1=CC=CC=C1 CADWTSSKOVRVJC-UHFFFAOYSA-N 0.000 description 4
- 229920001400 block copolymer Polymers 0.000 description 4
- 239000003093 cationic surfactant Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 239000010432 diamond Substances 0.000 description 4
- 229910003460 diamond Inorganic materials 0.000 description 4
- ILRSCQWREDREME-UHFFFAOYSA-N dodecanamide Chemical compound CCCCCCCCCCCC(N)=O ILRSCQWREDREME-UHFFFAOYSA-N 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 4
- 239000011888 foil Substances 0.000 description 4
- 229920006270 hydrocarbon resin Polymers 0.000 description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 4
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 4
- 239000011976 maleic acid Substances 0.000 description 4
- LYRFLYHAGKPMFH-UHFFFAOYSA-N octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(N)=O LYRFLYHAGKPMFH-UHFFFAOYSA-N 0.000 description 4
- 239000010452 phosphate Substances 0.000 description 4
- 239000004014 plasticizer Substances 0.000 description 4
- 229920000098 polyolefin Polymers 0.000 description 4
- 229920000346 polystyrene-polyisoprene block-polystyrene Polymers 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 229920006132 styrene block copolymer Polymers 0.000 description 4
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 description 4
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 3
- 125000002723 alicyclic group Chemical group 0.000 description 3
- 229960000686 benzalkonium chloride Drugs 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 229920006026 co-polymeric resin Polymers 0.000 description 3
- AFABGHUZZDYHJO-UHFFFAOYSA-N dimethyl butane Natural products CCCC(C)C AFABGHUZZDYHJO-UHFFFAOYSA-N 0.000 description 3
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 239000004005 microsphere Substances 0.000 description 3
- 239000000123 paper Substances 0.000 description 3
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 3
- 239000003208 petroleum Substances 0.000 description 3
- 229920002647 polyamide Polymers 0.000 description 3
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- 229920001223 polyethylene glycol Polymers 0.000 description 3
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- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 3
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 3
- 229960002317 succinimide Drugs 0.000 description 3
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- 239000000057 synthetic resin Substances 0.000 description 3
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- QMMJWQMCMRUYTG-UHFFFAOYSA-N 1,2,4,5-tetrachloro-3-(trifluoromethyl)benzene Chemical compound FC(F)(F)C1=C(Cl)C(Cl)=CC(Cl)=C1Cl QMMJWQMCMRUYTG-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 2
- FALRKNHUBBKYCC-UHFFFAOYSA-N 2-(chloromethyl)pyridine-3-carbonitrile Chemical compound ClCC1=NC=CC=C1C#N FALRKNHUBBKYCC-UHFFFAOYSA-N 0.000 description 2
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 description 2
- MPNXSZJPSVBLHP-UHFFFAOYSA-N 2-chloro-n-phenylpyridine-3-carboxamide Chemical compound ClC1=NC=CC=C1C(=O)NC1=CC=CC=C1 MPNXSZJPSVBLHP-UHFFFAOYSA-N 0.000 description 2
- KANZWHBYRHQMKZ-UHFFFAOYSA-N 2-ethenylpyrazine Chemical compound C=CC1=CN=CC=N1 KANZWHBYRHQMKZ-UHFFFAOYSA-N 0.000 description 2
- CYUZOYPRAQASLN-UHFFFAOYSA-N 3-prop-2-enoyloxypropanoic acid Chemical compound OC(=O)CCOC(=O)C=C CYUZOYPRAQASLN-UHFFFAOYSA-N 0.000 description 2
- HIQIXEFWDLTDED-UHFFFAOYSA-N 4-hydroxy-1-piperidin-4-ylpyrrolidin-2-one Chemical compound O=C1CC(O)CN1C1CCNCC1 HIQIXEFWDLTDED-UHFFFAOYSA-N 0.000 description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 2
- ATRRKUHOCOJYRX-UHFFFAOYSA-N Ammonium bicarbonate Chemical compound [NH4+].OC([O-])=O ATRRKUHOCOJYRX-UHFFFAOYSA-N 0.000 description 2
- 239000004156 Azodicarbonamide Substances 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- NDKYEUQMPZIGFN-UHFFFAOYSA-N Butyl dodecanoate Chemical compound CCCCCCCCCCCC(=O)OCCCC NDKYEUQMPZIGFN-UHFFFAOYSA-N 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 2
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- HPEUJPJOZXNMSJ-UHFFFAOYSA-N Methyl stearate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OC HPEUJPJOZXNMSJ-UHFFFAOYSA-N 0.000 description 2
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- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 2
- WQDUMFSSJAZKTM-UHFFFAOYSA-N Sodium methoxide Chemical compound [Na+].[O-]C WQDUMFSSJAZKTM-UHFFFAOYSA-N 0.000 description 2
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 2
- 239000006061 abrasive grain Substances 0.000 description 2
- 150000003926 acrylamides Chemical class 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 229910052783 alkali metal Inorganic materials 0.000 description 2
- 150000001340 alkali metals Chemical class 0.000 description 2
- 125000005037 alkyl phenyl group Chemical group 0.000 description 2
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 2
- 239000001099 ammonium carbonate Substances 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
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- XOZUGNYVDXMRKW-AATRIKPKSA-N azodicarbonamide Chemical compound NC(=O)\N=N\C(N)=O XOZUGNYVDXMRKW-AATRIKPKSA-N 0.000 description 2
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- 229910052788 barium Inorganic materials 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- JMGZBMRVDHKMKB-UHFFFAOYSA-L disodium;2-sulfobutanedioate Chemical compound [Na+].[Na+].OS(=O)(=O)C(C([O-])=O)CC([O-])=O JMGZBMRVDHKMKB-UHFFFAOYSA-L 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000005489 elastic deformation Effects 0.000 description 2
- RGXWDWUGBIJHDO-UHFFFAOYSA-N ethyl decanoate Chemical compound CCCCCCCCCC(=O)OCC RGXWDWUGBIJHDO-UHFFFAOYSA-N 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000001530 fumaric acid Substances 0.000 description 2
- HSEMFIZWXHQJAE-UHFFFAOYSA-N hexadecanamide Chemical compound CCCCCCCCCCCCCCCC(N)=O HSEMFIZWXHQJAE-UHFFFAOYSA-N 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- NNPPMTNAJDCUHE-UHFFFAOYSA-N isobutane Chemical compound CC(C)C NNPPMTNAJDCUHE-UHFFFAOYSA-N 0.000 description 2
- 239000012948 isocyanate Substances 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- QWTDNUCVQCZILF-UHFFFAOYSA-N isopentane Chemical compound CCC(C)C QWTDNUCVQCZILF-UHFFFAOYSA-N 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical class CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- QSQLTHHMFHEFIY-UHFFFAOYSA-N methyl behenate Chemical compound CCCCCCCCCCCCCCCCCCCCCC(=O)OC QSQLTHHMFHEFIY-UHFFFAOYSA-N 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- ZAZKJZBWRNNLDS-UHFFFAOYSA-N methyl tetradecanoate Chemical compound CCCCCCCCCCCCCC(=O)OC ZAZKJZBWRNNLDS-UHFFFAOYSA-N 0.000 description 2
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 2
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- CYRMSUTZVYGINF-UHFFFAOYSA-N trichlorofluoromethane Chemical compound FC(Cl)(Cl)Cl CYRMSUTZVYGINF-UHFFFAOYSA-N 0.000 description 1
- 229940029284 trichlorofluoromethane Drugs 0.000 description 1
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- 239000002888 zwitterionic surfactant Substances 0.000 description 1
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Abstract
Description
logH≧1.9385×loghA+4.2611 ・・・(1)
1つの実施形態においては、上記粘着シートの粘着面をシリコンチップに貼着した場合の25℃の環境温度下におけるせん断接着強度が、1.0MPa以上である。
1つの実施形態においては、上記粘着シートの粘着面をSUS304BAに貼着した際の80℃の環境温度下における引き剥がし粘着力が、15N/20mm以下である。
1つの実施形態においては、上記粘着剤層の25℃における押し込み硬度Hが、10MPa〜1GPaである。
1つの実施形態においては、上記粘着剤層が、ベースポリマーを含む粘着剤から構成され、該ベースポリマーが、熱可塑性エラストマーである。
1つの実施形態においては、上記熱可塑性エラストマーが、スチレン系エラストマーまたはエチレン−酢酸ビニル系エラストマーである。
1つの実施形態においては、上記粘着剤が、粘着付与樹脂をさらに含む。
1つの実施形態においては、上記粘着付与樹脂の含有量が、前記ベースポリマー100重量部に対して、1重量部〜350重量部である。
1つの実施形態においては、上記粘着剤層の少なくとも片側に配置された基材をさらに備える。
1つの実施形態においては、上記粘着剤層の少なくとも片側に配置された別の粘着剤層をさらに備える。
1つの実施形態においては、上記基材の25℃における引っ張り弾性率が、1×107Pa〜1×1010Paである。
1つの実施形態においては、上記粘着シートは、半導体製造工程における基板加工時の仮固定材として用いられる。
本発明の別の局面によれば、基板の研削方法が提供される。この基板の研削方法は、粘着剤層を備える粘着シートの該粘着剤層上に基板を載置し、固定した後、該基板の粘着剤層側とは反対側の面を研削することを含み、該粘着剤層の厚みが、1μm〜300μmであり、該粘着剤層の25℃における押し込み硬度H(Pa)と、粘着剤層の厚みhA(μm)とが、下記式(1)の関係を満たす。
本発明のさらに別の局面によれば、基板の製造方法が提供される。この基板の製造方法は、粘着剤層を備える粘着シートの該粘着剤層上に基板を載置し、固定した後、該基板の粘着剤層側とは反対側の面を研削する研削工程を含み、該粘着剤層の厚みが、1μm〜300μmであり、該粘着剤層の25℃における押し込み硬度H(Pa)と、粘着剤層の厚みhA(μm)とが、下記式(1)の関係を満たす。
図1(a)は、本発明の1つの実施形態による粘着シートの概略断面図である。粘着シート100は、粘着剤層10を備える。本発明の粘着シートは、粘着剤層10のみから構成されていてもよく、該粘着剤層の他に任意の適切な層をさらに備えていてもよい。
logH≧1.9385×loghA+4.2611 ・・・(1)
1.9385×loghA+9≧logH ・・・・(2)
1.9385×loghA+7≧logH ・・・・(2)’
押し込み硬度Hと厚みhAとが上記関係を満たしていれば、剥離性により優れる粘着シートを得ることができる。
上記粘着剤層は、粘着性を付与するための粘着剤を含む。
上記粘着剤層を構成する粘着剤としては、本発明の効果が得られる限りにおいて、任意の適切な粘着剤が用いられ得る。上記粘着剤としては、例えば、熱可塑性エラストマー、アクリル系樹脂、シリコーン系樹脂、ビニルアルキルエーテル系樹脂、ポリステル系樹脂、ポリアミド系樹脂、ウレタン系樹脂、フッ素化樹脂等をベースポリマー(粘着性樹脂)として含む粘着剤が挙げられる。好ましくは、上記粘着剤は、ベースポリマーとして熱可塑性樹脂を含む。熱可塑性樹脂を用いれば、上記関係式(1)を満たす粘着剤層を有し、かつ、加熱により優れた剥離性を発現し得る粘着シートを容易に得ることができる。好ましくは、ベースポリマーとしてアクリル系樹脂または熱可塑性エラストマーを含む粘着剤が用いられ、熱可塑性エラストマーがより好ましく用いられる。熱可塑性エラストマーとしては、スチレン系エラストマーまたはエチレン−酢酸ビニル系エラストマーが好ましく用いられ、スチレン系エラストマーがより好ましく用いられる。例えば、スチレン系エラストマーを用いれば、スチレンユニット比率の調整により、上記接着性および押し込み硬度Hを容易に制御することができる。
<体積充填率測定方法>
i)加熱前の粘着シートの粘着剤層を上に向けた状態で試料をホルダーに固定し、X線CTにより0〜180°に対し1601枚の連続透過像を撮影する。X線CTはZEISS, Xradia 520 Versaを用いて、管電圧40kV、管電流73μA、ピクセルサイズ0.3μm/Pixelで測定する。
ii)得られた全透過像を元に再構成を行って断層像を作成し、解析ソフトImageJ.を用いて三次元再構成像(TIFスタック像)と再構成断面像(3面図)を作成する。
iii) 得られた三次元再構成像(TIFスタック像)について画像処理を施し、熱膨張性微小球の識別を行う。識別結果より、厚さ方向における体積充填率、個々の発泡体の体積、および球相当直径を算出する。
なお、各試料の粘着剤層厚さはSEM断面観察により測定し、充填率は気泡部分を除いた値を総体積として算出する。
上記基材としては、例えば、樹脂シート、不織布、紙、金属箔、織布、ゴムシート、発泡シート、これらの積層体(特に、樹脂シートを含む積層体)等が挙げられる。樹脂シートを構成する樹脂としては、例えば、ポリエチレンテレフタレート(PET)、ポリエチレンナフタレート(PEN)、ポリブチレンテレフタレート(PBT)、ポリエチレン(PE)、ポリプロピレン(PP)、エチレン−プロピレン共重合体、エチレン−酢酸ビニル共重合体(EVA)、ポリアミド(ナイロン)、全芳香族ポリアミド(アラミド)、ポリイミド(PI)、ポリ塩化ビニル(PVC)、ポリフェニレンサルファイド(PPS)、フッ素系樹脂、ポリエーテルエーテルケトン(PEEK)等が挙げられる。不織布としては、マニラ麻を含む不織布等の耐熱性を有する天然繊維による不織布;ポリプロピレン樹脂不織布、ポリエチレン樹脂不織布、エステル系樹脂不織布等の合成樹脂不織布等が挙げられる。金属箔としては、銅箔、ステンレス箔、アルミニウム箔等が挙げられる。紙としては、和紙、クラフト紙等が挙げられる。上記基材は、単層であってもよく、多層であってもよい。上記基材が多層である場合、各層の構成は同じであってもよく、異なっていてもよい。
上記別の粘着剤層としては、任意の適切な粘着剤層が形成され得る。別の粘着剤層を形成する粘着剤としては、例えば、ゴム系粘着剤、アクリル系粘着剤、ビニルアルキルエーテル系粘着剤、シリコーン系粘着剤、ポリエステル系粘着剤、ポリアミド系粘着剤、ウレタン系粘着剤、フッ素系粘着剤、スチレン−ジエンブロック共重合体系粘着剤等が挙げられる。粘着剤には、例えば、可塑剤、充填剤、界面活性剤、老化防止剤、粘着性付与剤などの公知乃至慣用の添加剤が配合されていてもよい。
本発明の粘着シートは、弾性層をさらに備えていてもよい。弾性層は、粘着剤層の片面に配置され得る。粘着シートが基材を備える場合、弾性層は、粘着剤層と基材との間に配置され得る。弾性層を備えることにより、被着体に対する追従性が向上する。
本発明の粘着シートは、必要に応じて、セパレータをさらに備え得る。該セパレータは少なくとも一方の面が剥離面となっており、上記粘着剤層を保護するために設けられ得る。セパレータは、任意の適切な材料から構成され得る。
本発明の粘着シートは、任意の適切な方法により製造することができる。本発明の粘着シートは、例えば、基材(基材を含まない粘着シート得る場合には、任意の適切な基体)上に直接、粘着剤を含む組成物を塗工する方法、または任意の適切な基体上に粘着剤を含む組成物を塗工し形成された塗工層を基材に転写する方法等が挙げられる。粘着剤を含む組成物は、任意の適切な溶媒を含み得る。
下記の評価方法において、粘着剤層(および別の粘着剤層)の貼着は、貼着面に積層されたセパレータを剥離した後に行った。
(1)せん断接着強度
実施例および比較例で得られた粘着シート(サイズ:20mm×20mm)を、粘着剤層とは反対側の面を所定の土台(例えば、20mm×20mmシリコンチップ)に貼り付けて固定し、該粘着シートの粘着剤層表面に5mm×5mmシリコンチップ配置し、該シリコンチップをヒートプレス機により、100℃、0.1MPaの貼り合わせ条件で、1分間熱圧着して評価用サンプルを作製した。なお、別の粘着剤層を備えない粘着シートの土台への固定は、日東電工株式会社製の両面テープNo.585を用いた。
当該評価用サンプルについて、25℃の環境温度下で、Nordson社製dage4000を用い、貼り付け面からの高さ50μm位置で5mm×5mmシリコンチップの側面に測定端子をセットし、せん断速度500μm/sec.でチップと水平方向に外力を印加することで得られる荷重−変位曲線から、最大破壊荷重を読み取り、これを25℃環境温度下におけるせん断接着強度とした。
また、80℃の環境温度下で、上記同様にせん断接着強度を測定した。
表1には、それぞれ3回測定の平均値を示す。
(2)押し込み硬度
実施例および比較例で得られた粘着シートの粘着剤層表面に、ダイヤモンド製のBerkovich型(三角錐型)探針を垂直に押し当てることで得られる変位−荷重ヒステリシス曲線を、測定装置付帯のソフトウェア(triboscan)で数値処理して、押し込み硬度Hを測定した。押し込み硬度Hは、ナノインデンター(Hysitron Inc社製Triboindenter TI−950)を用いて、25℃における単一押し込み法により、押し込み速度約500nm/sec、押し込み深さ約3000nmの測定条件で、測定した。
また、押し込み硬度Hから、1.9385×loghA+4.2611で計算される値を算出した。
(3)サファイア研削性
実施例および比較例で得られた粘着シートの粘着剤層上に厚み900μm、4インチサイズのサファイアウエハを配置した後、これらを予め90℃に予熱しておいたヒートプレス機で、1.0MPaの圧力で5分間圧着した。サファイアウエハが固定された粘着シートを株式会社ディスコ製のグラインダー装置DFG8540にセットし、ウエハ厚みが120μmとなるまで研削した。研削性は以下の基準に基づいて評価した。
〇:ウエハ厚みが120μmとなるまで裏面研削が可能。
×:ウエハ厚みが120μmになる前にウエハが割れる、もしくはウエハ端部が欠ける。(裏面研削が不可能)
(4)剥離性
下記(5)における粘着シートの80℃における引き剥がし粘着力評価後の被着体SUS304BAを目視で観察した。剥離性は以下の基準に基づいて評価した。
〇:SUS304BA上に凝集破壊した粘着剤の残留物がなく、貼り付け跡もない。
△:SUS304BA上に凝集破壊した粘着剤の残留物はないが、貼り付け跡は確認できる。
×:SUS304BA上に凝集破壊した粘着剤の残留物が確認できる。
(5)80℃における引き剥がし粘着力
実施例および比較例で得られた粘着シートを20mm幅にカットし、該粘着シートの粘着面(粘着剤層面)をSUS304BAにハンドローラーで貼り付けて積層体を形成した。次いで、該積層体を予め80℃に予熱しておいたヒートプレス機で0.3MPaの圧力で1分間圧着してサンプルを作製した。該サンプルについて、SUS304BAから粘着シートを剥離角度180°、剥離速度300mm/minの条件で引き剥がして粘着力を測定した。
該粘着シートが基材を有さない粘着シート(実施例28)である場合には、粘着剤層面とは反対側の面に日東電工株式会社製の粘着テープNo.315を貼り付けた後に、上記サンプルを作製して、引き剥がし粘着力を測定した。
(6)基材の引張弾性率
粘着シートに用いた基材(幅10mm)をサンプルとして、動的粘弾性測定装置(TA Instrument社製、商品名「RSA−3」)の25℃における引張弾性率を測定した。なお、チャック間距離は20mmとし、測定周波数は1Hzとし、初期歪みは0.05%とし、昇温速度は5℃/min(−20℃〜100℃)として測定した。
マレイン酸変性スチレン・エチレン・ブチレン・スチレンブロック共重合体(a)(SEBS:スチレン部位/エチレン・ブチレン部位(重量比)=20/80、酸価:10(mg−CH3ONa/g)、旭化成ケミカルズ社製、商品名「タフテックM1943」)100重量部と、テルペンフェノール系粘着付与樹脂(ヤスハラケミカルズ社製、商品名「YSポリスターT80」、軟化点:80℃)20重量部と、エポキシ系架橋剤(三菱ガス化学社製、商品名「TETRAD−C」)3重量部と、脂肪酸エステル系界面活性剤(花王社製、商品名「エキセパールIPP」、分子量:298.5、アルキル基の炭素数:16)3重量部と、溶媒としてのトルエンとを混合して、樹脂組成物(I)(混合物)を調製した。
マレイン酸変性スチレン・エチレン・ブチレン・スチレンブロック共重合体(b)(SEBS:スチレン部位/エチレン・ブチレン部位(重量比)=30/70、酸価:10(mg−CH3ONa/g)、旭化成ケミカルズ社製、商品名「タフテックM1913」)100重量部と、テルペンフェノール系粘着付与樹脂(ヤスハラケミカルズ社製、商品名「YSポリスターT80」)50重量部と、エポキシ系架橋剤(三菱ガス化学社製、商品名「TETRAD−C」)3重量部と、脂肪酸エステル系界面活性剤(花王社製、商品名「エキセパールIPP」、分子量:298.5、アルキル基の炭素数:16)3重量部と、溶媒としてのトルエンとを混合して、樹脂組成物(II−1)(混合物)を調製した。
脂肪酸エステル系界面活性剤(花王社製、商品名「エキセパールIPP」、分子量:298.5、アルキル基の炭素数:16)3重量部に代えて、表1に示す界面活性剤を表1に示す添加量で用いたこと以外は、製造例2−1と同様にして、樹脂組成物(II−2〜10)を調製した。なお、用いた界面活性剤は、以下のとおりである。
製造例2−2(樹脂組成物(II−2)):リン酸エステル系界面活性剤;東邦化学工業社製、商品名「フォスファノールRL210」、化学式:C22H47O5P、アルキル基の炭素数:18、分子量422.57
製造例2−3(樹脂組成物(II−3)):脂肪酸アミド系界面活性剤;東京化成工業社製、ステアリン酸アミド、化学式:C18H37NO、アルキル基の炭素数:18、分子量:283.49
製造例2−4(樹脂組成物(II−4)):脂肪酸アミド系界面活性剤;東京化成工業社製、ラウリル酸アミド、化学式:C12H25NO、アルキル基の炭素数:12、分子量:199.33
製造例2−5(樹脂組成物(II−5)):脂肪酸アミノアルキルアミド系界面活性剤;東邦化学工業社製、商品名「カチナールMAPS」、化学式:C23H38N2O、アルキル基の炭素数:18、分子量:358.56
製造例2−6(樹脂組成物(II−6)):塩化トリメチルアンモニウム系界面活性剤;東邦化学工業社製、商品名「カチナールSTC−70ET」、化学式:C21H46ClN、アルキル基の炭素数:16、分子量:348.04
製造例2−7(樹脂組成物(II−7)):塩化ジメチルベンジルアンモニウム系界面活性剤;三洋化成社製、商品名「カチオンS」、化学式:C26H48ClN、アルキル基の炭素数:18、分子量:410.11
製造例2−8(樹脂組成物(II−8)):コハク酸無水物系界面活性剤;三洋化成工業社製、商品名「DSA」、化学式:C16H26O3、アルキル基の炭素数:12、分子量:266.37
製造例2−9(樹脂組成物(II−9)):コハク酸無水物系界面活性剤;三洋化成工業社製、商品名「PDSA−DA」、化学式:C19H32O3、アルキル基の炭素数:15、分子量:308.45
製造例2−10(樹脂組成物(II−10)):スルホコハク酸ナトリウム系界面活性剤;三洋化成工業社製、商品名「サンセパラ100」、化学式:C20H27O7SNa、アルキル基の炭素数:6、分子量:434.48
テルペンフェノール系粘着付与樹脂(ヤスハラケミカルズ社製、商品名「YSポリスターT80」)に代えて、テルペンフェノール系粘着付与樹脂(ヤスハラケミカルズ社製、商品名「YSポリスターS145」、軟化点:145℃)を用いたこと以外は、製造例2と同様にして、樹脂組成物(III)を調製した。
スチレン・エチレン・ブチレン・スチレンブロック共重合体(c)(未酸変性品、旭化成ケミカルズ社製、商品名「タフテックH1043」)100重量部と、テルペンフェノール系粘着付与樹脂(ヤスハラケミカルズ社製、商品名「YSポリスターT80」)80重量部と、エポキシ系架橋剤(三菱ガス化学社製、商品名「TETRAD−C」)3重量部と、リン酸エステル系界面活性剤(東邦化学工業社製、商品名「フォスファノールRL210」、分子量422.57、アルキル基の炭素数:18)3重量部と、溶媒としてのトルエンとを混合して、樹脂組成物(IV)(混合物)を調製した。
テルペンフェノール系粘着付与樹脂(ヤスハラケミカルズ社製、商品名「YSポリスターT80」)の添加量を20重量部としたこと以外は、製造例4と同様にして樹脂組成物(V)を調製した。
テルペンフェノール系粘着付与樹脂(ヤスハラケミカルズ社製、商品名「YSポリスターT80」)の添加量を100重量部としたこと以外は、製造例2と同様にして樹脂組成物(VI)を調製した。
テルペンフェノール系粘着付与樹脂(ヤスハラケミカルズ社製、商品名「YSポリスターT80」)の添加量を125重量部としたこと以外は、製造例2と同様にして樹脂組成物(VII)を調製した。
テルペンフェノール系粘着付与樹脂(ヤスハラケミカルズ社製、商品名「YSポリスターT80」)の添加量を150重量部としたこと以外は、製造例2と同様にして樹脂組成物(VIII)を調製した。
テルペンフェノール系粘着付与樹脂(ヤスハラケミカルズ社製、商品名「YSポリスターT80」)の添加量を200重量部としたこと、および、熱膨張性微小球(松本油脂製薬社製、商品名「マツモトマイクロスフェアーF-50D」、発泡開始温度120℃、平均粒子径14μm)100重量部をさらに添加したこと以外は、製造例2と同様にして樹脂組成物(IX)を調製した。
アクリル系樹脂(アクリル酸ブチル−アクリル酸共重合体、アクリル酸ブチル:アクリル酸(重量比)=100:5)100重量部と、エポキシ系架橋剤(三菱ガス化学社製、商品名「TETRAD−C」)3重量部と、脂肪酸エステル系界面活性剤(花王社製、商品名「エキセパールIPP」、分子量:298.5、アルキル基の炭素数:16)1重量部と、溶媒としてのトルエンとを混合して、樹脂組成物(A)を調製した。この樹脂組成物(A)を、PET基材(厚さ:50μm)上に、乾燥後の厚さが3μmとなるように塗布し、乾燥して粘着剤層を形成した。さらに、粘着剤層上に、セパレータを貼り合わせて、PET基材/粘着剤層/セパレータの層構成を有する粘着シートを作製した。得られた粘着シートを上記評価(1)〜(5)に供した結果を表2に示す。
製造例1で調製した樹脂組成物(I)を、PET基材(厚さ:50μm)上に、乾燥後の厚さが15μmとなるように塗布し、乾燥して粘着剤層を形成した。さらに、粘着剤層上に、セパレータを貼り合わせて、PET基材/粘着剤層/セパレータの層構成を有する粘着シートを作製した。得られた粘着シートを上記評価(1)〜(5)に供した結果を表2に示す。
粘着剤層の厚みを20μmとしたこと以外は、実施例2と同様にして粘着シートを作製した。得られた粘着シートを上記評価(1)〜(5)に供した結果を表2に示す。
粘着剤層の厚みを25μmとしたこと以外は、実施例2と同様にして粘着シートを作製した。得られた粘着シートを上記評価(1)〜(5)に供した結果を表2に示す。
樹脂組成物(I)に代えて、表2に示す樹脂組成物(製造例2−1および製造例3〜5で調製した樹脂組成物(II−1)および(III)〜(V))を用い、粘着剤層の厚みを表2に示す厚みとしたこと以外は、実施例2と同様にして、粘着シートを作製した。得られた粘着シートを上記評価(1)〜(5)に供した。結果を表2に示す。
エチレン・酢酸ビニル共重合樹脂(三菱化学社製、商品名「EV−40W」)100重量部と、エポキシ系架橋剤(三菱ガス化学社製、商品名「TETRAD−C」)3重量部と、脂肪酸エステル系界面活性剤(花王社製、商品名「エキセパールIPP」、分子量:298.5、アルキル基の炭素数:16)3重量部と、溶媒としてのトルエンとを混合して、樹脂組成物(B)を調製した。この樹脂組成物(B)を、PET基材(厚さ:50μm)上に、乾燥後の厚さが15μmとなるように塗布し、乾燥して粘着剤層を形成した。さらに、粘着剤層上に、セパレータを貼り合わせて、PET基材/粘着剤層/セパレータの層構成を有する粘着シートを作製した。得られた粘着シートを上記評価(1)〜(5)に供した結果を表3に示す。
エチレン・酢酸ビニル共重合樹脂(三菱化学社製、商品名「EV−40W」)に代えて、エチレン・酢酸ビニル共重合樹脂(三菱化学社製、商品名「EV−150」)を用いたこと以外は、実施例12と同様にして粘着シートを得た。得られた粘着シートを上記評価(1)〜(5)に供した。結果を表3に示す。
樹脂組成物(I)に代えて、表2に示す樹脂組成物(樹脂組成物(VI)〜(VIII)および(II−2)〜(IIー11)を用い、粘着剤層の厚みを表2に示す厚みとしたこと以外は、実施例2と同様にして、粘着シートを作製した。得られた粘着シートを上記評価(1)〜(5)に供した。結果を表3に示す。
PET基材(厚さ:50μm)に代えて、ポリオレフィン系基材(厚さ:80μm)を用いたこと、および、粘着剤層の厚みを20μmとしたこと以外は、実施例5と同様にして、粘着シートを得た。得られた粘着シートを上記評価に供した。結果を表4に示す。
上記ポリオレフィン系基材としては、プロピレン成分およびエチレンプロピレンゴム成分を含むプロピレン系熱可塑性エラストマー(三菱ケミカル社製、商品名「ゼラス」)を、ブラコー社製のTダイ成形機(設定温度:230℃)に供給し、厚さ80μmのフィルム状に成形して得られた基材を用いた。
PET基材(厚さ:50μm)に代えて、ポリオレフィン系基材(大倉工業社製、商品名「NSO#60」、厚さ:60μm)を用いたこと、および、粘着剤層の厚みを20μmとしたこと以外は実施例5と同様にして、粘着シートを得た。得られた粘着シートを上記評価に供した。結果を表4に示す。
製造例9で調整した樹脂組成物(IX)を、セパレータ上に、乾燥後の厚さが40μmとなるように塗布し、乾燥して粘着剤層を形成した。さらに、セパレータ上の粘着剤層と、別のセパレータを貼り合わせて、セパレータ/粘着剤層/セパレータの層構成を有する粘着シートを作製した。得られた粘着シートを上記評価(1)〜(5)に供した結果を表4に示す。
粘着剤層の厚みを30μmとしたこと以外は、実施例2と同様にして、粘着シートを得た。得られた粘着シートを上記評価(1)〜(5)に供した。結果を表5に示す。
粘着剤層の厚みを70μmとしたこと以外は、実施例5と同様にして、粘着シートを得た。得られた粘着シートを上記評価(1)〜(5)に供した。結果を表5に示す。
粘着剤層の厚みを200μmとしたこと以外は、実施例8と同様にして、粘着シートを得た。得られた粘着シートを上記評価(1)〜(5)に供した。結果を表5に示す。
脂肪酸エステル系界面活性剤(花王社製、商品名「エキセパールIPP」、分子量:298.5、アルキル基の炭素数:16)3重量部に代えて、芳香族エステル系界面活性剤(DIC社製、商品名「モノサイザーW−700」、分子量:546.78、アルキル基の炭素数:6)を用い、粘着剤層の厚みを10μmとしたこと以外は、実施例1同様にして、粘着シートを得た。得られた粘着シートを上記評価(1)〜(5)に供した。結果を表5に示す。
20 基材
30 別の粘着剤層
100,200、300 粘着シート
Claims (14)
- 粘着剤層を備える、粘着シートであって、
該粘着剤層の厚みが、1μm〜300μmであり、
該粘着剤層の25℃における押し込み硬度H(Pa)と、粘着剤層の厚みhA(μm)とが、下記式(1)の関係を満たす、粘着シート。
logH≧1.9385×loghA+4.2611 ・・・(1) - 前記粘着シートの粘着面をシリコンチップに貼着した場合の25℃の環境温度下におけるせん断接着強度が、1.0MPa以上である、請求項1に記載の粘着シート。
- 前記粘着シートの粘着面をSUS304BAに貼着した際の80℃の環境温度下における引き剥がし粘着力が、15N/20mm以下である、請求項1または2に記載の粘着シート。
- 前記粘着剤層の25℃における押し込み硬度Hが、10MPa〜1GPaである、請求項1から3のいずれかに記載の粘着シート。
- 前記粘着剤層が、ベースポリマーを含む粘着剤から構成され、
該ベースポリマーが、熱可塑性エラストマーである、請求項1から4のいずれかに記載の粘着シート。 - 前記熱可塑性エラストマーが、スチレン系エラストマーまたはエチレン−酢酸ビニル系エラストマーである、請求項5に記載の粘着シート。
- 前記粘着剤が、粘着付与樹脂をさらに含む、請求項5に記載の粘着シート。
- 前記粘着付与樹脂の含有量が、前記ベースポリマー100重量部に対して、1重量部〜350重量部である、請求項7に記載の粘着シート。
- 前記粘着剤層の少なくとも片側に配置された基材をさらに備える、請求項1から8のいずれかに記載の粘着シート。
- 前記粘着剤層の少なくとも片側に配置された別の粘着剤層をさらに備える、請求項1から9のいずれかに記載の粘着シート。
- 前記基材の25℃における引っ張り弾性率が、1×107Pa〜1×1010Paである、請求項9または10に記載の粘着シート。
- 半導体製造工程における基板加工時の仮固定材として用いられる、請求項1から11のいずれかに記載の粘着シート。
- 粘着剤層を備える粘着シートの該粘着剤層上に基板を載置し、固定した後、該基板の粘着剤層側とは反対側の面を研削することを含み、
該粘着剤層の厚みが、1μm〜300μmであり、
該粘着剤層の25℃における押し込み硬度H(Pa)と、粘着剤層の厚みhA(μm)とが、下記式(1)の関係を満たす、
基板の研削方法。 - 粘着剤層を備える粘着シートの該粘着剤層上に基板を載置し、固定した後、該基板の粘着剤層側とは反対側の面を研削する研削工程を含み、
該粘着剤層の厚みが、1μm〜300μmであり、
該粘着剤層の25℃における押し込み硬度H(Pa)と、粘着剤層の厚みhA(μm)とが、下記式(1)の関係を満たす、
チップの製造方法。
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