JP2019521803A5 - - Google Patents

Download PDF

Info

Publication number
JP2019521803A5
JP2019521803A5 JP2019503684A JP2019503684A JP2019521803A5 JP 2019521803 A5 JP2019521803 A5 JP 2019521803A5 JP 2019503684 A JP2019503684 A JP 2019503684A JP 2019503684 A JP2019503684 A JP 2019503684A JP 2019521803 A5 JP2019521803 A5 JP 2019521803A5
Authority
JP
Japan
Prior art keywords
ultrasonic probe
pca
housing
coupled
thermally conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2019503684A
Other languages
Japanese (ja)
Other versions
JP6925408B2 (en
JP2019521803A (en
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/EP2017/069102 external-priority patent/WO2018019974A1/en
Publication of JP2019521803A publication Critical patent/JP2019521803A/en
Publication of JP2019521803A5 publication Critical patent/JP2019521803A5/ja
Application granted granted Critical
Publication of JP6925408B2 publication Critical patent/JP6925408B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Claims (15)

レンズと、
前記レンズに結合されたトランスデューサスタックと、
前記レンズとは反対側で前記トランスデューサスタックの近位側に結合されたバッキングサブアセンブリと
を備える、超音波プローブの遠位端にあるトランスデューサアセンブリと、
前記トランスデューサアセンブリに離間して結合されたプリント回路アセンブリ(PCA)と、
前記PCAと前記トランスデューサアセンブリの少なくとも一部とを囲うハウジングであって、開口部を介して前記レンズの少なくとも一部を露出させるように前記開口部を前記超音波プローブの前記遠位端に定める、ハウジングと、
前記トランスデューサアセンブリと前記PCAとの間に配置され、前記トランスデューサアセンブリを前記PCAに結合する熱伝導性コンプライアント構成要素であって、前記熱伝導性コンプライアント構成要素は、前記PCAから離れて前記ハウジング内の前記開口部に向かう方向に前記トランスデューサアセンブリを付勢する、熱伝導性コンプライアント構成要素とを備える、超音波プローブ。
With the lens
With the transducer stack coupled to the lens,
A transducer assembly at the distal end of the ultrasonic probe , comprising a backing subassembly that is opposite to the lens and coupled to the proximal side of the transducer stack.
With a printed circuit assembly (PCA) spaced apart from the transducer assembly,
A housing that surrounds the PCA and at least a portion of the transducer assembly, with the opening defined at the distal end of the ultrasonic probe so as to expose at least a portion of the lens through the opening. With the housing
A thermally conductive compliant component that is located between the transducer assembly and the PCA and that couples the transducer assembly to the PCA, wherein the thermally conductive compliant component is separated from the PCA and the housing. An ultrasonic probe comprising a thermally conductive compliant component that urges the transducer assembly in a direction towards the opening within .
前記熱伝導性コンプライアント構成要素は、前記PCAの遠位部分に接続された第1の端部と前記バッキングサブアセンブリの近位部分に接続された第2の端部とを有するバネを備える、請求項1に記載の超音波プローブ。 The thermally conductive compliant component comprises a spring having a first end connected to the distal portion of the PCA and a second end connected to the proximal portion of the backing subassembly. The ultrasonic probe according to claim 1. 前記バネはS字形金属ストリップを含む、請求項2に記載の超音波プローブ。 The ultrasonic probe according to claim 2, wherein the spring includes an S-shaped metal strip. 前記S字形金属ストリップの前記第1の端部は一対のフランジを備え、各フランジは、前記PCAの前記遠位部分の互いに反対側にそれぞれ配置される、請求項3に記載の超音波プローブ。 The ultrasonic probe according to claim 3, wherein the first end of the S-shaped metal strip comprises a pair of flanges, each flange of which is disposed on opposite sides of the distal portion of the PCA. 前記熱伝導性コンプライアント構成要素は、前記PCAと前記バッキングサブアセンブリとの間に延在する複数のC字形バネを備える、請求項1に記載の超音波プローブ。 The ultrasonic probe of claim 1, wherein the thermally conductive compliant component comprises a plurality of C-shaped springs extending between the PCA and the backing subassembly. 前記開口部は、シール材によって前記レンズの周囲に結合される、請求項1に記載の超音波プローブ。 The ultrasonic probe according to claim 1, wherein the opening is coupled around the lens by a sealing material. 前記PCAは外面上にクラッドを含み、前記クラッドは前記熱伝導性コンプライアント構成要素に結合される、請求項1に記載の超音波プローブ。 The ultrasonic probe of claim 1, wherein the PCA comprises a clad on the outer surface, the clad being coupled to the thermally conductive compliant component. 前記超音波プローブは前記ハウジングの内面にヒートスプレッダをさらに含み、前記ヒートスプレッダは前記バッキングサブアセンブリの側面に熱的に結合される、請求項1に記載の超音波プローブ。 The ultrasonic probe according to claim 1, wherein the ultrasonic probe further includes a heat spreader on the inner surface of the housing, and the heat spreader is thermally coupled to the side surface of the backing subassembly. 前記超音波プローブは、前記ハウジングと前記ヒートスプレッダとの間に圧縮性ブロックをさらに含み、前記圧縮性ブロックは、前記ヒートスプレッダを前記バッキングサブアセンブリの前記側面に対して付勢する、請求項8に記載の超音波プローブ。 8. The ultrasonic probe further comprises a compressible block between the housing and the heat spreader, wherein the compressible block urges the heat spreader against the side surface of the backing subassembly, claim 8. Ultrasonic probe. 前記PCAの近位端に結合された同軸ケーブルをさらに含み、前記PCAは、前記熱伝導性コンプライアント構成要素から前記同軸ケーブルに熱を伝導する、請求項1に記載の超音波プローブ。 The ultrasonic probe according to claim 1, further comprising a coaxial cable coupled to the proximal end of the PCA, wherein the PCA conducts heat from the thermally conductive compliant component to the coaxial cable. 前記同軸ケーブルは、前記PCAに結合された金属ブレードを含む、請求項10に記載の超音波プローブ。 The ultrasonic probe according to claim 10, wherein the coaxial cable includes a metal blade coupled to the PCA. 前記ハウジングの内面は、前記トランスデューサアセンブリに隣接するリブを含み、前記バッキングサブアセンブリは、前記リブと係合して前記レンズを前記ハウジング内の前記開口部に対して位置合わせするタブを含む、請求項1に記載の超音波プローブInner surface of the housing includes a rib adjacent to the transducer assembly, the backing subassembly includes a tab for the ribs engaged with the lens alignment relative to the opening in the housing, wherein Item 1. The ultrasonic probe according to item 1. 前記ハウジングの前記内面は、前記PCAの遠位端の両側に隣接する複数の柱を含み、前記柱は前記PCAを拘束し、前記コンプライアント構成要素は、前記ハウジングの前記リブと前記柱との間で圧縮される、請求項12に記載の超音波プローブThe inner surface of the housing includes a plurality of columns adjacent to both sides of the distal end of the PCA, the columns constraining the PCA, and the compliant component of the rib of the housing and the column. The ultrasonic probe of claim 12, which is compressed between. 前記ハウジングの内面は、前記PCAの近位端に隣接する柱を含み、前記PCAは、前記PCAを貫通して前記柱と係合するねじによって前記ハウジングに結合される、請求項1に記載の超音波プローブThe first aspect of claim 1, wherein the inner surface of the housing includes a pillar adjacent to the proximal end of the PCA, the PCA being coupled to the housing by a screw that penetrates the PCA and engages the pillar. Ultrasonic probe . 請求項1から14のいずれか一項に記載の超音波プローブと、
前記超音波プローブから信号を受信して画像を生成する画像プロセッサと、
前記画像プロセッサから受け取られた前記画像を表示するためのディスプレイとを備える、超音波イメージングシステム。
The ultrasonic probe according to any one of claims 1 to 14 ,
An image processor that receives a signal from the ultrasonic probe and generates an image,
An ultrasound imaging system comprising a display for displaying the image received from the image processor.
JP2019503684A 2016-07-29 2017-07-28 Ultrasonic probe with thermal and drop impact management Active JP6925408B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201662368267P 2016-07-29 2016-07-29
US62/368,267 2016-07-29
PCT/EP2017/069102 WO2018019974A1 (en) 2016-07-29 2017-07-28 Ultrasound probe with thermal and drop impact management

Publications (3)

Publication Number Publication Date
JP2019521803A JP2019521803A (en) 2019-08-08
JP2019521803A5 true JP2019521803A5 (en) 2020-09-03
JP6925408B2 JP6925408B2 (en) 2021-08-25

Family

ID=59523098

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019503684A Active JP6925408B2 (en) 2016-07-29 2017-07-28 Ultrasonic probe with thermal and drop impact management

Country Status (5)

Country Link
US (1) US11925508B2 (en)
EP (1) EP3490728B1 (en)
JP (1) JP6925408B2 (en)
CN (1) CN109562414B (en)
WO (1) WO2018019974A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011020563A1 (en) 2009-08-19 2011-02-24 Picodrill Sa A method of producing an electrically conducting via in a substrate
KR102591372B1 (en) * 2015-10-27 2023-10-20 삼성메디슨 주식회사 Ultrasonic probe
EP3809972A1 (en) * 2018-06-25 2021-04-28 Koninklijke Philips N.V. Ultrasound probe with moveable heat spreader and cable strain relief
TWI700495B (en) * 2019-02-01 2020-08-01 佳世達科技股份有限公司 Probe protection device and detection device including the same
CN113825449B (en) * 2019-05-13 2024-03-08 皇家飞利浦有限公司 Ultrasonic probe handle
JP2022535704A (en) * 2019-05-24 2022-08-10 コーニンクレッカ フィリップス エヌ ヴェ Ultrasound probe with cable clasp with elastomer insert
US20230233191A1 (en) * 2022-01-25 2023-07-27 GE Precision Healthcare LLC Thermally conductive shock absorbers for medical imaging probes

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2656955B2 (en) * 1988-09-14 1997-09-24 オリンパス光学工業株式会社 Radiation detection and treatment device
US5381795A (en) * 1993-11-19 1995-01-17 Advanced Technology Laboratories, Inc. Intraoperative ultrasound probe
US5465724A (en) 1993-05-28 1995-11-14 Acuson Corporation Compact rotationally steerable ultrasound transducer
US6106474A (en) * 1997-11-19 2000-08-22 Scimed Life Systems, Inc. Aerogel backed ultrasound transducer
JP2001104356A (en) * 1999-10-08 2001-04-17 Toshiba Corp Ultrasonic therapy apparatus
US6530885B1 (en) 2000-03-17 2003-03-11 Atl Ultrasound, Inc. Spatially compounded three dimensional ultrasonic images
US6443896B1 (en) 2000-08-17 2002-09-03 Koninklijke Philips Electronics N.V. Method for creating multiplanar ultrasonic images of a three dimensional object
US20040002655A1 (en) * 2002-06-27 2004-01-01 Acuson, A Siemens Company System and method for improved transducer thermal design using thermo-electric cooling
US6709396B2 (en) * 2002-07-17 2004-03-23 Vermon Ultrasound array transducer for catheter use
US6776758B2 (en) * 2002-10-11 2004-08-17 Koninklijke Philips Electronics N.V. RFI-protected ultrasound probe
JP4332706B2 (en) 2003-05-06 2009-09-16 株式会社日立メディコ Ultrasonic probe
US7431698B2 (en) 2004-01-13 2008-10-07 Ge Medical Systems Global Technology Company, Llc Apparatus and method for controlling an ultrasound probe
JP4551111B2 (en) * 2004-04-16 2010-09-22 日本電波工業株式会社 Ultrasonic probe
US7692364B2 (en) * 2004-09-16 2010-04-06 Olympus Medical Systems Corporation Ultrasonic probe
US20080188755A1 (en) 2005-04-25 2008-08-07 Koninklijke Philips Electronics, N.V. Ultrasound Transducer Assembly Having Improved Thermal Management
JP4843395B2 (en) 2006-07-10 2011-12-21 日本電波工業株式会社 Ultrasonic probe
US20080194963A1 (en) 2007-02-08 2008-08-14 Randall Kevin S Probes for ultrasound imaging systems
US20080194960A1 (en) * 2007-02-08 2008-08-14 Randall Kevin S Probes for ultrasound imaging systems
US20120143060A1 (en) * 2007-12-27 2012-06-07 Koninklijke Philips Electronics N.V. Ultrasound transducer assembly with improved thermal behavior
JP5314008B2 (en) * 2008-05-15 2013-10-16 株式会社日立メディコ Ultrasonic probe, method for manufacturing the same, and ultrasonic diagnostic apparatus
US7946986B2 (en) * 2009-09-29 2011-05-24 Medicis Technologies Corporation Cartridge for use with an ultrasound therapy head
BR112012010628A8 (en) * 2009-11-09 2017-10-10 Koninklijke Philips Electronics Nv CURVED HIGH INTENSITY FOCUSING ULTRASOUND TRANSDUCER (HIFU)
ES2563313T3 (en) 2010-03-19 2016-03-14 Enraf Nonius B.V. Ultrasonic application device
JP5743314B2 (en) * 2010-12-27 2015-07-01 ジーイー・メディカル・システムズ・グローバル・テクノロジー・カンパニー・エルエルシー Ultrasonic probe and ultrasonic image display device
EP2671093B1 (en) 2011-01-31 2019-01-16 Sunnybrook Health Sciences Centre Ultrasonic probe with ultrasonic transducers addressable on common electrical channel
US9730677B2 (en) * 2011-05-17 2017-08-15 Koninklijke Philips Electronics N.V. Matrix ultrasound probe with passive heat dissipation
DE102011090079A1 (en) 2011-12-29 2013-07-04 Endress + Hauser Flowtec Ag Ultrasonic transducer for an ultrasonic flowmeter
US20130172751A1 (en) * 2012-01-02 2013-07-04 General Electric Company Systems and methods for shock absorbing in ultrasound probes
US9072487B2 (en) * 2012-05-11 2015-07-07 General Electric Company Ultrasound probe thermal drain
WO2014080312A1 (en) * 2012-11-20 2014-05-30 Koninklijke Philips N.V. Frameless ultrasound probes with heat dissipation
JP2015177537A (en) * 2014-03-18 2015-10-05 株式会社東芝 ultrasonic probe
EP2992829B1 (en) * 2014-09-02 2018-06-20 Esaote S.p.A. Ultrasound probe with optimized thermal management

Similar Documents

Publication Publication Date Title
JP2019521803A5 (en)
JP6925408B2 (en) Ultrasonic probe with thermal and drop impact management
JP5380849B2 (en) Imaging device
JP6412851B2 (en) Physical quantity measuring device
US20170108692A1 (en) Endoscope
JP2009068906A (en) Distance measuring apparatus
JP2015107218A5 (en)
JP2009060382A (en) Waveguide connector and waveguide connection structure
WO2015111399A1 (en) Fastening member, and obstacle detection device employing fastening member
JP6548234B2 (en) Ultrasonic probe and ultrasonic image display apparatus
JP6354305B2 (en) Grounding component, electronic device, imaging device, and method for producing grounding component
JP2015141119A (en) sensor arrangement structure
JP2019070560A5 (en)
JP2011097158A (en) Camera module mounting structure
EP3244804B1 (en) Interposer electrical interconnect coupling methods, apparatuses, and systems
JP2014216625A (en) Image sensor and imaging apparatus
JP2012135427A (en) Ultrasonic probe and ultrasonic image display
JP4694254B2 (en) Wiring connection part of electronic endoscope
JP6310273B2 (en) Grommet
JP2014195493A5 (en)
JP6751638B2 (en) Connector for ultrasonic signal of ultrasonic endoscope
JP5821024B2 (en) Ultrasonic sensor
JP2018026610A (en) Imaging apparatus
JP6414280B2 (en) Imaging device
JP2007157342A (en) Conduction device and electronic equipment