JP2019521803A5 - - Google Patents
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- JP2019521803A5 JP2019521803A5 JP2019503684A JP2019503684A JP2019521803A5 JP 2019521803 A5 JP2019521803 A5 JP 2019521803A5 JP 2019503684 A JP2019503684 A JP 2019503684A JP 2019503684 A JP2019503684 A JP 2019503684A JP 2019521803 A5 JP2019521803 A5 JP 2019521803A5
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- JP
- Japan
- Prior art keywords
- ultrasonic probe
- pca
- housing
- coupled
- thermally conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000000523 sample Substances 0.000 claims 20
- 210000000614 Ribs Anatomy 0.000 claims 3
- 239000002184 metal Substances 0.000 claims 3
- 238000003384 imaging method Methods 0.000 claims 1
- 239000003566 sealing material Substances 0.000 claims 1
- 238000002604 ultrasonography Methods 0.000 claims 1
Claims (15)
前記レンズに結合されたトランスデューサスタックと、
前記レンズとは反対側で前記トランスデューサスタックの近位側に結合されたバッキングサブアセンブリと
を備える、超音波プローブの遠位端にあるトランスデューサアセンブリと、
前記トランスデューサアセンブリに離間して結合されたプリント回路アセンブリ(PCA)と、
前記PCAと前記トランスデューサアセンブリの少なくとも一部とを囲うハウジングであって、開口部を介して前記レンズの少なくとも一部を露出させるように前記開口部を前記超音波プローブの前記遠位端に定める、ハウジングと、
前記トランスデューサアセンブリと前記PCAとの間に配置され、前記トランスデューサアセンブリを前記PCAに結合する熱伝導性コンプライアント構成要素であって、前記熱伝導性コンプライアント構成要素は、前記PCAから離れて前記ハウジング内の前記開口部に向かう方向に前記トランスデューサアセンブリを付勢する、熱伝導性コンプライアント構成要素とを備える、超音波プローブ。 With the lens
With the transducer stack coupled to the lens,
A transducer assembly at the distal end of the ultrasonic probe , comprising a backing subassembly that is opposite to the lens and coupled to the proximal side of the transducer stack.
With a printed circuit assembly (PCA) spaced apart from the transducer assembly,
A housing that surrounds the PCA and at least a portion of the transducer assembly, with the opening defined at the distal end of the ultrasonic probe so as to expose at least a portion of the lens through the opening. With the housing
A thermally conductive compliant component that is located between the transducer assembly and the PCA and that couples the transducer assembly to the PCA, wherein the thermally conductive compliant component is separated from the PCA and the housing. An ultrasonic probe comprising a thermally conductive compliant component that urges the transducer assembly in a direction towards the opening within .
前記超音波プローブから信号を受信して画像を生成する画像プロセッサと、
前記画像プロセッサから受け取られた前記画像を表示するためのディスプレイとを備える、超音波イメージングシステム。 The ultrasonic probe according to any one of claims 1 to 14 ,
An image processor that receives a signal from the ultrasonic probe and generates an image,
An ultrasound imaging system comprising a display for displaying the image received from the image processor.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201662368267P | 2016-07-29 | 2016-07-29 | |
US62/368,267 | 2016-07-29 | ||
PCT/EP2017/069102 WO2018019974A1 (en) | 2016-07-29 | 2017-07-28 | Ultrasound probe with thermal and drop impact management |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2019521803A JP2019521803A (en) | 2019-08-08 |
JP2019521803A5 true JP2019521803A5 (en) | 2020-09-03 |
JP6925408B2 JP6925408B2 (en) | 2021-08-25 |
Family
ID=59523098
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019503684A Active JP6925408B2 (en) | 2016-07-29 | 2017-07-28 | Ultrasonic probe with thermal and drop impact management |
Country Status (5)
Country | Link |
---|---|
US (1) | US11925508B2 (en) |
EP (1) | EP3490728B1 (en) |
JP (1) | JP6925408B2 (en) |
CN (1) | CN109562414B (en) |
WO (1) | WO2018019974A1 (en) |
Families Citing this family (7)
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WO2011020563A1 (en) | 2009-08-19 | 2011-02-24 | Picodrill Sa | A method of producing an electrically conducting via in a substrate |
KR102591372B1 (en) * | 2015-10-27 | 2023-10-20 | 삼성메디슨 주식회사 | Ultrasonic probe |
EP3809972A1 (en) * | 2018-06-25 | 2021-04-28 | Koninklijke Philips N.V. | Ultrasound probe with moveable heat spreader and cable strain relief |
TWI700495B (en) * | 2019-02-01 | 2020-08-01 | 佳世達科技股份有限公司 | Probe protection device and detection device including the same |
CN113825449B (en) * | 2019-05-13 | 2024-03-08 | 皇家飞利浦有限公司 | Ultrasonic probe handle |
JP2022535704A (en) * | 2019-05-24 | 2022-08-10 | コーニンクレッカ フィリップス エヌ ヴェ | Ultrasound probe with cable clasp with elastomer insert |
US20230233191A1 (en) * | 2022-01-25 | 2023-07-27 | GE Precision Healthcare LLC | Thermally conductive shock absorbers for medical imaging probes |
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JP4843395B2 (en) | 2006-07-10 | 2011-12-21 | 日本電波工業株式会社 | Ultrasonic probe |
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US20120143060A1 (en) * | 2007-12-27 | 2012-06-07 | Koninklijke Philips Electronics N.V. | Ultrasound transducer assembly with improved thermal behavior |
JP5314008B2 (en) * | 2008-05-15 | 2013-10-16 | 株式会社日立メディコ | Ultrasonic probe, method for manufacturing the same, and ultrasonic diagnostic apparatus |
US7946986B2 (en) * | 2009-09-29 | 2011-05-24 | Medicis Technologies Corporation | Cartridge for use with an ultrasound therapy head |
BR112012010628A8 (en) * | 2009-11-09 | 2017-10-10 | Koninklijke Philips Electronics Nv | CURVED HIGH INTENSITY FOCUSING ULTRASOUND TRANSDUCER (HIFU) |
ES2563313T3 (en) | 2010-03-19 | 2016-03-14 | Enraf Nonius B.V. | Ultrasonic application device |
JP5743314B2 (en) * | 2010-12-27 | 2015-07-01 | ジーイー・メディカル・システムズ・グローバル・テクノロジー・カンパニー・エルエルシー | Ultrasonic probe and ultrasonic image display device |
EP2671093B1 (en) | 2011-01-31 | 2019-01-16 | Sunnybrook Health Sciences Centre | Ultrasonic probe with ultrasonic transducers addressable on common electrical channel |
US9730677B2 (en) * | 2011-05-17 | 2017-08-15 | Koninklijke Philips Electronics N.V. | Matrix ultrasound probe with passive heat dissipation |
DE102011090079A1 (en) | 2011-12-29 | 2013-07-04 | Endress + Hauser Flowtec Ag | Ultrasonic transducer for an ultrasonic flowmeter |
US20130172751A1 (en) * | 2012-01-02 | 2013-07-04 | General Electric Company | Systems and methods for shock absorbing in ultrasound probes |
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WO2014080312A1 (en) * | 2012-11-20 | 2014-05-30 | Koninklijke Philips N.V. | Frameless ultrasound probes with heat dissipation |
JP2015177537A (en) * | 2014-03-18 | 2015-10-05 | 株式会社東芝 | ultrasonic probe |
EP2992829B1 (en) * | 2014-09-02 | 2018-06-20 | Esaote S.p.A. | Ultrasound probe with optimized thermal management |
-
2017
- 2017-07-28 CN CN201780046697.8A patent/CN109562414B/en active Active
- 2017-07-28 US US16/318,046 patent/US11925508B2/en active Active
- 2017-07-28 WO PCT/EP2017/069102 patent/WO2018019974A1/en unknown
- 2017-07-28 JP JP2019503684A patent/JP6925408B2/en active Active
- 2017-07-28 EP EP17748715.4A patent/EP3490728B1/en active Active
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