JP2019208038A - Light-emitting device and manufacturing method of the same - Google Patents

Light-emitting device and manufacturing method of the same Download PDF

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JP2019208038A
JP2019208038A JP2019129250A JP2019129250A JP2019208038A JP 2019208038 A JP2019208038 A JP 2019208038A JP 2019129250 A JP2019129250 A JP 2019129250A JP 2019129250 A JP2019129250 A JP 2019129250A JP 2019208038 A JP2019208038 A JP 2019208038A
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light
light emitting
resin
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JP2019208038A5 (en
JP6822526B2 (en
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照人 東
Akito Higashi
照人 東
啓 橋本
Hiroshi Hashimoto
啓 橋本
忠男 守野
Tadao Morino
忠男 守野
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Nichia Chemical Industries Ltd
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Abstract

To provide a light-emitting device of which an outline of a light emission part is clear and can be manufactured in a low cost, and a manufacturing method of the same.SOLUTION: A light-emitting device comprises: a light emission element 1 having an upper surface and a side surface; a light penetration member 3 coating at least one part of the upper surface of the light emission element 1, and penetrating a light from the light emission element 1; a first reflection member 5 holding the light penetration member; and a second reflection member 7 coating the side surface of the light emission element 1. The first reflection member 5 has a bottom surface positioned on a flat surface different from a lower surface of the light penetration member 3, and the bottom surface contacts with the second reflection member 7.SELECTED DRAWING: Figure 2

Description

本開示は、発光装置とその製造方法に関する。   The present disclosure relates to a light emitting device and a manufacturing method thereof.

発光素子を収納するパッケージを用いた表面実装タイプの発光装置が広く用いられるようになってきている。しかしながら、パッケージを用いた表面実装タイプの発光装置は、別途作製したパッケージに発光素子を実装して作製されることから、パッケージのサイズにより小型化が制限されていた。そこで、パッケージを用いる代わりに、発光素子の側面を反射部材で覆った発光装置も検討されている（例えば、特許文献１）。   A surface-mount type light-emitting device using a package that houses a light-emitting element has been widely used. However, since a surface-mount type light emitting device using a package is manufactured by mounting a light emitting element on a separately manufactured package, downsizing is limited by the size of the package. Therefore, a light emitting device in which the side surface of the light emitting element is covered with a reflecting member instead of using a package has been studied (for example, Patent Document 1).

特開２０１２−２２７４７０号公報JP 2012-227470 A

しかしながら、特許文献１に開示された発光装置は、個片化された後の発光装置において、蛍光体シートの側面が反射部材に覆われることなく露出されているので、発光部の輪郭がぼやけて、いわゆる見切りが悪い。   However, in the light emitting device disclosed in Patent Document 1, in the light emitting device after being singulated, the side surface of the phosphor sheet is exposed without being covered by the reflecting member, so the outline of the light emitting unit is blurred. The so-called closeout is bad.

そこで、本発明は、発光部の輪郭が明確な発光装置とその製造方法を提供することを目的とする。   Therefore, an object of the present invention is to provide a light emitting device having a clear outline of a light emitting portion and a method for manufacturing the same.

以上の課題を解決するために、本発明の一実施形態に係る発光装置は、
上面及び側面を有する発光素子と、
前記発光素子の上面の少なくとも一部を覆い、前記発光素子からの光を透過する光透過部材と、
前記光透過部材を保持する第１反射部材と、
前記発光素子の側面を被覆する第２反射部材と、を備え、
前記第１反射部材は、前記光透過部材の下面と異なる平面上に位置する底面を有しており、
前記底面と前記第２反射部材が接していることを特徴とする。 In order to solve the above problems, a light-emitting device according to an embodiment of the present invention includes:
A light emitting device having an upper surface and side surfaces;
A light transmitting member that covers at least a part of the upper surface of the light emitting element and transmits light from the light emitting element;
A first reflecting member holding the light transmitting member;
A second reflecting member covering the side surface of the light emitting element,
The first reflecting member has a bottom surface located on a different plane from the lower surface of the light transmitting member,
The bottom surface and the second reflecting member are in contact with each other.

以上の課題を解決するために、本発明の一実施形態に係る発光装置の製造方法は、
発光素子と、前記発光素子の上面の少なくとも一部を覆う光透過部材と、前記光透過部材の周りに設けられた第１反射部材と、前記発光素子の側面を被覆する第２光反射性部材とを有する発光装置の製造方法であって、
前記発光素子が配置される位置に対応する領域に凸部が設けられたプレート表面を有するベースプレートを準備するベースプレート準備工程と、
前記第１反射部材用に、前記凸部上に開口部を有する第１樹脂枠を前記プレート表面に形成する第１樹脂枠形成工程と、
前記開口部を埋めるように、光透過部材用の第２樹脂を塗布する第２樹脂塗布工程と、
前記ベースプレートを剥離するベースプレート剥離工程と、
前記ベースプレートを剥離することにより露出した第２樹脂表面に前記発光素子を接合する発光素子接合工程と、
前記発光素子の側面を囲みかつ前記第１樹脂層に接する前記第２反射部材用の第３樹脂を塗布する第３樹脂塗布工程と、
を含む。 In order to solve the above problems, a method for manufacturing a light emitting device according to an embodiment of the present invention includes:
A light-emitting element; a light-transmitting member that covers at least a part of the upper surface of the light-emitting element; a first reflecting member provided around the light-transmitting member; and a second light-reflecting member that covers a side surface of the light-emitting element. A method of manufacturing a light emitting device having:
A base plate preparation step of preparing a base plate having a plate surface provided with a convex portion in a region corresponding to a position where the light emitting element is disposed;
Forming a first resin frame having an opening on the convex portion on the plate surface for the first reflecting member; and
A second resin application step of applying a second resin for a light transmitting member so as to fill the opening,
A base plate peeling step for peeling the base plate;
A light emitting element bonding step of bonding the light emitting element to the second resin surface exposed by peeling the base plate;
A third resin application step of applying a third resin for the second reflecting member that surrounds a side surface of the light emitting element and is in contact with the first resin layer;
including.

以上のように構成された本発明の実施形態に係る発光装置とその製造方法によれば、発光部の輪郭が明確な発光装置とその製造方法を提供することができる。   According to the light emitting device and the manufacturing method thereof according to the embodiment of the present invention configured as described above, it is possible to provide a light emitting device with a clear outline of the light emitting portion and the manufacturing method thereof.

本発明に係る実施形態１の発光装置の上面図である。It is a top view of the light-emitting device of Embodiment 1 concerning the present invention. 図１のＡ−Ａ’線についての断面図である。It is sectional drawing about the A-A 'line | wire of FIG. 実施形態１の発光装置の下面図である。3 is a bottom view of the light emitting device according to Embodiment 1. FIG. 本発明に係る実施形態２の発光装置の上面図である。It is a top view of the light-emitting device of Embodiment 2 concerning the present invention. 図４のＡ−Ａ’線についての断面図である。FIG. 5 is a cross-sectional view taken along line A-A ′ of FIG. 4. 実施形態２の発光装置の下面図である。6 is a bottom view of the light emitting device of Embodiment 2. FIG. （ａ）〜（ｇ）は、実施形態に係る発光装置の製造方法を説明するための断面図である。(A)-(g) is sectional drawing for demonstrating the manufacturing method of the light-emitting device which concerns on embodiment. （ａ）及び（ｂ）は、実施形態１の変形例に係る発光装置の製造方法を説明するための断面図である。(A) And (b) is sectional drawing for demonstrating the manufacturing method of the light-emitting device which concerns on the modification of Embodiment 1. FIG. 本発明に係る実施形態３の発光装置の断面図である。It is sectional drawing of the light-emitting device of Embodiment 3 which concerns on this invention. （ａ）〜（ｇ）は、本発明に係る実施形態４の発光装置の製造方法を説明するための断面図である。(A)-(g) is sectional drawing for demonstrating the manufacturing method of the light-emitting device of Embodiment 4 which concerns on this invention. 本発明に係る実施形態４の発光装置の断面図である。It is sectional drawing of the light-emitting device of Embodiment 4 which concerns on this invention.

以下、図面に基づいて本発明の実施形態を詳細に説明する。なお、以下の説明では、必要に応じて特定の方向や位置を示す用語（例えば、「上」、「下」、「右」、「左」および、それらの用語を含む別の用語）を用いる。それらの用語の使用は図面を参照した発明の理解を容易にするためであって、それらの用語の意味によって本発明の技術的範囲が限定されるものではない。また、複数の図面に表れる同一符号の部分は同一の部分又は部材を示す。   Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the following description, terms indicating specific directions and positions (for example, “up”, “down”, “right”, “left” and other terms including those terms) are used as necessary. . The use of these terms is to facilitate understanding of the invention with reference to the drawings, and the technical scope of the present invention is not limited by the meaning of these terms. Moreover, the part of the same code | symbol which appears in several drawing shows the same part or member.

実施形態１の発光装置
図１は、本発明に係る実施形態１の発光装置の上面図であり、図２は、図１のＡ−Ａ’線についての断面図であり、図３は、実施形態１の発光装置の下面図である。
本発明に係る実施形態１の発光装置は、上面を発光面とし、発光面の反対側の下面に電極１３，１４が設けられた発光素子１と、発光素子１の発光面上に設けられた光透過部材３と、光透過部材３の周りに設けられた第１反射部材５と、発光素子１の周りに設けられた第２反射部材７とを含む。 The light emitting device of the Embodiment FIG. 1 1 is a top view of a light emitting device according to the first embodiment of the present invention, FIG. 2 is a cross-sectional view of line A-A 'in FIG. 1, FIG. 3 is performed It is a bottom view of the light-emitting device of the form 1.
The light-emitting device of Embodiment 1 according to the present invention is provided on the light-emitting surface of the light-emitting element 1 having the light-emitting surface as the upper surface and the electrodes 13 and 14 provided on the lower surface opposite to the light-emitting surface. The light transmissive member 3, the first reflective member 5 provided around the light transmissive member 3, and the second reflective member 7 provided around the light emitting element 1 are included.

実施形態１の発光装置において、発光素子１は、例えば、発光面側に位置する透光性基板１２と透光性基板１２の発光面の反対側の面に設けられた半導体積層体１１とを含み、半導体積層体１１の表面に電極１３，１４が形成されている。半導体積層体１１は、例えば、ｎ型半導体層とｐ型半導体層とを含み、電極１３がｎ型半導体層及びｐ型半導体層の一方に接続され、電極１４がｎ型半導体層及びｐ型半導体層の他方に接続される。半導体積層体１１は、さらにｎ型半導体層とｐ型半導体層の間に発光層を含んでいてもよい。   In the light emitting device according to the first embodiment, the light emitting element 1 includes, for example, a translucent substrate 12 positioned on the light emitting surface side and a semiconductor stacked body 11 provided on the surface opposite to the light emitting surface of the translucent substrate 12. In addition, electrodes 13 and 14 are formed on the surface of the semiconductor stacked body 11. The semiconductor stacked body 11 includes, for example, an n-type semiconductor layer and a p-type semiconductor layer, the electrode 13 is connected to one of the n-type semiconductor layer and the p-type semiconductor layer, and the electrode 14 is connected to the n-type semiconductor layer and the p-type semiconductor layer. Connected to the other of the layers. The semiconductor stacked body 11 may further include a light emitting layer between the n-type semiconductor layer and the p-type semiconductor layer.

実施形態１の発光装置において、光透過部材３は、下面が発光素子１の発光面に対向し、発光素子１の発光面の少なくとも一部を覆うように設けられ、発光素子が発光する光は光透過部材３を透過して出射される。実施形態１の発光装置において、光透過部材３は、発光素子１の発光面全体を覆うように設けられることが好ましく、より好ましくは、図１に示すように、発光素子１の発光面全体を覆いかつ光透過部材３の外周面（外側面）が発光素子１の外側面の外側に位置するように設けられる。光透過部材３の上面である表面３ｓは、光出射表面として、発光装置の上面の一部を構成する。光透過部材３は、発光素子１が発光する光を異なる波長の光に変換する蛍光体粒子を含んでいてもよい。   In the light emitting device according to the first embodiment, the light transmitting member 3 is provided so that the lower surface faces the light emitting surface of the light emitting element 1 and covers at least a part of the light emitting surface of the light emitting element 1. The light is transmitted through the light transmitting member 3 and emitted. In the light emitting device of Embodiment 1, the light transmissive member 3 is preferably provided so as to cover the entire light emitting surface of the light emitting element 1, and more preferably, as shown in FIG. The outer peripheral surface (outer surface) of the light transmissive member 3 is provided so as to be located outside the outer surface of the light emitting element 1. The surface 3s, which is the upper surface of the light transmitting member 3, constitutes a part of the upper surface of the light emitting device as the light emitting surface. The light transmissive member 3 may include phosphor particles that convert light emitted from the light emitting element 1 into light of different wavelengths.

実施形態１の発光装置において、第１反射部材５は、光透過部材３の周りに、好ましくは光透過部材３に接して設けられ、光透過部材３の側面からの光の漏れを抑制しかつ光透過部材３を保持する。第１反射部材５は、光透過部材３の側面全体に接して設けられることが好ましく、これにより、光透過部材３の側面からの光の漏れを効果的に抑制しかつ光透過部材３を確実に保持することができる。
実施形態１の発光装置において、第１反射部材５の表面５ｓは、例えば、光透過部材３の上面である表面３ｓを取り囲むようにして発光装置の上面の一部を構成し、これにより、発光装置の上面において、表面３ｓからなる光出射表面と表面５ｓからなる非出射表面との境界を明確に規定する。 In the light emitting device of the first embodiment, the first reflecting member 5 is provided around the light transmitting member 3, preferably in contact with the light transmitting member 3, and suppresses light leakage from the side surface of the light transmitting member 3. The light transmission member 3 is held. The first reflecting member 5 is preferably provided in contact with the entire side surface of the light transmissive member 3, thereby effectively suppressing light leakage from the side surface of the light transmissive member 3 and ensuring the light transmissive member 3. Can be held in.
In the light emitting device of the first embodiment, the surface 5s of the first reflecting member 5 constitutes a part of the upper surface of the light emitting device so as to surround the surface 3s that is the upper surface of the light transmitting member 3, for example, thereby emitting light. On the upper surface of the apparatus, the boundary between the light emitting surface consisting of the surface 3s and the non-emitting surface consisting of the surface 5s is clearly defined.

また、第１反射部材５は、光透過部材３の下面よりも下側に第１底面５ａを有しており、例えば、図２に示すように、光透過部材３の下面と同一平面上に位置する第２底面５ｂとの間に段差が形成される。実施形態１の発光装置では、同一平面上に位置する光透過部材３の下面と第２底面５ｂとにより、発光素子１が実装される実装面が構成され、その実装面に、発光素子１の発光面が光透過部材３の下面に対向するようにダイボンド樹脂によって接合される。これにより、第１底面５ａと第２底面５ｂの間に位置する内周面５ｃの内側に、発光素子１の側面に沿ってダイボンド樹脂が形成される。ダイボンド樹脂は、発光素子１の側面から光透過部材３側に広がるようにその側面が傾斜されることで、傾斜部９を有している。このダイボンド樹脂は、発光素子１と光透過部材３の間に形成されたダイボンド樹脂を光が透過する必要があることから、透光性樹脂により構成されていることが好ましい。この発光素子１と光透過部材３の間に形成される透光性樹脂層は、例えば２〜３０μｍの厚さに形成され、好ましくは、４〜２０μｍの厚さ、より好ましくは、５〜１０μｍ程度の厚さに形成される。なお、ここではダイボンド樹脂により傾斜部９が形成されているが、ダイボンド樹脂とは別に透光性樹脂を用いて傾斜部９を形成してもよい。   Moreover, the 1st reflection member 5 has the 1st bottom face 5a below the lower surface of the light transmissive member 3, for example, on the same plane as the lower surface of the light transmissive member 3, as shown in FIG. A step is formed between the second bottom surface 5b. In the light emitting device of the first embodiment, the mounting surface on which the light emitting element 1 is mounted is configured by the lower surface of the light transmitting member 3 and the second bottom surface 5b located on the same plane. It joins by die-bonding resin so that a light emission surface may oppose the lower surface of the light transmissive member 3. FIG. Thereby, die bond resin is formed along the side surface of the light emitting element 1 inside the inner peripheral surface 5c located between the first bottom surface 5a and the second bottom surface 5b. The die bond resin has the inclined portion 9 by the side surface being inclined so as to spread from the side surface of the light emitting element 1 to the light transmitting member 3 side. Since this die bond resin needs to transmit light through the die bond resin formed between the light emitting element 1 and the light transmitting member 3, it is preferable that the die bond resin is made of a light transmitting resin. The translucent resin layer formed between the light emitting element 1 and the light transmissive member 3 is formed to a thickness of, for example, 2 to 30 μm, preferably 4 to 20 μm, more preferably 5 to 10 μm. It is formed to a thickness of about. In addition, although the inclination part 9 is formed with die-bonding resin here, you may form the inclination part 9 using translucent resin separately from die-bonding resin.

実施形態１の発光装置において、第２反射部材７は、発光素子１を覆うように設けられ、外部接続用に電極１３，１４の表面が露出される。第２反射部材７は、第１反射部材５の第１底面５ａに接して設けられ、第２反射部材７と第１反射部材５とによって発光素子１が保護される。第２反射部材７は、第１反射部材５の第１底面５ａに加えて、第１反射部材５の段差部分、すなわち第１反射部材５の内周面及びダイボンド樹脂の表面に密着して形成されていることが好ましい。これにより、第１反射部材５と第２反射部材７との接合強度を高くできる。また、傾斜部９が透光性樹脂により形成されると、傾斜部９と第２反射部材７との界面で、発光素子１の側面から出射された光を反射して光透過部材３を介して取り出すことができるので、光の取り出し効率を高くできる。第２反射部材７の底面は、実質的に平坦に形成されて、その底面に電極１３，１４の表面が露出される。実施形態１の発光装置において、電極１３，１４の表面が露出された第２反射部材７の底面が、発光装置の実装面となる。   In the light emitting device of Embodiment 1, the second reflecting member 7 is provided so as to cover the light emitting element 1, and the surfaces of the electrodes 13 and 14 are exposed for external connection. The second reflecting member 7 is provided in contact with the first bottom surface 5 a of the first reflecting member 5, and the light emitting element 1 is protected by the second reflecting member 7 and the first reflecting member 5. In addition to the first bottom surface 5a of the first reflecting member 5, the second reflecting member 7 is formed in close contact with the stepped portion of the first reflecting member 5, that is, the inner peripheral surface of the first reflecting member 5 and the surface of the die bond resin. It is preferable that Thereby, the joining strength of the 1st reflective member 5 and the 2nd reflective member 7 can be made high. In addition, when the inclined portion 9 is formed of a translucent resin, the light emitted from the side surface of the light emitting element 1 is reflected at the interface between the inclined portion 9 and the second reflecting member 7 and passes through the light transmitting member 3. The light extraction efficiency can be increased. The bottom surface of the second reflecting member 7 is formed to be substantially flat, and the surfaces of the electrodes 13 and 14 are exposed on the bottom surface. In the light emitting device of the first embodiment, the bottom surface of the second reflecting member 7 where the surfaces of the electrodes 13 and 14 are exposed serves as a mounting surface of the light emitting device.

以上のように構成された実施形態１の発光装置は、別途作製したパッケージを用いることなく、発光素子１を第２反射部材７と第１反射部材５とによって保護するように構成されているので、小型にできる。   The light emitting device of the first embodiment configured as described above is configured to protect the light emitting element 1 with the second reflecting member 7 and the first reflecting member 5 without using a separately manufactured package. Can be small.

以上のように構成された実施形態１の発光装置は、光出射表面である光透過部材３の表面３ｓを取り囲むようにして第１反射部材５の表面５ｓにより取り囲むように構成することができるので、光出射表面と非出射表面との境界を明確に規定することができ、見切りのいい発光装置を構成できる。   Since the light emitting device of the first embodiment configured as described above can be configured to surround the surface 5s of the first reflecting member 5 so as to surround the surface 3s of the light transmitting member 3 that is the light emitting surface. The boundary between the light emitting surface and the non-emitting surface can be clearly defined, and a light-emitting device with good parting can be configured.

以上のように構成された実施形態１の発光装置は、第１反射部材５において、第１底面５ａと第２底面５ｂとの間に段差が形成されているので、第１反射部材５と第２反射部材７との界面からの光の漏洩を効果的に抑えることができる。
ここで、第１底面５ａと第２底面５ｂとの間の段差は、第１反射部材５と第２反射部材７との接合強度を高くし、かつ第１反射部材５と第２反射部材７との界面からの光の漏洩をより効果的に抑えるために、１μｍ〜１０００μｍであることが好ましく、より好ましくは１０μｍ〜２００μｍ、さらに好ましくは３０μｍ〜１００μｍである。別の言い方をすると、第１底面５ａと第２底面５ｂとの間の段差とは、内周面５ｃの高さのことである。
また、光透過部材３の厚みは１０μｍ〜５００μｍであることが好ましい。第１反射部材５の厚みは、段差の形成されていない部分（厚みが薄い部分）は光透過部材３の厚みと同じく１０μｍ〜５００μｍであることが好ましい。これにより、より一層見切りのいい発光装置を構成できる。 In the light emitting device according to the first embodiment configured as described above, a step is formed between the first bottom surface 5a and the second bottom surface 5b in the first reflective member 5, and therefore the first reflective member 5 and the first reflective member 5 2 Leakage of light from the interface with the reflecting member 7 can be effectively suppressed.
Here, the step between the first bottom surface 5 a and the second bottom surface 5 b increases the bonding strength between the first reflecting member 5 and the second reflecting member 7, and the first reflecting member 5 and the second reflecting member 7. Is preferably 1 μm to 1000 μm, more preferably 10 μm to 200 μm, and even more preferably 30 μm to 100 μm. In other words, the level difference between the first bottom surface 5a and the second bottom surface 5b is the height of the inner peripheral surface 5c.
Moreover, it is preferable that the thickness of the light transmissive member 3 is 10 μm to 500 μm. As for the thickness of the 1st reflection member 5, it is preferable that the part in which the level | step difference is not formed (part with thin thickness) is 10 micrometers-500 micrometers similarly to the thickness of the light transmissive member 3. Thereby, it is possible to configure a light-emitting device that is more fully closed.

以上のように構成された実施形態１の発光装置は、後述する製造方法で製造することができるので、安価に製造することができる。   Since the light emitting device of the first embodiment configured as described above can be manufactured by a manufacturing method described later, it can be manufactured at low cost.

以上のように構成された実施形態１の発光装置は、後述する製造方法で製造することができるので、光透過部材３に蛍光体を含有させることにより、種々の蛍光体を含む発光装置を提供することができる。   Since the light emitting device according to Embodiment 1 configured as described above can be manufactured by a manufacturing method described later, a light emitting device including various phosphors is provided by including the phosphor in the light transmitting member 3. can do.

以上の実施形態１の発光装置において、図２には、光出射表面である光透過部材３の表面３ｓが平坦な面により構成された例を示した。しかしながら、本発光装置において、光出射表面は平坦であるものには限定されず、凹面であってもよいし、凸面であってもよい。光出射表面に凹凸があってもよい。   In the light emitting device of Embodiment 1 described above, FIG. 2 shows an example in which the surface 3s of the light transmitting member 3 that is the light emitting surface is configured by a flat surface. However, in the present light emitting device, the light emission surface is not limited to a flat surface, and may be a concave surface or a convex surface. The light exit surface may be uneven.

実施形態１の発光装置の製造方法
実施形態１に係る発光装置の製造方法は、上述した実施形態１の発光装置を製造する方法であって、ベースプレート準備工程と、第１反射部材形成工程と、光透過部材形成工程と、発光素子実装工程と、第２反射部材形成工程と、ダイシング工程とを含む。本製造方法では、第１反射部材形成工程及び光透過部材形成工程は、ベースプレート準備工程で準備されたベースプレート２０上で行われる。 Manufacturing Method of Light Emitting Device of Embodiment 1 A manufacturing method of a light emitting device according to Embodiment 1 is a method of manufacturing the above-described light emitting device of Embodiment 1, and includes a base plate preparation step, a first reflecting member forming step, It includes a light transmitting member forming step, a light emitting element mounting step, a second reflecting member forming step, and a dicing step. In this manufacturing method, the first reflecting member forming step and the light transmitting member forming step are performed on the base plate 20 prepared in the base plate preparing step.

（ベースプレート準備工程）
本実施形態１の製造方法において、ベースプレート準備工程では、発光素子が配置される位置に対応する領域に凸部２１ａを備えたベースプレート２０を準備する。凸部２１ａは、ベースプレート２０のプレート表面２１に形成される。ベースプレート２０は、例えば、ＳＵＳ等の金属からなり、凸部２１ａは、プレート表面を加工することにより形成される。また、凸部２１ａの形状は、発光素子１の形状に基づいて決定され、例えば、発光素子１の実装を容易にするために、凸部の上面が発光素子１の上面形状より一回り大きくなるように形成される。
尚、このベースプレートは、繰り返し使用することもでき、ベースプレート準備工程は第１反射部材形成工程前に常に必要とされるものではない。 (Base plate preparation process)
In the manufacturing method of the first embodiment, in the base plate preparation step, the base plate 20 having the convex portions 21a in the region corresponding to the position where the light emitting element is arranged is prepared. The convex portion 21 a is formed on the plate surface 21 of the base plate 20. The base plate 20 is made of, for example, a metal such as SUS, and the convex portion 21a is formed by processing the plate surface. Further, the shape of the convex portion 21 a is determined based on the shape of the light emitting element 1. For example, in order to facilitate mounting of the light emitting element 1, the upper surface of the convex portion is slightly larger than the upper surface shape of the light emitting element 1. Formed as follows.
The base plate can be used repeatedly, and the base plate preparation process is not always required before the first reflecting member forming process.

（第１反射部材形成工程）
本実施形態１の製造方法において、第１反射部材形成工程では、例えば、図７（ａ）に示すように、ベースプレート２０のプレート表面２１側に金型２５０を配置し、トランスファー成形や射出成形等により、凸部２１ａ上に開口を有する格子形状の第１樹脂枠２５ｂを形成する。具体的には、凸部２１ａに対向する位置に金型凸部２５０ａを有する金型２５０を金型凸部２５０ａの上面が凸部２１ａの上面に接触するように配置し、凸部２１ａと金型凸部２５０ａの周りに、第１樹脂枠２５ｂに対応する形状の空洞を形成する。そして、その空洞に、例えば、光反射性物質を含む第１樹脂を充填して、硬化させる。このようにして、個々の発光装置に分割した後に、第１反射部材５となる第１樹脂枠２５ｂを形成する。 (First reflecting member forming step)
In the manufacturing method of Embodiment 1, in the first reflecting member forming step, for example, as shown in FIG. 7A, a mold 250 is arranged on the plate surface 21 side of the base plate 20, and transfer molding, injection molding, or the like is performed. Thus, a lattice-shaped first resin frame 25b having an opening on the convex portion 21a is formed. Specifically, a mold 250 having a mold convex portion 250a at a position facing the convex portion 21a is disposed such that the upper surface of the mold convex portion 250a is in contact with the upper surface of the convex portion 21a. A cavity having a shape corresponding to the first resin frame 25b is formed around the mold convex portion 250a. Then, the cavity is filled with, for example, a first resin containing a light reflective material and cured. Thus, after dividing | segmenting into each light-emitting device, the 1st resin frame 25b used as the 1st reflection member 5 is formed.

また、第１反射部材形成工程は、金型２５０を用いることなく、図８（ａ）に示すように、第１樹脂層２５をベースプレート表面２１の全面に形成して硬化させた後、図８（ｂ）に示すように、開口部を形成する（開口部形成工程）ようにしてもよい。開口部形成工程では、硬化させた第１樹脂層２５において凸部２１ａ上にそれぞれ開口部２５ａを形成する。開口部２５ａは、開口部２５ａ底面に凸部２１ａが露出するように、かつ光透過部材３に対応する形状となるようにそれぞれ形成される。
開口部２５ａは、例えば、ブラスト、レーザ加工等により形成することができる。
Further, in the first reflecting member forming step, the first resin layer 25 is formed and cured on the entire surface of the base plate surface 21 as shown in FIG. As shown in (b), an opening may be formed (opening forming step). In the opening forming step, the openings 25a are formed on the convex portions 21a in the cured first resin layer 25, respectively. The opening 25a is formed so that the convex portion 21a is exposed on the bottom surface of the opening 25a and has a shape corresponding to the light transmitting member 3.
The opening 25a can be formed by, for example, blasting, laser processing, or the like.

（光透過部材形成工程）
本実施形態１の製造方法において、光透過部材形成工程は、例えば、蛍光体を含む光透過部材３を形成する場合には、第２樹脂層形成工程と、例えば遠心分離により蛍光体を沈降させる蛍光体沈降工程と、第２樹脂層硬化工程とを含む。
第２樹脂層形成工程では、図７（ｃ）に示すように、例えば、蛍光体を含む第２樹脂を、例えば、ポッティングにより、開口部２５ａに充填しかつ第１樹脂枠２５ｂ上を覆うように塗布して、第２樹脂層２３を形成する。
蛍光体沈降工程では、ベースプレート２０に平行でかつベースプレート２０とは反対側に位置する第２樹脂層２３上方の回転軸を中心として、ベースプレート２０とともに第２樹脂層２３を回転させて、第２樹脂層２３に含まれている蛍光体をベースプレート２０側に沈降させる。
第２樹脂層硬化工程では、蛍光体をベースプレート２０側に沈降させた状態で第２樹脂層２３を硬化させる。以上の光透過部材形成工程によれば、種々の蛍光体を使用して発光装置を製造することができる。これに対して、特許文献１の発光装置は、大判の蛍光体シートを用いて製造されるので、シート化が困難な蛍光体を使用することができないという課題がある。 (Light transmission member forming process)
In the manufacturing method of the first embodiment, in the light transmitting member forming step, for example, when the light transmitting member 3 including the phosphor is formed, the phosphor is precipitated by the second resin layer forming step and, for example, centrifugation. A phosphor sedimentation step and a second resin layer curing step are included.
In the second resin layer forming step, as shown in FIG. 7C, for example, a second resin containing a phosphor is filled in the opening 25a by, for example, potting and covers the first resin frame 25b. To form a second resin layer 23.
In the phosphor sedimentation step, the second resin layer 23 is rotated together with the base plate 20 around the rotation axis above the second resin layer 23 that is parallel to the base plate 20 and located on the opposite side of the base plate 20, so that the second resin The phosphor contained in the layer 23 is allowed to settle to the base plate 20 side.
In the second resin layer curing step, the second resin layer 23 is cured in a state where the phosphor is allowed to settle to the base plate 20 side. According to the above light transmissive member formation process, a light-emitting device can be manufactured using various phosphors. On the other hand, since the light-emitting device of Patent Document 1 is manufactured using a large-sized phosphor sheet, there is a problem that a phosphor that is difficult to be formed into a sheet cannot be used.

さらに、第２樹脂層２３を、開口部２５ａに充填するとともに第１樹脂枠２５ｂ上を覆うように形成した場合には、第２樹脂層２３を硬化した後に、光透過部材形成工程はさらに、除去工程を含む。除去工程では、図７（ｄ）に示すように、開口部２５ａに充填された第２樹脂層２３が所望の厚さになり、第１樹脂枠２５ｂ上の第２樹脂層が除去されるように、第２樹脂層２３を上面から例えば研削する。
光透過部材形成工程において、各開口部２５ａにそれぞれ第２樹脂層２３を所定量充填することにより、第１樹脂枠２５ｂ上に第２樹脂層２３を形成することなく、開口部２５ａにそれぞれ所定の厚さの第２樹脂層２３を形成するようにしても良く、そのようにした場合には、除去工程は必須ではない。 Further, when the second resin layer 23 is formed so as to fill the opening 25a and cover the first resin frame 25b, after the second resin layer 23 is cured, the light transmitting member forming step is further performed. Including a removal step. In the removing step, as shown in FIG. 7D, the second resin layer 23 filled in the opening 25a has a desired thickness, and the second resin layer on the first resin frame 25b is removed. Then, the second resin layer 23 is ground from the upper surface, for example.
In the light transmitting member forming step, each opening 25a is filled with a predetermined amount of the second resin layer 23, so that the opening 25a is predetermined without forming the second resin layer 23 on the first resin frame 25b. The second resin layer 23 having a thickness of may be formed, and in such a case, the removing step is not essential.

（発光素子実装工程）
本実施形態１の製造方法において、発光素子実装工程は、ベースプレート剥離工程と、ダイボンド工程とを含み、必要に応じて、ベースプレート剥離工程の前に、補強シート貼付工程を含む。ここでは、補強シート貼付工程を含めて説明する。
補強シート貼付工程では、第１樹脂枠２５ｂ上及び開口部２５ａに形成された第２樹脂層からなる光透過部材３上に補強シート４０を貼付ける。補強シート４０は、ベースプレート２０を剥離した後の、第１樹脂枠２５ｂと第１樹脂枠２５ｂにより保持された光透過部材３からなる複合シート３０を補強する。 (Light emitting element mounting process)
In the manufacturing method of the first embodiment, the light emitting element mounting step includes a base plate peeling step and a die bonding step, and optionally includes a reinforcing sheet sticking step before the base plate peeling step. Here, a description will be given including the reinforcing sheet attaching step.
In the reinforcing sheet affixing step, the reinforcing sheet 40 is affixed on the first resin frame 25b and the light transmitting member 3 made of the second resin layer formed in the opening 25a. The reinforcing sheet 40 reinforces the composite sheet 30 composed of the first resin frame 25b and the light transmission member 3 held by the first resin frame 25b after the base plate 20 is peeled off.

ベースプレート剥離工程では、補強シート４０により補強された複合シート３０からベースプレート２０を剥離する。ベースプレート２０が剥離された複合シート３０には、ベースプレート２０の凸部２１に対応する凹部３０ａがそれぞれ形成される。凹部３０ａの底面はそれぞれ、光透過部材３の下面と当該下面の周りに露出された第２底面５ｂを含む。また、凹部３０ａの周りには、第１底面５ａが露出される。   In the base plate peeling step, the base plate 20 is peeled from the composite sheet 30 reinforced by the reinforcing sheet 40. The composite sheet 30 from which the base plate 20 has been peeled is formed with recesses 30a corresponding to the protrusions 21 of the base plate 20, respectively. Each bottom surface of the recess 30a includes a lower surface of the light transmitting member 3 and a second bottom surface 5b exposed around the lower surface. Further, the first bottom surface 5a is exposed around the recess 30a.

ダイボンド工程では、図７（ｅ）に示すように、各凹部３０ａの底面にそれぞれ発光素子１をダイボンド樹脂により接着する。このダイボンド樹脂は、例えば、透光性樹脂からなり、発光素子１と透光性部材３の間にはダイボンド樹脂層が形成され、発光素子１の周りには、ダイボンド樹脂からなる傾斜部９が形成される。発光素子１は、光透過部材３を介して光を効果的に取り出すことができるように、第２底面５ｂにはみ出すことなく光透過部材３の下面に接合することが好ましい。また、発光素子１は、ダイボンド樹脂により形成される傾斜部９が、発光素子１の周りの凹部３０ａ内に形成されるように実装することが好ましい。凹部３０ａの側壁に傾斜部９の端部が達するように形成することにより、傾斜部９が光透過部材３と第１樹脂枠２５ｂに跨るように形成することができる。これにより、光透過部材３の下面の全面に傾斜部９を広げることができ、光透過部材３の全面に光を入射することができる。これにより、発光面の輝度ムラを抑制することができる。   In the die bonding step, as shown in FIG. 7E, the light emitting element 1 is bonded to the bottom surface of each recess 30a with a die bonding resin. This die bond resin is made of, for example, a translucent resin, a die bond resin layer is formed between the light emitting element 1 and the translucent member 3, and an inclined portion 9 made of the die bond resin is formed around the light emitting element 1. It is formed. The light emitting element 1 is preferably joined to the lower surface of the light transmitting member 3 without protruding from the second bottom surface 5b so that light can be effectively extracted through the light transmitting member 3. Moreover, it is preferable that the light emitting element 1 is mounted such that the inclined portion 9 formed of the die bond resin is formed in the concave portion 30 a around the light emitting element 1. By forming so that the edge part of the inclination part 9 may reach the side wall of the recessed part 30a, it can form so that the inclination part 9 may straddle the light transmissive member 3 and the 1st resin frame 25b. Accordingly, the inclined portion 9 can be spread over the entire lower surface of the light transmitting member 3, and light can be incident on the entire surface of the light transmitting member 3. Thereby, the brightness nonuniformity of a light emission surface can be suppressed.

（第２反射部材形成工程）
本実施形態１の製造方法において、第２反射部材形成工程は、第３樹脂形成工程と、第３樹脂層研削工程とを含む。
第３樹脂形成工程では、図７（ｆ）に示すように、例えば、光反射性物質を含む第３樹脂２７を、各凹部３０ａにそれぞれ実装された発光素子１を覆い、かつ第２底面５ｂに接するように形成する。第３樹脂２７を形成する際、第３樹脂が発光素子１の周りの凹部３０ａ内に充填され、傾斜部及び凹部３０ａの側面に接するように形成することが好ましく、このようにすると、第１樹脂と第２樹脂とを強固に接合することができる。
第３樹脂層研削工程では、第３樹脂２７を下面から研削して、発光素子の電極１３，１４を露出させる。 (Second reflecting member forming step)
In the manufacturing method of Embodiment 1, the second reflecting member forming step includes a third resin forming step and a third resin layer grinding step.
In the third resin formation step, as shown in FIG. 7F, for example, a third resin 27 containing a light reflective material covers the light emitting element 1 mounted in each recess 30a, and the second bottom surface 5b. It forms so that it may touch. When the third resin 27 is formed, it is preferable that the third resin is filled in the concave portions 30a around the light emitting element 1 so as to be in contact with the inclined portions and the side surfaces of the concave portions 30a. The resin and the second resin can be firmly bonded.
In the third resin layer grinding step, the third resin 27 is ground from the lower surface to expose the electrodes 13 and 14 of the light emitting element.

（分割工程）
分割工程では、補強シートを剥離した後、または補強シートとともに、第１樹脂と第３樹脂とを、図７（ｇ）に示す分割線Ｌ１に沿ってダイシング等の方法で切断することにより、個々の発光装置に分離する。
以上のようにして、図１〜図３に示す実施形態１の発光装置が作製される。 (Division process)
In the dividing step, after the reinforcing sheet is peeled off or together with the reinforcing sheet, the first resin and the third resin are individually cut by a method such as dicing along the dividing line L1 shown in FIG. The light emitting device is separated.
As described above, the light-emitting device of Embodiment 1 shown in FIGS. 1 to 3 is manufactured.

実施形態２の発光装置
実施形態２の発光装置は、図４〜図６に示すように、光透過部材３に接する第１反射部材５の内周面が連続して第２底面５ｂまで延びた段差のない第１反射部材５を用いて構成している点で、実施形態１の発光装置と異なっている。以上のように構成された実施形態２の発光装置は、透光性樹脂により形成された傾斜部９と第２反射部材７との界面で反射した光を、光透過部材３を介してより効果的に取り出すことができ、光の取り出し効率をさらに高くできる。 Light Emitting Device of Embodiment 2 In the light emitting device of Embodiment 2, as shown in FIGS. 4 to 6, the inner peripheral surface of the first reflecting member 5 in contact with the light transmitting member 3 continuously extends to the second bottom surface 5 b. It differs from the light emitting device of Embodiment 1 in that it is configured using the first reflecting member 5 having no step. The light emitting device according to the second embodiment configured as described above is more effective for the light reflected at the interface between the inclined portion 9 formed of the translucent resin and the second reflecting member 7 via the light transmitting member 3. And the light extraction efficiency can be further increased.

実施形態３の発光装置
実施形態３の発光装置は、図９に示すように、第１反射部材５が、光透過部材３の下面よりも上側に第１底面５ａを有している点で、実施形態２の発光装置とは異なっている。すなわち、光透過部材３の側面が、第１反射部材５及び第２反射部材７の双方により被覆されている。以上のように構成された実施形態３の発光装置は、第１反射部材５において、第１底面５ａと光透過部材３の下面（発光素子１と光透過部材３との接合面）の間に段差が形成されるので、第１反射部材５と第２反射部材７との界面からの光の漏洩を効果的に抑えることができる。 Light Emitting Device of Embodiment 3 The light emitting device of Embodiment 3 is that the first reflecting member 5 has a first bottom surface 5a above the lower surface of the light transmitting member 3, as shown in FIG. This is different from the light emitting device of the second embodiment. That is, the side surface of the light transmitting member 3 is covered with both the first reflecting member 5 and the second reflecting member 7. The light emitting device according to the third embodiment configured as described above includes, in the first reflecting member 5, between the first bottom surface 5a and the lower surface of the light transmitting member 3 (the bonding surface between the light emitting element 1 and the light transmitting member 3). Since the step is formed, light leakage from the interface between the first reflecting member 5 and the second reflecting member 7 can be effectively suppressed.

実施形態４の発光装置の製造方法
実施形態４に係る発光装置の製造方法は、実施形態１に係る発光装置の製造方法に比較して、図１０（ａ）〜（ｇ）に示すように、ベースプレート２００の形状が実施形態１の製造方法で使用するベースプレート２０と異なっている以外は実施形態１の製造方法と同様に構成される。 Manufacturing Method of Light-Emitting Device According to Embodiment 4 The manufacturing method of the light-emitting device according to Embodiment 4 is compared with the manufacturing method of the light-emitting device according to Embodiment 1, as shown in FIGS. The configuration of the base plate 200 is the same as that of the manufacturing method of the first embodiment except that the shape of the base plate 200 is different from that of the base plate 20 used in the manufacturing method of the first embodiment.

具体的には、実施形態４に係る発光装置の製造方法において、ベースプレート２００は、例えば、円柱空洞からなる貫通孔２２０を有し、この貫通孔２２０は、例えば、対角方向に隣接する凸部２１０ａ間にそれぞれ設けられている。すなわち、ベースプレート２００において、例えば、複数の矩形形状の凸部２５０ａがベースプレート表面２１０において複数の行と列をなすように設けられ、その対角方向にそれぞれ凸部２５０ａと貫通孔２２０とが交互に設けられている。   Specifically, in the method for manufacturing a light emitting device according to the fourth embodiment, the base plate 200 includes, for example, a through hole 220 formed of a cylindrical cavity, and the through hole 220 is, for example, a convex portion adjacent in a diagonal direction. 210a are provided respectively. That is, in the base plate 200, for example, a plurality of rectangular convex portions 250a are provided so as to form a plurality of rows and columns on the base plate surface 210, and the convex portions 250a and the through holes 220 are alternately arranged in the diagonal direction. Is provided.

以上のように構成されたベースプレート２００を用いた実施形態４に係る発光装置の製造方法において、第１樹脂枠２５ｂ１を形成する際、貫通孔２２０にも光反射性物質を含む第１樹脂が充填され、第１樹脂枠２５ｂ１には貫通孔２２０の形状に対応する、例えば円柱形状のリブ２５ｒがそれぞれ形成される。以下、実施形態１と同様にして光透過部材３を形成した後、ベースプレート２００を剥離する。   In the method of manufacturing the light emitting device according to Embodiment 4 using the base plate 200 configured as described above, when the first resin frame 25b1 is formed, the through hole 220 is also filled with the first resin including the light reflecting material. For example, cylindrical ribs 25r corresponding to the shape of the through holes 220 are formed in the first resin frame 25b1, respectively. Hereinafter, after forming the light transmitting member 3 in the same manner as in the first embodiment, the base plate 200 is peeled off.

以上のように構成された実施形態４に係る発光装置の製造方法では、リブ２５ｒが貫通孔２２０を貫通して設けられているので、ベースプレート２００を剥離する際、ベースプレート２００を固定した状態でリブ２５ｒを押圧することにより、第１樹脂枠２５ｂ１を容易に剥離することができる。   In the method of manufacturing the light emitting device according to the fourth embodiment configured as described above, the rib 25r is provided through the through hole 220. Therefore, when the base plate 200 is peeled, the rib is fixed in the state where the base plate 200 is fixed. By pressing 25r, the first resin frame 25b1 can be easily peeled off.

以上の実施形態４の製造方法により作製された発光装置は、図１１に示すように、第１底面５ａより下方に位置するリブ２５ａの先端面２５ａｔの一部が第２反射部材７の底面と略同一平面上に露出されている点を除いて実施形態１の発光装置と同様に構成され、実施形態１の発光装置と同様の作用効果を有する。
ここで、図１１の断面図には、両側にそれぞれリブ２５ａの一部を示すために側面に近い位置の断面を示しているが、図１１の断面より中央よりの断面では、発光装置の場合も図２に示すような断面となる。図１０（ａ）〜（ｇ）についても同様である。 As shown in FIG. 11, in the light emitting device manufactured by the manufacturing method of Embodiment 4 described above, a part of the front end surface 25at of the rib 25a located below the first bottom surface 5a is in contact with the bottom surface of the second reflecting member 7. The light emitting device is configured in the same manner as the light emitting device of Embodiment 1 except that it is exposed on substantially the same plane, and has the same effects as the light emitting device of Embodiment 1.
Here, the cross-sectional view of FIG. 11 shows a cross-section at a position closer to the side surface in order to show a part of the rib 25a on each side, but the cross-section from the center of the cross-section of FIG. Also has a cross section as shown in FIG. The same applies to FIGS. 10A to 10G.

以下に、実施の形態の発光装置の各構成部材に適した材料等について説明する。
（発光素子１）
発光素子１としては、例えば発光ダイオードチップ等の半導体発光素子を用いることができる。半導体発光素子は、透光性基板１２と、その上に形成された半導体積層体１１とを含むことができる。発光素子１の大きさは、たとえば平面視における形状が正方形の場合、一辺の長さが３００μｍ以上１４００μｍ以下である。 Hereinafter, materials suitable for each component of the light emitting device of the embodiment will be described.
(Light emitting element 1)
As the light emitting element 1, for example, a semiconductor light emitting element such as a light emitting diode chip can be used. The semiconductor light emitting device can include a translucent substrate 12 and a semiconductor stacked body 11 formed thereon. For example, when the shape of the light emitting element 1 in a plan view is a square, the length of one side is not less than 300 μm and not more than 1400 μm.

（透光性基板１２）
透光性基板１２には、例えば、サファイア（Ａｌ２Ｏ３）、スピネル（ＭｇＡ１２Ｏ４）のような透光性の絶縁性材料や、半導体積層体１１からの発光を透過する半導体材料（例えば、窒化物系半導体材料）を用いることができる。 (Translucent substrate 12)
The light-transmitting substrate 12 includes, for example, a light-transmitting insulating material such as sapphire (Al 2 O 3 ) and spinel (MgA 1 2 O 4 ), and a semiconductor material that transmits light from the semiconductor stacked body 11 ( For example, a nitride-based semiconductor material) can be used.

（半導体積層体１１）
半導体積層体１１は、例えば、ｎ型半導体層、発光層（活性層）およびｐ型半導体層等の複数の半導体層を含む。半導体層には、例えば、ＩＩＩ−Ｖ族化合物半導体、ＩＩ−ＶＩ族化合物半導体等の半導体材料から形成することができる。具体的には、ＩｎＸＡｌＹＧａ１−Ｘ−ＹＮ（０≦Ｘ、０≦Ｙ、Ｘ＋Ｙ≦１）等の窒化物系の半導体材料（例えばＩｎＮ、ＡｌＮ、ＧａＮ、ＩｎＧａＮ、ＡｌＧａＮ、ＩｎＧａＡｌＮ等）を用いることができる。 (Semiconductor laminate 11)
The semiconductor stacked body 11 includes, for example, a plurality of semiconductor layers such as an n-type semiconductor layer, a light emitting layer (active layer), and a p-type semiconductor layer. The semiconductor layer can be formed from a semiconductor material such as a III-V group compound semiconductor or a II-VI group compound semiconductor, for example. Specifically, In X Al Y Ga 1- X-Y N (0 ≦ X, 0 ≦ Y, X + Y ≦ 1) nitride semiconductor material (e.g., InN such, AlN, GaN, InGaN, AlGaN , InGaAlN Etc.) can be used.

（電極１３，１４）
発光素子１の電極１３，１４としては、電気良導体を用いることができ、例えばＣｕ等の金属が好適である。 (Electrodes 13, 14)
As the electrodes 13 and 14 of the light emitting element 1, a good electric conductor can be used, and for example, a metal such as Cu is preferable.

（ダイボンド樹脂として用いる透光性樹脂）
透光性樹脂としては、特に、シリコーン樹脂、シリコーン変性樹脂、エポキシ樹脂、フェノール樹脂などの熱硬化性の透光性樹脂を用いることができる。
また、透光性樹脂は、発光素子１の側面に接触して、点灯時に発光素子１で発生する熱の影響を受けやすい。この点で、熱硬化性樹脂は、耐熱性に優れており、透光性樹脂として適している。 (Translucent resin used as die bond resin)
As the translucent resin, in particular, a thermosetting translucent resin such as a silicone resin, a silicone-modified resin, an epoxy resin, or a phenol resin can be used.
Further, the translucent resin is in contact with the side surface of the light emitting element 1 and is easily affected by heat generated in the light emitting element 1 during lighting. In this respect, the thermosetting resin has excellent heat resistance and is suitable as a light-transmitting resin.

（第１反射部材５及び第２反射部材７）
第１反射部材５及び第２反射部材７は、光反射性樹脂により構成することができる。
光反射性樹脂とは、発光素子１からの光に対する反射率が高く、例えば、反射率が７０％以上の樹脂を意味する。
反射性樹脂としては、例えば透光性樹脂に、光反射性物質を分散させたものが使用できる。光反射性物質としては、例えば、酸化チタン、二酸化ケイ素、二酸化チタン、二酸化ジルコニウム、チタン酸カリウム、アルミナ、窒化アルミニウム、窒化ホウ素、ムライトなどが好適である。光反射性物質は、粒状、繊維状、薄板片状などが利用できるが、特に、繊維状のものは第１反射部材５及び第２反射部材７の熱膨張率を低くして、例えば、発光素子１との間の熱膨張率差を小さくできるので、好ましい。反射性樹脂に含まれる樹脂材料としては、特に、シリコーン樹脂、シリコーン変性樹脂、エポキシ樹脂、フェノール樹脂などの熱硬化性の透光性樹脂であるのが好ましい。 (First reflective member 5 and second reflective member 7)
The first reflecting member 5 and the second reflecting member 7 can be made of a light reflecting resin.
The light reflective resin means a resin having a high reflectance with respect to the light from the light emitting element 1, for example, a reflectance of 70% or more.
As the reflective resin, for example, a translucent resin in which a light reflective material is dispersed can be used. As the light reflective material, for example, titanium oxide, silicon dioxide, titanium dioxide, zirconium dioxide, potassium titanate, alumina, aluminum nitride, boron nitride, mullite and the like are suitable. The light-reflective material may be in the form of particles, fibers, thin plates, etc. In particular, the fiber-like material has a low coefficient of thermal expansion of the first reflecting member 5 and the second reflecting member 7 to emit light, for example. This is preferable because the difference in coefficient of thermal expansion with respect to the element 1 can be reduced. The resin material contained in the reflective resin is particularly preferably a thermosetting translucent resin such as a silicone resin, a silicone-modified resin, an epoxy resin, or a phenol resin.

（光透過部材３）
光透過部材３を構成する透光性樹脂としては、シリコーン樹脂、シリコーン変性樹脂、エポキシ樹脂、フェノール樹脂などの熱硬化性樹脂、ポリカーボネート樹脂、アクリル樹脂、メチルペンテン樹脂、ポリノルボルネン樹脂などの熱可塑性樹脂を用いることができる。特に、耐光性、耐熱性に優れるシリコーン樹脂が好適である。 (Light transmission member 3)
Examples of the translucent resin constituting the light transmissive member 3 include thermoplastic resins such as thermosetting resins such as silicone resins, silicone-modified resins, epoxy resins, and phenol resins, polycarbonate resins, acrylic resins, methylpentene resins, and polynorbornene resins. Resin can be used. In particular, a silicone resin excellent in light resistance and heat resistance is suitable.

（蛍光体）
蛍光体は、発光素子１からの発光で励起可能なものが使用されることは言うまでもない。例えば、青色発光素子又は紫外線発光素子で励起可能な蛍光体としては、セリウムで賦活されたイットリウム・アルミニウム・ガーネット系蛍光体（Ｃｅ：ＹＡＧ）；セリウムで賦活されたルテチウム・アルミニウム・ガーネット系蛍光体（Ｃｅ：ＬＡＧ）；ユウロピウムおよび／又はクロムで賦活された窒素含有アルミノ珪酸カルシウム系蛍光体（ＣａＯ−Ａｌ２Ｏ３−ＳｉＯ２）；ユウロピウムで賦活されたシリケート系蛍光体（（Ｓｒ，Ｂａ）２ＳｉＯ４）；βサイアロン蛍光体、ＣＡＳＮ系蛍光体、ＳＣＡＳＮ系蛍光体等の窒化物系蛍光体；ＫＳＦ系蛍光体（Ｋ２ＳｉＦ６：Ｍｎ）；硫化物系蛍光体、量子ドット蛍光体などが挙げられる。これらの蛍光体と、青色発光素子又は紫外線発光素子と組み合わせることにより、様々な色の発光装置（例えば白色系の発光装置）を製造することができる。 (Phosphor)
Needless to say, a phosphor that can be excited by light emission from the light emitting element 1 is used. For example, phosphors that can be excited by blue light-emitting elements or ultraviolet light-emitting elements include yttrium-aluminum-garnet phosphors activated with cerium (Ce: YAG); lutetium-aluminum-garnet phosphors activated with cerium (Ce: LAG); Nitrogen-containing calcium aluminosilicate phosphor activated with europium and / or chromium (CaO—Al 2 O 3 —SiO 2 ); Silicate phosphor activated with europium ((Sr, Ba) 2 SiO 4 ); nitride phosphor such as β sialon phosphor, CASN phosphor, SCASN phosphor; KSF phosphor (K 2 SiF 6 : Mn); sulfide phosphor, quantum dot phosphor Etc. By combining these phosphors with a blue light emitting element or an ultraviolet light emitting element, light emitting devices of various colors (for example, white light emitting devices) can be manufactured.

以上、本発明に係るいくつかの実施形態について例示したが、本発明は上述した実施形態に限定されるものではなく、本発明の要旨を逸脱しない限り任意のものとすることができることは言うまでもない。   As mentioned above, although several embodiment which concerns on this invention was illustrated, this invention is not limited to embodiment mentioned above, It cannot be overemphasized that it can be made arbitrary, unless it deviates from the summary of this invention. .

１ 発光素子
３ 光透過部材
３ｓ 光透過部材の表面
５ 第１反射部材
５ａ 第１底面
５ｂ 第２底面
５ｃ 内周面
５ｓ 第１反射部材の表面
７ 第２反射部材
９ 傾斜部
１１ 半導体積層体
１２ 透光性基板
１３，１４ 電極
２０，２００ ベースプレート
２１，２１０ プレート表面
２１ａ，２１０ａ 凸部
２３ 第２樹脂層
２５ 第１樹脂層
２５ａ 開口部
２５ｂ 第１樹脂枠
２７ 第３樹脂
３０ 複合シート
３０ａ 凹部
４０ 補強シート
２２０ 貫通孔 DESCRIPTION OF SYMBOLS 1 Light emitting element 3 Light transmissive member 3s Surface 5 of light transmissive member 1st reflective member 5a 1st bottom face 5b 2nd bottom face 5c Inner peripheral surface 5s Surface 7 of 1st reflective member 2nd reflective member 9 Inclined part 11 Semiconductor laminated body 12 Translucent substrate 13, 14 Electrode 20, 200 Base plate 21, 210 Plate surface 21 a, 210 a Protrusion 23 Second resin layer 25 First resin layer 25 a Opening 25 b First resin frame 27 Third resin 30 Composite sheet 30 a Concave 40 Reinforcing sheet 220 Through hole

Claims (16)

上面及び側面を有する発光素子と、
前記発光素子の上面の少なくとも一部を覆い、前記発光素子からの光を透過する光透過部材と、
前記光透過部材を保持する第１反射部材と、
前記発光素子の側面を被覆する第２反射部材と、を備え、
前記第１反射部材は、前記光透過部材の下面と異なる平面上に位置する底面を有しており、
前記底面と前記第２反射部材が接していることを特徴とする発光装置。 A light emitting device having an upper surface and side surfaces;
A light transmitting member that covers at least a part of the upper surface of the light emitting element and transmits light from the light emitting element;
A first reflecting member holding the light transmitting member;
A second reflecting member covering the side surface of the light emitting element,
The first reflecting member has a bottom surface located on a different plane from the lower surface of the light transmitting member,
The light emitting device, wherein the bottom surface and the second reflecting member are in contact with each other. 前記第１反射部材の底面は、前記光透過部材の下面よりも下側に位置する請求項１に記載の発光装置。   The light emitting device according to claim 1, wherein a bottom surface of the first reflecting member is located below a lower surface of the light transmitting member. 前記第１反射部材の底面は、前記光透過部材の下面よりも上側に位置する請求項１に記載の発光装置。   The light emitting device according to claim 1, wherein a bottom surface of the first reflecting member is located above a lower surface of the light transmitting member. 前記光透過部材の側面が、前記第１反射部材及び前記第２反射部材により被覆されている請求項３に記載の発光装置。   The light emitting device according to claim 3, wherein a side surface of the light transmitting member is covered with the first reflecting member and the second reflecting member. 前記第１反射部材は、前記底面の内側に第２底面を有し、該第２底面と前記光透過部材の下面とが同一平面上に位置する請求項２に記載の発光装置。   The light emitting device according to claim 2, wherein the first reflecting member has a second bottom surface inside the bottom surface, and the second bottom surface and the lower surface of the light transmission member are located on the same plane. 前記底面と前記第２底面の段差が３０μｍ〜１００μｍである請求項５に記載の発光装置。   The light emitting device according to claim 5, wherein a step between the bottom surface and the second bottom surface is 30 μm to 100 μm. 前記発光素子は、前記光透過部材と接着材を介して接着されている請求項１〜５のいずれかに記載の発光装置。   The light emitting device according to claim 1, wherein the light emitting element is bonded to the light transmitting member via an adhesive. 前記第２反射部材は、前記接着材と接している請求項７に記載の発光装置。   The light emitting device according to claim 7, wherein the second reflecting member is in contact with the adhesive. 発光素子と、前記発光素子の上面の少なくとも一部を覆う光透過部材と、前記光透過部材の周りに設けられた第１反射部材と、前記発光素子の側面を被覆する第２光反射性部材とを有する発光装置の製造方法であって、
前記発光素子が配置される位置に対応する領域に凸部が設けられたプレート表面を有するベースプレートを準備するベースプレート準備工程と、
前記第１反射部材用に、前記凸部上に開口部を有する第１樹脂枠を前記プレート表面に形成する第１樹脂枠形成工程と、
前記開口部を埋めるように、光透過部材用の第２樹脂を塗布する第２樹脂塗布工程と、
前記ベースプレートを剥離するベースプレート剥離工程と、
前記ベースプレートを剥離することにより露出した第２樹脂表面に前記発光素子を接合する発光素子接合工程と、
前記発光素子の側面を囲みかつ前記第１樹脂層に接する前記第２反射部材用の第３樹脂を塗布する第３樹脂塗布工程と、
を含む発光装置の製造方法。 A light-emitting element; a light-transmitting member that covers at least a portion of the upper surface of the light-emitting element; a first reflecting member provided around the light-transmitting member; and a second light-reflecting member that covers a side surface of the light-emitting element. A method of manufacturing a light emitting device having:
A base plate preparation step of preparing a base plate having a plate surface provided with a convex portion in a region corresponding to a position where the light emitting element is disposed;
Forming a first resin frame having an opening on the convex portion on the plate surface for the first reflecting member; and
A second resin application step of applying a second resin for a light transmitting member so as to fill the opening,
A base plate peeling step for peeling the base plate;
A light emitting element bonding step of bonding the light emitting element to the second resin surface exposed by peeling the base plate;
A third resin application step of applying a third resin for the second reflecting member that surrounds a side surface of the light emitting element and is in contact with the first resin layer;
A method for manufacturing a light-emitting device including: 第１樹脂枠形成工程は、第２凸部を有する金型を前記第２凸部の上面が前記凸部の上面に接触するように配置して、前記凸部及び前記第２凸部の周りに前記第１樹脂枠に対応する形状の空洞を形成し、該空洞に樹脂を充填することを含む請求項９に記載の発光装置の製造方法。   In the first resin frame forming step, a mold having a second convex portion is arranged so that an upper surface of the second convex portion is in contact with an upper surface of the convex portion, and the periphery of the convex portion and the second convex portion is arranged. The method for manufacturing a light emitting device according to claim 9, further comprising: forming a cavity having a shape corresponding to the first resin frame, and filling the cavity with a resin. 第１樹脂枠形成工程は、
前記プレート表面に、前記第１反射部材用の第１樹脂層を形成する第１樹脂層形成工程と、
前記第１樹脂層を硬化させた後、硬化させた第１樹脂層において前記凸部上に開口部を形成する開口部形成工程と、
を含む請求項９に記載の発光装置の製造方法。 The first resin frame forming step
A first resin layer forming step of forming a first resin layer for the first reflecting member on the plate surface;
An opening forming step of forming an opening on the convex portion in the cured first resin layer after curing the first resin layer;
The manufacturing method of the light-emitting device of Claim 9 containing this. 前記第２樹脂は蛍光体粒子を含み、該蛍光体粒子をベースプレート側に沈降させる沈降工程を、前記第２樹脂を硬化させる前に含む請求項９〜１１のいずれかに記載の発光装置の製造方法。   The light emitting device according to any one of claims 9 to 11, wherein the second resin includes phosphor particles, and includes a sedimentation step of precipitating the phosphor particles toward the base plate before the second resin is cured. Method. 前記沈降工程において、前記蛍光体粒子を遠心沈降させる請求項１２記載の発光装置の製造方法。   The method for manufacturing a light emitting device according to claim 12, wherein, in the sedimentation step, the phosphor particles are centrifugally sedimented. 前記第２樹脂を硬化させた後、前記ベースプレート剥離工程前に、前記第２樹脂の上面を研削する工程を含む請求項９〜１３のいずれかに記載の発光装置の製造方法。   The method for manufacturing a light emitting device according to any one of claims 9 to 13, further comprising a step of grinding an upper surface of the second resin after the second resin is cured and before the base plate peeling step. 前記ベースプレート剥離工程の前に、前記第２樹脂の上面から前記第１樹脂層の上面にわたってシートを添付する工程を含む請求項９〜１４のいずれかに記載の発光装置の製造方法。   The method for manufacturing a light emitting device according to claim 9, further comprising a step of attaching a sheet from the upper surface of the second resin to the upper surface of the first resin layer before the base plate peeling step. 前記発光素子は、光透過部材と反対側の面に電極を有し、
前記塗布された第３樹脂を硬化させた後に、硬化した第３樹脂の表面を研削し、前記発光素子の電極を露出させる工程を含む請求項９〜１５のいずれかに記載の発光装置の製造方法。 The light emitting element has an electrode on a surface opposite to the light transmitting member,
The manufacturing of the light-emitting device according to claim 9, further comprising a step of grinding the surface of the cured third resin and exposing an electrode of the light-emitting element after curing the applied third resin. Method.
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