JP2019177400A - Plate thickness control method and device of metal plate, and method and equipment for manufacturing metal plate - Google Patents

Plate thickness control method and device of metal plate, and method and equipment for manufacturing metal plate Download PDF

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JP2019177400A
JP2019177400A JP2018068572A JP2018068572A JP2019177400A JP 2019177400 A JP2019177400 A JP 2019177400A JP 2018068572 A JP2018068572 A JP 2018068572A JP 2018068572 A JP2018068572 A JP 2018068572A JP 2019177400 A JP2019177400 A JP 2019177400A
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plate thickness
thickness
gauge
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plate
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JP6781411B2 (en
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開 小玉
Kai Kodama
開 小玉
太基 宮野
Taiki Miyano
太基 宮野
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JFE Steel Corp
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Abstract

To shorten a time until a monitoring AGC is stabilized and stably improves plate thickness precision even in a control system of a long conveyance time (dead time) between a plate thickness meter and a rolling machine.SOLUTION: A plate thickness control method of a metal plate calculates a plate thickness at a reducing point when drafting a metal plate with a rolling machine as a gauge meter plate thickness from a gauge meter equation, tracks the gauge meter plate thickness up to a measurement point of a plate thickness meter installed on a rear surface of the rolling machine and dynamically controls a draft position on the rolling machine such that a target plate thickness is provided by setting a difference between deviation from a plate thickness measured by the plate thickness meter at the measurement point to a tracked gauge meter plate thickness and deviation from gauge meter plate thickness at the reducing point and the target plate thickness as a monitoring operation amount. Therein, the draft position on the rolling machine is dynamically controlled such that target plate thickness is provided by setting the index-smoothed monitoring operation amount as a difference between deviation from the plate thickness measured by the plate thickness meter at the measurement point and the tracked gauge meter plate thickness and deviation from the gauge meter plate thickness at the reducing point to the target plate thickness as a monitoring operation amount after correction.SELECTED DRAWING: Figure 1

Description

本発明は、自動板厚制御（ＡＧＣ：Ａｕｔｏｍａｔｉｃ Ｇａｇｅ Ｃｏｎｔｒｏｌ）を用いた金属板の板厚制御方法および装置並びに金属板の製造方法および設備に関する。   The present invention relates to a metal plate thickness control method and apparatus using automatic plate thickness control (AGC), and a metal plate manufacturing method and equipment.

ＡＧＣの一つにモニタリングＡＧＣがある。モニタリングＡＧＣは、金属板を圧延機で圧延するにあたり、圧延機で圧延された金属板の出側板厚を板厚計で実測し、測定された出側板厚と目標板厚との偏差がゼロになるようにフィードバック制御により圧延機のロールギャップを制御する制御方式である。   One of AGC is monitoring AGC. When the monitoring AGC rolls a metal plate with a rolling mill, the thickness of the exit side of the metal plate rolled with the rolling mill is measured with a thickness gauge, and the deviation between the measured exit side thickness and the target thickness is zero. In this way, the roll gap of the rolling mill is controlled by feedback control.

モニタリングＡＧＣの制御ゲインが小さいときには、実板厚が目標板厚に収束するまでの時間が長く、制御ゲインが大きいときにはハンチングを生じて板厚精度が悪化する。また従来の方法では、圧延点から板厚計までの搬送時間（制御系のむだ時間）によって生じる、圧下点での板厚と板厚計で測定した板厚のずれにより適正な制御量が算出されず板厚精度が悪化するおそれがある。   When the control gain of the monitoring AGC is small, the time until the actual plate thickness converges to the target plate thickness is long. When the control gain is large, hunting occurs and the plate thickness accuracy deteriorates. In the conventional method, an appropriate control amount is calculated based on the difference between the plate thickness at the reduction point and the plate thickness measured by the plate thickness meter, which is caused by the transfer time from the rolling point to the plate thickness meter (dead time of the control system). Otherwise, the plate thickness accuracy may be deteriorated.

モニタリングＡＧＣの制御ゲインの向上、制御開始タイミングの早期化を図るため、スミス補償器を追加してむだ時間を補償する試みがある。図４（ａ）に通常のフィードバック制御系の構成を示し、図４（ｂ）にスミス補償法のフィードバック制御系の構成を示す。スミス補償器を追加することで、むだ時間ｅ-Ｌｐ・ｓを制御ループの外側に出して一次遅れ系として制御することが可能となる。 There is an attempt to compensate for the dead time by adding a Smith compensator in order to improve the control gain of the monitoring AGC and speed up the control start timing. FIG. 4A shows the configuration of a normal feedback control system, and FIG. 4B shows the configuration of the Smith control method feedback control system. By adding a Smith compensator, it is possible to control the dead time e −Lp · s outside the control loop as a first-order lag system.

例えば特許文献１には、金属板の先端が圧延機到達後から圧延機の後面側に設置された板厚計に達するまでは、ゲージメータ式で推定した板厚が目標板厚となるように圧下位置を制御し、金属板の先端が板厚計に達した後は、板厚計で検出した板厚と検出点における圧延時の目標板厚との差分で補正したゲージメータ式で推定した板厚が目標板厚となるように圧下位置を制御し、金属板の先端が板厚計に達したときの圧延点が板厚計に達した後は、板厚計で検出した板厚を用いる板厚制御方法が開示されている。   For example, Patent Document 1 discloses that the plate thickness estimated by the gauge meter method is the target plate thickness until the tip of the metal plate reaches the plate thickness meter installed on the rear side of the rolling mill after reaching the rolling mill. After controlling the reduction position and the tip of the metal plate reached the thickness gauge, it was estimated by a gauge meter formula corrected by the difference between the thickness detected by the thickness gauge and the target thickness at the time of rolling at the detection point. The reduction position is controlled so that the plate thickness becomes the target plate thickness, and after the rolling point reaches the plate thickness meter when the tip of the metal plate reaches the plate thickness meter, the plate thickness detected by the plate thickness meter is A plate thickness control method to be used is disclosed.

ところが、スミス補償器をモニタリングＡＧＣに追加して実機による圧延試験を行ったところ、その試験結果を図５に示すように、モニタリングＡＧＣによる圧延機の操作量が不安定となり、それに伴い狙い厚偏差が増大することが判明した。なお、図５（ａ）中縦軸はモニタリングＡＧＣの操作量であり、横軸は板長手方向の位置である。また、図５（ｂ）中縦軸は出側板厚の狙い厚からの偏差であり、横軸は板長手方向の位置であって図中左側が噛み込み端である。   However, when the Smith compensator was added to the monitoring AGC and a rolling test was performed using an actual machine, the test results showed that the operation amount of the rolling mill by the monitoring AGC became unstable, and the target thickness deviation was accompanied accordingly. Was found to increase. In FIG. 5A, the vertical axis represents the operation amount of the monitoring AGC, and the horizontal axis represents the position in the longitudinal direction of the plate. In FIG. 5B, the vertical axis represents the deviation of the outlet side plate thickness from the target thickness, the horizontal axis represents the position in the plate longitudinal direction, and the left side in the drawing is the biting end.

特開昭６１−８６０１９号公報JP-A-61-86019

本発明の目的は、モニタリングＡＧＣが安定するまでの時間を短くし、板厚計および圧延機間の搬送時間（むだ時間）が長い制御系においても安定して板厚精度を向上させることにある。   An object of the present invention is to shorten the time until the monitoring AGC is stabilized, and to stably improve the thickness accuracy even in a control system having a long conveying time (dead time) between the thickness gauge and the rolling mill. .

本発明者らは、上記課題を解決するため、スミス補償器を実機に導入した際にモニタリングＡＧＣが不安定になる原因について鋭意研究を行った。スミス補償法は、制御対象のむだ時間の正確な同定を前提とするが、実際の操業では、シミュレーションとは異なり板厚計の誤差、先進率の変動に起因するトラッキング誤差、ゲージメータ板厚と実際の板厚との誤差等の外乱が生じるため制御が不安定になる。本発明では、スミス補償法をモニタリングＡＧＣに適用するのに加えて指数平滑化処理を導入したことで非常に良好な制御が得られた。   In order to solve the above-mentioned problems, the present inventors have intensively studied the cause of the unstable monitoring AGC when the Smith compensator is introduced into an actual machine. The Smith compensation method is premised on the accurate identification of the dead time of the controlled object. However, in actual operation, unlike the simulation, the error of the thickness gauge, the tracking error due to the fluctuation of the advance rate, the gauge meter thickness Since disturbance such as an error from the actual plate thickness occurs, the control becomes unstable. In the present invention, very good control was obtained by introducing an exponential smoothing process in addition to applying the Smith compensation method to monitoring AGC.

具体的には、本発明の第１の態様は、金属板を圧延機で圧下する際の圧下点での板厚をゲージメータ式からゲージメータ板厚として算出し、該ゲージメータ板厚を前記圧延機の後面に設置された板厚計の測定点までトラッキングし、前記測定点において前記板厚計で測定した板厚と前記トラッキングした前記ゲージメータ板厚との偏差と、前記圧下点での前記ゲージメータ板厚と目標板厚との偏差との差分をモニタリング操作量として、前記目標板厚になるように前記圧縮機における圧下位置をダイナミックに制御する金属板の板厚制御方法であって、前記測定点において前記板厚計で測定した板厚と前記トラッキングした前記ゲージメータ板厚との偏差と、前記圧下点での前記ゲージメータ板厚と目標板厚との偏差との差分である前記モニタリング操作量を指数平滑化したものを補正後のモニタリング操作量として、前記目標板厚になるように前記圧縮機における圧下位置をダイナミックに制御する金属板の板厚制御方法である。   Specifically, in the first aspect of the present invention, the thickness at the reduction point when the metal plate is reduced by a rolling mill is calculated as a gauge meter plate thickness from a gauge meter type, and the gauge meter plate thickness is calculated as described above. Tracking to the measurement point of the thickness gauge installed on the rear surface of the rolling mill, the deviation between the thickness measured by the thickness gauge at the measurement point and the gauge thickness measured by the gauge meter, and at the reduction point A metal plate thickness control method for dynamically controlling a reduction position in the compressor so as to be the target plate thickness, using a difference between the gauge meter thickness and a deviation between the target plate thickness as a monitoring operation amount. The difference between the plate thickness measured by the plate thickness meter at the measurement point and the gauge meter plate thickness tracked and the deviation between the gauge meter plate thickness and the target plate thickness at the reduction point Moni As monitoring the operation amount of the corrected those exponential smoothing ring operation amount, a pressing position in the compressor such that the target thickness is a thickness control method for a metal plate for controlling dynamically.

本発明の第２の態様は、本発明の第１の態様において、前記ゲージメータ板厚の算出周期と前記板厚計の測定周期とを同じに設定する金属板の板厚制御方法である。   According to a second aspect of the present invention, there is provided a metal plate thickness control method according to the first aspect of the present invention, wherein the calculation cycle of the gauge meter plate thickness and the measurement cycle of the plate thickness meter are set to be the same.

本発明の第３の態様は、本発明の第１または第２の態様の金属板の板厚制御方法を用いて金属板を圧延することを特徴とする金属板の製造方法である。   According to a third aspect of the present invention, there is provided a metal plate manufacturing method comprising rolling a metal plate using the metal plate thickness control method according to the first or second aspect of the present invention.

本発明の第４の態様は、金属板を圧延機で圧下する際の圧下点での板厚をゲージメータ式からゲージメータ板厚として算出し、該ゲージメータ板厚を前記圧延機の後面に設置された板厚計の測定点までトラッキングし、前記測定点において前記板厚計で測定した板厚と前記トラッキングした前記ゲージメータ板厚との偏差と、前記圧下点での前記ゲージメータ板厚と目標板厚との偏差との差分をモニタリング操作量として、前記目標板厚になるように前記圧縮機における圧下位置をダイナミックに制御する金属板の板厚制御装置であって、前記測定点において前記板厚計で測定した板厚と前記トラッキングした前記ゲージメータ板厚との偏差と、前記圧下点での前記ゲージメータ板厚と目標板厚との偏差との差分である前記モニタリング操作量を指数平滑化により補正する指数平滑回路を備える金属板の板厚制御装置である。   According to a fourth aspect of the present invention, the thickness at the reduction point when the metal plate is reduced by a rolling mill is calculated as a gauge meter thickness from a gauge meter type, and the gauge meter thickness is applied to the rear surface of the rolling mill. Tracking to the measurement point of the installed thickness gauge, the deviation between the thickness measured by the thickness gauge at the measurement point and the gauge thickness measured by the gauge meter, and the gauge meter thickness at the reduction point A plate thickness control device for a metal plate that dynamically controls a reduction position in the compressor so as to be the target plate thickness, using a difference between a deviation from the target plate thickness as a monitoring operation amount, and at the measurement point The monitoring operation, which is a difference between a deviation between the plate thickness measured by the plate thickness meter and the tracked gauge meter plate thickness, and a deviation between the gauge meter plate thickness and the target plate thickness at the reduction point A plate thickness control apparatus for a metal plate with an exponential smoothing circuit for correcting the exponential smoothing.

本発明の第５の態様は、本発明の第４の態様において、前記ゲージメータ板厚の算出周期と前記板厚計の測定周期とを同じに設定する金属板の板厚制御装置である。   A fifth aspect of the present invention is the metal plate thickness control apparatus according to the fourth aspect of the present invention, wherein the calculation cycle of the gauge meter plate thickness and the measurement cycle of the plate thickness meter are set to be the same.

本発明の第６の態様は、金属板を圧延する圧延機と、本発明の第４または第５の態様の金属板の板厚制御装置とを備える金属板の製造設備である。   According to a sixth aspect of the present invention, there is provided a metal plate manufacturing facility comprising a rolling mill for rolling a metal plate and the metal plate thickness control device according to the fourth or fifth aspect of the present invention.

本発明によれば、指数平滑回路によってモニタリング操作量の急激な変化が抑制されるため、圧下点と板厚計間の距離およびモニタリングＡＧＣの操作量のゲインの大小にかかわらず、実板厚が目標板厚に円滑にかつ早く収束する。また、指数平滑定数（ゲイン）を調整することでモニタリングＡＧＣの応答性を調整することも可能になる。   According to the present invention, since the exponential smoothing circuit suppresses a rapid change in the monitoring operation amount, the actual plate thickness can be reduced regardless of the distance between the reduction point and the thickness gauge and the gain of the operation amount of the monitoring AGC. It converges smoothly and quickly to the target thickness. It is also possible to adjust the responsiveness of the monitoring AGC by adjusting the exponential smoothing constant (gain).

本発明の一実施形態の板厚制御方法および装置を適用した金属板の製造設備の要部概略構成図である。It is a principal part schematic block diagram of the manufacturing equipment of the metal plate to which the plate | board thickness control method and apparatus of one Embodiment of this invention are applied. 本発明の実施形態の板厚制御装置のブロック線図である。It is a block diagram of the plate | board thickness control apparatus of embodiment of this invention. （ａ）は、本発明の実施例による自動板厚制御を行ったときの、指数平滑回路で補正されたモニタリングＡＧＣの操作量の変位を示すグラフであり、（ｂ）は、そのときの狙い厚に対する板厚偏差を示すグラフである。(A) is a graph which shows the displacement of the operation amount of the monitoring AGC correct | amended by the exponential smoothing circuit at the time of performing automatic board thickness control by the Example of this invention, (b) is the aim at that time It is a graph which shows the plate | board thickness deviation with respect to thickness. （ａ）は通常のフィードバック制御系の構成を示すブロック線図であり、（ｂ）はスミス法を導入したフィードバック制御系の構成を示すブロック線図である。(A) is a block diagram which shows the structure of a normal feedback control system, (b) is a block diagram which shows the structure of the feedback control system which introduced the Smith method. 従来の自動板厚制御を行った場合のモニタリングＡＧＣの操作量の板厚方向での変位を示すグラフであり、（ｂ）は、そのときの狙い厚に対する板厚偏差を示すグラフである。It is a graph which shows the displacement in the plate | board thickness direction of the operation amount of monitoring AGC at the time of performing the conventional automatic plate | board thickness control, (b) is a graph which shows the plate | board thickness deviation with respect to the target thickness at that time.

以下、モニタリングＡＧＣを用いた本発明の金属板の板厚制御方法および装置並びに金属板の製造方法および設備の一実施形態について図面を参照しながら説明する。図１は、本実施形態の板厚制御方法および装置を適用した金属板の製造設備の要部概略構成図である。この製造設備は、鋼板等の金属板を圧延する圧延機１を備える。圧延機１は、上下のワークロール１ａ，１ｂと上下のバックアップロール１ｃ，１ｄを備える。本実施形態の製造設備の例では、図の左側から鋼板等の金属板が搬送され、圧延機１によって図の左側から右側へ目標板厚となるよう圧延される。所定板厚に圧延された金属板は図の右側に設けられた図示しない後工程に搬送される。圧延機は可逆式、非可逆式のどちらでもよい。図１中、ｈＧＭ（ＴＲＫ）は後述するトラッキングしたゲージメータ板厚を示し、ΔｈＧＭは測定板厚ｈγとトラッキングしたゲージメータ板厚ｈＧＭ（ＴＲＫ）との偏差と、圧下点でのゲージメータ板厚ｈＧＭ（圧下点）と目標板厚ｈ０との偏差と、の差を示し、ΔＳは基準ギャップと実績ギャップの差を示す。 Hereinafter, an embodiment of a metal plate thickness control method and apparatus, a metal plate manufacturing method and equipment of the present invention using monitoring AGC will be described with reference to the drawings. FIG. 1 is a schematic configuration diagram of a main part of a metal plate manufacturing facility to which the plate thickness control method and apparatus of this embodiment are applied. This manufacturing equipment includes a rolling mill 1 for rolling a metal plate such as a steel plate. The rolling mill 1 includes upper and lower work rolls 1a and 1b and upper and lower backup rolls 1c and 1d. In the example of the manufacturing facility of the present embodiment, a metal plate such as a steel plate is conveyed from the left side of the drawing and is rolled by the rolling mill 1 from the left side to the right side of the drawing so as to have a target plate thickness. The metal plate rolled to a predetermined plate thickness is conveyed to a post process (not shown) provided on the right side of the drawing. The rolling mill may be either reversible or irreversible. In FIG. 1, h GM (TRK) indicates a gauge gauge plate thickness that will be described later, and Δh GM indicates a deviation between a measured plate thickness h γ and a tracked gauge meter plate thickness h GM (TRK) , and a reduction point. The difference between the gauge meter plate thickness h GM (reduction point) and the target plate thickness h 0 is shown, and ΔS shows the difference between the reference gap and the actual gap.

本実施形態における金属板の板厚制御装置は、圧延機１の後面側に配置され、金属板の出側板厚を実測するγ線板厚計等の板厚計２と、上下のワークロール１ａ，１ｂ間の開度、つまり圧下位置を調整する例えば油圧シリンダからなる開度変更機構３と、圧下時の圧延荷重Ｐを測定する荷重計（ロードセル）４と、ワークロール１ａ，１ｂによる圧下位置を検出する圧下位置検出器５と、モニタリング制御器６と、板厚制御器７とを備え、圧延機１にて測定した圧延荷重Ｐおよびロール開度に基づき推定したゲージメータ板厚ｈＧＭを用いて板厚制御を行うゲージメータＡＧＣと、板厚計２による測定板厚ｈγを用いて板厚制御を行うモニタリングＡＧＣとを併用したものある。 The plate thickness control device for the metal plate in the present embodiment is arranged on the rear surface side of the rolling mill 1 and is a plate thickness meter 2 such as a γ-ray plate thickness meter for actually measuring the exit side plate thickness of the metal plate, and the upper and lower work rolls 1a. , 1b, that is, an opening changing mechanism 3 comprising, for example, a hydraulic cylinder for adjusting the rolling position, a load meter (load cell) 4 for measuring the rolling load P during rolling, and a rolling position by the work rolls 1a, 1b A rolling position detector 5, a monitoring controller 6, and a sheet thickness controller 7, and a gauge meter plate thickness h GM estimated on the basis of the rolling load P and the roll opening measured by the rolling mill 1. The gauge meter AGC that controls the thickness using the gauge AGC and the monitoring AGC that controls the thickness using the thickness h γ measured by the thickness gauge 2 are used together.

図２に、板厚制御系のブロック線図を示す。なお、図中、「ｈ」は出側板厚（実板厚）、「Ｓ」はロール開度（最終的なワークロール１ａ，１ｂ間のギャップ）、「Ｐ」は圧延荷重（実荷重）、「Ｋ」はミル定数、「Ｋｍ」は予測ミル定数、「Ｍ」は塑性定数、「Ｋｇ」は制御ゲイン、「α」はチューニング率、「ｈγ」は測定板厚（実厚）、「ＰＩ」はＰＩ制御コントローラ、「Ｓａｇｃ−ｍｏｎ」はモニタリングＡＧＣ後の指示ギャップ、「Ｓａｇｃ−ａｇ」はゲージメータＡＧＣの操作量、また、図中、文字または記号に付された「０」は目標値を、「Δ」は偏差をそれぞれ表す。また、図中の符号９は、ロール開度Ｓから圧延荷重Ｐを逆算する圧延荷重演算部であり、符号１０は、ゲージメータＡＧＣ操作量演算部であり、符号１１は、ゲージメータ厚演算部、符号１２は、測定板厚ｈγとトラッキングしたゲージメータ厚ｈＧＭ（ＴＲＫ）との差を生成する加算部であり、符号１３は、測定板厚ｈγとトラッキングしたゲージメータ厚ｈＧＭ（ＴＲＫ）との差と、圧下点でのゲージメータ厚ｈＧＭ（圧下点）と目標板厚ｈ０との差との偏差を生成する加算部であり、符号１４は、モニタリング操作量とロール開度の目標Ｓ０との差を生成する加算部である。 FIG. 2 shows a block diagram of the plate thickness control system. In the figure, “h” is the delivery side plate thickness (actual plate thickness), “S” is the roll opening (the gap between the final work rolls 1a and 1b), “P” is the rolling load (actual load), “K” is the mill constant, “Km” is the predicted mill constant, “M” is the plastic constant, “Kg” is the control gain, “α” is the tuning rate, “h γ ” is the measured plate thickness (actual thickness), “ “PI” is the PI controller, “S agc-mon ” is the indication gap after monitoring AGC, “S agc-ag ” is the manipulated variable of the gauge meter AGC, and “0” added to the letter or symbol in the figure Represents a target value, and “Δ” represents a deviation. Reference numeral 9 in the figure denotes a rolling load calculation unit that reversely calculates the rolling load P from the roll opening S, reference numeral 10 denotes a gauge meter AGC operation amount calculation unit, and reference numeral 11 denotes a gauge meter thickness calculation unit. Reference numeral 12 denotes an adding unit that generates a difference between the measured thickness h γ and the tracked gauge meter thickness h GM (TRK), and reference numeral 13 denotes a measured gauge thickness h γ and the tracked gauge meter thickness h GM ( TRK) is an addition unit that generates a deviation between the difference between the gauge meter thickness h GM (the reduction point) and the target plate thickness h 0 at the reduction point. an addition unit for generating a difference between the target S 0 degrees.

まず、ゲージメータＡＧＣについて説明する。塑性変動や入側板厚変動によって荷重変動（図中ΔＰで示す差荷重）が生じると、ゲージメータ式の考え方に従い出側板厚変動は、ミル定数Ｋを用いて以下の（１）式のよう表される。
Δｈ＝ΔＰ／Ｋ ・・・・・（１）
この出側板厚変動Δｈを、開度操作により補償するのがゲージメータＡＧＣの考え方であり、補償量Ｓａｇｃ−ａｇは、荷重変動ΔＰ、チューニング率α、および予想ミル定数Ｋｍを用いて以下の（２）式となる。なお、チューニング率αは０≦α≦１の範囲の値をもち、いわゆる制御ゲインと呼ばれるものである。
Ｓａｇｃ−ａｇ＝α・ΔＰ／Ｋｍ ・・・・・（２）
すなわち、ゲージメータＡＧＣでは、荷重の増加に対してワークロール１ａ，１ｂを閉めこむよう補償することで板厚変動が除去される。 First, the gauge meter AGC will be described. When load fluctuations (differential load indicated by ΔP in the figure) occur due to plastic fluctuations or inlet side board thickness fluctuations, the outlet side board thickness fluctuations are expressed as shown in the following formula (1) using the mill constant K in accordance with the gauge meter concept. Is done.
Δh = ΔP / K (1)
The gauge meter AGC is designed to compensate for the outlet thickness variation Δh by opening operation. The compensation amount S agc-ag is calculated using the load variation ΔP, the tuning rate α, and the expected mill constant Km as follows: (2) The tuning rate α has a value in a range of 0 ≦ α ≦ 1, and is called a so-called control gain.
S agc−ag = α · ΔP / Km (2)
That is, in the gauge meter AGC, the plate thickness variation is removed by compensating the work rolls 1a and 1b to be closed against an increase in load.

これに対して、モニタリングＡＧＣは、板厚計２による測定板厚ｈγと目標板厚ｈ０の差を操作量として用い、比例積分制御により板厚を補償する。ゲージメータＡＧＣではゲージメータ式の誤差により板厚を狙い厚に正確に制御することは困難であるが、モニタリングＡＧＣでは実測した板厚をフィードバックするため、狙い厚偏差の除去に大きく寄与することができる。しかし、モニタリングＡＧＣの問題点は、圧延機１による圧下点と板厚計２の測定点とのずれにより生じる搬送時間遅れによって制御系にむだ時間が発生することである。そこで本実施形態では、スミス補償器を追加してむだ時間を補償する。スミス補償器では動特性モデルを用いることでプロセスの活動を予測して制御を行うが、本実施形態ではこの動特性モデルとしてゲージメータ式を用いる。ゲージメータ板厚ｈＧＭは、ミル定数Ｋを用いて、以下の（３）式のように表される。
なお、βはゲージメータ厚補正項である。
ｈＧＭ＝Ｐ／Ｋ＋Ｓ０＋β・・・・（３） In contrast, monitoring the AGC, using a difference between the measured thickness h gamma and target thickness h 0 by thickness gauge 2 as the operation amount, a proportional integral control to compensate for the thickness. Gauge meter AGC makes it difficult to accurately control the thickness with the gauge meter type error, but monitoring AGC feeds back the measured thickness, which greatly contributes to the removal of the targeted thickness deviation. it can. However, the problem of monitoring AGC is that a dead time is generated in the control system due to a conveyance time delay caused by a deviation between the reduction point of the rolling mill 1 and the measurement point of the thickness gauge 2. Therefore, in this embodiment, a Smith compensator is added to compensate for the dead time. The Smith compensator performs control by predicting process activity by using a dynamic characteristic model. In this embodiment, a gauge meter type is used as the dynamic characteristic model. The gauge meter plate thickness h GM is expressed by the following equation (3) using the mill constant K.
Β is a gauge meter thickness correction term.
h GM = P / K + S 0 + β (3)

また、図２のブロック線図中の「ｅ-Ｌｓ」は圧延機１から板厚計２までの搬送時間遅れによって生じるむだ時間であり、実際には圧下点でのゲージメータ板厚ｈＧＭを板厚計２の位置までトラッキングするトラッキング部である。このため、スミス補償器を導入する際には先進率の変動によるトラッキング誤差やゲージメータ誤差等が生じ、モニタリングＡＧＣの操作量が不安定となるおそれがある。そこで、本実施形態の板厚制御装置は、圧下点からトラッキングしたゲージメータ板厚ｈＧＭ（ＴＲＫ）と板厚計２で実測した測定板厚ｈγとの差と、圧下点でのゲージメータ板厚ｈＧＭ（圧下点）と目標板厚ｈ０との差とを補償すべきモニタリング操作量とする場合に、該モニタリング操作量を指数平滑化により補正し、その値を板厚制御器７に補正後のモニタリング操作量として加える指数平滑回路８を備える。指数平滑回路８は図２中の加算部１３の後に配置してもよい。指数平滑回路８による処理は以下の（４）式により表される。
出力ｉ＝ａ×入力ｉ＋（１−ａ）×出力ｉ−１・・・・（４）
なお、入力ｉは指数平滑回路に入力される補正前のモニタリング操作量であり、出力ｉは指数平滑回路から出力された指数平滑化により補正されたモニタリグ操作量であり、出力ｉ−１は前回出力値である。また、ａは平滑定数であり、０＜ａ＜１の範囲の値をもつ。平滑定数ａが大きいと、入力値への重みづけが大きくなるので平滑化の程度が低くなり、平滑定数ａが小さいと前回出力値に対する重みづけが大きくなるので平滑化の程度は大きくなる。トラッキング誤差やゲージメータ誤差等は圧延機毎に異なることから最適な平滑定数ａは圧延機毎に異なるが、発明者らの研究により、ａを例えば０．０２〜０．１０の範囲することでモニタリングＡＧＣのモニタリング操作量を概ね安定化させることができることが判った。 Further, “e −Ls ” in the block diagram of FIG. 2 is a dead time caused by a delay in the conveyance time from the rolling mill 1 to the plate thickness gauge 2, and actually the gauge meter plate thickness h GM at the reduction point is calculated. It is a tracking unit that tracks to the position of the thickness gauge 2. For this reason, when a Smith compensator is introduced, a tracking error, a gauge meter error, or the like due to a change in the advance rate may occur, and the operation amount of the monitoring AGC may become unstable. Therefore, the plate thickness control apparatus according to the present embodiment has a difference between the gauge meter plate thickness h GM (TRK) tracked from the reduction point and the measured plate thickness h γ measured by the plate thickness meter 2, and the gauge meter at the reduction point. When the difference between the plate thickness h GM (the reduction point) and the target plate thickness h 0 is set as a monitoring operation amount to be compensated, the monitoring operation amount is corrected by exponential smoothing, and the value is corrected by the plate thickness controller 7. Is provided with an exponential smoothing circuit 8 added as a monitoring operation amount after correction. The exponential smoothing circuit 8 may be arranged after the adding unit 13 in FIG. Processing by the exponential smoothing circuit 8 is expressed by the following equation (4).
Output i = a × input i + (1-a) × output i−1 (4)
The input i is the monitoring operation amount before correction input to the exponential smoothing circuit, the output i is the monitoring rigging operation amount corrected by exponential smoothing output from the exponential smoothing circuit, and the output i-1 is the previous time. Output value. Further, a is a smoothing constant and has a value in the range of 0 <a <1. When the smoothing constant a is large, the weighting to the input value is large, so the degree of smoothing is low, and when the smoothing constant a is small, the weighting to the previous output value is large, so the degree of smoothing is large. Since the tracking error, gauge meter error, etc. are different for each rolling mill, the optimum smoothing constant a is different for each rolling mill, but by the inventors' research, a is set in the range of 0.02 to 0.10, for example. It was found that the monitoring operation amount of the monitoring AGC can be generally stabilized.

また、圧下点でのゲージメータ板厚ｈＧＭ（圧下点）の算出周期と板厚計２のサンプリング周期とが不一致であると制御量悪化の要因にもなり得ることから、本実施形態のように、板厚計のサンプリング周期を調整するサンプリング周期調整部１５を備えることが好ましい。このサンプリング周期調整部１５は、板厚計２による板厚ｈγのサンプリング周期を圧下点でのゲージメータ板厚ｈＧＭ（圧下点）の算出周期と同じにする機能を有する。 Further, if the calculation period of the gauge meter thickness h GM (the reduction point) at the reduction point and the sampling period of the plate thickness meter 2 do not coincide with each other, it may cause a control amount deterioration. In addition, it is preferable to include a sampling period adjustment unit 15 that adjusts the sampling period of the thickness gauge. The sampling cycle adjusting unit 15 has a function of making the sampling cycle of the plate thickness h γ by the plate thickness meter 2 the same as the calculation cycle of the gauge meter plate thickness h GM (the rolling point) at the rolling point .

以上説明したように、モニタリングＡＧＣにおけるモニタリング操作量を指数平滑化により補正することでモニタリングＡＧＣのモニタリング操作量を安定化させ板内変動を抑制することができる。また、圧下点でのゲージメータ板厚の算出周期と板厚計のサンプリング周期とを同じにすることで板内変動をさらに抑制することが可能にある。   As described above, by correcting the monitoring operation amount in the monitoring AGC by exponential smoothing, it is possible to stabilize the monitoring operation amount of the monitoring AGC and suppress the fluctuation in the plate. Further, by making the calculation cycle of the gauge meter plate thickness at the reduction point the same as the sampling cycle of the plate thickness meter, fluctuations in the plate can be further suppressed.

実施例として、図１，２に示した圧延機および板厚制御装置を用いて、金属板として厚み１０ｍｍの鋼板を目標板厚８ｍｍとなるよう圧延を行った。板厚計にはγ線板厚計を用いた。本実施例では、板厚計のサンプリング周期を１００ｍｍ間隔とするとともに、圧下点の圧延荷重Ｐおよび圧下点でのゲージメータ板厚ｈＧＭを１００ｍｍ間隔でトラッキングし、トラッキング点が板厚計に達した際に板厚計の測定板厚ｈγとトラッキングしたゲージメータ板厚ｈＧＭ（ＴＲＫ）との差を求め、この差と、圧下点でのゲージメータ板厚ｈＧＭ（圧下点）および目標板厚ｈ０間の差との偏差をモニタリング操作量として目標板厚になるように前記圧縮機における圧下位置をダイナミックに制御する際に、このモニタリング操作量を指数平滑回路で指数平滑化して補正し、その補正後の値を板厚制御器にモニタリング操作量として加えた。指数平滑回路の平滑定数は０．０４とした。また、板厚制御装置における主な条件は、ミル定数９００ton/mm、予測ミル定数９５０ton/mm、および塑性定数１５００ton/mmとした。 As an example, using a rolling mill and a plate thickness control device shown in FIGS. 1 and 2, a steel plate having a thickness of 10 mm was rolled as a metal plate to a target plate thickness of 8 mm. A gamma ray thickness gauge was used as the thickness gauge. In this embodiment, the sampling cycle of the thickness gauge is set at an interval of 100 mm, the rolling load P at the reduction point and the gauge meter thickness h GM at the reduction point are tracked at an interval of 100 mm, and the tracking point reaches the thickness gauge. The difference between the measured thickness h γ of the thickness gauge and the tracked gauge meter thickness h GM (TRK) is obtained, and this difference, the gauge meter thickness h GM (reduction point) at the reduction point, and the target in controlling pressing position in the compressor dynamically so that the deviation of the difference between the plate thickness h 0 to a target thickness as monitoring the operation amount, the correction by exponential smoothing the monitoring operation amount by an exponential smoothing circuit Then, the corrected value was added to the plate thickness controller as a monitoring operation amount. The smoothing constant of the exponential smoothing circuit was 0.04. The main conditions in the plate thickness control apparatus were a mill constant of 900 ton / mm, a predicted mill constant of 950 ton / mm, and a plastic constant of 1500 ton / mm.

本実施例による自動板厚制御を行った場合のモニタリングＡＧＣの、指数平滑回路で補正されたモニタリング操作量（図中「モニタ操作量」または「モニタリングＡＧＣ操作量」と記載する。）を図３（ａ）に、狙い厚に対する板厚偏差（図中「γ厚偏差」または「狙い厚偏差」と記載する。）を図３（ｂ）にそれぞれ示す。このように、本発明を適用することで、モニタリングＡＧＣのモニタリング操作量が安定し、狙い厚に対する板厚偏差が早期に収束することが確認された。   FIG. 3 shows the monitoring operation amount of the monitoring AGC corrected by the exponential smoothing circuit when automatic plate thickness control is performed according to this embodiment (referred to as “monitor operation amount” or “monitoring AGC operation amount” in the figure). FIG. 3 (b) shows the plate thickness deviation with respect to the target thickness (described as “γ thickness deviation” or “target thickness deviation” in the figure). Thus, by applying this invention, it was confirmed that the amount of monitoring operation of monitoring AGC was stabilized, and the plate | board thickness deviation with respect to target thickness converged at an early stage.

本発明により、モニタリングＡＧＣが安定するまでの時間を短くし、板厚計および圧延機間の搬送時間（むだ時間）が長い制御系においても安定して板厚精度を向上させることが可能となった。   According to the present invention, it is possible to shorten the time until the monitoring AGC is stabilized, and to stably improve the thickness accuracy even in a control system having a long conveying time (dead time) between the thickness gauge and the rolling mill. It was.

１ 圧延機
１ａ，１ｂ ワークロール
１ｃ，１ｄ バックアップロール
２ 板厚計
３ 開度変更機構
４ 荷重計
５ 圧下位置検出器
６ モニタリング制御器
７ 板厚制御器
８ 指数平滑回路
９ 圧延荷重演算部
１０ ゲージメータＡＧＣ操作量演算部
１１ ゲージメータ厚演算部
１２，１３，１４ 加算部
１５ サンプリング周期調整部 DESCRIPTION OF SYMBOLS 1 Rolling machine 1a, 1b Work roll 1c, 1d Backup roll 2 Plate thickness meter 3 Opening change mechanism 4 Load meter 5 Rolling-down position detector 6 Monitoring controller 7 Plate thickness controller 8 Exponential smoothing circuit 9 Rolling load calculating part 10 Gauge Meter AGC operation amount calculation unit 11 Gauge meter thickness calculation unit 12, 13, 14 Addition unit 15 Sampling cycle adjustment unit

具体的には、本発明の第１の態様は、金属板を圧延機で圧下する際の圧下点での板厚をゲージメータ式からゲージメータ板厚として算出し、該ゲージメータ板厚を前記圧延機の後面に設置された板厚計の測定点までトラッキングし、前記測定点において前記板厚計で測定した板厚と前記トラッキングした前記ゲージメータ板厚との偏差と、前記圧下点での前記ゲージメータ板厚と目標板厚との偏差との差分をモニタリング操作量として、前記目標板厚になるように前記圧延機における圧下位置をダイナミックに制御する金属板の板厚制御方法であって、前記測定点において前記板厚計で測定した板厚と前記トラッキングした前記ゲージメータ板厚との偏差と、前記圧下点での前記ゲージメータ板厚と目標板厚との偏差との差分である前記モニタリング操作量を指数平滑化したものを補正後のモニタリング操作量として、前記目標板厚になるように前記圧延機における圧下位置をダイナミックに制御する金属板の板厚制御方法である。 Specifically, in the first aspect of the present invention, the thickness at the reduction point when the metal plate is reduced by a rolling mill is calculated as a gauge meter plate thickness from a gauge meter type, and the gauge meter plate thickness is calculated as described above. Tracking to the measurement point of the thickness gauge installed on the rear surface of the rolling mill, the deviation between the thickness measured by the thickness gauge at the measurement point and the gauge thickness measured by the gauge meter, and at the reduction point A metal plate thickness control method for dynamically controlling a reduction position in the rolling mill so that a difference between a deviation between the gauge meter plate thickness and a target plate thickness is a monitoring operation amount to be the target plate thickness. The difference between the plate thickness measured by the plate thickness meter at the measurement point and the gauge meter plate thickness tracked and the deviation between the gauge meter plate thickness and the target plate thickness at the reduction point Moni As monitoring the operation amount of the corrected those exponential smoothing ring operation amount, a pressing position in the rolling mill so that the target thickness is a thickness control method for a metal plate for controlling dynamically.

本発明の第４の態様は、金属板を圧延機で圧下する際の圧下点での板厚をゲージメータ式からゲージメータ板厚として算出し、該ゲージメータ板厚を前記圧延機の後面に設置された板厚計の測定点までトラッキングし、前記測定点において前記板厚計で測定した板厚と前記トラッキングした前記ゲージメータ板厚との偏差と、前記圧下点での前記ゲージメータ板厚と目標板厚との偏差との差分をモニタリング操作量として、前記目標板厚になるように前記圧延機における圧下位置をダイナミックに制御する金属板の板厚制御装置であって、前記測定点において前記板厚計で測定した板厚と前記トラッキングした前記ゲージメータ板厚との偏差と、前記圧下点での前記ゲージメータ板厚と目標板厚との偏差との差分である前記モニタリング操作量を指数平滑化により補正する指数平滑回路を備える金属板の板厚制御装置である。 According to a fourth aspect of the present invention, the thickness at the reduction point when the metal plate is reduced by a rolling mill is calculated as a gauge meter thickness from a gauge meter type, and the gauge meter thickness is applied to the rear surface of the rolling mill. Tracking to the measurement point of the installed thickness gauge, the deviation between the thickness measured by the thickness gauge at the measurement point and the gauge thickness measured by the gauge meter, and the gauge meter thickness at the reduction point A plate thickness control device for a metal plate that dynamically controls a reduction position in the rolling mill so as to be the target plate thickness, using a difference between a deviation from the target plate thickness as a monitoring operation amount, and at the measurement point The monitoring operation, which is a difference between a deviation between the plate thickness measured by the plate thickness meter and the tracked gauge meter plate thickness, and a deviation between the gauge meter plate thickness and the target plate thickness at the reduction point A plate thickness control apparatus for a metal plate with an exponential smoothing circuit for correcting the exponential smoothing.

実施例として、図１，２に示した圧延機および板厚制御装置を用いて、金属板として厚み１０ｍｍの鋼板を目標板厚８ｍｍとなるよう圧延を行った。板厚計にはγ線板厚計を用いた。本実施例では、板厚計のサンプリング周期を１００ｍｍ間隔とするとともに、圧下点の圧延荷重Ｐおよび圧下点でのゲージメータ板厚ｈＧＭを１００ｍｍ間隔でトラッキングし、トラッキング点が板厚計に達した際に板厚計の測定板厚ｈγとトラッキングしたゲージメータ板厚ｈＧＭ（ＴＲＫ）との差を求め、この差と、圧下点でのゲージメータ板厚ｈＧＭ（圧下点）および目標板厚ｈ０間の差との偏差をモニタリング操作量として目標板厚になるように前記圧延機における圧下位置をダイナミックに制御する際に、このモニタリング操作量を指数平滑回路で指数平滑化して補正し、その補正後の値を板厚制御器にモニタリング操作量として加えた。指数平滑回路の平滑定数は０．０４とした。また、板厚制御装置における主な条件は、ミル定数９００ton/mm、予測ミル定数９５０ton/mm、および塑性定数１５００ton/mmとした。 As an example, using a rolling mill and a plate thickness control device shown in FIGS. 1 and 2, a steel plate having a thickness of 10 mm was rolled as a metal plate to a target plate thickness of 8 mm. A gamma ray thickness gauge was used as the thickness gauge. In this embodiment, the sampling cycle of the thickness gauge is set at an interval of 100 mm, the rolling load P at the reduction point and the gauge meter thickness h GM at the reduction point are tracked at an interval of 100 mm, and the tracking point reaches the thickness gauge. The difference between the measured thickness h γ of the thickness gauge and the tracked gauge meter thickness h GM (TRK) is obtained, and this difference, the gauge meter thickness h GM (reduction point) at the reduction point, and the target in controlling pressing position in the rolling mill dynamically so that the deviation of the difference between the plate thickness h 0 to a target thickness as monitoring the operation amount, the correction by exponential smoothing the monitoring operation amount by an exponential smoothing circuit Then, the corrected value was added to the plate thickness controller as a monitoring operation amount. The smoothing constant of the exponential smoothing circuit was 0.04. The main conditions in the plate thickness control apparatus were a mill constant of 900 ton / mm, a predicted mill constant of 950 ton / mm, and a plastic constant of 1500 ton / mm.

Claims (6)

金属板を圧延機で圧下する際の圧下点での板厚をゲージメータ式からゲージメータ板厚として算出し、該ゲージメータ板厚を前記圧延機の後面に設置された板厚計の測定点までトラッキングし、前記測定点において前記板厚計で測定した板厚と前記トラッキングした前記ゲージメータ板厚との偏差と、前記圧下点での前記ゲージメータ板厚と目標板厚との偏差との差分をモニタリング操作量として、前記目標板厚になるように前記圧縮機における圧下位置をダイナミックに制御する金属板の板厚制御方法であって、
前記測定点において前記板厚計で測定した板厚と前記トラッキングした前記ゲージメータ板厚との偏差と、前記圧下点での前記ゲージメータ板厚と目標板厚との偏差との差分である前記モニタリング操作量を指数平滑化したものを補正後のモニタリング操作量として、前記目標板厚になるように前記圧縮機における圧下位置をダイナミックに制御することを特徴とする金属板の板厚制御方法。 The plate thickness at the rolling point when the metal plate is rolled down by a rolling mill is calculated as a gauge meter plate thickness from the gauge meter type, and the gauge meter plate thickness is measured by a plate thickness meter installed on the rear surface of the rolling mill. And the deviation between the gauge thickness measured by the thickness gauge at the measurement point and the gauge gauge plate thickness tracked, and the deviation between the gauge meter thickness at the reduction point and the target thickness. A plate thickness control method of a metal plate that dynamically controls a reduction position in the compressor so as to be the target plate thickness, using a difference as a monitoring operation amount,
The difference between the plate thickness measured by the plate thickness meter at the measurement point and the tracked gauge meter plate thickness, and the difference between the gauge meter plate thickness and the target plate thickness at the reduction point A plate thickness control method for a metal plate, characterized in that a reduction position in the compressor is dynamically controlled so that the target plate thickness is obtained as a corrected monitoring operation amount obtained by exponentially smoothing a monitoring operation amount. 前記ゲージメータ板厚の算出周期と前記板厚計の測定周期とを同じに設定することを特徴とする、請求項１に記載の金属板の板厚制御方法。   2. The metal plate thickness control method according to claim 1, wherein a calculation cycle of the gauge meter plate thickness and a measurement cycle of the plate thickness meter are set to be the same. 請求項１または２に記載の金属板の板厚制御方法を用いて金属板を圧延することを特徴とする金属板の製造方法。   A method for producing a metal plate, comprising rolling the metal plate using the method for controlling the thickness of the metal plate according to claim 1. 金属板を圧延機で圧下する際の圧下点での板厚をゲージメータ式からゲージメータ板厚として算出し、該ゲージメータ板厚を前記圧延機の後面に設置された板厚計の測定点までトラッキングし、前記測定点において前記板厚計で測定した板厚と前記トラッキングした前記ゲージメータ板厚との偏差と、前記圧下点での前記ゲージメータ板厚と目標板厚との偏差との差分をモニタリング操作量として、前記目標板厚になるように前記圧縮機における圧下位置をダイナミックに制御する金属板の板厚制御装置であって、
前記測定点において前記板厚計で測定した板厚と前記トラッキングした前記ゲージメータ板厚との偏差と、前記圧下点での前記ゲージメータ板厚と目標板厚との偏差との差分である前記モニタリング操作量を指数平滑化により補正する指数平滑回路を備えることを特徴とする金属板の板厚制御装置。 The plate thickness at the rolling point when the metal plate is rolled down by a rolling mill is calculated as a gauge meter plate thickness from the gauge meter type, and the gauge meter plate thickness is measured by a plate thickness meter installed on the rear surface of the rolling mill. And the deviation between the gauge thickness measured by the thickness gauge at the measurement point and the gauge gauge plate thickness tracked, and the deviation between the gauge meter thickness at the reduction point and the target thickness. A plate thickness control device for a metal plate that dynamically controls the reduction position in the compressor so that the difference becomes a monitoring operation amount to the target plate thickness,
The difference between the plate thickness measured by the plate thickness meter at the measurement point and the tracked gauge meter plate thickness, and the difference between the gauge meter plate thickness and the target plate thickness at the reduction point An apparatus for controlling a thickness of a metal plate, comprising: an exponential smoothing circuit that corrects a monitoring operation amount by exponential smoothing. 前記ゲージメータ板厚の算出周期と前記板厚計の測定周期とを同じに設定することを特徴とする、請求項４に記載の金属板の板厚制御装置。   The plate thickness control device for a metal plate according to claim 4, wherein a calculation cycle of the gauge meter plate thickness and a measurement cycle of the plate thickness meter are set to be the same. 金属板を圧延する圧延機と、請求項４または５に記載の金属板の板厚制御装置とを備えることを特徴とする金属板の製造設備。   A metal plate manufacturing facility comprising: a rolling mill for rolling a metal plate; and the plate thickness control device for a metal plate according to claim 4 or 5.
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113932721A (en) * 2021-10-19 2022-01-14 济南邦威仪器有限公司 Panel powder laying thickness detection equipment and control method thereof
CN113932721B (en) * 2021-10-19 2024-01-19 济南邦威仪器有限公司 Plate powder spreading thickness detection equipment and control method thereof

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