JP2019175942A - Surface mounting inductor and manufacturing method thereof - Google Patents

Surface mounting inductor and manufacturing method thereof Download PDF

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JP2019175942A
JP2019175942A JP2018060546A JP2018060546A JP2019175942A JP 2019175942 A JP2019175942 A JP 2019175942A JP 2018060546 A JP2018060546 A JP 2018060546A JP 2018060546 A JP2018060546 A JP 2018060546A JP 2019175942 A JP2019175942 A JP 2019175942A
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coil
support plate
molded body
lead
mount inductor
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JP6927115B2 (en
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健生 大羽賀
Takeo Ohaga
健生 大羽賀
亮太 渡辺
Ryota Watanabe
亮太 渡辺
佐々森　邦夫
Kunio Sasamori
邦夫 佐々森
清水　浩
Hiroshi Shimizu
浩 清水
大悟 水村
Daigo Mizumura
大悟 水村
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Coils Of Transformers For General Uses (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)

Abstract

To provide a surface mounting inductor capable of easily exposing a coil terminal, for connection with an external terminal, from the surface of a pressure molded body, and excellent in connectibility with the external terminal.SOLUTION: A surface mounting inductor 100 includes a coil formed of a conductor having an insulation membrane, and having a wound part and a lead-out part, a compact 10 incorporating the wound part 14 of the coil, a pair of support-plates 16 placed, respectively, on the opposing faces of the compact 10, and an external terminal 12 placed on the compact. The support-plates 16 are partially embedded in the compact 10, and has an exposure part 16A for exposing at least the partial face from the face of the compact 10 where the support-plates 16 are placed. The end 18 of the lead-out part 18 of the coil is placed on the face of the support-plate 16 on the exposure part 16A with the insulation membrane being exfoliated. The area of the exposure part 16A is smaller than the area of the face of the compact where the support-plate 16 is placed, and the external terminal 12 is placed in contact with the end 18 of the lead-out part 18 of the coil.SELECTED DRAWING: Figure 1C

Description

本発明は、面実装インダクタおよびその製造方法に関する。   The present invention relates to a surface mount inductor and a method for manufacturing the same.

樹脂と磁性粉からなる加圧成型体でコイルを封止したインダクタが使用されている。このようなインダクタでは、使用機器における消費電力の増大化に伴い、直流抵抗（ＤＣＲ）の低減、直流重畳特性の改善が求められている。例えば、特許文献１には、リードフレームが内部に入り込む形状を有し、加圧成型体の内部でコイルの末端とリードフレームが接続されているインダクタが記載されている。また、特許文献２には、磁気コア組立体内に、内蔵コイルとコイル出口に接続する金属片とを含み、金属片と磁気コア組立体の外周に電極を設けたインダクタが記載されている。   An inductor in which a coil is sealed with a pressure-molded body made of resin and magnetic powder is used. Such an inductor is required to reduce direct current resistance (DCR) and improve direct current superposition characteristics as power consumption increases in the equipment used. For example, Patent Document 1 describes an inductor having a shape in which a lead frame enters the inside and in which a terminal end of a coil and the lead frame are connected inside a pressure-molded body. Patent Document 2 describes an inductor including a built-in coil and a metal piece connected to the coil outlet in the magnetic core assembly, and an electrode provided on the outer periphery of the metal piece and the magnetic core assembly.

韓国公開特許第１０−２０１７−００２３５０３号公報Korean Published Patent No. 10-2017-0023503 中国実用新案公告第２０４６６８１０４号明細書China Utility Model Publication No. 204668104 Specification

従来技術のインダクタでは、加圧成型体の内部にリードフレーム等が入り込むため、コイルの外径を大きくしたりすることが困難であった。そのため太い導線を用いて直流抵抗（ＤＣＲ）を改善したり、細い導線を用いてコイル径を大きくすることで直流重畳特性を改善したりすることが困難であった。一方、加圧成型の際にコイル末端を成型体の表面に露出させ、露出部分をリードフレームと接続して外部端子とする場合、コイルが細い導線から形成されていると加圧成型によってコイル末端が成型体に埋もれてしまい、リードフレームとの接続が困難になる場合があった。   In the prior art inductor, it is difficult to increase the outer diameter of the coil because a lead frame or the like enters the pressure molded body. For this reason, it has been difficult to improve the direct current resistance (DCR) using a thick conductive wire, or to improve the direct current superposition characteristics by increasing the coil diameter using a thin conductive wire. On the other hand, when the end of the coil is exposed to the surface of the molded body during pressure molding, and the exposed portion is connected to the lead frame as an external terminal, if the coil is formed of a thin conductor, the coil end is formed by pressure molding. May be buried in the molded body, making it difficult to connect to the lead frame.

本発明の一態様は、外部端子と接続されるコイル末端を、加圧成型体の表面から容易に露出することができ、外部端子とコイルとの接続性に優れる面実装インダクタおよびその製造方法を提供することを目的とする。   One aspect of the present invention is a surface-mount inductor that can easily expose a terminal end of a coil connected to an external terminal from the surface of a pressure-molded body and has excellent connectivity between the external terminal and the coil, and a method for manufacturing the same. The purpose is to provide.

第１態様は、絶縁皮膜を有する導線で形成され、巻回部と引き出し部とを有するコイルと、コイルの巻回部を内蔵する成型体と、成型体の対向する面のそれぞれに配置される一対の支持板と、成型体上に配置される外部端子と、を備える面実装インダクタである。支持板は、一部が成型体に埋設され、前記支持板が配置される前記成型体の面から少なくとも一部の面を露出する露出部を有する。コイルの引き出し部の端部は、絶縁皮膜が剥離された状態で支持板の露出部側の面上に配置される。支持板の露出部の面積は、前記支持板が配置される成型体の面の面積よりも小さくなっている。外部端子は、コイルの引き出し部の端部と接して配置される。   A 1st aspect is arrange | positioned at each of the surface which is formed with the conducting wire which has an insulating film, and has a winding part and a drawer | drawing-out part, the molded object which incorporates the winding part of a coil, and the opposing surface of a molded object A surface-mount inductor comprising a pair of support plates and an external terminal disposed on a molded body. The support plate has an exposed portion that is partially embedded in the molded body and exposes at least a portion of the surface from the surface of the molded body on which the support plate is disposed. The end portion of the coil drawing portion is disposed on the exposed portion side surface of the support plate in a state where the insulating film is peeled off. The area of the exposed portion of the support plate is smaller than the area of the surface of the molded body on which the support plate is disposed. The external terminal is disposed in contact with the end portion of the coil drawing portion.

第２態様は、面実装インダクタの製造方法である。製造方法は、絶縁皮膜を有する導線で形成され、巻回部と引き出し部とを有するコイルを準備することと、コイルの引き出し部の端部を、一対の支持板の一方の面上にそれぞれ配置することと、磁性粉を含む複合材料から形成される複数の板状予備成型体でコイルの巻回部を挟持し、板状予備成型体の側面、支持板およびコイルの引き出し部の端部をこの順に積層させ、成型金型の側面に対向させて成型金型内に配置することと、前記成型金型内で、前記コイルの巻回部を内蔵し、前記支持板の少なくとも一部が対向する面に露出する成型体を得ることと、を含む。   The second aspect is a method for manufacturing a surface mount inductor. The manufacturing method comprises preparing a coil formed of a conductive wire having an insulating film and having a winding part and a lead part, and arranging the end part of the coil lead part on one surface of a pair of support plates, respectively. The coil winding portion is sandwiched between a plurality of plate-shaped preforms formed of a composite material containing magnetic powder, and the side surfaces of the plate-shaped preform, the support plate, and the ends of the coil lead-out portions are Laminate in this order, arrange in the molding die so as to face the side of the molding die, and incorporate the coil winding part in the molding die, and at least a part of the support plate faces Obtaining a molded body exposed on the surface to be processed.

本発明の一態様によれば、外部端子と接続されるコイル末端を、加圧成型体の表面から容易に露出することができ、外部端子とコイルとの接続性に優れる面実装インダクタおよびその製造方法を提供することができる。   According to one aspect of the present invention, a coil end connected to an external terminal can be easily exposed from the surface of the pressure-molded body, and a surface-mount inductor excellent in connectivity between the external terminal and the coil and its manufacture A method can be provided.

実施例１の面実装インダクタの実装面側からみた平面図である。FIG. 3 is a plan view of the surface mount inductor according to the first embodiment when viewed from the mounting surface side. 図１のＡＡ線における断面図である。It is sectional drawing in the AA line of FIG. 図１Ｂの部分拡大図である。It is the elements on larger scale of FIG. 1B. 実施例１の面実装インダクタの変形例を説明する図である。FIG. 6 is a diagram illustrating a modification of the surface mount inductor according to the first embodiment. 実施例１の面実装インダクタの変形例を説明する図である。FIG. 6 is a diagram illustrating a modification of the surface mount inductor according to the first embodiment. 実施例２の面実装インダクタの実装面に直交する面における部分断面図である。6 is a partial cross-sectional view of a surface orthogonal to a mounting surface of a surface-mount inductor according to Embodiment 2. FIG. 実施例３の面実装インダクタの実装面に直交する面における断面図である。6 is a cross-sectional view of a surface orthogonal to the mounting surface of the surface-mount inductor of Example 3. FIG. 実施例４の面実装インダクタの実装面に直交する面における断面図である。FIG. 10 is a cross-sectional view of a surface orthogonal to the mounting surface of the surface-mount inductor of Example 4. 実施例５の面実装インダクタの実装面に平行な面における断面図である。FIG. 10 is a cross-sectional view of a surface parallel to the mounting surface of the surface-mount inductor of Example 5. 面実装インダクタの製造方法を説明する平面図である。It is a top view explaining the manufacturing method of a surface mount inductor. 面実装インダクタの製造方法を説明する平面図である。It is a top view explaining the manufacturing method of a surface mount inductor. 面実装インダクタの製造方法を説明する断面図である。It is sectional drawing explaining the manufacturing method of a surface mount inductor.

面実装インダクタは、絶縁皮膜を有する導線で形成され、巻回部および引き出し部を有するコイルと、コイルの巻回部を内蔵する成型体と、成型体の対向する面のそれぞれに配置される一対の支持板と、成型体上に配置される外部端子と、を備える。支持板は、一部が成型体に埋設され、支持板が配置される成型体の面から少なくとも一部の面を露出する露出部を有する。コイルの引き出し部の端部は、絶縁皮膜が剥離された状態で支持板の露出部側の面上に配置される。支持板の露出部の面積は、前記支持板が配置される成型体の面の面積よりも小さくなっている。外部端子は、コイルの引き出し部の端部と接して配置される。   The surface-mount inductor is formed of a conductive wire having an insulating film, and is disposed on each of a coil having a winding part and a lead part, a molded body incorporating the coil winding part, and a surface facing the molded body. A support plate and an external terminal disposed on the molded body. The support plate has an exposed portion that is partially embedded in the molded body and exposes at least a portion of the surface from the surface of the molded body on which the support plate is disposed. The end portion of the coil drawing portion is disposed on the exposed portion side surface of the support plate in a state where the insulating film is peeled off. The area of the exposed portion of the support plate is smaller than the area of the surface of the molded body on which the support plate is disposed. The external terminal is disposed in contact with the end portion of the coil drawing portion.

成型体の側面に露出する面を有する支持板上にコイルの引き出し部の端部が配置されることで、細い導線、断面円形状の導線等を用いてコイルが形成されていても、コイル末端を成型体の表面に容易に露出することができる。また、コイル末端と接続するリードフレームを成型体内に配置する必要がないため、成型体内に内蔵されるコイルの外径を容易に大きくすることができる。これにより、コイルを形成する導線を太くして直流抵抗（ＤＣＲ）特性を改善したり、細い導線を用いて外径の大きいコイルを形成して直流重畳特性を改善したりすることができる。すなわち、同一構造の面実装インダクタでありながら、直流抵抗（ＤＣＲ）特性と直流重畳特性とを選択的に改善することが可能になる。   Even if a coil is formed using a thin lead wire, a cross-sectional lead wire, etc., by arranging the end of the coil lead-out portion on the support plate having a surface exposed on the side surface of the molded body, the end of the coil Can be easily exposed on the surface of the molded body. In addition, since it is not necessary to arrange the lead frame connected to the coil end in the molded body, the outer diameter of the coil incorporated in the molded body can be easily increased. As a result, it is possible to improve the direct current resistance (DCR) characteristic by thickening the conducting wire forming the coil, or to improve the direct current superposition characteristic by forming a coil having a large outer diameter using a thin conducting wire. That is, it is possible to selectively improve the direct current resistance (DCR) characteristic and the direct current superimposition characteristic even though the surface mount inductor has the same structure.

支持板のコイルの引き出し部の端部が配置される面が導電性を有し、外部端子、コイルの引き出し部および支持板が、互いに電気的に接続されていてもよい。支持板と外部端子とでコイルの引き出し部が挟み込まれるため、コイルと外部端子との接続がより強固になる。   The surface of the support plate on which the end portion of the coil lead portion is disposed may be conductive, and the external terminal, the coil lead portion, and the support plate may be electrically connected to each other. Since the coil lead-out portion is sandwiched between the support plate and the external terminal, the connection between the coil and the external terminal is further strengthened.

支持板が絶縁体からなり、外部端子およびコイルの引き出し部が、電気的に接続されていてもよい。支持板が絶縁体であることで、コイルの巻回部の外径を大きくしても、コイルの巻回部と外部端子との絶縁性を高くすることができる。   The support plate may be made of an insulator, and the external terminal and the lead portion of the coil may be electrically connected. Since the support plate is an insulator, even if the outer diameter of the coil winding portion is increased, the insulation between the coil winding portion and the external terminal can be increased.

支持板間の距離と、コイルの巻回部の巻軸と垂直な方向における最大の大きさとが略同じであってもよい。すなわち、コイルの巻回部の支持板間方向の大きさが、支持板間の距離と略同じであってもよい。成型体を小型化しても十分な外径を有するコイル巻回部を形成することができる。   The distance between the support plates and the maximum size in the direction perpendicular to the winding axis of the coil winding portion may be substantially the same. That is, the size of the coil winding portion in the direction between the support plates may be substantially the same as the distance between the support plates. Even if the molded body is downsized, a coil winding portion having a sufficient outer diameter can be formed.

成型体の実装面側の底面と、成型体の底面に対向する上面との間の距離と、コイルの巻回部の巻軸と垂直な方向における最大の大きさが略同じであってもよい。すなわち、成型体の底面および上面に直交する方向のコイルの巻回部の大きさが、底面と上面間の距離と略同じであってもよい。成型体を小型化しても十分な外径を有するコイル巻回部を形成することができる。   The distance between the bottom surface on the mounting surface side of the molded body and the upper surface facing the bottom surface of the molded body and the maximum size in the direction perpendicular to the winding axis of the coil winding portion may be substantially the same. . That is, the size of the coil winding portion in the direction orthogonal to the bottom surface and the top surface of the molded body may be substantially the same as the distance between the bottom surface and the top surface. Even if the molded body is downsized, a coil winding portion having a sufficient outer diameter can be formed.

支持板の端部は、成型体の実装面側の面に露出していてもよい。これにより成型体の形成時における支持板の位置精度を高めることができる。   The end of the support plate may be exposed on the surface on the mounting surface side of the molded body. Thereby, the position accuracy of the support plate at the time of formation of a molded object can be improved.

支持板は、コイルの引き出し部を収容する凹部を有していてもよい。支持板がより安定して成型体の外部に露出するため、コイルの端部がより確実に成型体の外部に露出する。   The support plate may have a recess that accommodates the lead portion of the coil. Since the support plate is more stably exposed to the outside of the molded body, the end portion of the coil is more reliably exposed to the outside of the molded body.

面実装インダクタの製造方法は、絶縁皮膜を有する導線で形成され、巻回部と引き出し部とを有するコイルを準備する工程と、コイルの引き出し部の端部を、一対の支持板の一方の面上にそれぞれ配置する工程と、磁性粉を含む複合材料から形成される複数の板状予備成型体の側面に直交する面で前記コイルの巻回部を挟持して、板状予備成型体の側面上に、支持板およびコイルの引き出し部の端部をこの順に積層させ、成型金型の側面に対向させて成型金型内に配置する工程と、成型金型内で、コイルの巻回部を内蔵し、支持板の少なくとも一部が対向する面に露出する成型体を得る工程と、を含む。製造方法は、コイルの引き出し部の端部と、電気的に接続する外部端子を成型体上に配置する工程をさらに含んでいてもよい。板状予備成型体の側面に配置される支持板の成型体に対向する面とは反対側の面上にコイルの引き出し部を配置した状態で成型体を形成することで、コイルの引き出し部の端部が、成型体に埋設されることなく、成型体外に露出される。これにより外部端子とコイルの端部との接続が容易になる。   A method of manufacturing a surface mount inductor includes a step of preparing a coil formed of a conductive wire having an insulating film and having a winding portion and a lead portion, and an end portion of the lead portion of the coil on one surface of a pair of support plates. A side surface of the plate-shaped preform, sandwiching the winding portion of the coil with a surface orthogonal to the side surfaces of the plurality of plate-shaped preforms formed of a composite material including magnetic powder and a step of arranging each On top of this, the support plate and the end of the coil lead-out portion are laminated in this order, and placed in the molding die so as to face the side surface of the molding die, and the coil winding portion is placed in the molding die. And a step of obtaining a molded body that is incorporated and exposed to a surface at which at least a part of the support plate faces. The manufacturing method may further include a step of disposing the end portion of the lead portion of the coil and the external terminal to be electrically connected on the molded body. By forming the molded body in a state in which the coil lead-out portion is disposed on the surface opposite to the surface of the support plate that is disposed on the side surface of the plate-shaped preform, the surface of the coil lead-out portion The end portion is exposed outside the molded body without being embedded in the molded body. This facilitates the connection between the external terminal and the end of the coil.

板状予備成型体は、対向する側面に凹部を有し、支持板およびコイルの引き出し部の端部は、凹部の底面上に積層されてもよい。支持板が成型体中に埋没することがより確実に抑制でき、コイルの端部がより確実に成型体外に露出される。   The plate-shaped preform may have a concave portion on the opposite side surface, and the end portions of the support plate and the coil lead-out portion may be laminated on the bottom surface of the concave portion. It is possible to more reliably suppress the support plate from being buried in the molded body, and the end of the coil is more reliably exposed to the outside of the molded body.

凹部は、底面部の厚み方向に直交する方向の長さが、開口部の長さよりも短く形成されていてもよい。支持板の配置精度がより向上し、コイルの端部がより確実に成型体外に露出される。   The recess may be formed such that the length in the direction orthogonal to the thickness direction of the bottom surface is shorter than the length of the opening. The placement accuracy of the support plate is further improved, and the end of the coil is more reliably exposed outside the molded body.

本明細書において「工程」との語は、独立した工程だけではなく、他の工程と明確に区別できない場合であってもその工程の所期の目的が達成されれば、本用語に含まれる。以下、本発明の実施形態を図面に基づいて説明する。ただし、以下に示す実施形態は、本発明の技術思想を具体化するための、面実装インダクタ等を例示するものであって、本発明は、以下に示す面実装インダクタ等に限定されない。なお、特許請求の範囲に示される部材を、実施形態の部材に限定するものでは決してない。特に実施形態に記載されている構成部品の寸法、材質、形状、その相対的配置等は特に特定的な記載がない限りは、本発明の範囲をそれのみに限定する趣旨ではなく、単なる説明例にすぎない。なお、各図中には同一箇所に同一符号を付している。要点の説明または理解の容易性を考慮して、便宜上実施形態を分けて示すが、異なる実施形態で示した構成の部分的な置換または組み合わせが可能である。実施例２以降では実施例１と共通の事柄についての記述を省略し、異なる点についてのみ説明する。特に、同様の構成による同様の作用効果については実施形態毎には逐次言及しないことがある。   In this specification, the term “process” is not limited to an independent process, and is included in the term if the intended purpose of the process is achieved even when it cannot be clearly distinguished from other processes. . Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, the embodiments described below exemplify surface mount inductors and the like for embodying the technical idea of the present invention, and the present invention is not limited to the following surface mount inductors and the like. In addition, the member shown by a claim is not limited to the member of embodiment by any means. In particular, the dimensions, materials, shapes, relative arrangements, and the like of the component parts described in the embodiments are not intended to limit the scope of the present invention only to specific examples unless otherwise specifically described. Only. In the drawings, the same reference numerals are assigned to the same portions. In consideration of ease of explanation or understanding of the main points, the embodiments are shown separately for convenience, but the components shown in different embodiments can be partially replaced or combined. In the second and subsequent embodiments, description of matters common to the first embodiment is omitted, and only different points will be described. In particular, the same function and effect of the same configuration may not be mentioned sequentially for each embodiment.

以下、本発明を実施例により具体的に説明するが、本発明はこれらの実施例に限定されるものではない。   EXAMPLES The present invention will be specifically described below with reference to examples, but the present invention is not limited to these examples.

実施例１
実施例１の面実装インダクタ１００を図１Ａから図１Ｃを参照して説明する。図１Ａは、面実装インダクタの実装面側からみた概略平面図である。図１Ｂは、図１ＡのＡＡ線における概略断面図であり、コイルの巻軸に平行な面における断面図である。図１Ｃは図１Ｂの部分拡大図である。 Example 1
A surface-mount inductor 100 according to the first embodiment will be described with reference to FIGS. 1A to 1C. FIG. 1A is a schematic plan view seen from the mounting surface side of the surface mount inductor. FIG. 1B is a schematic cross-sectional view taken along line AA in FIG. 1A, and is a cross-sectional view in a plane parallel to the winding axis of the coil. FIG. 1C is a partially enlarged view of FIG. 1B.

図１Ａに示すように、面実装インダクタ１００は、コイル（図示せず）を内蔵する成型体１０と、成型体１０の表面に配置される外部端子１２とを備える。成型体１０は、実装面側の底面と、底面に対向する上面と、底面および上面に隣接する４つの側面とを有する。成型体１０の高さは、底面と上面の距離であり、成型体の縦および横は、対向する側面間の距離となる。外部端子１２は、成型体１０に内蔵されるコイル末端と接続され、成型体１０の底面から側面を経て上面まで延在している。   As shown in FIG. 1A, the surface-mount inductor 100 includes a molded body 10 containing a coil (not shown) and external terminals 12 disposed on the surface of the molded body 10. The molded body 10 has a bottom surface on the mounting surface side, a top surface facing the bottom surface, and four side surfaces adjacent to the bottom surface and the top surface. The height of the molded body 10 is the distance between the bottom surface and the top surface, and the vertical and horizontal directions of the molded body are the distances between the opposing side surfaces. The external terminal 12 is connected to the end of the coil built in the molded body 10 and extends from the bottom surface of the molded body 10 to the upper surface through the side surface.

図１Ｂでは、コイルの巻回部１４が成型体１０に内蔵され、その巻軸を実装面に直交して配置される。コイルは、絶縁皮膜を有する導線から形成され、その両端が最外周に位置するように２段に導線を巻回した巻回部１４と、巻回部から導線の両端を引き出す引き出し部を有している。成型体１０の対向する側面には１対の支持板１６が配置される。支持板１６は厚み方向に成型体１０に埋設され、成型体１０に対向する面とは反対側の面を成型体１０から露出して露出部を形成している。支持板１６の露出部の面積は、支持板１６が配置される成型体１０の側面の面積よりも小さくなっている。支持板１６には、その面積が成型体の側面の面積よりも小さい板状の部材が用いられる。外部端子１２は、支持板１６を被覆し、コイルの引き出し部の末端（図示せず）と接続され、成型体１０の実装面側の底面から側面を経て上面まで延在している。   In FIG. 1B, the winding part 14 of a coil is incorporated in the molded object 10, and the winding axis is arrange | positioned orthogonally to a mounting surface. The coil is formed of a conducting wire having an insulating film, and has a winding portion 14 in which the conducting wire is wound in two stages so that both ends thereof are located on the outermost periphery, and a lead-out portion that pulls out both ends of the conducting wire from the winding portion. ing. A pair of support plates 16 are disposed on the opposite side surfaces of the molded body 10. The support plate 16 is embedded in the molded body 10 in the thickness direction, and a surface opposite to the surface facing the molded body 10 is exposed from the molded body 10 to form an exposed portion. The area of the exposed portion of the support plate 16 is smaller than the area of the side surface of the molded body 10 on which the support plate 16 is disposed. As the support plate 16, a plate-like member whose area is smaller than the area of the side surface of the molded body is used. The external terminal 12 covers the support plate 16, is connected to a terminal end (not shown) of the coil lead-out portion, and extends from the bottom surface on the mounting surface side of the molded body 10 to the top surface through the side surface.

成型体１０は、例えば縦５ｍｍ×横５ｍｍ×高さ７ｍｍから縦７ｍｍ×横７ｍｍ×高さ５ｍｍの大きさに形成される。成型体は、例えば樹脂および磁性粉を含む複合材料を加圧成型して形成される。磁性体には、例えば、Ｆｅ、Ｆｅ−Ｓｉ、Ｆｅ−Ｓｉ−Ｃｒ、Ｆｅ−Ｓｉ−Ａｌ、Ｆｅ−Ｎｉ−Ａｌ、Ｆｅ−Ｃｒ−Ａｌ等の鉄系の金属磁性粉末、他の組成系の金属磁性粉末、アモルファス等の金属磁性粉末、表面がガラス等の絶縁体で被覆された金属磁性粉末、表面を改質した金属磁性粉末、ナノレベルの微小な金属磁性体粉末、フェライト等を用いることができる。また、樹脂には、エポキシ樹脂、ポリイミド樹脂、フェノール樹脂等の熱硬化性樹脂；ポリエチレン樹脂、ポリアミド樹脂等の熱可塑性樹脂等が用いられる。   The molded body 10 is formed in a size of, for example, 5 mm long × 5 mm wide × 7 mm high to 7 mm long × 7 mm wide × 5 mm high. The molded body is formed by pressure molding a composite material containing, for example, a resin and magnetic powder. Examples of magnetic materials include iron-based metal magnetic powders such as Fe, Fe-Si, Fe-Si-Cr, Fe-Si-Al, Fe-Ni-Al, Fe-Cr-Al, and other composition systems. Use metal magnetic powder, metal magnetic powder such as amorphous, metal magnetic powder whose surface is coated with an insulator such as glass, metal magnetic powder whose surface is modified, nano-level fine metal magnetic powder, ferrite, etc. Can do. Moreover, thermosetting resins, such as an epoxy resin, a polyimide resin, a phenol resin; Thermoplastic resins, such as a polyethylene resin and a polyamide resin, etc. are used for resin.

支持板１６は、例えば矩形状の金属板であり、縦および横の長さが、支持板が配置される成型体１０の側面の縦および横の長さよりも小さくなっている。支持板１６の側面のうち少なくも３辺は、成型体１０に埋設されている。支持板１６は、例えば縦３ｍｍ×横３ｍｍから縦５ｍｍ×横５ｍｍの大きさに形成される。支持板１６の厚みは、例えば０．１ｍｍ以上０．１５ｍｍ以下に形成される。   The support plate 16 is, for example, a rectangular metal plate, and the vertical and horizontal lengths are smaller than the vertical and horizontal lengths of the side surface of the molded body 10 on which the support plate is disposed. At least three sides of the side surface of the support plate 16 are embedded in the molded body 10. The support plate 16 is formed in a size of, for example, 3 mm long × 3 mm wide to 5 mm long × 5 mm wide. The thickness of the support plate 16 is, for example, 0.1 mm or more and 0.15 mm or less.

支持板１６は、厚みを有する板状の部材であればよく、厚み方向に直交する面の形状は矩形状、円形状、楕円状、多角形状等のいずれであってもよい。また、支持板１６は、コイルの引き出し部の端部１８が配置される面に導電性の金属層を有する絶縁性基材から形成されてもよい。すなわち、支持板１６は、板状の絶縁性基材とその一方の面上に配置される金属層とを有していてもよい。絶縁性基材には、例えばエポキシ樹脂等の樹脂基材、アルミナ等が使用できる。外部端子１２は、成型体１０の底面および側面の少なくとも一部に延在していればよく、上面には配置されていなくてもよい。図１Ｂでは、コイルの巻回部１４の巻軸が実装面に直交しているが、巻軸を実装面に平行にしてコイルを配置してもよい。   The support plate 16 may be a plate-like member having a thickness, and the shape of the surface orthogonal to the thickness direction may be any of a rectangular shape, a circular shape, an elliptical shape, a polygonal shape, and the like. The support plate 16 may be formed of an insulating base material having a conductive metal layer on the surface on which the end portion 18 of the coil lead-out portion is disposed. That is, the support plate 16 may have a plate-like insulating base material and a metal layer disposed on one surface thereof. As the insulating substrate, for example, a resin substrate such as an epoxy resin, alumina, or the like can be used. The external terminal 12 only needs to extend to at least a part of the bottom surface and the side surface of the molded body 10 and may not be disposed on the top surface. In FIG. 1B, the winding axis of the coil winding portion 14 is orthogonal to the mounting surface, but the coil may be disposed with the winding axis parallel to the mounting surface.

図１Ｃに示すように、面実装インダクタ１００では、コイルが巻回部１４の巻軸を実装面に直交させて配置される。コイルの巻回部１４は、絶縁被膜を有する導線から形成される。コイルを形成する導線は、断面が矩形状の平角線となっている。コイルの引き出し部の端部１８は、絶縁皮膜が剥離された状態で支持板１６の露出部側の面上に配置される。支持板１６は、導電性を有する金属板から形成される。支持板１６のコイルの引き出し部の端部１８が配置される面上には、はんだ層２０が形成され、コイルの引き出し部の端部１８と支持板１６とが電気的に接続されるとともに、コイルの引き出し部の端部１８が支持板１６上に固定されている。コイルの引き出し部の端部１８は、支持板１６と外部端子１２との間に挟持され、支持板１６および外部端子１２と電気的に接続される。はんだ層２０は、導線の端部１８と略同一の厚みで形成され、外部端子１２は、はんだ層２０と接合していてもよい。支持板１６は、厚み方向に成型体１０の側面に埋設され、はんだ層２０の表面が成型体１０の側面に露出して、支持板１６の露出部１６Ａとなっている。露出部１６Ａの面積は、成型体１０の支持板１６が配置される側面の面積よりも小さくなっている。支持板１６とコイルの引き出し部の端部１８が露出した成型体１０の側面には、支持板１６およびコイルの引き出し部の端部１８を被覆して、外部端子１２が配置される。外部端子１２は、成型体１０の底面、側面および上面の少なくとも一部を被覆するリードフレームで形成される。   As shown in FIG. 1C, in the surface-mount inductor 100, the coil is arranged with the winding axis of the winding portion 14 orthogonal to the mounting surface. The coil winding portion 14 is formed of a conductive wire having an insulating film. The conducting wire forming the coil is a rectangular wire having a rectangular cross section. The end portion 18 of the coil lead-out portion is disposed on the exposed portion side surface of the support plate 16 in a state where the insulating film is peeled off. The support plate 16 is formed from a conductive metal plate. A solder layer 20 is formed on the surface of the support plate 16 where the end portion 18 of the coil lead portion is disposed, and the end portion 18 of the coil lead portion and the support plate 16 are electrically connected. An end 18 of the coil lead-out portion is fixed on the support plate 16. The end 18 of the coil lead-out portion is sandwiched between the support plate 16 and the external terminal 12 and is electrically connected to the support plate 16 and the external terminal 12. The solder layer 20 is formed with substantially the same thickness as the end portion 18 of the conducting wire, and the external terminal 12 may be joined to the solder layer 20. The support plate 16 is embedded in the side surface of the molded body 10 in the thickness direction, and the surface of the solder layer 20 is exposed on the side surface of the molded body 10 to form an exposed portion 16A of the support plate 16. The area of the exposed portion 16A is smaller than the area of the side surface on which the support plate 16 of the molded body 10 is disposed. The external terminal 12 is disposed on the side surface of the molded body 10 where the support plate 16 and the end portion 18 of the coil lead-out portion are exposed, covering the support plate 16 and the end portion 18 of the coil lead-out portion. The external terminal 12 is formed of a lead frame that covers at least a part of the bottom surface, the side surface, and the top surface of the molded body 10.

支持板１６の一方の面上に、コイルの引き出し部の端部１８を接続し、支持板１６のコイルの引き出し部の端部１８が接続された面を外側にして成型体１０の側面に配置して成型体１０を形成することで、支持板１６の表面の少なくとも一部およびコイルの引き出し部の端部１８が、成型体１０から露出する。この露出した端部１８に外部端子１２となるリードフレームを接続することで、コイルと外部端子１２とが安定的に接続される。コイルの引き出し部の端部１８が、支持板１６に支えられて成型体１０の側面に露出するため、導線である平角線の厚みが薄い場合であっても端部と導線との良好な接続が可能になる。また、コイルの引き出し部の端部１８が、支持板１６と外部端子１２に挟持された状態で、支持板１６と外部端子１２とがはんだで接続されることで、コイルの引き出し部の端部１８の外部端子１２への接続強度が向上する。   An end 18 of the coil lead-out portion is connected to one surface of the support plate 16, and the surface to which the end 18 of the coil lead-out portion of the support plate 16 is connected is arranged on the side of the molded body 10. By forming the molded body 10, at least a part of the surface of the support plate 16 and the end 18 of the coil lead-out portion are exposed from the molded body 10. By connecting a lead frame serving as the external terminal 12 to the exposed end portion 18, the coil and the external terminal 12 are stably connected. Since the end portion 18 of the coil drawing portion is supported by the support plate 16 and exposed to the side surface of the molded body 10, even when the thickness of the flat wire which is the conducting wire is thin, the end portion and the conducting wire are connected well. Is possible. Further, the end portion 18 of the coil lead-out portion is connected by soldering the support plate 16 and the external terminal 12 with the end portion 18 of the coil lead-out portion held between the support plate 16 and the external terminal 12. The connection strength to the 18 external terminals 12 is improved.

図１Ｄは、実施例１の変形例である面実装インダクタ１１０を説明する部分拡大断面図である。図１Ｄでは、コイルを形成する導体が、断面が円形状となっていること以外は面実装インダクタ１００と同様に構成される。   FIG. 1D is a partially enlarged cross-sectional view illustrating a surface mount inductor 110 that is a modification of the first embodiment. In FIG. 1D, the conductor forming the coil is configured in the same manner as the surface-mount inductor 100 except that the cross section has a circular shape.

図１Ｄでは、コイルの引き出し部の端部１８は、絶縁皮膜が剥離された状態で支持板１６の露出部側の面上に配置される。コイルの引き出し部の端部１８が、支持板１６に支えられて成型体１０の側面に露出するため、導線の断面が円形状であっても、導線が成型体内に埋設されずに良好な接続が可能になる。また、コイルの引き出し部の端部１８が、支持板１６と外部端子１２に挟持された状態で、支持板１６と外部端子１２とがはんだで接続されることで、コイルの引き出し部の端部１８の外部端子１２への接続強度が向上する。   In FIG. 1D, the end portion 18 of the coil lead-out portion is disposed on the exposed portion side surface of the support plate 16 in a state where the insulating film is peeled off. Since the end 18 of the coil lead-out portion is supported by the support plate 16 and exposed to the side surface of the molded body 10, even if the cross section of the conductor is circular, the conductor is not embedded in the molded body and good connection is achieved. Is possible. Further, the end portion 18 of the coil lead-out portion is connected to the support plate 16 and the external terminal 12 by soldering in a state where the end portion 18 of the coil lead-out portion is sandwiched between the support plate 16 and the external terminal 12. The connection strength to the 18 external terminals 12 is improved.

図１Ｅは、実施例１の変形例である面実装インダクタ１２０を説明する部分拡大断面図である。図１Ｅでは、支持板１６上にはんだ層が設けられていないこと以外は面実装インダクタ１００と同様に構成される。   FIG. 1E is a partially enlarged cross-sectional view illustrating a surface-mount inductor 120 that is a modification of the first embodiment. In FIG. 1E, the configuration is the same as that of the surface-mount inductor 100 except that the solder layer is not provided on the support plate 16.

図１Ｅでは、コイルの引き出し部の端部１８は、絶縁皮膜が剥離された状態で支持板１６の露出部側の面上に配置される。支持板１６は、成型体１０の支持板１６が配置される面から、少なくとも一部の面を露出して露出部１６Ａを形成している。支持板１６の端部１８が配置される部分は、端部１８の厚み分で成型体の内部に埋設される。図示はしないが、コイルの引き出し部の端部１８は、支持板１６と、はんだで接続されていてもよい。面実装インダクタ１２０では、支持板１６の全面に、はんだ層を設ける必要がないため、製造工程が簡略化される。   In FIG. 1E, the end portion 18 of the coil lead-out portion is disposed on the exposed portion side surface of the support plate 16 with the insulating film peeled off. The support plate 16 exposes at least a part of the surface of the molded body 10 on which the support plate 16 is disposed to form an exposed portion 16A. The portion of the support plate 16 where the end portion 18 is disposed is embedded in the molded body with the thickness of the end portion 18. Although not shown, the end 18 of the coil lead-out portion may be connected to the support plate 16 with solder. In the surface mount inductor 120, since it is not necessary to provide a solder layer on the entire surface of the support plate 16, the manufacturing process is simplified.

実施例２
実施例２の面実装インダクタ２００を、図２の部分拡大断面図を参照して説明する。面実装インダクタ２００では、支持板１７は絶縁体から形成されていること以外は、実施例１の面実装インダクタ１００と同様に構成される。 Example 2
A surface-mount inductor 200 according to the second embodiment will be described with reference to a partially enlarged sectional view of FIG. The surface mount inductor 200 is configured in the same manner as the surface mount inductor 100 of the first embodiment except that the support plate 17 is formed of an insulator.

コイルの引き出し部の端部１８は、絶縁皮膜が剥離された状態で支持板１７の露出部側の面上に配置される。支持板１７は、ガラス強化エポキシ樹脂、エポキシ樹脂、アルミナ等の絶縁体から形成される。支持板１７のコイルの引き出し部の端部１８が配置される面上には、接着剤、導電ペースト等を含む接着層２１が形成されて端部１８が支持板１７上に固定されている。コイルの引き出し部の端部１８は、支持板１７と外部端子１２との間に挟持されて外部端子１２と電気的に接続される。接着層２１は、導線の端部１８と略同一の厚みで形成される。支持板１７は、厚み方向に成型体１０の側面に埋設され、接着層２１の表面が成型体１０の側面に露出して、支持板１７の露出部１７Ａとなっている。   The end portion 18 of the coil lead-out portion is disposed on the exposed portion side surface of the support plate 17 in a state where the insulating film is peeled off. The support plate 17 is formed of an insulator such as glass reinforced epoxy resin, epoxy resin, or alumina. An adhesive layer 21 containing an adhesive, a conductive paste or the like is formed on the surface of the support plate 17 where the end 18 of the coil lead-out portion is disposed, and the end 18 is fixed on the support plate 17. The end 18 of the coil lead-out portion is sandwiched between the support plate 17 and the external terminal 12 and is electrically connected to the external terminal 12. The adhesive layer 21 is formed with substantially the same thickness as the end portion 18 of the conducting wire. The support plate 17 is embedded in the side surface of the molded body 10 in the thickness direction, and the surface of the adhesive layer 21 is exposed on the side surface of the molded body 10 to form an exposed portion 17A of the support plate 17.

支持板１７は、コイルの巻回部１４に対向する面が絶縁性を有していればよく、コイルの引き出し部の端部１８が配置される面に銅等の導電性の金属層を有していてもよい。その場合、コイルの引き出し部の端部１８は支持板１７に、はんだで接続されて固定されていてもよい。   The support plate 17 only needs to have an insulating surface facing the coil winding portion 14, and has a conductive metal layer such as copper on the surface on which the end portion 18 of the coil lead portion is disposed. You may do it. In that case, the end portion 18 of the coil lead-out portion may be fixed to the support plate 17 by soldering.

面実装インダクタ２００では、支持板１７が絶縁体から形成されることで、外部端子１２とコイルの巻回部１４との電位差に起因する絶縁破壊を抑制することができる。そのため、コイルの外縁部の径を支持板間の距離と略同一にまで大きくすることができる。   In the surface mount inductor 200, the support plate 17 is formed of an insulator, so that the dielectric breakdown due to the potential difference between the external terminal 12 and the coil winding portion 14 can be suppressed. Therefore, the diameter of the outer edge portion of the coil can be increased to substantially the same as the distance between the support plates.

実施例３
実施例３の面実装インダクタ３００を、図３を参照して説明する。図３は面実装インダクタ３００のコイルの巻軸に直交する面における概略断面図である。面実装インダクタ３００では、支持板１７は絶縁体から形成されていること、コイルの巻回部１４の支持板１７間方向の外径ａが、支持板１７間の距離と略同一に形成されていること、および支持板１７の端部が成型体１０の実装面側の底面に露出していること、コイルの巻回部１４の巻軸を実装面に対して平行にしてコイルが配置されること以外は、実施例１の面実装インダクタ１００と同様に構成される。 Example 3
A surface-mount inductor 300 according to the third embodiment will be described with reference to FIG. FIG. 3 is a schematic cross-sectional view in a plane orthogonal to the winding axis of the coil of the surface mount inductor 300. In the surface mount inductor 300, the support plate 17 is formed of an insulator, and the outer diameter “a” of the coil winding portion 14 in the direction between the support plates 17 is formed substantially the same as the distance between the support plates 17. And that the end of the support plate 17 is exposed on the bottom surface of the molded body 10 on the mounting surface side, and the coil is disposed with the winding axis of the coil winding portion 14 parallel to the mounting surface. Except for this, the configuration is the same as that of the surface-mount inductor 100 of the first embodiment.

コイルの引き出し部の端部１８は、コイルの巻回部１４の成型体１０の上面付近から成型体１０の側面方向に引き出され、成型体１０の側面に沿って底面方向に延在している。コイルの引き出し部の端部１８は、絶縁皮膜が剥離された状態で支持板１７の露出部側の面上に配置され、接着層２１で支持板１７に接続されている。接着層２１は、導線の端部１８と略同一の厚みで形成される。図３では、接着層２１は支持板１７上の一部にのみ形成され、支持板１７の接着層２１が形成されていない面が、成型体１０の側面から露出して露出部１７Ａとなっている。また、支持板１７は成型体１０の底面まで延在し、支持板１７の一方の端部が成型体１０の底面に露出している。外部端子１２は、成型体１０の底面から側面を経て上面にまで延在している。コイルの引き出し部の端部１８は、支持板１７および外部端子１２に挟持され、外部端子１２と、はんだで接続される。   The end 18 of the coil drawing portion is drawn from the vicinity of the upper surface of the molded body 10 of the coil winding portion 14 toward the side surface of the molded body 10, and extends in the bottom direction along the side surface of the molded body 10. . The end 18 of the coil lead-out portion is disposed on the exposed portion side surface of the support plate 17 in a state where the insulating film is peeled off, and is connected to the support plate 17 by the adhesive layer 21. The adhesive layer 21 is formed with substantially the same thickness as the end portion 18 of the conducting wire. In FIG. 3, the adhesive layer 21 is formed only on a part of the support plate 17, and the surface of the support plate 17 where the adhesive layer 21 is not formed is exposed from the side surface of the molded body 10 and becomes an exposed portion 17 </ b> A. Yes. The support plate 17 extends to the bottom surface of the molded body 10, and one end of the support plate 17 is exposed on the bottom surface of the molded body 10. The external terminal 12 extends from the bottom surface of the molded body 10 to the top surface through the side surface. The end 18 of the coil lead-out portion is sandwiched between the support plate 17 and the external terminal 12 and connected to the external terminal 12 by soldering.

面実装インダクタ３００では、支持板１７が絶縁体から形成されることで、支持板１７の面に直交する方向におけるコイルの巻回部１４の外径ａを大きくすることができる。これにより、限られた成型体の大きさであっても、大口径のコイルを内蔵することが可能になる。また、面実装インダクタ３００では、支持板１７の端部が成型体１０の底面に露出していることで、成型体１０を形成する際における支持板１７の位置精度を向上させることができる。   In the surface mount inductor 300, the support plate 17 is formed of an insulator, whereby the outer diameter a of the coil winding portion 14 in the direction orthogonal to the surface of the support plate 17 can be increased. This makes it possible to incorporate a large-diameter coil even if the size of the molded body is limited. Further, in the surface mount inductor 300, since the end portion of the support plate 17 is exposed on the bottom surface of the molded body 10, the positional accuracy of the support plate 17 when forming the molded body 10 can be improved.

接着層２１は、コイルの引き出し部の端部１８が配置される支持板１７の面を被覆して設けられてもよい。その場合、支持板１７は厚み方向に成型体１０の側面に埋設され、接着層２１の表面が成型体１０の側面に露出して、支持板１７の露出部となる。   The adhesive layer 21 may be provided so as to cover the surface of the support plate 17 on which the end 18 of the coil lead-out portion is disposed. In that case, the support plate 17 is embedded in the side surface of the molded body 10 in the thickness direction, and the surface of the adhesive layer 21 is exposed on the side surface of the molded body 10 to become an exposed portion of the support plate 17.

実施例４
実施例４の面実装インダクタ４００を、図４を参照して説明する。図４は面実装インダクタ４００のコイルの巻軸に直交する面における概略断面図である。面実装インダクタ４００では、成型体１０の上面と底面に直交する方向におけるコイルの巻回部１４の外径ｂが、成型体１０の高さと略同一に形成されていること、および外部端子１２が成型体１０の上面に延在していないこと以外は、実施例３の面実装インダクタ３００と同様に構成される。 Example 4
A surface-mount inductor 400 according to the fourth embodiment will be described with reference to FIG. FIG. 4 is a schematic cross-sectional view of a surface perpendicular to the winding axis of the coil of the surface mount inductor 400. In the surface-mount inductor 400, the outer diameter b of the coil winding portion 14 in the direction orthogonal to the upper surface and the bottom surface of the molded body 10 is formed substantially the same as the height of the molded body 10, and the external terminals 12 are Except not extending to the upper surface of the molded body 10, it is comprised similarly to the surface mount inductor 300 of Example 3. FIG.

面実装インダクタ４００では、支持板１７間方向におけるコイルの巻回部１４の外径ａが、支持板１７間の距離と略同一に形成され、成型体１０の上面と底面に直交する方向におけるコイルの巻回部１４の外径ｂが、成型体１０の上面と底面間の距離、すなわち、成型体１０の高さと略同一に形成される。また、外部端子１２は成型体１０の底面および側面の一部に配置され、成型体１０の上面には配置されていない。   In the surface mount inductor 400, the outer diameter “a” of the coil winding portion 14 in the direction between the support plates 17 is formed substantially the same as the distance between the support plates 17, and the coil in the direction perpendicular to the top surface and the bottom surface of the molded body 10. The outer diameter b of the winding portion 14 is formed substantially the same as the distance between the upper surface and the bottom surface of the molded body 10, that is, the height of the molded body 10. In addition, the external terminals 12 are disposed on the bottom surface and part of the side surfaces of the molded body 10 and are not disposed on the upper surface of the molded body 10.

コイルの巻回部１４の外径が成型体１０に内蔵可能な最大値となっていることで、より優れた特性の面実装インダクタを構成することができる。また、外部端子１２が、コイルの引き出し部に近接する成型体１０の上面に配置されないことで、外部端子１２とコイルとの絶縁特性を向上させることができる。   Since the outer diameter of the coil winding portion 14 is the maximum value that can be incorporated in the molded body 10, a surface-mount inductor having more excellent characteristics can be configured. In addition, since the external terminal 12 is not disposed on the upper surface of the molded body 10 adjacent to the coil drawing portion, the insulation characteristics between the external terminal 12 and the coil can be improved.

実施例５
実施例５の面実装インダクタ５００を、図５を参照して説明する。図５は面実装インダクタ５００の実装面に平行な断面を実装面側からみた概略断面図である。面実装インダクタ５００では、コイルの巻回部１４の巻軸を実装面に対して平行にしてコイルが配置されていること、端部１８を収容する凹部がコイルの引き出し部の端部１８の延在方向に沿って支持板１６に設けられていること以外は、実施例１の面実装インダクタ１００と同様に構成される。 Example 5
A surface-mount inductor 500 according to the fifth embodiment will be described with reference to FIG. FIG. 5 is a schematic cross-sectional view of a cross-section parallel to the mounting surface of the surface-mount inductor 500 as viewed from the mounting surface side. In the surface-mount inductor 500, the coil is disposed with the winding axis of the coil winding portion 14 parallel to the mounting surface, and the concave portion that accommodates the end portion 18 extends from the end portion 18 of the coil lead-out portion. The configuration is the same as that of the surface-mount inductor 100 according to the first embodiment except that the support plate 16 is provided along the current direction.

面実装インダクタ５００では、断面が矩形状の導線からコイルが形成される。コイルの引き出し部の端部１８は、コイルの巻回部１４から成型体１０の上面側から引き出され、側面に沿って底面方向に延在している。支持板１６は、例えば矩形状の金属板であり、成型体１０からの露出部１６Ａを有して成型体１０の側面に配置される。支持板１６には、コイルの引き出し部の端部１８を収容する凹部が形成されている。端部１８は、支持板１６の凹部の底面に配置され、はんだ層２０で支持板１６に接続されて固定される。支持板１６の凹部は底面の幅よりも開口部の幅を広くして形成される。   In the surface mount inductor 500, a coil is formed from a conducting wire having a rectangular cross section. The end 18 of the coil drawing portion is drawn from the coil winding portion 14 from the upper surface side of the molded body 10 and extends in the bottom direction along the side surface. The support plate 16 is a rectangular metal plate, for example, and has an exposed portion 16 </ b> A from the molded body 10 and is disposed on the side surface of the molded body 10. The support plate 16 is formed with a recess for accommodating the end 18 of the coil drawing portion. The end 18 is disposed on the bottom surface of the concave portion of the support plate 16 and is connected to the support plate 16 with the solder layer 20 and fixed. The concave portion of the support plate 16 is formed with the width of the opening wider than the width of the bottom surface.

面実装インダクタ５００では、支持板１６に凹部が形成されていることで、コイルの引き出し部の端部１８の支持板上１６における位置精度を向上させることができる。   In the surface mount inductor 500, since the concave portion is formed in the support plate 16, it is possible to improve the positional accuracy of the end 18 of the coil lead-out portion on the support plate 16.

実施例６
実施例６の面実装インダクタの製造方法を、図６を参照して説明する。図６は、実施例４の面実装インダクタ４００の製造方法の一例を説明する成型金型の開口部方向からみた概略平面図である。 Example 6
A method for manufacturing the surface-mount inductor according to the sixth embodiment will be described with reference to FIG. FIG. 6 is a schematic plan view seen from the opening direction of the molding die for explaining an example of the manufacturing method of the surface mount inductor 400 of the fourth embodiment.

図６に示す製造方法では、絶縁皮膜を有する導線で形成され、巻回部１４および引き出し部を有するコイルを準備する。コイルの引き出し部の端部１８は、１対の支持板１７の対向しない側の面上に配置され、接着層２１で支持板１７に接続される。コイルの巻回部１４は、樹脂および磁性粉を含む複合材料から形成される２枚の板状予備成型体２２の厚み方向に直交する面の間に挟持されて成型金型２４内に配置される。支持板１７は、コイルの引き出し部の端部１８が配置される面とは反対側の面を板状予備成型体２２の側面に対向させて配置され、支持板１７のコイルの引き出し部の端部１８が配置される面は成型金型２４の内側面に対向する。また、支持板１７は一方の端面を成型金型２４の内側面に接して配置される。次いで、コイルの巻回部１４を挟持する板状予備成型体を成型金型２４内で加圧成型することで、コイルの巻回部１４を内蔵し、側面に支持板１７が露出部を有して配置される成型体が得られる。得られる成型体の底面、およびコイルの引き出し部の端部１８が露出する側面に、端部１８と接続する外部端子を形成することで面実装インダクタが製造される。   In the manufacturing method shown in FIG. 6, a coil formed of a conductive wire having an insulating film and having a winding part 14 and a lead part is prepared. The end portion 18 of the coil lead-out portion is disposed on the non-opposing surface of the pair of support plates 17 and is connected to the support plate 17 by the adhesive layer 21. The coil winding portion 14 is sandwiched between surfaces orthogonal to the thickness direction of the two plate-shaped preforms 22 formed of a composite material including resin and magnetic powder, and is disposed in the molding die 24. The The support plate 17 is disposed with the surface opposite to the surface on which the end portion 18 of the coil lead-out portion is disposed facing the side surface of the plate-shaped preform 22, and the end of the coil lead-out portion of the support plate 17 is disposed. The surface on which the part 18 is disposed faces the inner surface of the molding die 24. The support plate 17 is disposed with one end face in contact with the inner surface of the molding die 24. Next, a plate-shaped preform that sandwiches the coil winding portion 14 is pressure-molded in the molding die 24 to incorporate the coil winding portion 14, and the support plate 17 has an exposed portion on the side surface. Thus, a molded body to be arranged is obtained. Surface mount inductors are manufactured by forming external terminals connected to the end portions 18 on the bottom surface of the obtained molded body and the side surfaces where the end portions 18 of the coil lead portions are exposed.

具体的には、絶縁皮膜を有する導線を両端が最外周に位置する様に２段に導線を巻回して形成される巻回部１４と、巻回部１４から導線の両端が引き出される引き出し部を有するコイルを形成する。コイルの引き出し部の端部１８は、絶縁皮膜が剥離された状態で１対の支持板１７の互いに対向しない面上にそれぞれ配置される。樹脂と磁性粉を含む複合材料で形成した第１の板状予備成型体２２を成型金型２４内に配置する。次いでコイルの巻回部１４の巻軸を第１の板状予備成型体２２の面と直交させて、コイルの巻回部１４を第１の板状予備成型体２２の面上に配置する。次いでコイルの巻回部１４上に第２の板状予備成型体２２を配置する。このとき支持板１７と成型金型２４の内側面の間にコイルの引き出し部の端部１８を配置させて、支持板１７がそれぞれ板状予備成型体２２の側面に配置される。続いて、成型金型２４内で、これらを加圧成型して一体化し、これを成型金型２４から取り出して成型体を得る。この成型体の側面には、支持板１７の面の一部とコイルの引き出し部の端部１８が露出する。そして、この成型体に、上面、側面および底面の一部を被覆するリードフレーム、または側面および底面の一部を被覆するリードフレームが取り付けられて外部端子が形成される。   Specifically, a winding portion 14 formed by winding a conducting wire having an insulating film in two stages so that both ends are positioned on the outermost periphery, and a drawing portion from which both ends of the conducting wire are drawn from the winding portion 14 Forming a coil having The end portions 18 of the coil lead portions are respectively disposed on the surfaces of the pair of support plates 17 that do not face each other with the insulating film peeled off. A first plate-shaped preform 22 formed of a composite material containing resin and magnetic powder is placed in a molding die 24. Next, the coil winding portion 14 is arranged on the surface of the first plate-shaped preform 22 so that the winding axis of the coil winding portion 14 is orthogonal to the surface of the first plate-shaped preform 22. Next, the second plate-shaped preform 22 is disposed on the coil winding portion 14. At this time, the end 18 of the coil lead-out portion is disposed between the support plate 17 and the inner surface of the molding die 24, and the support plates 17 are respectively disposed on the side surfaces of the plate-shaped preform 22. Then, these are pressure-molded and integrated in the molding die 24 and taken out from the molding die 24 to obtain a molded body. A part of the surface of the support plate 17 and the end 18 of the coil lead-out portion are exposed on the side surface of the molded body. Then, a lead frame covering a part of the upper surface, the side surface and the bottom surface, or a lead frame covering a part of the side surface and the bottom surface is attached to the molded body to form an external terminal.

コイルの引き出し部の端部が支持板上に接続されたコイルを、板状予備成型体とともに成型金型内で一体成型することで、コイルの引き出し部の端部が側面に露出する成型体を効率良く製造することができる。   A molded body in which the end portion of the coil lead portion is exposed to the side surface by integrally molding the coil in which the end portion of the coil lead portion is connected to the support plate in the molding die together with the plate-shaped preform. It can be manufactured efficiently.

実施例７
実施例７の面実装インダクタの製造方法を、図７を参照して説明する。図７は、面実装インダクタの製造方法の他の一例を説明する成型金型の開口部方向からみた概略平面図である。実施例７の製造方法では、板状予備成型体として、対向する側面に支持板１７を収容する凹部をそれぞれ有する板状予備成型体２３を用いること、支持板１７の一方の端部が成型金型の内側面に接していないこと以外は実施例６の製造方法と同様に構成される。 Example 7
A method for manufacturing the surface-mount inductor according to the seventh embodiment will be described with reference to FIG. FIG. 7 is a schematic plan view seen from the opening direction of the molding die for explaining another example of the method for manufacturing the surface mount inductor. In the manufacturing method of Example 7, as the plate-shaped preform, the plate-shaped preform 23 having recesses for accommodating the support plates 17 on the opposite side surfaces is used, and one end of the support plate 17 is molded metal. The manufacturing method is the same as that of the manufacturing method of Example 6 except that it does not contact the inner surface of the mold.

図７に示す製造方法では、樹脂と磁性粉を含む複合材料で形成される板状予備成型体２３の対向する側面のそれぞれに、対向する面側へ向かう凹部が形成されている。それぞれの凹部は、板状予備成型体２３の厚み方向に貫通して形成される。凹部は、板状予備成型体２２の側面の凹部が形成されていない面と平行な底面と、底面と板状予備成型体２３の側面の凹部が形成されていない面とを接続する側面とを有し、板状予備成型体２３の側面の凹部が形成されていない面と底面との距離である深さで形成される。凹部の底面における厚み方向に直交する方向の長さは、収容される支持板１７の長さより長く、または略同一に形成される。凹部の開口部の長さは、凹部の底面の長さよりも長く形成される。すなわち、板状予備成型体２３の側面に連なる側面と凹部の底面との間の角度ｃが９０度より大きく、例えば１３５度に形成される。凹部の深さは、支持板１７およびコイルの引き出し部の端部１８の厚みの合計よりも浅く形成される。コイルの引き出し部の端部１８が接続される支持板１７は、コイルの引き出し部の端部１８が配置される面を成型金型２４の内側面に対向させて、板状予備成型体２３の凹部の側面上に配置される。コイルの巻回部１４を挟持する板状予備成型体２３は、成型金型２４内で加圧成型されて成型体が形成される。   In the manufacturing method shown in FIG. 7, the recessed part which goes to the opposing surface side is formed in each of the opposing side surface of the plate-shaped preform 23 formed with the composite material containing resin and magnetic powder. Each recess is formed so as to penetrate in the thickness direction of the plate-shaped preform 23. The concave portion includes a bottom surface parallel to the surface of the plate-shaped preform 22 on which the concave portion is not formed, and a side surface connecting the bottom surface and the surface of the plate-shaped preform 23 on which the concave portion is not formed. And having a depth that is the distance between the bottom surface of the plate-shaped preform 23 and the bottom surface where the concave portion is not formed. The length of the bottom surface of the recess in the direction orthogonal to the thickness direction is longer than or substantially the same as the length of the support plate 17 accommodated. The length of the opening of the recess is formed longer than the length of the bottom surface of the recess. That is, the angle c between the side surface connected to the side surface of the plate-shaped preform 23 and the bottom surface of the recess is larger than 90 degrees, for example, 135 degrees. The depth of the recess is formed shallower than the total thickness of the support plate 17 and the end 18 of the coil lead-out portion. The support plate 17 to which the end 18 of the coil lead-out portion is connected has the surface on which the end 18 of the coil lead-out portion is disposed facing the inner surface of the molding die 24, so It arrange | positions on the side surface of a recessed part. A plate-shaped preform 23 sandwiching the coil winding portion 14 is pressure-molded in a molding die 24 to form a molded body.

板状予備成型体が、支持板を収容する凹部を有することで、コイルを形成する導線の厚みが厚い場合でも、加圧成型によって支持板が傾いて導線が成型体に埋設されてしまうことが抑制され、外部端子との良好な接続が達成できる。特に、凹部の開口部の長さが、凹部の底面の長さよりも長く形成されることにより、凹部の側面が傾斜を有し、角度９０度より大きく、好ましくは１３５度にすることにより、その効果が顕著になる。   Since the plate-shaped preform has a recess that accommodates the support plate, the support plate is inclined by pressure molding and the conductor is embedded in the molded body even when the thickness of the conductor forming the coil is thick. Suppressed and good connection with external terminals can be achieved. In particular, the length of the opening of the recess is formed to be longer than the length of the bottom surface of the recess, so that the side surface of the recess has an inclination and the angle is greater than 90 degrees, preferably 135 degrees. The effect becomes remarkable.

実施例８
実施例８の面実装インダクタの製造方法を、図８を参照して説明する。図８は、面実装インダクタの製造方法の他の一例を説明する概略断面図であり、面実装インダクタの実装面となる面側からみた成型金型の内側面における断面を示す図である。実施例８の製造方法では、支持板１７にコイルの引き出し部の端部１８を収容する凹部が形成されている。 Example 8
A method for manufacturing the surface-mount inductor according to the eighth embodiment will be described with reference to FIG. FIG. 8 is a schematic cross-sectional view for explaining another example of the method for manufacturing the surface-mount inductor, and is a view showing a cross-section on the inner surface of the molding die as viewed from the surface side to be the mounting surface of the surface-mount inductor. In the manufacturing method according to the eighth embodiment, the support plate 17 is formed with a recess that accommodates the end 18 of the coil lead-out portion.

図８の製造方法では、絶縁皮膜を有し、断面が円形状の導線を、その両端が最外周に位置する様に巻回して形成される巻回部１４と、巻回部１４から導線の両端が引き出される引き出し部を有するコイルを形成する。コイルの引き出し部の端部１８は、絶縁皮膜が剥離された状態で１対の支持板１７の互いに対向しない面上に形成される凹部上にそれぞれ配置される。樹脂と磁性粉を含む複合材料で形成される２枚の板状予備成型体２２はコイルの巻回部１４を挟持して配置される。コイルの巻回部１４の巻軸は板状予備成型体２２の面と直交している。支持板１７と成型金型２４の内側面の間には、コイルの引き出し部の端部１８を配置され、支持板１７は板状予備成型体２２の側面上に配置される。続いて、成型金型２４内でこれらを加圧成型して一体化し、成型金型２４から取り出して成型体を得る。   In the manufacturing method of FIG. 8, a winding portion 14 formed by winding a conductor having an insulating film and having a circular cross section so that both ends thereof are located on the outermost periphery, and A coil having a lead portion from which both ends are drawn is formed. The end portions 18 of the coil lead portions are respectively disposed on recesses formed on the surfaces of the pair of support plates 17 that are not opposite to each other with the insulating film being peeled off. Two plate-shaped preforms 22 formed of a composite material including a resin and magnetic powder are disposed with the coil winding portion 14 interposed therebetween. The winding axis of the coil winding portion 14 is orthogonal to the surface of the plate-shaped preform 22. Between the support plate 17 and the inner surface of the molding die 24, an end 18 of the coil lead-out portion is disposed, and the support plate 17 is disposed on the side surface of the plate-shaped preform 22. Then, these are pressure-molded and integrated in the molding die 24 and taken out from the molding die 24 to obtain a molded body.

支持板にコイルの引き出し部の端部を収容する凹部が設けられることで、支持板上における端部の位置精度を向上させることができる。   By providing the support plate with the concave portion for accommodating the end portion of the coil lead-out portion, the position accuracy of the end portion on the support plate can be improved.

１０ 成型体
１２ 外部端子
１４ コイル巻回部
１６、１７ 支持板
１８ コイル端部
１００ 面実装インダクタ DESCRIPTION OF SYMBOLS 10 Molded body 12 External terminal 14 Coil winding part 16, 17 Support plate 18 Coil end part 100 Surface mount inductor

Claims (10)

絶縁皮膜を有する導線で形成され、巻回部および引き出し部を有するコイルと、
前記コイルの巻回部を内蔵する成型体と、
前記成型体の対向する面のそれぞれに配置される一対の支持板と、
前記成型体上に配置される外部端子と、を備え、
前記支持板は、一部が前記成型体に埋設され、前記支持板が配置される前記成型体の面から少なくとも一部の面を露出する露出部を有し、
前記コイルの引き出し部の端部は、前記絶縁皮膜が剥離された状態で前記支持板の露出部側の面上に配置され、
前記露出部の面積は、前記支持板が配置される前記成型体の面の面積よりも小さく、
前記外部端子は、前記コイルの引き出し部の端部と接して配置される、面実装インダクタ。 A coil formed of a conductive wire having an insulating film and having a winding part and a lead part;
A molded body containing a winding portion of the coil;
A pair of support plates disposed on each of the opposing surfaces of the molded body;
An external terminal disposed on the molded body,
The support plate has an exposed portion that is partially embedded in the molded body and exposes at least a portion of the surface from the surface of the molded body on which the support plate is disposed;
The end portion of the coil lead portion is disposed on the exposed portion side surface of the support plate in a state where the insulating film is peeled off,
The area of the exposed portion is smaller than the area of the surface of the molded body on which the support plate is disposed,
The surface mount inductor, wherein the external terminal is disposed in contact with an end portion of the lead portion of the coil. 前記支持板は露出部側の面が、導電性を有し、
前記外部端子、前記コイルの引き出し部および前記支持板が互いに電気的に接続されている、請求項１に記載の面実装インダクタ。 The support plate has a conductive surface on the exposed portion side,
The surface-mount inductor according to claim 1, wherein the external terminal, the lead portion of the coil, and the support plate are electrically connected to each other. 前記支持板は、絶縁体からなり、
前記外部端子および前記コイルの引き出し部が電気的に接続されている、請求項１に記載の面実装インダクタ。 The support plate is made of an insulator,
The surface-mount inductor according to claim 1, wherein the external terminal and the lead portion of the coil are electrically connected. 前記支持板間の距離と、前記コイルの巻回部の巻軸と垂直な方向における巻回部の最大の大きさとが略同じである、請求項３に記載の面実装インダクタ。   The surface-mount inductor according to claim 3, wherein a distance between the support plates and a maximum size of the winding part in a direction perpendicular to a winding axis of the winding part of the coil are substantially the same. 前記成型体の実装面側の面と、前記実装面に対向する成型体の上面との間の距離と、前記コイルの巻回部の巻軸と垂直な方向における最大の大きさが略同じである、請求項３又は請求項４に記載の面実装インダクタ。   The distance between the surface on the mounting surface side of the molded body and the upper surface of the molded body facing the mounting surface, and the maximum size in the direction perpendicular to the winding axis of the winding portion of the coil are substantially the same. The surface mount inductor according to claim 3 or claim 4, wherein the surface mount inductor is provided. 前記支持板の端部は、前記成型体の実装面側の面に露出している、請求項１から５のいずれかに記載の面実装インダクタ。   6. The surface-mount inductor according to claim 1, wherein an end portion of the support plate is exposed on a surface on a mounting surface side of the molded body. 前記支持板が前記コイルの引き出し部を収容する凹部を有する、請求項１から請求項６のいずれかに記載の面実装インダクタ。   The surface-mount inductor according to any one of claims 1 to 6, wherein the support plate has a recess that accommodates the lead portion of the coil. 絶縁皮膜を有する導線で形成され、巻回部と引き出し部とを有するコイルを準備することと、
前記コイルの引き出し部の端部を、一対の支持板の一方の面上にそれぞれ配置することと、
磁性粉を含む複合材料から形成される複数の前記板状予備成型体で前記コイルの巻回部を挟持し、前記板状予備成型体の側面上に、前記支持板および前記コイルの引き出し部の端部をこの順に積層させ、成型金型の内側面に対向させて成型金型内に配置することと、
前記成型金型内で、前記コイルの巻回部を内蔵し、前記支持板の少なくとも一部が対向する面に露出する成型体を得ることと、を含む、面実装インダクタの製造方法。 Preparing a coil formed of a conductive wire having an insulating film and having a winding part and a lead part;
Disposing the end portions of the coil lead portions on one surface of a pair of support plates;
The coil winding portion is sandwiched between a plurality of the plate-shaped preforms formed of a composite material containing magnetic powder, and the support plate and the coil lead-out portion are placed on the side surfaces of the plate-shaped preform. Laminating the ends in this order, facing the inner surface of the molding die and placing it in the molding die;
A method for producing a surface-mount inductor, comprising: obtaining a molded body in which a winding portion of the coil is built in the molding die and at least a part of the support plate is exposed to an opposing surface. 前記板状予備成型体は、対向する側面に凹部を有し、前記支持板および前記コイルの引き出し部の端部は、前記凹部の底面上に積層される、請求項８に記載の製造方法。   The manufacturing method according to claim 8, wherein the plate-shaped preform has a concave portion on an opposite side surface, and end portions of the support plate and the coil drawing portion are stacked on a bottom surface of the concave portion. 前記凹部は、底面部の厚み方向に直交する方向の長さが、開口部の長さよりも短く形成される、請求項９に記載の製造方法。   The manufacturing method according to claim 9, wherein the recess is formed such that a length in a direction perpendicular to a thickness direction of the bottom surface is shorter than a length of the opening.
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